Window for a display device, method of manufacturing a window for a display device, and display device and electronic device

Abstract

A window for a display device, a method of manufacturing a window for a display device, a display device, and an electronic device are provided. The window includes a glass substrate. The glass substrate includes a first portion, a second portion having a crystallinity greater than a crystallinity of the first portion and positioned at a first side of the first portion, and a third portion having a crystallinity greater than the crystallinity of the first portion and positioned at a second side of the first portion. A thickness of the first portion is less than each of a thickness of the second portion and a thickness of the third portion.

Description

Technical Field

[0001] This disclosure relates herein to windows for display devices, methods of manufacturing windows for display devices, and display devices and electronic devices including windows, and more specifically, to windows including two types of glass substrates, methods of manufacturing windows, display devices including windows, and electronic devices including windows. Background Technology

[0002] Electronic devices can display images to provide information to users. Currently, various types of electronic devices are under development. Specifically, foldable electronic devices are being developed.

[0003] Electronic devices may include display devices and windows. Windows may include a glass substrate. There is a need for a window that improves the impact resistance and strength of the outer surface and reduces stress occurring during folding. Summary of the Invention

[0004] This disclosure provides a window for a display device that has improved impact resistance and reduced folding stress.

[0005] This disclosure provides a method for manufacturing a window.

[0006] This disclosure provides a display device including a window.

[0007] This disclosure provides an electronic device including a window.

[0008] Embodiments of the present invention provide a window comprising a glass substrate. The glass substrate includes: a first portion; a second portion having a crystallinity greater than that of the first portion and positioned at a first side of the first portion; and a third portion having a crystallinity greater than that of the first portion and positioned at a second side of the first portion. The thickness of the first portion is less than the thickness of each of the second and third portions.

[0009] In the embodiments, the crystallization rate of the second part can be in the range of about 30% to about 80%.

[0010] In one embodiment, the second portion may include an upper surface and an inclined surface extending from the upper surface of the second portion. The third portion may include an upper surface and an inclined surface extending from the upper surface of the third portion. The inclined surfaces of the second and third portions may face each other, and the upper surface of the first portion is located between the inclined surfaces of the second and third portions.

[0011] In an embodiment, the first portion may further include a lower surface opposite to the upper surface of the first portion, the second portion may further include a lower surface opposite to the upper surface of the second portion, and the third portion may further include a lower surface opposite to the upper surface of the third portion. The lower surfaces of the first portion, the second portion, and the third portion may define flat surfaces.

[0012] In an embodiment, the elastic modulus of the first part may be smaller than that of the second part.

[0013] In an embodiment, the thickness of the first portion can be in the range of about 10 μm to about 50 μm, and the thickness of the second portion can be in the range of about 50 μm to about 100 μm.

[0014] Embodiments of the present invention provide a method for manufacturing a window for a display device, the method comprising: providing a first glass substrate comprising amorphous glass, a second glass substrate comprising crystalline glass, and a third glass substrate comprising crystalline glass; joining a first side surface of the first glass substrate and a side surface of the second glass substrate; and joining a side surface of the third glass substrate and a second side surface of the first glass substrate opposite to the first side surface of the first glass substrate. The thickness of the first glass substrate is smaller than each of the thicknesses of the second and third glass substrates.

[0015] In one embodiment, the joining of a first side surface of a first glass substrate with a side surface of a second glass substrate may include providing a plasma flow to the first side surface of the first glass substrate and the side surface of the second glass substrate.

[0016] Embodiments of the present invention can provide a display device comprising: a display panel including a folded region, a first non-folded region, and a second non-folded region, wherein the first non-folded region and the second non-folded region are back-to-back with each other and the folded region is located between the first non-folded region and the second non-folded region; and a window including a glass substrate and coupled to the display panel. The glass substrate may include: a first portion overlapping the folded region; a second portion overlapping the first non-folded region, having a crystallinity greater than that of the first portion, and positioned on a first side of the first portion; and a third portion overlapping the second non-folded region, having a crystallinity greater than that of the first portion, and positioned on a second side of the first portion. The second and third portions are back-to-back with each other and the first portion is located between the second and third portions, and the thickness of the first portion is less than the thickness of each of the second and third portions.

[0017] In one embodiment, the second portion may include an upper surface and an inclined surface extending from the upper surface of the second portion. The third portion may include an upper surface and an inclined surface extending from the upper surface of the third portion. The inclined surfaces of the second and third portions may face each other, and the upper surface of the first portion is located between the inclined surfaces of the second and third portions.

[0018] In an embodiment, the elastic modulus of the first part may be smaller than that of the second part.

[0019] In an embodiment, the thickness of the first portion is in the range of about 10 μm to about 50 μm, and the thickness of the second portion can be in the range of about 50 μm to about 100 μm.

[0020] Embodiments of the present invention provide an electronic device comprising: a display device including a folded region, a first non-folded region, and a second non-folded region, wherein the first non-folded region and the second non-folded region are back-to-back with each other and the folded region is located between the first non-folded region and the second non-folded region; and a housing for accommodating the display device. The display device may further include a display panel and a window coupled to the display panel. The window may include a glass substrate, and the glass substrate includes: a first portion overlapping the folded region; a second portion overlapping the first non-folded region, having a crystallinity greater than that of the first portion, and positioned on a first side of the first portion; and a third portion overlapping the second non-folded region, having a crystallinity greater than that of the first portion, and positioned on a second side of the first portion. The second and third portions are back-to-back with each other and the first portion is located between the second and third portions, and the thickness of the first portion is less than the thickness of each of the second and third portions.

[0021] In this embodiment, the electronic device may be any one of a mobile phone, a smartwatch, and an information providing device for a vehicle.

[0022] In one embodiment, the second portion includes an upper surface and an inclined surface extending from the upper surface of the second portion, and the third portion may include an upper surface and an inclined surface extending from the upper surface of the third portion. The inclined surfaces of the second portion and the third portion may face each other, and the upper surface of the first portion is between the inclined surfaces of the second portion and the third portion.

[0023] In an embodiment, the elastic modulus of the first part may be smaller than that of the second part.

[0024] In an embodiment, the thickness of the first portion is in the range of about 10 μm to about 50 μm, and the thickness of the second portion can be in the range of about 50 μm to about 100 μm.

[0025] In an embodiment, the first portion may include amorphous glass.

