Display module, manufacturing method thereof and display device

Abstract

The display module, the manufacturing method thereof and the display device are provided. The display module comprises a display panel and a protection layer. The display panel comprises a display area and a bending area located on one side of the display area in a first direction. The protection layer comprises a first protection part and a second protection part. The first protection part is located on the light-emitting side of the display panel, and the second protection part is located on the back light side of the display panel. The orthographic projections of the first protection part and the second protection part on the display panel are both located in the bending area. In the present application, the first protection part mainly plays a protection role. The second protection part plays a role of supporting the bending structure and reduces the stress of the bending structure after bending. In the present embodiment, by arranging the first protection part and the second protection part on the inner and outer sides of the bending area respectively, the influence of the bending stress on the metal wire in the bending area when the bending area is bent with a small radius can be reduced, so that the width of the frame of the display device can be reduced, and the narrow frame can be set.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display module and its manufacturing method, and a display device. Background Technology

[0002] With the development of display technology, display modules are becoming increasingly common, gradually being applied to various electronic devices needed for people's daily work or life. In order to enhance the visual immersion and aesthetic value of electronic devices, and to increase the effective display area and optimize the user experience without changing the overall size of the electronic device, more and more display modules are adopting narrow bezel designs. However, the reliability of existing display modules with narrow bezel designs needs to be improved. Summary of the Invention

[0003] In view of this, the purpose of this disclosure is to provide a display module that can reduce cracks in the bending zone, a method for manufacturing the same, and a display device.

[0004] For the purposes described above, this disclosure discloses a display module comprising:

[0005] The display panel includes a display area and a bent area located on one side of the display area in a first direction;

[0006] The protective layer includes a first protective part and a second protective part. The first protective part is located on the light-emitting side of the display panel, and the second protective part is located on the backlight side of the display panel. The orthographic projections of the first protective part and the second protective part on the display panel are both located in the bending area.

[0007] In one embodiment, the protective layer further includes a third protective portion located between and connecting the first and second protective portions. The third protective portion is located on a side wall of the display panel in the bending area in a second direction, where the second direction intersects the first direction.

[0008] Preferably, the protective layer further includes a fourth protective portion, which is connected to the side of the second protective portion away from the third protective portion, and the fourth protective portion is located on the side wall of the display panel in the bending area away from the third protective portion in the second direction.

[0009] In one embodiment, the protective layer includes an adhesive layer and a base layer, the base layer being located on the side of the adhesive layer opposite to the display panel, and the size of the adhesive layer being larger than the size of the base layer in a direction perpendicular to the surface of the display panel.

[0010] Preferably, the base material comprises polyimide or polyethylene terephthalate;

[0011] Preferably, the adhesive layer is made of optical adhesive;

[0012] Preferably, in the direction perpendicular to the surface of the display panel, the size of the base layer is less than 15 micrometers, and the size of the adhesive layer is greater than 15 micrometers.

[0013] In one embodiment, the display panel further includes a bonding area located on the side of the bending area opposite to the display area;

[0014] The display module further includes a support layer located on the backlight side of the display panel. The support layer includes a first support portion and a second support portion spaced apart. The orthographic projection of the first support portion on the display panel is located in the display area, and the orthographic projection of the second support portion on the display panel is located in the bonding area. The second protective portion is located between the first support portion and the second support portion.

[0015] Preferably, when the display module is in an unbent state, there is a first gap between the first support portion and the second support portion, and in the first direction, the size of the second protective portion is less than or equal to the size of the first gap;

[0016] Preferably, the second protective portion is symmetrically arranged about the centerline of the first gap;

[0017] Preferably, in the direction perpendicular to the surface where the display panel is located, the size of the second protective part is larger than the size of the support layer;

[0018] Preferably, in a direction perpendicular to the surface of the display panel, the size of the adhesive layer in the second protective part is larger than the size of the support layer.

[0019] In one embodiment, when the protective layer is in an unbent state, the dimension of the protective layer in the second direction is greater than or equal to twice the dimension of the display panel in the second direction.

[0020] Based on the same inventive concept, this disclosure provides a method for manufacturing a display module, which includes the following steps:

[0021] A display panel or a display panel motherboard is provided, the display panel or the display panel motherboard including a display area and a bending area located on one side of the display area in a first direction;

[0022] A protective layer is formed on the display panel or the mother panel of the display panel located in the bending area:

[0023] It includes forming a first protective portion on the light-emitting side of the display panel or the display panel motherboard located in the bending area;

[0024] A second protective portion is formed on the backlight side of the display panel or the mother panel of the display panel located in the bending area.

