A solution purification apparatus and purification method

Abstract

The embodiment of the present application provides a kind of solution purification device and purification method, it is related to solution purification technical field, wherein, the solution purification device includes: liquid storage container, liquid storage container is used to store the solution to be purified;Electrolysis component, electrolysis component is communicated with liquid storage container, electrolysis component is configured as, when at least part of solution in liquid storage container is introduced into electrolysis component, electrolysis solution, to deposit metal ion impurities in solution as solid metal;Filtering component, filtering component is communicated with electrolysis component, filtering component is configured as, when electrolysis solution passes through filtering component, filter out solid metal.The solution purification device and purification method provided in the embodiment of the present application solve the problem that the convenience of galvanization solution purification process is low in the related art.

Description

Technical Field

[0001] This application relates to the field of solution purification technology, and in particular to a solution purification device and purification method. Background Technology

[0002] Zinc plating is a key step in the surface treatment of copper foil to enhance its high-temperature resistance, oxidation resistance, and electrochemical stability.

[0003] However, during the recycling process, zinc plating solutions are prone to contamination by copper ions. This causes copper ions to be preferentially electroplated during the copper foil zinc plating process, resulting in a reduction in the zinc ion content on the copper foil surface and affecting product performance. To address this, related technologies involve adding zinc powder to the zinc plating solution. The reducing properties of zinc replace copper ions with solid copper impurities, which are then separated by filtration equipment, thereby reducing the copper ion content in the zinc plating solution and achieving purification.

[0004] However, the above methods easily generate a large amount of zinc sludge (hazardous waste), which complicates the hazardous waste treatment process; and the deposited solid copper impurities will be mixed in the zinc sludge, which is not conducive to the subsequent recycling of solid copper impurities, thus making the zinc plating solution purification process less convenient. Summary of the Invention

[0005] This application provides a solution purification device and method to solve the problem of low convenience in the purification process of zinc plating solution in related technologies.

[0006] On one hand, embodiments of this application provide a solution purification device, comprising:

[0007] A liquid storage container for storing a solution to be purified;

[0008] An electrolysis assembly connected to the liquid storage container is configured to electrolyze the solution after at least a portion of the solution in the liquid storage container is introduced into the electrolysis assembly, thereby depositing metal ion impurities in the solution as solid metal.

[0009] A filtration assembly connected to the electrolysis assembly, the filtration assembly being configured to filter out the solid metal when the electrolyzed solution passes through the filtration assembly.

[0010] In one possible implementation, the electrolysis assembly includes an electrolysis vessel, a power supply unit, an anode unit, and a cathode unit;

[0011] The electrolytic container is provided with at least two spaced-apart ion exchange membranes, which divide the internal space of the electrolytic container into an anode chamber, a buffer chamber, and a cathode chamber arranged sequentially. The cathode chamber is connected to the liquid storage container and the filter assembly. The anode chamber is used to hold the first electrolyte, the buffer chamber is used to hold the second electrolyte, and the cathode chamber is used to hold the solution to be purified.

[0012] The anode and cathode are electrically connected to the positive and negative terminals of the power supply, respectively. The anode is disposed in the anode chamber and at least a portion of the anode is immersed in the first electrolyte. The cathode is disposed in the cathode chamber and at least a portion of the cathode is immersed in the solution to be purified.

[0013] In one possible implementation, at least two of the ion exchange membranes include cation exchange membranes and anion exchange membranes spaced apart, the anode chamber is located on the side of the cation exchange membrane opposite to the anion exchange membrane, the buffer chamber is located between the cation exchange membrane and the anion exchange membrane, and the cathode chamber is located on the side of the anion exchange membrane opposite to the cation exchange membrane.

[0014] In one possible implementation, the electrolytic vessel is further provided with a filter membrane located on the side of the anion exchange membrane facing the cathode chamber.

[0015] In one possible implementation, a rotating element is also included, the cathode being connected to the rotating element, the rotating element being used to drive the cathode to rotate relative to the electrolytic container to agitate the solution.

[0016] In one possible implementation, a nozzle is also included, disposed within the cathode chamber, the nozzle being used to blow airflow into the cathode chamber to agitate the solution.

[0017] In one possible implementation, a transducer is also included, which is disposed on the electrolytic vessel and corresponds to the cathode chamber, and is used to vibrate the electrolytic vessel to agitate the solution.

[0018] In one possible implementation, the filtration assembly includes a transfer container, a filtration pipe, and at least one first filter element;

[0019] The transfer container is connected to the electrolysis assembly, and the transfer container is used to receive the electrolyzed solution;

[0020] The inlet and outlet of the filter pipe are both connected to the transfer container, and the first filter element is connected to the filter pipe; the first filter element is configured to filter out the solid metal when the electrolyzed solution circulates through the filter pipe.

[0021] In one possible implementation, the filtration assembly further includes a second filter element connected between the transfer container and the electrolysis assembly, the second filter element being configured to filter out the solid metal when the transfer container receives the electrolyzed solution;

[0022] And / or, the transfer container is also connected to the liquid storage container.

