A semiconductor deep hole variable frequency ultrasonic cleaning device and method
By incorporating an inclined acoustic wave reflector and an arc-shaped surface design into the ultrasonic cleaning device, the problem of ultrasonic waves being unable to penetrate deep holes laterally has been solved, achieving efficient deep hole cleaning and ensuring thorough cleaning and cleanliness of the wafers.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HENGCHAOYUAN CLEANING TECH (SHENZHEN) CO LTD
- Filing Date
- 2026-04-15
- Publication Date
- 2026-06-05
AI Technical Summary
In existing ultrasonic cleaning devices, ultrasonic waves mostly propagate vertically, making it difficult to penetrate the deep holes of wafers laterally. This is especially true for deep holes with high aspect ratios, where the ultrasonic energy attenuates significantly at the bottom and walls of the holes, resulting in impurities not being effectively loosened and incomplete cleaning.
The frequency conversion ultrasonic cleaning device using semiconductor deep holes uses inclined acoustic wave reflectors on both sides of the connecting arm. With a 45-degree angle design, the vertically upward propagating ultrasonic waves are reflected into horizontal propagation. The angle of the reflectors can be independently controlled by the adjustment components. Combined with the arc surface design and through groove, the reflectors can flexibly switch between inclined and horizontal states, promoting the directional flow of cleaning fluid and the discharge of impurities.
It significantly improves the thoroughness of deep hole cleaning, avoids impurity residue in deep holes, ensures that each area of the deep hole is uniformly subjected to ultrasonic energy, promotes the rapid removal of impurities, and improves the cleanliness consistency and cleaning efficiency of the entire wafer.
Smart Images
Figure CN122161365A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of semiconductor wafer processing technology, and more specifically, relates to a frequency conversion ultrasonic cleaning device and method for deep holes in semiconductors. Background Technology
[0002] Semiconductor wafers, or simply wafers, are circular thin films made of high-purity single-crystal silicon. Silicon, as a semiconductor material, possesses the property of conducting electricity under specific conditions, making it an ideal material for manufacturing integrated circuits. Ultrasonic cleaning devices for semiconductor wafers utilize the cavitation, acceleration, and direct flow effects of ultrasound in liquids to efficiently clean the wafer surface.
[0003] Utility model patent CN223027986U discloses an ultrasonic cleaning device for stable cleaning of semiconductor wafers, including a base. Slider blocks are slidably connected to the inner walls of both sides of the base, and a frame is fixedly connected between the side walls of two sliders. Grooves are provided on both inner walls of the base. A movable plate has a cavity inside, and multiple holes are equidistantly arranged at the lower end of the movable plate. The sliders drive the frame to slide downwards. When the sliders slide downwards, grooves limit the sliders to prevent misalignment, allowing the frame and semiconductor wafers to be immersed in a cleaning solution. Then, an ultrasonic generator operates, working in conjunction with the cleaning solution to clean the semiconductor wafer. Clean water inside the cavity is sprayed out through the multiple holes onto the surface of the semiconductor wafer, thus performing a secondary cleaning to remove any residual cleaning solution or chemical components from the semiconductor wafer surface.
[0004] Deep vias on wafers are key structures for achieving three-dimensional integration, high-density storage, and vertical interconnection in semiconductor manufacturing. Most memory chips have deep vias concentrated in the central region of the wafer, forming a high-density array. The fundamental driving force behind deep via setup is to break through the physical limits of two-dimensional planar integration and achieve higher performance and higher density semiconductor devices through vertical expansion.
[0005] Although this cleaning device can clean wafers, in existing ultrasonic cleaning devices, ultrasonic waves mostly propagate vertically, making it difficult to penetrate the deep holes of the wafer laterally. Especially for deep holes with high aspect ratios, the ultrasonic energy attenuates severely at the bottom and walls of the holes, resulting in impurities not being effectively loosened and incomplete cleaning. Summary of the Invention
[0006] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the invention.
[0007] To address the problem in existing ultrasonic cleaning devices mentioned in the background section that ultrasonic waves mostly propagate vertically, making it difficult to penetrate laterally into the deep holes of wafers, especially for deep holes with high aspect ratios, where ultrasonic energy attenuates significantly at the bottom and walls of the holes, resulting in impurities not being effectively loosened and incomplete cleaning, the present invention adopts the following technical solution.
