Five-axis linkage machining center intelligent chip removal and cooling system and method

Abstract

The application discloses a five-axis linkage machining center intelligent chip removal and cooling system and method, and belongs to the field of numerical control machining. The system comprises a high-pressure cooling subsystem, a negative pressure capturing subsystem, a gas-liquid-solid three-phase separation and purification recycling subsystem, and a data processing and control subsystem. The sensing network in the data processing and control subsystem is used to collect the working parameters of the system and the five-axis position of the machine tool, and to transmit the collected multi-source data to an edge controller in real time. The edge controller is used to synchronously control the nozzle angle and the jetting parameters of the high-pressure cooling subsystem, the suction port damper opening and the negative pressure suction unit frequency of the negative pressure capturing subsystem, and the filter element backflushing regeneration and centrifugal dewatering parameters of the gas-liquid-solid three-phase separation and purification recycling subsystem according to the machining point position and the chip state, and to synchronously record data to a data recording and diagnosis module. The application can realize the synergy of the jetting-suctioning-chip movement three fields, and can efficiently and stably recycle and purify the chip mixture for a long time.

Description

Technical Field

[0001] This invention relates to CNC machine tool processing technology, and more particularly to an intelligent chip removal and cooling system and method for a five-axis linkage machining center. Background Technology

[0002] Five-axis linkage gantry machining centers often encounter problems in machining difficult-to-machine materials (such as titanium alloys, high-temperature alloys, and stainless steel) in aerospace, new energy, and shipbuilding fields. These problems include high-power cutting, long chip entanglement, high temperatures in the machining area, cutting fluid atomization and contamination, and difficulty in recovering the chip-cutting fluid mixture. Existing technologies include solutions using high-pressure cutting fluid for chip breaking and cooling. For example, Chinese patent CN207325965U discloses a CNC machine tool structure using a high-pressure water gun and pulse jet for chip breaking; Chinese patent CN110653659B discloses an adjustable high-pressure coolant automatic chip breaking device. Furthermore, Chinese patent CN111390641B discloses a five-axis linkage CNC machining center with an integrated structure including a recovery chamber, negative pressure channel, atomizing nozzles, and magnetic suction device for dust / droplet recovery.

[0003] However, the above solutions often have the following shortcomings: (1) High-pressure injection and negative pressure capture are mostly independent operations, lacking an online optimization mechanism that coordinates the three fields of "injection-suction-chip movement".

[0004] (2) The multi-inlet system lacks a quantifiable spatiotemporal gate control strategy for the damper, and cannot dynamically follow the five-axis pose and machining point, resulting in insufficient local capture or high overall energy consumption.

[0005] (3) Gas-liquid-solid three-phase separation and filtration often use fixed parameters for operation, making it difficult to form a closed-loop self-tuning for fluctuations in filter element pressure difference, liquid content, turbidity, etc., resulting in long-term instability of recovery rate, dryness and maintenance frequency.

[0006] (4) For high-power ultra-precision machining of difficult-to-machine materials, existing systems cannot simultaneously achieve the comprehensive goals of high capture rate, long tool life, low liquid consumption and low mist emission. Summary of the Invention

[0007] Purpose of the invention: The present invention aims to provide an intelligent chip removal and cooling system and method for a five-axis linkage machining center that can achieve coordinated "jet-suction-chip movement", dynamic suction to reduce energy consumption, and efficient, long-term stable recycling and purification of chip-liquid-mist mixtures.

[0008] Technical solution: The present invention discloses an intelligent chip removal and cooling system for a five-axis linkage machining center, comprising a high-pressure cooling subsystem, a negative pressure capture subsystem, a gas-liquid-solid three-phase separation and purification reuse subsystem, and a data processing and control subsystem; the high-pressure cooling subsystem includes interconnected high-pressure liquid supply units and nozzle arrays; The negative pressure capture subsystem includes a negative pressure suction unit and a multi-inlet assembly. Each inlet of the multi-inlet assembly is equipped with an independent damper actuator. The negative pressure air path of the multi-inlet assembly is collected at the air inlet of the negative pressure suction unit. The negative pressure capture subsystem is connected to the gas-liquid-solid three-phase separation and purification reuse subsystem. The gas-liquid-solid three-phase separation and purification reuse subsystem includes a primary cyclone separator, a secondary liquid-gas separator and filter element assembly, a tertiary centrifugal dehydrator, and a coolant purification reuse unit. The gas-liquid outlet at the top of the primary cyclone separator is connected to the inlet of the secondary liquid-gas separator and filter element assembly. The solid outlet at the bottom of the primary cyclone separator and the outlet at the bottom of the secondary liquid-gas separator and filter element assembly are both connected to the inlet of the tertiary centrifugal dehydrator. The liquid outlet of the tertiary centrifugal dehydrator is connected to the coolant purification reuse unit. The secondary liquid-gas separator and filter element assembly are connected in parallel with a pulse backflushing unit for filter element backflushing regeneration. The debris-liquid-mist mixture sucked by the negative pressure suction unit enters the primary cyclone separator, the secondary liquid-gas separator and filter element assembly, and the tertiary centrifugal dehydrator. The separated liquid flows back to the coolant purification reuse unit. The data processing and control subsystem includes a sensor network, an edge controller, and a data recording and diagnostic module. The sensor network collects the operating parameters of the high-pressure cooling subsystem, the negative pressure capture subsystem, and the gas-liquid-solid three-phase separation and purification reuse subsystem, as well as the five-axis position and orientation of the machine tool, and transmits the collected multi-source data to the edge controller in real time. The edge controller synchronously adjusts the nozzle angle and spray parameters of the high-pressure cooling subsystem, the suction damper opening and negative pressure suction unit frequency of the negative pressure capture subsystem, and the filter backflushing regeneration and centrifugal dehydration parameters of the gas-liquid-solid three-phase separation and purification reuse subsystem according to the machining point position and chip state, and synchronously records the data to the data recording and diagnostic module. The data recording and diagnostic module is a data storage feedback terminal, used to store data and push diagnostic results and maintenance suggestions back to the edge controller, providing a reference for the edge controller's control decisions.

[0009] Preferably, the high-pressure liquid supply unit controls the nozzle array to spray coolant through a pulse modulation valve group.

[0010] Preferably, the pitch and azimuth angles of each nozzle in the nozzle array are adjusted by a nozzle servo angle adjustment mechanism.

[0011] Preferably, the suction port of the multi-suction port assembly is a flared structure with a self-cleaning grid on the inner side of the flared port.

[0012] Preferably, the secondary liquid-gas separation and filter assembly includes three filter elements with different precision connected in series by pipelines.

[0013] Preferably, the coolant purification and reuse unit includes a coarse filtration mechanism, a fine filtration mechanism, a magnetic separation mechanism, an ultraviolet sterilization mechanism, a heat exchange mechanism, a concentration / conductivity monitoring mechanism, an automatic replenishment mechanism, and a storage tank connected in sequence. After coarse filtration, fine filtration, magnetic separation to capture ferromagnetic cutting particles, ultraviolet sterilization to kill microorganisms, concentration / conductivity monitoring to trigger the replenishment threshold, and automatic replenishment mechanism to replenish and maintain the coolant concentration, the separated liquid enters the storage tank.