[0023] On the other hand, embodiments of this application provide a solution purification method, employing the solution purification apparatus described in any of the above embodiments, comprising the following steps:

[0024] At least a portion of the solution to be purified in the storage container of the solution purification device is passed into the electrolysis component of the solution purification device, and then the solution is electrolyzed by the electrolysis component to deposit the metal ion impurities in the solution into solid metal.

[0025] The electrolyzed solution is passed through a filter assembly in a solution purification device to filter out the solid metal.

[0026] This application provides a solution purification device and method. The solution purification device includes: a storage container for storing the solution to be purified; an electrolysis component connected to the storage container, configured to electrolyze the solution after at least a portion of the solution in the storage container is introduced into the electrolysis component, thereby depositing metal ion impurities in the solution as solid metal; and a filtration component connected to the electrolysis component, configured to filter out the solid metal when the electrolyzed solution passes through the filtration component. In use, a zinc plating solution (the solution to be purified) can be stored in the storage container. When purification is required, at least a portion of the zinc plating solution in the storage container can be introduced into the electrolysis component to electrolyze the zinc plating solution, depositing copper ions in the zinc plating solution as solid copper impurities. The electrolyzed zinc plating solution is then introduced into the filtration component to filter out the solid copper impurities. Therefore, compared with the purification methods of zinc plating solution in related technologies, this method of purifying zinc plating solution is less likely to generate hazardous waste such as zinc sludge, thus eliminating the need for additional hazardous waste treatment steps; moreover, the purity of the filtered solid copper impurities is high, which can be directly used as raw materials for recycling without the need for further separation steps of solid copper impurities, greatly improving the convenience of the zinc plating solution purification process and also helping to control costs, thus solving the problem of low convenience of the zinc plating solution purification process in related technologies. Attached Figure Description

[0027] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0028] Figure 1 This is a schematic diagram of a solution purification device provided in an embodiment of this application.

[0029] Explanation of reference numerals in the attached figures:

[0030] 100-liquid storage container;

[0031] 200 - Electrolysis assembly; 210 - Electrolysis container; 211 - Anode chamber; 212 - Buffer chamber; 213 - Cathode chamber; 220 - Power supply component; 230 - Anode component; 240 - Cathode component; 250 - Ion exchange membrane; 251 - Cation exchange membrane; 252 - Anion exchange membrane; 260 - Filter membrane;

[0032] 300 - Filter assembly; 310 - Transfer container; 320 - Filter pipe; 330 - First filter element; 340 - Second filter element;

[0033] 400-Rotating component;

[0034] 500-nozzle;

[0035] 600-Transducer;

[0036] 700 - Valve;

[0037] 800-concentration meter.

[0038] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0039] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0040] In related technologies, zinc plating is a key step in the surface treatment of copper foil to enhance its high-temperature heat resistance, oxidation resistance, and electrochemical stability.

[0041] However, during the recycling process, zinc plating solutions are prone to contamination by copper ions. This causes copper ions to be preferentially electroplated during the copper foil zinc plating process, resulting in a reduction in the zinc ion content on the copper foil surface and affecting product performance. To address this, related technologies involve adding zinc powder to the zinc plating solution. The reducing properties of zinc replace copper ions with solid copper impurities, which are then separated by filtration equipment, thereby reducing the copper ion content in the zinc plating solution and achieving purification.

[0042] However, the above methods easily generate large amounts of zinc sludge (hazardous waste), making the hazardous waste treatment process complex. Furthermore, the deposited solid copper impurities mix with the zinc sludge, hindering their subsequent recycling. In other words, if the deposited solid copper impurities are to be recycled, a further solid copper impurity separation step is required, which is quite complex. Therefore, the zinc plating solution purification process is not very convenient.

[0043] Based on this, embodiments of this application provide a solution purification device and method. The solution purification device includes: a storage container for storing the solution to be purified; an electrolysis component connected to the storage container, configured to electrolyze the solution after at least a portion of the solution in the storage container is introduced into the electrolysis component, thereby depositing metal ion impurities in the solution as solid metal; and a filtration component connected to the electrolysis component, configured to filter out the solid metal when the electrolyzed solution passes through the filtration component. In use, a zinc plating solution (the solution to be purified) can be stored in the storage container. When purification is required, at least a portion of the zinc plating solution in the storage container can be introduced into the electrolysis component to electrolyze the zinc plating solution, depositing copper ions in the zinc plating solution as solid copper impurities. The electrolyzed zinc plating solution is then introduced into the filtration component to filter out the solid copper impurities. Therefore, compared with the purification methods of zinc plating solution in related technologies, this method of purifying zinc plating solution is less likely to generate hazardous waste such as zinc sludge, thus eliminating the need for additional hazardous waste treatment steps; moreover, the purity of the filtered solid copper impurities is high, which can be directly used as raw materials for recycling without the need for further separation steps of solid copper impurities, greatly improving the convenience of the zinc plating solution purification process and also helping to control costs, thus solving the problem of low convenience of the zinc plating solution purification process in related technologies.

[0044] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0045] like Figure 1 As shown in the embodiment of this application, a solution purification device includes:

[0046] Liquid storage container 100 is used to store the solution to be purified;

[0047] An electrolysis unit 200 is connected to a liquid storage container 100. The electrolysis unit 200 is configured to electrolyze the solution after at least a portion of the solution in the liquid storage container 100 is introduced into the electrolysis unit 200, so as to deposit metal ion impurities in the solution as solid metal.

