Gas management assembly for high pressure heat treatment apparatus

Abstract

The present application provides a kind of high-pressure heat treatment device, it includes: internal chamber, the object to be carried out heat treatment is housed;External chamber, it is provided with: shell;And partition plate, the shell is divided into the high temperature area of the internal chamber and the low temperature area of the temperature lower than the high temperature area of the above-mentioned, and is provided with drain hole on the partition plate, the high temperature area and the low temperature area are communicated;Gas supply module, with the first pressure higher than atmospheric pressure, process gas for the heat treatment is supplied to the internal chamber, with the second pressure, protective gas is supplied to the external chamber, the setting of the second pressure is closely related to the first pressure;And discharge module, the opening of the drain hole is controlled, and the protective gas in the high temperature area is discharged to the low temperature area.

Description

Technical Field

[0001] This invention relates to a heat treatment apparatus used for heat treatment of objects under high pressure. Background Technology

[0002] Generally, in semiconductor manufacturing processes, ion implantation can cause damage at the wafer interface. Annealing is a process that uses heat treatment to restore the wafer surface from this damage. Besides annealing, wafers also require heat treatment during impurity activation, thin film formation (CVD), and Ohmic contact alloying processes.

[0003] During heat treatment, gas acts on the wafer. This gas can be supplied at high pressure to the chamber containing the wafer. After the heat treatment process is complete, the used gas is discharged from the chamber. After venting, the heat-treated wafer can be removed from the chamber. Then, new wafers and gas are supplied to the chamber for the next heat treatment step.

[0004] The chamber needs to have a certain degree of airtightness to prevent gas leakage. The chamber's airtightness (and insulation) is also important for preventing heat loss. This airtightness can also be a barrier to reducing the chamber's temperature.

[0005] Specifically, since heat treatment is performed at high temperatures, it is necessary to reduce the temperature of the chamber during or after heat treatment. For example, after heat treatment, when extracting the heat-treated wafer, the chamber temperature must first be reduced. However, due to the good sealing of the chamber, cooling it takes a long time. This results in a longer tact time for the wafer heat treatment process. Summary of the Invention

[0006] The problem to be solved One objective of this invention is to provide a high-pressure heat treatment apparatus that can rapidly cool a chamber according to different needs.

[0007] Problem-solving methods To address the aforementioned technical challenges, embodiments of the present invention provide a high-pressure heat treatment apparatus, comprising: an internal chamber for accommodating an object to be heat-treated; an external chamber having: a shell; and a partition plate dividing the shell into a high-temperature region containing the internal chamber and a low-temperature region with a temperature lower than the high-temperature region, wherein a discharge port is provided on the partition plate connecting the high-temperature region and the low-temperature region; a gas supply module supplying process gas for the heat treatment to the internal chamber at a first pressure higher than atmospheric pressure, and supplying protective gas to the external chamber at a second pressure, the second pressure being closely related to the first pressure; and a discharge module controlling the opening of the discharge port to discharge the protective gas in the high-temperature region to the low-temperature region.

[0008] Here, the aforementioned housing includes: a cover portion that, together with the aforementioned partition plate, defines the aforementioned low-temperature region; and at least one of the aforementioned cover portion and the aforementioned partition plate contains a cooling medium for cooling the aforementioned protective gas discharged into the aforementioned low-temperature region.

[0009] Here, the aforementioned cover is disposed on the upper side of the aforementioned partition plate, opposite to the aforementioned partition plate; both the aforementioned cover and the aforementioned partition plate contain the aforementioned cooling medium, and the aforementioned low-temperature region is filled with cold air released by the aforementioned cooling medium.

[0010] Here, the aforementioned cover can hold a larger amount of cooling medium compared to the aforementioned partition plate.

[0011] Here, in the aforementioned external chamber, the protective gas is cooled by heat exchange with the aforementioned cooling medium in the low-temperature region, and then circulated back to the aforementioned high-temperature region.

