Wet process equipment

Abstract

A wet process apparatus includes a first tank, a wafer boat and a jet device. The first tank includes two opposite tank walls and a tank bottom plate. The wafer boat is movably arranged in the first tank and includes a plurality of slots, and the plurality of slots are arranged along a width direction of any one of the two tank walls. The jet device includes at least one upper jet pipe and at least one lower jet pipe. The upper jet pipe is arranged along the width direction of at least one of the tank walls and includes a plurality of upper jet holes. The lower jet pipe is arranged below the wafer boat and includes a plurality of lower jet holes. The plurality of upper jet holes and the plurality of lower jet holes spray processing liquid to the plurality of slots in different directions relative to the wafer boat, thereby effectively removing etching residues and improving etching rate.

Description

Technical Field

[0001] This application relates to a semiconductor manufacturing apparatus, and more particularly to a wet process apparatus. Background Technology

[0002] In the manufacturing process of semiconductor wafers, packaging, display panels, and light-emitting diodes, a wafer (substrate) processing system is required to supply processing solutions, such as chemical solutions or deionized water, to the surface of the wafer for etching, cleaning, and coating processes. Within this wafer processing system, a wet processing device is necessary for etching and post-etching cleaning. Wet etching techniques generally include single-sided etching and batch etching. However, traditional batch etching techniques produce significant and difficult-to-control through-hole morphology deformation, and it is difficult to increase the etching rate. Furthermore, while traditional single-sided etching produces less through-hole morphology deformation, the etching time is extremely long, several times that of batch etching. Therefore, improving the through-hole morphology deformation and increasing the etching rate after wet etching are urgent problems that need to be solved. Summary of the Invention

[0003] One objective of this application is to provide a wet process apparatus capable of etching perforations with uniform apertures on both sides and improving the etching rate.

[0004] Another object of this application is to provide a wet process apparatus that can generate turbulence and effectively remove etching residues.

[0005] To achieve the above objectives, this application provides a wet processing apparatus, including a first tank, a crystal boat, and a spraying device. The first tank includes two opposing tank walls and a tank bottom plate, the tank bottom plate being connected between the bottoms of the two tank walls. The crystal boat is movably disposed within the first tank and includes a plurality of slots, the plurality of slots being spaced apart from each other along a width direction of any of the two tank walls, and used to receive a carrier plate. The spraying device includes at least one upper spray pipe and at least one lower spray pipe, the upper spray pipe being disposed along the width direction of at least one of the tank walls and including a plurality of upper spray holes, the lower spray pipe being disposed between the upper spray pipe and the tank bottom plate, and located below the crystal boat, and the lower spray pipe including a plurality of lower spray holes, the plurality of upper spray holes and the plurality of lower spray holes spraying a processing liquid toward the plurality of slots in different directions relative to the crystal boat.

[0006] Preferably, the wet process equipment further includes a second tank disposed around the first tank, and the second tank includes an outer wall, characterized in that the height of the second tank wall relative to the bottom plate of the first tank is lower than the height of the outer wall relative to the bottom plate of the tank.

[0007] Preferably, the first tank further includes at least one first drain outlet that penetrates the bottom plate of the tank, and the second tank includes at least one second drain outlet that penetrates the bottom of one of the second tanks.

[0008] Preferably, a plurality of the carrier plates are disposed in a plurality of slots of the crystal boat, and the plurality of upper jet holes are respectively disposed between any two of the carrier plates.

[0009] Preferably, the lower jet pipe is disposed between the two tank walls along a length direction of the bottom plate of the tank, and the upper jet pipe and the lower jet pipe are disposed in an alternating direction.

[0010] Preferably, the first tank further includes a laminar flow plate disposed between the crystal boat and the tank bottom plate, and located above the lower jet pipe, and the laminar flow plate includes a plurality of laminar flow holes, which are respectively connected to the plurality of lower jet pipes.

[0011] Preferably, the jetting device further includes an upper liquid supply pipe connected to the upper jetting pipe and used to transfer the treatment liquid into the upper jetting pipe.