[0008] A frequency conversion ultrasonic cleaning device for deep holes in semiconductors includes a single-tank ultrasonic cleaner with a cleaning tank. A movable lifting assembly is located on one side of the upper end of the single-tank ultrasonic cleaner. A connecting arm is mounted on the movable lifting assembly, and a semiconductor basket is attached to the connecting arm. A wafer is placed inside the semiconductor basket. The movable lifting assembly drives the connecting arm to move laterally and vertically to adjust its height. Inclined acoustic wave reflectors are located on both sides of the connecting arm. Two adjustment components are mounted on the connecting arm, each adjusting the angle of one acoustic wave reflector independently. When cleaning the wafer, the adjustment components cause the acoustic wave reflectors on both sides to be tilted. After a specified cleaning time, the two adjustment components alternately adjust the acoustic wave reflectors on both sides to rotate alternately.
[0009] Preferably, the connecting arm is equipped with a quick-release assembly, which enables the semiconductor basket to be quickly secured and removed.
[0010] Preferably, a cleaning assembly is installed on the connecting arm, which rinses the cleaned wafer.
[0011] Preferably, the semiconductor basket includes two side half-clamps, with a connecting block fixedly connected between the two side half-clamps near the bottom. A handle is fixedly connected to the outer wall of the connecting block, and multiple slots are provided on the opposite surfaces of the two side half-clamps.
[0012] Preferably, the movable lifting assembly includes a first linear slide rail, a first sliding block, a first servo motor, a first drive screw, a second linear slide rail, a second slider, a second drive screw, and a second servo motor. The first linear slide rail is detachably connected to the upper side of the single-tank ultrasonic cleaner. The first sliding block is slidably connected to the first linear slide rail. The first drive screw is rotatably connected inside the first linear slide rail and threadedly connected to the first sliding block. The first servo motor is detachably connected to one end of the first linear slide rail, and its rotating end is fixedly connected to one end of the first drive screw. The second linear slide rail is detachably connected to the upper end of the first sliding block. The second drive screw is rotatably connected inside the second linear slide rail. The second servo motor is detachably connected to the upper end of the second linear slide rail, and its rotating end is fixedly connected to the end of the second drive screw. The second slider is slidably connected to the second linear slide rail and threadedly connected to the second drive screw. The connecting arm is detachably connected to the outer wall of the second slider.
[0013] Preferably, the quick-release assembly includes a connecting plate, which is detachably connected to the end of the connecting arm. A snap-fit plate is fixedly connected to one side of the connecting plate, and a sliding rail is fixedly connected to the upper end of the other side. A sliding rod is fixedly connected inside the sliding rail, and a sliding plate is slidably connected to the outer wall of the sliding rod. An extension plate is fixedly connected to the upper end of the sliding plate, and a movable snap-fit plate is fixedly connected to the end of the extension plate. The outer edges of the two side half-clamps extend outward near the upper end, and a return spring is sleeved on the outer wall of the sliding rod. Pulling the sliding plate outward can compress the return spring.
[0014] Preferably, the adjustment assembly includes an adjustment plate, with oppositely arranged connecting lugs fixedly connected to both sides of the end of the connecting arm, and a rotating shaft fixedly connected to both sides of the acoustic wave reflector plates, with the rotating shafts on both sides rotatably connected to the two connecting lugs on both sides respectively. The adjustment plate is detachably connected to the outer wall of the rotating shaft on the opposite side of the acoustic wave reflector plates. The adjustment plate is provided with a sliding groove, and a sliding plate is slidably connected inside the sliding groove. A rotating shaft is rotatably connected to the outer wall of the sliding plate, and the telescopic end of a telescopic cylinder is detachably connected to the outer wall of the rotating shaft. The base of the telescopic cylinder is detachably connected to the outer wall of the connecting arm.
[0015] Preferably, multiple through slots are provided on the two acoustic wave reflectors, and multiple reinforcing ribs are fixedly connected to the outer wall of the two acoustic wave reflectors away from the semiconductor basket. The reflective surface of the two acoustic wave reflectors near the semiconductor basket is an arc-shaped surface.