[0014] The present invention discloses an intelligent chip removal and cooling method for a five-axis linkage machining center, comprising the following steps: (1) Collect the five-axis pose and machining point coordinates of the machine tool, and collect the working status parameters of the five-axis linkage gantry machining center; (2) Activate the high-pressure cooling subsystem according to the processing procedure and control the nozzle array to spray coolant in a directional manner; (3) In the fully enclosed processing chamber, the negative pressure capture subsystem is activated to establish a negative pressure capture field, and the air damper is controlled in time and space to make the suction force dynamically follow the five-axis posture and processing point. (4) Define the angle between the jet thrust vector and the suction vector as the coupling angle θ, and take chip capture rate, mist emission, energy consumption and negative pressure difference as targets. By adjusting the nozzle angle and jet parameters of the high pressure cooling subsystem, the opening of the suction damper of the negative pressure capture subsystem and the frequency of the negative pressure suction unit, the coupling angle θ is kept within the preset range. (5) Input the debris-liquid-mist mixture captured by negative pressure into the gas-liquid-solid three-phase separation and purification reuse subsystem. The filter element pressure difference ΔPf of the secondary liquid-gas separation and filter element assembly, the liquid content W of the coolant after dehydration separation by the tertiary centrifugal dehydrator, the turbidity T, and the concentration / conductivity C are used as closed-loop variables to trigger the filter element backflushing regeneration and centrifugal dehydration parameter adjustment of the gas-liquid-solid three-phase separation and purification reuse subsystem.

[0015] Preferably, the pitch and azimuth angles of each nozzle in the nozzle array are adjusted by a nozzle servo angle adjustment mechanism.

[0016] Preferably, in step (3), the air damper time-space gating of the multi-inlet assembly includes: (a) Establish a neighborhood window centered on the processing point location. The suction ports contained within the neighborhood window are active suction ports, forming a neighborhood suction port set. (b) Calculate the weight for each active suction port in the neighborhood suction port set, quantify the contribution of each active suction port to chip capture at the current processing point, and calculate the actual gating opening of each active suction port based on the suction port weight, negative pressure requirement, and energy consumption constraint; (c) Open each active suction port in the neighboring suction port set according to the actual gating opening, and put the suction ports in the non-neighboring suction port set into standby or maintain the pressure holding opening to reduce ineffective suction energy consumption and turbulence interference.

[0017] Preferably, in step (4), a local three-dimensional coordinate system is established with the processing point as the origin and the tool spindle axis as the Z-axis. The jet thrust vector is determined by the equivalent composite jet direction and pressure flow rate of the open nozzle; the attraction vector is determined by the active suction port gate opening degree in the neighborhood window, the frequency of the negative pressure suction unit, and the fluid resistance between the multi-suction port assembly and the negative pressure suction unit; then the coupling angle θ is the angle between the jet thrust vector and the attraction vector.

[0018] Beneficial Effects: Compared with existing technologies, this invention has the following significant advantages: Based on the coupling theory of jet flow field, negative pressure suction field and chip motion field, the coupling angle θ between the jet thrust vector and the suction vector is defined, and online self-tuning control is established with chip capture rate, mist emission, energy consumption and pressure difference as objectives; through jet / suction coordination under θ constraint, chips and mist droplets are more likely to enter the effective capture channel, reducing the risk of escape and secondary cutting; through three-dimensional orientation of the nozzle array and spatiotemporal gating of multi-inlet dampers, the suction force dynamically follows the five-axis pose and machining point, and only the suction ports in the neighborhood window of the machining point are opened, reducing the ineffective power consumption caused by full-domain suction; at the same time, based on parameters such as filter element pressure difference, liquid content and turbidity, closed-loop self-tuning of cyclone separation, filter element backflushing and centrifugal dehydration is performed to achieve filter element regeneration and high chip dryness, and more stable coolant recovery and reuse. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a schematic diagram of the nozzle array structure of the present invention; Figure 3 This is a schematic diagram of the multi-inlet assembly structure of the present invention; Figure 4 This is a schematic diagram of the gas-liquid-solid three-phase separation and purification reuse subsystem of the present invention; Figure 5 This is a flowchart illustrating the operation of the coolant purification and reuse unit of the present invention. Figure 6 This is a schematic diagram illustrating the vector relationship and the definition of the coupling angle θ in this invention; Figure 7 This is a schematic diagram of the spatiotemporal gating neighborhood window and weight allocation for the suction port according to the present invention; Figure 8 This is a flowchart of the control method of the present invention.

[0020] In the diagram, 1. High-pressure liquid supply unit; 2. Pulse modulation valve group; 3. Nozzle array; 4. Nozzle servo angle adjustment mechanism; 5. Fully enclosed processing chamber; 6. Negative pressure suction unit; 7. Multi-suction port assembly; 8. Independent damper actuator; 9. Primary cyclone separator; 10. Secondary liquid-gas separation and filter assembly; 11. Pulse backflushing unit; 12. Tertiary centrifugal dehydrator; 13. Coolant purification and reuse unit; 14. Sensor network; 15. Edge controller; 17. Self-cleaning grid. Detailed Implementation

[0021] The technical solution of the present invention will be further described below with reference to the accompanying drawings.

[0022] like Figure 1 As shown, the intelligent chip removal and cooling system for a five-axis linkage machining center according to the present invention includes a high-pressure cooling subsystem, a negative pressure capture subsystem, a gas-liquid-solid three-phase separation and purification reuse subsystem, and a data processing and control subsystem.

[0023] The high-pressure cooling subsystem includes a high-pressure liquid supply unit 1, a nozzle array 3, and a nozzle servo angle adjustment mechanism 4. The high-pressure liquid supply unit 1 includes a high-pressure pump, a pressure / flow regulating valve, a pulse modulation valve group 2, and a liquid supply pipeline. The liquid supply pipeline of the high-pressure liquid supply unit 1 is connected to the nozzle array 3 through the output pipeline of the pulse modulation valve group 2. The high-pressure liquid supply unit 1 supplies coolant to the nozzle array 3, and controls the nozzle array 3 to spray coolant through the pulse modulation valve group 2, supporting grouped operation.

[0024] like Figure 2 As shown, the nozzle array 3 is arranged around the main axis, preferably in two rings, including an upper nozzle ring and a lower nozzle ring. Each of the upper and lower nozzle rings has several nozzles, and each nozzle's pitch / azimuth angle is adjusted via a nozzle servo angle adjustment mechanism 4. Preferably, the pitch angle range is 30–60°, and the azimuth angle range is 0–360°. The orientation function is achieved through three-dimensional angle adjustment by the servo motor of the servo angle adjustment mechanism.

[0025] The present invention uses a nozzle array 3 arranged in two rings, and the nozzles can be opened in groups to form an equivalent synthetic jet direction to maintain the coupling angle θ within a preset range.

[0026] The negative pressure capture subsystem includes a negative pressure suction unit 6 and a multi-suction port assembly 7. Each suction port of the multi-suction port assembly 7 is equipped with an independent damper actuator 8, whose damper opening and closing is adjustable from 0 to 100%. The negative pressure air path of the multi-suction port assembly 7 converges to the air inlet of the negative pressure suction unit 6. The negative pressure suction unit 6 preferably uses a variable frequency high-pressure centrifugal fan, and its outlet is connected to the first-stage cyclone separator 9 of the gas-liquid-solid three-phase separation and purification reuse subsystem, conveying the suctioned debris-liquid-mist mixture to the gas-liquid-solid three-phase separation and purification reuse subsystem, while simultaneously forming a stable negative pressure field within the fully enclosed processing chamber 5. The multi-suction port assembly 7 includes several suction ports. In this embodiment, 16 independent suction ports are provided, of which 8 are distributed around the workbench area within the fully enclosed processing chamber of the machining center, 4 are located below the gantry beam within the fully enclosed processing chamber, and 4 are located at the base of the machining center's rotary shaft, etc. Figure 3 As shown.