[0012] Preferably, the plurality of upper jet holes are spaced apart from each other and arranged in multiple rows.

[0013] Preferably, the upper jet pipe is arranged to move longitudinally reciprocating relative to the bottom plate of the tank.

[0014] Preferably, each of the two tank walls is provided with an upper jet pipe.

[0015] Preferably, the tank wall is provided with multiple upper jet pipes.

[0016] In the wet process equipment provided in this application, a jetting device including an upper jetting pipe and a lower jetting pipe is used. The longitudinal jetting generated by the lower jetting pipe passes through the laminar flow plate to create a laminar flow effect. Combined with the lateral jetting generated by the jetting pipe, a strong turbulent flow effect is created. This allows for double-sided etching of the carrier plate (wafer) inserted in the crystal boat, and can etch a uniform perforation morphology. It can also effectively remove etching residues, thereby improving the etching rate. This effectively solves the problems of traditional etching time being too long, poor perforation morphology deformation after etching, and incomplete removal of etching residues. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the wet process equipment according to an embodiment of this application.

[0018] Figure 2 for Figure 1 A three-dimensional top view of the wet process equipment.

[0019] Figure 3 This is a three-dimensional structural diagram of a crystal boat, one of the embodiments of this application.

[0020] Figure 4 for Figure 1 A three-dimensional cross-sectional schematic diagram of the wet process equipment.

[0021] Figure 5 for Figure 1 Another three-dimensional cross-sectional view of the wet process equipment.

[0022] Figure 6 This is a schematic diagram of the wet process equipment and a drainage device according to an embodiment of this application.

[0023] Figure 7 This is a three-dimensional cross-sectional schematic diagram of a wet process apparatus according to another embodiment of this application.

[0024] Figure 8 This is a partial perspective cross-sectional view of a wet process apparatus according to another embodiment of this application.

[0025] Figure 9 This is a front cross-sectional view of a wet process apparatus according to another embodiment of this application.

[0026] Figure 10 This is a front cross-sectional view of a wet process apparatus according to another embodiment of this application. Detailed Implementation

[0027] To facilitate understanding of the technical features, content, advantages, and effects of this application, this application is described in detail below with reference to the accompanying drawings and in the form of embodiments. The accompanying drawings are intended only for illustration and auxiliary explanation and may not represent the actual scale and precise configuration of this application after implementation. Therefore, the scale and configuration of the accompanying drawings should not be used to interpret or limit the scope of this application in actual implementation.

[0028] The following descriptions of embodiments are taken with reference to the accompanying drawings, illustrating specific embodiments in which this application can be implemented. Directional terms used in this application, such as "up," "down," "front," "back," "left," "right," "top," "bottom," "horizontal," and "vertical," are merely for reference to the accompanying drawings. Therefore, the directional terms used are for illustrative and understanding purposes only, and not for limiting the application. Throughout the specification and claims, unless explicitly specified otherwise, the terms "a" and "described" encompass a description including "a or at least one" of the stated elements or components. Furthermore, as used herein, the singular article also includes a description of multiple elements or components unless clearly apparent from the specific context.

[0029] The following description, with reference to the accompanying drawings, illustrates various embodiments of this application. For ease of understanding, the same elements in the following embodiments are indicated by the same symbols. It should be noted that the combination of various elements in this application preferably forms the above-described multiple embodiments, but this should not be construed as a limitation of this application. That is, the various elements in this application can have more combinations, and are not limited to the above-described multiple embodiments.

[0030] This application provides a wet process apparatus applicable to semiconductor front-end processes, advanced semiconductor packaging processes, compound semiconductor processes, optoelectronic processes, etc. Specifically, the wet process apparatus can be used to accommodate a wafer boat and a carrier plate located on the wafer boat, wherein the carrier plate is a wafer or substrate, for performing etching or cleaning processes on the wafer or substrate.

