A ceramic capacitor loading, sintering and unloading integrated device and method

Abstract

The present application relates to ceramic capacitor production technical field, provide a kind of ceramic capacitor feeding, sintering, discharging integrated equipment and method, including feeding machine, sintering furnace, discharging machine;Feeding machine includes bearing net conveying device, chip green body scattering device, bearing net supply device, cover net supply device, first feeding net plate handling device, second feeding net plate handling device, feeding net plate conveying device;Discharging machine includes discharging net plate conveying device, bearing net clamping turnover device, chip porcelain body collecting device, cover net recovery device, bearing net recovery device, first discharging net plate handling device, second discharging net plate handling device, chip porcelain body discharge screening device.Advantages: improve production efficiency, replace manual work by machine, automatically handle bearing net and carry out the feeding and discharging of sintering furnace and pour off ceramic capacitor chip porcelain body from bearing net;High degree of automation, reduce manual operation and reduce labor intensity during the sintering feeding and discharging of ceramic capacitor.

Description

Technical Field

[0001] This invention relates to the field of ceramic capacitor production technology, specifically to an integrated equipment and method for feeding, sintering, and unloading ceramic capacitors. Background Technology

[0002] Ceramic capacitors are a general term for capacitors that use ceramic materials as the dielectric. Multilayer ceramic capacitors (MLCCs), also known as chip capacitors, multilayer capacitors, or stacked capacitors, are a type of ceramic capacitor. MLCCs are characterized by their small size, large capacitance, low loss rate at high frequencies, suitability for mass production, low cost, and high stability. The manufacturing process of multilayer ceramic capacitors (MLCCs) includes: raw material preparation, casting, printing, stacking, lamination, cutting, glue removal, sintering, chamfering, electrode coating, electroplating, testing, and sorting.

[0003] The internal electrode fabrication of multilayer ceramic capacitors (MLCCs) utilizes the principle of screen printing. Internal electrode patterns of a specific shape and size are printed onto a cast dielectric ceramic film. These patterns are then formed using a staggered, stacked method to create the internal electrode structure, resulting in a block. After isostatic pressing (under specific temperature and pressure), the bonding between the block layers is further strengthened. The laminated blocks are then trimmed and glued, and cut into ceramic capacitor chip blanks of the designed dimensions using a cutting technique. After glue removal, the ceramic capacitor chip blanks enter a sintering furnace, where they are sintered into a ceramic capacitor chip body. Within this ceramic capacitor chip body, the ceramic dielectric and internal electrodes are sintered into a dense monolithic structure.

[0004] In the traditional sintering production stage, the firing mesh is usually manually moved to the spreading area. A spreading device then spreads a large number of ceramic capacitor chip green blanks to be sintered onto the firing mesh. The firing mesh is then manually moved to a conveyor for feeding, and the conveyor sends the firing mesh into the sintering furnace. After sintering, the ceramic capacitor chip green blanks become ceramic capacitor chip bodies. The firing mesh leaves the sintering furnace and, after cooling, is manually removed for unloading. The firing mesh is then moved above the receiving box, and the ceramic capacitor chip bodies are manually poured off the firing mesh and fall into the receiving box.

[0005] However, manually handling the sintering mesh for loading and unloading the sintering furnace and removing the ceramic capacitor chip bodies from the sintering mesh is cumbersome and inefficient. Therefore, in order to improve production efficiency, a machine is urgently needed to replace manual labor and automatically handle the sintering mesh for loading and unloading the sintering furnace and removing the ceramic capacitor chip bodies from the sintering mesh. This technical field urgently needs an integrated equipment and method for loading, sintering, and unloading ceramic capacitors. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to provide an integrated equipment and method for feeding, sintering and unloading ceramic capacitors.

[0007] The technical solution of the present invention is implemented as follows: an integrated equipment for feeding, sintering and unloading ceramic capacitors, characterized in that it includes a feeding machine, a sintering furnace and an unloading machine; The feeding machine includes a firing mesh conveying device, a chip blank spreading device, a firing mesh supply device, a cover mesh supply device, a first feeding mesh plate handling device, a second feeding mesh plate handling device, and a feeding mesh plate conveying device. The firing mesh conveying device is located between the chip blank spreading device and the feeding mesh plate conveying device. The first feeding mesh plate handling device is located between the firing mesh supply device and the firing mesh conveying device. The second feeding mesh plate handling device is located between the cover mesh supply device and the feeding mesh plate conveying device. The feeding machine includes a feeding screen conveying device, a firing screen clamping and turning device, a chip ceramic body receiving device, a cover screen recycling device, a firing screen recycling device, a first feeding screen conveying device, a second feeding screen conveying device, and a chip ceramic body discharge screening device. The chip ceramic body receiving device is located between the feeding screen conveying device and the firing screen clamping and turning device. The first feeding screen conveying device is located between the feeding screen conveying device and the firing screen recycling device. The second feeding screen conveying device is located between the feeding screen conveying device and the cover screen recycling device. The chip ceramic body discharge screening device is located below the chip ceramic body receiving device. The feed inlet of the sintering furnace is connected to the discharge outlet of the feeding mesh conveyor, and the discharge outlet of the sintering furnace is connected to the feed inlet of the unloading mesh conveyor.

[0008] A method for feeding, sintering, and unloading ceramic capacitors, using an integrated ceramic capacitor feeding, sintering, and unloading device, includes the following steps: Step 1: The first feeding screen conveying device picks up the burning screen from the burning screen supply device and then transports the burning screen to the burning screen conveying device. Step 2: The firing mesh conveying device moves the firing mesh toward the spreading area of ​​the chip blank spreading device; Step 3: The chip blank spreading device spreads the ceramic capacitor chip blanks onto the firing mesh, while the firing mesh conveying device gradually moves the firing mesh away from the chip blank spreading device. Step 4: After the material spreading is completed, the chip blank spreading device stops spreading the material, and the firing mesh conveying device moves the firing mesh toward the feeding mesh conveying device; Step 5: The first feeding mesh conveying device picks up the firing mesh from the firing mesh conveying device and then transports the firing mesh to the feeding mesh conveying device. Then, the second feeding mesh conveying device picks up the cover mesh from the cover mesh supply device, transports the cover mesh to the feeding mesh conveying device, and places the cover mesh on the firing mesh. The cover mesh and the firing mesh form a combined mesh plate. Step 6: The feeding mesh conveyor sends the combined mesh into the sintering furnace. The ceramic capacitor chip green blank is sintered into the ceramic capacitor chip body. The combined mesh then enters the unloading mesh conveyor from the sintering furnace. Step 7: The feeding screen conveyor moves the combined screen towards the chip ceramic body receiving device; Step 8: The second feeding screen conveying device picks up the cover screen from the combined screen, the cover screen is separated from the burning screen, and then the cover screen is transported to the cover screen recycling device; Step 9: The firing mesh clamping and flipping device first clamps the firing mesh from the feeding mesh conveyor device, then pulls the firing mesh out to the top of the chip ceramic body receiving device, flips the firing mesh, and the ceramic capacitor chip ceramic body falls from the firing mesh to the chip ceramic body receiving device. The firing mesh clamping and flipping device flips the firing mesh in the opposite direction, pushes the firing mesh back to the feeding mesh conveying device, and then releases the firing mesh. Step 10: The ceramic capacitor chip body falls from the chip body receiving device to the chip body discharge screening device. The first feeding screen conveying device picks up the burning screen from the feeding screen conveying device and then transports the burning screen to the burning screen recycling device.