[0048] The filter assembly 300 is connected to the electrolysis assembly 200. The filter assembly 300 is configured to filter out solid metal when the electrolyzed solution passes through the filter assembly 300.

[0049] It should be noted that the solution to be purified can be from various fields, and there are no restrictions on the field; the purpose is simply to deposit metal ion impurities in the solution. In this embodiment, the solution to be purified is a zinc plating solution.

[0050] The liquid storage container 100 can be a tank container, a box container, or other type of container, and there are no restrictions on this. The liquid storage container 100 just needs to be able to store the zinc plating solution.

[0051] When it is necessary to purify the zinc plating solution, at least a portion of the zinc plating solution in the storage container 100 can be passed into the electrolysis component 200 to electrolyze the zinc plating solution, depositing copper ions in the zinc plating solution as solid copper impurities. Then, the electrolyzed zinc plating solution is passed into the filter component 300, so that when the zinc plating solution passes through the filter component 300, the filter component can filter out the solid copper impurities in the zinc plating solution.

[0052] Therefore, compared to the purification methods of zinc plating solutions in related technologies, this method is less likely to generate hazardous waste such as zinc sludge, thus eliminating the need for additional hazardous waste treatment steps. Furthermore, the filtered solid copper impurities can be directly recycled as raw materials without further separation steps. This significantly improves the convenience of the zinc plating solution purification process, facilitates cost control, and solves the problem of low convenience in zinc plating solution purification processes in related technologies.

[0053] Furthermore, the purification device for this solution continuously extracts copper ions from the zinc plating solution, ensuring that the copper ion content remains at a low level and eliminating electroplating interference. It can also adapt to both acidic and alkaline zinc plating solutions, guaranteeing efficient copper extraction.

[0054] like Figure 1 As shown, in some embodiments, the electrolysis assembly 200 includes an electrolysis container 210, a power supply unit 220, an anode unit 230, and a cathode unit 240;

[0055] The electrolytic container 210 is provided with at least two spaced ion exchange membranes 250, which divide the internal space of the electrolytic container 210 into an anode chamber 211, a buffer chamber 212, and a cathode chamber 213 arranged sequentially. The cathode chamber 213 is connected to both the liquid storage container 100 and the filter assembly 300. The anode chamber 211 is used to hold the first electrolyte, the buffer chamber 212 is used to hold the second electrolyte, and the cathode chamber 213 is used to hold the solution to be purified.

[0056] The anode 230 and cathode 240 are electrically connected to the positive and negative terminals of the power supply 220, respectively. The anode 230 is disposed in the anode chamber 211 and at least a portion of the anode 230 is immersed in the first electrolyte. The cathode 240 is disposed in the cathode chamber 213 and at least a portion of the cathode 240 is immersed in the solution to be purified.

[0057] It should be noted that the electrolytic container 210 can be a tank container, a box container or other types of container, and there are no restrictions on this, as long as the inside of the electrolytic container 210 is hollow.

[0058] At least two ion exchange membranes 250 are spaced apart inside the electrolytic vessel 210 to divide the internal space of the electrolytic vessel 210 into an anode chamber 211, a buffer chamber 212, and a cathode chamber 213 arranged sequentially. The cathode chamber 213 can be simultaneously connected to the storage container 100 and the filter assembly 300 via a pipe. In practice, the pipe can be connected to the electrolytic vessel 210, the storage container 100, or the filter assembly 300 by welding, bolting, flange connection, or other means.

[0059] The anode 230 and cathode 240 are electrically connected to the positive and negative terminals of the power supply 220, respectively. The anode 230 is inserted into the anode chamber 211, and the cathode 240 is inserted into the cathode chamber 213. The power supply 220 can be a battery or other power source. Both the anode 230 and cathode 240 are made of conductive materials and can be selected appropriately according to actual needs. In implementation, a switch can be added to the power supply 220 to control the circuit opening and closing, thereby controlling the start or stop of operation of the anode 230 and cathode 240.

[0060] Therefore, in use, a first electrolyte can be introduced into the anode chamber 211, immersing at least a portion of the anode 230 in the first electrolyte; a second electrolyte can be introduced into the buffer chamber 212; and at least a portion of the zinc plating solution in the storage container 100 can be introduced into the cathode chamber 213, immersing at least a portion of the cathode 240 in the zinc plating solution. Next, the power supply 220 is kept connected to the anode 230 and cathode 240 to electrolyze the zinc plating solution, thereby depositing copper ions in the zinc plating solution as solid copper impurities. Finally, the electrolyzed zinc plating solution can be passed through the filter assembly 300 to filter out the solid copper impurities.

[0061] In this embodiment, at least two ion exchange membranes 250 include a cation exchange membrane 251 and an anion exchange membrane 252 spaced apart. The anode chamber 211 is located on the side of the cation exchange membrane 251 away from the anion exchange membrane 252. The buffer chamber 212 is located between the cation exchange membrane 251 and the anion exchange membrane 252. The cathode chamber 213 is located on the side of the anion exchange membrane 252 away from the cation exchange membrane 251.