[0012] Here, the aforementioned discharge module includes: a through-hole cover corresponding to the aforementioned discharge hole; and a drive unit that moves the through-hole cover between a position where the aforementioned discharge hole is closed and a position where the aforementioned discharge hole is open.

[0013] Here, the aforementioned emission module also includes a hinge that rotatably attaches the aforementioned through-hole cover to the aforementioned partition plate.

[0014] Here, the aforementioned drive unit includes: an actuator capable of moving back and forth; and a connecting rod, which is rotatably coupled to the aforementioned through-hole cover.

[0015] Here, the present invention also includes: the exhaust module, which exhausts the process gas and the protective gas from the internal chamber and the external chamber; and the discharge module, which opens the discharge port before the exhaust module is operated.

[0016] Here, the present invention further includes: a heating module disposed in the high-temperature region to heat the process gas and the protective gas in the high-temperature region; and the partition plate further includes: a heat insulation layer disposed opposite to the heating module.

[0017] Another embodiment of the present invention provides a high-pressure heat treatment apparatus, comprising: an inner chamber for containing an object to be heat treated; an outer chamber having a shell, wherein the shell has a high-temperature region containing the inner chamber and a low-temperature region with a temperature lower than the high-temperature region; a gas supply module for supplying process gas for the heat treatment to the inner chamber at a first pressure higher than atmospheric pressure and supplying protective gas to the outer chamber at a second pressure, the second pressure being closely related to the first pressure; a heating module disposed in the high-temperature region for heating the process gas and the protective gas in the high-temperature region; and a discharge module for discharging the heated protective gas to the low-temperature region under the action of the heating module in the high-temperature region.

[0018] Here, the aforementioned housing includes: a partition plate that divides the aforementioned high-temperature region and low-temperature region; and a cover portion that, together with the partition plate, defines the aforementioned low-temperature region; and the partition plate forms a passage for the aforementioned protective gas to be discharged to the aforementioned low-temperature region.

[0019] Here, the aforementioned passage includes: a discharge port formed through the aforementioned partition plate, connecting the aforementioned high-temperature region and the aforementioned low-temperature region; the aforementioned discharge module includes: a through-hole cover corresponding to the aforementioned discharge port; and a drive unit that moves the aforementioned through-hole cover between a position where the aforementioned discharge port is closed and a position where the aforementioned discharge port is open.

[0020] Here, the present invention further includes: an exhaust module for exhausting the process gas and the protective gas from the internal chamber and the external chamber; and an emission module for discharging the protective gas from the high-temperature region to the low-temperature region before the exhaust module is operated.

[0021] Here, the aforementioned partition plate also includes: a heat insulation layer disposed on the upper side of the aforementioned heating module, which is positioned opposite to the aforementioned heating module.

[0022] The effects of the invention The high-pressure heat treatment device of the present invention, which has the structure described above, not only contains the inner chamber in its outer chamber, but also separates the high-temperature region and the low-temperature region. In this way, the protective gas supplied by the gas supply module is exhausted from the high-temperature region to the low-temperature region under the action of the exhaust module. The protective gas heated in the high-temperature region will undergo heat exchange in the low-temperature region, thereby completing the rapid cooling process.

[0023] After the cooled protective gas returns to the high-temperature region, it can cool the high-temperature region and the internal chamber at a faster rate than natural cooling. This completes the rapid cooling of the high-temperature chamber, thus shortening the tact time of the semiconductor wafer thermal processing. Attached Figure Description

[0024] Figure 1 This is a conceptual diagram illustrating a high-pressure heat treatment apparatus 100 according to an embodiment of the present invention.

[0025] Figure 2 The diagram is for illustration. Figure 1 Block diagram of the control structure of the medium and high pressure heat treatment device 100.

[0026] Figure 3 The diagram is for illustration. Figure 1 A partial cross-sectional view of one of the structural forms of the emission module 150 of the medium- and high-pressure heat treatment device 100.

[0027] Figure 4 It is a diagram. Figure 3 A partial cross-sectional view of another configuration of the structure related to the emission module 150.

[0028] Figure 5 It is a diagram. Figure 4 Plan view of the middle partition 123.