[0009] Compared with the prior art, the beneficial effects or advantages of the present invention are: improved production efficiency, with machines replacing manual labor, automatically handling the firing mesh for loading and unloading the sintering furnace and removing the ceramic capacitor chip bodies from the firing mesh; the loading machine automatically picks up and places the firing mesh through corresponding devices, sprinkles the ceramic capacitor chip green bodies onto the firing mesh, places the cover mesh on the firing mesh to obtain a combined mesh plate, and then sends the combined mesh plate into the sintering furnace, where the cover mesh plays a protective role during sintering; the combined mesh plate from the sintering furnace enters the unloading machine, which automatically recovers the cover mesh through corresponding devices, clamps the firing mesh and flips it, removing the ceramic capacitor chip bodies from the firing mesh, automatically recovers the firing mesh, and collects and screens the ceramic capacitor chip bodies, quickly obtaining high-quality products; the present invention has a high degree of automation, reducing manual operation and labor intensity during the sintering and loading / unloading process of ceramic capacitors. Attached Figure Description

[0010] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0011] Figure 1 This is a schematic plan view of the structure of an integrated ceramic capacitor feeding, sintering, and unloading device according to the present invention.

[0012] Figure 2 This is a three-dimensional schematic diagram of the feeding machine of the present invention.

[0013] Figure 3 This is a schematic plan view of the feeding machine of the present invention.

[0014] Figure 4 This is a schematic diagram showing the positions of the chip blank spreading device, the firing mesh conveying device, and the feeding mesh conveying device of the present invention.

[0015] Figure 5 This is a three-dimensional schematic diagram of the structure of the wire mesh conveying device of the present invention.

[0016] Figure 6 This is a schematic diagram of the present invention, showing the ceramic capacitor chip blanks being spread on a firing mesh.

[0017] Figure 7 This is a three-dimensional structural schematic diagram of the wire mesh supply device of the present invention. Figure 1 .

[0018] Figure 8 This is a three-dimensional structural schematic diagram of the wire mesh supply device of the present invention. Figure 2 .

[0019] Figure 9 This is a three-dimensional schematic diagram of the feeding mesh conveyor device of the present invention.

[0020] Figure 10 This is a schematic plan view of the structure of the first feeding screen conveying device of the present invention.

[0021] Figure 11 This is a three-dimensional schematic diagram of the feeding machine of the present invention.

[0022] Figure 12 This is a schematic plan view of the material feeding machine of the present invention.

[0023] Figure 13 This is a schematic diagram showing the positions of the feeding mesh conveying device, the chip ceramic body receiving device, and the firing mesh clamping and flipping device of the present invention.

[0024] Figure 14 This is a three-dimensional schematic diagram of the material feeding mesh conveyor device of the present invention.

[0025] Figure 15 This is a three-dimensional schematic diagram of the structure of the stencil correction component of the present invention.

[0026] Figure 16This is a three-dimensional structural schematic of the wire mesh clamping and flipping device of the present invention. Figure 1 .

[0027] Figure 17 This is a three-dimensional structural schematic of the wire mesh clamping and flipping device of the present invention. Figure 2 .

[0028] Figure 18 This is a three-dimensional schematic diagram of the chip ceramic body receiving device of the present invention.

[0029] Figure 19 This is a schematic diagram of the firing mesh of the present invention being flipped and then touched by the striking rod.

[0030] Figure 20 This is a three-dimensional schematic diagram of the chip ceramic body output screening device of the present invention.

[0031] Figure 21 This is a schematic diagram of the screen, first inclined material channel, second inclined material channel and third inclined material channel of the present invention inside the screening shell.

[0032] Figure 22 This is a three-dimensional schematic diagram of the structure of the firing mesh of the present invention.

[0033] Figure 23 This is a schematic plan view of the structure of the combined mesh plate of the present invention.

[0034] Reference numerals: 1. Feeding machine; 11. Firing mesh conveying device; 111. Firing mesh tray; 111. Firing mesh limiting block; 1111. Conveying block; 112. Guide rail; 113. Displacement adjustment assembly; 114. Weighing sensor; 115. Spreading position sensor; 116. Feeding position sensor; 117. Chip blank spreading device; 12. Spreading base; 121. Support rod; 122. Feeding box; 123. Material channel; 124. Spreading vibrator; 125. Firing mesh supply device; 13. Supply base; 131. Push-pull hopper; 132. Hopper bottom plate; 1321. Mesh plate limiting fixture; 1322. Mesh plate support block; 1323. Top plate; 133. Supply lifting drive assembly 134; First mesh plate detection sensor 135; Second mesh plate detection sensor 136; Upright pole 137; Hopper limiting block 138; Cover mesh supply device 14; First feeding mesh plate handling device 15; Handling base 151; Spatial movement assembly 152; Robotic arm base plate 153; Suction cup 154; Second feeding mesh plate handling device 16; Feeding mesh plate conveying device 17; Feeding assembly line base 171; Synchronous belt conveyor assembly 172; Mesh plate assembly block 173; Assembly lifting drive assembly 174; Guide plate 175; Feeding frame 18; Sintering furnace 2; Bearing 21. Burning mesh; 211. Positioning protrusion; 22. Cover mesh; 23. Ceramic capacitor chip green body; 24. Ceramic capacitor chip ceramic body; 3. Feeding machine; 31. Feeding mesh conveyor device; 311. Feeding production line base; 312. Roller conveyor assembly; 3121. Baffle clearance groove; 313. Mesh limiting assembly; 3131. Limiting support; 3132. Limiting stop bar; 3133. Limiting lifting driver; 314. First mesh correction assembly; 3141. Correction support; 3142. Correction shaft; 3143. Correction baffle; 3144. Angle driver; 3144. Second mesh correction assembly; 315. Third mesh correction assembly. Component 316; Firing mesh clamping and turning device 32; Gripper 321; Clamping drive assembly 322; Clamping base 323; Telescopic drive assembly 324; Telescopic base 325; Turning shaft 326; Turning drive assembly 327; Turning base 328; Auxiliary shaft 329; Arc-shaped rack 3210; Planetary gear 3220; Induction plate 3230; Initial position sensor 3240; Material collection position sensor 3250; Chip ceramic body collecting device 33; Hopper 331; Striking mounting rod 332; Striking rod 333; Buffer plate 334; Material gap 3341; Vibrator 3 35; Cover mesh recycling device; 34; Firing mesh recycling device; 35; First feeding mesh plate conveying device; 36; Second feeding mesh plate conveying device; 37; Chip ceramic body discharge screening device; 38; Collection box; 381; Screening shell; 382; First inclined channel; 3821; Second inclined channel; 3822; Third inclined channel; 3823; Triangular diverter block; 3824; Screen; 383; Small-size mesh area; 3831; Qualified-size mesh area; 3832; Flattening area; 3833; Screening vibrator; 384; Screening base; 385; Small-size defective product collection box; 386; First feeding pipeline; 3861;Good product collection box 387; Second feeding pipe 3871; Large-size defective product collection box 388; Third feeding pipe 3881; Unloading frame 39. Detailed Implementation

[0035] This invention provides an integrated device and method for feeding, sintering, and unloading ceramic capacitors. The overall concept of the technical solution is as follows: In the preparation stage, workers add the ceramic capacitor chip blanks to be sintered, the firing mesh, and the cover mesh to the feeding machine; the equipment is started for automatic production, the feeding machine automatically picks up, places, and transports the firing mesh, the firing mesh reaches the spreading area, and the ceramic capacitor chip blanks to be sintered are spread on the firing mesh, then the cover mesh is placed on the firing mesh to obtain a combined mesh plate, which is sent to the conveying device of the sintering furnace; the ceramic capacitor chip blanks in the combined mesh plate are sintered into ceramic capacitor chip bodies, and the conveying device of the sintering furnace transfers the combined mesh plate to the unloading machine; the unloading machine automatically recovers the cover mesh, clamps the firing mesh and flips it, pouring the ceramic capacitor chip bodies off the firing mesh, then automatically recovers the firing mesh and collects the fallen ceramic capacitor chip bodies, and sorts them according to the size differences of the ceramic capacitor chip bodies to distinguish between good and bad products. Finally, the staff removed the screened ceramic capacitor chip bodies from the feeding machine and took away the recycled cover screen and firing screen.