[0016] Preferably, the cleaning assembly includes spray holes, an outlet pipe, a water storage tank, and an inlet pipe. The water storage tank is detachably connected to the upper end of the connecting arm. One end of the outlet pipe is connected to the water storage tank, and the other end of the outlet pipe passes through the connecting arm and is connected to the connecting plate. The connecting plate is provided with multiple spray holes. One end of the inlet pipe is connected to one end of the water storage tank, and the other end of the inlet pipe is connected to an external water supply. The water storage tank has a built-in water pump, and a filter device is provided between the inlet pipe and the external water supply.
[0017] This invention also discloses a variable frequency ultrasonic cleaning method for semiconductor deep holes, using the aforementioned variable frequency ultrasonic cleaning device for semiconductor deep holes, the method comprising the following steps: S1. Place the wafer to be cleaned into the semiconductor basket and attach the semiconductor basket containing the wafer to the connecting arm. S2. The connecting arm is driven to move horizontally and downward through the moving lifting component at the top of the single-tank ultrasonic cleaner, so that the semiconductor basket and wafer are immersed in the cleaning solution in the cleaning tank. S3. By adjusting the two acoustic wave reflectors on the connecting arm to the tilted state, turn on the frequency conversion ultrasonic wave, and the vertically upward ultrasonic wave is reflected by the acoustic wave reflector to propagate horizontally, so as to perform ultrasonic cleaning on the deep holes on the wafer. S4. After the ultrasonic cleaning time is specified, the two adjustment components alternately adjust the alternating rotation of the two acoustic reflector plates to disturb the cleaning fluid and remove the impurities stripped from the deep holes. S5. Turn off the frequency conversion ultrasonic wave, and drive the connecting arm to move upward through the moving lifting component, so that the semiconductor basket and wafer are lifted out of the cleaning solution in the cleaning tank, and the cleaning is completed.
[0018] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. In this invention, by setting inclined acoustic wave reflectors on both sides of the connecting arm and utilizing a 45-degree angle structure design, the vertically upward propagating ultrasonic waves in the cleaning tank can be reflected and then propagated horizontally, allowing the ultrasonic waves to directly act on the deep hole area on the wafer, significantly improving the thoroughness of deep hole cleaning and avoiding impurity residue in the deep holes. The angle of the single-sided acoustic wave reflector can be independently controlled by the adjustment component. The telescopic movement of the telescopic cylinder drives the adjustment plate and the reflector shaft to rotate. Combined with the adaptive sliding of the slide plate in the sliding groove, the reflector can flexibly switch between the inclined and horizontal states. After cleaning for a period of time, it can be alternately adjusted to the horizontal state, which can disturb the cleaning fluid to form a directional flow field and discharge the impurities stripped from the deep holes.
[0019] 2. In this invention, the side of the acoustic wave reflector closest to the semiconductor basket is set as an arc surface. Compared with the planar reflection structure, the arc surface can make the propagation direction of the reflected sound waves more diverse and the angle distribution more dispersed. It can effectively disperse the fixed standing waves, avoid the situation of uneven sound field strength, ensure that the deep holes in each area of the wafer are subjected to uniform ultrasonic energy, improve the cleanliness consistency of the entire wafer, and prevent the occurrence of over-cleaning of some deep holes or cleaning blind spots.
[0020] 3. In this invention, multiple through slots are opened on the acoustic wave reflector plate. With the tilting setting of the reflector plate, some ultrasonic waves can directly pass through the through slots to form a composite sound field. It can also realize bidirectional permeable convection of the cleaning liquid in the cleaning tank. When the reflector plate rotates alternately, the water flow can quickly pass through the through slots to realize the reversal, accelerate the flow of cleaning liquid inside and outside the deep hole, promote the rapid discharge of impurities, and avoid the formation of a local static water layer that leads to impurity deposition.
[0021] 4. In this invention, the semiconductor basket adopts a combination structure of two side half-clamps and a bottom connecting block. The connecting block is located near the bottom of the half-clamps, which reduces the obstruction structure on both sides of the basket and ensures that the transversely propagating ultrasonic waves can reach the deep hole area of the wafer without obstruction. Attached Figure Description
[0022] Figure 1 This is a schematic diagram of a frequency conversion ultrasonic cleaning device for semiconductor deep holes according to the present invention. Figure 2 This is a front view schematic diagram of the cleaning device in this invention; Figure 3 This is a side view of the cleaning device in this invention. Figure 4 This is a schematic diagram of the semiconductor basket structure in this invention; Figure 5 This is a schematic diagram of the quick-release component structure in this invention; Figure 6 In this invention Figure 5 Enlarged structural diagram of section A; Figure 7 This is a schematic diagram of the adjustment component structure in this invention; Figure 8 In this invention Figure 7 Enlarged structural diagram of section B; Figure 9 This is a schematic diagram of the ultrasonic wave reflection path in this invention; Figure 10 This is a schematic diagram of the acoustic wave reflector structure in this invention; Figure 11 This is a schematic diagram of the cleaning component structure in this invention.