[0026] In the embodiments, the crystallization rate of the second part can be in the range of about 30% to about 80%. Attached Figure Description

[0027] The accompanying drawings are included to provide a further understanding of the inventive concept, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the inventive concept and, together with the description, serve to explain the principles of the inventive concept. In the drawings:

[0028] Figure 1A This is a block diagram of an electronic device according to an embodiment of the present invention;

[0029] Figures 1B to 1D This is a perspective view of an electronic device according to an embodiment of the present invention;

[0030] Figures 2A to 2C This is a perspective view of an electronic device according to an embodiment of the present invention;

[0031] Figure 3 This is an exploded perspective view of a display device according to an embodiment of the present invention;

[0032] Figure 4A and Figure 4B This is a cross-sectional view of a window according to an embodiment of the present invention;

[0033] Figure 4C yes Figure 4A An enlarged cross-sectional view of a portion;

[0034] Figure 4D yes Figure 4C An enlarged cross-sectional view of the first part;

[0035] Figure 5A and Figure 5B This is a cross-sectional view of a window according to an embodiment of the present invention;

[0036] Figure 6 This is a flowchart illustrating a method for manufacturing a window according to an embodiment of the concept of the present invention;

[0037] Figure 7 A diagram illustrating a plasma bonding apparatus according to an embodiment of the present invention; and

[0038] Figure 8 The bonding process of a chemically strengthened first glass substrate with a treated second glass substrate and a treated third glass substrate is shown. Detailed Implementation

[0039] In this specification, when a component (or area, layer, or portion, etc.) is referred to as being "on" another component, "connected to" another component, or "coupled to" another component, it means that the component may be directly disposed on / directly connected to / directly coupled to the other component, or that a third component may be disposed between the component and the other component.

[0040] The same reference numerals always refer to the same components. In the drawings, for the purpose of effectively describing the technical content, the thickness, ratio, and dimensions of components are exaggerated. The term "and / or" includes all combinations of one or more of the related components.

[0041] Various components may be described using terms such as "first" and "second," but such components should not be limited by such terms. These terms are used only to distinguish one component, part, area, layer, or portion from another component, part, area, layer, or portion. For example, without departing from the scope of the invention, a first component, first part, first area, first layer, or first portion may be named a second component, second part, second area, second layer, or second portion, and similarly, a second component, second part, second area, second layer, or second portion may also be named a first component, first part, first area, first layer, or first portion. Unless the context clearly indicates otherwise, singular expressions include plural expressions.

[0042] The terms “below,” “under,” “on the lower side,” “above,” “on top,” or “on the upper side,” etc., may be used to describe the relationship between the components shown in the accompanying drawings. These terms are relative concepts and are described based on the directions indicated in the drawings.

[0043] It should be understood that the terms “comprising” or “having” are intended to indicate the presence of the features, quantities, steps, operations, components, parts, or combinations thereof described in the specification, but do not preclude the possibility of the presence or addition of one or more other features, quantities, steps, operations, components, parts, or combinations thereof.

[0044] Taking into account the measurements discussed and the errors associated with the measurement of a particular quantity, the terms “approximately” or “about” as used herein include the stated value and include a suitable range of deviations from the particular value as determined by one of ordinary skill in the art. For example, the terms “approximately” or “about” may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0045] As used herein, the term "substantially" means approximately or actually. The term "substantially homogeneous" means approximately homogeneous or actually homogeneous. The term "substantially identical" means approximately identical or actually identical. The term "substantially the same" means approximately the same or actually the same. The term "substantially perpendicular" means approximately perpendicular or actually perpendicular. The term "substantially parallel" means approximately parallel or actually parallel.

[0046] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Unless expressly defined herein, terms (such as those defined in a general dictionary) shall be interpreted as having meaning consistent with their meaning in the context of the relevant art and shall not be interpreted in an overly idealized or overly formalized sense.

[0047] In the following description, embodiments of the inventive concept are illustrated with reference to the accompanying drawings.

[0048] Figure 1A This is a block diagram of an electronic device ED according to an embodiment of the present invention. Figures 1B to 1D This is a perspective view of an electronic device ED according to an embodiment of the present invention. Figures 2A to 2C This is a perspective view of an electronic device ED according to an embodiment of the present invention.

[0049] An electronic device ED according to an embodiment of the present invention includes a display device DD. The electronic device ED according to an embodiment of the present invention may be as follows: Figures 2A to 2C The foldable phone shown is not limited to this.

[0050] like Figure 1A As shown, the electronic device ED outputs various information through the display module 140 in the operating system. In an example where the processor 110 executes an application stored in the memory 120, the display module 140 provides application information to the user through the display panel 141.

[0051] Processor 110 acquires external input via input module 130 or sensor module 161 and executes the application corresponding to the external input. In the example where the user selects the camera icon displayed on display panel 141, processor 110 acquires user input via input sensor 161-2 and activates camera module 171. Processor 110 transmits image data corresponding to the captured image acquired by camera module 171 to display module 140. Display module 140 can display the image corresponding to the captured image via display panel 141.

[0052] As another example, when personal information authentication is performed in display module 140, fingerprint sensor 161-1 acquires input fingerprint information as input data. Processor 110 compares the input data acquired by fingerprint sensor 161-1 with authentication data stored in memory 120 and executes the application corresponding to the comparison result. Display module 140 can display information executed according to the application logic via display panel 141.

[0053] As another example, when a music stream icon displayed in display module 140 is selected, processor 110 acquires user input via input sensor 161-2 and activates the music stream application stored in memory 120. In the example where a music execution command is entered into the music stream application, processor 110 activates audio output module 163 to provide the user with audio information corresponding to the music execution command.

[0054] Referring to the preceding text, the operation of the electronic device ED has been briefly described. The configuration of the electronic device ED will be described in detail below. Some components of the electronic device ED, which will be described later, can be integrated and provided as a single component, and a single component can be provided as two or more separate components.

[0055] Reference Figure 1A The electronic device ED can communicate with the external electronic device 102 via a network (e.g., a short-range wireless communication network or a long-range wireless communication network). According to an embodiment, the electronic device ED may include a processor 110, a memory 120, an input module 130, a display module 140, a power module 150, an embedded module 160, and an external module 170. According to an embodiment, at least one of the described plurality of components may be omitted in the electronic device ED, or one or more other components may be added. According to an embodiment, some of the plurality of components (e.g., sensor module 161, antenna module 162, or audio output module 163) may be integrated into another component (e.g., display module 140).

[0056] Processor 110 can execute software to control at least one other component (e.g., hardware or software component) connected to electronic device ED, and can perform various data processing or computational operations. According to an embodiment, as at least part of the data processing or computational operation, processor 110 can store commands or data received from other components (e.g., input module 130, sensor module 161, or communication module 173) in volatile memory 121, and can process the commands or data stored in volatile memory 121, and the resulting data can be stored in non-volatile memory 122.