[0036] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0037] See Figures 1 to 23 The preferred embodiment of the present invention. An integrated device for feeding, sintering and unloading ceramic capacitors, comprising a feeder 1, a sintering furnace 2, and an unloading machine 3; The feeding machine 1 includes a firing mesh conveying device 11, a chip blank spreading device 12, a firing mesh supply device 13, a cover mesh supply device 14, a first feeding mesh plate handling device 15, a second feeding mesh plate handling device 16, and a feeding mesh plate conveying device 17. The firing mesh conveying device 11 is located between the chip blank spreading device 12 and the feeding mesh plate conveying device 17. The first feeding mesh plate handling device 15 is located between the firing mesh supply device 13 and the firing mesh conveying device 11. The second feeding mesh plate handling device 16 is located between the cover mesh supply device 14 and the feeding mesh plate conveying device 17. The feeding machine 3 includes a feeding screen conveying device 31, a firing screen clamping and turning device 32, a chip ceramic body receiving device 33, a cover screen recycling device 34, a firing screen recycling device 35, a first feeding screen conveying device 36, a second feeding screen conveying device 37, and a chip ceramic body discharge screening device 38. The chip ceramic body receiving device 33 is located between the feeding screen conveying device 31 and the firing screen clamping and turning device 32. The first feeding screen conveying device 36 is located between the feeding screen conveying device 31 and the firing screen recycling device 35. The second feeding screen conveying device 37 is located between the feeding screen conveying device 31 and the cover screen recycling device 34. The chip ceramic body discharge screening device 38 is located below the chip ceramic body receiving device 33. The feed inlet of the sintering furnace 2 is connected to the discharge outlet of the feeding mesh conveyor 17, and the discharge outlet of the sintering furnace 2 is connected to the feed inlet of the unloading mesh conveyor 31.

[0038] The beneficial effects or advantages of this invention are: improved production efficiency, with machines replacing manual labor, automatically handling the firing mesh 21 for loading and unloading the sintering furnace 2 and removing the ceramic capacitor chip body 24 from the firing mesh 21; the loading machine 1 automatically picks up and places the firing mesh 21 through a corresponding device, sprinkles the ceramic capacitor chip green body 23 onto the firing mesh 21, places the cover mesh 22 on the firing mesh 21 to obtain a combined mesh plate, and then sends the combined mesh plate into the sintering furnace 2, where the cover mesh 22 plays a protective role during sintering; the combined mesh plate coming out of the sintering furnace 2 enters the unloading machine 3, which automatically recovers the cover mesh 22 through a corresponding device, clamps the firing mesh 21 and flips it, removing the ceramic capacitor chip body 24 from the firing mesh 21, automatically recovers the firing mesh 21, collects and screens the ceramic capacitor chip body 24, and quickly obtains good products; this invention has a high degree of automation, reducing manual operation and labor intensity during the sintering and loading / unloading process of ceramic capacitors.

[0039] The function of the cover mesh 22 is to cover the product to prevent the product from shifting due to temperature changes or airflow during sintering, and to block possible dust or impurities from falling onto the product surface.

[0040] Furthermore, the wire mesh conveying device 11 includes a wire mesh tray 111, a conveying block 112, a guide rail 113, and a displacement adjustment component 114. The guide rail 113 is fixedly connected to the feeding frame 18. The bottom of the conveying block 112 is connected to the guide rail 113 through the displacement adjustment component 114. The wire mesh tray 111 is fixedly connected to the top of the conveying block 112. The chip blank feeding device 12 is located in front of the guide rail 113, and the feeding mesh conveyor device 17 is located behind the guide rail 113.

[0041] The beneficial effects of this technical solution are as follows: the firing tray 111 moves along the guide rail 113 between the chip blank spreading device 12 and the feeding screen conveyor 17; the displacement adjustment component 114 provides power to change the position of the firing tray 111, and the firing tray 111 also passes through the transport areas of the first feeding screen conveyor 15 and the second feeding screen conveyor 16, which helps to improve the stability of the firing tray during movement. The displacement adjustment component 114 uses a linear motor from the prior art.

[0042] More specifically, the fire-supporting mesh conveying device 11 also includes a weighing sensor 115, which is disposed between the fire-supporting mesh tray 111 and the conveying block 112.

[0043] The beneficial effects of this technical solution are as follows: The weighing sensor 115 detects the weight change of the firing mesh tray 111 in real time and feeds the weight signal back to the feeding control device of the feeding machine 1. When an empty firing mesh is placed on the firing mesh tray 111, the feeding control device of the feeding machine 1 moves the firing mesh tray 111 toward the chip blank spreading device 12 through the displacement adjustment component 114. When the firing mesh 21 is receiving the ceramic capacitor chip blank 23, the weighing sensor 115 detects that the weight of the firing mesh tray 111 gradually increases. After the spreading is completed, the displacement adjustment component 114 moves the firing mesh tray 111 toward the feeding mesh plate conveying device 17. This effectively prevents the empty firing mesh from getting close to the feeding mesh plate conveying device 17.

[0044] More specifically, the wire mesh conveying device 11 also includes a material spreading position sensor 116 and a material feeding position sensor 117. The material spreading position sensor 116 and the material feeding position sensor 117 are respectively installed at the front end and the rear end of the guide rail 113. The material spreading position sensor 116 and the material feeding position sensor 117 are both used to detect the conveying block 112. The material spreading position sensor 116 and the material feeding position sensor 117 are both electrically connected to the displacement adjustment component 114.

[0045] The beneficial effects of this technical solution are: it helps the firing mesh tray 111 to accurately stop at the spreading or feeding position. The firing mesh tray 111 and the conveying block 112 move along the guide rail 113. When the spreading position sensor 116 detects the conveying block 112, it sends a feedback signal to the displacement adjustment component 114, which then stops the conveying block 112 and the firing mesh tray 111 in the spreading area of ​​the chip blank spreading device 12. When the feeding position sensor 117 detects the conveying block 112, it sends a feedback signal to the displacement adjustment component 114, which then stops the conveying block 112 and the firing mesh tray 111 in the feeding area of ​​the feeding mesh conveyor 17. Both the spreading position sensor 116 and the feeding position sensor 117 are photoelectric sensors; the conveying block 116 has a sensing element for cooperating with the photoelectric sensors.

[0046] More specifically, the burning mesh tray 111 is cross-shaped, and the front end, rear end, left end and right end of the burning mesh tray 111 are all equipped with burning mesh limiting blocks 1111.

[0047] The beneficial effects of this technical solution are: the four limiting blocks 1111 of the firing mesh effectively prevent the firing mesh 21 from deviating in position during movement.

[0048] More specifically, the chip blank spreading device 12 includes a spreading base 121, a support rod 122, a feeding box 123, a feeding channel 124, and a spreading vibrator 125. The spreading base 121 is fixedly connected to the feeding frame 18. The lower end of the support rod 122 is fixedly connected to the spreading base 121, and the upper end of the support rod 122 is fixedly connected to the feeding box 123. The feeding channel 124 is connected to the spreading base 121 through the spreading vibrator 125. The inlet of the feeding channel 124 is located below the outlet of the feeding box 123, and the burning mesh tray 111 is located below the outlet of the feeding channel 124.

[0049] The beneficial effects of this technical solution are as follows: The feeding box 123 is used to place the ceramic capacitor chip green blank 23 to be sintered; the first feeding screen conveying device 15 first places the sintering screen 21 on the sintering screen tray 111, and the displacement adjustment component 114 moves the sintering screen tray 111 below the discharge port of the material channel 124; under the action of the spreading vibrator 125, the ceramic capacitor chip green blank 23 gradually falls from the feeding box 123 through the material channel 124 and then onto the sintering screen 21, while the sintering screen 21 gradually moves backward, so that the ceramic capacitor chip green blank 23 is evenly spread on the sintering screen 21. After the spreading is completed, the sintering screen tray 111 moves towards the feeding screen conveying device 17.

[0050] The working principle of the chip blank spreading device 12 can be found in the utility model patent document "A uniform spreading mechanism for ceramic capacitors" (announcement number CN223385491U).