[0031] Reference Figure 1 and Figure 2 ,like Figure 1 As shown, the wet process equipment 1 provided in this application includes a first tank 10, a second tank 20, a crystal boat 30, and a jetting device 50. The first tank 10 includes two opposing tank walls 11, a tank bottom plate 12 connected between the bottoms of the two tank walls 11, a front tank wall 13 and a rear tank wall 14 connected between the two tank walls 11, and a laminar flow plate 15 disposed between the crystal boat 30 and the tank bottom plate 12. In this embodiment, the first drain port 16 penetrates the tank bottom plate 12. Figure 1 and Figure 2 As shown, the second tank 20 is arranged around the first tank 10, and the second tank 20 includes an outer wall 21 and a second drain port 22 penetrating the bottom of the second tank 20. (Refer to...) Figure 4 and Figure 5 These are, respectively, a three-dimensional cross-sectional schematic diagram of the wet process equipment 1 from a front-inward perspective. For example... Figure 4 and Figure 5 As shown, the outer wall 21 of the second tank 20 is only provided around the upper half of the first tank 10, and an outer cavity is formed between the outer wall 21 and the tank wall 11 relative to the first tank 10. In this embodiment, the height of the second tank wall 11 of the first tank 10 relative to the tank bottom plate 12 is lower than the height of the outer wall 21 of the second tank 20 relative to the tank bottom plate 12. That is, when the treatment liquid (not shown) inside the first tank 10 is full, it will overflow from the tank wall 11 and flow into the outer cavity between the outer wall 21 and the tank wall 11.

[0032] Reference Figure 2 and Figure 3The crystal boat 30 is movably disposed within the first tank 10 and includes a plurality of slots 31. In some embodiments, the plurality of slots 31 are spaced apart from each other along a width direction W1 of any of the two tank walls 11 and are used to receive the carrier plate 7. Specifically, the carrier plate 7 is a wafer or a substrate. For example, the carrier plate 7 may be a silicon wafer (substrate) or a compound substrate, which is not particularly limited herein, and the carrier plate 7 is used to form semiconductor devices or other electronic devices. In some embodiments, the carrier plate 7 may be a circular wafer or a square wafer, which can be fixed to the slot 31 by being inserted through the edge and bottom of the carrier plate 7. Specifically, after the carrier plate 7 (wafer) is inserted into the slot 31, the edge of the carrier plate 7 faces the tank wall 11, and the bottom of the carrier plate 7 is spaced apart from the tank bottom plate 12.

[0033] Continue to refer to Figure 2 , Figure 4 and Figure 5 The jetting device 50 includes an upper jetting pipe 51, an upper liquid supply pipe 52, and a lower jetting pipe 53. In this embodiment, the upper jetting pipe 51 is arranged along the width direction W1 of a tank wall 11 and includes a plurality of upper jetting holes 511. The optimal position for the upper jetting pipe 51 is between the middle height of its distance from the tank bottom plate 12 and one-third of the height above the tank bottom plate 12. Figure 5 As shown, multiple upper jet holes 511 are spaced apart and arranged in a single row along the upper jet pipe 51, with each upper jet hole 511 facing the crystal boat 30. Specifically, the multiple upper jet holes 511 are respectively disposed between any two carrier plates 7, that is, there is a gap between adjacent slots 31 (e.g., Figure 3 (As shown), the upper jet hole 511 corresponds to the spacing between the slots 31. Preferably, after the carrier plate 7 is fixed to the slot 31, the edge of the carrier plate 7 does not correspond to the upper jet hole 511. Figure 2 and Figure 5 As shown, one end of the upper liquid supply pipe 52 is connected to the middle portion of the upper spray pipe 51, and the other end is connected to a liquid supply device (not shown), forming an inverted T-shape with the upper liquid supply pipe 52 and the upper spray pipe 51. The liquid supply device supplies the processing liquid to the upper liquid supply pipe 52 and allows it to flow into the upper spray pipe 51, from which it is ejected laterally towards the crystal boat 30 through the upper spray hole 511. In some embodiments, the processing liquid is an etching solution, such as an aqueous solution of phosphoric acid or a mixture of sulfuric acid, phosphoric acid, and water, but is not limited thereto. In other embodiments, the processing liquid is deionized water, used to perform the cleaning process.

