A rack mount capacitor module configurable for electrical parameters

Abstract

A support capacitor module with configurable electrical parameters comprises two support groups and a capacitor chip group arranged oppositely; the support group comprises at least one first support and / or at least one second support, the first support is arranged adjacent to the first support or adjacent to the second support; the capacitor chip group comprises a plurality of capacitor chips, the plurality of capacitor chips are arranged at intervals between the first support and the second support or between two second supports or between two first supports; the first support is connected with only a single capacitor chip opposite in the capacitor chip group, the second support is connected with two capacitor chips arranged adjacently, and a gap is arranged between the first support and the adjacent first support or the adjacent second support; the application discards the printed circuit board carrier, adopts support integration support and welding fixation, has a stable structure, excellent heat dissipation, strong anti-substrate bending, can meet high-voltage and large-capacity application scenarios, effectively reduces parasitic parameters, and improves power density and long-term reliability.

Description

Technical Field

[0001] This invention belongs to the field of electronic component technology, specifically relating to a bracket-type capacitor module with configurable electrical parameters. Background Technology

[0002] In the fields of power electronics, new energy, and industrial power supplies, core circuit functions such as filtering, energy storage, and resonant circuits heavily rely on high-performance capacitors. As system power levels continue to increase, higher demands are placed on the operating voltage, capacitance, and adaptability to harsh operating conditions of capacitors. The voltage and capacitance performance of a single ceramic capacitor chip is no longer sufficient to meet the practical needs of high-voltage, high-capacity applications.

[0003] In existing technologies, multiple capacitor chips are typically fixed to a printed circuit board (PCB) by soldering or using conductive adhesive, and parameter configuration is achieved through series and parallel connections. Some improved solutions use ceramic substrates instead of PCBs to reduce parasitic parameters, or employ a supportless stacking method to increase capacitance density. However, all of the above solutions have significant drawbacks: 1. As a carrier, the PCB or ceramic substrate introduces non-negligible parasitic parameters under high-frequency and high-power conditions, affecting circuit performance, and its heat dissipation efficiency is low, easily leading to heat accumulation when multiple chips are stacked; 2. Although the supportless stacking solution can increase capacitance density, the mechanical stress between chips cannot be effectively released, making it prone to chip cracking and solder joint detachment under harsh environments such as vibration and temperature shock, resulting in low long-term reliability; 3. In existing integration solutions, the number of capacitor chips connected in series and parallel is a fixed design, and the series capacitance value and withstand voltage level cannot be adjusted after production, resulting in insufficient configuration flexibility and limiting the freedom of system design. If parameters need to be changed, the carrier structure needs to be redesigned, which significantly increases R&D and manufacturing costs; 4. Traditional welding or conductive adhesive connection methods are prone to poor contact in multi-layer integration scenarios, further reducing the overall reliability of the module.

[0004] In summary, the industry urgently needs a capacitor integration structure that abandons reliance on traditional substrates, possesses a robust structure and excellent heat dissipation performance, while allowing for flexible configuration of electrical parameters and accommodating both high voltage and high capacity requirements. This would improve the power density, operational reliability, and design flexibility of power electronic systems. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide a bracket-type capacitor module with configurable electrical parameters. Through a modular bracket structure, the number of series stages and the number of parallel stages can be flexibly adjusted, taking into account structural strength, heat dissipation performance and freedom of electrical parameter configuration.

[0006] The present invention adopts the following technical solution: A bracket-type capacitor module with configurable electrical parameters includes two bracket groups and a capacitor chip group arranged opposite each other; A support group includes at least one first support and / or at least one second support, wherein the first support is disposed adjacent to the first support or adjacent to the second support, and the total number of supports included in both support groups includes a plurality of first supports and at least one second support. A capacitor chip group includes a plurality of capacitor chips, which are spaced apart between a first support and a second support, or between two second supports or between two first supports. The first bracket is connected to the end electrode of a single capacitor chip in the capacitor chip group, the second bracket is connected to two adjacent capacitor chips, and a gap is provided between the first bracket and the adjacent first bracket or the adjacent second bracket.

[0007] Furthermore, the first bracket includes a first bracket body and a first connecting foot disposed at the lower end of the first bracket body, the second bracket includes a second bracket body and two second connecting feet spaced apart at the lower end of the second bracket body, the cross-section of the first bracket body is smaller than the cross-section of the second bracket body, the first bracket body is connected only to a single capacitor chip opposite to each other in the capacitor chip group, and the second bracket body is connected to two capacitor chips arranged adjacent to each other.