[0051] Furthermore, the wire mesh supply device 13 includes a supply base 131, a push-pull hopper 132, a top plate 133, and a supply lifting drive assembly 134. The supply base 131 is fixedly connected to the feeding frame 18, the push-pull hopper 132 is slidably connected to the supply base 131, and the top plate 133 is connected to the feeding frame 18 through the supply lifting drive assembly 134. The supply base 131 is provided with a first opening, the bottom of the push-pull hopper 132 is provided with a second opening, and the top plate 133 can pass through the first opening and the second opening.

[0052] The beneficial effects of this technical solution are as follows: Workers place the stacked wire mesh 21 into the push-pull hopper 132, then install the push-pull hopper 132 onto the supply base 131. The supply lifting drive assembly 134 moves the top plate 133 upwards, and the top plate 133 passes through the first and second openings, gradually lifting the stacked wire mesh. Each time the first feeding wire mesh transport device 15 removes the topmost wire mesh from the push-pull hopper 132, the top plate 133 performs a lifting action, which helps the stacked wire meshes in the push-pull hopper 132 rise one by one and then be stably removed by the first feeding wire mesh transport device 15. When the push-pull hopper 132 is empty, the supply lifting drive assembly 134 lowers the top plate 133 back to its initial position.

[0053] The sliding connection between the push-pull hopper 132 and the supply base 131 is similar to that of a drawer structure. When the push-pull hopper 132 is empty, the operator pulls it out from the supply base 131, replenishes it with stacked fire-supporting mesh, and then pushes it back into the supply base 131. The supply lifting drive assembly 134 mainly consists of a servo motor and a ball screw, both based on existing technology.

[0054] More specifically, the wire mesh supply device 13 further includes a first wire mesh detection sensor 135, a second wire mesh detection sensor 136, and a vertical pole 137. The first wire mesh detection sensor 135 is connected to the supply base 131 through the vertical pole 137. The first wire mesh detection sensor 135 is also located above the push-pull hopper 132. The second wire mesh detection sensor 136 is installed on the top material plate 133. Both the first wire mesh detection sensor 135 and the second wire mesh detection sensor 136 are electrically connected to the supply lifting drive assembly 134.

[0055] The beneficial effects of this technical solution are as follows: When the first mesh plate detection sensor 135 does not detect the firing mesh, the supply lifting drive assembly 134 causes the top plate 133 to rise, thereby raising the position of the stacked firing mesh; when the first mesh plate detection sensor 135 detects the firing mesh, the top plate 133 stops rising, making it easier for the first feeding mesh plate handling device 15 to remove the topmost firing mesh; when the second mesh plate detection sensor 136 detects the firing mesh, it indicates that there is still a firing mesh above the top plate 133; when the second mesh plate detection sensor 136 does not detect the firing mesh, it indicates that the push-pull hopper 132 becomes empty, and the second mesh plate detection sensor 136 sends a signal to the supply lifting drive assembly 134, which lowers the top plate 133 to its initial position, allowing the operator to prepare for refilling. The first mesh plate detection sensor 135 is a through-beam photoelectric sensor; the second mesh plate detection sensor 136 is a reflective photoelectric sensor.

[0056] More specifically, the push-pull hopper 132 includes a hopper bottom plate 1321, a mesh plate limiting fixture 1322, and a mesh plate support block 1323. The hopper bottom plate 1321 is slidably connected to the supply base 131 in the horizontal direction. The hopper bottom plate 1321 is provided with a second opening. The mesh plate limiting fixture 1322 is fixedly connected to the hopper bottom plate 1321. The mesh plate support block 1323 covers the second opening and is slidably connected to the mesh plate limiting fixture 1322 in the vertical direction. The mesh plate support block 1323 is provided with a light-transmitting hole. The top plate 133 can lift the mesh plate support block 1323. The second mesh plate detection sensor 136 is aligned with the light-transmitting hole.

[0057] The beneficial effects of this technical solution are as follows: the stacked wire mesh is placed on the wire mesh support block 1323, and the wire mesh limiting fixture 1322 helps the wire mesh and the wire mesh support block to rise stably, preventing the wire mesh from shifting in the horizontal direction; compared with the top plate 133, the surface area of ​​the wire mesh support block 1323 is the same as that of the wire mesh 21, but the thickness of the wire mesh support block 1323 is greater than that of the wire mesh 21, effectively preventing the top plate 133 from touching the wire mesh 21 and causing damage; the second wire mesh detection sensor 136 detects from the light-transmitting hole whether there is still a wire mesh 21 above the wire mesh support block 1323.

[0058] More specifically, the firing mesh supply device 13 also includes a hopper limiting block 138, which is fixedly connected to the supply base 131.

[0059] The beneficial effects of this technical solution are as follows: When the push-pull hopper 132 contacts the hopper limit block 138, it indicates that the push-pull hopper 132 is installed in place. At this time, the first port of the supply base 131 is aligned with the second port of the push-pull hopper 132, and the top plate 133 can pass smoothly through the first port and the second port, which makes it easier for the staff to judge the installation status.

[0060] More specifically, the first feeding screen conveying device 15 includes a conveying base 151, a spatial movement component 152, a robotic arm base plate 153, and a suction cup 154. The conveying base 151 is fixedly connected to the feeding frame 18, the robotic arm base plate 153 is connected to the conveying base 151 through the spatial movement component 152, and the suction cup 154 ​​is fixedly connected to the robotic arm base plate 153.

[0061] The beneficial effects of this technical solution are as follows: The suction cup 154 ​​uses vacuum technology to hold the firing mesh 21, and the robotic arm base plate 153, driven by the spatial movement component 152, transports the firing mesh 21. The robotic arm base plate 153 is equipped with multiple suction cups 154, which are positioned around the periphery of the firing mesh 21. The spatial movement component 152 employs the existing robotic arm handling principle, enabling the robotic arm base plate 153 to move in the XYZ directions.

[0062] The structure of the cover mesh supply device 14 is the same as that of the bearing mesh supply device 13. The structure of the second feeding mesh plate handling device 16 is the same as that of the first feeding mesh plate handling device 15.

[0063] Further, the feeding mesh conveyor device 17 includes a feeding assembly line base 171, a synchronous belt conveyor assembly 172, a mesh assembly block 173, an assembly lifting drive assembly 174, and a guide plate 175. The feeding assembly line base 171 is fixedly connected to the feeding frame 18. The synchronous belt conveyor assembly 172 is fixedly connected to the feeding assembly line base 171. The mesh assembly block 173 is connected to the feeding assembly line base 171 through the assembly lifting drive assembly 174. The mesh assembly block 173 is located between the two synchronous belt conveyor assemblies 172. The guide plate 175 is fixedly connected to the feeding assembly line base 171. The two guide plates 175 are respectively located on the outer sides of the two synchronous belt conveyor assemblies 172. The feed inlet of the synchronous belt conveyor assembly 172 is aligned with the guide rail 113, and the discharge outlet of the synchronous belt conveyor assembly 172 is connected to the feed inlet of the sintering furnace 2.

[0064] The beneficial effects of this technical solution are as follows: The assembly lifting drive component 174 first raises the mesh plate assembly block 173, which is higher than the synchronous belt conveyor component 172. The first feeding mesh plate handling device 15 picks up the firing mesh 21 with ceramic capacitor chip blanks 23 from the firing mesh tray 111 and places it on the mesh plate assembly block 173. The second feeding mesh plate handling device 16 picks up the cover mesh 22 from the cover mesh supply device 14 and moves it above the mesh plate assembly block 173. Then, the cover mesh 22 is placed on the firing mesh 21, at which point the cover mesh 22 and the firing mesh 21 form a combined mesh plate. The assembly lifting drive component 174 then lowers the mesh plate assembly block 173, which is lower than the synchronous belt conveyor component 172. The combined mesh plate is then placed on the synchronous belt conveyor component 172.