[0027] The suction port has a flared structure and is equipped with an independent damper actuator 8. A self-cleaning grid 17 is provided on the inner side of the flared mouth of the suction port. The self-cleaning grid is made of shape memory alloy material and vibrates when the temperature exceeds a threshold to shake off the blockage.

[0028] This invention reduces ineffective suction energy consumption and turbulence interference by setting up multiple suction ports and configuring an independent damper actuator 8 for each suction port. During operation, only a portion of the suction ports can be opened, while the remaining suction ports enter standby or maintain a small opening for pressure holding.

[0029] The gas-liquid-solid three-phase separation and purification / reuse subsystem includes a primary cyclone separator 9, a secondary liquid-gas separator and filter assembly 10, a tertiary centrifugal dehydrator 12, and a coolant purification / reuse unit 13. The solid outlet of the primary cyclone separator 9 is connected to the inlet of the tertiary centrifugal dehydrator 12, and the upper gas-liquid outlet is connected to the inlet of the secondary liquid-gas separator and filter assembly 10. The secondary liquid-gas separator and filter assembly 10 is connected in parallel with a pulse backflushing unit 11 for backflushing to regenerate the filter element. The lower outlet of the secondary liquid-gas separator and filter assembly 10 is connected to the tertiary centrifugal dehydrator 12, and the liquid outlet of the tertiary centrifugal dehydrator 12 is connected to the coolant purification / reuse unit 13. Figure 4 As shown. The debris-liquid-mist mixture drawn by the negative pressure suction unit 6 enters the primary cyclone separator 9, the secondary liquid-gas separator and filter element assembly 10, and the tertiary centrifugal dehydrator 12. The separated liquid flows back to the coolant purification and reuse unit 13.

[0030] The coolant purification and reuse unit 13 includes, in sequence, a coarse filtration mechanism, a fine filtration mechanism, a magnetic separation mechanism, an ultraviolet sterilization mechanism, a heat exchange mechanism, a concentration / conductivity monitoring mechanism, an automatic replenishment mechanism, and a storage tank. The separated liquid undergoes a series of processes, including coarse filtration, fine filtration, magnetic separation to capture ferromagnetic cutting particles, ultraviolet sterilization to kill microorganisms, concentration / conductivity monitoring to trigger the replenishment threshold, and automatic replenishment to maintain a stable coolant concentration, before entering the storage tank. Figure 5 As shown, coolant is supplied to the high-pressure liquid supply unit 1, forming a closed-loop process that increases the service life of the coolant to 12–18 months.

[0031] In this embodiment, the inlet airflow velocity of the first-stage cyclone separator is 25–30 m / s, the cone angle is 60°, and the height is about 1.5 m. It is equipped with a double-helix guide plate. After the mixed airflow enters the first-stage cyclone separator 9, the gas-liquid-solid preliminary separation is achieved under the centrifugal action of the double-helix guide plate. The solid phase chips and a small amount of wet chips with attached liquid droplets are discharged from the bottom of the cone and enter the third-stage centrifugal dehydrator 12 for dehydration treatment. The gas-liquid mixed airflow then enters the second-stage liquid-gas separation and filter element assembly 10.

[0032] The secondary liquid-gas separation and filter assembly includes a three-stage filter element connected in series via pipelines. The filter elements are cylindrical or pleated structures with filter filtration calibers of 200μm, 50μm, and 10μm, respectively. They are arranged sequentially within the sealed housing of the assembly along the airflow direction. The outlet of the previous stage filter element is connected to the inlet of the next stage filter element, achieving progressive fine filtration. The gas-liquid mixture discharged from the primary cyclone separator 9 enters the inlet of the secondary liquid-gas separation and filter assembly and passes sequentially through a 200μm coarse filter element, a 50μm medium filter element, and a 10μm fine filter element. Gas containing trace amounts of particles smaller than 10μm that cannot be trapped by the filter elements is discharged from the gas outlet of the assembly housing. The solid particles and coolant droplets aggregated from each stage of the filter elements flow along the filter element wall to the liquid collection chamber at the bottom of the assembly housing. The outlet of this liquid collection chamber is connected to a three-stage centrifugal dehydrator 12 via pipeline for dehydration treatment. The separated liquid enters the coolant purification and reuse unit 13. Meanwhile, the secondary liquid-gas separator and filter element assembly housing is provided with a side wall outlet. The side wall outlet is the component's emergency or bypass liquid collection port. When the liquid level in the bottom liquid collection chamber of the component is too high or the filter element is partially damaged, causing liquid droplet leakage, the side wall outlet can quickly collect the leaked / overflowing coolant to prevent coolant loss. At the same time, it prevents untreated impurity-containing coolant from directly entering the negative pressure pipeline, ensuring the system's sealing performance and coolant recovery rate.

[0033] The pulse backflush unit 11 is connected in parallel with the secondary liquid-gas separator and the filter element assembly 10. Its core function is filter element regeneration. The backflush trigger is determined by the filter element pressure difference threshold or periodic conditions. When the filter element pressure difference sensor detects that the pressure difference between the filter elements exceeds the threshold or the pressure difference growth rate of the filter elements is abnormal, the pulse backflush unit 11 outputs a high-pressure pulse airflow, which blows from the air outlet side of the filter element to the air inlet side, blowing off the solid particles and agglomerated viscous liquid clumps trapped on the surface of the filter element, restoring the flow capacity of the filter element and reducing the flow channel resistance. The blown-off impurities and droplets fall into the liquid collection chamber at the bottom of the assembly and flow with the coolant to the tertiary centrifugal dehydrator 12 for dehydration treatment, realizing the subsequent unified treatment of impurities and coolant.

[0034] The three-stage centrifugal dewatering machine 12 is a horizontal screw centrifuge with a rotation speed of 1500–2500 rpm and a centrifugal acceleration of 300–800g. The wet chips discharged from the first-stage cyclone separator 9 enter the three-stage centrifugal dewatering machine 12 and are discharged as dry chips after centrifugal dewatering, so that the liquid content of the chips is reduced to less than 5%. The separated liquid is returned to the coolant purification and reuse unit 13.

[0035] The data processing and control subsystem includes a sensor network 14, an edge controller 15, and a data recording and diagnostic module. The sensor network 14 serves as a data acquisition terminal, bidirectionally connected to the edge controller 15. The edge controller 15 sends control commands such as sampling frequency and acquisition point to the sensor network. The sensor network collects operating parameters of the high-pressure cooling subsystem, the negative pressure capture subsystem, and the gas-liquid-solid three-phase separation and purification reuse subsystem, as well as the machine tool's five-axis pose, and transmits the collected multi-source data, such as temperature, pressure, flow rate, and vibration, to the edge controller 15 in real time. The edge controller synchronously adjusts the nozzle angle / jet parameters of the high-pressure cooling subsystem, the suction damper opening / fan frequency of the negative pressure capture subsystem, and / or the filter backflushing regeneration and centrifugal dehydration parameters of the gas-liquid-solid three-phase separation and purification reuse subsystem, based on the machining point location and chip state. The edge controller 15 is connected to the data recording and diagnostic module, synchronously transmitting real-time control parameters, subsystem operating status, raw sensor data, and fault warning information to the data recording and diagnostic module. The data recording and diagnostic module is a data storage feedback terminal that can push diagnostic results and maintenance suggestions, such as filter blockage trends and tool wear warnings, back to the edge controller 15, providing a reference for the edge controller's control decisions.