[0062] Specifically, two ion exchange membranes 250 are provided, namely a cation exchange membrane 251 and an anion exchange membrane 252, which are horizontally spaced inside the electrolytic vessel 210. In practice, the distance between the cation exchange membrane 251 and the anion exchange membrane 252 can be 1.5-3.0 mm. At this time, the anode chamber 211 is located on the side of the cation exchange membrane 251 away from the anion exchange membrane 252, the buffer chamber 212 is located between the cation exchange membrane 251 and the anion exchange membrane 252, and the cathode chamber 213 is located on the side of the anion exchange membrane 252 away from the cation exchange membrane 251.

[0063] Thus, two adjacent chambers can be isolated by cation exchange membrane 251 and anion exchange membrane 252. Cation exchange membrane 251 is used to selectively allow cations to pass through (i.e., cations can pass through, but anions cannot), and anion exchange membrane 252 is used to selectively allow anions to pass through (i.e., anions can pass through, but cations cannot), so as to ensure that the electrolysis reaction in the electrolysis container 210 proceeds smoothly.

[0064] In implementation, both cation exchange membrane 251 and anion exchange membrane 252 can be existing products, and their structures are not restricted.

[0065] In other embodiments, the cation exchange membrane 251 and the anion exchange membrane 252 may be configured in other quantities; in addition, other quantities of chambers may be divided within the electrolysis vessel 210, without limitation.

[0066] like Figure 1 As shown, the electrolytic vessel 210 is further provided with a filter membrane 260 inside, which is located on the side of the anion exchange membrane 252 facing the cathode chamber 213.

[0067] The filter membrane 260 can be a PP filter membrane (polypropylene microporous filter membrane) or other filter membranes 260.

[0068] Therefore, physical filtration can be achieved through the filter membrane 260, reducing the possibility of impurities and suspended matter appearing in the cathode chamber 213 affecting the anion exchange membrane 252 and ensuring the safe operation of the anion exchange membrane 252.

[0069] For example, in some embodiments (in an acidic system), the first electrolyte may include a strongly acidic main electrolyte, an anode interface wetting agent, and an electrocatalytic modifier (such as sulfuric acid, sodium dodecylbenzenesulfonate, etc.); the second electrolyte may include a neutral supporting electrolyte and a weakly acidic pH buffer (such as sodium citrate, sodium sulfate, etc.). In this case, selective copper complexing agents, auxiliary coordinating agents, and low molecular weight wetting agents (such as thiourea, isonicotinic acid, polyethylene glycol, etc.) may be further added to the cathode chamber 213 according to actual needs.

[0070] The roles of each material are as follows: the strongly acidic main electrolyte provides high conductivity and a proton source, maintaining the oxygen evolution reaction at the anolyte; the anolyte interface wetting agent reduces the anolyte surface tension, prevents bubble adhesion, and extends anolyte life; the electrocatalytic modifier increases the oxygen evolution overpotential, suppresses side reactions, and enhances coating stability; and the neutral supporting electrolyte forms an ionic strength gradient, inhibiting... Transmembrane migration; weakly acidic pH buffers can complex trace metal ions, preventing membrane fouling and protecting ion exchange membranes. Selective copper complexing agents can inhibit zinc co-deposition and improve copper selectivity; auxiliary ligands can promote dense copper deposition and improve coating quality; low molecular weight wetting agents can inhibit hydrogen evolution side reactions and reduce porosity.

[0071] For example, in some embodiments (in an alkaline system), the first electrolyte may include a strongly alkaline main electrolyte and a sulfur-based anti-toxic agent (such as potassium hydroxide, sodium sulfide, etc.); the second electrolyte may include a carbonate pH buffer and a mechanical filter protectant (such as sodium carbonate, sodium bicarbonate, etc.). In this case, pH-buffered weak complexing agents, dispersants, and surfactants (such as triethanolamine, sodium gluconate, sodium dodecyl sulfate, etc.) may be further added to the cathode chamber 213 according to actual needs.

[0072] The functions of each material are as follows: a strongly alkaline main electrolyte can maintain high... Concentration ensures efficient oxygen evolution at the anode; sulfur-based anti-poisoning agents preferentially oxidize and consume permeated metal ions, preventing poisoning of the anode coating. Carbonate pH buffers can neutralize... Permeation prevents sudden pH changes in the cathode region; mechanical filtration protectants intercept colloidal particles to prevent membrane pore blockage. pH-buffered weak complexing agents stabilize the pH in the cathode region and complex impurity ions; dispersants prevent metal hydroxide precipitation and maintain... Activity; surfactants can improve mass transfer and prevent concentration polarization.

[0073] In practice, the liquid levels in each chamber (i.e., anode chamber 211, buffer chamber 212, and cathode chamber 213) can be controlled to be consistent, while maintaining the pressure in anode chamber 211 greater than the pressure in buffer chamber 212, which in turn is greater than the pressure in cathode chamber 213 (for example, the pressure difference can be 1.0~2.0 kPa). This ensures stable and balanced pressure in each chamber, preventing deformation or damage to the ion exchange membrane 250 due to uneven stress. It also enables directional and controllable migration of the electrolyte, suppresses backflow of gas and impurities, and improves the stability and efficiency of the electrolysis reaction, as well as the service life of the ion exchange membrane 250.