[0065] Synchronous belt conveyor 172 delivers the combined mesh plate to the sintering furnace 2; guide plate 175 prevents the combined mesh plate from deviating from its position. The assembly lifting drive assembly 174 uses a telescopic cylinder, a technology already in use. Synchronous belt conveyor 172 is a conventional conveyor assembly. While synchronous belt conveyor 172 is conveying the current combined mesh plate, the mesh plate assembly block 173 rises to receive the next sintering mesh and cover mesh; this assembly process of the sintering mesh and cover mesh is prevented from being interfered with by synchronous belt conveyor 172.

[0066] More specifically, the upper surface edge of the heat-receiving mesh 21 has a positioning protrusion 211, and the lower surface edge of the cover mesh 22 has a positioning groove, with the positioning protrusion 211 paired with the positioning groove.

[0067] The beneficial effects of this technical solution are: the positioning protrusion inserted into the positioning groove helps the cover mesh 22 and the bearing mesh 21 to move simultaneously.

[0068] Furthermore, the feeding screen conveyor 31 includes a feeding assembly line base 311, a roller conveyor assembly 312, a screen limiting assembly 313, and a screen correction assembly. The feeding assembly line base 311 is fixedly connected to the feeding frame 39, and the roller conveyor assembly 312 is fixedly connected to the feeding assembly line base 311. The mesh plate limiting assembly 313 includes a limiting support 3131, a limiting stop bar 3132, and a limiting lifting driver 3133. The limiting support 3131 is fixedly connected to the unloading assembly line base 311, and the limiting stop bar 3132 is connected to the limiting support 3131 through the limiting lifting driver 3133. The screen correction assembly includes a correction support 3141, a correction shaft 3142, a correction baffle 3143, and a corner driver 3144. The correction support 3141 is fixedly connected to the feeding line base 311. The correction shaft 3142 is connected to the correction support 3141 through the corner driver 3144. The correction baffle 3143 is fixedly connected to the shaft of the correction shaft 3142. The correction shaft 3142 is located above the roller conveyor assembly 312. The roller conveyor assembly 312 is provided with a baffle clearance groove 3121. There are three screen correction assemblies, namely a first screen correction assembly 314, a second screen correction assembly 315, and a third screen correction assembly 316. Along the conveying direction of the roller conveyor assembly 312, the first screen correction assembly 314, the second screen correction assembly 315, the third screen correction assembly 316, and the screen limiting assembly 313 are arranged sequentially. The area between the first screen correction assembly 314 and the second screen correction assembly 315 is the cover screen gripping area, and the area between the third screen correction assembly 316 and the screen limiting assembly 313 is the sintering screen gripping area. The screen limiting assembly 313 is located at the discharge port of the roller conveyor assembly 312, and the inlet of the roller conveyor assembly 312 is connected to the discharge port of the sintering furnace 2.

[0069] The beneficial effects of this technical solution are as follows: the combined mesh plate coming out of the sintering furnace 2 enters the roller conveyor assembly 312, and the roller conveyor assembly 312 moves the combined mesh plate towards the chip ceramic receiving device 33. With the cooperation of the mesh plate correction assembly and the mesh plate limiting assembly, the combined mesh plate passes through the cover mesh grabbing area and the firing mesh grabbing area in an orderly manner.

[0070] In the screen correction assembly, when the angle driver 3144 causes the correction shaft 3142 to rotate in the forward direction, and the correction baffle 3143 changes from a horizontal to a vertical state, the correction baffle 3143 prevents the combined screen from moving. When the angle driver 3144 causes the correction shaft 3142 to rotate in the reverse direction, and the correction baffle 3143 returns to a horizontal state, the correction baffle 3143 is higher than the combined screen, and at this time the combined screen moves under the action of the roller conveyor assembly 312. The angle driver 3144 uses a conventional angle cylinder.

[0071] In the mesh limiting assembly 313, when the limiting lifting driver 3133 raises the limiting stop 3132, the limiting stop 3132 prevents the burning mesh 21 from moving. When the limiting lifting driver 3133 lowers the limiting stop 3132, the burning mesh 21 can leave the discharge port of the roller conveyor assembly 312. The limiting lifting driver 3133 uses a telescopic cylinder of existing technology.

[0072] The roller conveyor assembly 312 is equipped with multiple corresponding position sensors to detect changes in the position of the combined mesh plates. The roller conveyor assembly 312 ensures that the combined mesh plates pass through the cover mesh grabbing area and the firing mesh grabbing area in an orderly manner. The combined mesh plates enter the roller conveyor assembly 312 in sequence. When there is a previous combined mesh plate in the cover mesh grabbing area, the current combined mesh plate temporarily stops before the first mesh plate correction assembly 314. When the cover mesh grabbing area is empty, the correction baffle of the first mesh plate correction assembly 314 becomes horizontal, and the correction baffle of the second mesh plate correction assembly 315 becomes vertical. The combined mesh plate then moves to the cover mesh grabbing area. Then, the correction baffle of the second mesh plate correction assembly 315 blocks the combined mesh plate, and the correction baffle of the first mesh plate correction assembly 314 becomes vertical again. At this time, the second unloading mesh plate transport device 37 removes the cover mesh 22 from the combined mesh plate. The cover mesh 22 separates from the firing mesh 21 and is then transported to the cover mesh recycling device 34. When the previous mesh 21 is present in the mesh-holding area or the mesh-holding and flipping device is holding a mesh, the mesh in the cover mesh-holding area remains stationary. When the mesh-holding area is empty and the mesh-holding and flipping device 32 is not holding a mesh, the correction baffles of the second mesh plate correction assembly 315 and the third mesh plate correction assembly 316 become horizontal, the limit bar of the mesh plate limit assembly 313 rises, and the mesh moves from the cover mesh-holding area to the mesh-holding area. The correction baffle of the third mesh plate correction assembly 316 then becomes straight, causing the mesh to abut against the limit bar 3121, correcting the position of the mesh and helping to accurately hold it. The mesh-holding and flipping device 315... 2. The firing mesh 21 is clamped forward, and then the limiting rod 3132 descends. The firing mesh clamping and flipping device 32 pulls the firing mesh 21 above the chip ceramic body receiving device 33, and then flips the firing mesh 21 from a horizontal state to an inclined state, thereby knocking the ceramic capacitor chip ceramic body 24 off the firing mesh 21 and dropping it into the chip ceramic body receiving device 33. The firing mesh clamping and flipping device 32 then flips the firing mesh 21 in the opposite direction, and the firing mesh 21 returns to a horizontal state. Then the firing mesh 21 is pushed back to the firing mesh grabbing area, and the limiting rod 3132 rises again. The first unloading mesh plate conveying device 36 transports the unloaded firing mesh from the firing mesh grabbing area to the firing mesh recycling device 35.

[0073] Furthermore, the wire mesh clamping and flipping device 32 includes a gripper 321, a clamping drive assembly 322, a clamping base 323, a telescopic drive assembly 324, a telescopic base 325, a flipping shaft 326, a flipping drive assembly 327, and a flipping base 328. The gripper 321 is connected to the clamping base 323 through the clamping drive assembly 322. The clamping base 323 is connected to the telescopic base 325 through the telescopic drive assembly 324. The telescopic base 325 is fixedly connected to the flipping shaft 326. The flipping shaft 326 is connected to the flipping base 328 through the flipping drive assembly 327. The flipping base 328 is fixedly connected to the feeding frame 39.

[0074] The beneficial effects of this technical solution are as follows: When the firing mesh 21 is located in the firing mesh gripping area of ​​the feeding mesh conveyor 31, the telescopic drive component 324 extends, causing the gripper 321 to move forward and approach the firing mesh 21. The clamping drive component 322 causes the gripper 321 to clamp the side of the firing mesh 21. The telescopic drive component 324 retracts, pulling the firing mesh 21 above the chip ceramic receiving device 33. At this time, the firing mesh 21 is in a horizontal state. Then, the flipping drive component 327 flips the firing mesh 21, and the firing mesh 21 moves from... The horizontal state changes to an inclined state, and the ceramic capacitor chip body 24 located on the firing mesh 21 falls downward into the chip body receiving device 33; then the flipping drive component 327 causes the firing mesh 21 to flip in the opposite direction, and the firing mesh 21 returns to the horizontal state. The telescopic drive component 324 then pushes the firing mesh 21 back to the firing mesh gripping area of ​​the feeding mesh conveyor 31. The clamping drive component 322 causes the gripper 321 to release the side of the firing mesh 21, and the telescopic drive component 324 causes the gripper 321 to return to its original position.