[0029] Figure 6 It is a diagram. Figure 3 A conceptual diagram of the emission module 150 in one form.

[0030] Figure 7 It is a diagram. Figure 3 A concept diagram of another form of the emission module 150.

[0031] (Explanation of reference numerals in the attached image) 100: High-pressure heat treatment device; 110: Internal chamber 120: External chamber; 121: Shell 123: Divider plate; 125: High-temperature zone 127: Low-temperature zone; 130: Gas supply module 140: Exhaust module; 150: Emission module 151: Through-hole cover; 155: Actuator 160: Heating module; 170: Sensing module Detailed Implementation The following description, with reference to the accompanying drawings, details the high-pressure heat treatment apparatus according to a preferred embodiment of the present invention. In this specification, even in different embodiments, the same or similar structures will be assigned the same or similar reference numerals, and similar related descriptions will be replaced by the first description text.

[0032] Figure 1 This is a conceptual diagram illustrating a high-pressure heat treatment apparatus 100 according to an embodiment of the present invention.

[0033] Referring to the figure, the high-pressure heat treatment device 100 includes: an internal chamber 110; an external chamber 120; a gas supply module 130; an exhaust module 140; and a discharge module 150.

[0034] The internal chamber 110 forms a receiving space for accommodating objects to be heat-treated. To prevent granulation under high temperature and high pressure conditions, the internal chamber 110 can be made of a non-metallic material, such as quartz. Although omitted in the accompanying drawings, a door (not shown) is provided at the lower end of the internal chamber 110 to open the receiving space. As the door descends, the receiving space is opened, and the object is picked up and transferred into the internal chamber 110 by a gripper (not shown). A heater (not shown) is provided on the outside of the internal chamber 110, under the action of the heater, the temperature of the internal chamber 110 can reach several hundred degrees Celsius. The object can be, for example, a wafer. In this case, the gripper can be a wafer boat capable of stacking the wafers into multiple layers.

[0035] The outer chamber 120 is a structure that houses the inner chamber 110. Unlike the inner chamber 110, the outer chamber 120 is not affected by semiconductor wafer contamination and can therefore be made of metallic materials. The outer chamber 120 has a housing 121, which has an internal space that can accommodate the inner chamber 110. The lower part of the housing 121 also has a door (not shown), which descends together with the door of the inner chamber 110 to open the inner space.

[0036] The aforementioned internal space can be divided into two regions by a partition plate 123. The lower side of the partition plate 123 can be the high-temperature region 125 where the internal chamber 110 is located. The upper side of the partition plate 123 can be a low-temperature region 127 with a temperature lower than that of the high-temperature region 125. The high-temperature region 125 is heated by a heater, raising its temperature to a level second only to that of the internal chamber 110, but the temperature of the low-temperature region 127 is significantly lower than that of the high-temperature region 125. The temperature of the low-temperature region 127 is affected by a cooling medium, such as cooling water, and will decrease.

[0037] The gas supply module 130 is a structure that supplies gas to chambers 110 and 120. The gas supply module 130 includes a gas supplier 131 connected to the actual equipment gas supply equipment in the semiconductor factory. The gas supplier 131 can selectively supply process gases, such as hydrogen / deuterium, fluorine, ammonia, chlorine, and nitrogen, to the internal chamber 110. The gas supplier 131 can also supply protective gases, such as nitrogen (an inert gas), to the external chamber 120. These process gases and protective gases enter the internal chamber 110 or the external chamber 120 respectively through process gas line 133 or protective gas line 135. The protective gas injected into the external chamber 120 specifically fills the space between the external chamber 120 and the internal chamber 110.

[0038] The aforementioned process gas and protective gas, as pressures higher than atmospheric pressure, can, for example, create pressures several times or even tens of times higher than atmospheric pressure. Furthermore, when the pressure of the process gas is a first pressure and the pressure of the protective gas is a second pressure, the aforementioned setting relationship between the two can be maintained. For example, the second pressure can be set to be higher than the first pressure. This pressure difference has the advantage of preventing the process gas from leaking from the internal chamber 110.