[0008] Furthermore, the second bracket also includes a support foot disposed at the lower end of the second bracket body, the support foot being disposed between two second connecting feet and supported at the lower ends of two adjacent capacitor chips.

[0009] Furthermore, the height of the supporting leg is higher than the height of the second connecting leg.

[0010] Furthermore, the first connecting foot includes a first extension section connected to the lower end of the first bracket body and a first connecting section arranged perpendicularly to the lower end of the first extension section, wherein the first extension section is a tapered structure that gradually narrows from top to bottom.

[0011] Furthermore, the support assembly also includes a plurality of isolation plates disposed between two adjacent capacitor chips, with their ends extending into the gap.

[0012] A method for fabricating a bracket-type capacitor module with configurable electrical parameters, used to fabricate a bracket-type capacitor module as described in any of the above claims, the method specifically including the following steps: Step 1: Clean the capacitor chip to remove the oxide layer on the surface of its terminal electrodes; Step 2: According to the assembly requirements, two bracket groups and capacitor chip groups are arranged sequentially in the assembly fixture. The connecting surfaces of the first bracket, the second bracket and the capacitor chip are coated with solder. Step 3: Place the assembled fixture on the welding base and lock it in place by the fixing mechanism. Then, send the welding base and the assembly fixture into the welding equipment to weld them together. After welding is completed, remove the assembly fixture to obtain the bracket capacitor module.

[0013] Furthermore, the assembly fixture includes a first assembly plate, a second assembly plate, and two positioning posts. The first assembly plate is provided with a first positioning groove for the positioning bracket assembly and a plurality of first discharge holes communicating with the first positioning groove. The first discharge holes are used to discharge flux volatiles or air during the welding process. The second assembly plate is vertically opposite to the first assembly plate and is provided with a second positioning groove opposite to the first positioning groove and a plurality of second discharge holes communicating with the second positioning groove. The plurality of first discharge holes are opposite to the plurality of second discharge holes. The two positioning posts are disposed opposite to each other on the first assembly plate, and the second assembly plate is provided with two clearance holes for the two positioning posts to pass through respectively. During assembly, a bracket assembly is first placed in the first positioning groove, and solder is applied to the inner surfaces of the first and second brackets. Then, a plurality of capacitor chips are placed sequentially on the bracket assembly, and a spacer is inserted between adjacent capacitor chips. Next, another bracket assembly is placed on top of the plurality of capacitor chips, and the second assembly plate is supported on the other bracket assembly, so that the other bracket assembly is embedded in the second positioning groove, thus completing the assembly of the two bracket assemblies and the capacitor chip assembly.

[0014] Furthermore, the fixing mechanism includes a fixing plate located above the welding base, two fixing screws spaced apart on the welding base and extending upward, a spring pin disposed on the fixing plate opposite to the assembly fixture, and two locking members that cooperate with the two fixing screws to lock the fixing plate.

[0015] Furthermore, the welding base is provided with a limiting groove for placing the assembly fixture, the spring pin is opposite to the limiting groove, and the locking component includes a locking nut that cooperates with the fixing screw and a wing nut located above the locking nut that cooperates with the fixing screw. The locking nut is limited at the bottom of the fixing plate, and the wing nut is locked from top to bottom at the top of the fixing plate.