[0075] The clamping drive assembly 322 is a pneumatic finger, and the telescopic drive assembly 324 is a telescopic cylinder. The flipping drive assembly 327 includes a servo motor and a transmission device, and the output shaft of the servo motor is connected to the flipping shaft 326 through the transmission device.

[0076] Furthermore, the wire mesh clamping and flipping device 32 also includes an auxiliary shaft 329, an arc-shaped rack 3210, and a planetary gear 3220. The central hole of the planetary gear 3220 is rotatably connected to the shaft end of the auxiliary shaft 329. The shaft body of the auxiliary shaft 329 is fixedly connected to the telescopic base 325. The planetary gear 3220 is meshed with the arc-shaped rack 3210. The arc-shaped rack 3210 is fixedly connected to the flipping base 328. The center of the arc-shaped rack 3210 is located at the flipping shaft 326.

[0077] The beneficial effects of this technical solution are: when the planetary gear 3220 rolls along the arc-shaped rack 3210, it helps to improve the flipping stability of the heat-bearing mesh 21.

[0078] Furthermore, the wire mesh clamping and flipping device 32 also includes a sensing plate 3230, an initial position sensor 3240, and a receiving position sensor 3250. The initial position sensor 3240 and the receiving position sensor 3250 are fixedly mounted on the flipping base 328 and arranged at intervals around the flipping shaft 326. One end of the sensing plate 3230 is fixedly connected to the shaft end of the flipping shaft 326, and the other end of the sensing plate 3230 can swing between the initial position sensor 3240 and the receiving position sensor 3250. The initial position sensor 3240 and the receiving position sensor 3250 are both electrically connected to the flipping drive assembly 327.

[0079] The beneficial effects of this technical solution are: it helps to accurately stop the sintering mesh 21 at the receiving position or the initial position during the flipping process. When the flipping drive assembly 327 causes the flipping shaft 326 to rotate, the sensing plate 3230 also rotates accordingly. When the receiving position sensor 3250 detects the sensing plate 3230, the flipping drive assembly 327 stops the rotation of the flipping shaft 326. At this time, the sintering mesh 21 is in an inclined state for unloading. When the initial position sensor 3240 detects the sensing plate 3230, the flipping drive assembly 327 stops the rotation of the flipping shaft 326. At this time, the sintering mesh 21 is in a horizontal state.

[0080] Both the initial position sensor 3240 and the receiving position sensor 3250 are through-beam photoelectric sensors, and the sensing element 3230 can move between the transmitting end and the receiving end of the through-beam photoelectric sensor.

[0081] Furthermore, the chip ceramic body receiving device 33 includes a hopper 331, a striking mounting rod 332, a striking rod 333, a buffer plate 334, and a vibrator 335. The two ends of the striking mounting rod 332 are fixedly connected to the left inner wall and the right inner wall of the hopper 331, respectively. The striking rod 333 is fixedly connected to the striking mounting rod 332. Multiple striking rods 333 are arranged at intervals along the length direction of the striking mounting rod 332. The buffer plate 334 is inclined. The upper end of the buffer plate 334 is fixedly connected to the striking mounting rod 332. There is a material gap 3341 between the lower end of the buffer plate 334 and the front inner wall of the hopper 331. The vibrator 335 is fixedly connected to the front outer wall of the hopper 331. The hopper 331 is fixedly connected to the feeding frame 39. The hopper 331 is located between the feeding mesh conveying device 31 and the burning mesh clamping and turning device 32, and the gripper 321 is located above the hopper 331.

[0082] The beneficial effects of this technical solution are as follows: During the process of flipping the firing mesh 21, when the firing mesh 21 becomes tilted, the firing mesh 21 hits the striking rod 333; a large number of ceramic capacitor chip bodies 24 fall from the firing mesh into the hopper 331 due to gravity; during the material collection process, the vibrator 335 generates appropriate vibration force and acts on the hopper 331. The vibration force is also transmitted to the striking rod 333 and the buffer plate 334 through the striking mounting rod 332, and the firing mesh 21 also vibrates accordingly. Some of the ceramic capacitor chip bodies 24 that are still on the firing mesh 21 are vibrated and detach from the firing mesh and move downward, preventing the ceramic capacitor chip bodies 24 from adhering to the firing mesh and the inner wall of the hopper; the ceramic capacitor chip bodies 24 fall from the firing mesh 21 to the buffer plate 334 and then fall down along the inner wall of the hopper 331 through the material gap 3341 to the discharge port of the hopper 331.

[0083] The vibrator 335 is an electromagnetic vibrator 335. The striking rod 333 is a hot melt glue rod.

[0084] More specifically, the firing mesh recycling device 35 includes a recycling bin, which is fixedly connected to the feeding frame. The first feeding mesh conveying device 36 places the firing mesh 21 into the recycling bin of the firing mesh recycling device 35, and as the equipment operates, the firing mesh 21 is stacked one by one in the recycling bin.

[0085] The structure of the cover mesh recycling device 34 is the same as that of the burning mesh recycling device 35; the first feeding mesh plate handling device 36 and the second feeding mesh plate handling device 37 are both the same as the structure of the first feeding mesh plate handling device 15.

[0086] More specifically, the chip ceramic body discharge screening device 38 includes a collection box 381, a screening housing 382, ​​a screen 383, a screening vibrator 384, a screening base 385, a small-size defective product collection box 386, a good product collection box 387, and a large-size defective product collection box 388. The left side of the screen 383 is a small-size mesh area 3831, the middle part of the screen 383 is a qualified-size mesh area 3832, and the right side of the screen 383 is a flattening area 3833. The screen 383 is fixedly connected to the screening housing 382, ​​the collection box 381 is fixedly connected to the screening housing 382, ​​the screening housing 382 is connected to the screening base 385 through the screening vibrator 384, and the screening base 385 is fixedly connected to the feeding frame 39. The discharge port of the collection box 381 is located above the left side of the screen 383. The housing 382 is provided with a first inclined material channel 3821, a second inclined material channel 3822, and a third inclined material channel 3823. The inlet of the first inclined material channel 3821 is located below the small-sized mesh area 3831. The outlet of the first inclined material channel 3821 is connected to the inlet of the small-sized defective product collection box 386 through a first feeding pipe 3861. The inlet of the second inclined material channel 3822 is located below the qualified-sized mesh area 3832. The outlet of the second inclined material channel 3822 is connected to the inlet of the good product collection box 387 through a second feeding pipe 3871. The inlet of the third inclined material channel 3823 is adjacent to the right end of the upper surface of the flat area 3833. The outlet of the third inclined material channel 3823 is connected to the inlet of the large-sized defective product collection box 388 through a third feeding pipe 3881.

[0087] The beneficial effects of this technical solution are as follows: the ceramic capacitor chip body 24 falls from the hopper 331 of the chip ceramic body receiving device 33 to the collection box 381 of the chip ceramic body discharge screening device 38; under the action of the screening vibrator 384, the ceramic capacitor chip body 24 in the collection box 381 gradually falls onto the screen 383 and then passes through the small-size mesh area 3831, the qualified-size mesh area 3832, and the flattening area 3833 in sequence; the ceramic capacitor chip body 24 smaller than the qualified size passes downward through the small-size mesh area 3831 and then... After passing through the first inclined conveyor 3821, the ceramic capacitor chip 24 finally falls into the small-sized defective product collection box 386; the ceramic capacitor chip 24 of the qualified size passes down through the qualified size mesh area 3832 and then through the second inclined conveyor 3822, finally falling into the good product collection box 387; the ceramic capacitor chip 24 of the larger than qualified size reaches the flat area 3833 and then enters the third inclined conveyor 3823, finally falling into the large-sized defective product collection box 388; good products and defective products are quickly separated, and after the collection box is full, the staff replaces the collection box.