[0025] In one embodiment, the step of forming a protective layer on the display panel or the display panel motherboard located in the bending region includes:

[0026] Provide temporary carrier film;

[0027] A protective layer is provided on the temporary carrier film to form a temporary protective structure. The temporary protective structure includes a first part and a second part, and the first part and the second part are spaced apart. The protective layer includes a base layer and an adhesive layer located on the side of the base layer opposite to the temporary carrier film.

[0028] The adhesive layer in the first part, facing away from the temporary carrier film, is bonded to the light-emitting side of the display panel or the display panel motherboard located in the bending area; the adhesive layer in the second part, facing away from the temporary carrier film, is bonded to the backlight side of the display panel or the display panel motherboard located in the bending area, and the first part and the second part are then pressed together.

[0029] Remove the temporary carrier film corresponding to the first part and the temporary carrier film corresponding to the second part to form a first protective part and a second protective part;

[0030] Preferably, the size of the temporary carrier film is greater than or equal to 150 micrometers in the direction perpendicular to the plane of the display panel.

[0031] In one embodiment, the step of forming the second protective portion on the backlight side of the display panel or the display panel motherboard located in the bending region includes:

[0032] A third protective portion is formed on one side wall of the display panel or the display panel motherboard located in the bending area in the second direction, the second direction intersecting the first direction;

[0033] Preferably, the temporary protective structure further includes a third part, which is located between the first part and the second part and connects the first part and the second part. The adhesive layer in the third part is attached to the side of the temporary carrier film away from the temporary carrier film and to one side wall of the display panel or the display panel motherboard in the second direction of the bending area to form a third protective part.

[0034] Preferably, the temporary carrier film has a first notch at the location corresponding to the third part and part of the second part, and the side wall of the first notch near the first part is flush with the side wall of the display panel or the mother plate of the display panel in the bending area in the second direction.

[0035] In one embodiment, the step of forming the second protective portion on the backlight side of the display panel or the display panel motherboard located in the bending region includes:

[0036] A fourth protective portion is formed on the sidewall of the display panel or the display panel motherboard located in the bending area, on the sidewall of the display panel facing away from the third protective portion in the second direction;

[0037] Preferably, the temporary protective structure further includes a fourth part, which is connected to the side of the second part away from the third part. The adhesive layer in the fourth part away from the temporary carrier film is attached to the side wall of the display panel or the display panel motherboard located in the bending area away from the third protective part in the second direction to form a fourth protective part.

[0038] Preferably, the temporary carrier film is provided with a second notch corresponding to the fourth part and part of the second part, and the side wall surface of the second notch near the second part is flush with the side wall surface of the display panel or the mother plate of the display panel located in the bending area in the second direction;

[0039] Preferably, the display panel motherboard is cut to form the display panel.

[0040] Based on the same inventive concept, this disclosure also provides a display device, which includes a display module as described above, or a display module manufactured by the manufacturing method described above.

[0041] Compared with the prior art, the present disclosure provides a display module and its manufacturing method and display device, wherein the first protective part of the display module mainly plays a protective role, and the second protective part plays a supporting role for the bending structure, reducing the stress of the bending structure after bending. By setting the first protective part and the second protective part on the inner and outer sides of the bending area respectively, the influence of bending stress on the metal line of the bending area when the bending area is bent at a small radius can be reduced, thereby reducing the width of the bezel of the display device and realizing the setting of a narrow bezel. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in this disclosure or related technologies, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are only embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0043] Figure 1 This is a schematic diagram of the display module provided in the embodiment of this application in its unbent state. Figure 1 ;

[0044] Figure 2 This is a schematic diagram of the display module provided in the embodiment of this application in its unbent state. Figure 2 ;

[0045] Figure 3 This is a schematic diagram of the display module provided in the embodiment of this application in its unbent state. Figure 3 ;

[0046] Figure 4a A side view of the display module provided in the embodiments of this application in its unbent state. Figure 1 ;

[0047] Figure 4b A side view of the display module provided in the embodiments of this application in its unbent state. Figure 2 ;

[0048] Figure 5 This is a schematic diagram of the display module in a bent state provided in an embodiment of this application;

[0049] Figures 6a-10 This is a schematic diagram of the structure of the display module provided in the embodiments of this application during the manufacturing process;

[0050] Figure 11 This is a schematic diagram of the display module manufacturing process provided in an embodiment of this application. Detailed Implementation

[0051] To make the objectives, technical solutions, and advantages of this disclosure clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0052] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this disclosure should have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms "first," "second," and similar terms used in the embodiments of this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0053] With the development of display technology, the application of display modules is becoming increasingly widespread, gradually being incorporated into various electronic devices needed for people's daily work and life. More and more display modules are adopting narrow bezel designs, but due to limitations in screen structure and module materials, reducing bezel width is becoming increasingly difficult. Currently, reducing bezel width mainly involves reducing the bending radius of the bending area B and the bonding area C. However, as the bending radius decreases, the risk of screen abnormalities also increases. For example, increasing the bending area B (also known as the twisted area) increases the risk of cracks, resulting in no display, bright lines, dark lines, etc.