[0036] In this embodiment, the sensor network 14 is distributed according to the monitoring targets and includes: power sensors, vibration sensors, vision sensors, pressure sensors, temperature sensors, etc. The power sensors are integrated into the machine tool spindle drive module, the high-pressure pump of the high-pressure liquid supply unit 1, and the variable frequency fan of the negative pressure suction unit 6 to monitor the real-time power of the spindle, pump, and fan. The vibration sensors are arranged at the machine tool spindle shank, worktable, gantry beam, and rotary shaft base to monitor machine tool vibration and tool vibration during the cutting process, and at the same time assist in judging chip accumulation / tool ​​wear. The vision sensors use industrial cameras and are arranged in a position with minimal blind spots on the inner wall of the fully enclosed machining chamber 5, aimed at the machining area, to collect chip morphology, chip removal path, and chip accumulation around the machining point in real time. The pressure sensors include a first pressure sensor p1 located at the inlet of the negative pressure suction unit, a second pressure sensor p2 located at the outlet of the negative pressure suction unit or the inlet of the first-stage cyclone separator to facilitate the calculation of the negative pressure difference ΔP, and a filter element pressure difference sensor ΔPf located between the second-stage liquid-gas separator and the series filter element of the filter element assembly 10. The temperature sensor is located on the tool shank. These various sensors work together to form a comprehensive monitoring network covering the entire processing area.

[0037] The present invention discloses an intelligent chip removal and cooling method for a five-axis linkage machining center, comprising the following steps: (1) Collect the five-axis pose and machining point coordinates of the machine tool, and collect the working status parameters of the five-axis linkage gantry machining center.

[0038] The operating parameters include at least cooling pressure, cooling flow rate, tool temperature, negative pressure differential, fan frequency, opening degree of each suction port, filter element pressure differential, liquid content and turbidity, etc.

[0039] (2) The high-pressure cooling subsystem is activated according to the processing procedure, and the nozzle array is controlled to perform directional spraying.

[0040] Preferably, pulse modulation is applied to the continuous jet to enhance chip breaking and chip removal.

[0041] (3) A negative pressure capture field is established in the fully enclosed processing chamber, and the air damper is controlled in time and space for multiple suction ports so that the suction force dynamically follows the five-axis position and processing point. The negative pressure capture field is generated by a variable frequency high-pressure centrifugal fan.

[0042] The time-space gating of the damper includes: (a) Establish a neighborhood window Ω centered on the machining point. The neighborhood window Ω can be spherical, cylindrical, or sector-shaped. Project it onto the machine tool coordinate system according to the five-axis attitude. The suction ports contained in the neighborhood window are active suction ports, forming the neighborhood suction port set S. Ω During operation, only the set of suction ports S within the neighborhood window is opened. Ω ; (b) is the set of neighboring suction ports SΩ Each active suction port is weighted and its contribution to the current processing point is quantified. The actual gating opening of each active suction port is calculated based on the port weight, negative pressure requirement, and energy consumption constraint. The active suction ports are opened according to their actual gating openings, while the remaining suction ports are put into standby or maintained at a small opening to reduce ineffective suction energy consumption and turbulence interference.

[0043] The gating degree gi is expressed as: gi=sat(gmin,gmax,f(wi, negative pressure demand, energy consumption constraint)).

[0044] Here, Sat represents the Saturation Function, whose core function is to limit the calculated damper opening value within a preset minimum and maximum opening range, preventing the opening from exceeding the actuator's physical limits. gmin represents the minimum damper opening, which is the small opening for pressure holding at the suction port. Non-working suction ports maintain this opening to prevent turbulence caused by sudden changes in negative pressure within the pipeline. gmax represents the maximum damper opening, which is 100%, i.e., the suction port is fully open, representing the upper limit of the opening of the working suction port, i.e., the active suction port. f represents the damper opening calculation function, which is a multivariate composite function, expressed as f(wi, negative pressure demand, energy consumption constraint). The inputs are the suction port weight wi, the negative pressure value required for current processing, and the system energy consumption limit index. The output is the initial calculated value of the damper opening. wi represents the suction port weight, which is the comprehensive scoring coefficient of the suction port, set according to the distance from the suction port to the processing point, the attitude angle between the suction port and the processing point, the historical capture effect of the suction port, and the suction port blockage risk.

[0045] This invention's air damper spatiotemporal gate control is a multi-dimensional dynamic control strategy, embodying the characteristics of dynamically following the processing point in space and switching in real time according to the processing trajectory in time. It does not merely control the opening / closing of the suction port, but includes three core elements: Spatial Dimension - Neighborhood Window Ω: Establish a spherical / cylindrical / sector-shaped neighborhood centered on the processing point to determine the set of active suction ports S to be opened. Ω Only open the suction port within the neighborhood, and close / hold the pressure of the suction port outside the neighborhood.

[0046] Spatial Dimension - Suction Port Weight wi: Calculates the weight for each active suction port, quantifying the suction port's contribution to the capture of the current processing point.

[0047] Spatial and temporal dimensions - gate opening gi: Based on the weight wi, negative pressure demand, and energy consumption constraints, the actual opening of each active suction port is calculated through the function f and the saturation function Sat. As the processing point moves, the neighborhood window, suction port weight, and suction port gate opening are dynamically adjusted synchronously.

[0048] The suction port weight wi is the core calculation basis for the damper opening. The core purpose of adjusting this parameter is to achieve precise distribution of negative pressure suction, avoiding ineffective energy consumption and turbulence caused by uniform suction across the entire area. Specifically, it assigns high weights to suction ports that are close to the processing point, have a good attitude angle, and have a good historical capture effect, and vice versa, so that the suction is tilted towards the effective capture area. The weight calculation incorporates a blockage risk indicator. For suction ports that are prone to blockage, the weight is appropriately reduced and the opening is decreased to avoid the failure of the negative pressure system due to suction port blockage. Through the weight, qualitative factors such as processing point position, machine tool attitude, and system status are transformed into quantitative coefficients, making the calculation of damper opening more scientific and reproducible, rather than a simple empirical value. When the processing point moves, the suction port weight changes gradually, which drives the opening to adjust gradually, avoiding sudden increases and decreases in suction, achieving smooth switching of suction, and ensuring the stability of the negative pressure field.