[0088] More specifically, the screening housing 382 has a triangular diverting block 3824, which is attached to the upper surface of the flattening area 3833. The third inclined material channel 3823 has two inlets, which are located at the two corners of the flattening area 3833 respectively.

[0089] The beneficial effects of this technical solution are as follows: Under the action of the screening vibrator 384, the ceramic capacitor chip body 24 gradually moves towards the flat area 3833. When the ceramic capacitor chip body 24 encounters the triangular diverter block 3824, it splits into two paths and then moves along the inclined surface of the triangular diverter block 3824 to the two corners of the flat area 3833 respectively, and finally enters the two feed ports of the third inclined material channel 3823 respectively.

[0090] The feeding machine 1 also includes a feeding control device, which is electrically connected to the firing mesh conveying device 11, the chip green blank spreading device 12, the firing mesh supply device 13, the cover mesh supply device 14, the first feeding mesh plate handling device 15, the second feeding mesh plate handling device 16, and the feeding mesh plate conveying device 17; the unloading machine 3 also includes an unloading control device, which is electrically connected to the unloading mesh plate conveying device 31, the firing mesh clamping and turning device 32, the chip ceramic body receiving device 33, the cover mesh recycling device 34, the firing mesh recycling device 35, the second unloading mesh plate handling device 37, the first unloading mesh plate handling device 36, and the chip ceramic body discharge screening device 38; both the feeding control device and the unloading control device use existing industrial computers, and the feeding control device and the unloading control device are connected in communication to orderly carry out the production of ceramic capacitor feeding, sintering, and unloading.

[0091] To increase production, in the feeding machine 1, there are two of each of the following: the wire mesh conveying device 11, the chip blank spreading device 12, the wire mesh supply device 13, the cover mesh supply device 14, and the feeding mesh plate conveying device 17; in the unloading machine 3, there are two of each of the following: the unloading mesh plate conveying device 31, the wire mesh clamping and turning device 32, the cover mesh recycling device 34, and the wire mesh recycling device 35; and the number of the remaining devices is one.

[0092] A method for feeding, sintering, and unloading ceramic capacitors, using an integrated ceramic capacitor feeding, sintering, and unloading device, includes the following steps: Step 1: The staff adds the ceramic capacitor chip blank 23 to the chip blank feeding device 12, adds the firing mesh 21 to the firing mesh supply device 13, and adds the cover mesh 22 to the cover mesh supply device 14; the equipment is started, the first feeding mesh plate conveying device 15 picks up the firing mesh 21 from the firing mesh supply device 13, and then transports the firing mesh 21 to the firing mesh conveying device 11; Step 2: The firing mesh conveying device 11 moves the firing mesh 21 toward the spreading area of ​​the chip blank spreading device 12; Step 3: The chip blank spreading device 12 spreads the ceramic capacitor chip blank 23 onto the firing mesh 21, while the firing mesh conveying device 11 gradually moves the firing mesh 21 away from the chip blank spreading device 12. Step 4: After the material spreading is completed, the chip blank spreading device 12 stops spreading the material, and the firing mesh conveying device 11 moves the firing mesh 21 toward the feeding mesh conveying device 17. Step 5: The first feeding mesh conveying device 15 picks up the firing mesh 21 from the firing mesh conveying device 11, and then transports the firing mesh 21 to the feeding mesh conveying device 17. Then, the second feeding mesh conveying device 16 picks up the cover mesh 22 from the cover mesh supply device 14, and then transports the cover mesh 22 to the feeding mesh conveying device 17 and places the cover mesh 22 on the firing mesh 21. The cover mesh 22 and the firing mesh 21 form a combined mesh plate. Step 6: The feeding mesh conveyor 17 feeds the combined mesh into the sintering furnace 2. The ceramic capacitor chip green body 23 is sintered into the ceramic capacitor chip body 24. The combined mesh then enters the unloading mesh conveyor 31 from the sintering furnace 2. Step 7: The feeding screen conveyor 31 moves the combined screen towards the chip ceramic body receiving device 33; Step 8: The second feeding screen conveying device 37 picks up the cover screen 22 from the combined screen, the cover screen 22 is separated from the burning screen 21, and then the cover screen 22 is transported to the cover screen recycling device 34; Step 9: The firing mesh clamping and flipping device 32 first clamps the firing mesh 21 from the feeding mesh plate conveying device 31, then pulls the firing mesh 21 out to the top of the chip ceramic body receiving device 33, flips the firing mesh 21, and the ceramic capacitor chip ceramic body 24 falls from the firing mesh 21 to the chip ceramic body receiving device 33. The furnace-supporting mesh clamping and flipping device 32 flips the furnace-supporting mesh 21 in the opposite direction, pushes the furnace-supporting mesh 21 back to the feeding mesh conveying device 31, and then releases the furnace-supporting mesh 21. Step 10: The ceramic capacitor chip body 24 falls from the chip body receiving device 33 to the chip body discharge screening device 38; the first feeding screen conveying device 36 picks up the firing screen 21 from the feeding screen conveying device 31, and then transports the firing screen 21 to the firing screen recycling device 35; the staff takes away the screened ceramic capacitor chip body, and takes away the recycled cover screen and firing screen.

[0093] In summary, the feeding machine 1 automatically transports the sintering mesh 21, spreads material onto the sintering mesh 21, places the cover mesh 22 on the sintering mesh 21 to form a combined mesh plate, and conveys the combined mesh plate to the sintering furnace 2; the unloading machine 3 automatically receives the combined mesh plate from the sintering furnace 2, recovers the cover plate, flips the sintering mesh 21 to unload the material, recovers the sintering mesh 21, collects and screens the material to obtain a good product; thus improving production efficiency.

Claims

1. An integrated equipment for feeding, sintering, and unloading ceramic capacitors, characterized in that: Including feeding machine, sintering furnace, and unloading machine; The feeding machine includes a firing mesh conveying device, a chip blank spreading device, a firing mesh supply device, a cover mesh supply device, a first feeding mesh plate handling device, a second feeding mesh plate handling device, and a feeding mesh plate conveying device. The firing mesh conveying device is located between the chip blank spreading device and the feeding mesh plate conveying device. The first feeding mesh plate handling device is located between the firing mesh supply device and the firing mesh conveying device. The second feeding mesh plate handling device is located between the cover mesh supply device and the feeding mesh plate conveying device. The feeding machine includes a feeding screen conveying device, a firing screen clamping and turning device, a chip ceramic body receiving device, a cover screen recycling device, a firing screen recycling device, a first feeding screen conveying device, a second feeding screen conveying device, and a chip ceramic body discharge screening device. The chip ceramic body receiving device is located between the feeding screen conveying device and the firing screen clamping and turning device. The first feeding screen conveying device is located between the feeding screen conveying device and the firing screen recycling device. The second feeding screen conveying device is located between the feeding screen conveying device and the cover screen recycling device. The chip ceramic body discharge screening device is located below the chip ceramic body receiving device. The feed inlet of the sintering furnace is connected to the discharge outlet of the feeding mesh conveyor, and the discharge outlet of the sintering furnace is connected to the feed inlet of the unloading mesh conveyor.

2. The integrated feeding, sintering, and unloading equipment for ceramic capacitors according to claim 1, characterized in that: The wire mesh conveying device includes a wire mesh tray, a conveying block, a guide rail, and a displacement adjustment component. The guide rail is fixedly connected to the feeding frame. The bottom of the conveying block is connected to the guide rail through the displacement adjustment component. The wire mesh tray is fixedly connected to the top of the conveying block. The chip blank spreading device is located in front of the guide rail, and the feeding mesh conveyor is located behind the guide rail.