[0057] Processor 110 may include a main processor 111 and an auxiliary processor 112. Main processor 111 may include at least one of a central processing unit (CPU) 111-1 and an application processor (AP). Main processor 111 may also include one or more of a graphics processing unit (GPU) 111-2, a communication processor (CP), and an image signal processor (ISP). Main processor 111 may also include a neural network processing unit (NPU) 111-3. Neural network processing unit 111-3 is a processor specifically designed to process artificial intelligence models, and these models can be created through machine learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DNN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the networks described herein, but is not limited to the examples described herein. In addition to hardware architecture, the artificial intelligence model may additionally or optionally include software architecture. At least two of the described processing units and processors can be implemented as an integrated component (e.g., a single chip) or can each be implemented as a separate component (e.g., multiple chips).

[0058] The auxiliary processor 112 may include a controller 112-1. The controller 112-1 may include an interface conversion circuit and a timing control circuit. The controller 112-1 receives image signals from the main processor 111, converts the data format of the image signals to conform to the interface specifications of the display module 140, and outputs the image data. The controller 112-1 can output various types of control signals that support driving the display module 140.

[0059] The auxiliary processor 112 may also include a data conversion circuit 112-2, a gamma correction circuit 112-3, and a rendering circuit 112-4. The data conversion circuit 112-2 can receive image data from the controller 112-1 and can compensate the image data to display an image with desired brightness according to the characteristics of the electronic device ED or user settings, or can convert the image data to reduce power consumption or compensate for afterimages. The gamma correction circuit 112-3 can convert image data or a gamma reference voltage to give the image displayed in the electronic device ED desired gamma characteristics. The rendering circuit 112-4 can receive image data from the controller 112-1 and can render the image data considering the pixel arrangement of the display panel 141 applied to the electronic device ED. At least one of the data conversion circuit 112-2, the gamma correction circuit 112-3, and the rendering circuit 112-4 may be integrated into another component (e.g., the main processor 111 or the controller 112-1). At least one of the data conversion circuit 112-2, the gamma correction circuit 112-3, and the rendering circuit 112-4 can be integrated into the data driver 143, which will be described later.

[0060] The memory 120 may store various data used by at least one component of the electronic device ED (e.g., processor 110 or sensor module 161) as well as input or output data for commands related to the various data. The memory 120 may include at least one of volatile memory 121 and non-volatile memory 122.

[0061] The input module 130 can receive commands or data from outside the electronic device ED (e.g., from a user or external electronic device 102) to be used by components of the electronic device ED (e.g., processor 110, sensor module 161, or audio output module 163).

[0062] Input module 130 may include a first input module 131 for receiving commands or data from a user and a second input module 132 for receiving commands or data from an external electronic device 102. The first input module 131 may include a microphone, mouse, keyboard, buttons (e.g., keypads), or pen (e.g., a passive or active pen). The second input module 132 may support a specified protocol enabling wired or wireless connection to the external electronic device 102. According to embodiments, the second input module 132 may include a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, or an audio interface. The second input module 132 may include a connector enabling physical connection to the external electronic device 102, such as an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0063] Display module 140 visually presents information to the user. Display module 140 may include display panel 141, scan driver 142, and data driver 143. Display module 140 may also include a window, base, and bracket for protecting display panel 141.

[0064] The display panel 141 may include a liquid crystal display panel, an organic light-emitting display panel, or an inorganic light-emitting display panel, and the type of display panel 141 is not particularly limited. The display panel 141 may be a rigid panel or a flexible panel that can be rolled up or folded. The display module 140 may also include a support member, bracket, or heat dissipation component for supporting the display panel 141.

[0065] The scan driver 142 can be mounted as a driver chip on the display panel 141. In some aspects, the scan driver 142 can be integrated into the display panel 141. For example, the scan driver 142 may include an amorphous silicon thin-film transistor (TFT) gate driver circuit (ASG), a low-temperature polycrystalline silicon (LTPS) TFT gate driver circuit, or an oxide semiconductor TFT gate driver circuit (OSG) embedded in the display panel 141. The scan driver 142 receives control signals from the controller 112-1 and outputs scan signals to the display panel 141 in response to the control signals.

[0066] The display panel 141 may also include a transmitter driver. The transmitter driver outputs a transmitter control signal to the display panel 141 in response to a control signal received from the controller 112-1. The transmitter driver may be formed separately from the scan driver 142 or may be integrated into the scan driver 142.

[0067] The data driver 143 receives a control signal from the controller 112-1, converts the image data into an analog voltage (e.g., a data voltage) in response to the control signal, and then outputs the data voltage to the display panel 141.

[0068] The data driver 143 can be integrated into another component (e.g., controller 112-1). The functions of the interface conversion circuitry and timing control circuitry of controller 112-1 described herein can also be integrated into the data driver 143.

[0069] The display module 140 may also include a voltage generation circuit, etc. The voltage generation circuit can output various voltages that support driving the display panel 141.

[0070] Power module 150 supplies power to components of electronic device ED. Power module 150 may include a battery that charges with electrical voltage. The battery may include a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. Power module 150 may include a power management integrated circuit (PMIC). The PMIC supplies power optimized for each of the modules described herein and those described later. Power module 150 may include a wireless power transmitting / receiving component electrically connected to the battery. The wireless power transmitting / receiving component may include multiple coil-shaped antenna radiators.

[0071] The electronic device ED may also include an embedded module 160 and an external module 170. The embedded module 160 may include a sensor module 161, an antenna module 162, and an audio output module 163. The external module 170 may include a camera module 171, an optical module 172, and a communication module 173.

[0072] Sensor module 161 can detect input applied by the user's body or by the pen in the first input module 131, and can generate an electrical signal or data value corresponding to the input. Sensor module 161 may include at least one of fingerprint sensor 161-1, input sensor 161-2, and digitizer 161-3.

[0073] The fingerprint sensor 161-1 can generate data values ​​corresponding to the user's fingerprint. The fingerprint sensor 161-1 may include an optical fingerprint sensor or a capacitive fingerprint sensor.

[0074] Input sensor 161-2 can generate data values ​​corresponding to coordinate information about input from the user's body or from a pen. Input sensor 161-2 generates data values ​​based on changes in electrostatic capacitance caused by the input. Input sensor 161-2 can detect input from a passive pen or can send data to or receive data from an active pen.

[0075] The input sensor 161-2 can also measure biometric signals such as blood pressure, water content, and body fat. In an example where a user brings a part of their body into contact with the sensor layer or sensing panel and keeps it stationary for a certain period of time, the input sensor 161-2 can detect biometric signals based on changes in the electric field caused by the part of the user's body and can output the information desired by the user to the display module 140.

[0076] The digitizer 161-3 can generate data values ​​corresponding to coordinate information about input from a pen. The digitizer 161-3 generates electromagnetic changes caused by the input as data values. The digitizer 161-3 can detect input from a passive pen or send data to or receive data from an active pen.