[0074] During implementation, in order to optimize the electrolysis effect of the zinc plating solution in the cathode chamber 213.

[0075] like Figure 1 As shown, in some embodiments, the solution purification device further includes a rotating element 400, and the cathode element 240 is connected to the rotating element 400. The rotating element 400 is used to drive the cathode element 240 to rotate relative to the electrolysis container 210 to agitate the solution.

[0076] The rotating component 400 can be a motor or other device. The rotating component 400 can be mounted on the electrolytic vessel 210 via a bracket and by welding, screwing, or other means, or it can be directly mounted on the ground. The cathode component 240 can be connected to the rotating shaft in the rotating component 400 by screwing, welding, or other means, so that the rotating component 400 can control the rotation of the cathode component 240.

[0077] The rotation method of the cathode element 240 can be continuous rotation in one direction, or alternating rotation in the forward and reverse directions.

[0078] Therefore, during the electrolytic zinc plating process, while the cathode component 240 is engaged in electrolysis, the rotating component 400 can also drive the cathode component 240 to rotate, thereby agitating the zinc plating solution in the cathode chamber 213, improving the electrolysis effect of the zinc plating solution, and ensuring uniform ion concentration.

[0079] like Figure 1 As shown, in some embodiments, the solution purification device further includes a nozzle 500 disposed in the cathode chamber 213, the nozzle 500 being used to blow airflow into the cathode chamber 213 to agitate the solution.

[0080] The nozzle 500 can be a venturi nozzle or other types of nozzle 500, without limitation. Furthermore, the number of nozzles 500 is also not limited, for example, one, two, three, etc.

[0081] In this embodiment, the cathode chamber 213 is provided with three nozzles 500 (all of which may be Venturi nozzles), and can be connected to the electrolysis vessel 210 by welding, screwing or other means.

[0082] Therefore, during the electrolytic zinc plating process, airflow can be blown into the cathode chamber 213 (and the zinc plating solution) through the nozzle 500, thereby further agitating the zinc plating solution, improving the electrolytic effect of the zinc plating solution, and ensuring uniform ion concentration.

[0083] like Figure 1 As shown, in some embodiments, the solution purification device further includes a transducer 600, which is disposed on the electrolytic container 210 and corresponds to the cathode chamber 213. The transducer 600 is used to vibrate the electrolytic container 210 to agitate the solution.

[0084] The transducer 600 can be an ultrasonic transducer or other types of transducers 600, without limitation. Furthermore, the number of transducers 600 is also not limited, such as one, two, three, etc.

[0085] In this embodiment, a transducer 600 (which may be an ultrasonic transducer) is provided and can be connected to the electrolytic container 210 by welding, screwing or other means, and corresponds to the cathode chamber 213.

[0086] Therefore, during the electrolytic zinc plating process, a vibration source can be provided through the transducer 600 to vibrate the zinc plating solution, thereby further agitating the zinc plating solution, improving the electrolytic effect of the zinc plating solution, and ensuring uniform ion concentration.

[0087] like Figure 1 As shown, in some embodiments, the filter assembly 300 includes a transfer container 310, a filter pipe 320, and at least one first filter element 330.

[0088] The transfer container 310 is connected to the electrolysis unit 200, and the transfer container 310 is used to receive the electrolyzed solution;

[0089] The inlet and outlet of the filter pipe 320 are both connected to the transfer container 310, and the first filter element 330 is connected to the filter pipe 320. The first filter element 330 is configured to filter out solid metal when the electrolyzed solution circulates through the filter pipe 320.

[0090] It should be noted that the transit container 310 can be a tank container, a box container, or other types of container, and there are no restrictions on this.

[0091] The transfer container 310 can be connected to the cathode chamber 213 in the electrolysis assembly 200 via a pipeline, allowing the transfer container 310 to receive the electrolyzed solution. The pipeline can be connected to the electrolysis container 210 and the transfer container 310 by welding, flange connection, or other means.

[0092] The filter pipe 320 can be an open-loop structure, with the two ends of the filter pipe 320 extending in the same direction being the inlet and outlet, respectively. Both the inlet and outlet ends of the filter pipe 320 can be connected to the transfer container 310 by welding, flange connection or other means, so that the solution in the transfer container 310 can circulate between the filter pipe 320 and the transfer container 310.

[0093] The first filter element 330 can be connected to the filter pipe 320 by screwing, welding or other means. The first filter element 330 can be a filter in an existing product, and its structure is not limited, such as a precision filter, activated carbon filter, etc. In addition, the number of first filter elements 330 is not limited, and can be one, two, three, etc.

[0094] During implementation, a drive pump, such as a centrifugal pump or a pipeline pump, can be connected to the filter pipe 320 according to actual needs, so that the electrolyzed solution can be driven to circulate between the filter pipe 320 and the transfer container 310.

[0095] Therefore, the electrolyzed zinc plating solution can be passed into the transfer container 310, and then the zinc plating solution can be circulated between the filter pipe 320 and the transfer container 310. When the zinc plating solution flows through the filter pipe 320, the solid copper impurities in the zinc plating solution are filtered out by the first filter element 330.