[0049] like Figure 7 As shown, in the top-view projection of the worktable, suction ports 1 through 8 are marked around the perimeter and bottom. There are no independent suction port numbers for the crossbeam and the rotary shaft base. The current machining point is P. A circle with a radius of approximately 3–5 suction ports centered at machining point P is the neighborhood window Ω. The suction ports contained within this window are active suction ports, including suction ports 3, 5, and 4, forming the neighborhood suction port set S. Ω The suction ports outside the window, such as ports 1, 2, and 6-8, are in standby mode or maintain a small opening for pressure holding. For active suction ports, their weights and openings are calculated. As shown in the figure, suction port 3 is close to the current processing point, and the angle between the attraction vector Fs and the chip movement vector Vc at processing point P is small. Considering its historical capture effect and clogging risk, the weight w3 is calculated to be 0.8. Considering the negative pressure requirement and energy consumption constraints, the gate opening g3 of suction port 3 is calculated to be 80%. Similarly, the weights w4 and g4 of suction port 4 are 1.0 and 100%, respectively, meaning suction port 4 is fully open; the weights w5 and g5 of suction port 5 are 0.8 and 80%, respectively. For suction ports outside the neighborhood window, some ports enter standby mode, such as suction ports 1 and 7, while others maintain a small opening for pressure holding, such as suction ports 2, 6, and 6, which have a gate opening of 10%. As the processing point moves, the set S of active suction ports changes at different times. Ω Dynamic switching means that the suction power dynamically follows the processing point. For example, at time t1, suction ports 3, 4 and 5 are opened; at time t2, suction ports 4, 5 and 8 are opened; and at time t3, suction ports 4, 8 and 6 are opened.

[0050] (4) Define the coupling angle θ between the jet thrust vector and the suction vector, and establish online self-tuning control with the chip capture rate, mist emission, energy consumption and pressure difference as the objectives. Adjust the nozzle pitch angle / azimuth angle and the suction port opening to keep the coupling angle θ in the preset range to improve the capture rate.

[0051] The preset range of the coupling angle θ is 120°–150°.

[0052] The coupling angle θ between the jet thrust vector and the attraction vector includes: A local three-dimensional coordinate system is established with the machining point as the origin and the tool spindle axis as the Z-axis. The jet thrust vector Fj is defined as determined by the direction and pressure / flow rate of the equivalent composite jet from the open nozzle; the suction vector Fs is determined by the gating opening of the suction port set within the neighborhood window, the frequency of the variable-frequency high-pressure centrifugal fan, and the fluid resistance between the multi-suction port assembly and the negative pressure suction unit; the chip motion vector Vc is along the chip exit direction of the tool. The coupling angle θ is the angle between the jet thrust vector Fj and the suction vector Fs, i.e., θ = ∠(Fj, Fs). Figure 6 As shown.

[0053] The fluid resistance between the multi-inlet assembly and the negative pressure suction unit refers to the fluid resistance generated by the local pipeline or structure between a single inlet of the multi-inlet assembly 7 and the air inlet of the negative pressure suction unit 6 in the negative pressure capture subsystem. It is a key physical quantity affecting the magnitude and direction of the suction vector Fs, specifically including: local inlet resistance: the resistance generated by the inlet's flared structure and the grid gaps of the self-cleaning grid 17; branch pipeline resistance: the local resistance at bends, diameter changes, and joints of the branch ducts from a single inlet to the main suction duct; damper actuator resistance: the flow channel resistance corresponding to the opening degree of the damper blades of the independent damper actuator 8. The smaller the opening degree, the greater the resistance; main flow confluence resistance: the fluid turbulence resistance generated when the multi-inlet branch pipelines converge in the main suction duct. The local flow channel resistance is positively correlated with the inlet opening degree, pipeline layout, and fluid velocity. The greater the resistance, the smaller the amplitude of the corresponding suction vector Fs, and the weaker the negative pressure suction.

[0054] With the goals of maximizing capture rate η, minimizing mist emission E, energy consumption P, and negative pressure difference ΔP, and using the coupling angle θ within a preset range as a coordination indicator, the jet thrust vector and suction vector are optimally matched to ensure that chips and droplets accurately enter the negative pressure capture channel. For example, when η decreases or visual or pressure criteria indicate an increasing trend in chip accumulation, the nozzle direction and the opening of adjacent suction ports are adjusted first to bring θ back to the preferred range of 120°–150°. When E or P exceeds the threshold, the set of open suction ports is reduced and the gating weight is optimized, while maintaining the local suction of key suction ports. The visual criteria are derived from a vision sensor, indicating visual characteristics of chip accumulation around the processing point, such as chips staying longer around the worktable and tool, forming local accumulation. This may be caused by the chip removal path deviating from the negative pressure suction port, causing the chips to fall into non-suction areas instead of moving towards the active suction port. Alternatively, the chip shape may be abnormal, with long or entangled chips that cannot be pushed to the suction port by the jet. The pressure criteria are derived from pressure sensors. These criteria include abnormal pressure differential ΔP at the inlet of the negative pressure suction unit. If the pressure differential suddenly decreases, it indicates an increase in flow resistance within the pipeline, possibly due to chips clogging the pipeline / suction port. Alternatively, the filter element pressure differential ΔPf may rise abnormally, with the pressure differential between the secondary liquid-gas separator and the filter element assembly increasing at a faster rate, indicating that chip particles are accumulating on the filter element surface and prematurely causing blockage. Or, local pressure fluctuations may occur within the processing chamber, with pressure sensors in the fully enclosed processing chamber 5 detecting sudden changes in local pressure, indicating that chip accumulation is causing uneven distribution of the negative pressure field.

[0055] The capture rate η is the proportion of chips / droplets effectively captured by the negative pressure capture subsystem to the total generated amount. A decrease in η may be due to: failure of the jet-suction coordination, such as the coupling angle θ deviating from the optimal range of 120°–150°; unreasonable suction port control strategy, such as incorrect selection of the active suction port or insufficient opening; abnormal parameters of the negative pressure capture subsystem, such as excessively low fan frequency or insufficient negative pressure differential; and abnormal chip morphology, such as tangled or excessively long chips that cannot be effectively sucked up. Failure to adjust in time will lead to chip accumulation, droplet escape, and increased tool temperature.

[0056] (5) The chip-liquid-mist mixture captured by negative pressure is fed into the gas-liquid-solid three-phase separation and purification reuse subsystem to realize coolant recovery and chip drying.

[0057] In this process, filter cartridge backflushing regeneration and centrifugal dehydration parameter adjustments are triggered using filter cartridge differential pressure ΔPf, liquid content W, turbidity T, and concentration / conductivity C as closed-loop variables. For example, when the filter cartridge differential pressure ΔPf exceeds the differential pressure threshold or the growth rate is abnormal, the pulse backflushing unit 11 is triggered to backflush and the backflushing effect is recorded; when the liquid content W at the centrifuge outlet rises or does not meet the liquid content threshold, the speed of the three-stage centrifugal dehydrator is increased or the differential speed is adjusted; when T or C deviates from the target, bypass, liquid replenishment, or heat exchange regulation is triggered; maintenance scores and predictive maintenance recommendations are generated through logs. Specifically, the bypass refers to the bypass piping system of the coolant purification and reuse unit 13. Bypass adjustment means that when the turbidity T or concentration / conductivity C of the coolant deviates significantly from the target value, such as excessive turbidity or excessive concentration, and the fine filtration / magnetic separation process cannot quickly repair the issue, the excess coolant is switched from the main purification pipeline to the bypass pipeline for deep purification treatment, such as additional filtration, dilution, and additive replenishment. This prevents the excess coolant from flowing directly back to the storage tank, which would affect the processing cooling effect. The replenishment adjustment is performed by the automatic replenishment mechanism within the coolant purification and reuse unit 13. When the concentration / conductivity sensor detects that the coolant concentration is too low, it automatically replenishes the storage tank with concentrated coolant or pure water to maintain a stable concentration. The replenishment port is a dedicated interface of the unit, and the replenishment process is a closed-loop automatic control. The heat exchange regulation is performed by the heat exchange mechanism in the coolant purification and reuse unit 13. It is located after the ultraviolet sterilization mechanism to cool the returned liquid, so as to avoid the heat generated during processing from causing the coolant temperature to be too high, or to preheat the new replenishment liquid to ensure the temperature of the coolant is stable when it enters the high-pressure supply unit 1.