[0077] At least one of the fingerprint sensor 161-1, the input sensor 161-2, and the digitizer 161-3 can be implemented as a sensor layer formed on the display panel 141 by a continuous process. The fingerprint sensor 161-1, the input sensor 161-2, and the digitizer 161-3 can be disposed in the upper portion of the display panel 141, and any one of the fingerprint sensor 161-1, the input sensor 161-2, and the digitizer 161-3 (e.g., the digitizer 161-3) can be disposed in the lower portion of the display panel 141.

[0078] At least two of the fingerprint sensor 161-1, input sensor 161-2, and digitizer 161-3 can be integrated into a single sensing panel using the same process. In an example where at least two of the fingerprint sensor 161-1, input sensor 161-2, and digitizer 161-3 are integrated into a single sensing panel, the sensing panel can be positioned between the display panel 141 and a window positioned above the display panel 141. According to an embodiment, the sensing panel can be positioned on the window, and the position of the sensing panel is not particularly limited.

[0079] At least one of the fingerprint sensor 161-1, the input sensor 161-2, and the digitizer 161-3 can be embedded in the display panel 141. That is, at least one of the fingerprint sensor 161-1, the input sensor 161-2, and the digitizer 161-3 can be formed simultaneously by a process for forming elements (e.g., light-emitting elements and transistors) included in the display panel 141.

[0080] In some respects, sensor module 161 can generate electrical signals or data values ​​corresponding to the internal or external states of electronic device ED. Sensor module 161 may also include, for example, gesture sensors, gyroscope sensors, atmospheric pressure sensors, magnetic sensors, accelerometers, grip force sensors, proximity sensors, color sensors, infrared (IR) sensors, biosensors, temperature sensors, humidity sensors, or illuminance sensors.

[0081] Antenna module 162 may include one or more antennas for transmitting or receiving signals or power to or from an external source. According to an embodiment, communication module 173 may transmit or receive signals from external electronic device 102 via an antenna suitable for a communication scheme. The antenna pattern of antenna module 162 may also be integrated with a component of display module 140 (e.g., display panel 141) or input sensors 161-2, etc.

[0082] The audio output module 163 is a device for outputting audio signals to the outside of the electronic device ED, and may include, for example, a speaker for general purposes (such as playback of multimedia or recordings) and a receiver for answering telephone calls. According to embodiments, the receiver may be formed integrally with or separately from the speaker. The audio output pattern of the audio output module 163 may be integrated into the display module 140.

[0083] Camera module 171 can capture still images and moving images. According to an embodiment, camera module 171 may include one or more lenses, an image sensor, or an image signal processor. Camera module 171 may also include an infrared camera capable of measuring the presence or absence of a user, the user's position, and the user's line of sight, etc.

[0084] The light module 172 can provide light. The light module 172 may include a light-emitting diode or a xenon lamp. The light module 172 may be interlocked with the camera module 171 or may operate independently of the camera module 171.

[0085] Communication module 173 can establish a wired or wireless communication channel between electronic device ED and external electronic device 102, and can support the execution of communication through the established communication channel. Communication module 173 may include both wireless communication modules such as cellular communication modules, short-range wireless communication modules, or Global Navigation Satellite System (GNSS) communication modules, and wired communication modules such as local area network (LAN) communication modules or power line communication modules; or both wireless communication modules such as cellular communication modules, short-range wireless communication modules, or Global Navigation Satellite System (GNSS) communication modules, or wired communication modules such as local area network (LAN) communication modules or power line communication modules. Communication module 173 can communicate with external electronic device 102 through short-range communication networks such as Bluetooth, WiFi Direct, or Infrared Data Association (IrDA), or long-range communication networks such as cellular networks, the Internet, or computer networks (e.g., LAN or WAN). The various types of communication modules 173 described herein can be implemented as a single chip or can each be implemented as separate chips.

[0086] The input module 130, sensor module 161, and camera module 171 can be used to interlock with the processor 110 to control the operation of the display module 140.

[0087] The processor 110 outputs commands or data to the display module 140, audio output module 163, camera module 171, or optical module 172 based on the input data received from the input module 130. For example, the processor 110 can generate image data corresponding to the input data applied by a mouse or active pen and output the image data to the display module 140, or it can generate command data corresponding to the input data and output the command data to the camera module 171 or optical module 172. In an example where no input data is received from the input module 130 for a certain period of time, the processor 110 can reduce the power consumption in the electronic device ED by switching the operating mode of the electronic device ED to a low-power mode or a sleep mode.

[0088] Processor 110 outputs commands or data to display module 140, audio output module 163, camera module 171, or optical module 172 based on sensing data received from sensor module 161. For example, processor 110 can compare authentication data applied from fingerprint sensor 161-1 with authentication data stored in memory 120 and then execute an application based on the comparison result. Processor 110 can execute commands based on sensing data detected by input sensor 161-2 or digitizer 161-3, or can output corresponding image data to display module 140. In an example where a temperature sensor is included in sensor module 161, processor 110 can receive temperature data measured from sensor module 161 and can also perform brightness correction operations on image data based on the temperature data.

[0089] The processor 110 can receive measurement data from the camera module 171 regarding the presence or absence of a user, the user's position, and the user's line of sight. The processor 110 can also perform brightness correction operations on the image data based on the measurement data. For example, the processor 110, which determines the presence or absence of a user by input from the camera module 171, can output image data to the display module 140 whose brightness has been corrected by the data conversion circuit 112-2 or the gamma correction circuit 112-3.

[0090] Some of the components can be connected to each other via peripheral communication schemes (such as bus, general purpose input / output (GPIO), serial peripheral interface (SPI), mobile industrial processor interface (MIPI), and hyperpath interconnect (UPI) links, and thus can exchange signals (e.g., commands or data) between components. Processor 110 can communicate with display module 140 via a mutually agreed interface, and can use, for example, any of the communication schemes described herein, and embodiments of the inventive concept are not limited to the communication schemes described herein.

[0091] The electronic device ED according to the various embodiments disclosed herein can be of various types. For example, the electronic device ED may include at least one of portable communication devices (e.g., smartphones), tablet devices, portable multimedia devices, wearable devices, and home appliances. The electronic device ED according to embodiments of this disclosure is not limited to the devices described herein. Figure 1B The AR glasses shown Figure 1C The various types of vehicle information providing devices shown are Figure 1D The smartwatch shown can be implemented as the electronic device ED of the present invention.

[0092] Reference Figures 2A to 2C The electronic device ED may include a display device DD and a housing HUS that houses the display device DD. The electronic device ED may include a display surface FS provided by the display device DD. The display surface FS may be defined by a first direction DR1 and a second direction DR2 intersecting the first direction DR1. The electronic device ED can provide an image IM to a user via the display surface FS. The image IM is provided on a third direction DR3.

