Servers and nodes

Abstract

Embodiments of the present application provide a server and a node. The server comprises a first manifold assembly, a second manifold assembly and a plurality of nodes. At least one node of the plurality of nodes is a first node, the first node comprising a first tank and a first device, the first tank being configured to contain a first cooling medium, the first device being contained in the first tank and being configured to be immersed in the first cooling medium, an inner cavity of the first tank and the first manifold assembly being configured to form a first circulation loop for circulation of the first cooling medium. At least one node of the plurality of nodes comprises a second device and a cold plate assembly, the cold plate assembly being configured to contain a second cooling medium, the cold plate assembly being in contact with the second device, an inner cavity of the cold plate assembly and the second manifold assembly being configured to form a second circulation loop for circulation of the second cooling medium. A heat flux density of the first device is less than a heat flux density of the second device. In this way, efficient heat dissipation of the node can be achieved.

Description

Technical Field

[0001] This application relates to the field of server technology, and more particularly to a server and node. Background Technology

[0002] Server nodes typically include components such as main chips, network interface cards (NICs), memory, hard drives, and power supplies. These components generate heat during operation. As server performance continues to improve, the heat dissipation requirements of the nodes also increase. How to efficiently dissipate heat from the nodes has become a pressing issue in server design. Summary of the Invention

[0003] This application provides a server and node that can achieve efficient heat dissipation for the node.

[0004] The first aspect of this application provides a server, which includes a first manifold component, a second manifold component, and multiple nodes.

[0005] At least one of the multiple nodes is a first node. The first node includes a first housing and a first device. The first housing is used to contain a first cooling medium. The first device is housed in the first housing and is used to be immersed in the first cooling medium to realize heat exchange between the first device and the first cooling medium. The inner cavity of the first housing is connected to a first manifold assembly. The inner cavity of the first housing and the first manifold assembly are used to form a first circulation loop for the first cooling medium to circulate.

[0006] At least one of the multiple nodes includes a second device and a cold plate assembly, the cold plate assembly being used to contain a second cooling medium, the cold plate assembly being in contact with the second device to achieve heat exchange between the cold plate assembly and the second device, the inner cavity of the cold plate assembly being in communication with a second manifold assembly, and the inner cavity of the cold plate assembly and the second manifold assembly being used to form a second circulation loop for the second cooling medium to circulate.

[0007] The heat flux density of the first device is less than that of the second device.

[0008] The server provided in this application embodiment uses a cold plate assembly to contact a second device with a high heat flux density for liquid cooling. The second cooling medium within the cold plate assembly has a high flow rate and high heat dissipation efficiency, effectively meeting the high-efficiency heat dissipation requirements of the second device with a high heat flux density. While efficiently meeting the heat dissipation requirements of the second device with a high heat flux density, the first device with a lower heat flux density is immersed in a first cooling medium. The first cooling medium contacts the first device for liquid cooling, thus meeting the high-efficiency heat dissipation requirements of the first device with a lower heat flux density. Since both the first device with a lower heat flux density and the second device with a higher heat flux density are cooled by liquid cooling, this facilitates full liquid cooling of the server, resulting in lower server noise.

[0009] Furthermore, compared to the solution where both the first and second devices are cooled by liquid cooling using cold plate assemblies, it is easier to achieve efficient liquid cooling for both the first and second devices when there are significant differences in their shape, size, and arrangement. This facilitates flexible selection and arrangement of the first and second devices, makes it easier to match the flow rate, pressure drop, and position of the cold plate assembly, and the structure of the cold plate assembly is relatively simple.

[0010] Furthermore, the inner cavity of the first housing and the first manifold assembly form a first circulation loop for the circulation of the first cooling medium, while the inner cavity of the cold plate assembly and the second manifold assembly form a second circulation loop for the circulation of the second cooling medium. The first and second circulation loops are independent of each other, facilitating independent control of the pressure drop and flow rate of the first cooling medium flowing through the first housing and the second cooling medium flowing through the cold plate assembly, thereby improving the server's energy efficiency. The independence of the first and second circulation loops allows the first and second cooling media to be different, and the selection of the second cooling media is not limited by the first cooling media. This facilitates the selection of a cooling media with higher heat dissipation efficiency as the second cooling media, thereby improving the heat dissipation efficiency for second devices with higher heat flux densities.

[0011] In some possible implementations, the first housing includes a first end and a second end, which are located at opposite ends of the first housing in a first direction. The first end is provided with a first medium inflow connector and a first medium outflow connector.

[0012] The first housing is provided with a flow guiding structure, which is used to form a flow guiding channel. The inlet of the flow guiding channel is located at the first end and is connected to the first medium inflow connector. The outlet of the flow guiding channel is located at the second end and is connected to the part of the inner cavity of the first housing located outside the flow guiding channel. The first medium outflow connector is connected to the part of the inner cavity of the first housing located outside the flow guiding channel.

[0013] The inner cavity of the first housing is connected to the first manifold assembly through a first medium inlet connector and a first medium outlet connector. The first medium inlet connector is used to allow the first cooling medium to flow into the first housing, and the first medium outlet connector is used to allow the first cooling medium to flow out of the first housing.

[0014] In this way, the first medium inlet connector and the first medium outlet connector are located at the same end of the first housing, making the assembly between the first housing and the first manifold assembly more convenient. By setting a flow guiding structure to form a flow channel, the flow path of the first cooling medium flowing through the first housing is defined. The first cooling medium flowing into the first housing from the first medium inlet connector first flows along the flow channel to the second end, and then flows from the outlet of the flow channel to the portion of the inner cavity of the first housing located outside the flow channel. At the second end, the first cooling medium flows out from inside the flow channel, and then flows along the portion of the inner cavity of the first housing located outside the flow channel from the second end to the first medium outlet connector located at the first end. Thus, the first cooling medium flowing into the first housing from the first medium inlet connector is less likely to flow directly out from the adjacent first medium outlet connector. The flow of the first cooling medium at various locations within the first housing is good, and the utilization rate of the cooling capacity of the first cooling medium is high, facilitating efficient heat dissipation for the first components located at various locations within the first housing.

[0015] In some possible implementations, a first device is provided within the flow channel.

[0016] In this way, the first cooling medium in the flow channel has good fluidity, and the first device located in the flow channel has a stable flow of the first cooling medium, which has a good heat dissipation effect on the first device located in the flow channel.

[0017] In some possible implementations, the first node further includes a circuit board disposed within the first housing and fixedly connected to the first housing. A flow guiding structure is used to form a flow guiding channel with the circuit board and the housing wall of the first housing. A first device located within the flow guiding channel is disposed on the circuit board.

[0018] In this way, it is easier to form a flow channel, which can efficiently dissipate heat from the first device located in the flow channel, while facilitating the interaction between the first device located in the flow channel and the device located in the first housing.

[0019] In some possible implementations, the first node includes a second device and a cold plate assembly, which are disposed within the first housing.

[0020] In this way, while efficiently dissipating heat from the first and second devices through liquid cooling, the server has a high degree of integration and space utilization, and the interaction between the first and second devices is also relatively easy.

[0021] In some possible implementations, the second device and the cold plate assembly are located outside the flow channel within the first housing. The second device is located within the circuit board of the first housing, and the cold plate assembly is located on the side of the second device away from the circuit board.