[0023] The correspondence between the labels and component names in the attached figures is as follows: 100. Single-tank ultrasonic cleaner; 101. Cleaning tank; 102. Semiconductor basket; 103. First linear slide rail; 104. First sliding block; 105. First servo motor; 106. First drive screw; 107. Second linear slide rail; 108. Second slider; 109. Second drive screw; 110. Second servo motor; 111. Slot; 112. Connecting block; 113. Handle; 114. Half clamp; 200. Sound wave reflector; 201. Connecting arm; 202. Connecting plate; 203. Snap-on buckle plate; 204. Moving buckle plate; 205. Extending plate; 206. Sliding plate; 207. Sliding track; 208. Return spring; 209. Sliding rod; 210. Connecting lug; 211. Adjusting plate; 212. Telescopic cylinder; 213. Sliding groove; 214. Slide plate; 215. Rotating shaft; 216. Curved surface; 217. Through groove; 218. Reinforcing rib; 300. Cleaning assembly; 301. Spray nozzle; 302. Water outlet pipe; 303. Water storage tank; 304. Water inlet pipe. Detailed Implementation
[0024] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
[0025] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.
[0026] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places throughout this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that mutually excludes other embodiments. The present invention provides the following embodiments.
[0027] like Figure 1 , Figure 2 as well as Figure 3 The diagram shows a preferred embodiment of a frequency-conversion ultrasonic cleaning device for semiconductor deep holes according to the present invention. This embodiment includes a single-tank ultrasonic cleaner 100, with a cleaning tank 101 on the single-tank ultrasonic cleaner 100. A movable lifting assembly is located on one side of the upper end of the single-tank ultrasonic cleaner 100, and a connecting arm 201 is mounted on the movable lifting assembly. A semiconductor basket 102 is attached to the connecting arm 201, and a wafer is placed inside the semiconductor basket 102. The movable lifting assembly drives the connecting arm 201 to move laterally and vertically to adjust its height. Inclined acoustic wave reflectors 200 are located on both sides of the connecting arm 201. In this embodiment, before cleaning, the wafer is placed inside the semiconductor basket 102, and then the semiconductor basket 102 is connected to the connecting arm 201. The wafer is then placed inside the cleaning tank 101 by the movable lifting assembly for ultrasonic cleaning. The acoustic wave reflectors 200 on both sides reflect the ultrasonic waves vertically upwards to horizontally propagating... Figure 9 As shown, this enables the cleaning of deep holes on the wafer, resulting in a more thorough cleaning and better cleaning effect.
[0028] It is worth noting that in order to reflect the vertically upward propagating ultrasonic waves to the horizontal, the angle between the two sound wave reflectors 200 and the semiconductor basket 102 is 45 degrees.
[0029] The specific structure of the movable lifting assembly can be as follows: Figure 1The illustrated embodiment shows that the movable lifting assembly includes a first linear slide rail 103, a first sliding block 104, a first servo motor 105, a first drive screw 106, a second linear slide rail 107, a second slider 108, a second drive screw 109, and a second servo motor 110. The first linear slide rail 103 is detachably connected to the upper side of the single-tank ultrasonic cleaner 100. The first sliding block 104 is slidably connected to the first linear slide rail 103. The first drive screw 106 is rotatably connected to the inside of the first linear slide rail 103 and threadedly connected to the first sliding block 104. The first servo motor 105 is detachably connected to one end of the first linear slide rail 103, and its rotating end is fixedly connected to one end of the first drive screw 106. The second linear slide rail 107 is detachably connected to the upper end of the first sliding block 104. The second drive screw 109 is rotatably connected to the upper end of the first linear slide rail 107, the second slider 108, and the second drive screw 109. Inside the second linear slide rail 107, the second servo motor 110 is detachably connected to the upper end of the second linear slide rail 107, and its rotating end is fixedly connected to the end of the second drive screw 109. The second slider 108 is slidably connected to the second linear slide rail 107 and threadedly connected to the second drive screw 109. The connecting arm 201 is detachably connected to the outer wall of the second slider 108. In this embodiment, the first servo motor 105 rotates to drive the first drive screw 106 to rotate, thereby enabling the first sliding block 104 to move laterally along the length direction of the first linear slide rail 103, thereby adjusting the lateral position of the connecting arm 201. The second servo motor 110 rotates to drive the second drive screw 109 to rotate, thereby enabling the second slider 108 to move up and down along the outer wall of the second linear slide rail 107, thereby adjusting the lifting and lowering of the connecting arm 201.
