Head-mounted display device

Abstract

The application discloses a head-mounted display device, and belongs to the technical field of communication. The head-mounted display device comprises a shell assembly, a heat source device, a display module, a fan and a heat dissipation piece. The shell assembly comprises a shell and a frame body. The shell has a containing cavity. The shell is also provided with an air inlet hole and an air outlet hole which are in communication with the containing cavity. The frame body is located in the containing cavity. The frame body divides the containing cavity into a first containing cavity and a second containing cavity which are arranged along a first direction. The fan is located in the containing cavity. The fan comprises a mounting seat and a fan blade. The fan blade is rotationally connected with the mounting seat. The mounting seat and the frame body enclose a first space. The fan blade is located in the first space. The heat dissipation piece is located in the first containing cavity and is in heat-conducting connection with the heat source device. The heat dissipation piece and the frame body enclose a second space. One of the first space and the second space is in communication with the air inlet hole, and the other is in communication with the air outlet hole. The air inlet hole, the first space, the second space and the air outlet hole form a heat dissipation channel of the head-mounted display device.

Description

Technical Field

[0001] This application belongs to the field of communication technology, specifically relating to a head-mounted display device. Background Technology

[0002] With the rapid development of science and technology, head-mounted display devices have been deeply integrated into people's daily lives and work scenarios.

[0003] In related technologies, the CPU (Central Processing Unit) is the core heat source component of head-mounted display devices. Priority is given to optimizing its heat distribution and conduction path, thereby employing localized heat dissipation structures to directly cool the CPU. For example, a heat sink is typically used to dissipate heat from the CPU.

[0004] However, with the continuous increase in the functional density of head-mounted display devices, the heat load on components such as the display module is also increasing. The heat dissipation structures in related technologies can only target the CPU for cooling, thus failing to effectively integrate the display module into the active cooling system. This results in heat not being dissipated from the display module in a timely manner, forming isolated localized hotspots. These hotspots can not only lead to decreased device efficiency and shortened lifespan, but also cause functional problems such as image distortion, positioning drift, and abnormal touch response, seriously affecting the user experience and reliability of the head-mounted display device. Therefore, the heat dissipation performance of head-mounted display devices in related technologies is poor. Summary of the Invention

[0005] The purpose of this application is to provide a head-mounted display device that can solve the technical problem of poor heat dissipation performance of head-mounted display devices in the related art.

[0006] To solve the above-mentioned technical problems, this application is implemented as follows: This application discloses a head-mounted display device, comprising: A housing assembly includes a housing and a frame. The housing has a receiving cavity and is further provided with an air inlet and an air outlet communicating with the receiving cavity. The frame is located inside the receiving cavity and divides the receiving cavity into a first receiving cavity and a second receiving cavity arranged along a first direction. A heat source device and a display module are provided, wherein the heat source device is disposed in the first receiving cavity; at least a portion of the display module is disposed in the second receiving cavity; A fan is located within the receiving cavity. The fan includes a mounting base and fan blades. The fan blades are rotatably connected to the mounting base. The mounting base and the frame enclose a first space, and the fan blades are located within the first space. A heat sink is located in the first receiving cavity and is thermally connected to the heat source device. The fan blades and the heat sink are arranged at intervals along a second direction, which intersects with the first direction. The heat sink and the frame enclose a second space. The second space is connected to the first space; one of the first space and the second space is connected to the air inlet and the other is connected to the exhaust port. The air inlet, the first space, the second space and the exhaust port form a heat dissipation channel for the head-mounted display device. The display module and the heat source device are respectively disposed on both sides of the heat dissipation channel along the first direction.

[0007] In this embodiment, the frame mates with the mounting bases of the heat sink and the fan, respectively, to enclose and form a first space and a second space that are interconnected. The two spaces are connected end to end and permeable to each other, thereby constructing a continuous and closed active heat dissipation channel. Simultaneously, on the one hand, the heat source device in the first cavity, through the thermally connected heat sink, rapidly conducts concentrated heat to the airflow area of ​​the second space, relying on forced convection heat exchange via the flowing air to achieve rapid cooling of the core heat source device; on the other hand, the waste heat generated by the display module in the second cavity can exchange heat with the heat dissipation channel, thereby simultaneously removing the heat dissipated by the display module through the airflow of the same heat dissipation channel. Therefore, the head-mounted display device disclosed in this application only needs a single fan and a single through-flow heat dissipation channel to achieve synchronous heat dissipation of the heat source device and the display module. Thus, the head-mounted display device disclosed in this application can incorporate the heat source device and the display module into the same heat dissipation system, thereby achieving multi-heat source collaborative heat dissipation, and avoiding the risk of isolated local hot spots formed by the inability to dissipate heat from the display module in a timely manner, thus effectively improving the heat dissipation performance of the head-mounted display device. Attached Figure Description

[0008] Figure 1 and Figure 2 This is a schematic diagram of a head-mounted display device disclosed in an embodiment of this application; Figure 3 and Figure 4 This is a schematic diagram of the structure of a head-mounted display device disclosed in an embodiment of this application; Figure 5 This is a cross-sectional view of a head-mounted display device disclosed in an embodiment of this application; Figures 6 to 11 This is a schematic diagram of the structure of some components of a head-mounted display device disclosed in an embodiment of this application; Figure 12 This is a partial enlarged view of the frame of a head-mounted display device disclosed in an embodiment of this application; Figure 13This is a partial cross-sectional view of the frame of a head-mounted display device disclosed in an embodiment of this application; Figures 14 to 16 This is a partial cross-sectional view of the frame and housing of a head-mounted display device disclosed in an embodiment of this application; Figure 17 This is a schematic diagram of the structure of a fan in a head-mounted display device disclosed in an embodiment of this application; Figure 18 This is a schematic diagram of the structure of a fan mounting base for a head-mounted display device disclosed in an embodiment of this application; Figure 19 This is a schematic diagram of the heat sink of a head-mounted display device disclosed in an embodiment of this application.

[0009] Explanation of reference numerals in the attached figures: 100 - Housing assembly, 110 - Housing, 1101 - Receiving cavity, 11011 - First receiving cavity, 11012 - Second receiving cavity, 1102 - Air inlet, 1103 - Exhaust outlet, 111 - Frame, 111a - First sidewall, 111b - Second sidewall, 112 - First end cap, 113 - Second end cap, 120 - Frame, 1201 - First surface, 12011 - First through hole, 12012 - Second through hole, 12013 - Third through hole, 1202 - First recess, 12021 - First opening side, 1 2022-Second opening side, 1203-Flow guiding structure, 1203a-First flow guiding protrusion, 1203b-Second flow guiding protrusion, 1204-Second recess, 121-First support part, 122-Connecting part, 1221-Connecting hole, 123-Second support part, 130-Suspension bracket, 1301-Accommodation groove, 131-First connecting section, 132-Suspension section, 133-Second connecting section, 140-Circuit board support structure, 150-Connecting bridge, 151-Heat insulation part, 152-Fixing part, 160-Interval protrusion; 200 - Heat source device; 300 - Display module, 310 - First display module, 320 - Second display module; 400-Fan, 410-Mounting base, 411-Second surface, 4111-Mounting hole, 420-Fan blade, 430-Air inlet, 431-First air inlet, 432-Second air inlet, 440-Air outlet, 401-First fan, 402-Second fan; 510 - First Space, 520 - Second Space, 530 - Connecting Opening, 540 - Third Space, 550 - Fourth Space, 560 - Fifth Space; 600-Heat sink, 610-Heat conductive substrate, 620-Fin portion, 621-First fin portion, 622-Second fin portion; 800 - Heat source module, 810 - First camera module, 820 - Second camera module; 900 - Flexible circuit board, 910 - First flexible circuit board, 920 - Second flexible circuit board; Y - First direction, Z - Second direction, X - Third direction. Detailed Implementation

[0010] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0011] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such terms can be used interchangeably where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0012] The head-mounted display device provided in this application will be described in detail below with reference to the accompanying drawings, through specific embodiments and application scenarios.

[0013] Please refer to Figures 1 to 19 This application discloses a head-mounted display device, which includes a housing assembly 100, a heat source device 200, a display module 300, a fan 400, and a heat sink 600.

[0014] The housing assembly 100 provides a mounting base for other components of the head-mounted display device. The housing assembly 100 includes a housing 110 and a frame 120. The housing 110 can be understood as the outer shell of the head-mounted display device, serving as both an external component and a protective element for the components installed within it. The housing 110 has a receiving cavity 1101, and also includes an air inlet 1102 and an exhaust 1103 communicating with the receiving cavity 1101. The air inlet 1102 and exhaust 1103 can be understood as through holes extending from the outer surface of the housing 110 through its inner surface. Optionally, the housing 110 may include a frame 111, a first end cap 112, and a second end cap 113. The frame 111 may be located between the first end cap 112 and the second end cap 113, in which case the frame 111, the first end cap 112, and the second end cap 113 together enclose the aforementioned receiving cavity 1101. The air inlet 1102 and the exhaust 1103 can be formed on at least one of the frame 111, the first end cover 112, and the second end cover 113. Of course, the housing 110 is not limited to the above structure and can also be other structures, which are not limited herein.

[0015] The frame 120 provides a mounting base for the functional components of the head-mounted display device. The frame 120 is located within the receiving cavity 1101, dividing the receiving cavity 1101 into a first receiving cavity 11011 and a second receiving cavity 11012 arranged along a first direction Y. Optionally, the aforementioned frame 111 may surround the frame 120, and the first end cap 112, the frame 120, and the second end cap 113 may be arranged along the first direction Y. The second receiving cavity 11012 is formed between the frame 120 and the first end cap 112, and the first receiving cavity 11011 is formed between the frame 120 and the second end cap 113.

[0016] The heat source device 200 is the main heat-generating component of the head-mounted display device, and is typically a high-heat-generating component such as the CPU or motherboard. The heat source device 200 is located within the first receiving cavity 11011. The display module 300, also known as the optomechanical module, is used to implement the display function. At least a portion of the display module 300 is located within the second receiving cavity 11012. At this time, the display module 300 and the heat source device 200 are located on opposite sides of the frame 120 along the first direction Y. The display module 300 can be mounted on the aforementioned first end cover.