[0022] This arrangement allows for convenient and flexible placement of the second device and the cold plate assembly, and simplifies the design of the flow channel. Furthermore, it facilitates interaction between the second and first devices. Additionally, the second device and the cold plate assembly have minimal impact on the flow of the first cooling medium within the flow channel, promoting efficient heat dissipation for the first device located within the flow channel.

[0023] In some possible implementations, the flow channel includes a first flow channel section, a second flow channel section, and a third flow channel section arranged along a first direction.

[0024] Along the first direction, the second flow channel segment is located between the first flow channel segment and the third flow channel segment, and the two ends of the second flow channel segment are connected to the first flow channel segment and the third flow channel segment respectively. The second device is located between the first flow channel segment and the third flow channel segment.

[0025] Along the second direction, the second device is located to the side of the second flow channel section, the size of the first flow channel section is larger than the size of the second flow channel section, and the size of the third flow channel section is larger than the size of the second flow channel section.

[0026] The end of the third flow channel section furthest from the second flow channel section is an open structure to form the flow channel outlet of the guide flow channel.

[0027] Wherein, one of the length direction and the width direction of the first box is the first direction, and the other of the length direction and the width direction of the first box is the second direction.

[0028] In this way, while the second device is conveniently arranged outside the flow channel, it also facilitates the arrangement of a larger number of first devices with larger dimensions in the second direction within the first and third flow channel sections. This allows for the placement of more first devices within the flow channel, achieving efficient heat dissipation for a greater number of them. Furthermore, the opening structure at the end of the third flow channel section furthest from the second flow channel section forms the flow channel outlet. The flow area at the outlet of the flow channel is relatively large, which facilitates the smooth flow of the first cooling medium within the flow channel, resulting in better fluidity and thus better heat dissipation for the first devices located within it.

[0029] In some possible implementations, the first housing contains a plurality of second devices, and the first end of the first housing is also provided with a second medium inflow connector and a second medium outflow connector.

[0030] The cold plate assembly includes a flow splitter, a flow combiner, and multiple cold plates. In the same first housing, the cold plates correspond one-to-one with the second devices. The medium flow inlet of the cold plate is connected to the second medium inlet connector through the flow splitter, and the medium flow outlet of the cold plate is connected to the second medium outlet connector through the flow combiner.

[0031] The cold plate assembly is connected to the second manifold assembly through a second medium inlet connector and a second medium outlet connector. The second medium inlet connector is used to allow the second cooling medium to flow into the cold plate assembly, and the second medium outlet connector is used to allow the second cooling medium to flow out of the cold plate assembly.

[0032] The second device is located on the upper surface of the circuit board inside the first housing. The cold plate is located above the corresponding second device and in contact with the corresponding second device to achieve heat exchange between the cold plate and the corresponding second device.

[0033] The confluence component and the diversion component are located above the flow guiding structure inside the first housing and opposite to the flow guiding structure. The confluence component is located above the diversion component and opposite to the diversion component. The cold plate is located on the side of the confluence component and the diversion component in the second direction.

[0034] Thus, the first medium inflow connector, the first medium outflow connector, the second medium inflow connector, and the second medium outflow connector are located at the same end of the first housing, facilitating the assembly of the first node. Multiple cold plates, each corresponding to a second device, are installed within the first housing to achieve efficient heat dissipation for the multiple second devices within the first housing. By setting up a busbar and a shunt component, multiple cold plates can be connected in parallel, resulting in good temperature uniformity among the cold plates and more balanced heat dissipation for each second device. The busbar and shunt components are located above the flow guiding structure within the first housing, with the cold plates positioned to the sides of the busbar and shunt components in the second direction. This facilitates liquid cooling of the second devices located on both sides of the flow guiding structure in the second direction, allowing for more flexible arrangement of the second devices and making it easier to set up the cold plate assemblies for liquid cooling of the second devices located on both sides of the flow guiding structure in the second direction. The busbar and shunt components are opposite to the flow guiding structure, allowing for a high degree of integration and a smaller length and width dimension of the first node. The confluence component is positioned above and opposite the flow divider component. This facilitates the connection between the cold plate and the confluence and flow divider components, and the cold plate assembly is relatively small in size. It also facilitates the flow of the second cooling medium, which becomes gaseous after absorbing heat, into the confluence component, making it less likely for the second cooling medium, which becomes gaseous after absorbing heat, to stagnate within the cold plate.

[0035] In some possible implementations, the server further includes a first cooling medium distribution unit and a second cooling medium distribution unit. The inner cavity of the first enclosure is connected to the first cooling medium distribution unit via a first manifold assembly, and the first enclosure, the first manifold assembly, and the first cooling medium distribution unit form a first circulation loop. The cold plate assembly is connected to the second cooling medium distribution unit via a second manifold assembly, and the cold plate assembly, the second manifold assembly, and the second cooling medium distribution unit form a second circulation loop. The first cooling medium is a single-phase cooling medium.

[0036] In this way, the first cooling medium distribution unit, the first manifold assembly, and the first housing form a first circulation loop, while the second cooling medium distribution unit, the second manifold assembly, and the cold plate assembly form a second circulation loop. This allows for independent control of the pressure drop and flow rate of the first cooling medium flowing through the first housing and the second cooling medium flowing through the cold plate assembly, respectively, through the first and second cooling medium distribution units. Furthermore, the first cooling medium is a single-phase cooling medium, which reduces the pressure and sealing requirements of the first housing and minimizes limitations on its selection.

[0037] In some possible implementations, the second cooling medium is a two-phase cooling medium.

[0038] In this way, after absorbing heat, the second cooling medium will vaporize from a liquid state to a gaseous state, absorbing a large amount of latent heat. The gaseous second cooling medium returns to the second cooling medium distribution unit, condenses back into a liquid state, and then flows back into the cold plate assembly to absorb heat again. In this way, the efficient heat dissipation capacity of the latent heat of phase change of the two-phase cooling medium can be utilized to give the cold plate assembly good heat dissipation performance, which is beneficial for efficient heat dissipation of the second device. In addition, the second cooling medium is contained in the cold plate assembly, and the pressure bearing and sealing requirements of the phase change of the second cooling medium can be met by the relatively small size of the cold plate assembly. Meeting the pressure bearing and sealing requirements of the phase change of the second cooling medium is relatively easy, and it is not necessary for the pressure bearing and sealing of the enclosure containing the second device to meet the phase change requirements of the second cooling medium, thus reducing the restrictions on the selection of the enclosure containing the second device.

[0039] In some possible implementations, a transparent observation window is provided at the second end of the first housing.

[0040] This facilitates the observation of the liquid level in the first chamber, allowing for the adjustment of the flow rate of the first cooling medium supplied to the first chamber based on the liquid level, in order to meet the heat dissipation requirements of the first device.

[0041] A second aspect of this application provides a node comprising a first housing, a first device, a second device, and a cold plate assembly. The first housing contains a first cooling medium. The first device, the second device, and the cold plate assembly are housed within the first housing. The first device is immersed in the first cooling medium to achieve heat exchange between the first device and the first cooling medium. The cold plate assembly contains a second cooling medium and is in contact with the second device to achieve heat exchange between the cold plate assembly and the second device. The heat flux density of the first device is less than that of the second device.

[0042] In some possible implementations, the first housing includes a first end and a second end, which are located at opposite ends of the first housing in a first direction. The first end is provided with a first medium inflow connector and a first medium outflow connector.