[0030] In most existing wafers, the deep holes are located in the center. When the reflector reflects the ultrasonic waves, the sides of the semiconductor basket 102 must be unobstructed to avoid blocking the ultrasonic cleaning. To enable the semiconductor basket 102 to accommodate the ultrasonic waves reflected by the two acoustic wave reflectors 200, a specific structure can be adopted as follows: Figure 4 In the embodiment shown, the semiconductor basket 102 includes two side half-clamps 114. A connecting block 112 is fixedly connected between the two side half-clamps 114 near the bottom. A handle 113 is fixedly connected to the outer wall of the connecting block 112. A plurality of slots 111 are provided on the opposite surfaces of the two side half-clamps 114. In this embodiment, the slots 111 on the opposite surfaces of the two side half-clamps 114 are used to clamp and fix the wafer. The two side half-clamps 114 are fixed together by the connecting block 112. The semiconductor basket 102 can be moved easily by the handle 113. The connecting block 112 is located near the bottom of the two side half-clamps 114 so that there are no additional obstructions to block the lateral propagation of ultrasonic waves, thus ensuring the cleaning effect on the deep holes of the wafer.
[0031] To quickly secure the semiconductor basket 102 to the connecting arm 201, a quick-release structure can be adopted as follows: Figure 5 In the embodiment shown, a connecting plate 202 is detachably connected to the end of the connecting arm 201. A snap-fit plate 203 is fixedly connected to one side of the connecting plate 202, and a sliding rail 207 is fixedly connected to the upper end of the other side. A sliding rod 209 is fixedly connected inside the sliding rail 207. A sliding plate 206 is slidably connected to the outer wall of the sliding rod 209. An extension plate 205 is fixedly connected to the upper end of the sliding plate 206. A movable snap-fit plate 204 is fixedly connected to the end of the extension plate 205. The outer edges of the two side half-clamps 114 extend outward near the upper end. A return spring 208 is sleeved on the outer wall. Pulling the sliding plate 206 outward can compress the return spring 208. In this embodiment, during installation, the outer edge extension of one half-clamp 114 is placed on the upper end of the sliding plate 206 and moved laterally, so that the sliding plate 206 moves on the outer wall of the sliding rod 209 and compresses the return spring 208. Then, the outer edge extension of the other half-clamp 114 is locked inside the snap-fit plate 203, thereby completing the installation. The same applies during disassembly, thereby enabling quick assembly and disassembly of the semiconductor basket 102.
[0032] The ultrasonic waves reflected by the two acoustic wave reflectors 200 converge at the semiconductor basket 102, preventing the cleaned impurities from being discharged. Therefore, it is necessary to alternately adjust one side of the acoustic wave reflector 200 to a horizontal position, allowing the impurities to flow out towards the horizontal direction. To achieve angle adjustment of the acoustic wave reflector 200 on one side, the specific structure can be as follows: Figure 7 as well as Figure 8 In the embodiment shown, connecting lugs 210 are fixedly connected to both sides of the end of the connecting arm 201. Rotating shafts are fixedly connected to the two sound wave reflectors 200 on both sides, and the rotating shafts are rotatably connected to the two connecting lugs 210 on each side. Adjusting plates 211 are detachably connected to the outer walls of the rotating shafts on opposite sides of the sound wave reflectors 200. A sliding groove 213 is provided on the adjusting plate 211. A sliding plate 214 is slidably connected inside the sliding groove 213. A rotating shaft 215 is rotatably connected to the outer wall of the sliding plate 214. A telescopic cylinder 2 is detachably connected to the outer wall of the rotating shaft 215. At the telescopic end of 12, the base of the telescopic cylinder 212 is detachably connected to the outer wall of the connecting arm 201. In this embodiment, when the telescopic cylinder 212 retracts, the rotating shaft 215 moves with the cylinder, and the slide plate 214 slides adaptively in the sliding groove 213, thereby enabling the acoustic reflector plate 200 to rotate to a horizontal position. The same applies when the telescopic cylinder 212 extends. After cleaning for a period of time, the acoustic reflectors plate 200 on both sides can be adjusted to rotate alternately, which can shake the firmly adhered impurities and discharge the cleaned impurities outward, thereby improving the cleaning effect.