[0096] In this embodiment, three first filter elements 330 (two of which are a precision filter and an activated carbon filter, respectively) can be installed on the filter pipe 320 to achieve the filtration effect through multiple first filter elements 330, effectively improving the filtration effect of solid copper impurities and improving the purification effect of zinc plating solution.

[0097] like Figure 1 As shown, in some embodiments, the filter assembly 300 further includes a second filter element 340, which is connected between the transfer container 310 and the electrolysis assembly 200. The second filter element 340 is configured to filter out solid metals when the transfer container 310 receives the electrolyzed solution.

[0098] And / or, the transfer container 310 is also connected to the liquid storage container 100.

[0099] Specifically, the second filter element 340 can be connected to the pipeline between the transfer container 310 and the electrolysis assembly 200 (i.e., the cathode chamber 213) by screwing, welding, or other means. The second filter element 340 can be a filter from existing products, and its structure is not limited, such as a precision filter or an activated carbon filter.

[0100] Therefore, during the process of passing the electrolyzed zinc plating solution from the cathode chamber 213 into the transfer container 310, the zinc plating solution can be initially filtered by the second filter element 340 to filter out solid copper impurities in the zinc plating solution, further optimize the filtration effect of solid copper impurities, and improve the purification effect of the zinc plating solution.

[0101] In addition, the transfer container 310 can be connected to the storage container 100 via a pipeline, so that the purified zinc plating solution can be reintroduced and stored in the storage container 100; or it can be purified again to further improve the cleanliness of the zinc plating solution.

[0102] For example, the liquid storage container 100 can be connected to the filter pipe 320 through a pipe to achieve the purpose of connecting the transfer container 310 and the liquid storage container 100.

[0103] In other embodiments, the filtering assembly 300 may further include a plurality of filters connected in sequence.

[0104] It should be noted that valves 700 can be added to some pipelines according to actual needs, so as to control the flow of the solution to be purified. Valves 700 can be existing products such as solenoid valves and pneumatic valves.

[0105] In addition, an ion concentration meter 800 can be installed on the cathode chamber 213 and the liquid storage container 100 by screwing, welding or other means. The ion concentration meter 800 can be an existing product. Thus, the concentration of copper ions in the zinc plating solution can be detected by the ion concentration meter 800, which facilitates timely knowledge of the purification level of the zinc plating solution and facilitates control of the purification process.

[0106] Further explanation is needed: the electrolyte additive in cathode chamber 213 must have a molecular weight of less than 400 g / mol and an activated carbon adsorption removal rate greater than 60%. The solution purification device can also be equipped with an electrolyte circulation system and an intelligent control system, similar to existing products, to intelligently control the electrolysis process. Added reagents can be substituted from the same system, maintaining the same concentration. Ultrasonic transducers and Venturi nozzles can be replaced with other devices that reduce concentration polarization, such as bottom spiral stirrers. When injecting the corresponding electrolyte into each chamber, the liquid level should be kept basically consistent, controlling the level difference within ±5 mm. After treating 4-7 batches, the zinc plating solution is purified using activated carbon adsorption and precision filtration, achieving a removal rate greater than 75%. Real-time monitoring of copper ion concentration is also possible, dynamically adjusting pulse parameters and recovering solid copper impurities.

[0107] In summary, the solution purification device provided in this application embodiment can, when it is necessary to purify zinc plating solution, pass at least a portion of the zinc plating solution in the storage container 100 into the electrolysis component 200 so that the zinc plating solution is electrolyzed by the electrolysis component 200, and the copper ions in the zinc plating solution are deposited as solid copper impurities. Then, the electrolyzed zinc plating solution is passed into the filter component 300 so that when the zinc plating solution passes through the filter component 300, the filter component can filter out the solid copper impurities in the zinc plating solution.

[0108] Therefore, compared to the purification methods of zinc plating solutions in related technologies, this method is less likely to generate hazardous waste such as zinc sludge, thus eliminating the need for additional hazardous waste treatment steps. Furthermore, the filtered solid copper impurities can be directly recycled as raw materials without further separation steps. This significantly improves the convenience of the zinc plating solution purification process, facilitates cost control, and solves the problem of low convenience in zinc plating solution purification processes in related technologies.

[0109] This application provides a solution purification method using the solution purification device described in any of the above embodiments, comprising the following steps:

[0110] At least a portion of the solution to be purified in the storage container 100 of the solution purification device is passed into the electrolysis component 200 of the solution purification device, and then the solution is electrolyzed by the electrolysis component 200 to deposit the metal ion impurities in the solution into solid metal.

[0111] The electrolyzed solution is passed through the filter element 300 in the solution purification device to filter out the solid metal.

[0112] The solution purification device has been described in detail in the above embodiments and will not be repeated here.

[0113] In this embodiment, the zinc plating solution to be purified can be stored in the storage container 100. When it is necessary to purify the zinc plating solution, at least a portion of the zinc plating solution in the storage container 100 can be passed into the electrolysis assembly 200. The electrolysis assembly 200 electrolyzes the zinc plating solution to deposit copper ion impurities in the zinc plating solution into solid copper impurities. Then, the electrolyzed zinc plating solution is passed into the filter assembly 300 to filter out the solid copper impurities.