[0043] The first housing is provided with a flow guiding structure, which is used to form a flow guiding channel. The inlet of the flow guiding channel is located at the first end and is connected to the first medium inflow connector. The outlet of the flow guiding channel is located at the second end and is connected to the part of the inner cavity of the first housing located outside the flow guiding channel. The first medium outflow connector is connected to the part of the inner cavity of the first housing located outside the flow guiding channel. The first medium inflow connector is used to allow the first cooling medium to flow into the first housing, and the first medium outflow connector is used to allow the first cooling medium to flow out of the first housing.

[0044] In some possible implementations, a first device is provided within the flow channel.

[0045] In some possible implementations, the node further includes a circuit board. The circuit board is disposed within a first housing and is fixedly connected to the first housing. A flow guiding structure is used to form a flow guiding channel with the circuit board and the housing wall of the first housing. A first device located within the flow guiding channel is disposed on the circuit board. A second device and a cold plate assembly are disposed outside the flow guiding channel. The second device is disposed on the circuit board, and the cold plate assembly is disposed on the side of the second device away from the circuit board.

[0046] In some possible implementations, the flow channel includes a first flow channel section, a second flow channel section, and a third flow channel section arranged along a first direction.

[0047] Along the first direction, the second flow channel segment is located between the first flow channel segment and the third flow channel segment, and the two ends of the second flow channel segment are connected to the first flow channel segment and the third flow channel segment respectively. The second device is located between the first flow channel segment and the third flow channel segment.

[0048] Along the second direction, the second device is located to the side of the second flow channel section, the size of the first flow channel section is larger than the size of the second flow channel section, and the size of the third flow channel section is larger than the size of the second flow channel section.

[0049] The end of the third flow channel section furthest from the second flow channel section is an open structure to form the flow channel outlet of the guide flow channel.

[0050] In some possible implementations, the first housing contains a plurality of second devices, and the first end is also provided with a second medium inflow connector and a second medium outflow connector.

[0051] The cold plate assembly includes a flow splitter, a flow combiner, and multiple cold plates corresponding to the second device. The medium inlet of the cold plate is connected to the second medium inlet connector through the flow splitter, and the medium outlet of the cold plate is connected to the second medium outlet connector through the flow combiner. The second medium inlet connector is used to allow the second cooling medium to flow into the cold plate assembly, and the second medium outlet connector is used to allow the second cooling medium to flow out of the cold plate assembly.

[0052] The second device is located on the upper surface of the circuit board inside the first housing. The cold plate is located above the corresponding second device and in contact with the corresponding second device to achieve heat exchange between the cold plate and the corresponding second device.

[0053] The confluence component and the diversion component are located above the flow guiding structure and opposite to the flow guiding structure. The confluence component is located above the diversion component and opposite to the diversion component. The cold plate is located on the side of the confluence component and the diversion component in the second direction.

[0054] In some possible implementations, a transparent observation window is provided at the second end of the first housing. Attached Figure Description

[0055] Figure 1A schematic diagram of a server provided in an embodiment of this application;

[0056] Figure 2 for Figure 1 An exploded view of the server provided in the image;

[0057] Figure 3 An assembly diagram of yet another server provided in an embodiment of this application;

[0058] Figure 4 An exploded view of yet another server provided in an embodiment of this application;

[0059] Figure 5 A schematic diagram of a first node provided in an embodiment of this application;

[0060] Figure 6 An exploded view of yet another server provided in an embodiment of this application;

[0061] Figure 7 for Figure 6 A diagram of the server provided in the document;

[0062] Figure 8 for Figure 5 Another schematic diagram of the first node provided in the diagram;

[0063] Figure 9 An exploded view of yet another first node provided in an embodiment of this application;

[0064] Figure 10 for Figure 9 A schematic diagram of the first node provided in the diagram;

[0065] Figure 11 A schematic diagram of yet another first node provided in an embodiment of this application;

[0066] Figure 12 A schematic diagram of yet another first node provided in an embodiment of this application;

[0067] Figure 13 This is an assembly diagram of another type of server provided in an embodiment of this application.

[0068] Explanation of reference numerals in the attached figures:

[0069] 10. Cabinet; 20. Power supply frame; 30. First cooling medium distribution unit; 40. Second cooling medium distribution unit; 50. Node; 50a. First node; 50b. Second node;

[0070] 100. First housing; 110. First end; 120. Second end; 121. Observation window; 122. Wrench;

[0071] 210. First device; 220. Second device;

[0072] 300. Cold plate assembly; 310. Diverter component; 320. Combinator component; 330. Cold plate; 340. First connecting pipe; 350. Second connecting pipe;

[0073] 410. First manifold assembly; 420. Second manifold assembly;

[0074] 500. Flow guiding structure;

[0075] 600. Circuit board;

[0076] 700, Second Box;

[0077] J1, First medium inlet connector; J2, First medium outlet connector; J3, Second medium inlet connector; J4, Second medium outlet connector; J5, Third medium inlet connector; J6, Third medium outlet connector; J7, Fourth medium inlet connector; J8, Fourth medium outlet connector; J9, Fifth medium inlet connector; J10, Fifth medium outlet connector; J11, Sixth medium inlet connector; J12, Sixth medium outlet connector; J13, Seventh medium inlet connector; J14, Seventh medium outlet connector;

[0078] P1, First flow channel; P2, Second flow channel; P3, Third flow channel; P4, Fourth flow channel; P5, Guide flow channel; P51, First flow channel section; P52, Second flow channel section; P53, Third flow channel section;

[0079] N1, flow channel inlet; N2, flow channel outlet;

[0080] x, first direction; y, second direction; z, third direction. Detailed Implementation

[0081] The terminology used in the implementation section of this application is only for explaining specific embodiments of this application and is not intended to limit this application. The implementation of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0082] Figure 1 A schematic diagram of a server provided in an embodiment of this application. Figure 2 for Figure 1 The image provided is an exploded view of the server. In the image, the x-direction is the first direction, the y-direction is the second direction, and the z-direction is the third direction.

[0083] like Figure 1 , Figure 2As shown in the illustration, this application provides a server that may include a rack 10 and multiple nodes 50, with the nodes 50 housed within the rack 10. The nodes 50 may include, but are not limited to, compute nodes and switching nodes. Compute nodes are capable of performing computational functions, and switching nodes are capable of performing switching functions.

[0084] For example, multiple nodes 50 can be arranged side by side along the height direction of the rack 10. The rack 10 may have multiple slots arranged along the height direction of the rack 10, and the slots extend along the depth direction of the rack 10. The nodes 50 can be inserted into the slots along the depth direction of the rack 10.

[0085] The depth direction of the rack 10 is the first direction, the width direction of the rack 10 is the second direction, and the height direction of the rack 10 is the third direction.

[0086] For example, the server may also include a power supply frame 20, which may be located inside the rack 10 and at the top of the rack 10. The power supply frame 20 is connected to the node 50 and can supply power to the node 50.

[0087] For example, the power supply frame 20 may be positioned above node 50.

[0088] For example, the server may include multiple power supply frames 20, which may be arranged side by side along the height of the rack 10.

[0089] Node 50 includes a housing and the components housed within the housing. The housing serves to support and protect the components housed within it.

[0090] At least one of the multiple nodes 50 is a first node 50a, that is, the server includes at least one first node 50a. The enclosure of the first node 50a is a first enclosure 100, that is, the first node 50a includes a first enclosure 100, the first enclosure 100 is located inside the rack 10, and the first enclosure 100 is used to contain the first cooling medium.