[0016] As can be seen from the above description of the present invention, compared with the prior art, the beneficial effects of the present invention are: First, the capacitor module structure defined by this invention eliminates the reliance on printed circuit boards and uses a bracket as the core load-bearing structure. It has advantages such as structural stability, excellent heat dissipation performance, and flexible expansion. It can simultaneously meet the application scenarios of high voltage and large capacity, while effectively reducing parasitic parameters and improving the power density and long-term operational reliability of power electronic systems. It is suitable for filtering, energy storage and resonant circuits in the fields of power electronics, new energy and industrial power supplies. Second, the structure of the bracket-type capacitor module is further defined, consisting of at least one first bracket and / or at least one second bracket forming a bracket group. The first or second bracket can serve as a connection port. During operation, by selecting the first or second bracket at different positions as connection ports, the number of capacitor chips connected in series in the capacitor module can be adjusted to achieve a stepped configuration of series capacitance value and withstand voltage level. The number of capacitor chips connected in parallel in the vertical direction can also be flexibly increased or decreased according to the target capacity requirement to meet different application scenarios. Third, by replacing the traditional PCB or ceramic substrate with the first and second brackets, stable support is provided for the capacitor chips, and they are fixed by soldering. This can effectively release the mechanical stress between the capacitor chips and improve their resistance to vibration and temperature shock. Moreover, the heat dissipation efficiency of the metal materials of the first and second brackets is much higher than that of non-metallic substrates, which avoids heat accumulation, significantly improves the long-term reliability of the module, effectively reduces parasitic parameters under high frequency and high power conditions, and ensures circuit performance. Fourth, the standardized integrated structure reduces R&D and manufacturing costs: the first and second supports can be adapted to various series and parallel configurations, eliminating the need to redesign the carrier for different parameters, effectively reducing the R&D cycle and production costs. Fifth, the process steps are simple, including only core processes such as capacitor chip processing and series connection of capacitor chip group and bracket group. The process is simple and controllable, and the metal electrode bracket can achieve standardized continuous mass production, which is suitable for large-scale industrial production. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the bracket-type capacitor module structure in Example 1; Figure 2 This is an exploded view of the bracket-type capacitor module in Example 1; Figure 3 This is a schematic diagram of the current flow of the bracket-type capacitor module in Example 2. Figure 1 ; Figure 4 This is a schematic diagram of the current flow of the bracket-type capacitor module in Example 2. Figure 2 ; Figure 5 This is a schematic diagram of the current flow of the bracket-type capacitor module in Example 2. Figure 3 ; Figure 6 This is a schematic diagram of the current flow of the bracket-type capacitor module in Example 2. Figure 4 ; Figure 7 This is a schematic diagram of the current flow of the bracket-type capacitor module in Example 3. Figure 1 ; Figure 8 This is a schematic diagram of the current flow of the bracket-type capacitor module in Example 3. Figure 2; Figure 9 This is a schematic diagram of the current flow of the bracket-type capacitor module in Example 3. Figure 3 ; Figure 10 This is a schematic diagram of the current flow of the bracket-type capacitor module in Example 3. Figure 4 ; Figure 11 This is a structural diagram of the assembly fixture; Figure 12 Assembly diagram of welding base and fixing mechanism Figure 1 ; Figure 13 Assembly diagram of welding base and fixing mechanism Figure 2 ; In the diagram, 1. Support assembly; 2. Capacitor chip assembly; 3. First support; 4. Second support; 5. Gap; 6. Assembly fixture; 7. Welding base; 8. Fixing mechanism; 21. Capacitor chip; 31. First support body; 32. First connecting foot; 33. First extension section; 34. First connecting section; 41. Second support body; 42. Second connecting foot; 43. Support foot; 44. Second extension section; 45. Second connecting section; 61. First assembly plate; 611. First positioning groove; 612. First discharge hole; 62. Second assembly plate; 621. Second positioning groove; 622. Second discharge hole; 623. Clearance hole; 63. Positioning post; 71. Limiting groove; 81. Fixing plate; 82. Fixing screw; 83. Spring pin; 84. Locking component; 85. Locking nut; 86. Wing nut. Detailed Implementation

[0018] The present invention will be further described below through specific embodiments.

[0019] Reference Figures 1 to 10 As shown, a bracket-type capacitor module with configurable electrical parameters includes two bracket groups 1 and a capacitor chip group 2 arranged opposite to each other.

[0020] The support group 1 includes at least one first support 3 and / or at least one second support 4, wherein the first support 3 is arranged adjacent to each other or adjacent to the second support 4, and the two support groups include a plurality of first supports and at least one second support; specifically, a gap 5 is provided between the first support 3 and the adjacent first support 3 or the adjacent second support 4, so that two adjacent first supports 3 or two adjacent second supports 4 or adjacent first supports 3 and second supports 4 will not be connected in parallel, thus affecting the use of the support-type capacitor module.

[0021] The capacitor chip assembly 2 includes multiple capacitor chips 21, which are spaced apart between the first support 3 and the second support 4, or between two second supports 4, or between two first supports 3. During assembly, the arrangement of the multiple first supports 3 and the multiple second supports 4 is set according to the production requirements of this batch of bracket-type capacitor modules to ensure that the assembled bracket-type capacitor modules meet the required production requirements. Specifically, each capacitor chip 21 has end electrodes at both ends.