[0039] The exhaust module 140 is a structure that exhausts the aforementioned process gas and protective gas from chambers 110 and 120. To exhaust the process gas from the inner chamber 110, an exhaust pipe 141 is connected to the upper part of the inner chamber 110. The exhaust pipe 141 is located in the cryogenic region 127 and extends from the cryogenic region 127 to the outside of the outer chamber 120. A gas emitter 143 can be installed on the exhaust pipe 141. The gas emitter 143 can be a valve structure for controlling the emission of the aforementioned process gas.

[0040] To discharge the protective gas from the external chamber 120, similar to the structure described above, an exhaust pipe 145 connected to the external chamber 120 and a gas emitter 147 mounted thereon can be provided. Since these exhaust pipes 141 and 145 are interconnected, the concentration of the process gas decreases after being diluted by the protective gas, and it is then discharged.

[0041] The emission module 150 is a structure that discharges the protective gas present in the high-temperature region 125 to the low-temperature region 127. The protective gas present in the high-temperature region 125 has greater energy than the protective gas present in the low-temperature region 127. Therefore, it can be discharged to the low-temperature region 127 through convection. The protective gas can lose heat energy in the low-temperature region 127 and circulate back to the high-temperature region 125. Due to the circulation and heat exchange of the protective gas, the high-temperature region 125 and the internal chamber 110 can be rapidly cooled.

[0042] The control structure of the high-pressure heat treatment device 100 is referenced. Figure 2 Please provide a detailed explanation. Figure 2 The diagram is for illustration. Figure 1 Block diagram of the control structure of the medium and high pressure heat treatment device 100.

[0043] Refer to this figure and Figure 1 In addition to the gas supply module 130 and other structures described above, the high-pressure heat treatment device 100 may also include: a heating module 160; a sensing module 170; a control module 180; and a storage module 190.

[0044] The heating module 160 described above includes the heater described above. The heater can be disposed inside the external chamber 120. The heater can heat the process gas to rapidly reach the process temperature.

[0045] The sensing module 170 is a structure used to sense the environment of the chambers 110 and 120. The sensing module 170 may be equipped with a pressure sensor 171 and a temperature sensor 175. The pressure sensor 171 and the temperature sensor 175 may be installed in each of the chambers 110 and 120.

[0046] The control module 180 is a structure that controls the air supply module 130, the exhaust module 140, etc. The control module 180 can control the air supply module 130 and other structures based on the sensing results of the sensing module 170.

[0047] The aforementioned storage module 190 is a structure designed to store and provide referenceable data, programs, etc., to the control module. The storage module 190 may include at least one type of storage medium, such as flash memory, hard disk, magneto-optical disk, and optical disk.

[0048] According to the above structure, the control module 180 can control the operation of the gas supply module 130 based on the first pressure and the second pressure obtained by the pressure device 171 in the chambers 110 and 120.

[0049] The control module 180 can also control the operation of the discharge module 150 based on the temperatures of the chambers 110 and 120 obtained by the temperature sensor 175. The discharge module 150 is activated when it is necessary to reduce the temperature of the chambers 110 and 120 during the heat treatment process, or at the end of the heat treatment.

[0050] Upon completion of heat treatment, the exhaust module 140 is activated, and the emission module 150 can be activated before the process gas is vented. Based on the operation of the emission module 150, the protective gas cools the process gas through natural circulation and heat exchange. The process gas can be cooled to below a set temperature and then vented through the exhaust module 140. This prevents potential hazards such as explosions when the process gas is vented at a high temperature.

[0051] The specific structure and operation of the aforementioned emission module 150 will refer to Figures 3 to 7 Please provide an explanation.

[0052] first, Figure 3 The diagram is for illustration. Figure 1 A partial cross-sectional view of one of the structural forms of the emission module 150 of the medium- and high-pressure heat treatment device 100. Figure 4 It is a diagram. Figure 3 A partial cross-sectional view of another configuration of the structure related to the emission module 150.