[0017] The fan 400 is located within the receiving cavity 1101, which can be located either within the first receiving cavity 11011 or the second receiving cavity 11012. The fan 400 includes a mounting base 410 and fan blades 420. The mounting base 410 supports the fan blades 420, and the fan blades 420 are rotatably connected to the mounting base 410. The mounting base 410 and the frame 120 enclose a first space 510, within which the fan blades 420 are located. This can be understood as the mounting base 410 and the frame 120 defining the first space 510 within the receiving cavity 1101. At this time, the first space 510 serves as the airflow space for the fan 400. Therefore, the frame 120 and the mounting base 410 together form the first space 510, and the frame 120 serves as part of the outer shell of the fan 400. Thus, the frame 120 and the mounting base 410 together constitute the outer shell of the fan 400.

[0018] The heat sink 600 is located within the first receiving cavity 11011 and is thermally connected to the heat source device 200. Heat from the heat source device 200 can be transferred to the heat sink 600 and then dissipated through it. For example, the heat sink 600 can be a heatsink, a vapor chamber, or other heat dissipation structure. Of course, the heat sink 600 can also be other heat dissipation structures, which are not limited herein. Optionally, the heat sink 600 and the heat source device 200 can be connected using materials such as thermally conductive silicone or thermally conductive gel.

[0019] The fan blades 420 and the heat sink 600 can be arranged at intervals along the second direction Z, which intersects with the first direction Y. Optionally, the first direction Y can be the thickness direction of the head-mounted display device, and the second direction Z can be the width direction of the head-mounted display device. Of course, the first direction Y and the second direction Z can also be other directions of the head-mounted display device, which are not limited herein.

[0020] The heat sink 600 and the frame 120 enclose and form a second space 520. This can be understood as the heat sink 600 and the frame 120 cooperating to define the second space 520 within the first receiving cavity 11011, so the second space 520 is part of the first receiving cavity 11011.

[0021] The second space 520 is connected to the first space 510. One of the first space 510 and the second space 520 is connected to the air inlet 1102, and the other is connected to the exhaust outlet 1103. In one embodiment, the first space 510 can be connected to the air inlet 1102, and the second space 520 can be connected to the exhaust outlet 1103. In this case, external cold air enters through the air inlet 1102, flows through the first space 510 and the second space 520, and then exits through the exhaust outlet 1103. In another embodiment, the second space 520 can be connected to the air inlet 1102, and the first space 510 can be connected to the exhaust outlet 1103. In this case, external cold air enters through the air inlet 1102, flows through the second space 520 and the first space 510, and then exits through the exhaust outlet 1103.

[0022] In this application, the air inlet 1102, the first space 510, the second space 520, and the exhaust vent 1103 form a heat dissipation channel for the head-mounted display device. Since the heat source device 200 and the display module 300 are respectively disposed on both sides of the frame 120 along the first direction Y, and the frame 120 is used to enclose the part forming the heat dissipation channel, the display module 300 and the heat source device 200 are respectively disposed on both sides of the heat dissipation channel along the first direction Y.

[0023] In this application, the frame 120 cooperates with the mounting bases 410 of the heat sink 600 and the fan 400 to form a first space 510 and a second space 520 that are interconnected. The two spaces are connected end to end and are interconnected, thereby constructing a continuous and closed heat dissipation channel. During the rotation of the fan blades 420, the airflow in the heat dissipation channel and the external cold airflow can be circulated, thereby achieving active heat dissipation.

[0024] In the specific operation, on the one hand, the heat source device 200 in the first accommodating cavity 11011, through the heat sink 600 connected by thermal conductivity, rapidly conducts concentrated heat to the air duct area of ​​the second space 520, relying on forced convection heat exchange through the flowing air to achieve rapid cooling of the core high heat source. On the other hand, the residual heat generated by the display module 300 in the second accommodating cavity 11012 can be transferred to one of the frame 120 and the mounting base 410, or the hot airflow can enter the first space 510 to form heat exchange, thereby simultaneously carrying away the heat dissipated by the display module 300 through the airflow of the same heat dissipation channel.

[0025] At this time, it ensures that the heat source device 200 in the first cavity 11011 is cooled down quickly through efficient heat conduction by the heat sink 600 and forced convection, and at the same time removes the heat generated by the display module 300 in the second cavity 11012. Therefore, the heat dissipation channel can simultaneously meet the heat dissipation needs of heat sources with different power consumption.

[0026] In the embodiments disclosed in this application, the head-mounted display device only requires a single fan 400 and a single through-type heat dissipation channel to achieve synchronous heat dissipation for the heat source device 200 and the display module 300. Therefore, the head-mounted display device disclosed in this application can incorporate the heat source device 200 and the display module 300 into the same heat dissipation system, thereby achieving multi-heat source collaborative heat dissipation. This avoids the risk of heat on the display module 300 not being dissipated in time, forming isolated local hot spots, and thus effectively improves the heat dissipation performance of the head-mounted display device.

[0027] Furthermore, this application only requires a single fan 400 and a single through-type heat dissipation channel to achieve synchronous heat dissipation for the heat source device 200 and the display module 300. Therefore, it is not necessary to configure independent heat dissipation structures for multiple heat-generating components such as the heat source device 200 and the display module 300. This effectively solves the problems of limited internal space, high device integration, and heat accumulation from multiple heat sources in head-mounted display devices. It also takes into account the strong heat dissipation requirements of the high-power heat source device 200 and the mild heat dissipation requirements of the display module 300, thereby achieving coordinated and balanced heat dissipation from multiple heat sources. This reduces thermal coupling interference between different heat sources, resulting in better overall temperature control and further improving the stability and lifespan of the head-mounted display device during long-term continuous operation.

[0028] In addition, the high-power heat source devices 200 are concentrated in the first receiving cavity 11011, and the display module 300 is located in the second receiving cavity 11012. The cavity space is used to realize the physical partitioning and isolation of multiple heat sources, thereby avoiding the disorderly radiation and conduction of high heat from the main control and chip-type strong heat sources to the display heat source, thus eliminating the problem of heat accumulation and local heat gathering caused by the superposition of multiple heat sources, and thus realizing independent temperature control between each heat source, thereby improving the heat dissipation effect.

[0029] Furthermore, a composite mode of "600 solid-state heat dissipation component plus 400 forced air cooling fan" is adopted. This mode is designed to address the characteristics of high heat flux density and rapid heat accumulation when multiple heat sources are working simultaneously. It can quickly and continuously remove the superimposed heat generated by each heat source, thereby effectively preventing the phenomenon of excessive temperature rise and hot spot consolidation caused by multiple heat sources working simultaneously. This also avoids the risk of system frequency reduction, performance limitation, and accelerated aging of components due to high temperature at multiple points.

[0030] In the embodiments disclosed in this application, the fan 400 and the heat sink 600 are formed by the frame 120 to form the first space 510 and the second space 520. There is no need to add additional fan shells, fixed brackets and other structures, thereby making the heat dissipation structure highly integrated. This adapts to the design requirements of lightweight, miniaturized and compact head-mounted display devices, reduces the overall size and weight of the device, and thus improves wearing comfort.

[0031] In addition, the frame 120 in this application is used to enclose and form a heat dissipation channel, thus increasing the surface area of ​​the frame 120 within the heat dissipation channel. The fan can more directly blow the heat on the frame 120 out through the heat dissipation channel, so the frame 120 has better heat dissipation performance.

[0032] In the above configuration, the fan 400 can be located within the first receiving cavity 11011, in which case the fan 400 and the heat sink 600 are located on the same side of the frame 120. The mounting base 410 of the fan 400, within the first receiving cavity 11011, cooperates with the frame 120 to define a first space 510. This first space 510 is part of the first receiving cavity 11011. Of course, the fan 400 and the heat sink 600 can be located on opposite sides of the frame 120, and the fan 400 can be located within the second receiving cavity 11012. In this case, the mounting base 410, cooperating with the frame 120, defines the first space 510 within the second receiving cavity 11012, and the first space 510 is part of the second receiving cavity 11012.

[0033] In this application, the fan 400 has an air inlet 430 and an air outlet 440. When the first space 510 is connected to the exhaust port 1103, the air inlet 430 connects the second space 520 and the first space 510, and the air outlet 440 connects the exhaust port 1103 and the first space 510. When the first space 510 is connected to the air inlet 1102, the air inlet 430 connects the air inlet 1102 and the first space 510, and the air outlet 440 connects the first space 510 and the second space 520.

[0034] In one specific embodiment, the air inlet 430 of the fan 400 can be located on at least one of the frame 120 and the mounting base 410. The air inlet 430 connects the first space 510 with the air intake 1102, and the air outlet 440 of the fan 400 faces the heat sink 600, so that the first space 510 and the second space 520 are connected through the air outlet 440. At this time, the second space 520 is connected to the exhaust vent 1103.

[0035] In this design, the air inlet 430 can be selectively located on either the frame 120 or the mounting base 410, or a combination of both. This breaks the limitation of a single air inlet 430 location and allows for flexible adjustment of the air inlet 430 position based on the overall structural dimensions of the equipment, the arrangement of internal components, and installation space constraints. This adapts to the assembly requirements of different specifications of the complete machine and reduces structural design constraints. Furthermore, the air outlet 440 of the fan 400 is positioned towards the heat sink 600, allowing cool air to directly target and wash the surface of the heat sink 600, maximizing the forced convection heat transfer effect and further improving the heat dissipation performance.

[0036] In one optional embodiment, the heat source device 200 can be disposed on the side of the heat sink 600 away from the frame 120. In this case, the heat source device 200 is located outside the second space 520. In this solution, the heat source device 200 is arranged on the side of the heat sink 600 away from the frame 120 and outside the second space 520, realizing the physical separation between the heat source and the heat dissipation channel. This prevents the radiated heat and dissipated heat of the heat source device 200 from flowing back into the second space 520 and the air duct of the fan 400, avoiding the risk of hot air flowing back into the heat dissipation channel, causing the temperature to rise and resulting in a decrease in heat dissipation efficiency. In addition, since the heat source device 200 is disposed outside the second space 520, it will not obstruct or turbulent the airflow blown out of the air outlet 440 of the fan 400. Therefore, it reduces airflow eddies, turbulence, and stagnation, resulting in good unobstructed heat dissipation channel, low airflow loss of the fan 400, and stable airflow efficiency. This is conducive to long-term stable heat dissipation, thereby improving heat dissipation efficiency.