[0054] For the reasons mentioned above, this application provides a display module and its manufacturing method, as well as a display device. The display module includes a display panel and a protective layer. The display panel includes a display area and a bending area located on one side of the display area in a first direction. The protective layer includes a first protective part and a second protective part. The first protective part is located on the light-emitting side of the display panel, and the second protective part is located on the backlight side of the display panel. The orthographic projections of the first and second protective parts on the display panel are both located in the bending area. In this application, the first protective part mainly serves a protective function; the second protective part serves to support the bending structure and reduce the stress of the bending structure after bending. In this embodiment, by providing the first and second protective parts on the inner and outer sides of the bending area respectively, the influence of bending stress on the metal wire of the bending area can be reduced when the bending area is bent at a small radius, thereby reducing the width of the bezel of the display device and achieving a narrow bezel design.

[0055] The following is combined with Figures 1-5 The present application describes a display module, which includes a support layer 30, a display panel 10, and a cover plate 40 stacked sequentially from bottom to top.

[0056] Specifically, the display panel 10 is a flexible display panel 10, which is a display panel 10 made of flexible materials and can adapt to various complex shapes and curves, such as curved screens and rollable screens. The flexible display panel 10 can be responsible for displaying actual images or information, and is usually manufactured using flexible display technologies such as OLED, which has excellent display effects and flexible characteristics.

[0057] refer to Figures 1-3 The flexible display panel 10 includes a display area A, a bending area B located on one side of the display area A in the first direction (Y direction), and a bonding area C adjacent to the bending area B (which can also be understood as the bonding area C located on the side of the bending area B away from the display area A). The display area A is used to display to the user, the bending area B is the area where the flexible display panel 10 achieves its bending function, and the area adjacent to the bending area B can be regarded as the lower frame area, i.e., the bonding area C. The bonding area C can be used to bond integrated circuits (ICs), flexible printed circuits (FPCs), etc., to achieve connection and communication with other components. In the direction perpendicular to the surface of the display panel 10 (Z direction), the display panel 10 includes a light-emitting side F1 and a backlight side F2 arranged opposite to each other. The light-emitting side F1 is responsible for presenting image information to the user, while the backlight side F2 serves a supporting function.

[0058] refer to Figure 1 In the display module, the protective layer 20 is located in the bending area B of the display panel 10. This protective layer 20 primarily protects the display panel 10 in the bending area B, reduces bending stress, and prevents the metal wires in the bending area B from breaking. The protective layer 20 includes a first protective part 21 and a second protective part 22. The first protective part 21 is located on the light-emitting side F1 of the display panel 10; this first protective part 21 can also be called the outer protective part, and it mainly serves a protective function. The second protective part 22 is located on the backlight side F2 of the display panel 10; this second protective part 22 can also be called the inner protective part, and it mainly supports the bending structure and reduces the stress on the bending structure after bending. In this embodiment, by providing the first protective part 21 and the second protective part 22 on the inner and outer sides of the bending area B respectively, the impact of bending stress on the metal wires in the bending area B during small-radius bending can be reduced, thereby reducing the width of the display device's bezel and achieving a narrow bezel design.

[0059] In this embodiment, when the protective layer 20 is in an unbent state, the size of the protective layer 20 in the second direction (X direction) is equal to twice the size of the display panel 10 in the second direction (X direction).