[0091] For example, the first node 50a may be, but is not limited to, a computing node, a switching node, etc.

[0092] Figure 3 This is an assembly diagram of another type of server provided in an embodiment of this application.

[0093] like Figure 2 , Figure 3As shown in the embodiment of this application, at least some of the devices disposed within the first housing 100 are first devices 210, that is, the first node 50a also includes first devices 210, which are housed within the first housing 100. The first devices 210 are used to be immersed in the first cooling medium to achieve heat exchange between the first devices 210 and the first cooling medium.

[0094] The server also includes a first manifold assembly 410, the inner cavity of the first housing 100 is connected to the first manifold assembly 410, and the inner cavity of the first housing 100 and the first manifold assembly 410 are used to form a first circulation loop for the circulation of the first cooling medium.

[0095] At least one of the multiple nodes 50 includes a second device 220 and a cold plate assembly 300. The cold plate assembly 300 is used to contain a second cooling medium and is in contact with the second device 220 to achieve heat exchange between the cold plate assembly 300 and the second device 220. The heat flux density of the first device 210 is less than the heat flux density of the second device 220.

[0096] The server also includes a second manifold assembly 420, the inner cavity of the cold plate assembly 300 is connected to the second manifold assembly 420, and the inner cavity of the cold plate assembly 300 and the second manifold assembly 420 are used to form a second circulation loop for the second cooling medium to circulate.

[0097] Thus, for the second device 220 with a higher heat flux density, liquid cooling is achieved through contact between the cold plate assembly 300 and the second device 220. The second cooling medium within the cold plate assembly 300 has a high flow rate and high heat dissipation efficiency, effectively meeting the high-efficiency heat dissipation requirements of the second device 220 with its higher heat flux density. While efficiently meeting the heat dissipation requirements of the second device 220 with its higher heat flux density, the first device 210 with a lower heat flux density is immersed in the first cooling medium. Liquid cooling is achieved through contact between the first cooling medium and the first device 210, effectively meeting the high-efficiency heat dissipation requirements of the first device 210 with its lower heat flux density. The use of liquid cooling for both the first device 210 with its lower heat flux density and the second device 220 with its higher heat flux density facilitates full liquid cooling of the server, resulting in lower server noise.

[0098] Furthermore, compared to the solution where both the first device 210 and the second device 220 are cooled by liquid cooling through the cold plate assembly 300, the solution of using the cold plate assembly 300 for cooling the second device 220 with a higher heat flux density and using immersion liquid cooling for cooling the first device 210 with a lower heat flux density is easier to achieve efficient liquid cooling for both the first device 210 and the second device 220 when there are significant differences in their shape, size, and arrangement. This facilitates flexible selection and arrangement of the first device 210 and the second device 220, makes it easier to match the flow rate, pressure drop, and position of the cold plate assembly 300, and makes the structure of the cold plate assembly 300 simpler.

[0099] Furthermore, the inner cavity of the first housing 100 and the first manifold assembly 410 form a first circulation loop for the circulation of the first cooling medium, while the inner cavity of the cold plate assembly 300 and the second manifold assembly 420 form a second circulation loop for the circulation of the second cooling medium. The first and second circulation loops are independent of each other, facilitating independent control of the pressure drop and flow rate of the first cooling medium flowing through the first housing 100 and the second cooling medium flowing through the cold plate assembly 300, thereby improving the server's energy efficiency. The independence of the first and second circulation loops allows the first and second cooling media to be different, and the selection of the second cooling media is not limited by the first cooling media. This facilitates the selection of a cooling media with higher heat dissipation efficiency as the second cooling media, thereby improving the heat dissipation efficiency of the second device 220 with higher heat flux density.

[0100] For example, the first cooling medium is a single-phase cooling medium, which reduces the pressure and sealing requirements of the first housing 100 and reduces the restrictions on the selection of the first housing 100.

[0101] For example, the first cooling medium is an insulating cooling medium.

[0102] For example, the first device 210 may include, but is not limited to, a network interface card, a memory, a hard disk, a power supply, etc. The second device 220 may be a main chip. For example, the second device 220 may include, but is not limited to, a central processing unit (CPU), a graphics processing unit (GPU), etc.

[0103] For example, a plurality of first devices 210 may be provided inside the first housing 100.

[0104] For example, the same node 50 may include multiple second devices 220, and the same cold plate assembly 300 may contact the multiple second devices 220 to achieve heat exchange with the multiple second devices 220. That is, the same cold plate assembly 300 can perform liquid cooling heat dissipation on the multiple second devices 220.

[0105] In some possible implementations, the server further includes a first cooling medium distribution unit 30 and a second cooling medium distribution unit 40. The inner cavity of the first housing 100 is connected to the first cooling medium distribution unit 30 via a first manifold assembly 410, and the first housing 100, the first manifold assembly 410, and the first cooling medium distribution unit 30 form a first circulation loop. The cold plate assembly 300 is connected to the second cooling medium distribution unit 40 via a second manifold assembly 420, and the cold plate assembly 300, the second manifold assembly 420, and the second cooling medium distribution unit 40 form a second circulation loop.

[0106] This allows for independent control of the pressure drop and flow rate of the first cooling medium flowing through the first housing 100 and the second cooling medium flowing through the cold plate assembly 300, respectively, through the first cooling medium distribution unit 30 and the second cooling medium distribution unit 40.

[0107] In some possible implementations, the first node 50a further includes a second device 220 and a cold plate assembly 300, which are disposed within the first housing 100. That is, the portion of the device disposed within the first housing 100 is the first device 210, and the portion of the device disposed within the first housing 100 is the second device 220.

[0108] In this way, while efficiently dissipating heat from the first device 210 and the second device 220 through liquid cooling, the server has a high degree of integration and high space utilization, and the interaction between the first device 210 and the second device 220 is also relatively easy.

[0109] In some examples where the first node 50a also includes the second device 220 and the cold plate assembly 300, in addition to the second device 220, other devices located in the first housing 100 can be the first device 210.

[0110] For example, at least a portion of the second device 220 may be immersed in the first cooling medium.

[0111] In some examples, all nodes 50 can be the first node 50a.

[0112] In some possible implementations, the second cooling medium is a two-phase cooling medium.

[0113] In this way, after absorbing heat, the second cooling medium will vaporize from a liquid state to a gaseous state, absorbing a large amount of latent heat. The gaseous second cooling medium returns to the second cooling medium distribution unit 40, condenses back into a liquid state, and then flows back into the cold plate assembly 300 to absorb heat again. In this way, the efficient heat dissipation capacity of the latent heat of phase change of the two-phase cooling medium can be utilized to give the cold plate assembly 300 good heat dissipation performance, which is beneficial for efficient heat dissipation of the second device 220. In addition, the second cooling medium is contained in the cold plate assembly 300. The pressure bearing and sealing requirements of the phase change of the second cooling medium can be met by the relatively small size of the cold plate assembly 300. It is relatively easy to meet the pressure bearing and sealing requirements of the phase change of the second cooling medium. It is not necessary for the pressure bearing and sealing of the enclosure containing the second device 220 to meet the phase change requirements of the second cooling medium, and the selection of the enclosure containing the second device 220 is less restricted.

[0114] For example, the cold plate assembly 300 can meet the requirement of a heat flux density greater than 150 W / cm². 2 The heat dissipation requirements of the device, that is, the heat flux density of the second device 220 can be greater than 150W / cm². 2 .