[0037] In another alternative embodiment, the fan 400's shaft extends along a first direction Y, the frame 120 has a first surface 1201, the mounting base 410 has a second surface 411, the first surface 1201 and the second surface 411 are arranged along the first direction Y, and the fan blade 420 is located between the first surface 1201 and the second surface 411. The air inlet 430 may include a first air inlet 431 and a second air inlet 432, the first air inlet 431 being located on the first surface 1201, and the second air inlet 432 being located on the second surface 411.

[0038] One of the first air inlet 431 and the second air inlet 432 faces the first receiving cavity 11011, and the other faces the second receiving cavity 11012. That is, one of the first air inlet 431 and the second air inlet 432 is located on the same side as the first receiving cavity 11011, and the other is located on the same side as the second receiving cavity 11012. At least one of the first air inlet 431 and the second air inlet 432 is connected to the air inlet 1102.

[0039] In this design, the fan blade 420 is sandwiched between the first surface 1201 and the second surface 411, and works in conjunction with the first air inlet 431 and the second air inlet 432 located on both sides. This enables independent airflow to the dual-cavity compartments. The first receiving cavity 11011 and the second receiving cavity 11012 can obtain cool air through the corresponding first air inlet 431 and the second air inlet 432, thereby avoiding the drawback that a single air inlet 430 cannot handle the heat dissipation of both cavities. This also makes the overall heat dissipation channel highly compatible with the layout of the first receiving cavity 11011 and the second receiving cavity 11012, thus further improving the heat dissipation performance.

[0040] In addition, the axial double-sided opening air intake mode effectively expands the overall air intake flow area compared with the single-sided opening air intake 430 structure, thereby significantly increasing the air intake volume of fan 400 per unit time, thereby reducing air intake resistance, reducing airflow congestion and eddy phenomena, and ensuring smooth airflow circulation when fan 400 is running.

[0041] In addition, the first receiving cavity 11011 and the second receiving cavity 11012 can be matched with the air inlet 430 of the corresponding surface. The airflow can directly enter the first space 510 from the outside through the corresponding air inlet 430. Therefore, the air supply path is short and the airflow loss is small. Thus, there is no need to transfer and guide the air through a narrow air duct, which reduces the pressure loss and wind force attenuation along the way. The fan 400 does not need to run at high speed to meet the heat dissipation requirements, effectively reducing the power consumption and operating noise of the equipment and improving the user experience.

[0042] Furthermore, the fan 400 shaft extends along the first direction Y, and the fan blade 420 is sandwiched between the first surface 1201 and the second surface 411. Combined with the compact arrangement of the dual-sided distributed air inlets 430, the axial gap space between the frame 120 and the mounting base 410 can be fully utilized without the need for additional lateral air inlet space. The structure is compact and highly integrated, which is conducive to the overall miniaturization and thinning of head-mounted display devices.

[0043] In one embodiment, the mounting base 410 and the heat sink 600 can be located on the same side of the frame 120. In this case, both the first space 510 and the second space 520 are part of the first receiving cavity 11011. The aforementioned air inlet 1102 can communicate with the second air inlet 432 through the space in the first receiving cavity 11011 other than the first space 510 and the second space 520. The first air inlet 431 is used to connect the second receiving cavity 11012 and the first space 510. The aforementioned air inlet 1102 can communicate with the first space 510 through the second receiving cavity 11012.

[0044] In another embodiment, the mounting base 410 and the heat sink 600 can be located on opposite sides of the frame 120 along the first direction Y. In this case, the mounting base 410 is located within the second receiving cavity 11012. In this configuration, the side of the heat sink 600 facing away from the frame 120, the frame 120, and a portion of the inner surface of the housing 110 together form a fourth space 550, such as... Figure 1 As shown. The fourth space 550 here refers to the space in the first receiving cavity 11011 excluding the second space 520. The aforementioned air inlet 1102 can be connected to the first air inlet 431 through the fourth space 550. The side of the mounting base 410 facing away from the frame 120, the frame 120, and part of the inner surface of the housing 110 together form the fifth space 560, as shown. Figure 1As shown. The fifth space 560 here refers to the space in the second receiving cavity 11012 other than the first space 510. The second air inlet 432 connects the fifth space 560 and the first space 510. The aforementioned air inlet 1102 can be connected to the first space 510 through the second receiving cavity 11012. The aforementioned air inlet 1102 can be connected to the second air inlet 432 through the fifth space 560.

[0045] In the above scheme, before the cold air enters the first space 510, it can also carry away the hot air flow in the corresponding cavity space, further reducing isolated local hot spots, thus helping to further improve the heat dissipation performance of the head-mounted display device.

[0046] In another alternative embodiment, the distance between the first air inlet 431 and the air inlet 1102 can be less than the distance between the second air inlet 432 and the air inlet 1102. In this case, the first air inlet 431 is positioned closer to the air inlet.

[0047] When the first air inlet 431 is closer to the second air inlet 432, the first air inlet 431 and the second air inlet 432 satisfy at least one of the following conditions: The orthographic projection of the second air inlet 432 onto the plane of the first surface 1201 falls within the range of the orthographic projection of the first air inlet 431 onto the plane of the first surface 1201.

[0048] The total opening area of ​​the second air inlet 432 is less than the total opening area of ​​the first air inlet 431.

[0049] The air inlet 430 may include a first air inlet 431 and multiple second air inlets 432. The orthographic projections of the multiple second air inlets 432 on the plane where the first surface 1201 is located all fall within the range of the orthographic projection of the first air inlet 431 on the plane where the first surface 1201 is located.

[0050] In this scheme, the first air inlet 431 is positioned closer to the air intake 1102 than the second air inlet 432, forming a staggered, layered air intake structure. By combining the nested projections of the two and the differentiated opening areas, the air intake capacity of different openings can be matched according to the airflow delivery distance and the difference in wind resistance loss. This avoids the problems of uneven air intake and disordered airflow distribution, making the overall airflow distribution more in line with the actual resistance distribution of the heat dissipation channel, thereby achieving a more reasonable airflow distribution and further improving the heat dissipation effect.

[0051] Furthermore, the projection of the second air inlet 432 onto the first surface 1201 falls within the projection area of ​​the first air inlet 431. Multiple second air inlets 432 are nested within the projection area of ​​the first air inlet 431, eliminating the need for additional lateral layout space. By achieving independent air intake from both air inlets 430, the opening layout is simplified, reducing the area occupied by the openings. This facilitates adaptation to limited installation spaces, enabling a smaller and thinner overall design, thus improving the internal space utilization of the head-mounted display device. Simultaneously, the concentration of multiple second air inlets 432 within the projection area of ​​the first air inlet 431 results in a well-organized and concentrated air intake area. The dispersed, small-sized second air inlets 432, arranged around or in a concentrated manner, weakens airflow collisions between the individual second air inlets 432 and avoids mutual interference.

[0052] Furthermore, the total opening area of ​​the second air inlet 432 is set smaller than that of the first air inlet 431, taking into account the low wind resistance of the first air inlet 431 at close range and the high wind resistance of the second air inlet 432 at a distance. The first air inlet 431 at close range ensures the core air intake with its large opening, while the second air inlet 432 at a distance assists in air supply with its small opening, effectively offsetting the air pressure loss caused by long-distance air supply. This effectively prevents backflow and turbulence at the second air inlet 432, thus helping to maintain stable air pressure in the heat dissipation channel. Further, the first air inlet 431 near the air intake 1102 can serve as the main air inlet 430, responsible for the main cold air supply, ensuring the air volume supply to the core heat dissipation area; while the small-area second air inlet 432 at a distance can serve as an auxiliary air supply inlet, supplementing the airflow in the edge area and compensating for insufficient air volume in long-distance heat dissipation. Therefore, this combined primary and secondary air intake mode balances strong heat dissipation in the core area with uniform air supply throughout the entire area, thereby improving the overall heat dissipation effect and the uniformity of the temperature field.

[0053] In an optional embodiment, the second surface 411 is further provided with a mounting hole 4111, through which the shaft of the first fan 401 can be rotatably connected to the mounting base 410. There are multiple second air inlets 432, which are spaced apart circumferentially around the mounting hole 4111, and extend circumferentially along the mounting hole 4111.

[0054] In this design, multiple second air inlets 432 are arranged circumferentially around the mounting holes 4111 and extend circumferentially, which can achieve uniform air intake around the rotation axis of the fan 400. This ensures balanced airflow in all directions around the fan blades 420, avoiding problems such as insufficient air intake in certain areas and excessive wind resistance on one side. This optimizes the overall air intake smoothness of the fan 400, which in turn helps to further improve the heat dissipation performance of the head-mounted display device.

[0055] In another embodiment, the housing 110 may have a first sidewall 111a and a second sidewall 111b disposed opposite each other along the second direction Z. The first sidewall 111a and the second sidewall 111b may be disposed on the aforementioned frame 111. A heat sink 600 is disposed near the first sidewall 111a, and a fan 400 is disposed near the second sidewall 111b. One of the air inlet 1102 and the exhaust 1103 may be formed in the first sidewall 111a to communicate with the second space 520, and the other of the air inlet 1102 and the exhaust 1103 may be formed in the second sidewall 111b to communicate with the first space 510. The heat dissipation channel formed by the air inlet 1102, the first space 510, the second space 520, and the air inlet 1102 may penetrate the housing 110 along the second direction Z.

[0056] In this design, the heat sink 600 is positioned near the first sidewall 111a, and the fan 400 is positioned near the second sidewall 111b, arranged in a partitioned manner. The air inlet 1102 and exhaust 1103 are respectively located on the opposite first sidewall 111a and second sidewall 111b. At this point, the air inlet 1102, the first space 510, the second space 520, and the exhaust 1103 form a through-type heat dissipation channel along the second direction Z. Because the heat dissipation channel runs through the second direction Z, it has fewer detours and bends, effectively shortening the airflow path inside the housing 110 and reducing ineffective extensions of the heat dissipation channel. Therefore, the heat dissipation performance of the fan 400 can be fully utilized. Without increasing the fan 400's specifications or increasing operating power consumption, the heat dissipation limit is effectively improved, which is beneficial for further enhancing heat dissipation performance.

[0057] In addition, the layout of the heat dissipation channel does not require the reservation of complex bending space, so the structure of the heat dissipation channel is simpler and more compact, which helps to reduce the internal space occupied by the head-mounted display device, and thus helps the head-mounted display device to become thinner and smaller.