[0034] Continue to refer to Figure 4 and Figure 5 The lower jet pipe 53 is disposed between the two tank walls 11 along a length direction of the tank bottom plate 12, and the upper jet pipe 51 and the lower jet pipe 53 are arranged in an alternating direction. In this embodiment, as... Figure 4 As shown, the projections of the upper jet pipe 51 and the lower jet pipe 53 onto the tank bottom plate 12 form a cross shape. Figure 5 As shown, the lower jet pipe 53 includes a plurality of lower jet holes 531, and the plurality of upper jet holes 511 and the plurality of lower jet holes 531 spray processing fluid into the plurality of slots 31 in different directions relative to the crystal boat 30. More specifically, as... Figure 5 As shown, the laminar flow plate 15 is located above the lower spray pipe 53, and a plurality of laminar flow holes 151 communicating with the lower spray pipe 53 are formed through the laminar flow plate 15. Specifically, the laminar flow plate 15 forms an upper chamber and a lower chamber within the first tank 10, with the upper chamber containing the crystal boat 30 and the lower spray pipe 53 disposed in the lower chamber. Preferably, the plurality of laminar flow holes 151 are arranged in an array, so that the treatment fluid sprayed from the lower spray pipe 53 produces a laminar flow effect on the carrier plate 7 after passing through the laminar flow holes 151. In some embodiments, the spray rates of the upper spray pipe 51 and the lower spray pipe 53 can be changed according to actual needs via a speed regulating valve (not shown).

[0035] Reference Figure 6 and Figure 4 The wet process equipment 1 of this application is also connected to a drainage device 6. The drainage device 6 includes an external pipeline 61 and a drainage pump 63. Figure 4 As shown, the first drain port 16 of the first tank 10 is connected to the external pipeline 61, and the second drain port 22 of the second tank 20 can be connected to a drain pipeline (not shown).

[0036] When the wet process equipment 1 of this application is used, a processing liquid (not shown) is continuously sprayed out through the lower spray hole 531 of the lower spray pipe 53, and the processing liquid rises through the laminar flow hole 151 of the laminar flow plate 15 and floods the carrier plate 7 (wafer, i.e., the object to be etched). At this time, the processing liquid sprayed out by the lower spray pipe 53 produces a laminar flow effect on the carrier plate 7. Next, a processing liquid of the same composition is sprayed out towards the carrier plate 7 housed in the crystal boat 30 through the upper spray hole 511 of the upper spray pipe 51 to provide sufficient flow field disturbance capability. At this time, the lateral jet sprayed out by the upper spray pipe 51 and the longitudinal jet sprayed out by the lower spray pipe interact and produce a strong turbulent effect between adjacent carrier plates 7, thereby discharging the by-products generated by etching through turbulence. Finally, the processing solution filled in the first tank 10 overflows from the top edge of the tank wall 11 into the space between the tank wall 11 and the outer wall 21 of the second tank 20, and is then discharged through the second drain port 22. The processing solution that does not overflow from the first tank 10 can be discharged through the first drain port 16, filtered, and reused. After etching, the carrier board (wafer) can be moved to a cleaning tank (not shown) for cleaning, and finally moved to a hot air drying tank (not shown) for drying, thus completing the patterning on the wafer for subsequent processes. Accordingly, the above process can achieve an etching or cleaning process that improves process efficiency and saves energy consumption.

[0037] Reference Figure 7This is a three-dimensional cross-sectional schematic diagram of a wet process apparatus according to another embodiment of this application. In this embodiment, the upper jet pipe 51 can be longitudinally reciprocated relative to the bottom plate 12 using a control component (not shown) to further generate different degrees of turbulence effect on the carrier plate 7 inside the crystal boat 30.

[0038] Reference Figure 8 This is a partial perspective cross-sectional view of a wet process apparatus according to another embodiment of this application. In this embodiment, the upper jet pipe 51 includes a plurality of upper jet holes 511 spaced apart from each other and arranged in multiple rows to generate a large-scale turbulence effect.