[0114] Therefore, compared to the purification methods of zinc plating solutions in related technologies, this method of purifying zinc plating solutions is less likely to generate hazardous waste such as zinc sludge, thus eliminating the need for additional hazardous waste treatment steps. Furthermore, the filtered solid copper impurities can be directly recycled as raw materials, without the need for further separation steps. This greatly improves the convenience of the zinc plating solution purification process and is also beneficial for cost control. In addition, it can simultaneously adapt to acidic / alkaline environments, has a high copper removal rate, a low zinc loss rate, and allows for the recycling of the plating solution, solving the problems of short lifespan and large amounts of hazardous waste in traditional technologies. In other words, this purification method not only generates no hazardous waste, but the copper sludge deposited at the cathode can also be used as a copper feedstock, reducing costs.

[0115] The following detailed explanation is provided through specific examples:

[0116] Example 1 (acidic zinc plating solution system, pH ≦ 5) specifically includes the following steps:

[0117] Step 1: When the ion concentration meter 800 detects a copper ion concentration ≥20 ppm in the storage container 100, add 0.2-0.5 mol / L sodium citrate and 5% Na2SO4 (sodium sulfate) to the buffer chamber 212. Simultaneously, open valve 700 between the cathode chamber 213 and the storage container 100, allowing the zinc plating solution to enter the cathode chamber 213. Add 0.2-0.5 g / L thiourea, 0.1-0.3 g / L isonicotinic acid, and 0.05-0.15 g / L PEG-200 (polyethylene glycol with a molecular weight of 200) to the cathode chamber 213. Add 15-20% of the solution to the anode chamber 211. (Sulfuric acid) and 0.1-0.3 g / L sodium dodecylbenzenesulfonate, to control the liquid level in each chamber to be consistent. Maintain the pressure in anode chamber 211 > buffer chamber 212 > cathode chamber 213 (pressure difference 1.0-2.0 kPa).

[0118] Step Two: Circulate the zinc plating solution within the cathode chamber 213 and the storage container 100. Turn on the power supply 220, and simultaneously, the rotating component 400 drives the cathode component 240 to rotate slowly, alternating between forward and reverse rotation. Activate each nozzle 500 and transducer 600 to agitate the zinc plating solution within the cathode chamber 213, ensuring uniform ion concentration. When the ion concentration meter 800 detects that the copper ion concentration in the zinc plating solution within the cathode chamber 213 is ≤5 ppm, control the power supply 220 to be turned off, and simultaneously open the valve 700 between the cathode chamber 213 and the transfer container 310, introducing the zinc plating solution into the transfer container 310. Solid copper impurities electrolyzed from the zinc plating solution can be collected in the second filter 340.

[0119] Step 3: The solution in the transfer container 310 is further filtered through a portion of the first filter element 330 to remove solid copper impurities produced by electrolysis. It also passes through a portion of the first filter element 330 (such as an activated carbon filter) to adsorb the reagents added to the cathode chamber 213 (excluding the zinc plating solution). Finally, it passes through a portion of the first filter element 330 (such as a precision filter) to further filter out tiny deposited copper particles and impurity ions. Simultaneously, valve 700 on the filter pipe 320 is opened, and valve 700 between the filter pipe 320 and the storage container 100 is closed, allowing the zinc plating solution to be returned to the transfer container 310. This step is repeated approximately 10 times. Then, valve 700 between the filter pipe 320 and the storage container 100 is opened, allowing the purified zinc plating solution to be returned to the storage container 100 for reuse.

[0120] Example 2 (alkaline zinc plating solution system 9≦pH≦13) specifically includes the following steps:

[0121] Step 1: When the ion concentration meter 800 detects a copper ion concentration ≥ 20 ppm in the storage container 100, add 0.5 mol / L Na₂CO₃ (sodium carbonate) and NaHCO₃ (sodium bicarbonate) buffer solution to the buffer chamber 212. Simultaneously, open valve 700 between the cathode chamber 213 and the storage container 100, allowing the zinc plating solution to enter the cathode chamber 213. Add 0.05-0.1 mol / L triethanolamine, 0.05-0.15 mol / L sodium gluconate, and 0.01-0.03 g / L sodium dodecyl sulfate to the cathode chamber 213. Add 5 mol / L KOH (potassium hydroxide) and 0.05% Na₂S (sodium sulfide) to the anode chamber 211, maintaining a consistent liquid level in all chambers. Maintain the pressure in the anode chamber 211 > the buffer chamber 212 > the cathode chamber 213 (pressure difference 1.0-2.0 kPa).

[0122] Step Two: Circulate the zinc plating solution within the cathode chamber 213 and the storage container 100. Turn on the power supply 220, and simultaneously, the rotating component 400 drives the cathode component 240 to rotate slowly, alternating between forward and reverse rotation. Activate each nozzle 500 and transducer 600 to agitate the zinc plating solution in the cathode chamber 213, ensuring uniform ion concentration. When the ion concentration meter 800 detects a copper ion concentration ≤5 ppm in the zinc plating solution in the cathode chamber 213, turn off the power supply 220 and simultaneously open the valve 700 between the cathode chamber 213 and the transfer container 310, introducing the zinc plating solution into the transfer container 310. Solid copper impurities electrolyzed from the zinc plating solution can be collected in the second filter 340. Add 2-3 mL / L of hydrogen peroxide solution to the transfer container 310.