[0053] Referring further to the figure, the housing 121 may include a main body portion 121a and a cover portion 121b. If the main body portion 121a is generally cylindrical, then the cover portion 121b has a corresponding shape to the open upper portion of the main body portion 121a. The cover portion 121b may generally have a dome-like shape.

[0054] The partition plate 123 is provided to separate the cover portion 121b from it in a positional opposite to it. The partition plate 123 is supported on the main body portion 121a and is provided on the lower side of the cover portion 121b. The partition plate 123, together with the main body portion 121a, defines the high-temperature region 125, and together with the cover portion 121b, defines the low-temperature region 127.

[0055] The heating module 160 is provided in the high-temperature region 125. The heating module 160 may include a heater 161 and a heat insulation block 165. The heater 161 may have a shape that encloses the internal chamber 110. The protective gas in the high-temperature region 125 and the processing gas in the internal chamber 110 can be heated by the heat generated by the heater 161. The heat insulation block 165 houses the heater 161, thus preventing the heat from the heater 161 from being transferred to the main body 121a.

[0056] Corresponding to the heater 161, a heat insulation layer 123a may be provided on the lower part of the partition plate 123. The heat insulation layer 123a may be provided on the upper side of the heating module 160, thereby forming a positional relationship directly opposite the heater 161. The heat insulation layer 123a can prevent the heat generated by the heater 161 from being transferred to the low-temperature region 127.

[0057] A cooling layer 123b may be provided on the upper part of the partition plate 123. The cooling layer 123b has a space for containing a cooling medium, such as cooling water. Corresponding to the cooling layer 123b, the cover portion 121b may also be provided with a space for containing cooling water. The cover portion 121b can hold more cooling water than the partition plate 123. Since the cover portion 121b defines the upper part of the low-temperature region 127, the protective gas discharged into the low-temperature region 127 mainly exchanges heat with the cover portion 121b during the process of rising to its maximum temperature.

[0058] Cooling water contained in the aforementioned cover portion 121b and / or the aforementioned cooling layer 123b fills the low-temperature region 127 with cold air. Therefore, the temperature of the low-temperature region 127 can be maintained at a low temperature level. The aforementioned protective gas discharged into the low-temperature region 127 can exchange heat with the aforementioned cold air and be cooled.

[0059] A through-hole 123c may also be provided on the aforementioned partition plate 123. The aforementioned through-hole 123c is a structure that connects the high-temperature region 125 and the low-temperature region 127. The aforementioned through-hole 123c can be opened and closed under the control of the aforementioned discharge module 150.

[0060] The external chamber 120 allows the protective gas to circulate from the low-temperature region 127 to the high-temperature region 125. For example, the external chamber 120 may form a gap G structure between the partition plate 123 and the main body portion 121a, and between the main body portion 121a and the heating module 160. In this case, the protective gas can circulate through the gap G.

[0061] According to the above structure, when the emission module 150 closes the emission port 123c... Figure 3 The heat generated by the heater 161 can heat the gas in the internal chamber 110 and the high-temperature region 125. The heat generated by the heater 161 cannot be transferred to the low-temperature region 127 due to the heat insulation layer 123a. Furthermore, the low-temperature region 127 can also be maintained at a low temperature by the cooling water in the cover portion 121b and / or the cooling layer 123b. Therefore, even if the high-temperature region 125 and the low-temperature region 127 have the same pressure, their temperature states will have a significant difference.

[0062] When the process gas needs to be cooled, the discharge port 123c is opened under the control of the discharge module 150. In this case, the protective gas in the high-temperature region 125 rises through the discharge port 123c and flows to the low-temperature region 127. The high-temperature protective gas exchanges heat with the cooling water in the low-temperature region 127. The cooled low-temperature protective gas can return to the high-temperature region 125 through the gap G [or discharge port 123c] and other structures between the partition plate 123 and the main body 121a.

[0063] As the protective gas continuously circulates through natural convection, the process gas can exchange heat with it, achieving rapid cooling. After sufficient cooling, the process gas can be discharged to the outside through the exhaust pipe 141.