[0115] For example, the second device 220 can be a power of 2500W and a heat flux density of 250W / cm². 2 Device.

[0116] For example, the first cooling medium distribution unit 30 may include a heat exchanger, a first pump, and a first control system. The heat exchanger is used to dissipate heat from the first cooling medium flowing back to the first cooling medium distribution unit 30, the first pump is used to drive the first cooling medium to flow in the first circulation loop, and the first control system is used to control the flow rate, pressure, etc. of the first cooling medium flowing out of the first cooling medium distribution unit 30.

[0117] For example, the second cooling medium distribution unit 40 may include a condenser, a subcooler, a liquid storage tank, a second pump, and a second control system. The condenser can perform preliminary condensation on the second cooling medium flowing back to the second cooling medium distribution unit 40, the subcooler can further cool the second cooling medium condensed by the condenser, the liquid storage tank can store the second cooling medium and act as a buffer, the second pump is used to drive the second cooling medium to flow in the second circulation loop, and the second control system is used to control the flow rate, pressure, etc. of the second cooling medium flowing out of the second cooling medium distribution unit 40.

[0118] In some other possible implementations, the second cooling medium may also be a single-phase cooling medium.

[0119] Figure 4 An exploded view of another server provided in an embodiment of this application.

[0120] like Figure 3 , Figure 4 As shown, in some possible embodiments, the first housing 100 includes a first end 110 and a second end 120, which are respectively located at both ends of the first housing 100 in a first direction. The first end 110 is provided with a first medium inflow connector J1 and a first medium outflow connector J2. The inner cavity of the first housing 100 is connected to the first manifold assembly 410 through the first medium inflow connector J1 and the first medium outflow connector J2. The first medium inflow connector J1 is used to allow the first cooling medium to flow into the first housing 100, and the first medium outflow connector J2 is used to allow the first cooling medium to flow out of the first housing 100.

[0121] In this way, the first medium inflow connector J1 and the first medium outflow connector J2 are located at the same end of the first housing 100, which makes the assembly between the first housing 100 and the first manifold assembly 410 more convenient.

[0122] For example, one of the length direction and the width direction of the first box 100 is a first direction, the other of the length direction and the width direction of the first box 100 is a second direction, and the height direction of the first box 100 is a third direction.

[0123] For example, the first medium inflow connector J1 and the first medium outflow connector J2 are arranged along the width direction of the cabinet 10, and the first medium inflow connector J1 and the first medium outflow connector J2 are connected to the inner cavity of the first enclosure 100.

[0124] The first manifold assembly 410 has a first flow channel P1 and a second flow channel P2. The first manifold assembly 410 is located on the side of the first end 110 away from the second end 120. The first manifold assembly 410 is provided with a third medium inflow connector J5, a third medium outflow connector J6, a fourth medium inflow connector J7 and a fourth medium outflow connector J8. The fourth medium inflow connector J7 and the fourth medium outflow connector J8 are connected to the first flow channel P1, and the third medium inflow connector J5 and the third medium outflow connector J6 are connected to the second flow channel P2.

[0125] The fourth medium inflow connector J7 is connected to the medium outlet of the first cooling medium distribution unit 30, the fourth medium outflow connector J8 is connected to the first medium inflow connector J1, the third medium inflow connector J5 is connected to the first medium outflow connector J2, and the third medium outflow connector J6 is connected to the medium inlet of the first cooling medium distribution unit 30.

[0126] In this way, it is more convenient and easier to connect the first housing 100 with the first manifold assembly 410 and the first cooling medium distribution unit 30, the connection structure is simpler, it is easier to form the first circulation loop, and the structure of the first circulation loop is simpler.

[0127] For example, the first medium inflow connector J1, the first medium outflow connector J2, the fourth medium outflow connector J8, and the third medium inflow connector J5 can all be blind-plug connectors. When the first enclosure 100 is inserted into the cabinet 10, the first medium inflow connector J1 and the fourth medium outflow connector J8 can be connected by blind plugging, and the first medium outflow connector J2 and the third medium inflow connector J5 can be connected by blind plugging.

[0128] For example, the first manifold assembly 410 may be disposed inside the cabinet 10 and fixedly connected to the cabinet 10.

[0129] For example, the first cooling medium distribution unit 30 can be located inside the cabinet 10 and at the bottom of the cabinet 10, so that the connection between the first cooling medium distribution unit 30 and the first manifold assembly 410 is more convenient and the connection structure is simpler.

[0130] In some possible implementations, the first end 110 of the first housing 100 is provided with a second medium inflow connector J3 and a second medium outflow connector J4. The cold plate assembly 300 is connected to the second manifold assembly 420 through the second medium inflow connector J3 and the second medium outflow connector J4. The second medium inflow connector J3 is used to allow the second cooling medium to flow into the cold plate assembly 300, and the second medium outflow connector J4 is used to allow the second cooling medium to flow out of the cold plate assembly 300.

[0131] Thus, the first medium inflow connector J1, the first medium outflow connector J2, the second medium inflow connector J3, and the second medium outflow connector J4 are located at the same end of the first housing 100, which facilitates the assembly of the first node 50a.

[0132] For example, the second medium inflow connector J3 and the second medium outflow connector J4 are arranged along the width direction of the server rack 10. The second medium inflow connector J3 is connected to the medium inlet of the cold plate assembly 300, and the second medium outflow connector J4 is connected to the medium outlet of the cold plate assembly 300.

[0133] The second manifold assembly 420 has a third flow channel P3 and a fourth flow channel P4. The second manifold assembly 420 is located on the side of the first end 110 of the first housing 100 away from the second end 120 of the first housing 100. The second manifold assembly 420 is provided with a fifth medium inlet connector J9, a fifth medium outlet connector J10, a sixth medium inlet connector J11 and a sixth medium outlet connector J12. The fifth medium inlet connector J9 and the fifth medium outlet connector J10 are connected to the third flow channel P3, and the sixth medium inlet connector J11 and the sixth medium outlet connector J12 are connected to the fourth flow channel P4.

[0134] The fifth medium inflow connector J9 is connected to the medium outlet of the second cooling medium distribution unit 40, the fifth medium outflow connector J10 is connected to the second medium inflow connector J3, the sixth medium inflow connector J11 is connected to the second medium outflow connector J4, and the sixth medium outflow connector J12 is connected to the medium inlet of the second cooling medium distribution unit 40.

[0135] This makes it easier and more convenient to connect the cold plate assembly 300 with the second manifold assembly 420 and the second cooling medium distribution unit 40. The connection structure is relatively simple, making it easier to form the second circulation loop. The structure of the second circulation loop is relatively simple, which facilitates liquid cooling of the second device 220 through the cold plate assembly 300.

[0136] For example, the second medium inflow connector J3, the second medium outflow connector J4, the fifth medium outflow connector J10, and the sixth medium inflow connector J11 can all be blind-plug connectors. When the first enclosure 100 is inserted into the cabinet 10, the second medium inflow connector J3 can be connected to the fifth medium outflow connector J10 and the second medium outflow connector J4 can be connected to the sixth medium inflow connector J11 by blind plugging.

[0137] For example, the second manifold assembly 420 may be disposed inside the cabinet 10 and fixedly connected to the cabinet 10.

[0138] For example, the second cooling medium distribution unit 40 can be located on the side of the second manifold assembly 420 away from the first housing 100, so that the connection between the second cooling medium distribution unit 40 and the second manifold assembly 420 is more convenient and the connection structure is simpler.