[0093] The display surface FS of the electronic device ED according to an embodiment may include a display area F-AA and a peripheral area F-NAA. An image IM can be displayed through the display area F-AA. The peripheral area F-NAA is adjacent to the display area F-AA. The peripheral area F-NAA may not display the image IM and may have a predetermined color. The peripheral area F-NAA may surround the display area F-AA, but is not limited thereto, and the peripheral area F-NAA may be disposed adjacent to a single side of the display area F-AA or may be omitted. The electronic device ED according to an embodiment of the present invention may include active areas of various shapes, and is not limited to any one embodiment.

[0094] The display surface FS may also include a sensing area EMA. Various electronic modules can be disposed within the sensing area EMA. For example, the electronic modules may include at least one of a camera module, a light detection sensor, and a thermal detection sensor. The sensing area EMA may be surrounded by the display area F-AA. Although one sensing area EMA is shown as an example, the number of sensing areas EMA is not limited to this.

[0095] The sensing area EMA can be part of the display area F-AA. Therefore, the image IM can also be displayed in the sensing area EMA. In an example where the electronic module located in the sensing area EMA is disabled, the sensing area EMA can display the image IM as part of the display area F-AA.

[0096] The display surface FS may include a folded area FA and non-folded areas NFA1 and NFA2. The electronic device ED may include multiple non-folded areas NFA1 and NFA2. According to an embodiment, the electronic device ED may include a first non-folded area NFA1 and a second non-folded area NFA2, with the folded area FA disposed between the first non-folded area NFA1 and the second non-folded area NFA2. Although... Figures 2A to 2C An embodiment of an electronic device ED including a folding area FA is shown, but the embodiments disclosed herein are not limited thereto, and the electronic device ED may include multiple folding areas.

[0097] Reference Figure 2B and Figure 2C The electronic device ED can be folded relative to a folding axis FX extending in one direction. Figure 2B and Figure 2C The folding axis FX shown as a virtual axis extending in the second direction DR2 is defined to overlap with the folding area FA and can be parallel to the long side direction of the electronic device ED.

[0098] Reference Figure 2B The electronic device ED can be folded so that the first non-folded area NFA1 and the second non-folded area NFA2 face each other. That is, the display surface FS can be folded inwards so as not to be exposed to the outside. (See reference...) Figure 2C According to an embodiment of the present invention, the electronic device ED can be folded outward so that the display surface FS is exposed to the outside.

[0099] Figure 3 This is an exploded perspective view of a display device DD according to an embodiment of the present invention.

[0100] The display device DD according to an embodiment of the present invention includes a display panel DP and a window WM disposed on the display panel DP.

[0101] Display panel DP can be a light-emitting display panel. For example, display panel DP can be an organic light-emitting display panel, an inorganic light-emitting display panel, a micro light-emitting diode (LED) display panel, a micro OLED display panel, or a nano LED display panel.

[0102] The display panel (DP) can include the display area DP-DA and the non-display area DP-NDA. The display area DP-DA is where pixels are set and references are generated. Figures 2A to 2C The image IM area is described. The display area of ​​the DP display panel DP-DA can be referenced in this document. Figures 2A to 2C The description corresponds to the display area F-AA. The non-display area DP-NDA can be compared with the reference. Figures 2A to 2C The description of the peripheral area corresponds to F-NAA. In this specification, the statement "one area (or part) corresponds to another area (or part)" means that these areas overlap with each other, and are not limited to areas with the same shape and the same area.

[0103] The display panel DP can include [symbols / parameters] respectively. Figures 2A to 2C The folding area FA of the electronic device ED (or display device DD) and the folding area FA-D corresponding to the first non-folding area NFA1 and the second non-folding area NFA2, as well as the first non-folding area NFA1-D and the second non-folding area NFA2-D. Figure 3 In the middle, the area protruding from the window WM of the second non-folding area NFA2-D can be bent and set below the second non-folding area NFA2-D.

[0104] WM provides references in this article Figures 2A to 2C The described display surface FS. That is, the window WM can provide the front surface of the electronic device ED. The window WM may include a folded area FA-W, a first non-folded area NFA1-W, and a second non-folded area NFA2-W, respectively corresponding to the folded area FA of the electronic device ED and the first non-folded area NFA1 and the second non-folded area NFA2. When the electronic device ED is folded, the folded area FA-W deforms with a predetermined curvature.

[0105] The window WM may include a substrate and a border pattern disposed on the surface of the substrate. The area where the border pattern is disposed may define a reference area. Figures 2A to 2C The outer region F-NAA is described. In embodiments of the present invention, the border pattern may be omitted.

[0106] exist Figure 3 In this diagram, apart from the display panel DP and the window WM, other components of the display device DD are not shown. For example, the display device DD may also include a protective layer disposed above the window WM, an input sensor disposed between the window WM and the display panel DP, a support plate disposed below the display panel DP, and a buffer layer.

[0107] exist Figure 3 In, with Figures 2A to 2C In contrast, apart from the display device DD, other components of the electronic device ED are not shown. For example, the housing HUS is not shown. (See reference...) Figure 1A The described electronic modules (e.g., processor 110, memory 120, and power module 150) can be disposed within the space defined by the display device DD and the housing HUS. In some aspects, reference is made to... Figures 2A to 2C Other components described can be further configured in this space.

[0108] Figure 4A and Figure 4B This is a cross-sectional view of window WM according to an embodiment of the present invention. Figure 4C yes Figure 4A A magnified cross-sectional view of a portion of the image. Figure 4D yes Figure 4C The first part is an enlarged cross-sectional view of GS1.

[0109] Reference Figure 4A and Figure 4B A window WM may include a glass substrate GS and a resin layer RL disposed on the surface of the glass substrate GS. The resin layer RL may include acrylic resin, epoxy resin, silicone resin, urethane resin, urethane-acrylic resin, mixed sol-gel, and siloxane resin. A window WM having the structure described herein can have improved impact resistance through the resin layer RL while maintaining the optical and design properties of the glass substrate GS.

[0110] exist Figure 4A In the middle, the upper surface of the resin layer RL can provide Figures 2A to 2C The display surface FS. With Figure 4A Compared to the window WM shown, Figure 4B This is illustrated, for example, in a window WM where the positions of the glass substrate GS and the resin layer RL are reversed. Figure 4B In the middle, the upper surface of the glass substrate GS can provide Figures 2A to 2C The display surface FS.

[0111] In embodiments of the present invention, the stacking structure of the window WM can be modified. In embodiments of the present invention, the resin layer RL can be omitted. For example, in embodiments of the present invention, the resin layer RL can be replaced by an adhesive layer, such as a pressure-sensitive adhesive sheet. A protective film can be further disposed on the adhesive layer.