[0064] Next, Figure 5 It is a diagram. Figure 4 Plan view of the middle partition 123.

[0065] Referring to this figure, the discharge hole 123c is located at a position away from the center of the cooling layer 123b. This is because the upper part of the internal chamber 110 is located at the center of the cooling layer 123b.

[0066] The cooling layer 123b is disc-shaped, and the discharge hole 123c can also be a circular opening. In this case, the diameter D1 of the discharge hole 123c can be in a specific ratio to the diameter D2 of the cooling layer 123b. Specifically, this determined ratio can prevent the adverse effects of thermal shock on the internal chamber 110 due to rapid heat dissipation during the process of discharging heat from the high-temperature region 125 to the low-temperature region 127.

[0067] The above description uses the discharge port 123c as a flow path to illustrate the case where the protective gas is discharged from the high-temperature region 125 to the low-temperature region 127. However, the channel can also be of other forms. For example, since the partition plate 123 is a structure that rotates or moves up and down around a horizontal axis, the space formed between the partition plate 123 and the housing 121 can serve as the channel.

[0068] Figure 6 It is a diagram. Figure 3 A conceptual diagram of a single state of the medium emission module 150. Figure 7 It is a diagram. Figure 3 Conceptual diagram of another state of the emission module 150.

[0069] Referring to this figure for further explanation, the above-mentioned emission module 150 may include a through-hole cover 151, a hinge 153, an actuator 155, and a chain link 157.

[0070] The dimensions of the aforementioned through-hole cover 151 correspond to those of the aforementioned discharge hole 123c. The aforementioned through-hole cover 151 can be in a closed position. Figure 6 Close the aforementioned discharge port 123c. The aforementioned through-hole cover 151 can then be in the open position. Figure 7 Open the above-mentioned discharge port 123c.

[0071] The through-hole cover 151 can be rotated and attached to the partition plate 123 via hinge 153. This design allows the through-hole cover 151 to rotate between the closed position and the open position.

[0072] To enable the movement of the through-hole cover 151, a drive unit may be provided. The drive unit may include an actuator 155 and a connecting rod 157.

[0073] The actuator 155 described above is a structure that moves back and forth. The actuator 155 may be a cylinder structure that rotates back and forth. More specifically, the cylinder may be an electric cylinder operated by an electric motor.

[0074] The connecting rod 157 is a structure that connects the movable part of the cylinder to the through-hole cover 151. One end of the connecting rod 157 is engaged with the through-hole cover 151, while the other end of the connecting rod 157 is rotatably engaged with the movable part. In order to accommodate the rotation of the connecting rod 157, an elongated hole is provided in one of the structures of the connecting rod 157 and the movable part, and a pin that can be movably inserted into the elongated hole can be provided in the other.

[0075] The high-pressure heat treatment apparatus described above is not limited to the setup and operation methods of the above embodiments. Various modified embodiments can also be achieved by selectively combining all or part of the structures in the various embodiments.

Claims

1. A high-pressure heat treatment apparatus, characterized in that, include: The internal chamber contains the object to be heat-treated. An external chamber is provided with: a shell; and a partition plate that divides the shell into a high-temperature region that houses the internal chamber and a low-temperature region with a temperature lower than the high-temperature region, and a discharge hole is provided on the partition plate to connect the high-temperature region and the low-temperature region. The gas supply module supplies process gas for the heat treatment to the internal chamber and brings the process gas to a first pressure higher than atmospheric pressure. It also supplies protective gas to the external chamber and brings the protective gas to a second pressure set in association with the first pressure. as well as The emission module controls the opening of the emission port, allowing the protective gas in the high-temperature region to be emitted into the low-temperature region. The aforementioned housing includes: a cover portion, which, together with the aforementioned partition plate, defines the aforementioned low-temperature region; The aforementioned cover and the aforementioned partition plate contain a cooling medium, and the aforementioned low-temperature area is filled with cold air released by the aforementioned cooling medium.