[0039] Reference Figure 9 This is a front cross-sectional schematic diagram of a wet process apparatus according to another embodiment of this application. In this embodiment, an upper jet pipe 51 is respectively provided on the two tank walls 11 of the first tank 10. The upper jet pipes 51 are provided on opposite sides of the crystal boat 30, thereby generating lateral jets from these opposite sides, which can produce a better turbulence effect on large-sized carrier plates 7 (e.g., wafers with a length and width of 600x600 mm), and further improve etching efficiency.

[0040] Reference Figure 10 This is a front cross-sectional schematic diagram of a wet process apparatus according to another embodiment of this application. In this embodiment, two upper jet pipes 51 are provided on the tank wall 11 to create turbulence of different ranges on the carrier plate 7 inside the crystal boat 30, thereby improving etching efficiency.

[0041] In summary, the wet process equipment provided in this application utilizes a jetting device including an upper jetting pipe and a lower jetting pipe. The laminar flow effect generated by the longitudinal jetting from the lower jetting pipe passing through the laminar flow plate, combined with the lateral jetting from the jetting pipe, creates a strong turbulent flow effect. This allows for double-sided etching of the carrier plate (wafer) inserted into the crystal boat, producing a uniform perforation morphology and effectively removing etching residues. This improves the etching rate and effectively solves the problems of traditional etching methods, such as excessively long etching times, poor perforation morphology deformation after etching, and incomplete removal of etching residues.

[0042] The embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the technical solutions and core ideas of this application. Those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A wet process equipment, characterized in that, include: The first tank includes two tank walls and a bottom plate arranged opposite to each other, the bottom plate being connected between the bottoms of the two tank walls; A crystal boat is movably disposed within the first tank and includes multiple slots, wherein the multiple slots are spaced apart from each other along a width direction of any of the two tank walls and are used to store a carrier plate. and The spraying device includes at least one upper spray pipe and at least one lower spray pipe. The upper spray pipe is arranged along the width direction of at least one of the tank walls and includes a plurality of upper spray holes. The lower spray pipe is disposed between the upper spray pipe and the tank bottom plate and is located below the crystal boat. The lower spray pipe includes a plurality of lower spray holes. The plurality of upper spray holes and the plurality of lower spray holes spray a processing liquid toward the plurality of slots in different directions relative to the crystal boat.

2. The wet process equipment as described in claim 1, characterized in that, The wet process equipment also includes a second tank arranged around the first tank, and the second tank includes an outer wall, wherein the height of the second tank wall relative to the bottom plate of the first tank is lower than the height of the outer wall relative to the bottom plate of the tank.

3. The wet process equipment as described in claim 2, characterized in that, The first tank also includes at least one first drain outlet that penetrates the bottom plate of the tank, and the second tank includes at least one second drain outlet that penetrates the bottom of one of the second tanks.

4. The wet process equipment as described in claim 1, characterized in that, Multiple carrier plates are disposed in multiple slots of the crystal boat, and the multiple upper jet holes are respectively disposed between any two carrier plates.

5. The wet process equipment as described in claim 1, characterized in that, The lower jet pipe is disposed between the two tank walls along a length of the bottom plate of the tank, and the upper jet pipe and the lower jet pipe are disposed in an alternating direction.

6. The wet process equipment as described in claim 1, characterized in that, The first tank also includes a laminar flow plate disposed between the crystal boat and the tank bottom plate, and located above the lower jet pipe. The laminar flow plate includes a plurality of laminar flow holes, which are respectively connected to the plurality of lower jet pipes.

7. The wet process equipment as described in claim 1, characterized in that, The jetting device also includes an upper liquid supply pipe, which is connected to the upper jetting pipe and is used to transfer the treatment liquid into the upper jetting pipe.

8. The wet process equipment as described in claim 1, characterized in that, The multiple upper jet holes are spaced apart from each other and arranged in multiple rows.

9. The wet process equipment as described in claim 1, characterized in that, The upper jet pipe is arranged to move longitudinally and reciprocally relative to the bottom plate of the tank.

10. The wet process equipment as described in claim 1, characterized in that, Each of the two tank walls is equipped with an upper jet pipe.

11. The wet process equipment as described in claim 1, characterized in that, The tank wall is equipped with multiple upper jet pipes.

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