[0060] refer to Figure 2In another optional embodiment, the protective layer 20 may further include a first protective part 21, a second protective part 22, and a third protective part 23. The third protective part 23 is located between the first protective part 21 and the second protective part 22 and connects the first protective part 21 and the second protective part 22. The first protective part 21 is located on the light-emitting side F1 of the display panel 10 in the bending area B, the second protective part 22 is located on the backlight side F2 of the display panel 10 in the bending area B, and the third protective part 23 is located on one side wall of the display panel 10 in the second direction (X direction) in the bending area B. The second direction (X direction) and the first direction (Y direction) are located on the same plane and intersect with the first direction (Y direction). In this embodiment, by providing the third protective part 23, the side wall of the bending area B can be protected. Since the side wall of the bending area B is laser-cut and the cutting surface is exposed, the side wall of the bending area B can be protected by the third protective part 23. In this embodiment, the first protective part 21, the second protective part 22, and the third protective part 23 are interconnected to form a whole. Before the protective layer 20 is attached to the display panel 10, a temporary carrier film 27 is provided on the side of the protective layer 20 away from the substrate. The temporary carrier film 27 is used to reduce the probability of generating air bubbles during the attachment process. The temporary carrier film 27 is provided with a first notch 271. The orthographic projection of the first notch 271 on the protective layer 20 covers the third protective part 23 and part of the second protective part 22. This design facilitates the bending of the protective layer 20. It should be noted that the temporary carrier film 27 needs to be removed after the protective layer 20 is attached.

[0061] In this embodiment, when the protective layer 20 is in an unbent state, the size of the protective layer 20 in the second direction (X direction) is more than twice the size of the display panel 10 in the second direction (X direction).

[0062] refer to Figure 3In another optional embodiment, the protective layer 20 may further include a first protective portion 21, a second protective portion 22, a third protective portion 23, and a fourth protective portion 24. The third protective portion 23 is located between the first protective portion 21 and the second protective portion 22 and connects the first protective portion 21 and the second protective portion 22. The fourth protective portion 24 is located on the side of the second protective portion 22 away from the second protective portion 22 and is connected to the second protective portion 24. The first protective portion 21 is located on the light-emitting side F1 of the display panel 10 in the bending area B, the second protective portion 22 is located on the backlight side F2 of the display panel 10 in the bending area B, and the third protective portion 23 is located on the display panel 10 in the bending area B. On one side wall in the second direction (X direction), the fourth protective part 24 is located on the side wall of the display panel 10 in the bending area B on the side away from the third protective part 23 in the second direction (X direction). It can be understood that the third protective part 23 and the fourth protective part 24 are respectively located on the two side walls of the bending area B opposite to each other in the second direction (X direction). The second direction (X direction) and the first direction (Y direction) are located on the same plane and intersect with the first direction (Y direction). In this embodiment, the protective layer 20 provides all-round protection for the bending area B of the display panel 10, further improving the protection of the bending area B of the display panel 10. In this embodiment, the first protective part 21, the second protective part 22, the third protective part 23, and the fourth protective part 24 are interconnected to form a whole. Before the protective layer 20 is attached to the display panel 10, a temporary carrier film 27 is provided on the side of the protective layer 20 away from the substrate. The temporary carrier film 27 is used to reduce the probability of generating air bubbles during the attachment process. The temporary carrier film 27 is provided with a first notch 271 and a second notch 272. The orthographic projection of the first notch 271 on the protective layer 20 covers the third protective part 23 and part of the second protective part 22. The orthographic projection of the first notch 271 on the protective layer 20 covers the fourth protective part 24 and part of the second protective part 22. This design facilitates the bending of the protective layer 20. It should be noted that the temporary carrier film 27 needs to be removed after the protective layer 20 is attached.

[0063] In this embodiment, when the protective layer 20 is in an unbent state, the size of the protective layer 20 in the second direction (X direction) is more than twice the size of the display panel 10 in the second direction (X direction).

[0064] refer to Figures 4a-5In the display module, the support layer 30 is located on the backlight side F2 of the display panel 10. The support layer 30 mainly serves to support the display panel 10. The support layer 30 includes a first support portion 31 and a second support portion 32 that are spaced apart. The orthographic projection of the first support portion 31 on the display panel 10 is located in the display area A of the display panel 10, and the orthographic projection of the second support portion 32 on the display panel 10 is located in the bonding area C of the display panel 10. The second support portion 32 is located between the first support portion 31 and the second support portion 32. When the display module is in an unbent state, there is a first gap 33 between the first support part 31 and the second support part 32. In the first direction (Y direction), the size of the second protective part 22 is less than or equal to the size of the first gap 33. This design allows the second protective part 22 to be placed in the first gap 33. Furthermore, the second protective part 22 is symmetrically arranged about the centerline of the first gap 33, that is, the second protective part 22 is centrally attached to the first gap 33, so that the bending stress is evenly distributed when bending. Here, the extension of the centerline is parallel to the second direction.