[0139] For example, the second cooling medium distribution unit 40 can be located outside the cabinet 10, making it easier and more convenient to arrange the second cooling medium distribution unit 40.

[0140] For example, the width of the second cooling medium distribution unit 40 can be the same as the width of the cabinet 10, and the height of the second cooling medium distribution unit 40 can be the same as the height of the cabinet 10.

[0141] Figure 5 This is a schematic diagram of a first node provided in an embodiment of this application.

[0142] like Figure 4 , Figure 5 As shown, exemplarily, the first end 110 is provided with a plurality of second medium outflow connectors J4 arranged vertically, so that when the second cooling medium is a two-phase cooling medium, a larger flow rate of the gaseous second cooling medium can flow out of the cold plate assembly 300, making it less likely for the gaseous second cooling medium to stagnate within the cold plate assembly 300. For example, the first end 110 is provided with two second medium outflow connectors J4 arranged vertically. The second manifold assembly 420 is provided with a plurality of fifth medium inflow connectors J9 corresponding one-to-one with the second medium outflow connectors J4, and the second medium outflow connectors J4 are connected to and communicate with the corresponding fifth medium inflow connectors J9.

[0143] For example, along the width direction of the cabinet 10, the second medium inflow connector J3 and the second medium outflow connector J4 are located on the side of the first medium outflow connector J2 away from the first medium inflow connector J1, and the first medium inflow connector J1 and the first medium outflow connector J2 are located on the side of the second medium inflow connector J3 away from the second medium outflow connector J4.

[0144] For example, the second manifold assembly 420 is provided with a plurality of sixth medium outflow connectors J12 to allow a larger flow rate of the gaseous second cooling medium out of the fourth flow channel P4 when the second cooling medium is a two-phase cooling medium, so that the gaseous second cooling medium is less likely to stagnate in the fourth flow channel P4. The plurality of sixth medium outflow connectors J12 can be arranged vertically.

[0145] For example, the fifth medium inflow connector J9 is located at the lower part of the second manifold assembly 420, and the sixth medium outflow connector J12 is located at the upper part of the second manifold assembly 420.

[0146] For example, the first end 110 is provided with a first medium inflow connector J1, a first medium outflow connector J2 and a second medium inflow connector J3.

[0147] Figure 6 An exploded view of yet another server provided in this application embodiment. Figure 7 for Figure 6 A diagram of the server provided in the document.

[0148] like Figure 6 , Figure 7As shown, the first manifold assembly 410 and the second manifold assembly 420 can be arranged along the width direction of the cabinet 10 on the side of the first end 110 away from the second end 120, so that the connection of the first manifold assembly 410 and the connection of the second manifold assembly 420 are less likely to affect each other.

[0149] Figure 8 for Figure 5 Another schematic diagram of the first node provided in the diagram.

[0150] like Figure 8 As shown, in some possible implementations, the second end 120 of the first housing 100 is provided with a transparent observation window 121.

[0151] This facilitates the observation of the liquid level inside the first housing 100, so that the flow rate of the first cooling medium supplied to the first housing 100 can be adjusted according to the liquid level inside the first housing 100 to meet the heat dissipation requirements of the first device 210.

[0152] In some examples, the second end 120 is provided with a wrench 122 to facilitate blind insertion of the first enclosure 100 in the cabinet 10 and reliable docking of the first node 50a with the first manifold assembly 410 and the second manifold assembly 420, making it easier to assemble and disassemble the first node 50a with the first manifold assembly 410 and the second manifold assembly 420.

[0153] Figure 9 An exploded view of yet another first node provided in an embodiment of this application. Figure 10 for Figure 9 A schematic diagram of the first node provided in the diagram. Figure 9 The direction pointed by the arrow on the midpoint line indicates the flow direction of the first cooling medium.

[0154] like Figure 9 , Figure 10 As shown, in some examples, the first housing 100 may contain a plurality of second devices 220. For example, the first housing 100 may contain four second devices 220.

[0155] The cold plate assembly 300 includes a flow distribution component 310, a flow junction component 320, and multiple cold plates 330. Within the same first housing 100, each cold plate 330 corresponds to a second device 220. The medium inlet of each cold plate 330 is connected to a second medium inflow connector J3 via the flow distribution component 310, and the medium outlet of each cold plate 330 is connected to a second medium outflow connector J4 via the flow junction component 320. The cold plate contacts the corresponding second device 220 to achieve heat exchange between them.

[0156] In this way, by setting multiple cold plates 330 corresponding one-to-one with the second devices 220 within the first housing 100, efficient heat dissipation of the multiple second devices 220 within the first housing 100 can be achieved. By setting the busbar component 320 and the shunt component 310, the multiple cold plates 330 can be connected in parallel, resulting in better temperature uniformity among the cold plates 330 and more balanced heat dissipation for each second device 220.

[0157] For example, the cold plate assembly 300 also includes a first connecting pipe 340 and a second connecting pipe 350. The second medium inflow connector J3 is connected to the diversion component 310 through the first connecting pipe 340, and the second medium outflow connector J4 is connected to the confluence component 320 through the second connecting pipe 350.

[0158] When the first housing 100 is provided with multiple second medium outflow connectors J4, the cold plate assembly 300 includes multiple second connecting pipes 350 corresponding one-to-one with the multiple second medium outflow connectors J4 of the same first node 50a. The second medium outflow connectors J4 are connected to the manifold 320 through the corresponding second connecting pipes 350, so as to facilitate the outlet of the gaseous second cooling medium from the manifold 320 when the second cooling medium is a two-phase cooling medium.

[0159] For example, the manifold 320 is disposed above and opposite the diverter 310. This facilitates the connection between the cold plate 330 and the manifold 320 and the diverter 310, allowing for a smaller size of the cold plate assembly 300. Furthermore, it facilitates the flow of the second cooling medium, which becomes gaseous after absorbing heat, into the manifold 320, preventing it from becoming stagnant within the cold plate 330.

[0160] For example, a circuit board 600 is provided inside the first housing 100, and the circuit board 600 is fixedly connected to the first housing 100. A second device 220 is disposed on the circuit board 600 to facilitate interaction between the second device 220 and other devices disposed within the first housing 100. A cold plate assembly 300 is disposed on the side of the second device 220 away from the circuit board 600 to facilitate contact between the cold plate assembly 300 and the second device 220, thereby achieving liquid cooling of the second device 220. Specifically, a cold plate 330 is disposed on the side of the corresponding second device 220 away from the circuit board 600.

[0161] For example, the second device 220 is disposed on the side of the circuit board 600 away from the bottom wall of the first housing 100.

[0162] For example, the second device 220 is disposed on the upper surface of the circuit board 600, and the cold plate 330 is disposed above the corresponding second device 220.

[0163] Figure 11A schematic diagram of yet another first node provided in an embodiment of this application. Figure 12 This is a schematic diagram of yet another first node provided in an embodiment of this application.

[0164] like Figures 10-12 As shown, in some possible implementations, the first housing 100 is provided with a flow guiding structure 500.

[0165] The flow guiding structure 500 is used to enclose and form a flow guiding channel P5. The flow inlet N1 of the flow guiding channel P5 is located at the first end 110 and is connected to the first medium inflow connector J1. The flow outlet N2 of the flow guiding channel P5 is located at the second end 120 and is connected to the part of the inner cavity of the first housing 100 located outside the flow guiding channel P5. The first medium outflow connector J2 is connected to the part of the inner cavity of the first housing 100 located outside the flow guiding channel P5.