[0123] Step 3: The solution in the transfer container 310 is further filtered through a portion of the first filter element 330 to remove solid copper impurities produced by electrolysis. It also passes through a portion of the first filter element 330 (such as an activated carbon filter) to adsorb the reagents added to the cathode chamber 213 (excluding the zinc plating solution). Finally, it passes through a portion of the first filter element 330 (such as a precision filter) to further filter out tiny deposited copper particles and impurity ions. Simultaneously, valve 700 on the filter pipe 320 is opened, and valve 700 between the filter pipe 320 and the storage container 100 is closed, allowing the zinc plating solution to be returned to the transfer container 310. This step is repeated approximately 10 times. Then, valve 700 between the filter pipe 320 and the storage container 100 is opened, allowing the purified zinc plating solution to be returned to the storage container 100 for reuse.

[0124] Finally, it should be noted that other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. A solution purification device, characterized in that, include: A liquid storage container (100) for storing a solution to be purified; An electrolysis assembly (200) is connected to the liquid storage container (100). The electrolysis assembly (200) is configured to electrolyze the solution after at least a portion of the solution in the liquid storage container (100) is introduced into the electrolysis assembly (200) to deposit metal ion impurities in the solution as solid metal. A filter assembly (300) is connected to the electrolysis assembly (200), and the filter assembly (300) is configured to filter out the solid metal when the electrolyzed solution passes through the filter assembly (300).

2. The solution purification device according to claim 1, characterized in that, The electrolysis assembly (200) includes an electrolysis container (210), a power supply unit (220), an anode unit (230), and a cathode unit (240). The electrolytic container (210) is provided with at least two spaced-apart ion exchange membranes (250), which divide the internal space of the electrolytic container (210) into an anode chamber (211), a buffer chamber (212), and a cathode chamber (213) arranged sequentially. The cathode chamber (213) is connected to the liquid storage container (100) and the filter assembly (300). The anode chamber (211) is used to hold the first electrolyte, the buffer chamber (212) is used to hold the second electrolyte, and the cathode chamber (213) is used to hold the solution to be purified. The anode (230) and the cathode (240) are electrically connected to the positive and negative terminals of the power supply (220), respectively. The anode (230) is disposed in the anode chamber (211), and at least a portion of the anode (230) is used to be immersed in the first electrolyte. The cathode (240) is disposed in the cathode chamber (213), and at least a portion of the cathode (240) is used to be immersed in the solution to be purified.

3. The solution purification device according to claim 2, characterized in that, At least two of the ion exchange membranes (250) include a cation exchange membrane (251) and an anion exchange membrane (252) spaced apart, the anode chamber (211) is located on the side of the cation exchange membrane (251) away from the anion exchange membrane (252), the buffer chamber (212) is located between the cation exchange membrane (251) and the anion exchange membrane (252), and the cathode chamber (213) is located on the side of the anion exchange membrane (252) away from the cation exchange membrane (251).

4. The solution purification device according to claim 3, characterized in that, The electrolytic vessel (210) is also provided with a filter membrane (260), which is located on the side of the anion exchange membrane (252) facing the cathode chamber (213).

5. The solution purification apparatus according to any one of claims 2-4, characterized in that, It also includes a rotating component (400), to which the cathode component (240) is connected. The rotating component (400) is used to drive the cathode component (240) to rotate relative to the electrolytic container (210) to agitate the solution.

6. The solution purification apparatus according to any one of claims 2-4, characterized in that, It also includes a nozzle (500) disposed in the cathode chamber (213) for blowing airflow into the cathode chamber (213) to agitate the solution.

7. The solution purification apparatus according to any one of claims 2-4, characterized in that, It also includes a transducer (600) disposed on the electrolytic container (210), the transducer (600) corresponding to the cathode chamber (213), the transducer (600) being used to vibrate the electrolytic container (210) to agitate the solution.

8. The solution purification apparatus according to any one of claims 1-4, characterized in that, The filtration assembly (300) includes a transfer container (310), a filtration pipe (320), and at least one first filter element (330). The transfer container (310) is connected to the electrolysis assembly (200), and the transfer container (310) is used to receive the electrolyzed solution; The inlet and outlet of the filter pipe (320) are both connected to the transfer container (310), and the first filter element (330) is connected to the filter pipe (320); the first filter element (330) is configured to filter out the solid metal when the electrolyzed solution circulates through the filter pipe (320).

9. The solution purification apparatus according to claim 8, characterized in that, The filtration assembly (300) further includes a second filter element (340) connected between the transfer container (310) and the electrolysis assembly (200), and the second filter element (340) is configured to filter out the solid metal when the transfer container (310) receives the electrolyzed solution; And / or, the transfer container (310) is also in communication with the liquid storage container (100).

10. A method for purifying a solution, using the solution purification apparatus according to any one of claims 1-9, characterized in that, Includes the following steps: At least a portion of the solution to be purified in the storage container (100) of the solution purification device is passed into the electrolysis component (200) of the solution purification device, and then the solution is electrolyzed by the electrolysis component (200) to deposit the metal ion impurities in the solution into solid metal. The electrolyzed solution is passed through a filter assembly (300) in a solution purification device to filter out the solid metal.

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