[0065] refer to Figures 4a-5 Currently, the protective layer 20 in existing technology is BPL adhesive (Bending Protection Layer (BPL), but the uniformity of BPL adhesive is poor, and the thickness of the BPL adhesive layer near the POL area (polarizer area) is too thick. Therefore, when the bending radius R is less than 0.15, the stress near the POL area in the bending zone is too large, which leads to the fracture of the metal layer in the twisted area and causes display abnormalities. Therefore, the protective layer 20 in this application includes an adhesive layer 25 and a base layer 26. The base layer 26 is located on the side of the adhesive layer 25 away from the display panel 10. In the direction perpendicular to the surface of the display panel 10 (Z direction), the dimension H1 (thickness) of the adhesive layer 25 is greater than the dimension H2 of the base layer 26. That is, the protective layer 20 in this embodiment is a composite protective layer 20. This design can effectively ensure the release of bending radius stress because the adhesive layer 25 and the base layer 26 have good uniformity. On the other hand, it can reduce the thickness of the protective layer 20 in the bending area B, thereby reducing the width of the display device bezel and achieving a narrow bezel setting. The composite protective layer 20 is bonded to the bending area B (twisted area) of the display panel 10. This area requires bending, so the thickness of the composite protective layer 20 is critical. For example, in the direction perpendicular to the surface of the display panel 10 (Z direction), the thickness of the base layer 26 (H2) is less than 15 micrometers (e.g., 5 micrometers, 6 micrometers, 7 micrometers, 8 micrometers, 9 micrometers, 10 micrometers, 11 micrometers, 12 micrometers, 13 micrometers, 14 micrometers, 15 micrometers), and the thickness of the adhesive layer 25 (H1) is greater than 15 micrometers (e.g., 15 micrometers, 20 micrometers, 25 micrometers, 30 micrometers).

[0066] For example, the adhesive layer 25 is made of optical adhesive, and the base layer 26 is made of polyimide (PI) or polyethylene terephthalate (PET).

[0067] refer to Figures 4a-4b In one embodiment, in the direction perpendicular to the plane where the display panel 10 is located (Z direction), the dimension H4 of the second protective part 22 is greater than or equal to the dimension H3 of the first protective part 21. Preferably, referring to... Figure 4b The second protective part 22 has a dimension H4 larger than the first protective part 21's dimension H3, and the second protective part 22 has a dimension H5 larger than the support layer 30. This design further enhances the protection of the bending area B. Furthermore, in the direction perpendicular to the surface of the display panel 10 (Z direction), the adhesive layer 25 of the second protective part 22 has a dimension H6 larger than the support layer 30's dimension H5. This design ensures that when the bending area B is bent, the neutral layer of the bending area B is kept away from the metal trace layer, so that the second protective part 22 does not have an additional impact on the support layer 30.

[0068] refer to Figures 1-11 Based on the same inventive concept, this disclosure also provides a method for manufacturing a display module in any of the above embodiments, the method comprising the following steps:

[0069] S10 provides a display panel 10 or a display panel motherboard 100, which includes a display area A, a bending area B located on one side of the display area A in a first direction (Y direction), and a bonding area C adjacent to the bending area B.

[0070] In this step, the display panel 10 is formed by cutting the mother plate 100 into an irregular shape. That is, the protective layer on the display panel in this application can be set either before or after the mother plate is cut into an irregular shape.

[0071] S20: A protective layer 20 is formed on the display panel 10 or the display panel motherboard 100 located in the bending area B, which includes forming a first protective part 21 on the light-emitting side F1 of the display panel 10 located in the bending area B, and forming a second protective part 22 on the backlight side F2 of the display panel 10 or the display panel motherboard 100 located in the bending area B.

[0072] refer to Figure 6a , Figure 7a and Figure 7b Step S20 includes: providing a temporary carrier film 27; in this step, by setting the temporary carrier film 27, on the one hand, it supports the protective layer, and on the other hand, it can reduce the probability of generating air bubbles during the bonding process.

[0073] refer to Figure 10 For example, in the direction perpendicular to the surface of the display panel (Z direction), the size H7 of the temporary carrier film 27 is greater than or equal to 150 micrometers.

[0074] A protective layer 20 is formed on the temporary carrier film 27 to form a temporary protective structure 200. The temporary protective structure 200 includes a first part 210 and a second part 220, and the first part 210 and the second part 220 are spaced apart. The protective layer 20 includes a base layer 26 and an adhesive layer 25 located on the side of the base layer 26 away from the temporary carrier film 27.