[0058] Furthermore, the exhaust port 1103 can be formed in the first sidewall 111a, and the exhaust port 1103 can be directly opposite to and communicate with the opening of the second space 520 facing the first sidewall 111a. Here, the exhaust port 1103 and the opening of the second space 520 facing the first sidewall 111a are a connecting opening 530, which is used to connect the second space 520 and the exhaust port 1103. Here, the connecting opening 530 can be formed on at least one of the heat sink 600 and the frame 120. The air inlet 1102 can be formed in the second sidewall 111b. The air inlet 430 of the first fan 401 is formed in the frame 120 and / or the mounting base 410 to connect the first space 510 and the air inlet 1102. The air inlet 430 can penetrate the frame 120 and / or the mounting base 410 along the first direction Y, and here, the air inlet 430 can specifically be the first air inlet 431 mentioned above. The air inlet 1102 can be spaced apart from the air inlet 430, and the air inlet 1102 can penetrate the second sidewall 111b along the second direction Z. The first direction Y can intersect the second direction Z.

[0059] In this design, the orientation of the air inlet 430 intersects with that of the air inlet 1102. Therefore, after passing through the air inlet 1102, the external cold air must follow a staggered path intersecting with the air inlet 430 before entering the first space 510, thus actively lengthening the overall air intake path. The cold air flows a longer path within the casing 110 and has a longer residence time for heat exchange, further improving the utilization rate of cold air and the overall heat absorption capacity, thereby further enhancing heat dissipation performance. Furthermore, the exhaust port 1103 is located on the first sidewall 111a and is directly connected to the opening of the second space 520 facing the first sidewall 111a. After heat exchange, the high-temperature hot air can travel straight along the second direction Z to the exhaust port 1103 and quickly exit the casing 110. Therefore, the hot air exhaust channel is free of bends, obstructions, and detours, achieving direct hot air exhaust, significantly shortening the hot air exhaust path, and preventing high-temperature airflow from swirling, stagnating, and accumulating inside the casing 110. Therefore, this solution adopts a long-path detour air intake method and a short-path direct air exhaust method, which helps to further improve the heat dissipation performance of head-mounted display devices.

[0060] In one embodiment, the heat sink 600 may include a heat-conducting substrate 610 and a fin portion 620. The frame 120 may be enclosed with the heat-conducting substrate 610 to form the second space 520 described above. The fin portion 620 may be located within the second space 520 and extend along the second direction Z. The heat source device 200 may be disposed on the side of the heat-conducting substrate 610 away from the fin portion 620.

[0061] In this design, the heat source device 200 is directly attached to the side of the thermally conductive substrate 610 opposite to the fin portion 620. Heat can be quickly and directly conducted from the heat source device 200 to the thermally conductive substrate 610, resulting in a short heat transfer path, reduced intermediate transfer losses, and low overall thermal resistance. This allows for efficient and concentrated collection of heat generated by the heat source device 200, preventing localized heat accumulation. Furthermore, the location of the heat source device 200 on the side of the thermally conductive substrate 610 opposite to the fin portion 620 prevents direct contact between dust, foreign objects, and the heat source device 200, thus protecting it and improving its safety.

[0062] In another alternative embodiment, the first space 510 can be connected to the air intake 1102 via the air inlet 430 of the fan 400. This can be understood as the air intake 1102 being connected to the first space 510 via one of the first air inlet 431 and the second air inlet 432. The second space 520 is connected to the exhaust 1103 via a connecting opening 530. The first space 510 and the second space 520 are connected via the air outlet 440 of the fan 400. The air outlet 440 can be a connecting hole 1221 formed on the frame 120. The air outlet 440 and the exhaust 1103 of the fan 400 can be arranged opposite each other along the second direction Z, and the fin portion 620 can be located between the air outlet 440 and the exhaust 1103 of the fan 400.

[0063] In this design, the air outlet 440 and exhaust port 1103 of the fan 400 are positioned opposite each other along the second direction Z. After the airflow is blown out from the air outlet 440, it can travel in a straight line, shortening the hot air exhaust path, reducing airflow turns and local resistance losses, and preventing hot air from swirling and stagnating inside the housing 110, thus achieving rapid exhaust of high-temperature airflow. In addition, the fin portion 620 is located between the air outlet 440 and the exhaust port 1103. The high-speed airflow blown out by the fan 400 can directly and evenly wash the surface of the fin portion 620. The airflow fully covers the gaps between the fins, thereby significantly improving the convective heat transfer efficiency between the fins and the air, quickly removing the heat accumulated in the heat sink 600, thereby strengthening the core heat dissipation capacity and further improving the heat dissipation performance.

[0064] Furthermore, the frame 120 may be provided with a first recess 1202 recessed along the first direction Y. The first recess 1202 may have a first opening side 12021 facing the first direction Y and a second opening side 12022 facing the second direction Z. The first recess 1202 and the second recess 1204 are through structures on the first opening side 12021 and the second opening side 12022, without sidewalls. That is, the first recess 1202 has two adjacent opening positions. The thermally conductive substrate 610 is stacked with the frame 120 along the first direction Y, and the thermally conductive substrate 610 may cover the first opening side 12021 of the first recess 1202 along the first direction Y. The edge of the thermally conductive substrate 610 facing the vent 1103 may surround the second opening side 12022 of the first recess 1202 to form the above-mentioned communicating opening 530, which may be opposite to and communicate with the vent 1103.

[0065] In this design, the frame 120 is provided with a first recess 1202 recessed along the first direction Y. The first recess 1202 is a through-structure without sidewalls on both the first opening side 12021 and the second opening side 12022, thus eliminating redundant partition sidewalls, simplifying the integrated processing structure of the frame 120, reducing molding difficulty and material costs, and simultaneously reducing the overall weight. Furthermore, the edge of the heat-conducting substrate 610 facing the exhaust hole 1103 cooperates with the second opening side 12022 of the first recess 1202 to form a connecting opening 530. No separate drilling is required; the connecting opening 530 is directly formed based on the assembly structure, resulting in a clever structure and reducing drilling processes.

[0066] In the above scheme, the heat from the display module 300 and the heat source device 200 can be transferred to the frame 120, so the temperature of the frame 120 is relatively high.

[0067] To prevent heat transfer from the frame 120 to the housing 110, in another alternative embodiment, the housing 110 and the frame 120 may be spaced apart. The housing assembly 100 may also include a connecting bridge 150, through which the frame 120 and the housing 110 can be connected.

[0068] In this design, the shell 110 and the frame 120 are spaced apart, with a gap between them to avoid large-area contact and significantly reduce the direct heat-conducting contact area between the frame 120 and the shell 110. Utilizing the low thermal conductivity of the air gap, heat is effectively blocked from direct conduction from the frame 120 to the shell 110, achieving passive insulation. Simultaneously, the frame 120 and the shell 110 are fixedly connected only by connecting bridges 150, abandoning the assembly method of overall fitting and full circumference connection. This limits the heat transfer path to a small number of connecting bridges 150, significantly reducing the number of heat transfer channels and contact area, significantly reducing heat conduction efficiency, and suppressing heat diffusion. Therefore, the combination of spaced suspension and local connecting bridges 150 effectively prevents the heat accumulated in the frame 120 from spreading to the outer shell 110, preventing the shell 110 from absorbing heat and heating up over a large area, and avoiding problems such as overheating of the outer shell and excessively high surface temperature of the entire unit.

[0069] In addition, the space between the shell 110 and the frame 120 can form a small amount of air convection, which can not only remove the residual heat in the gap through the weak air flow, but also form a natural heat insulation layer by relying on the low thermal conductivity of the still air. Therefore, heat transfer is reduced in two ways, further improving the heat insulation effect.

[0070] In the configuration where the mounting base 410 and the heat sink 600 are located on the same side of the frame 120, external cold air enters the space of the first receiving cavity 11011 excluding the first space 510 and the second space 520 through the air inlet 1102. The space of the first receiving cavity 11011 excluding the first space 510 and the second space 520 is connected to the first space 510 through the second air inlet 432. Therefore, some cold air enters the first space 510 through the second air inlet 432. The other part of the cold air enters the second receiving cavity 11012 through the gap between the housing 110 and the frame 120, and then enters the first space 510 through the second receiving cavity 11012.

[0071] In a configuration where the mounting base 410 and the heat sink 600 can be located on opposite sides of the frame 120 along the first direction Y, external cold air enters the fourth space 550 (excluding the second space 520) in the first receiving cavity 11011 through the air inlet 1102. The fourth space 550 is connected to the first space 510 through the first air inlet 431, so some cold air enters the first space 510 through the first air inlet 431. Meanwhile, another portion of the cold air enters the fifth space 560 (excluding the first space 510) in the second receiving cavity 11012 through the gap between the housing 110 and the frame 120, and then enters the first space 510 through the second air inlet 432.

[0072] In one specific embodiment, the connecting bridge 150 can be a threaded connector. In this embodiment, using a threaded connector as the connecting bridge 150, the connection between the frame 120 and the housing 110 is achieved only through a small, localized threaded engagement area. Therefore, the thermally conductive contact area is extremely small, which can maximally interrupt the heat transfer path from the high-temperature frame 120 to the housing 110, continuously weakening heat conduction and effectively avoiding the risk of the housing 110 overheating. Furthermore, the threaded connector provides a locking and fixing mechanism, resulting in high connection strength and good positioning. It can stably maintain the gap between the housing 110 and the frame 120, preventing assembly misalignment and improper contact, ensuring the continuous effectiveness of the thermal insulation gap, and thus exhibiting good structural stability.

[0073] Optionally, the connecting bridge 150 can be a threaded connection such as a bolt, thread, or self-tapping screw. Of course, the connecting bridge 150 is not limited to threaded connections; it can also be a riveted or snap-fit ​​structural component. This article does not limit the specific structure of the connecting bridge 150.

[0074] Furthermore, the connecting bridge 150 may include a heat insulation part 151 and a fixing part 152. The heat insulation part 151 may be disposed between the frame 120 and the housing 110, and the fixing part 152 may pass through the frame 120, the heat insulation part 151, and the housing 110 in sequence to connect the frame 120 and the housing 110. In this case, the connecting bridge 150 is divided into the heat insulation part 151 and the fixing part 152, which have independent functions: the heat insulation part 151 is used to block heat transfer, while the fixing part 152 is used to achieve structural locking and fixation.