[0022] In another embodiment of this application, the capacitor chip group 2 is provided in multiple groups, and the multiple groups of capacitor chip groups 2 are arranged vertically at intervals. During assembly, the capacitor chip group 2 of each layer is connected to the two support groups 1 respectively to form a series-parallel composite module to meet the target capacitance value requirement.

[0023] The first bracket 3, connected only to a single capacitor chip 21 in the capacitor chip assembly 2, is made of copper or iron-nickel Kovar alloy and has excellent conductivity and heat dissipation performance. It includes a first bracket body 31 and a first connecting pin 32 located at the lower end of the first bracket body 31. The first bracket body 31 is connected only to a single capacitor chip 21 in the capacitor chip assembly 2. The first connecting pin 32 includes a first extension 33 connected to the lower end of the first bracket body 31 and a first connecting section 34 arranged perpendicularly to the lower end of the first extension 33. The first extension 33 has a tapered structure, wider at the top and narrower at the bottom, to increase the connection area between the first connecting pin 32 and the first bracket body 31, ensuring the strength of the fabricated bracket-type capacitor module during use. Specifically, the thickness of the first bracket 3 is 0.1-0.5 mm.

[0024] The second bracket 4, connected to two adjacent capacitor chips 21, is made of copper or iron-nickel Kovar alloy and has excellent conductivity and heat dissipation performance. It includes a second bracket body 41, two second connecting pins 42 spaced apart at the lower end of the second bracket body 41, and a support pin 43 located at the lower end of the second bracket body 41. The second bracket body 41 is connected to two adjacent capacitor chips 21 in the capacitor chip group 2. The second connecting pin 42 includes a second extension 44 connected to the lower end of the second bracket body 41 and a second connecting section 45 arranged perpendicularly to the lower end of the second extension 44. The second extension 44 has a tapered structure that is larger at the top and smaller at the bottom to increase the connection area between the second connecting pin 42 and the second bracket body 41 and ensure the strength of the prepared bracket-type capacitor module during use. The support pin 43 is located between the two second connecting pins 42 and supports the lower end of the two adjacent capacitor chips 21 to prevent the solder joints from melting due to abnormal temperature or unreasonable packaging temperature, which would cause the capacitor chips 21 to separate from the second bracket 4. Specifically, the support foot 43 is L-shaped and located at the lower end of the second bracket body 41, and the height of the support foot 43 is higher than the height of the second connecting foot 42; furthermore, the thickness of the second bracket 4 is 0.1-0.5mm.

[0025] In another embodiment of this application, the support group 1 further includes multiple isolation sheets, wherein the isolation sheets are polytetrafluoroethylene isolation sheets, which are disposed between two adjacent capacitor chips 21, and their ends extend into the opposing gap 5. There is no parallel connection between two adjacent first supports 3, two adjacent second supports 4, or adjacent first supports 3 and second supports 4. The above embodiments are applicable to the fabrication of large-size support-type capacitor modules. For small-size support-type capacitors, in order to simplify the fabrication process of small-size support-type capacitor modules, isolation sheets are generally not additionally set. During the welding process, the setting of large-size isolation sheets can not only ensure the spacing between the two capacitor chips, but also facilitate the subsequent removal of the isolation sheets. Specifically, the thickness of the isolation sheet is 0.2-0.5mm. Further, in this application, large size refers to sizes above 3035, and small size refers to sizes below 3035, and the parameters of the 3035 size are as follows: length 7.62mm, width: 8.89mm, thickness: 4.5mm max.

[0026] The aforementioned bracket-type capacitor module specifically includes the following steps: Step 1: Clean the terminal electrodes of capacitor chip 21 to remove the oxide layer on the surface of the terminal electrodes and ensure the reliability of the soldering. Step 2: Based on the target withstand voltage level, pre-determine the arrangement of the first support 3 and the second support 4 in the support group 1, and then arrange the two support groups 1 and the capacitor chip group 2 in the assembly fixture 6 in sequence. The connection surfaces of the first support 3, the second support 4 and the capacitor chip 21 are coated with solder. Step 3: Place the assembled jig 6 on the welding base 7 and lock it with the fixing mechanism 8. Then, send the welding base 7 and the assembly jig 6 into the welding equipment to weld them together. After welding, remove the assembly jig 6 to obtain the bracket capacitor module. Step 4: Test the capacitance and withstand voltage of the obtained bracket-type capacitor module. If the parameters do not meet the design requirements, test by changing the arrangement of the first bracket 3 and the second bracket 4 to adjust the number of series connections or increase or decrease the number of parallel connections of single-layer modules until the target performance is achieved.

