Ejector pin device and semiconductor process equipment

Abstract

The application provides a pin device and a semiconductor processing equipment. The pin device comprises a pin and a temperature measuring component. The pin is used for supporting a wafer. The temperature measuring component comprises a flexible connecting piece and a temperature measuring piece. The fixed end of the flexible connecting piece is connected with the pin, and the free end of the flexible connecting piece is located on the outer circumferential side of the upper end of the pin. The temperature measuring piece is arranged on the free end and faces the pin. The flexible connecting piece is arranged to be bent under the compression of the wafer when the pin supports the wafer, so that the temperature measuring piece is attached to the wafer.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing, and more specifically, to a pin device and semiconductor process equipment. Background Technology

[0002] The back-end processes of integrated circuits mainly include interconnects, packaging, and WAT (Wafer Acceptance Test), among which interconnects play a crucial role. Of all interconnects, copper interconnects are currently the most widely used. Copper interconnects offer a range of advantages, including low resistance, good electromigration resistance, and excellent electrical properties. In the fabrication process of copper interconnects, the wafer (e.g., a silicon wafer) first enters a degassing chamber to remove water vapor and residual gases adhering to the wafer surface; then it enters a pre-cleaning chamber to further remove residual gases and also to reduce the underlying oxides; next, it enters a physical vapor deposition chamber to prepare a barrier layer, which includes tantalum (Ta) and tantalum nitride (TaN). Tantalum nitride is generated by introducing nitrogen gas (N2) into the chamber, where the nitrogen reacts with tantalum ions sputtered from the target on the wafer; finally, the wafer enters a copper chamber where a thin copper seed layer is deposited along the trenches of the wafer to prepare for the next step of electroplating. Electroplating involves immersing the wafer in a chemical solution, with the copper seed layer acting as the cathode, to completely fill the trenches; finally, chemical mechanical polishing is used to planarize the uneven surface after electroplating, and then the next trench is filled until the top layer of the wafer is reached.

[0003] As manufacturing processes become increasingly advanced, electroplating can no longer achieve complete filling. Current technology employs reflow copper deposition, which effectively reduces the aspect ratio of the deposited copper. The reflow process first uses physical vapor deposition to prepare a copper film of a certain thickness within vias or trenches, then the wafer is heated to a high temperature. Because copper has a low melting point, the copper on the sidewalls of the vias or trenches slowly melts during heating, flowing to the bottom of the vias or trenches, increasing the bottom coverage and thus reducing the aspect ratio of the trenches. After multiple reflow deposition cycles, the vias or trenches can be completely filled.

[0004] If heating abnormalities occur during the reflow process, the heating device needs to be replaced. However, current technology typically monitors the process only at regular intervals, which is a lengthy process and cannot guarantee the stability of the copper reflow process, posing significant risks.

[0005] Therefore, how to monitor wafer temperature during the reflow process is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0006] This application aims to solve at least one of the technical problems existing in the prior art, and proposes a pin device and semiconductor process equipment that can measure wafer temperature in reflow process.

[0007] To achieve the purpose of this application, a ejector pin device is provided for use in semiconductor process equipment, including an ejector pin and a temperature measuring component, wherein the ejector pin is used to support a wafer;

[0008] The temperature measuring component includes a flexible connector and a temperature measuring element. The fixed end of the flexible connector is connected to the ejector pin, and the free end of the flexible connector is located on the outer periphery of the upper end of the ejector pin. The temperature measuring element is disposed at the free end and faces the ejector pin. The flexible connector is configured to bend under the pressure of the wafer when the ejector pin supports the wafer, so that the temperature measuring element fits the wafer.

[0009] In some embodiments, the connecting wire of the temperature measuring element is disposed between the surfaces of the flexible connector and the ejector pin that are opposite to each other, and extends from the lower end of the ejector pin.

[0010] In some embodiments, the width of the flexible connector, perpendicular to its extension direction, gradually decreases from the fixed end to the free end.

[0011] In some embodiments, there are at least two temperature measuring components, and the free ends of the flexible connectors of the at least two temperature measuring components are distributed circumferentially at intervals along the ejector pin.

[0012] In some embodiments, the ejector pin includes an ejector pin body and a telescopic portion disposed at the upper end of the ejector pin body. When in contact with the wafer, the upper end of the telescopic portion descends a predetermined distance relative to the ejector pin body, so that the flexible connector bends when compressed by the wafer.

[0013] In some embodiments, the telescopic portion includes a telescopic head and an elastic element, wherein the telescopic head is disposed above the upper end of the ejector pin body for supporting the wafer; and the elastic element is connected between the telescopic head and the upper end of the ejector pin body.

