Double-ring encapsulation air cavity sealing structure of MEMS piezoelectric fan

Abstract

The application relates to the technical field of MEMS device packaging, in particular to a double-ring packaging air cavity sealing structure of a MEMS piezoelectric fan, a root of a MEMS piezoelectric fan body is connected with a connecting assembly; an air cavity shell is arranged opposite to the MEMS piezoelectric fan body, and the air cavity shell and the MEMS piezoelectric fan body form an air cavity; an inner ring sealing structure and an outer ring sealing structure are arranged at a gap position between the air cavity shell and the connecting assembly, the inner ring sealing structure and the outer ring sealing structure are coaxial and arranged in an inner-outer nested mode, a double-ring sealing structure is formed, and an intermediate cavity is formed between the inner ring sealing structure and the outer ring sealing structure; the size of the intermediate cavity can make the gas leaked into the intermediate cavity from the outer ring sealing structure generate vortex flow. The application optimizes the comprehensive performance of the sealing system from multiple dimensions such as air tightness, fluid characteristics and structural durability through the design of the double-ring sealing structure and the intermediate cavity, and has high practicability and popularization value.

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