[0058] like Figure 8 As shown, the intelligent chip removal and cooling system architecture for a five-axis linkage machining center according to the present invention includes an input layer, a rule layer, a model layer, a arbiter, and an output layer. The input layer includes a sensor network and a CNC interface. The sensor network is used to collect multi-source data such as temperature, pressure, flow rate, vibration, vision, and power. The CNC interface is used to collect five-axis pose, machining point coordinates, process type, material parameters, etc.

[0059] The rule layer is used for safety constraints and process level adjudication, including a safety constraint module, a process level module, a threshold module, and a state machine module. The safety constraint module detects hard constraint thresholds such as temperature exceeding limits, pressure surges, abnormal flow rates, excessive differential pressure, and abnormal vibration. For example, when temperature exceeds limits or pressure surges, it outputs emergency commands such as shutdown, increasing cooling pressure, or increasing negative pressure. The process level module outputs a preset pressure-flow mapping table based on roughing / semi-finishing / finishing processes to determine the basic parameters for high-pressure cooling. The state machine module includes a five-state machine (jet-pulse-capture-separation-reuse) and state switching conditions, controlling the state switching of the five-state machine and determining the operating mode of each subsystem. The threshold module triggers backflushing / centrifugal speed adjustment / liquid replenishment when filter element differential pressure ΔPf, liquid content W, turbidity T, etc., exceed thresholds. For example, when filter element differential pressure ΔPf or liquid content W exceeds the standard, it outputs trigger commands such as backflushing, centrifuge speed adjustment, and liquid replenishment.

[0060] The model layer includes a parameter recommendation module, a trend prediction module, and a maintenance scoring module. The parameter recommendation module recommends nozzle angles, suction inlet openings, and fan frequencies based on massive amounts of historical data stored in the data recording and diagnostic module. The trend prediction module predicts chip accumulation trends, filter element clogging trends, and tool wear trends. Specifically, it mines historical data to establish a correlation model of "processing parameters - system status - fault trends"; it collects real-time sensor data and control parameters from the current processing and inputs them into the correlation model; through trend fitting, machine learning, and time series analysis, it quantitatively predicts the development trends of chip accumulation, filter element clogging, and tool wear over a future period (e.g., the next 5 / 10 minutes), outputting trend quantification values ​​and warning levels. The maintenance scoring module calculates a maintenance urgency score based on the differential pressure growth rate, backflushing effect, and liquid content fluctuation. Specifically, a quantitative weighted scoring method based on multi-dimensional operational status indicators is used, with maintenance urgency as the final output. The core focuses on three closed-loop variables: filter element pressure difference, backflushing effect, and liquid content fluctuation. A quantitative calculation model is established by combining the deviation, rate of change, and historical performance of each indicator. Auxiliary indicators such as equipment runtime and fault history are also incorporated to ultimately output a comprehensive maintenance score. The actual performance of the maintenance score is recorded in the data recording and diagnostic module, which in turn optimizes the calculation model at the model layer, improving the accuracy of the score.

[0061] The arbitrator is a core decision-making unit independent of the rule layer and model layer. It is not a sub-module of the rule layer or model layer. In the system control architecture, it is located at the output end of the rule layer and model layer, and the input end of the output layer, playing a core role in priority adjudication and instruction filtering. When the rule layer outputs hard constraint instructions (such as emergency response to safety over-limit or threshold triggering operation), and the model layer outputs optimized recommendation instructions (such as recommended nozzle angle and suction opening parameters), the arbitrator executes the rule layer priority logic: if the rule layer determines that the system is "unsafe" or needs to "force the execution of emergency / threshold instructions", it rejects the recommendation of the model layer and directly sends the rule layer instruction to the output layer; if the system is in normal working condition and there is no hard constraint triggering, it adopts the optimized recommendation instruction of the model layer and sends it to the output layer for execution.

[0062] The output layer is where actuators perform mechanical actions or parameter adjustments according to instructions, used to achieve online self-tuning control of the coupling angle θ, time-space gate control of multi-inlet dampers, and closed-loop self-tuning control of the three-phase separation link based on filter element pressure difference and liquid content. The actuators include a pulse modulation valve group 2, a nozzle servo angle adjustment mechanism 4, an independent damper actuator 8, a variable frequency fan in the negative pressure suction unit 6, a pulse backflushing unit 11, a three-stage centrifugal dehydrator 12, an automatic liquid replenishment mechanism in the coolant purification and reuse unit 13, and a heat exchange mechanism, etc.

[0063] The effects of the present invention are further illustrated below with three specific embodiments.

[0064] Example 1: Rough machining of TC4 titanium alloy aerospace structural components The workpiece to be processed is 2500mm×1200mm×300mm (length×width×height); it is an integral frame part, including a deep cavity (depth 150mm), thin wall (thickness 8mm), and reinforcing ribs; the blank allowance is 20-30mm.

[0065] Five-axis gantry machining center, model VMC2516, travel X2500 / Y1600 / Z1000mm, A-axis ±120°, C-axis 360°, spindle: power 55kW, speed 12,000rpm, torque 440Nm; φ63mm face milling cutter, insert APMT1604, TiAlN coated, number of inserts Z=8.

[0066] Cutting parameters (roughing): Spindle speed n = 800 rpm; Feed per tooth fz = 0.15 mm / z; Depth of cut ap = 5 mm; Width of cut ae = 50 mm; Material removal rate MRR=fz*Z*n*ap*ae=0.15×8×800×5×50=2400000mm³ / min=2400cm³ / min.

[0067] Parameter settings for the high-pressure cooling subsystem: Pressure: 12MPa; Flow rate: 100L / min; Coolant: Semi-synthetic cutting fluid, concentration 10%, temperature 25℃; Nozzle activation: All 8 nozzles are open; Nozzle angles: Upper ring depression angle 45°, azimuth angles evenly distributed (0°, 90°, 180°, 270°); Lower ring depression angle 60°, azimuth angles 45°, 135°, 225°, 315° (staggered from the upper ring); Pulse modulation: Frequency 30Hz, duty cycle 70%.

[0068] Negative pressure capture subsystem parameter settings: Fan frequency: 45Hz (corresponding to speed 1350rpm); Negative pressure: 2500Pa; Wind speed: 28m / s; Suction port opening: 4 around the workbench + 2 under the crossbeam (6 in total, dynamically switched according to real-time X / Y position).

[0069] Intelligent control: Tool temperature threshold: 750℃; Temperature closed loop: When the temperature is detected to be >750℃, the pressure is automatically increased to 13MPa and then dropped after 10 seconds.

[0070] Timeframes and key data:

[0071] Observation of chip morphology: Chip length: 20-40mm (effective breakage by high-pressure jet); Chip morphology: C-shaped curl, no entanglement; Color: Silver-white with blue tempering color (temperature about 600-700℃), indicating effective cooling.

[0072] Resource Consumption and Recovery: Coolant Consumption: 800L in the tank before startup, 790L measured after 30 minutes of processing, 10L consumed (evaporation + splash), consumption rate 1.25%; Coolant Recovery: 780L of coolant recovered by the separator, recovery rate = 780 / 800 = 97.5%; Chip Generation: Theoretical MRR × Time × Density = 2400cm³ / min × 30min × 4.5g / cm³ = 324kg; Chip Recovery: 321kg weighed in the chip storage box, recovery rate = 321 / 324 = 99.1%; Chip Liquid Content: 4.2% (near dry state) measured by sampling.