[0075] The adhesive layer 25 in the first part 210, facing away from the temporary carrier film 27, is bonded to the light-emitting side F1 of the display panel 10 or the display panel motherboard 100 located in the bending area B. The adhesive layer 25 in the second part 220, facing away from the temporary carrier film 27, is bonded to the backlight side F2 of the display panel 10 or the display panel motherboard 100 in the bending area. The first part 210 and the second part 220 are then pressed together.

[0076] Remove the temporary carrier film 27 corresponding to the first part 210 and the temporary carrier film 27 corresponding to the second part 220 to form the first protective part 21 and the second protective part 22.

[0077] This step Figure 7a To attach the temporary protective structure 200 to the bending area B of the display panel motherboard 100, after removing the temporary carrier film 27 corresponding to the first part 210 and the temporary carrier film 27 corresponding to the second part 220, it is necessary to cut the display panel motherboard 100, the first protective part 21, and the second protective part 22 to form as shown. Figure 1 Display module; this step Figure 7b In order to attach the temporary protective structure 200 to the bending area B of the display panel 10, i.e., to perform irregular cutting of the display panel motherboard before attaching the temporary protective structure 200 to form the display panel, the first protective part 21 and the second protective part 22 can be formed simply by removing the temporary carrier film 27 corresponding to the first part 210 and the temporary carrier film 27 corresponding to the second part 220.

[0078] refer to Figure 6b , Figures 8a-8c In one embodiment, before the step of forming the second protective part 22 on the backlight side F2 of the display panel 10 or the display panel mother plate 100 located in the bending area B, the method further includes: forming a third protective part 23 on one side wall of the display panel 10 or the display panel mother plate 100 located in the bending area B in the second direction (X direction).

[0079] In this embodiment, the step of forming a protective layer 20 on the display panel 10 or the display panel motherboard 100 located in the bending area B includes:

[0080] Provide temporary carrier film 27;

[0081] A protective layer 20 is formed on a temporary carrier film 27 to form a temporary protective structure 200, which includes a first part 210, a second part 220 and a third part 230 located between the first part 210 and the second part 220 and connecting the first part 210 and the second part 220.

[0082] A first notch 271 is provided at the location of the temporary carrier film 27 corresponding to the third part 230 and part of the second part 220. The side wall of the first notch 271 near the first part is flush with the side wall of the display panel 10 or the display panel motherboard 100 of the bending area B in the second direction (X direction). In this step, the first notch 271 is provided to facilitate the bending of the third part 230.

[0083] The adhesive layer 25 in the first part 210, facing away from the temporary carrier film 27, is bonded to the light-emitting side F1 of the display panel 10 or the display panel motherboard 100 located in the bending area B. The adhesive layer 25 in the third part 230, facing away from the temporary carrier film 27, is bonded to one side wall of the display panel 10 or the display panel motherboard 100 in the bending area B in the second direction (X direction). The adhesive layer 25 in the second part 220, facing away from the temporary carrier film 27, is bonded to the backlight side F2 of the display panel 10 or the display panel motherboard 100 in the bending area B. The first part 210 and the second part 220 are then pressed together.

[0084] Remove the temporary carrier film 27 corresponding to the first part 210 and the second temporary carrier film 27 corresponding to the second part 220 to form the first protective part 21, the second protective part 22 and the third protective part 23.

[0085] It should be noted that the reference Figure 8c When a display panel 10 is used in this embodiment, the display module includes a third protective part 23 (e.g., Figure 2 (As shown), Reference Figure 8a and Figure 8b In this embodiment, when a display panel motherboard 100 is used, the third part 230 of the temporary protective structure 200 is attached to the side wall of the display panel motherboard 100. After removing the temporary carrier film 27 corresponding to the first part 210 and the temporary carrier film 27 corresponding to the second part 220, during the process of irregularly cutting the display panel motherboard 100 to form the display panel, part of the first protective part 21, the second protective part 22 and all of the third protective part will be removed. Therefore, the display module does not include the third protective part 23 at this time (e.g., Figure 1 (As shown).

[0086] refer to Figure 6c , Figures 9a-9cIn one embodiment, after the step of forming the second protective portion 22 on the backlight side F2 of the display panel 10 or the display panel mother plate 100 located in the bending area B, the method further includes forming a fourth protective portion 24 on the side wall of the display panel 10 or the display panel mother plate 100 located in the bending area B that is away from the third protective portion 23 in the second direction (X direction).

[0087] In this embodiment, the step of forming a protective layer 20 on the display panel 10 located in the bending area B includes:

[0088] Provide temporary carrier film 27;

[0089] A protective layer 20 is formed on a temporary carrier film 27 to form a temporary protective structure 200, which includes a first part 210, a second part 220, a third part 230 located between the first part 210 and the second part 220 and connecting the first part 210 and the second part 220, and a fourth part 240 connected to the side of the second part 220 opposite to the third part 230.