[0112] according to Figure 4CA glass substrate GS may comprise multiple portions distinguished by their crystallinity. Hereinafter, a glass substrate GS comprising a first portion GS1, a second portion GS2, and a third portion GS3 will be described as an example. The second portion GS2 and the third portion GS3 may each have a higher crystallinity than the first portion GS1. When amorphous glass is heat-treated, specific components within the glass grow into crystals, and the glass becomes a crystalline material. The crystallinity of the glass is determined based on the degree of heat treatment.

[0113] In embodiments of the present invention, the first portion GS1 may comprise amorphous glass. However, embodiments of the present invention are not limited thereto, and the first portion GS1 may also comprise heat-treated glass such that the first portion GS1 has a lower crystallinity than each of the second portion GS2 and the third portion GS3.

[0114] The second part GS2 can be disposed on the first side of the first part GS1, and the third part GS3 can be disposed on the second side of the first part GS1. That is, the first part GS1 can be disposed between the second part GS2 and the third part GS3, with the surface of the first side of the first part GS1 in contact with the second part GS2, and the surface of the second side of the first part GS1 in contact with the third part GS3. In some examples, the crystallinity of the second part GS2 and the third part GS3 can each be 30% or greater to increase mechanical strength. In some aspects, the crystallinity of the second part GS2 and the third part GS3 can be 80% or less, or 50% or less, to increase transparency. The crystallinity can be measured by X-ray diffraction (XRD) and transmission electron microscopy (TEM).

[0115] The first part GS1 may correspond to (or overlap with) the folded area FA-W. Embodiments of the present invention are not limited to the first part GS1 completely overlapping the folded area FA-W. For example, a portion of the second part GS2 and a portion of the third part GS3 may overlap the folded area FA-W, and multiple portions of the first part GS1 may overlap with the first non-folded area NFA1-W and the second non-folded area NFA2-W, respectively.

[0116] Part 2 (GS2) and Part 3 (GS3) may include crystalline glass. Crystalline glass is obtained by crystallizing amorphous glass through heat treatment and corresponds to ceramic glass. Compared to amorphous glass, crystalline glass has a higher elastic modulus and higher impact strength.

[0117] The first part GS1 has a smaller thickness than the second part GS2 and the third part GS3. The phrase "the first part GS1 has a smaller thickness than the second part GS2 and the third part GS3" can be the result of comparing measurements at any measurement point of the first part GS1, the second part GS2, and the third part GS3, can be the result of comparing average thicknesses, or can be the result of comparing the maximum thickness of the first part GS1 with each of the minimum thicknesses of the second part GS2 and the third part GS3. However, thicknesses measured at the boundaries between the first part GS1 and the second part GS2, and at the boundaries between the first part GS1 and the third part GS3, can be excluded from thickness comparisons.

[0118] The first part GS1 may have a substantially uniform thickness. Each of the second part GS2 and the third part GS3 has a uniform thickness, but may have regions where the thickness varies. The thickness of the first part GS1 may range from about 10 μm to about 50 μm, and the thickness of each of the second part GS2 and the third part GS3 may range from about 50 μm to about 100 μm. The thickness of the first part GS1 is measured at a first point P1 on the upper surface US of the first part GS1, the thickness of the second part GS2 is measured at a second point P2 on the upper surface US of the second part GS2, and the thickness of the third part GS3 is measured at a third point P3 on the upper surface US of the third part GS3.

[0119] Each of the second point P2 and the third point P3 is spaced apart from the first point P1. The thickness of the first part GS1 and the thickness of the second part GS2, measured at the boundary (or boundary point) between the first part GS1 and the second part GS2, can be equal to each other, and the thickness of the first part GS1 and the thickness of the third part GS3, measured at the boundary (or boundary point) between the first part GS1 and the third part GS3, can be equal to each other. The first point P1 and the second point P2 do not overlap with the boundary between the first part GS1 and the second part GS2, and the first point P1 and the third point P3 do not overlap with the boundary between the first part GS1 and the third part GS3.

[0120] Even when the thickness of the second part GS2 is measured at a point on the inclined surface IS of the second part GS2 and the thickness of the third part GS3 is measured at a point on the inclined surface IS of the third part GS3, the thickness of the first part GS1 is smaller than the thickness of both the second part GS2 and the third part GS3.

[0121] Even when the first portion GS1 has a non-uniform thickness, the thickness measured at the point of maximum thickness in the first portion GS1 can be smaller than the thickness measured at any point in the second portion GS2 and at any point in the third portion GS3. However, the arbitrary point is not located at the boundary between the first portion GS1 and the second portion GS2, nor at the boundary between the first portion GS1 and the third portion GS3.

[0122] According to the structure described herein, the second part GS2 and the third part GS3, which occupy a larger area than the first part GS1, have a larger modulus of elasticity than the first part GS1, thereby improving the impact resistance of the window WM. Since the first part GS1 has a smaller modulus of elasticity than each of the second part GS2 and the third part GS3, the amount of stress occurring in the window WM during folding can be reduced.

[0123] The glass substrate GS includes a first surface S1 and a second surface S2 facing away from each other on a third-direction DR3, and the resin layer RL includes a first surface S10 and a second surface S20 facing away from each other on a third-direction DR3. Figure 4C In the diagram, the first surface S1 of the glass substrate GS is shown as the upper surface of the glass substrate GS, and the first surface S10 of the resin layer RL is shown as the upper surface of the resin layer RL. The first surface S1 of the glass substrate GS and the second surface S20 of the resin layer RL are in contact with each other.

[0124] The glass substrate GS and the resin layer RL can have different thicknesses depending on the region. A groove GV can be formed in the glass substrate GS. The groove GV can be defined by the upper surface US of the first portion GS1, the inclined surface IS of the second portion GS2, and the inclined surface IS of the third portion GS3. The inclined surface IS of the second portion GS2 and the inclined surface IS of the third portion GS3 face each other and are located between the upper surface US of the first portion GS1 and the inclined surface IS of the third portion GS3. The inclined surface IS of the second portion GS2 extends from the upper surface US of the second portion GS2, and the inclined surface IS of the third portion GS3 extends from the upper surface US of the third portion GS3. The upper surface US of the first portion GS1, the upper surface US of the second portion GS2, the upper surface US of the third portion GS3, the inclined surface IS of the second portion GS2, and the inclined surface IS of the third portion GS3 define the first surface S1 of the glass substrate GS.