3. The integrated feeding, sintering, and unloading equipment for ceramic capacitors according to claim 2, characterized in that: The feeding mesh supply device includes a supply base, a push-pull hopper, a top plate, and a supply lifting drive assembly. The supply base is fixedly connected to the feeding frame, the push-pull hopper is slidably connected to the supply base, and the top plate is connected to the feeding frame through the supply lifting drive assembly. The supply base is provided with a first opening, and the bottom of the push-pull hopper is provided with a second opening. The top plate can pass through the first opening and the second opening.

4. The integrated feeding, sintering, and unloading equipment for ceramic capacitors according to claim 2, characterized in that: The feeding mesh conveyor device includes a feeding line base, a synchronous belt conveyor assembly, a mesh assembly block, an assembly lifting drive assembly, and a guide plate. The feeding line base is fixedly connected to the feeding frame. The synchronous belt conveyor assembly is fixedly connected to the feeding line base. The mesh assembly block is connected to the feeding line base via the assembly lifting drive assembly. The mesh assembly block is located between two synchronous belt conveyor assemblies. The guide plate is fixedly connected to the feeding line base. The two guide plates are located on the outer sides of the two synchronous belt conveyor assemblies. The feed inlet of the synchronous belt conveyor assembly is aligned with the guide rail. The discharge outlet of the synchronous belt conveyor assembly is connected to the feed inlet of the sintering furnace.

5. The integrated feeding, sintering, and unloading equipment for ceramic capacitors according to claim 1, characterized in that: The feeding screen conveyor includes a feeding assembly line base, a roller conveyor assembly, a screen limiting assembly, and a screen correction assembly. The feeding assembly line base is fixedly connected to the feeding frame, and the roller conveyor assembly is fixedly connected to the feeding assembly line base. The mesh plate limiting assembly includes a limiting support, a limiting stop bar, and a limiting lifting driver. The limiting support is fixedly connected to the unloading assembly line base, and the limiting stop bar is connected to the limiting support through the limiting lifting driver. The screen correction assembly includes a correction support, a correction shaft, a correction baffle, and a corner driver. The correction support is fixedly connected to the base of the feeding assembly line. The correction shaft is connected to the correction support through the corner driver. The correction baffle is fixedly connected to the shaft of the correction shaft. The correction shaft is located above the roller conveyor assembly. The roller conveyor assembly is provided with a baffle clearance groove. There are three screen correction assemblies, namely a first screen correction assembly, a second screen correction assembly, and a third screen correction assembly. Along the conveying direction of the roller conveyor assembly, a first screen correction assembly, a second screen correction assembly, a third screen correction assembly, and a screen limiting assembly are sequentially arranged. The area between the first screen correction assembly and the second screen correction assembly is the cover screen gripping area, and the area between the third screen correction assembly and the screen limiting assembly is the sintering screen gripping area. The screen limiting assembly is located at the discharge port of the roller conveyor assembly, and the inlet of the roller conveyor assembly is connected to the discharge port of the sintering furnace.

6. The integrated feeding, sintering, and unloading equipment for ceramic capacitors according to claim 1, characterized in that: The wire mesh clamping and flipping device includes a jaw, a clamping drive assembly, a clamping base, a telescopic drive assembly, a telescopic base, a flipping shaft, a flipping drive assembly, and a flipping base. The jaw is connected to the clamping base via the clamping drive assembly, the clamping base is connected to the telescopic base via the telescopic drive assembly, the telescopic base is fixedly connected to the flipping shaft, the flipping shaft is connected to the flipping base via the flipping drive assembly, and the flipping base is fixedly connected to the feeding frame.

7. The integrated feeding, sintering, and unloading equipment for ceramic capacitors according to claim 6, characterized in that: The wire mesh clamping and flipping device further includes an auxiliary shaft, an arc-shaped rack, and a planetary gear. The central hole of the planetary gear is rotatably connected to the shaft end of the auxiliary shaft. The shaft body of the auxiliary shaft is fixedly connected to the telescopic base. The planetary gear meshes with the arc-shaped rack. The arc-shaped rack is fixedly connected to the flipping base. The center of the arc-shaped rack is located on the flipping shaft.

8. The integrated feeding, sintering, and unloading equipment for ceramic capacitors according to claim 6, characterized in that: The wire mesh clamping and flipping device further includes a sensing plate, an initial position sensor, and a receiving position sensor. The initial position sensor and the receiving position sensor are fixedly mounted on the flipping base and arranged at intervals around the flipping axis. One end of the sensing plate is fixedly connected to the shaft end of the flipping axis, and the other end of the sensing plate can swing between the initial position sensor and the receiving position sensor. The initial position sensor and the receiving position sensor are both electrically connected to the flipping drive assembly.

9. The integrated feeding, sintering, and unloading equipment for ceramic capacitors according to claim 6, characterized in that: The chip ceramic body receiving device includes a hopper, a striking mounting rod, a striking bar, a buffer plate, and a vibrator. The two ends of the striking mounting rod are fixedly connected to the left inner wall and the right inner wall of the hopper, respectively. The striking bar is fixedly connected to the striking mounting rod. Multiple striking bars are arranged at intervals along the length of the striking mounting rod. The buffer plate is inclined. The upper end of the buffer plate is fixedly connected to the striking mounting rod. There is a material gap between the lower end of the buffer plate and the front inner wall of the hopper. The vibrator is fixedly connected to the front outer wall of the hopper. The hopper is fixedly connected to the feeding frame. The hopper is located between the feeding mesh conveying device and the burning mesh clamping and turning device, and the grippers are located above the hopper.

10. A method for feeding, sintering, and unloading ceramic capacitors, characterized in that: Using the integrated ceramic capacitor feeding, sintering, and unloading equipment according to any one of claims 1 to 9 includes the following steps: Step 1: The first feeding screen conveying device picks up the burning screen from the burning screen supply device and then transports the burning screen to the burning screen conveying device. Step 2: The firing mesh conveying device moves the firing mesh toward the spreading area of ​​the chip blank spreading device; Step 3: The chip blank spreading device spreads the ceramic capacitor chip blanks onto the firing mesh, while the firing mesh conveying device gradually moves the firing mesh away from the chip blank spreading device. Step 4: After the material spreading is completed, the chip blank spreading device stops spreading the material, and the firing mesh conveying device moves the firing mesh toward the feeding mesh conveying device; Step 5: The first feeding mesh conveying device picks up the firing mesh from the firing mesh conveying device and then transports the firing mesh to the feeding mesh conveying device. Then, the second feeding mesh conveying device picks up the cover mesh from the cover mesh supply device, transports the cover mesh to the feeding mesh conveying device, and places the cover mesh on the firing mesh. The cover mesh and the firing mesh form a combined mesh plate. Step 6: The feeding mesh conveyor sends the combined mesh into the sintering furnace. The ceramic capacitor chip green blank is sintered into the ceramic capacitor chip body. The combined mesh then enters the unloading mesh conveyor from the sintering furnace. Step 7: The feeding screen conveyor moves the combined screen towards the chip ceramic body receiving device; Step 8: The second feeding screen conveying device picks up the cover screen from the combined screen, the cover screen is separated from the burning screen, and then the cover screen is transported to the cover screen recycling device; Step 9: The firing mesh clamping and flipping device first clamps the firing mesh from the feeding mesh conveyor device, then pulls the firing mesh out to the top of the chip ceramic body receiving device, flips the firing mesh, and the ceramic capacitor chip ceramic body falls from the firing mesh to the chip ceramic body receiving device. The firing mesh clamping and flipping device flips the firing mesh in the opposite direction, pushes the firing mesh back to the feeding mesh conveying device, and then releases the firing mesh. Step 10: The ceramic capacitor chip body falls from the chip body receiving device to the chip body discharge screening device. The first feeding screen conveying device picks up the burning screen from the feeding screen conveying device and then transports the burning screen to the burning screen recycling device.

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