[0033] A solid 200mm acoustic reflector will block some of the vertically upward ultrasonic waves, allowing sound to travel only through the reflective surface. This creates weak areas in the sound field within the tank and also blocks the left and right water flow. During alternating shaking to remove impurities, localized still water layers can easily form. To avoid this, a specific structure can be adopted as follows: Figure 10 In the embodiment shown, multiple through grooves 217 are provided on the two acoustic wave reflectors 200, and multiple reinforcing ribs 218 are fixedly connected to the outer wall of the two acoustic wave reflectors 200 away from the semiconductor basket 102. In this embodiment, the through grooves 217 allow some ultrasonic waves to pass directly through, forming a composite sound field in conjunction with the transverse sound waves of the reflector surface. The ultrasonic energy in the wafer and deep hole area is more balanced, resulting in a better cleaning effect. Furthermore, the through grooves 217 allow bidirectional permeable convection of the cleaning fluid inside the cleaning tank 101. When the two acoustic wave reflectors 200 are tilted alternately, the water flow can pass through the gap and quickly change direction, resulting in faster fluid renewal inside and outside the deep hole and more thorough removal of impurities.
[0034] If the reflecting surface of the sound wave reflector 200 is planar, it is easy to form a fixed standing wave, causing uneven sound field intensity. To avoid this situation, the specific structure can be as follows: Figure 10 In the embodiment shown, the reflective surface of the acoustic wave reflectors 200 on both sides near the semiconductor basket 102 is an arc-shaped surface 216. In this embodiment, by setting the arc-shaped surface 216, the reflected acoustic waves are more diverse in direction and more dispersed in angle, which can effectively disperse the standing waves and avoid some deep holes being washed too strongly and others not being washed at all, resulting in higher uniformity of cleanliness of the entire wafer.
[0035] After the wafers are cleaned inside the cleaning tank 101, they need to be rinsed. A specific structure can be adopted as follows: Figure 10 In the embodiment shown, a cleaning assembly 300 is installed on the connecting arm 201. The cleaning assembly 300 includes spray holes 301, a water outlet pipe 302, a water storage tank 303, and a water inlet pipe 304. The water storage tank 303 is detachably connected to the upper end of the connecting arm 201. One end of the water outlet pipe 302 is connected to the water storage tank 303, and the other end of the water outlet pipe 302 passes through the connecting arm 201 and is connected to the connecting plate 202. The connecting plate 202 is provided with a plurality of spray holes 301. One end of the water inlet pipe 304 is connected to the water storage tank 303. One end is connected to the water inlet pipe 304, and the other end is connected to the external water supply. The water storage tank 303 has a built-in water pump, and a filter device is provided between the water inlet pipe 304 and the external water supply. In this embodiment, after the wafer cleaning is completed, the connecting arm 201 is raised so that the semiconductor basket 102 is removed from the cleaning liquid inside the cleaning tank 101. At this time, the water pump is started to spray the water inside the water storage tank 303 through the water outlet pipe 302 from the inside of each spray hole 301 onto the wafer on the semiconductor basket 102, thereby rinsing the wafer.
[0036] This embodiment also discloses a frequency conversion ultrasonic cleaning method for semiconductor deep holes, using the aforementioned frequency conversion ultrasonic cleaning device for semiconductor deep holes. The method includes the following steps: S1. Place the wafer to be cleaned into the semiconductor basket 102 and attach the semiconductor basket 102 containing the wafer to the connecting arm 201. S2. The connecting arm 201 is driven to move laterally and downward through the moving lifting component at the upper end of the single-tank ultrasonic cleaner 100, so that the semiconductor basket 102 and the wafer are immersed in the cleaning solution in the cleaning tank 101. S3. By adjusting the two acoustic wave reflectors 200 on both sides to the tilted state through the two adjustment components on the connecting arm 201, the frequency conversion ultrasonic wave is turned on. The ultrasonic wave that is propagating vertically upward is reflected by the acoustic wave reflector 200 and propagates horizontally to perform ultrasonic cleaning on the deep holes on the wafer. S4. After the ultrasonic cleaning time is specified, the two adjustment components alternately adjust the alternating rotation of the two acoustic wave reflectors 200° to disturb the cleaning fluid and remove the impurities stripped from the deep holes. S5. Turn off the frequency conversion ultrasonic wave, and drive the connecting arm 201 to move upward through the moving lifting component, so that the semiconductor basket 102 and the wafer are lifted out of the cleaning liquid in the cleaning tank 101, and the cleaning is completed.