[0090] A first notch 271 is provided at the temporary carrier film 27 corresponding to the third part 230 and part of the second part 220. The side wall of the first notch 271 near the first part 210 is flush with the side wall of the display panel 10 or the display panel mother plate 100 located in the bending area B in the second direction (X direction). A second notch 272 is provided at the temporary carrier film 27 corresponding to the fourth part 240 and part of the second part 220. The side wall of the second notch 272 near the second part 220 is flush with the side wall of the display panel 10 or the display panel mother plate 100 located in the bending area B in the second direction (X direction). In this step, the first notch 271 and the second notch 272 are provided to facilitate the bending of the third part 230 and the fourth part 240.

[0091] The adhesive layer 25 in the first part 210, facing away from the temporary carrier film 27, is bonded to the light-emitting side F1 of the display panel 10 located in the bending area B. The adhesive layer 25 in the third part 230, facing away from the temporary carrier film 27, is bonded to one side wall of the display panel 10 located in the bending area B in the second direction (X direction). The adhesive layer 25 in the second part 220, facing away from the temporary carrier film 27, is bonded to the backlight side F2 of the display panel 10 located in the bending area B. The adhesive layer 25 in the fourth part 240, facing away from the temporary carrier film 27, is bonded to the side wall of the display panel located in the bending area B in the second direction (X direction) facing away from the third protective part 23. The first part 210 and the second part 220 are then pressed together.

[0092] The temporary carrier film 27 corresponding to the first part 210 and the second temporary carrier film 27 corresponding to the second part 220 are removed to form the first protective part 21, the second protective part 22, the third protective part 23 and the fourth protective part 24.

[0093] In one embodiment, after step S10, a support layer 30 is formed. The support layer 30 is located on the backlight side F2 of the display panel 10. The support layer 30 includes a first support portion 31 and a second support portion 32 that are spaced apart. The orthographic projection of the first support portion 31 on the display panel 10 is located in the display area A. The orthographic projection of the second support portion 32 on the display panel 10 is located in the bonding area C. The second support portion 32 is located between the first support portion 31 and the second support portion 32.

[0094] It should be noted that the reference Figure 9c When a display panel 10 is used in this embodiment, the display module includes a third protective part 23 and a fourth protective part 24 (e.g., Figure 3 (As shown), Reference Figure 9a and Figure 9b In this embodiment, when a display panel motherboard 100 is used, the third part 230 and the fourth part 240 of the temporary protective structure 200 are attached to the side wall of the display panel motherboard 100. After removing the temporary carrier film 27 corresponding to the first part 210 and the temporary carrier film 27 corresponding to the second part 220, during the process of irregularly cutting the display panel motherboard 100 to form the display panel, part of the first protective part 21, the second protective part 22, and all of the third protective part 23 and the fourth protective part 24 will be removed. Therefore, at this time, the display module does not include the third protective part 23 and the fourth protective part 24 (e.g., Figure 1 (As shown).

[0095] It should be noted that the above description describes some embodiments of this disclosure. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in a different order than that shown in the above embodiments and still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require a specific or sequential order to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0096] This disclosure is intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A display module, characterized in that, include: The display panel includes a display area and a bent area located on one side of the display area in a first direction; The protective layer includes a first protective part and a second protective part. The first protective part is located on the light-emitting side of the display panel, and the second protective part is located on the backlight side of the display panel. The orthographic projections of the first protective part and the second protective part on the display panel are both located in the bending area.

2. The display module as described in claim 1, characterized in that, The protective layer further includes a third protective part, which is located between the first protective part and the second protective part and connects the first protective part and the second protective part. The third protective part is located on one side wall of the display panel in the bending area in a second direction, and the second direction intersects with the first direction. Preferably, the protective layer further includes a fourth protective portion, which is connected to the side of the second protective portion away from the third protective portion, and the fourth protective portion is located on the side wall of the display panel in the bending area away from the third protective portion in the second direction.

3. The display module as described in claim 1, characterized in that, The protective layer includes an adhesive layer and a base layer. The base layer is located on the side of the adhesive layer opposite to the display panel, and in a direction perpendicular to the surface of the display panel, the size of the adhesive layer is larger than the size of the base layer. Preferably, the base material comprises polyimide or polyethylene terephthalate; Preferably, the adhesive layer is made of optical adhesive; Preferably, in the direction perpendicular to the surface of the display panel, the size of the base layer is less than 15 micrometers, and the size of the adhesive layer is greater than 15 micrometers.