[0027] The brazing filler metal used is a high-temperature filler metal with a melting point range of 200-300℃, to ensure that the welding nodes between the first bracket 3 and the capacitor chip 21 or the second bracket 4 and the capacitor chip 21 maintain a stable connection under high temperature and vibration environments.

[0028] Reference Figure 11 As shown, the fixture 6 includes a first assembly plate 61, a second assembly plate 62, and two positioning posts 63. The first assembly plate 61 is provided with a first positioning groove 611 of the positioning bracket group 1 and a plurality of first discharge holes 612 communicating with the first positioning groove 611. The second assembly plate 62 is vertically opposite to the first assembly plate 61 and is provided with a second positioning groove 621 opposite to the first positioning groove 611 and a plurality of second discharge holes 622 communicating with the second positioning groove 621. The two positioning posts 63 are arranged opposite each other on the first assembly plate 61 and extend upward. The second assembly plate 62 is provided with two clearance holes 623 for the two positioning posts 63 to pass through respectively. Specifically, during the welding process, flux volatiles or air overflowing from the welding point can overflow outward through the plurality of first discharge holes 612 or second discharge holes 622 to prevent flux volatiles or air from affecting the quality of the welded bracket capacitor module. During assembly, firstly, a bracket assembly 1 is placed in the first positioning groove 611, and solder is applied to the inner surfaces of the first bracket 3 and the second bracket 4. Then, multiple capacitor chips 21 are placed sequentially on the bracket assembly 1, and a polytetrafluoroethylene (PTFE) insulating sheet is inserted between adjacent capacitor chips 21. Next, another bracket assembly 1 is placed on top of the multiple capacitor chips 21. Then, the second assembly plate 62 is supported on the other bracket assembly 1, so that the other bracket assembly 1 is embedded in the second positioning groove 621, completing the assembly of the two bracket assemblies 1 and the capacitor chip assembly 2. After soldering, for small-sized bracket-type capacitor modules, the PTFE insulating sheet needs to be removed; for large-sized bracket-type capacitor modules, the PTFE insulating sheet is retained as a buffer layer.

[0029] Reference Figure 12 and Figure 13 As shown, the fixing mechanism 8 includes a fixing plate 81 located on the welding base 7, two fixing screws 82 spaced apart and extending upward on the welding base 7, spring pins 83 disposed on the fixing plate 81 opposite to the assembly fixture 6, and two locking members 84 that cooperate with the two fixing screws 82 to lock the fixing plate 81. Specifically, the welding base 7 is provided with a limiting groove 71 for placing the assembly fixture 6; the spring pins 83 are opposite to the limiting groove 71 to press the assembly fixture in the limiting groove 71. 6; The locking component 84 includes a locking nut 85 that mates with the fixing screw 82 and a wing nut 86 located above the locking nut 85 that mates with the fixing screw 82. The locking nut 85 is positioned at the bottom of the fixing plate 81, and the wing nut 86 is locked from top to bottom at the top of the fixing plate 81. Through the cooperation of the locking nut 85 and the wing nut 86, the position of the spring pin 83 in the vertical direction is adjusted to ensure that it presses against the assembly fixture 6 and ensures the quality of the welded bracket capacitor module.

[0030] In this embodiment, multiple spring ejector pins 83 and multiple limiting grooves 71 are provided to simultaneously weld the bracket group 1 and capacitor chip group 2 in multiple assembly fixtures 6, effectively improving production efficiency. Example 1

[0031] Reference Figure 1 As shown, one bracket group 1 includes two first brackets 3 arranged adjacent to each other, and the other bracket group 1 includes a second bracket 4; the capacitor chip group 2 includes two capacitor chips 21, and one end of the two capacitor chips 21 is respectively welded to the two first brackets 3, and the other end is welded to the second bracket 4.