[0166] In this way, by setting the flow guiding structure 500 to form the flow guiding channel P5, the flow path of the first cooling medium flowing through the first housing 100 is limited. The first cooling medium flowing into the first housing 100 from the first medium inlet connector J1 first flows along the flow guiding channel P5 to the second end 120, and then flows from the flow channel outlet N2 of the flow guiding channel P5 to the part of the inner cavity of the first housing 100 located outside the flow guiding channel P5. After the first cooling medium flows out from the flow guiding channel P5 at the second end 120, it flows along the part of the inner cavity of the first housing 100 located outside the flow guiding channel P5 from the second end 120 to the first medium outlet connector J2 located at the first end 110. Thus, the first cooling medium flowing into the first housing 100 from the first medium inflow connector J1 is not likely to flow out directly from the adjacent first medium outflow connector J2. The first cooling medium has good flowability at various locations within the first housing 100, and the utilization rate of the cooling capacity of the first cooling medium is high, which facilitates efficient heat dissipation of the first device 210 located at various locations within the first housing 100.

[0167] For example, the end of the guide channel P5 away from the first end 110 is an open structure to form the channel outlet N2 of the guide channel P5.

[0168] For example, the flow guiding structure 500 may include at least one of the following structures that can divide the inner cavity of the first housing 100: ribs, cover plates, etc.

[0169] In some possible implementations, the flow channel P5 is provided with a first device 210.

[0170] In this way, the first cooling medium in the flow channel P5 has good fluidity, and the first device 210 located in the flow channel P5 has a stable flow of the first cooling medium, which has a good heat dissipation effect on the first device 210 located in the flow channel P5.

[0171] For example, the first device 210 is disposed within the flow channel P5 to facilitate efficient heat dissipation of the first device 210.

[0172] In some possible implementations, the flow guiding structure 500 is used to form a flow guiding channel P5 with the box wall of the circuit board 600 and the first box 100, and the first device 210 located in the flow guiding channel P5 is disposed on the circuit board 600.

[0173] In this way, it is easier to form the flow channel P5. While efficiently dissipating heat from the first device 210 located in the flow channel P5, it is also convenient to realize the interaction between the first device 210 located in the flow channel P5 and the device located in the first housing 100.

[0174] For example, both the first device 210 and the second device 220 are disposed on the circuit board 600 to facilitate the interaction between the first device 210 and the second device 220.

[0175] For example, the flow guiding structure 500 includes a rib and a cover plate. The lower end of the rib is fixedly connected to the upper surface of the circuit board 600, one end of the rib is fixedly connected to the inner wall of the first end, the other end of the rib is spaced apart from the inner wall of the second end, and the cover plate is connected to the upper end of the rib.

[0176] In some possible implementations, the second device 220 and the cold plate assembly 300 are located outside the flow channel P5 within the first housing 100.

[0177] In this way, the arrangement of the second device 220 and the cold plate assembly 300 is more convenient and flexible, and the design of the flow channel P5 is easier. In addition, the second device 220 and the cold plate assembly 300 have little impact on the flow of the first cooling medium in the flow channel P5, which is conducive to efficient heat dissipation of the first device 210 located in the flow channel P5.

[0178] In some possible implementations, the flow channel P5 includes a first flow channel segment P51, a second flow channel segment P52, and a third flow channel segment P53 arranged along a first direction.

[0179] Along the first direction, the second flow channel segment P52 is located between the first flow channel segment P51 and the third flow channel segment P53. The two ends of the second flow channel segment P52 are connected to the first flow channel segment P51 and the third flow channel segment P53 respectively. The second device 220 is located between the first flow channel segment P51 and the third flow channel segment P53.

[0180] Along the second direction, the second device 220 is located to the side of the second flow channel section P52, the size of the first flow channel section P51 is larger than the size of the second flow channel section P52, and the size of the third flow channel section P53 is larger than the size of the second flow channel section P52.

[0181] The end of the third flow channel section P53 furthest from the second flow channel section P52 is an open structure to form the flow channel outlet N2 of the guide flow channel P5.

[0182] In this way, while the second device 220 is conveniently arranged outside the flow channel P5, it also facilitates the arrangement of a larger number of first devices 210 with larger dimensions in the second direction within the first flow channel section P51 and the third flow channel section P53. This allows for the placement of more first devices 210 within the flow channel P5, achieving efficient heat dissipation for more of the first devices 210. Furthermore, the opening structure at the end of the third flow channel section P53 furthest from the second flow channel section P52 forms the flow channel outlet N2 of the flow channel P5. The flow area of ​​the flow channel outlet N2 of the flow channel P5 is relatively large, which facilitates the smooth flow of the first cooling medium within the flow channel P5. This allows for better flow of the first cooling medium within the flow channel P5, which is beneficial for heat dissipation of the first devices 210 located within the flow channel P5.

[0183] For example, the first flow channel section P51, the second flow channel section P52 and the third flow channel section P53 are all provided with the first device 210.

[0184] For example, the cold plate assembly 300 is disposed above the flow guiding structure 500.

[0185] like Figure 9 , Figure 10 As shown, in some possible embodiments, the confluence component 320 and the diversion component 310 are disposed above and opposite to the flow guiding structure 500, and the cold plate 330 is disposed to the side of the confluence component 320 and the diversion component 310 in the second direction.

[0186] This facilitates liquid cooling of the second devices 220 located on both sides of the flow guiding structure 500 in the second direction, allowing for more flexible arrangement of the second devices 220 and making it easier to set up the cold plate assembly 300 for liquid cooling of the second devices 220 located on both sides of the flow guiding structure 500 in the second direction. Furthermore, the fact that the busbar component 320 and the shunt component 310 are opposite to the flow guiding structure 500 allows for a higher integration of the first node 50a and a smaller length and width dimension of the first node 50a.

[0187] For example, the flow guiding structure 500 has a cold plate 330 and a second device 220 on both sides in the second direction. Specifically, the second flow channel section P52 has a cold plate 330 and a second device 220 on both sides in the second direction.

[0188] Figure 13 This is an assembly diagram of another type of server provided in an embodiment of this application.

[0189] like Figure 13As shown, in some possible implementations, at least one of the plurality of nodes 50 is a second node 50b, that is, the server includes at least one first node 50a and at least one second node 50b. The enclosure of the second node 50b is a second enclosure 700, that is, the second node 50b includes the second enclosure 700, which is disposed within the rack 10. The second node 50b also includes a second device 220 and a cold plate assembly 300, which are disposed within the second enclosure 700, that is, at least some of the devices disposed within the second enclosure 700 are the second device 220.

[0190] For example, the second node 50b may be, but is not limited to, a compute node, a switching node, etc.

[0191] In some examples where the second device 220 is located within the second housing 700, a seventh medium inflow connector J13 and a seventh medium outflow connector J14 are provided at one end of the second housing 700 near the second manifold assembly 420. The seventh medium inflow connector J13 and the seventh medium outflow connector J14 are arranged along the width direction of the cabinet 10. The seventh medium inflow connector J13 is connected to the medium inlet of the cold plate assembly 300, and the seventh medium outflow connector J14 is connected to the medium outlet of the cold plate assembly 300. The fifth medium outflow connector J10 is connected to and connected to the seventh medium inflow connector J13, and the sixth medium inflow connector J11 is connected to and connected to the seventh medium outflow connector J14.