4. The display module as described in claim 3, characterized in that, The display panel further includes a bonding area, which is located on the side of the bending area opposite to the display area. The display module further includes a support layer located on the backlight side of the display panel. The support layer includes a first support portion and a second support portion spaced apart. The orthographic projection of the first support portion on the display panel is located in the display area, and the orthographic projection of the second support portion on the display panel is located in the bonding area. The second protective portion is located between the first support portion and the second support portion. Preferably, when the display module is in an unbent state, there is a first gap between the first support portion and the second support portion, and in the first direction, the size of the second protective portion is less than or equal to the size of the first gap; Preferably, the second protective portion is symmetrically arranged about the centerline of the first gap; Preferably, in the direction perpendicular to the surface where the display panel is located, the size of the second protective part is larger than the size of the second support layer; Preferably, in a direction perpendicular to the surface of the display panel, the size of the adhesive layer in the second protective part is larger than the size of the support layer.

5. The display module as described in claim 2, characterized in that, When the protective layer is in its unbent state, the dimension of the protective layer in the second direction is greater than or equal to twice the dimension of the display panel in the second direction.

6. A method for manufacturing a display module, characterized in that, Includes the following steps: A display panel or a display panel motherboard is provided, the display panel or the display panel motherboard including a display area and a bending area located on one side of the display area in a first direction; A protective layer is formed on the display panel or the mother panel of the display panel located in the bending area. It includes forming a first protective portion on the light-emitting side of the display panel or the display panel motherboard located in the bending area; A second protective portion is formed on the backlight side of the display panel or the mother panel of the display panel located in the bending area.

7. The manufacturing method as described in claim 6, characterized in that, The step of forming a protective layer on the display panel or the mother panel of the display panel located in the bending area includes: Provide temporary carrier film; A protective layer is provided on the temporary carrier film to form a temporary protective structure. The temporary protective structure includes a first part and a second part, and the first part and the second part are spaced apart. The protective layer includes a base layer and an adhesive layer located on the side of the base layer opposite to the temporary carrier film. The adhesive layer in the first part, facing away from the temporary carrier film, is bonded to the light-emitting side of the display panel or the display panel motherboard located in the bending area; the adhesive layer in the second part, facing away from the temporary carrier film, is bonded to the backlight side of the display panel or the display panel motherboard located in the bending area, and the first part and the second part are then pressed together. Remove the temporary carrier film corresponding to the first part and the temporary carrier film corresponding to the second part to form a first protective part and a second protective part; Preferably, the size of the temporary carrier film is greater than or equal to 150 micrometers in the direction perpendicular to the plane of the display panel.

8. The manufacturing method as described in claim 7, characterized in that, Prior to the step of forming the second protective portion on the backlight side of the display panel or the display panel motherboard located in the bending area, the following steps are included: A third protective portion is formed on one side wall of the display panel or the display panel motherboard located in the bending area in the second direction, the second direction intersecting the first direction; Preferably, the temporary protective structure further includes a third part, which is located between the first part and the second part and connects the first part and the second part. The adhesive layer in the third part is attached to the side of the temporary carrier film away from the temporary carrier film and to one side wall of the display panel or the display panel motherboard located in the bending area in the second direction to form a third protective part. Preferably, the temporary carrier film has a first notch at the third part and part of the second part, and the side wall of the first notch near the first part is flush with the side wall of the display panel or the mother plate of the display panel located in the bending area in the second direction.

9. The manufacturing method as described in claim 8, characterized in that, The step of forming a second protective portion on the backlight side of the display panel or the display panel motherboard located in the bending area includes: A fourth protective portion is formed on the sidewall of the display panel or the display panel motherboard located in the bending area, on the sidewall of the display panel facing away from the third protective portion in the second direction; Preferably, the temporary protective structure further includes a fourth part, which is connected to the side of the second part away from the third part. The adhesive layer in the fourth part away from the temporary carrier film is attached to the side wall of the display panel or the display panel motherboard located in the bending area away from the third protective part in the second direction to form a fourth protective part. Preferably, the temporary carrier film is provided with a second notch corresponding to the fourth part and part of the second part, and the side wall surface of the second notch near the second part is flush with the side wall surface of the display panel or the mother plate of the display panel located in the bending area in the second direction; Preferably, the display panel motherboard is cut to form the display panel.

10. A display device comprising a display module as described in any one of claims 1-5, or a display module manufactured by the method described in any one of claims 6-9.

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