[0032] In this embodiment, if a first bracket 3 and a second bracket 4 are selected as connection ports, the current flows through the capacitor chip 21 connected to the first bracket 3; if two first brackets 3 are selected as connection ports, the current flows through the two capacitor chips 21 in sequence. Example 2

[0033] Reference Figures 3 to 6 As shown, the support group 1 includes a first support 3 and a second support 4, and the two first supports 3 are staggered and opposite to each other in the two support groups 1; the capacitor chip group 2 includes three capacitor chips 21, which are arranged sequentially in the two support groups 1, and the end electrodes of the capacitor chips 21 are welded to the opposite first support 3 or second support 4.

[0034] This embodiment includes four connection ports, as shown in Figure ①, ②, ③, and ④. Current enters from the upper right of the figure downwards. (Refer to...) Figure 3 As shown, if ports ② and ④ are selected, current flows through capacitor chip 21 connected to the first bracket 3 indicated by ②; refer to Figure 4 As shown, if ports ① and ④ are selected, the current flows through the single capacitor chip 21 located in the middle; refer to... Figure 5 As shown, if ports ① and ② are selected, current flows through the two capacitor chips 21 connected to the second bracket 4 indicated by ④; refer to Figure 6 As shown, if ports ② and ③ are selected, the current will flow through the three capacitor chips 21 in sequence. Example 3

[0035] Reference Figures 7 to 10 As shown, one support group 1 includes two second supports 4, and the other support group 1 includes two first supports 3 and one second support 4, with the two first supports 3 located on both sides of the second support 4; two sets of capacitor chip groups 2 are provided, and the two sets of capacitor chip groups 2 are arranged vertically and vertically between the two support groups 1. The capacitor chip group 2 includes four capacitor chips 21 arranged at intervals, and the end electrodes of the capacitor chips 21 are welded to the opposite first support 3 or second support 4.

[0036] This embodiment includes five connection ports, as shown in Figure ①, ②, ③, ④, and ⑤. Current enters from the lower right side of the figure. (Refer to...) Figure 7 As shown, if ports ⑤ and ② are selected, the current flows through the two capacitor chips 21 arranged vertically and horizontally, which are connected to the first bracket 3 indicated by ⑤; refer to Figure 8 As shown, if ports ① and ④ are selected, the current flows through the two capacitor chips 21 arranged vertically and connected between the two second supports 4 indicated by ① and ④; refer to Figure 9 As shown, if ports ① and ⑤ are selected, the current flows through the six capacitor chips 21 that are connected to the first bracket 3 and the second bracket 4 indicated by ⑤ and ④ and are arranged vertically; refer to Figure 10 As shown, if ports ⑤ and ③ are selected, the current flows through the eight capacitor chips 21 arranged vertically.

[0037] The capacitor module structure defined in this invention eliminates reliance on printed circuit boards, using a bracket as the core supporting structure. It boasts advantages such as structural stability, excellent heat dissipation, and flexible expansion, simultaneously meeting the needs of high-voltage and high-capacity applications. It also effectively reduces parasitic parameters, improves the power density and long-term operational reliability of power electronic systems, and is suitable for filtering, energy storage, and resonant circuits in power electronics, new energy, and industrial power supply fields. Furthermore, the structure of the bracket-type capacitor module is further defined, consisting of at least one first bracket 3 and / or at least one second bracket 4 forming a bracket group 1. The first bracket 3 or the second bracket 4 can serve as a connection port. During operation, by selecting different positions of the first bracket 3 or the second bracket 4 as connection ports, the number of capacitor chips 21 connected in series in the capacitor module can be adjusted, achieving a stepped configuration of series capacitance and withstand voltage levels. The number of capacitor chip groups 2 connected in parallel in the vertical direction can also be flexibly increased or decreased according to target capacity requirements to meet different application scenarios.

[0038] The above description is merely a preferred embodiment of the present invention and should not be construed as limiting the scope of the present invention. All equivalent changes and modifications made in accordance with the scope of the present invention and the contents of the specification should still fall within the scope of the present invention.

Claims

1. A bracket-type capacitor module with configurable electrical parameters, characterized in that: This includes two support groups and a capacitor chip group that are positioned opposite each other; A support group includes at least one first support and / or at least one second support, wherein the first support is disposed adjacent to the first support or adjacent to the second support, and the total number of supports included in both support groups includes a plurality of first supports and at least one second support. A capacitor chip group includes a plurality of capacitor chips, which are spaced apart between a first support and a second support, or between two second supports or between two first supports. The first bracket is connected to the end electrode of a single capacitor chip in the capacitor chip group, the second bracket is connected to two adjacent capacitor chips, and a gap is provided between the first bracket and the adjacent first bracket or the adjacent second bracket.