[0125] The first portion GS1 includes a lower surface opposite to the upper surface US of the first portion GS1, the second portion GS2 includes a lower surface opposite to the upper surface US of the second portion GS2, and the third portion GS3 includes a lower surface opposite to the upper surface US of the third portion GS3. The lower surfaces of the first portion GS1, the second portion GS2, and the third portion GS3 define the same flat surface. The flat surface is shown as... Figure 4C The second surface S2.

[0126] The resin layer RL can fill the groove GV and provide a flat upper surface. The first portion RL1 of the resin layer RL corresponding to the folded area FA-W can have a larger thickness than the second portion RL2 and the third portion RL3 of the resin layer RL corresponding to the first non-folded area NFA1-W and the second non-folded area NFA2-W, respectively. Since the second surface S2 of the glass substrate GS provides a flat surface and the first surface S10 of the resin layer RL provides a flat surface, the window WM can have a uniform thickness.

[0127] Figure 4D This is an enlarged cross-sectional view of the first part GS1. The first part GS1 may include chemically strengthened glass. The first part GS1 may include a tensile stress region TP and compressive stress regions SP1 and SP2. The first compressive stress region SP1 and the second compressive stress region SP2 are defined on both sides of the tensile stress region TP in the thickness direction. Since the first surface S1 and the second surface S2 are subjected to the same chemical strengthening, the first compressive stress region SP1 and the second compressive stress region SP2 may have the same thickness or the same depth.

[0128] Figure 5A and Figure 5B This is a cross-sectional view of window WM according to an embodiment of the present invention. Figure 5A and Figure 5B Showing with Figure 4C The corresponding cross-sectional view. See below for reference. Figure 4C For a detailed description of the same component, please refer to the reference. Figure 4C Explanation.

[0129] like Figure 5A As shown, the second part GS2 and the third part GS3 can each have a substantially uniform thickness. (This can be omitted.) Figure 4C The inclined surface IS is shown in the figure.

[0130] like Figure 5B As shown, the inclined surface IS of each of the second part GS2 and the third part GS3 can be a curved surface. Although the concave inclined surface IS is shown as an example, the inclined surface IS can be a convex curved surface.

[0131] Figure 6 This is a flowchart illustrating a method for manufacturing a window WM according to an embodiment of the present invention. Figure 7 This is a diagram illustrating a plasma bonding device FB according to an embodiment of the present invention.

[0132] In the description of the methods and processes herein, operations may be performed in a different order than those shown and / or described, or in a different order or at different times. Some operations may also be omitted from the flowchart, one or more operations may be repeated, or additional operations may be added. Descriptions of elements as "can be set" and "can be formed," etc., include methods, processes, and techniques for setting, forming, positioning, and modifying elements, etc., based on the exemplary aspects described herein.

[0133] like Figure 6 As shown, the method may include providing a first glass substrate, a second glass substrate, and a third glass substrate (S1). The first glass substrate, the second glass substrate, and the third glass substrate may include amorphous glass.

[0134] Next, the method may include chemically strengthening the first glass substrate (S2). Chemical strengthening can be performed using a salt containing an ionic salt (e.g., a liquid ionic salt). Multiple potassium ions (K... + A medium is provided to a first glass substrate. Therefore, the first glass substrate may include a medium and sodium ions (Na+) dispersed in the medium. + ) and potassium ions (K + Potassium ions (K) + By replacing sodium ions (Na) dispersed in the medium + And absorbed from the ionic salt into the first glass substrate.

[0135] Based on potassium ions (K + ) and sodium ions (Na + The degree of substitution can determine the intensity of surface stress (or surface compressive stress), the intensity of internal stress (or internal tensile stress), and the depth of the compressive stress zone (SP) (i.e., the depth of the layer (DOL)). The compressive stress zones are respectively defined on both sides of the first glass substrate. These compressive stress zones are compared with a reference... Figure 4D The first compressive stress region SP1 and the second compressive stress region SP2 described correspond to each other. In embodiments of the present invention, the step of chemically strengthening the first glass substrate can be omitted.

[0136] Subsequently, the method may include processing the second and third glass substrates (S3). The second and third glass substrates may be heat-treated to transform the amorphous glass into a crystalline glass. In some aspects, a portion of the second and third glass substrates may be removed using CNC glass cutting equipment. In this way, a glass substrate can be formed. Figure 4C The inclined surface IS is shown. There is no particular restriction on the order in which the second and third glass substrates are processed, and the processes can be performed simultaneously or sequentially.

[0137] In embodiments of the present invention, the steps of removing a portion of the second glass substrate and a portion of the third glass substrate can be omitted. For example, as... Figure 5A As shown, when the entire region of each of the second portion GS2 and the third portion GS3 has a substantially uniform thickness, the step of removing a portion of the second glass substrate and a portion of the third glass substrate is not performed. In this embodiment, for example, the step of processing the second and third glass substrates may include heat-treating the second and third glass substrates to transform the amorphous glass into a crystalline glass.

[0138] Next, the method may include bonding the second glass substrate and the third glass substrate to the first glass substrate (S4). This can be achieved using... Figure 7 The plasma bonding device FB shown is illustrated. Figure 7 The plasma bonding device FB shown includes a cylindrical body portion BD and a first electrode E1 and a second electrode E2 disposed within the body portion BD. The first electrode E1 and the second electrode E2 can be electrodes with opposite polarities, and the first electrode E1 can be a cathode and the second electrode E2 can be an anode. The first electrode E1 can have a sharp end.

[0139] In an example where a predetermined gas GS is supplied to the main body portion BD and a voltage with a high potential difference is applied between the first electrode E1 and the second electrode E2, an arc discharge ARC is generated between the end of the first electrode E1 and the second electrode E2. The gas GS may contain oxygen. The gas GS can be ionized by the arc discharge ARC to form a plasma jet PLJ (also referred to herein as a plasma flow or a stream of plasma). The plasma bonding device FB may include a cooling water inlet W-IN and a cooling water outlet W-OUT. In some aspects, the method may include providing a barrier gas (or shielding gas) around the plasma jet PLJ such that the concentration of the plasma jet PLJ is improved.

[0140] Figure 8 The bonding process is illustrated for a chemically strengthened first glass substrate, a treated second glass substrate, and a treated third glass substrate. For example... Figure 8 As shown, a chemically strengthened first glass substrate GS10, a treated second glass substrate GS20, and a treated third glass substrate GS30 are provided. Figure 7 The plasma jet PLJ shown can be provided to a chemically strengthened first glass substrate GS10 and a treated second glass substrate GS20. Although in Figure 7 Not shown, but a plasma jet PLJ can also be provided to a treated third glass substrate GS30. A first side surface SS1 of a chemically strengthened first glass substrate GS10 and a side surface SS20 of a treated second glass substrate GS20 can be bonded. For example, the plasma jet PLJ provides oxygen functional groups. The oxygen functional groups bonded to the first side surface SS1 of the first glass substrate GS10 are covalently bonded to the silicon atoms of the second glass substrate GS20, and the oxygen functional groups bonded to the side surface SS20 of the second glass substrate GS20 are covalently bonded to the silicon atoms of the first glass substrate GS10. Therefore, the first side surface SS1 of the first glass substrate GS10 and the side surface SS20 of the second glass substrate GS20 can be directly bonded to glass via silanol condensation.