[0037] The above description, in conjunction with specific embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, several simple deductions or substitutions can be made without departing from the concept of the present invention, and all such deductions or substitutions should be considered to fall within the scope of protection defined by the claims submitted herein.
Claims
1. A frequency conversion ultrasonic cleaning device for deep holes in semiconductors, comprising a single-tank ultrasonic cleaner (100), wherein a cleaning tank (101) is provided on the single-tank ultrasonic cleaner (100), a movable lifting assembly is provided on one side of the upper end of the single-tank ultrasonic cleaner (100), a connecting arm (201) is installed on the movable lifting assembly, a semiconductor basket (102) is snapped onto the connecting arm (201), a wafer is placed inside the semiconductor basket (102), and the movable lifting assembly drives the connecting arm (201) to move laterally and vertically to adjust the height, characterized in that, Inclined acoustic reflectors (200) are provided on both sides of the connecting arm (201). Two adjustment components are installed on the connecting arm (201). Each adjustment component adjusts the angle of one side of the acoustic reflector (200) separately. When cleaning the wafer, the adjustment components make the acoustic reflectors (200) on both sides tilted. After a specified cleaning time, the two adjustment components alternately adjust the acoustic reflectors (200) on both sides to rotate alternately.
2. The frequency conversion ultrasonic cleaning device for semiconductor deep holes according to claim 1, characterized in that, The connecting arm (201) is equipped with a quick-release assembly that allows the semiconductor basket (102) to be quickly secured and removed.
3. The frequency conversion ultrasonic cleaning device for semiconductor deep holes according to claim 2, characterized in that, A cleaning assembly (300) is installed on the connecting arm (201) to rinse the cleaned wafer.
4. The frequency conversion ultrasonic cleaning device for semiconductor deep holes according to claim 1, characterized in that, The semiconductor basket (102) includes two side half-clamps (114), and two side half-clamps (114) are fixedly connected to each other near the bottom with oppositely arranged connecting blocks (112). The outer walls of the two side connecting blocks (112) are fixedly connected with grip handles (113), and multiple slots (111) are provided on the opposite sides of the two side half-clamps (114).
5. The frequency conversion ultrasonic cleaning device for semiconductor deep holes according to claim 1, characterized in that, The movable lifting assembly includes a first linear slide rail (103), a first sliding block (104), a first servo motor (105), a first drive screw (106), a second linear slide rail (107), a second slider (108), a second drive screw (109), and a second servo motor (110). The first linear slide rail (103) is detachably connected to the upper side of the single-tank ultrasonic cleaner (100). The first sliding block (104) is slidably connected to the first linear slide rail (103). The first drive screw (106) is rotatably connected inside the first linear slide rail (103) and threadedly connected to the first sliding block (104). The first servo motor (105) is detachably connected to the first linear slide rail (107), the first sliding block (108), the first drive screw (109), and the second servo motor (110). At one end of the first linear slide rail (103), and the rotating end is fixedly connected to one end of the first drive screw (106), the second linear slide rail (107) is detachably connected to the upper end of the first sliding block (104), the second drive screw (109) is rotatably connected to the inside of the second linear slide rail (107), the second servo motor (110) is detachably connected to the upper end of the second linear slide rail (107), and the rotating end is fixedly connected to the end of the second drive screw (109), the second slider (108) is slidably connected to the second linear slide rail (107) and threadedly connected to the second drive screw (109), and the connecting arm (201) is detachably connected to the outer wall of the second slider (108).