2. The high-pressure heat treatment apparatus according to claim 1, characterized in that, The aforementioned cover is located on the upper side of the aforementioned partition plate, opposite to the aforementioned partition plate.

3. The high-pressure heat treatment apparatus according to claim 2, characterized in that, The aforementioned cover can hold a larger amount of cooling medium compared to the aforementioned partition plate.

4. The high-pressure heat treatment apparatus according to claim 1, characterized in that, The aforementioned external chamber allows the protective gas to exchange heat with the aforementioned cooling medium in the low-temperature region and then circulate back to the aforementioned high-temperature region.

5. The high-pressure heat treatment apparatus according to claim 1, characterized in that, The aforementioned emission modules include: A through-hole cap, formed corresponding to the aforementioned discharge hole; and The drive unit is formed in such a way that it can move between a position where the through hole is closed and a position where the through hole is open.

6. The high-pressure heat treatment apparatus according to claim 5, characterized in that, The aforementioned emission module further includes a hinge that rotatably attaches the aforementioned through-hole cover to the aforementioned partition plate.

7. The high-pressure heat treatment apparatus according to claim 6, characterized in that, The aforementioned drive unit includes: an actuator capable of moving back and forth; and a connecting rod, which is combined with the aforementioned through-hole cover and rotatably coupled to the aforementioned actuator.

8. The high-pressure heat treatment apparatus according to claim 1, characterized in that, Also includes: The exhaust module exhausts the process gas and the protective gas from the internal and external chambers; and the discharge module opens the discharge port before the exhaust module is operated.

9. The high-pressure heat treatment apparatus according to claim 1, characterized in that, Also includes: A heating module is installed in the high-temperature region to heat the process gas and the protective gas in the high-temperature region. The aforementioned partition plate also includes a heat insulation layer opposite to the aforementioned heating module.

10. A high-pressure heat treatment apparatus, characterized in that, include: The internal chamber contains the object to be heat-treated. An outer chamber is provided with a shell, and the shell has a high-temperature region that houses the inner chamber and a low-temperature region with a temperature lower than the high-temperature region. The gas supply module supplies process gas for the heat treatment to the internal chamber and brings the process gas to a first pressure higher than atmospheric pressure. It also supplies protective gas to the external chamber and brings the protective gas to a second pressure set in association with the first pressure. as well as A heating module, disposed in the aforementioned high-temperature region, heats the aforementioned process gas and the aforementioned protective gas within the high-temperature region; and The emission module, under the influence of the heating module in the high-temperature region, discharges the heated protective gas into the low-temperature region. The aforementioned housing includes: The partition plate divides the aforementioned high-temperature and low-temperature zones; and The cap, together with the aforementioned partition plate, defines the aforementioned low-temperature region; The aforementioned cover and the aforementioned partition plate contain a cooling medium, and the aforementioned low-temperature area is filled with cold air released by the aforementioned cooling medium.

11. The high-pressure heat treatment apparatus according to claim 10, characterized in that, The aforementioned partition plate forms a passage for the protective gas to exit into the aforementioned low-temperature region.

12. The high-pressure heat treatment apparatus according to claim 11, characterized in that, The aforementioned pathway includes: a discharge port, which is formed through the aforementioned partition plate and connects the aforementioned high-temperature region and the aforementioned low-temperature region; The aforementioned emission modules include: A through-hole cap, formed corresponding to the aforementioned discharge hole; and The drive unit is formed in such a way that it can move between a position where the through hole is closed and a position where the through hole is open.

13. The high-pressure heat treatment apparatus according to claim 10, characterized in that, Also includes: The exhaust module exhausts the aforementioned process gas and the aforementioned protective gas from the aforementioned internal chamber and external chamber; Before the exhaust module is activated, the aforementioned emission module will release the protective gas from the high-temperature region to the low-temperature region.

14. The high-pressure heat treatment apparatus according to claim 11, characterized in that, The aforementioned partition plate also includes: a heat insulation layer disposed on the upper side of the aforementioned heating module, which is opposite to the position of the aforementioned heating module.

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