[0192] In some examples where the second device 220 is located within the second housing 700, all devices located within the first housing 100 can be the first device 210, and all devices located within the second housing 700 can be the second device 220.

[0193] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0194] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0195] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them. Although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A server, characterized in that, It includes a first manifold assembly (410), a second manifold assembly (420), and multiple nodes (50); At least one of the plurality of nodes (50) is a first node (50a). The first node (50a) includes a first housing (100) and a first device (210). The first housing (100) is used to contain a first cooling medium. The first device (210) is contained in the first housing (100). The first device (210) is used to be immersed in the first cooling medium to realize heat exchange between the first device (210) and the first cooling medium. The inner cavity of the first housing (100) is connected to the first manifold assembly (410). The inner cavity of the first housing (100) and the first manifold assembly (410) are used to form a first circulation loop for the first cooling medium to circulate. At least one of the plurality of nodes (50) includes a second device (220) and a cold plate assembly (300), the cold plate assembly (300) being used to contain a second cooling medium, the cold plate assembly (300) being in contact with the second device (220) to achieve heat exchange between the cold plate assembly (300) and the second device (220), the inner cavity of the cold plate assembly (300) being in communication with the second manifold assembly (420), the inner cavity of the cold plate assembly (300) and the second manifold assembly (420) being used to form a second circulation loop for the second cooling medium to circulate. The heat flux density of the first device (210) is less than that of the second device (220).

2. The server according to claim 1, characterized in that, The first housing (100) includes a first end (110) and a second end (120). The first end (110) and the second end (120) are respectively located at both ends of the first housing (100) in a first direction. The first end (110) is provided with a first medium inflow connector (J1) and a first medium outflow connector (J2). The first housing (100) is provided with a flow guiding structure (500), which is used to form a flow guiding channel (P5). The inlet (N1) of the flow guiding channel (P5) is located at the first end (110) and is connected to the first medium inflow connector (J1). The outlet (N2) of the flow guiding channel (P5) is located at the second end (120) and is connected to the part of the inner cavity of the first housing (100) located outside the flow guiding channel (P5). The first medium outflow connector (J2) is connected to the part of the inner cavity of the first housing (100) located outside the flow guiding channel (P5). The inner cavity of the first housing (100) is connected to the first manifold assembly (410) through the first medium inflow connector (J1) and the first medium outflow connector (J2). The first medium inflow connector (J1) is used to allow the first cooling medium to flow into the first housing (100), and the first medium outflow connector (J2) is used to allow the first cooling medium to flow out of the first housing (100).

3. The server according to claim 2, characterized in that, The first device (210) is provided inside the flow channel (P5).

4. The server according to claim 3, characterized in that, The first node (50a) further includes a circuit board (600), which is disposed inside the first housing (100). The circuit board (600) is fixedly connected to the first housing (100). The flow guiding structure (500) is used to form the flow guiding channel (P5) by surrounding the circuit board (600) and the housing wall of the first housing (100). The first device (210) located in the flow guiding channel (P5) is disposed on the circuit board (600).

5. The server according to any one of claims 1-4, characterized in that, The first node (50a) includes the second device (220) and the cold plate assembly (300), which are disposed within the first housing (100); The second device (220) and the cold plate assembly (300) are located outside the flow channel (P5) inside the first housing (100); The second device (220) is located on the circuit board (600) inside the first housing (100), and the cold plate assembly (300) is located on the side of the second device (220) away from the circuit board (600).

6. The server according to claim 5, characterized in that, The flow channel (P5) includes a first flow channel section (P51), a second flow channel section (P52), and a third flow channel section (P53) arranged along a first direction. Along the first direction, the second flow channel segment (P52) is located between the first flow channel segment (P51) and the third flow channel segment (P53), and the two ends of the second flow channel segment (P52) are respectively connected to the first flow channel segment (P51) and the third flow channel segment (P53), and the second device (220) is located between the first flow channel segment (P51) and the third flow channel segment (P53); Along the second direction, the second device (220) is located to the side of the second flow channel segment (P52), the size of the first flow channel segment (P51) is larger than the size of the second flow channel segment (P52), and the size of the third flow channel segment (P53) is larger than the size of the second flow channel segment (P52); The third flow channel section (P53) has an open structure at the end away from the second flow channel section (P52) to form the flow channel outlet (N2) of the guide flow channel (P5). Wherein, one of the length direction and the width direction of the first box (100) is the first direction, and the other of the length direction and the width direction of the first box (100) is the second direction.

7. The server according to claim 5 or 6, characterized in that, The first housing (100) contains a plurality of the second devices (220); The first end (110) of the first housing (100) is also provided with a second medium inflow connector (J3) and a second medium outflow connector (J4). The cold plate assembly (300) includes a flow splitter (310), a flow combiner (320), and a plurality of cold plates (330). In the same first housing (100), the cold plates (330) correspond one-to-one with the second devices (220). The medium inlet of the cold plate (330) is connected to the second medium inlet connector (J3) through the flow splitter (310), and the medium outlet of the cold plate (330) is connected to the second medium outlet connector (J4) through the flow combiner (320). The cold plate assembly (300) is connected to the second manifold assembly (420) through the second medium inlet connector (J3) and the second medium outlet connector (J4). The second medium inlet connector (J3) is used to allow the second cooling medium to flow into the cold plate assembly (300), and the second medium outlet connector (J4) is used to allow the second cooling medium to flow out of the cold plate assembly (300). The second device (220) is disposed on the upper surface of the circuit board (600) inside the first housing (100), and the cold plate (330) is disposed above the corresponding second device (220) and in contact with the corresponding second device (220) to realize heat exchange between the cold plate (330) and the corresponding second device (220); The confluence component (320) and the diversion component (310) are located above the flow guiding structure (500) inside the first housing (100) and opposite to the flow guiding structure (500). The confluence component (320) is located above the diversion component (310) and opposite to the diversion component (310). The cold plate (330) is located on the side of the confluence component (320) and the diversion component (310) in the second direction.

8. The server according to any one of claims 1-7, characterized in that, It also includes a first cooling medium distribution unit (30) and a second cooling medium distribution unit (40); The inner cavity of the first housing (100) is connected to the first cooling medium distribution unit (30) through the first manifold assembly (410), and the first housing (100), the first manifold assembly (410) and the first cooling medium distribution unit (30) are used to form the first circulation loop; The cold plate assembly (300) is connected to the second cooling medium distribution unit (40) through the second manifold assembly (420), and the cold plate assembly (300), the second manifold assembly (420) and the second cooling medium distribution unit (40) are used to form the second circulation loop; The first cooling medium is a single-phase cooling medium.

9. The server according to claim 8, characterized in that, The second cooling medium is a two-phase cooling medium.

10. A node (50), characterized in that, The device includes a first housing (100), a first device (210), a second device (220), and a cold plate assembly (300). The first housing (100) is used to contain a first cooling medium. The first device (210), the second device (220), and the cold plate assembly (300) are housed within the first housing (100). The first device (210) is used to be immersed in the first cooling medium to achieve heat exchange between the first device (210) and the first cooling medium. The cold plate assembly (300) is used to contain the second cooling medium, and the cold plate assembly (300) is in contact with the second device (220) to realize heat exchange between the cold plate assembly (300) and the second device (220); The heat flux density of the first device (210) is less than that of the second device (220).

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