6. The frequency conversion ultrasonic cleaning device for semiconductor deep holes according to claim 2, characterized in that, The quick-release assembly includes a connecting plate (202), which is detachably connected to the end of the connecting arm (201). A snap-fit plate (203) is fixedly connected to one side of the connecting plate (202), and a sliding rail (207) is fixedly connected to the upper end of the other side. A sliding rod (209) is fixedly connected inside the sliding rail (207). A sliding plate (206) is slidably connected to the outer wall of the sliding rod (209). An extension plate (205) is fixedly connected to the upper end of the sliding plate (206), and a movable snap plate (204) is fixedly connected to the end of the extension plate (205). The outer edges of the two side half-clamps (114) extend outward near the upper end. A return spring (208) is sleeved on the outer wall of the sliding rod (209). Pulling the sliding plate (206) outward can compress the return spring (208).
7. The frequency conversion ultrasonic cleaning device for semiconductor deep holes according to claim 3, characterized in that, The adjustment assembly includes an adjustment plate (211), and two oppositely arranged connecting lugs (210) are fixedly connected to the ends of the connecting arm (201). A rotating shaft is fixedly connected to the two sound wave reflectors (200) on both sides, and the two rotating shafts are rotatably connected to the two connecting lugs (210) on both sides respectively. The adjustment plate (211) is detachably connected to the outer wall of the rotating shaft on the opposite side of the two sound wave reflectors (200). A sliding groove (213) is provided on the adjustment plate (211). A sliding plate (214) is slidably connected inside the sliding groove (213). A rotating shaft (215) is rotatably connected to the outer wall of the sliding plate (214). The telescopic end of a telescopic cylinder (212) is detachably connected to the outer wall of the rotating shaft (215). The base part of the telescopic cylinder (212) is detachably connected to the outer wall of the connecting arm (201).
8. The frequency conversion ultrasonic cleaning device for semiconductor deep holes according to claim 1, characterized in that, Multiple through slots (217) are provided on the two sides of the acoustic wave reflector (200). Multiple reinforcing ribs (218) are fixedly connected to the outer wall of the two sides of the acoustic wave reflector (200) away from the semiconductor basket (102). The reflective surface of the two sides of the acoustic wave reflector (200) near the semiconductor basket (102) is an arc-shaped surface (216).
9. The frequency conversion ultrasonic cleaning device for semiconductor deep holes according to claim 7, characterized in that, The cleaning assembly (300) includes a spray hole (301), a water outlet pipe (302), a water storage tank (303), and a water inlet pipe (304). The water storage tank (303) is detachably connected to the upper end of the connecting arm (201). One end of the water outlet pipe (302) is connected to the water storage tank (303), and the other end of the water outlet pipe (302) passes through the connecting arm (201) and is connected to the connecting plate (202). The connecting plate (202) is provided with multiple spray holes (301). One end of the water inlet pipe (304) is connected to one end of the water storage tank (303), and the other end of the water inlet pipe (304) is connected to an external water supply. The water storage tank (303) has a built-in water pump, and a filter device is provided between the water inlet pipe (304) and the external water supply.
10. A method for frequency conversion ultrasonic cleaning of semiconductor deep holes, using the frequency conversion ultrasonic cleaning apparatus for semiconductor deep holes as described in claim 1, characterized in that, The method includes the following steps: S1. Place the wafer to be cleaned into the semiconductor basket (102) and attach the semiconductor basket (102) containing the wafer to the connecting arm (201); S2. The connecting arm (201) is driven to move laterally and downward by the moving lifting assembly at the upper end of the single-tank ultrasonic cleaner (100), so that the semiconductor basket (102) and the wafer are immersed in the cleaning solution in the cleaning tank (101). S3. By adjusting the two acoustic wave reflectors (200) on both sides to the tilted state through the two adjustment components on the connecting arm (201), the frequency conversion ultrasonic wave is turned on. The ultrasonic wave that propagates vertically upward is reflected by the acoustic wave reflector (200) and propagates horizontally to perform ultrasonic cleaning on the deep holes on the wafer. S4. After the ultrasonic cleaning time is specified, the two adjustment components are used to adjust the alternating rotation of the two acoustic wave reflectors (200) to disturb the cleaning fluid and discharge the impurities stripped from the deep holes. S5. Turn off the frequency conversion ultrasonic wave, and drive the connecting arm (201) to move upward through the moving lifting component, so that the semiconductor basket (102) and the wafer are lifted out of the cleaning liquid in the cleaning tank (101) to complete the cleaning.