[0075] In this design, the low thermal conductivity of the heat insulation component 151 effectively blocks the direct transfer of heat from the frame 120 to the housing 110 through the physical contact surface. This weakens heat transfer at its source and further prevents the surface of the housing 110 from overheating, thus reducing the stuffiness experienced by the user. Furthermore, the heat insulation component 151 between the frame 120 and the housing 110 forms a dual heat insulation system of an air gap and a heat insulation element, effectively blocking heat conduction and radiation, significantly reducing heat diffusion to the housing 110, and further optimizing the heat insulation effect between the frame 120 and the housing 110. Additionally, the heat insulation component 151 has a certain buffering capacity, absorbing the minor vibrations generated by the fan 400 during operation and reducing vibration transmission to the housing 110, thereby improving the user's wearing experience.

[0076] Optionally, the heat insulation part 151 can be made of materials with low thermal conductivity, such as rubber, foam, or plastic. The fixing part 152 can be a threaded structure, a snap-fit ​​component, or a riveted component.

[0077] The aforementioned connecting bridge 150 can also be used to form an antenna structure.

[0078] In another specific embodiment, a sealing filler portion can be filled between the frame 120 and the housing 110 to isolate the first receiving cavity 11011 and the second receiving cavity 11012. The housing 110 has a vent hole, through which the second receiving cavity 11012 can be connected to the external environment. In this case, the aforementioned air inlet 1102 is connected to the first receiving cavity 11011. The sealing filler portion can be made of materials such as rubber or plastic, or other filler materials, which are not limited herein.

[0079] In the configuration where the mounting base 410 and the heat sink 600 are located on the same side of the frame 120, external cold air enters the space in the first receiving cavity 11011 other than the first space 510 and the second space 520 through the air inlet 1102. The space in the first receiving cavity 11011 other than the first space 510 and the second space 520 is connected to the first space 510 through the second air inlet 432, so cold air enters the first space 510 through the second air inlet 432. Since a sealing filler is filled between the frame 120 and the housing 110, the cold air in the first receiving cavity 11011 does not enter the second receiving cavity 11012. External cold air enters the second receiving cavity 11012 through the vent on the housing 110.

[0080] In a configuration where the mounting base 410 and the heat sink 600 are located on opposite sides of the frame 120 along the first direction Y, external cold air enters the fourth space 550 (excluding the second space 520) in the first receiving cavity 11011 through the air inlet 1102. The fourth space 550 is connected to the first space 510 through the first air inlet 431, and cold air enters the fourth space 550 through the first air inlet 431. Because a sealing filler is provided between the frame 120 and the housing 110, the fourth space 550 is isolated from the fifth space 560, and therefore the cold air in the fourth space 550 will not enter the fifth space 560. External cold air enters the fifth space 560 through the vent on the housing 110.

[0081] Optionally, the vent can be formed on the first end cap 112, or the gaps in the textile material on the first end cap 112 can serve as vents. Of course, the vent can also be formed on the frame 111, and the specific location of the vent is not limited herein.

[0082] In this design, the sealing filling part provides thermal insulation and airtightness, preventing heat from the high-temperature chamber from being conducted and diffused to the other chamber through gaps. This allows for independent temperature control of the two chambers, preventing overheating in one chamber from affecting the operating temperature of other components and thus improving the uniformity of the overall temperature field distribution. Furthermore, the sealing filling part can buffer the assembly stress and vibration between the housing 110 and the frame 120, reducing abnormal operating noise.

[0083] In another alternative embodiment, a flow guiding structure 1203 is constructed on the frame 120, and the flow guiding structure 1203 may be located in the first space 510. The flow guiding structure 1203 is used to guide the airflow passing through the first space 510.

[0084] In this design, the guiding effect of the airflow guide structure 1203 reduces the flow resistance and pressure loss of the airflow within the first space 510, thereby making the airflow smoother and improving the intake volume and suction efficiency of the fan 400. Furthermore, by placing the airflow guide structure 1203 on the frame 120, the mounting base 410 of the fan 400 does not need to be integrally molded or have an additional airflow guide structure 1203 installed, resulting in a simpler shape for the mounting base 410, simpler mold forming, and lower processing costs. Simultaneously, it helps reduce the local wall thickness of the mounting base 410, avoiding injection molding defects such as shrinkage and deformation, thereby improving the yield rate of parts. Additionally, placing the airflow guide structure 1203 on the frame 120 frees up the limited space around the mounting base 410, allowing for a more rational layout of the head-mounted display device and facilitating the compact arrangement of internal components, thus meeting the requirements for a thinner and lighter design of the head-mounted display device. Furthermore, compared to the limited airflow structure 1203 confined to a small mounting base 410, the airflow structure 1203 on the frame 120 can cover the entire air intake area of ​​the first space 510, effectively sorting and gathering airflow over a wide range, resulting in a more comprehensive airflow guidance effect and higher air intake regularity.

[0085] In the above scheme, the flow guiding structure 1203 can be a protrusion or a groove.

[0086] In one specific embodiment, the airflow guiding structure 1203 may include a first airflow guiding protrusion 1203a and a second airflow guiding protrusion 1203b. The first airflow guiding protrusion 1203a and the second airflow guiding protrusion 1203b may be located on two adjacent sidewalls of the first space 510. The frame 120 is provided with the first airflow guiding protrusion 1203a and the air inlet 430 of the fan 400 on the side opposite to the mounting base 410. The first airflow guiding protrusion 1203a is arranged around the air inlet 430. Specifically, the air inlet 430 may be the first air inlet 431 mentioned above. The first airflow guiding protrusion 1203a may be located on the sidewall where the first surface 1201 is located. The first airflow guiding protrusion 1203a may be arranged around the fan blade 420. The second flow guide protrusion 1203b can be disposed adjacent to both the first flow guide protrusion 1203a and the mounting base 410, and the second flow guide protrusion 1203b can be located on the sidewall between the first surface 1201 and the mounting base 410. The second flow guide protrusion 1203b extends along the second direction Z.

[0087] In this design, the first airflow guide protrusion 1203a is arranged around the air inlet 430 and the fan blade 420, which can reduce the airflow diffusion range, reduce the ineffective dissipation of airflow from the gaps around the air inlet 430, and concentrate the airflow to converge in the center area of ​​the fan blade 420, thereby reducing the intake resistance of the fan 400. At the same time, it avoids the problems of corner eddies and negative pressure dead zones, ensuring the uniformity of airflow into the fan 400, thereby effectively improving the intake volume and efficiency of the cooling system and enhancing the overall cooling performance. Furthermore, the second airflow guide protrusion 1203b extends along the second direction Z, so the second airflow guide protrusion 1203b can better guide the airflow to the second space 520, reduce the energy loss caused by airflow collision, and ensure a continuous, unidirectional, and stable supply of cool air to the second space 520.

[0088] Therefore, the first guide protrusion 1203a and the second guide protrusion 1203b are respectively arranged on the adjacent side walls of the first space 510, thereby forming a staggered double guide limiting structure. The first guide protrusion 1203a is arranged around the air inlet 430 and the fan blade 420 of the fan 400, which can gather and guide the airflow in the early stage of air intake. The second guide protrusion 1203b extends along the second direction Z, which sorts and constrains the airflow in the lateral side, avoiding the airflow in the first space 510 from being scattered and disorderly. This allows the overall airflow to flow stably along the preset path, thereby further improving the heat dissipation performance.

[0089] In one embodiment, the fan 400 is disposed in the second receiving cavity 11012. In this case, the mounting base 410 and the heat sink 600 can be located on opposite sides of the frame 120 along the first direction Y, with the mounting base 410 located within the second receiving cavity 11012. The mounting base 410 and the frame 120 cooperate to define a first space 510 within the second receiving cavity 11012. The side of the mounting base 410 away from the frame 120, the frame 120, and a portion of the inner surface of the housing 110 together form a fifth space 560. The display module 300 is disposed on the side of the fan 400 away from the frame 120, with at least a portion of the display module 300 located within the fifth space 560. The first space 510 and the second space 520 described above can at least partially overlap in the second direction Z.

[0090] In this scheme, the first space 510 and the second space 520 at least partially overlap in the second direction Z, thereby achieving spatial misalignment and reuse, effectively reducing the overall size of the device and the stacking thickness. Therefore, while ensuring the integrity of the heat dissipation channel and the installation space of each component, it can reduce structural redundancy and is conducive to the miniaturization and thinning of the entire machine.

[0091] In one specific embodiment, a first recess 1202 recessed along a first direction Y is provided on a first side of the frame 120, where the first side may refer to the side facing the first receiving cavity 11011. A second recess 1204 recessed along the first direction Y is provided on a second side of the frame 120 opposite to the first side, where the second side refers to the side facing the second receiving cavity 11012. The first recess 1202 and the second recess 1204 may be spaced apart along a second direction Z, and the first recess 1202 and the second recess 1204 may at least partially overlap in the second direction Z. The frame 120 also has a connecting hole 1221, through which the first recess 1202 and the second recess 1204 can be connected. A heat sink 600 may be located on the first side, and the heat sink 600 may enclose the first recess 1202 to form a second space 520. The mounting base 410 can be located on the second side. The mounting base 410 can be enclosed with the second recess 1204 to form a first space 510. At this time, the connecting hole 1221 can be the air outlet 440 of the fan 400. The first space 510 and the second space 520 are connected through the connecting hole 1221.

[0092] In this design, the heat sink 600 and the first recess 1202 cooperate to form a second space 520, and the mounting base 410 and the second recess 1204 cooperate to form a first space 510. At this time, relying on the recessed structures on both sides of the frame 120, a closed and independent cavity space is created without occupying additional internal space. Therefore, the internal volume of the heat dissipation channel is effectively increased, providing sufficient space for airflow and the arrangement of the heat dissipation structure, thereby avoiding the problems of airflow congestion and limited heat exchange area caused by space crowding within the heat dissipation channel.

[0093] In an optional embodiment, the frame 120 may include a first support portion 121, a connecting portion 122, and a second support portion 123 connected together. The first support portion 121 and the second support portion 123 may extend along a second direction Z. One side of the connecting portion 122 may be connected to the first support portion 121, and the other side of the connecting portion 122 may be connected to the second support portion 123. The connecting portion 122 may extend along a first direction Y, such that the first support portion 121 and the second support portion 123 are staggered in the second direction Z.