[0141] In this manner, the processed third glass substrate GS30 is also bonded to the second side surface SS2 of the first glass substrate GS10. In the example where the side surface SS30 of the third glass substrate GS30 is directly bonded to the second side surface SS2 of the first glass substrate GS10, a [structure / form] can be formed. Figure 4C The glass substrate GS shown is subsequently formed when liquid resin is applied to the glass substrate GS and then dried. Figure 4C The resin layer RL shown.

[0142] Based on the foregoing, the amount of stress occurring in the window during folding can be reduced. In some respects, this can increase the window's impact resistance.

[0143] The embodiments of the present invention have been described above with reference to the present invention concept. However, it will be understood by those skilled in the art or those of ordinary skill that various modifications and changes can be made to the present invention concept, as long as such modifications and changes do not depart from the spirit and technical scope of the present invention concept set forth in the appended claims.

[0144] Therefore, the technical scope of this invention is not limited to what is stated in the detailed description of the specification, but should be determined by the claims.

Claims

1. A window for a display device, wherein, The window includes a glass substrate. The glass substrate includes: Part One; The second part has a higher crystallinity than the first part and is located on the first side of the first part; and The third part has a crystallinity greater than that of the first part and is located on the second side of the first part. The thickness of the first part is smaller than the thickness of the second part and the thickness of the third part.

2. The window according to claim 1, wherein, The first part includes amorphous glass.

3. The window according to claim 1, wherein, The crystallization rate of the second part is in the range of 30% to 80%.

4. The window according to claim 1, wherein: The second part includes an upper surface and an inclined surface extending from the upper surface of the second part. The third portion includes an upper surface and an inclined surface extending from the upper surface of the third portion, and The inclined surface of the second part and the inclined surface of the third part face each other, and the upper surface of the first part lies between the inclined surface of the second part and the inclined surface of the third part.

5. The window according to claim 4, wherein: The first portion also includes a lower surface opposite to the upper surface of the first portion. The second part also includes a lower surface opposite to the upper surface of the second part. The third part also includes a lower surface opposite to the upper surface of the third part, and The lower surface of the first portion, the lower surface of the second portion, and the lower surface of the third portion define a flat surface.

6. The window according to claim 1, wherein, The elastic modulus of the first part is smaller than that of the second part.

7. The window according to claim 1, wherein: The thickness of the first portion is in the range of 10 μm to 50 μm, and The thickness of the second part is in the range of 50 μm to 100 μm.

8. A method for manufacturing a window for a display device, wherein, The method includes: A first glass substrate comprising amorphous glass, a second glass substrate comprising crystalline glass, and a third glass substrate comprising the crystalline glass are provided; Joining the first side surface of the first glass substrate and the side surface of the second glass substrate; and The side surface of the third glass substrate and the second side surface of the first glass substrate, which is opposite to the first side surface of the first glass substrate, are joined together. The thickness of the first glass substrate is smaller than the thickness of each of the second and third glass substrates.

9. The method according to claim 8, wherein, The engagement of the first side surface of the first glass substrate with the side surface of the second glass substrate includes providing a plasma flow to the first side surface of the first glass substrate and the side surface of the second glass substrate.

10. A display device, wherein, The display device includes: A display panel includes a folding area, a first non-folding area, and a second non-folding area, wherein the first non-folding area and the second non-folding area face away from each other, and the folding area is located between the first non-folding area and the second non-folding area; and The window includes a glass substrate and is coupled to the display panel. The glass substrate includes: The first part overlaps with the folded area; The second part overlaps with the first non-folded region, has a higher crystallinity than the first part, and is located on the first side of the first part; and The third portion overlaps with the second non-folded region, has a crystallinity greater than that of the first portion, and is located on the second side of the first portion. in: The second part and the third part are back-to-back with each other, and the first part is located between the second part and the third part. The thickness of the first portion is smaller than the thickness of the second portion and the thickness of the third portion.

11. The display device according to claim 10, wherein: The second part includes an upper surface and an inclined surface extending from the upper surface of the second part. The third portion includes an upper surface and an inclined surface extending from the upper surface of the third portion, and The inclined surface of the second part and the inclined surface of the third part face each other, and the upper surface of the first part lies between the inclined surface of the second part and the inclined surface of the third part.

12. The display device according to claim 10, wherein, The elastic modulus of the first part is smaller than that of the second part.

13. The display device according to claim 10, wherein, The thickness of the first portion is in the range of 10 μm to 50 μm, and the thickness of the second portion is in the range of 50 μm to 100 μm.

14. An electronic device, wherein, The electronic device includes: A display device includes a folding region, a first non-folding region, and a second non-folding region, wherein the first non-folding region and the second non-folding region face away from each other and the folding region is located between the first non-folding region and the second non-folding region; and Housing that houses the display device. in: The display device further includes a display panel and a window coupled to the display panel. The window includes a glass substrate, and The glass substrate includes: The first part overlaps with the folded area; The second part overlaps with the first non-folded region, has a higher crystallinity than the first part, and is located on the first side of the first part; and The third portion overlaps with the second non-folded region, has a crystallinity greater than that of the first portion, and is located on the second side of the first portion. in: The second part and the third part are back-to-back with each other, and the first part is located between the second part and the third part. The thickness of the first portion is smaller than the thickness of the second portion and the thickness of the third portion.

15. The electronic device according to claim 14, wherein, The electronic device is any one of a mobile phone, a smartwatch, and an information providing device for a vehicle.

16. The electronic device according to claim 14, wherein: The second part includes an upper surface and an inclined surface extending from the upper surface of the second part. The third portion includes an upper surface and an inclined surface extending from the upper surface of the third portion, and The inclined surface of the second part and the inclined surface of the third part face each other, and the upper surface of the first part lies between the inclined surface of the second part and the inclined surface of the third part.

17. The electronic device according to claim 14, wherein, The elastic modulus of the first part is smaller than that of the second part.

18. The electronic device according to claim 14, wherein: The thickness of the first portion is in the range of 10 μm to 50 μm, and The thickness of the second part is in the range of 50 μm to 100 μm.

19. The electronic device according to claim 14, wherein, The first part includes amorphous glass.

20. The electronic device according to claim 14, wherein, The crystallization rate of the second part is in the range of 30% to 80%.

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