2. A bracket-type capacitor module with configurable electrical parameters according to claim 1, characterized in that: The first bracket includes a first bracket body and a first connecting foot disposed at the lower end of the first bracket body. The second bracket includes a second bracket body and two second connecting feet disposed at a distance from the lower end of the second bracket body. The cross-section of the first bracket body is smaller than the cross-section of the second bracket body. The first bracket body is connected only to a single capacitor chip opposite to each other in the capacitor chip group. The second bracket body is connected to two capacitor chips arranged adjacent to each other.

3. A bracket-type capacitor module with configurable electrical parameters according to claim 2, characterized in that: The second bracket also includes a support foot disposed at the lower end of the second bracket body. The support foot is disposed between two second connecting feet and supported at the lower ends of two adjacent capacitor chips.

4. A bracket-type capacitor module with configurable electrical parameters according to claim 3, characterized in that: The height of the supporting leg is higher than the height of the second connecting leg.

5. A bracket-type capacitor module with configurable electrical parameters according to claim 2, characterized in that: The first connecting foot includes a first extension section connected to the lower end of the first bracket body and a first connecting section arranged perpendicularly to the lower end of the first extension section. The first extension section is a tapered structure that gradually narrows from top to bottom.

6. A bracket-type capacitor module with configurable electrical parameters according to claim 1, characterized in that: The support assembly also includes multiple isolation plates, which are disposed between two adjacent capacitor chips and extend to the gap at their ends.

7. A bracket-type capacitor module with configurable electrical parameters according to claim 1, characterized in that: Its preparation method specifically includes the following steps: Step 1: Clean the capacitor chip to remove the oxide layer on the surface of its terminal electrodes; Step 2: According to the assembly requirements, two bracket groups and capacitor chip groups are arranged sequentially in the assembly fixture. The connecting surfaces of the first bracket, the second bracket and the capacitor chip are coated with solder. Step 3: Place the assembled fixture on the welding base and lock it in place by the fixing mechanism. Then, send the welding base and the assembly fixture into the welding equipment to weld them together. After welding is completed, remove the assembly fixture to obtain the bracket capacitor module.

8. A bracket-type capacitor module with configurable electrical parameters according to claim 7, characterized in that: The assembly fixture includes a first assembly plate, a second assembly plate, and two positioning posts. The first assembly plate has a first positioning groove for the positioning bracket assembly and multiple first discharge holes communicating with the first positioning groove. The first discharge holes are used to discharge flux volatiles or air during the welding process. The second assembly plate is vertically opposite to the first assembly plate and has a second positioning groove opposite to the first positioning groove and multiple second discharge holes communicating with the second positioning groove. The multiple first discharge holes are opposite to the multiple second discharge holes. The two positioning posts are positioned opposite each other on the first assembly plate, and the second assembly plate has two clearance holes for the two positioning posts to pass through respectively. During assembly, one bracket assembly is first placed in the first positioning groove, and solder is applied to the inner surfaces of the first and second brackets. Then, multiple capacitor chips are placed sequentially on the bracket assembly, and a spacer is inserted between adjacent capacitor chips. Next, another bracket assembly is placed on top of the multiple capacitor chips, and the second assembly plate is supported on the other bracket assembly, so that the other bracket assembly is embedded in the second positioning groove, completing the assembly of the two bracket assemblies and the capacitor chip assembly.

9. A bracket-type capacitor module with configurable electrical parameters according to claim 7, characterized in that: The fixing mechanism includes a fixing plate located above the welding base, two fixing screws spaced apart on the welding base and extending upward, spring pins on the fixing plate opposite to the assembly fixture, and two locking parts that cooperate with the two fixing screws to lock the fixing plate.

10. A bracket-type capacitor module with configurable electrical parameters according to claim 9, characterized in that: The welding base is provided with a limiting groove for placing the assembly fixture. The spring pin is opposite to the limiting groove. The locking component includes a locking nut that cooperates with the fixing screw and a wing nut located above the locking nut that cooperates with the fixing screw. The locking nut is limited at the bottom of the fixing plate, and the wing nut is locked from top to bottom at the top of the fixing plate.

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