[0094] The mounting base 410, the first support portion 121, and the connecting portion 122 can enclose to form a first space 510. The heat sink 600, the second support portion 123, and the connecting portion 122 can enclose to form a second space 520. The mounting base 410 and the heat sink 600 can be respectively disposed on opposite sides of the frame 120. A connecting hole 1221 is provided on the connecting portion 122, through which the first space 510 and the second space 520 can be connected.

[0095] In this design, the frame 120 is integrally formed by a first support portion 121, a connecting portion 122, and a second support portion 123. The first support portion 121 and the second support portion 123 extend along the second direction Z, while the connecting portion 122 extends along the first direction Y and is offset from each other in the second direction Z, thus breaking the traditional straight alignment structure. The staggered arrangement of the first support portion 121 and the second support portion 123 provides differentiated installation areas for the components on both sides, avoiding interference between the mounting base 410 and the heat sink 600 stacked on the same projection plane, thereby optimizing the overall layout rationality from a structural perspective.

[0096] In addition, the mounting base 410 and the heat sink 600 are respectively located on the corresponding support parts on both sides of the frame 120. Therefore, the mounting base 410 and the heat sink 600 make full use of the misalignment advantage of the first support part 121 and the second support part 123 to reduce the external protrusion size of the parts, thereby effectively controlling the overall thickness and lateral size of the equipment, which is conducive to further adapting to the design requirements of product thinness and miniaturization.

[0097] Furthermore, by utilizing the staggered space formed by the misalignment of the first support portion 121 and the second support portion 123, two sets of cavity spaces and heat dissipation-related components can be accommodated simultaneously within the limited overall device outline, achieving efficient space reuse. Without increasing the overall device size, the cavity volume of the heat dissipation channel is guaranteed, thus balancing structural compactness with the space required for heat dissipation. Therefore, while ensuring a small size for the head-mounted display device, it exhibits good heat dissipation performance.

[0098] The aforementioned second recess 1204 can be provided on the first support portion 121, and the first recess 1202 can be provided on the second support portion 123.

[0099] In one embodiment, the first support portion 121, the connecting portion 122, and the second support portion 123 can be arranged along the second direction Z. The first support portion 121 can be connected to the second sidewall 111b of the housing 110, and the second support portion 123 can be connected to the first sidewall 111a. The first surface 1201 described above is provided on the side of the first support portion 121 opposite to the mounting base 410.

[0100] In one embodiment, such as Figures 6 to 10 As shown, the housing assembly 100 may further include a suspension bracket 130 located within the receiving cavity 1101. The opposing ends of the suspension bracket 130 may be respectively located on opposite sides of the aforementioned first air inlet 431, which is connected to the air inlet 1102. At least a portion of the suspension bracket 130 is opposite to the first air inlet 431. The heat source module 800 may be thermally connected to the suspension bracket 130. Here, the heat source module 800 is a heat-generating component in the head-mounted display device other than the display module 300 and the heat source device 200. Examples include camera modules, sensors, and other components.

[0101] In this design, the heat source module 800 is thermally connected to the suspension bracket 130, allowing the heat generated by the heat source module 800 to be quickly transferred to the suspension bracket 130. The suspension bracket 130 is mounted on the first air inlet 431, placing it in an air intake position. At this time, the cool air entering the first space 510 can exchange heat with the suspension bracket 130, thus achieving heat dissipation for the heat source module 800. Therefore, this design integrates the heat source device 200, the display module 300, and the heat source module 800 into a single heat dissipation system, achieving multi-heat source synergistic heat dissipation and further improving the heat dissipation performance of the head-mounted display device.

[0102] In one solution, the heat source module 800 can be a camera module. In this case, the solution can not only dissipate heat from high-heat components such as the CPU and motherboard, but also better integrate the heat dissipation of the camera module and display module 300 into the active cooling system, thereby solving the problem of heat dissipation from multiple heat sources in head-mounted display devices.

[0103] In the above scheme, the heat source module 800 can be in direct contact with the suspension bracket 130, thereby achieving a thermally conductive connection. In an optional scheme, the heat source module 800 can be thermally connected to the suspension bracket 130 through a thermally conductive material. This thermally conductive material can be copper foil, thermal interface materials, etc., and of course, other thermally conductive materials can also be used; this article does not impose any limitations.

[0104] In one optional embodiment, the suspended bracket 130 may include a first connecting segment 131, a suspended segment 132, and a second connecting segment 133 connected in sequence. The first connecting segment 131 and the second connecting segment 133 may be located at opposite ends of the suspended segment 132. The first connecting segment 131 and the second connecting segment 133 may be connected to the frame 120 respectively, so that the suspended segment 132 is separated from the frame 120 and spaced apart. The suspended segment 132 may be arranged opposite to the first air inlet 431. The heat source module 800 may be installed on at least one of the first connecting segment 131, the suspended segment 132, and the second connecting segment 133.

[0105] In this design, the suspended bracket 130 is divided into three continuous sections, effectively extending the overall heat dissipation profile and heat exchange surface area. The first connecting section 131, the suspended section 132, and the second connecting section 133 can all serve as heat dissipation carriers to participate in heat exchange. Therefore, in conjunction with the continuous air intake of the first air inlet 431, it is possible to achieve simultaneous heat exchange with cold air in multiple sections and locations, thereby achieving multi-point coordinated heat dissipation and significantly improving the overall heat removal efficiency, which is conducive to further improving heat dissipation performance. In addition, the suspended section 132 is directly opposite the first air inlet 431, and the airflow can circulate around the side of the suspended section 132 without structural obstruction, which is conducive to greatly improving convective heat transfer conditions. Furthermore, the suspended structure with fixed ends and suspended in the middle has good buffering and shock absorption characteristics, which can block the vibration generated by the fan 400 and heat source from being transmitted to the frame 120, reducing structural resonance and friction noise.

[0106] In one embodiment, the suspension bracket 130 can be located outside the first space 510, and the distances between the two ends of the first connecting segment 131 and the second connecting segment 133 and the first surface 1201 are both smaller than the distance between the suspension segment 132 and the first surface 1201. In this embodiment, the position of the suspension segment 132 is higher than the positions of the first connecting segment 131 and the second connecting segment 133, thus making the suspension bracket 130 an arched structure. The distance between the suspension segment 132 and the first surface 1201 is relatively large, thus avoiding the obstruction of the first air inlet 431 by the suspension segment 132, thereby avoiding affecting the air intake of the fan 400.

[0107] In an optional embodiment, the heat source module 800 may include a first camera module 810 and a second camera module 820. The first camera module 810 may be mounted on the suspension section 132, and the second camera module 820 may be mounted on one of the first connecting section 131 and the second connecting section 133. Here, the first camera module 810 may be a VST (Video See-Through) camera module, and the second camera module 820 may be a SLAM (Simultaneous Localization and Interference) camera module.

[0108] In this design, the first camera module 810 is positioned in the suspension section 132, and the second camera module 820 is arranged in either the first connecting section 131 or the second connecting section 133. The two camera modules are staggered and installed in different sections of the suspension bracket 130, overcoming the drawbacks of a layout where dual camera modules are stacked in a concentrated manner. The dual camera modules are separated from each other and conduct heat in a staggered manner, avoiding the accumulation and superposition of heat in the same area, effectively dispersing the heat load, reducing local high-temperature hotspots from the source, and improving the overall heat dissipation balance.

[0109] In one optional embodiment, a receiving groove 1301 for mounting the heat source module 800 can be provided on the side of the suspension bracket 130 facing away from the first air inlet 431. In this solution, the heat source module 800 is located within the receiving groove 1301, which helps to reduce the stacking size of the heat source module 800 and the suspension bracket 130, thereby helping to reduce the size of the head-mounted display device. In addition, providing the receiving groove 1301 on the side of the suspension bracket 130 facing away from the first air inlet 431 can form a wrap-around limiting and positioning constraint on the heat source module 800, preventing the heat source module 800 from shifting, loosening, or warping, resulting in high assembly consistency and tight structural fit, thereby improving the overall assembly firmness and structural reliability. In addition, the walls and bottom of the receiving tank 1301 can make large-area contact with the heat source module 800, effectively increasing the heat conduction contact area, shortening the heat conduction path and reducing the contact thermal resistance, so that the heat generated by the heat source module 800 can be quickly and evenly conducted to the suspension bracket 130, which is conducive to the rapid diffusion and discharge of heat.

[0110] In the above scheme, the bottom of the heat source module 800 and the bottom of the receiving groove 1301 can be connected by a thermally conductive material to improve the thermal conductivity of the heat source module 800 and the suspension bracket 130.

[0111] Furthermore, the orthographic projection of the bottom of the receiving groove 1301 on the plane where the first surface 1201 is located falls within the range of the orthographic projection of the first air inlet 431 on the plane where the first surface 1201 is located, and the size of the orthographic projection of the bottom of the receiving groove 1301 on the plane where the first surface 1201 is located is smaller than the size of the orthographic projection of the first air inlet 431 on the plane where the first surface 1201 is located.

[0112] In this design, the orthographic projection of the bottom of the receiving tank 1301 falls entirely within the orthographic projection range of the first air inlet 431, ensuring that the bottom of the tank and the heat source module 800 within it are directly facing the source of the incoming airflow. The low-temperature airflow introduced by the first air inlet 431 can directly and centrally act on the core heat-generating areas of the suspended support 130 and the heat source module 800, thereby improving heat exchange efficiency. Furthermore, the projected size of the bottom of the receiving tank 1301 is smaller than the projected size of the first air inlet 431. Therefore, the coverage area of ​​the heat source module 800 is always smaller than the effective ventilation area of ​​the first air inlet 431, thus preventing complete blockage or obstruction of the first air inlet 431. This ensures sufficient airflow area is reserved around the first air inlet 431, preventing airflow blockage and reduced airflow due to the excessive size of the heat source module 800, thereby guaranteeing the stability of the overall airflow.

[0113] When the suspension bracket 130 includes the aforementioned suspension section 132, first connecting section 131, and second connecting section 133, the orthographic projection of the bottom of the receiving groove 1301 on the suspension bracket 130 onto the plane of the first surface 1201 falls within the range of the orthographic projection of the first air inlet 431 onto the plane of the first surface 1201, and the size of the orthographic projection of the bottom of the receiving groove 1301 onto the plane of the first surface 1201 is smaller than the size of the orthographic projection of the first air inlet 431 onto the plane of the first surface 1201. The positional relationship between the receiving groove 1301 on the first connecting section 131 and the second connecting section 133 and the first air inlet 431 is not restricted.

