Active thermal management of substrate, heated end effector, and delivery device including heated end effector.
By using a heated end effector and an active thermal control system during substrate transport, the problems of thermal stress and slip defects caused by temperature non-uniformity were solved, resulting in higher processing quality and throughput.
CN122139487APending Publication Date: 2026-06-02BROOKS AUTOMATION US LLC
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- BROOKS AUTOMATION US LLC
- Filing Date
- 2024-09-06
- Publication Date
- 2026-06-02
AI Technical Summary
Technical Problem
During substrate transport, thermal stress and crystal slip defects caused by temperature inhomogeneity at the contact points affect processing quality and yield.
Method used
The system employs a heated end effector and an active thermal control system to actively manage substrate temperature by heating or cooling the end effector and substrate holding stage, ensuring temperature uniformity and reducing thermal shock.
Benefits of technology
It improves the temperature uniformity of substrate processing, reduces thermal stress and slip defects, and enhances processing quality and throughput.
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Smart Images
Figure CN122139487A_ABST
Abstract
A substrate delivery device includes a base, a hinged arm, and an end effector. The hinged arm is connected to the base via an end joint, about which it rotates and extends. The end effector is connected to the hinged arm at a distal joint and has a substrate or carrier plate holding stage thereon. The end effector is a non-conductive or semi-conductive end effector made of a ceramic material, such that the end effector as a whole is substantially non-conductive or semi-conductive. The end effector has an active heater that is connected to and heat-exchanges with the substantially non-conductive or semi-conductive material to controllably heat the substrate or carrier plate holding stage to a temperature of 400°C or higher during substrate delivery.
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Citation Information
Patent Citations
US10134621B2
US10777438B2
US11201073B2
US11235935B2
US11535460B2