[0073] Tool life: Traditional cooling (external cooling 0.5MPa): After 60 minutes of machining, the wear on the back face of the insert is VB=0.35mm, which meets the wear standard (VB=0.3mm) and the tool needs to be replaced; In this embodiment, after 120 minutes of machining, VB=0.28mm, which does not meet the standard and can continue to be used; the tool life is extended by 100%.

[0074] Machining accuracy: Dimensional accuracy: Key dimension tolerance ±0.08mm, measured deviation ±0.05mm, qualified; Geometric tolerance: Flatness 0.06mm (requirement ≤0.1mm), qualified; Roughness Ra: Measured 1.2μm (traditional method 1.8μm), improved by 33%; No scratches, burns, or hardened layers on the surface; Energy consumption analysis: High-pressure pump power: 22kW×0.5h=11kWh; Fan power: 22kW×0.45 (frequency coefficient)×0.5h=4.95kWh; Total: 15.95kWh; Unit energy consumption: 15.95kWh / 324kg=0.049kWh / kg chips.

[0075] Example 2: Semi-finishing of high-temperature alloy GH4169 turbine disk

[0076] The workpiece to be processed is a turbine disk with a diameter of φ800mm×200mm; complex cavity, tenon groove depth of 80mm, width of 15mm, wall thickness of 6mm; dimensional accuracy ±0.05mm, roughness Ra≤1.6μm; machine tool: same as in Example 1.

[0077] Cutting tool: φ12mm solid carbide end mill, 4-flute, helix angle 35°, AlTiN coated; Cutting parameters (semi-finishing): Spindle speed n = 3000 rpm; Feed per tooth fz = 0.08 mm / z; Depth of cut ap = 2 mm; Width of cut ae = 8 mm; MRR = 0.08 × 4 × 3000 × 2 × 8 = 153600 mm³ / min = 153.6 cm³ / min.

[0078] High-pressure cooling subsystem parameter settings: Pressure: 10MPa; Flow rate: 60L / min; Coolant: Fully synthetic cutting fluid (low foam), concentration 8%, temperature 23℃; Nozzle activation: 4 on the upper ring (aligned with the tenon opening); Nozzle angle: Dynamically follow, adjusting the azimuth angle in real time according to the A-axis / C-axis angle; Pulse modulation: Frequency 20Hz, duty cycle 65%.

[0079] Negative pressure capture subsystem parameter settings: Fan frequency: 35Hz (speed 1050rpm); Negative pressure: 2000Pa; Wind speed: 22m / s; Suction port: 4 fully open on the rotary table base (high temperature alloy chips are small and need to be captured completely).

[0080] Five-axis linkage strategy: When machining tenons and grooves, the A-axis swings ±30° for every 15° rotation of the C-axis (24 grooves in total); the azimuth angle β of the cooling nozzle rotates synchronously with the C-axis: β = C-axis angle + 90° (always spraying from the side towards the cutting point); the chip suction port does not need to be switched (the base suction port covers all directions).

[0081] 60-minute processing cycle data:

[0082] Special working condition handling: When machining the 18th tenon groove, the power sensor detected a sudden increase to 35kW (suspected tool wear or cutting parameter deviation).

[0083] The system automatically responds as follows: ① Cooling pressure increases to 11MPa; ② Negative pressure increases to 2200Pa; ③ Alarm is triggered, prompting the operator to pay attention; After inspection, the operator finds that the allowance in the tank is too large (3mm instead of 2mm), which is normal; After processing is completed, the system parameters automatically recover.

[0084] Dimensional accuracy: Tongue and groove width: 15±0.05mm, the measured average of 24 grooves is 15.02mm, the standard deviation is 0.018mm, and the pass rate is 100%; Depth: 80±0.05mm, the measured average is 79.98mm, which is qualified.

[0085] Surface quality: Roughness Ra: Measured 1.4μm (requirement ≤1.6μm), qualified; no built-up edge, no burns.

[0086] Tool life comparison: Traditional cooling: After machining 6 pieces (360 min), the tool wear VB=0.25mm, and it is scrapped; This system: After machining 10 pieces (600 min), VB=0.23mm, and it can continue to be used; the tool life is extended by 67%; Resource recovery: Coolant consumption: 8L consumed in 60min, consumption rate 1%; recovery rate: 98.2%; Chip recovery: theoretical 153.6cm³ / min × 60min × 8.2g / cm³ = 75.6kg, actual measured 74.8kg, recovery rate 98.9%; liquid content: 3.8%.

[0087] In this embodiment, nozzle following and micro-chip capture are achieved during five-axis linkage. The PLC reads the real-time C-axis angle of the machine tool's CNC (refresh cycle 50ms); the nozzle target azimuth angle β = C + 90° is calculated; the servo motor responds quickly (maximum angular velocity 120° / s) to achieve dynamic following; the measured following error is <2°, and the cooling effect is unaffected. GH4169 chips have small particle sizes (0.5-3mm) and are easily dispersed; by increasing the negative pressure (2000Pa), reducing the wind speed (22m / s to avoid excessive wind speed blowing up chips), and using an omnidirectional suction port layout, a capture rate of 98.9% is achieved.

[0088] Example 3: Precision machining of 316L stainless steel marine propellers

[0089] Processing object and working conditions: φ1500mm×400mm (adjustable pitch propeller, 5 blades); the blades are free-form surfaces, with a leading edge radius of R10mm, a trailing edge sharp angle of <1mm, and a thickness that varies from 3 to 15mm; dimensional accuracy ±0.03mm, and surface roughness Ra≤0.8μm.

[0090] The machine tool is the same as in Example 1. Cutting tool: φ10mm ball end mill, 2-flute, DLC (diamond-like carbon) coated; rotation speed n = 8000 rpm; feed per tooth fz = 0.05 mm / z; depth of cut ap = 0.5 mm; step distance Δ = 0.3 mm; MRR = 0.05 × 2 × 8000 × 0.5 × 10 = 40000 mm³ / min = 40 cm³ / min (lower MRR for finishing).

[0091] System parameter settings. High-pressure cooling subsystem parameters (finishing mode): Pressure: 6MPa (reduced pressure during finishing to avoid impact on the workpiece); Flow rate: 35L / min; Coolant: emulsion, concentration 12%, temperature 22℃; Nozzle activation: 2 on the upper ring (aligned with the front of the tool); Nozzle angle: 40° depression angle, azimuth angle dynamically adjusted according to the tool path; No pulse modulation (finishing requires a stable jet).

[0092] Negative pressure capture subsystem parameters (finishing mode). Fan frequency: 25Hz (750rpm); Negative pressure: 1500Pa (fewer chips in finishing, reducing negative pressure for energy saving); Wind speed: 18m / s; Suction port opening: 2 below the crossbeam + 2 around the worktable (total 4).

[0093] Surface quality optimization: Adding extreme pressure additives (2% concentration) to the coolant further reduces friction; more stringent tool temperature control: threshold temperature reduced to 600℃.

[0094] 120-minute processing cycle (5 blades) (approximately 24 minutes per blade):

[0095] Chip morphology: extremely fine ribbon-like, 5-10 mm in length and <1 mm in width; silvery-white in color, without ablation.