[0114] In another alternative embodiment, the fan 400 and the suspension bracket 130 can be located on opposite sides of the frame 120. The frame 120 may also include a circuit board support structure 140 disposed on the same side as the suspension bracket 130, with one end of the suspension bracket 130 connected to the circuit board support structure 140. Specifically, the second camera module 820 described above is disposed on the first connecting segment 131, and the end of the second connecting segment 133 opposite to the suspension segment 132 is connected to the circuit board support structure 140.

[0115] The head-mounted display device may also include a flexible circuit board 900. One end of the flexible circuit board 900 is connected to the mounting base 410 for controlling the rotation of the fan blades 420, and the other end of the flexible circuit board 900 is fixed to the circuit board support structure 140. In this case, the circuit structure on the mounting base 410 is connected to the flexible circuit board 900, and the flexible circuit board 900 is electrically connected to the mainboard of the head-mounted display device. The mainboard supplies power to the circuit structure on the mounting base 410 through the flexible circuit board 900, thereby driving the rotating shaft to rotate, which in turn drives the fan blades 420 to rotate.

[0116] In this design, the circuit board support structure 140 provides fixed limiting points for the flexible circuit board 900, which can constrain the wiring harness routing and prevent the flexible circuit board 900 from repeated pulling and twisting fatigue caused by the vibration of the fan 400 or the displacement of components. This reduces the risk of wire breakage and poor contact, thereby ensuring the stable transmission of control signals and power supply for the fan 400. In addition, the circuit board support structure 140 also serves the dual functions of connecting the suspension bracket 130 and fixing the flexible circuit board 900. Therefore, there is no need to add additional independent fixing components. The integrated design of the suspension bracket 130, circuit support, and wiring harness limiting reduces the number of scattered parts, thereby simplifying the structure and assembly process. This is beneficial for the lightweight and miniaturized design of the head-mounted device.

[0117] In another embodiment, the display module 300 may include a first display module 310 and a second display module 320 fixed within the second receiving cavity 11012. The first display module 310 and the second display module 320 are spaced apart along a third direction X, and any two of the first direction Y, the second direction Z, and the third direction X intersect. Here, the first direction Y can be the width direction of the head-mounted display device, the second direction Z can be the thickness direction of the head-mounted display device, and the third direction X can be the length direction of the head-mounted display device. The first display module 310 can correspond to the user's left eye, and the second display module 320 can correspond to the user's right eye.

[0118] The number of fans 400 can be at least two, namely a first fan 401 and a second fan 402. The second fan 402 and the first fan 401 can be arranged at a distance from each other along a third direction X in the frame 120. The first display module 310 can be arranged on the side of the first fan 401 away from the frame 120, and the second display module 320 can be arranged on the side of the second fan 402 away from the frame 120.

[0119] The mounting base 410 of the first fan 401 can be enclosed with the frame 120 to form a first space 510, and the mounting base 410 of the second fan 402 can be enclosed with the frame 120 to form a third space 540. Both the first space 510 and the third space 540 are connected to the second space 520. Here, the first space 510 and the third space 540 are spaces formed by the mounting bases 410 of different fans 400 and the frame 120. The positional relationship and structure between the first space 510 and the second space 520 described above are fully applicable to the positional relationship and structure between the third space 540 and the second space 520.

[0120] In this design, the first fan 401 and the second fan 402 are arranged at intervals along a third direction X. The first fan 401 and the second fan 402 correspond one-to-one with the first display module 310 and the second display module 320. Therefore, each display module 300 is equipped with its own dedicated cooling fan 400, allowing for targeted cooling of a single display module 300. This avoids interference between the left and right display modules 300, achieving independent cooling for each zone and effectively preventing the risk of excessively high temperatures in a single display area. Furthermore, the dual-fan 400 design further improves cooling efficiency. In addition, the dual fans 400, dual air ducts, and dual display modules 300 are arranged symmetrically, resulting in a highly modular and standardized structure with strong component compatibility, facilitating mass assembly and positioning. Simultaneously, the consistent structure of the left and right air ducts and the unified airflow pattern reduce the difficulty of heat dissipation design and improve product yield and structural stability.

[0121] In the above scheme, a through hole is provided on the frame 120, and the first space 510 and the second through hole 12012 can be connected to the air inlet 1102 through the same through hole. At this time, the first fan 401 and the second fan 402 share the air inlet 430.

[0122] In one optional embodiment, the frame 120 has a first surface 1201, which is disposed opposite to the mounting base 410 of the first fan 401 and the mounting base 410 of the second fan 402. The first surface 1201 may have a first through hole 12011 and a second through hole 12012. The first space 510 can be connected to the air inlet 1102 through the first through hole 12011. The third space 540 can be connected to the air inlet 1102 through the second through hole 12012, and the second space 520 can be connected to the exhaust hole 1103. Here, the first through hole 12011 is the first air inlet 431 of the first fan 401, and the second through hole 12012 is the first air inlet 431 of the second fan 402.

[0123] In this design, the first surface 1201 of the frame 120 has a first through hole 12011 and a second through hole 12012. The first space 510 is connected to the air inlet 1102 through the first through hole 12011, and the third space 540 is connected to the air inlet 1102 through the second through hole 12012. At this time, the corresponding cavities of the left and right fans 400 each have independent air intake channels. The air intake air is introduced in a zoned manner to avoid mutual airflow competition and interference between the air intake air on both sides, thus ensuring the balanced and stable air intake of the first fan 401 and the second fan 402. In addition, the first fan 401 and the second fan 402 share the same air inlet 1102 to introduce low-temperature fresh air from the outside, and then the air is distributed to the first space 510 and the third space 540 through the first through hole 12011 and the second through hole 12012 respectively. This achieves a centralized air intake and zoned air distribution airflow organization, which can evenly distribute the cold air supply to the left and right heat dissipation circuits, making the heat dissipation conditions of the left and right display modules 300 consistent, the temperature difference smaller, and the overall heat dissipation consistency significantly improved.

[0124] In the above scheme, a spacer protrusion 160 can be provided in the second space 520. The spacer protrusion 160 can divide the second space 520 into two small chambers arranged along the third direction X. One chamber can be connected to the first space 510, and the other chamber can be connected to the third space 540. Correspondingly, the heat sink 600 can have at least two fin portions 620, namely a first fin portion 621 and a second fin portion 622. The first fin portion 621 can be located in one of the chambers, and the second fin portion 622 can be located in the other chamber.

[0125] In another optional embodiment, the frame 120 may also have a third through hole 12013 extending through the frame 120 along the first direction Y. The third through hole 12013 may be located between the first through hole 12011 and the second through hole 12012. In this solution, by opening the third through hole 12013 between the first through hole 12011 and the second through hole 12012, the excess solid material in the middle of the frame 120 is removed, and the weight of the frame 120 is greatly reduced in the form of a hollow structure. This results in a lower burden for long-term wear of the head-mounted display device and a significant improvement in wearing comfort. In addition, a through-hole 12013 is provided between the first through hole 12011 and the second through hole 12012. The third through hole 12013 forms a central partition structure, which completely separates the air intake area of ​​the first space 510 corresponding to the first through hole 12011 on the left and the air intake area of ​​the third space 540 corresponding to the second through hole 12012 on the right. This effectively prevents the cross-flow and mutual collision of air intake air on both sides, so that the two independent air intake paths on the left and right do not affect each other, and ensures that the air intake state of the two fans 400 is more stable and reliable.

[0126] In another alternative embodiment, the head-mounted display device further includes a first flexible circuit board 910 and a second flexible circuit board 920, where the first flexible circuit board 910 and the second flexible circuit board 920 are the same as the aforementioned flexible circuit board 900. The first flexible circuit board 910 and the second flexible circuit board 920 correspond to different fans 400. One end of the first flexible circuit board 910 is connected to the mounting base 410 of the first fan 401 to control the rotation of the fan blades 420 of the first fan 401, and the other end of the first flexible circuit board 910 passes through the third through hole 12013 and wraps around to the side of the frame 120 opposite to the mounting base 410 of the first fan 401.

[0127] One end of the second flexible circuit board 920 can be connected to the mounting base 410 of the second fan 402 to control the rotation of the fan blades 420 of the second fan 402, and the other end of the second flexible circuit board 920 passes through the third through hole 12013 and wraps around to the side of the frame 120 away from the mounting base 410 of the second fan 402.

[0128] In this solution, the first flexible circuit board 910 and the second flexible circuit board 920 are directly laid through the third through hole 12013, and the lines on both sides are concentrated and uniformly stored through the middle hole. There is no need to open an independent wiring channel or avoidance structure in the frame 120, which greatly simplifies the wiring layout inside the cavity and reduces the situation of messy and winding wiring, thus making the internal structure of the head-mounted display device more regular and simple.

[0129] When there are multiple fans 400, each fan 400 can be provided with a suspension bracket 130 and the aforementioned circuit board support structure 140 at its first air inlet 431.

[0130] The head-mounted display device disclosed in this application can be a VR device, such as VR glasses or a VR helmet. Alternatively, it can be an AR device, such as AR glasses or an AR helmet. This application does not limit the specific type of head-mounted display device.

[0131] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A head-mounted display device, characterized in that, include: The housing assembly (100) includes a housing (110) and a frame (120). The housing (110) has a receiving cavity (1101) and an air inlet (1102) and an exhaust outlet (1103) communicating with the receiving cavity (1101). The frame (120) is located inside the receiving cavity (1101) and divides the receiving cavity (1101) into a first receiving cavity (11011) and a second receiving cavity (11012) arranged along a first direction (Y). A heat source device (200) and a display module (300) are provided, wherein the heat source device (200) is disposed in the first receiving cavity (11011); at least a portion of the display module (300) is disposed in the second receiving cavity (11012); A fan (400) is located within the receiving cavity (1101). The fan (400) includes a mounting base (410) and fan blades (420). The fan blades (420) are rotatably connected to the mounting base (410). The mounting base (410) and the frame (120) enclose a first space (510). The fan blades (420) are located within the first space (510). A heat sink (600) is located in the first receiving cavity (11011) and is thermally connected to the heat source device (200). The fan blades (420) and the heat sink (600) are arranged at intervals along a second direction (Z). The second direction (Z) intersects with the first direction (Y). The heat sink (600) and the frame (120) enclose a second space (520). The second space (520) is connected to the first space (510); one of the first space (510) and the second space (520) is connected to the air inlet (1102), and the other is connected to the exhaust port (1103). The air inlet (1102), the first space (510), the second space (520) and the exhaust port (1103) form a heat dissipation channel for the head-mounted display device. The display module (300) and the heat source device (200) are respectively disposed on both sides of the heat dissipation channel along the first direction (Y).