[0096] Coolant consumption: 6L per 120min, consumption rate 0.75% (low evaporation during finishing). Chip generation: 40cm³ / min × 120min × 7.9g / cm³ = 37.9kg; Recovery: 37.5kg, recovery rate 98.9%; Liquid content: 3.1% (excellent centrifugal drying effect).

[0097] Processing effect evaluation: Blade profile: compared with the CAD model (three-coordinate measurement), the maximum deviation is +0.025mm, the average is ±0.015mm, which is qualified; Roughness Ra: the average of the five blades is 0.71μm (<0.8μm requirement), which is excellent; The surface is free of ripples and chatter marks, and is as smooth as a mirror.

[0098] Tool life: Traditional cooling: After machining 2 pieces (10 pieces, 240 min), the tool wear is severe, the ball end radius error >0.02 mm, and it is scrapped; This system: After machining 4 pieces (20 pieces, 480 min), the radius error is 0.015 mm, and it is usable; the tool life is extended by 100%; Customer feedback: A shipbuilding company reported that the surface quality was significantly improved, the time for subsequent polishing processes was reduced from 8 hours to 4 hours, and the overall efficiency was increased by 30%.

[0099] Multi-material compatibility testing (processing other materials with the same system before and after this propeller project):

[0100] As can be seen from the table above, this invention performs well with different materials, requiring only adjustment of pressure and negative pressure parameters without any hardware modifications.

Claims

1. An intelligent chip removal and cooling system for a five-axis linkage machining center, characterized in that, It includes a high-pressure cooling subsystem, a negative pressure capture subsystem, a gas-liquid-solid three-phase separation and purification reuse subsystem, and a data processing and control subsystem; the high-pressure cooling subsystem includes interconnected high-pressure liquid supply units and nozzle arrays. The negative pressure capture subsystem includes a multi-inlet assembly and a negative pressure suction unit. Each inlet of the multi-inlet assembly is equipped with an independent damper actuator. The air inlet of the negative pressure suction unit is connected to the multi-inlet assembly, and the air outlet is connected to the gas-liquid-solid three-phase separation and purification reuse subsystem. The gas-liquid-solid three-phase separation and purification reuse subsystem includes a filter assembly, a centrifugal dehydration assembly and a coolant purification reuse unit connected in sequence. The filter assembly is connected in parallel with a pulse backflushing unit for filter element backflushing regeneration. The data processing and control subsystem is used to collect the working parameters of the high-pressure cooling subsystem, the negative pressure capture subsystem, and the gas-liquid-solid three-phase separation and purification reuse subsystem, as well as the five-axis position of the machine tool. Based on the machining point position and chip state, it adjusts the nozzle angle and spray parameters of the high-pressure cooling subsystem, the opening of the suction damper of the negative pressure capture subsystem, the frequency of the negative pressure suction unit, and / or the filter element backflushing regeneration and centrifugal dehydration parameters of the gas-liquid-solid three-phase separation and purification reuse subsystem.

2. The intelligent chip removal and cooling system for a five-axis linkage machining center according to claim 1, characterized in that, The high-pressure liquid supply unit controls the nozzle array to spray coolant through a pulse modulation valve group.

3. The intelligent chip removal and cooling system for a five-axis linkage machining center according to claim 1, characterized in that, Each nozzle in the nozzle array is adjusted for pitch and azimuth angles via a nozzle servo angle adjustment mechanism.

4. The intelligent chip removal and cooling system for a five-axis linkage machining center according to claim 1, characterized in that, The suction port of the multi-suction port assembly has a flared, funnel-shaped structure, and a self-cleaning grid is provided on the inner side of the funnel.

5. The intelligent chip removal and cooling system for a five-axis linkage machining center according to claim 1, characterized in that, The filtration assembly includes three levels of filter elements with different filtration precision connected in series by pipelines.

6. The intelligent chip removal and cooling system for a five-axis linkage machining center according to claim 1, characterized in that, The coolant purification and reuse unit includes a coarse filtration mechanism, a fine filtration mechanism, a magnetic separation mechanism, an ultraviolet sterilization mechanism, a heat exchange mechanism, a concentration / conductivity monitoring mechanism, an automatic replenishment mechanism, and a storage tank connected in sequence. After coarse filtration, fine filtration, magnetic separation to capture ferromagnetic cutting particles, ultraviolet sterilization to kill microorganisms, concentration / conductivity monitoring to trigger the replenishment threshold, and automatic replenishment mechanism to replenish and maintain the coolant concentration, the coolant enters the storage tank.

7. A method for intelligent chip removal and cooling in a five-axis linkage machining center, characterized in that, Includes the following steps: (1) Collect the five-axis pose and machining point coordinates of the machine tool, and collect the working status parameters of the five-axis linkage gantry machining center; (2) Activate the high-pressure cooling subsystem according to the processing procedure and control the nozzle array to spray coolant in a directional manner; (3) In the fully enclosed processing chamber, the negative pressure capture subsystem is activated to establish a negative pressure capture field, and the air damper is controlled in time and space to make the suction force dynamically follow the five-axis posture and processing point. (4) Define the angle between the jet thrust vector and the suction vector as the coupling angle θ, and take chip capture rate, mist emission, energy consumption and negative pressure difference as targets. By adjusting the nozzle angle and jet parameters of the high pressure cooling subsystem, the opening of the suction damper of the negative pressure capture subsystem and / or the frequency of the negative pressure suction unit, the coupling angle θ is kept within the preset range. (5) Input the debris-liquid-mist mixture captured by negative pressure into the gas-liquid-solid three-phase separation and purification reuse subsystem. The filter element pressure difference ΔPf of the secondary liquid-gas separation and filter element assembly, the liquid content W of the coolant after dehydration separation by the tertiary centrifugal dehydrator, the turbidity T, and the concentration / conductivity C are used as closed-loop variables to trigger the filter element backflushing regeneration and centrifugal dehydration parameter adjustment of the gas-liquid-solid three-phase separation and purification reuse subsystem.

8. The intelligent chip removal and cooling method for a five-axis linkage machining center according to claim 7, characterized in that, Each nozzle in the nozzle array has its pitch and azimuth angles adjusted via a nozzle servo angle adjustment mechanism.

9. The intelligent chip removal and cooling method for a five-axis linkage machining center according to claim 7, characterized in that, In step (3), the implementation of time-space gating of the damper on the multi-inlet assembly includes: (a) Establish a neighborhood window centered on the processing point location. The suction ports contained within the neighborhood window are active suction ports, forming a neighborhood suction port set. (b) Calculate the weight for each active suction port in the neighborhood suction port set, and calculate the actual gating opening of each active suction port based on the suction port weight, negative pressure demand, and energy consumption constraints; (c) Open each active suction port in the neighboring suction port set according to the actual gating opening, and put the suction ports in the non-neighboring suction port set into standby or maintain the pressure holding opening.

10. The intelligent chip removal and cooling method for a five-axis linkage machining center according to claim 9, characterized in that, In step (4), a local three-dimensional coordinate system is established with the machining point as the origin and the tool spindle axis as the Z-axis. The jet thrust vector is determined by the equivalent composite jet direction and pressure flow rate of the opened nozzle. The suction vector is determined by the gating opening of the active suction port within the neighborhood window, the frequency of the negative pressure suction unit, and the fluid resistance between the multi-suction port assembly and the negative pressure suction unit.

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