2. The head-mounted display device according to claim 1, characterized in that, The heat source device (200) is located on the side of the heat sink (600) away from the frame (120), and the heat source device (200) is located outside the second space (520); The air inlet (430) of the fan (400) is opened in the frame (120) and / or the mounting base (410) to connect the first space (510) with the air inlet (1102), and the air outlet (440) of the fan (400) faces the heat sink (600) so that the first space (510) and the second space (520) are connected through the air outlet (440).

3. The head-mounted display device according to claim 2, characterized in that, The fan (400) has a rotating shaft that extends along the first direction (Y). The frame (120) has a first surface (1201), and the mounting base (410) has a second surface (411). The first surface (1201) and the second surface (411) are arranged along the first direction (Y). The fan blade (420) is located between the first surface (1201) and the second surface (411). The air inlet (430) includes a first air inlet (431) and a second air inlet (432). The first air inlet (431) is located on the first surface (1201), and the second air inlet (432) is located on the second surface (411). One of the first air inlet (431) and the second air inlet (432) faces the first receiving cavity (11011), and the other faces the second receiving cavity (11012); at least one of the first air inlet (431) and the second air inlet (432) is connected to the air inlet (1102).

4. The head-mounted display device according to claim 3, characterized in that, The distance between the first air inlet (431) and the air inlet (1102) is less than the distance between the second air inlet (432) and the air inlet (1102); The first air inlet (431) and the second air inlet (432) satisfy at least one of the following conditions: The orthographic projection of the second air inlet (432) onto the plane of the first surface (1201) falls within the range of the orthographic projection of the first air inlet (431) onto the plane of the first surface (1201); The total opening area of ​​the second air inlet (432) is less than the total opening area of ​​the first air inlet (431); The air inlet (430) includes a first air inlet (431) and a plurality of second air inlets (432). The orthographic projections of the plurality of second air inlets (432) onto the plane of the first surface (1201) all fall within the range of the orthographic projection of the first air inlet (431) onto the plane of the first surface (1201).

5. The head-mounted display device according to claim 1, characterized in that, The housing (110) has a first sidewall (111a) and a second sidewall (111b) disposed opposite each other along the second direction (Z). The heat sink (600) is disposed near the first sidewall (111a), and the fan (400) is disposed near the second sidewall (111b). One of the air inlet (1102) and the air outlet (1103) is opened on the first sidewall (111a) to communicate with the second space (520), and the other of the air inlet (1102) and the air outlet (1103) is opened on the second sidewall (111b) to communicate with the first space (510). The heat dissipation channel formed by the air inlet (1102), the first space (510), the second space (520), and the air inlet (1102) penetrates the housing (110) along the second direction (Z).

6. The head-mounted display device according to claim 1, characterized in that, The heat sink (600) includes a heat-conducting substrate (610) and a fin portion (620). The frame (120) and the heat-conducting substrate (610) enclose the second space (520). The fin portion (620) is located in the second space (520) and extends along the second direction (Z). The heat source device (200) is disposed on the side of the heat-conducting substrate (610) away from the fin portion (620).

7. The head-mounted display device according to claim 6, characterized in that, The first space (510) is connected to the air inlet (430) of the fan (400) and the air inlet (1102); the second space (520) is connected to the exhaust port (1103); the first space (510) and the second space (520) are connected to the air outlet (440) of the fan (400); the air outlet (440) of the fan (400) and the exhaust port (1103) are arranged opposite to each other along the second direction (Z), and the fin portion (620) is located between the air outlet (440) and the exhaust port (1103) of the fan (400).

8. The head-mounted display device according to claim 1, characterized in that, The housing (110) and the frame (120) are spaced apart; the housing assembly (100) further includes a connecting bridge (150), through which the frame (120) and the housing (110) are connected.

9. The head-mounted display device according to claim 8, characterized in that, The connecting bridge (150) includes a heat insulation part (151) and a fixing part (152). The heat insulation part (151) is disposed between the frame (120) and the housing (110). The fixing part (152) passes through the frame (120), the heat insulation part (151) and the housing (110) in sequence to connect the frame (120) and the housing (110).

10. The head-mounted display device according to claim 8, characterized in that, A sealing filler is provided between the frame (120) and the housing (110) to isolate the first receiving cavity (11011) and the second receiving cavity (11012); the housing (110) is provided with a vent hole, and the second receiving cavity (11012) is connected to the external environment through the vent hole.

11. The head-mounted display device according to claim 1, characterized in that, A flow guiding structure (1203) is constructed on the frame (120), and the flow guiding structure (1203) is located in the first space (510); the flow guiding structure (1203) is used to guide the airflow flowing through the first space (510).

12. The head-mounted display device according to claim 1, characterized in that, The fan (400) is located in the second receiving cavity (11012), and the display module (300) is located on the side of the fan (400) away from the frame (120); the first space (510) and the second space (520) at least partially overlap in the second direction (Z).

13. The head-mounted display device according to claim 1, characterized in that, The frame (120) has a first recess (1202) recessed along the first direction (Y) on its first side, and a second recess (1204) recessed along the first direction (Y) on its second side away from the first side. The first recess (1202) and the second recess (1204) are spaced apart along the second direction (Z), and the first recess (1202) and the second recess (1204) at least partially overlap in the second direction (Z). The frame (120) also has a connecting hole (12... 21), the first recess (1202) and the second recess (1204) are connected through the connecting hole (1221); the heat sink (600) is located on the first side, and the heat sink (600) and the first recess (1202) enclose to form the second space (520); the mounting base (410) is located on the second side, and the mounting base (410) and the second recess (1204) enclose to form the first space (510), and the connecting hole (1221) is the air outlet (440) of the fan (400).

14. The head-mounted display device according to claim 1, characterized in that, The frame (120) includes a first support portion (121), a connecting portion (122), and a second support portion (123) connected together. The first support portion (121) and the second support portion (123) extend along the second direction (Z). One side of the connecting portion (122) is connected to the first support portion (121), and the other side of the connecting portion (122) is connected to the second support portion (123). The connecting portion (122) extends along the first direction (Y), such that the first support portion (121) and the second support portion (123) are offset in the second direction (Z). The mounting base (410) together with the first support (121) and the connecting part (122) forms the first space (510), and the heat sink (600) together with the second support (123) and the connecting part (122) forms the second space (520); the mounting base (410) and the heat sink (600) are respectively disposed on opposite sides of the frame (120); a connecting hole (1221) is provided on the connecting part (122), and the first space (510) and the second space (520) are connected through the connecting hole (1221).

15. The head-mounted display device according to claim 1, characterized in that, The frame (120) has a first surface (1201) opposite to the mounting base (410), the first surface (1201) has a first air inlet (431), the first space (510) is connected to the air inlet (1102) through the first air inlet (431); the second space (520) is connected to the exhaust port (1103); The housing assembly (100) further includes a suspension bracket (130) located in the receiving cavity (1101), with the opposite ends of the suspension bracket (130) respectively located on opposite sides of the first air inlet (431), and at least a portion of the suspension bracket (130) being opposite to the first air inlet (431). The heat source module (800) is thermally connected to the suspension bracket (130).

16. The head-mounted display device according to claim 15, characterized in that, The suspended support (130) includes a first connecting section (131), a suspended section (132), and a second connecting section (133) connected in sequence. The first connecting section (131) and the second connecting section (133) are located at opposite ends of the suspended section (132). The first connecting section (131) and the second connecting section (133) are connected to the frame (120) to separate the suspended section (132) from the frame (120) and space them apart. The suspended section (132) is arranged opposite to the first air inlet (431). The heat source module (800) is installed on at least one of the first connecting section (131), the suspended section (132), and the second connecting section (133).

17. The head-mounted display device according to claim 15, characterized in that, The suspended bracket (130) has a receiving groove (1301) on the side opposite to the first air inlet (431) for installing the heat source module (800): The orthographic projection of the bottom of the receiving groove (1301) onto the plane of the first surface (1201) falls within the range of the orthographic projection of the first air inlet (431) onto the plane of the first surface (1201), and the size of the orthographic projection of the bottom of the receiving groove (1301) onto the plane of the first surface (1201) is smaller than the size of the orthographic projection of the first air inlet (431) onto the plane of the first surface (1201).

18. The head-mounted display device according to claim 15, characterized in that, The fan (400) and the suspension bracket (130) are located on opposite sides of the frame (120); the frame (120) also includes a circuit board support structure (140) arranged on the same side as the suspension bracket (130), and one end of the suspension bracket (130) is connected to the circuit board support structure (140). The head-mounted display device also includes a flexible circuit board (900), one end of which is connected to the mounting base (410) for controlling the rotation of the fan blades (420), and the other end of which is fixed to the circuit board support structure (140).

19. The head-mounted display device according to claim 1, characterized in that, The display module (300) includes a first display module (310) and a second display module (320) fixed in the second receiving cavity (11012). The first display module (310) and the second display module (320) are arranged at intervals along a third direction (X). Any two of the first direction (Y), the second direction (Z) and the third direction (X) intersect each other. The number of fans (400) is at least two, namely a first fan (401) and a second fan (402); the second fan (402) and the first fan (401) are arranged at intervals along the third direction (X) on the frame (120); the first display module (310) is located on the side of the first fan (401) away from the frame (120), and the second display module (320) is located on the side of the second fan (402) away from the frame (120); The mounting base (410) of the first fan (401) and the frame (120) enclose to form the first space (510), and the mounting base (410) of the second fan (402) and the frame (120) enclose to form the third space (540); the first space (510) and the third space (540) are both connected to the second space (520).

20. The head-mounted display device according to claim 19, characterized in that, The frame (120) has a first surface (1201), which is disposed opposite to the mounting base (410) of the first fan (401) and the mounting base (410) of the second fan (402). The first surface (1201) has a first through hole (12011) and a second through hole (12012). The first space (510) is connected to the air inlet (1102) through the first through hole (12011). The third space (540) is connected to the air inlet (1102) through the second through hole (12012). The second space (520) is connected to the exhaust hole (1103).

Images