[0014] In some embodiments, the telescopic head is provided with a first mating part, and the ejector pin body is provided with a second mating part;

[0015] The first mating part and the second mating part are movable relative to each other along the axial direction of the ejector body to restrict the telescopic head from telescopically extending or retracting along the axial direction of the ejector body.

[0016] In some embodiments, the first mating part is a limiting cavity disposed at the lower end of the telescopic head, and the second mating part is a limiting recess formed on the outer peripheral surface of the ejector body. The inner peripheral surface of the limiting cavity and the outer peripheral surface of the limiting recess can be mated relative to each other along the axial direction of the ejector body.

[0017] The elastic element is disposed in the limiting cavity.

[0018] In some embodiments, the flexible connector is made of silicone rubber.

[0019] As another technical solution, the present invention also provides a semiconductor process apparatus, including a process chamber and a base disposed in the process chamber, a heating device, and the ejector pin device provided by the present invention.

[0020] The base is used to support the wafer, and the base has a pin hole that penetrates the base in a vertical direction;

[0021] The ejector pin in the ejector pin device is liftable and can pass through the ejector pin hole so that the upper end of the ejector pin is higher or lower than the upper surface of the base;

[0022] The heating device is used to heat the wafer.

[0023] In some embodiments, there are at least two temperature measuring components, and the temperature measuring components of the at least two temperature measuring components located at the free end of the flexible connector are evenly distributed on a circumference centered on the contact point between the ejector pin and the wafer.

[0024] In some embodiments, a vacuum connector and a temperature collector are also included, wherein,

[0025] The vacuum connector is disposed on the bottom chamber wall of the process chamber and is electrically connected to the connecting wire of the temperature measuring element.

[0026] The temperature collector is located outside the process chamber and is electrically connected to the vacuum connector temperature sensor to collect the wafer temperature detected by the temperature sensor.

[0027] This application has the following beneficial effects:

[0028] The ejector pin device provided in this application includes an ejector pin for supporting a wafer and a temperature measuring component. The temperature measuring component includes a flexible connector and a temperature measuring component. The fixed end of the flexible connector is connected to the ejector pin, and the free end of the flexible connector is located on the outer periphery of the upper end of the ejector pin. The temperature measuring component is disposed at the free end and faces the ejector pin. The flexible connector is configured to bend under the pressure of the wafer when the wafer is supported by the ejector pin, so that the temperature measuring component fits against the wafer. This allows for real-time measurement of the wafer temperature during the reflow process, thereby ensuring the stability of the reflow process, timely detection of abnormalities, and reducing the risk of chip scrap. Furthermore, the wafer temperature uniformity can be monitored during the reflow process, allowing for optimization of wafer temperature uniformity, thus ensuring chip yield and increasing economic benefits. Moreover, by utilizing the elasticity of the flexible connector and placing the temperature measuring component at the free end of the flexible connector, it can be ensured that the temperature measuring component fits tightly against the wafer when the free end of the flexible connector is subjected to wafer pressure, thereby ensuring measurement stability. In addition, the flexible connector can also protect the temperature measuring element, enabling it to be used stably and continuously under the high temperature conditions of the heating lamp.

[0029] This application also provides a semiconductor process apparatus including the above-described ejector pin device, and has the aforementioned advantages. Attached Figure Description

[0030] Figure 1 A schematic diagram of the ejector pin device provided in a specific embodiment of this application;

[0031] Figure 2 for Figure 1 A schematic diagram of the structure when the center pin device supports the wafer;

[0032] Figure 3 This is a schematic diagram of a wafer being supported by a ejector pin assembly.

[0033] Figure 4 for Figure 1 A magnified view of a portion of the image;

[0034] Figure 5 for Figure 2 A magnified view of a portion of the image;

[0035] Figure 6 This is a schematic diagram of a ejector pin device supporting a wafer in semiconductor process equipment.

[0036] Figure 7 This is a schematic diagram of a substrate supporting a wafer in a semiconductor process equipment.

[0037] in, Figures 1 to 7 The attached figures are labeled as follows:

[0038] Ejector device 100, base 2, ejector hole 21, temperature measuring point 22, wafer 3, heating lamp 4, first reflector 5, second reflector 6, shielding liner 7, shielding ring 8, lifting mechanism 9, vacuum connector 10, temperature collector 11, controller 12, ejector 1, telescopic head 1101, ejector body 120, spring 130, temperature measuring component 200, temperature measuring part 210, flexible connector 220, thermocouple wire 230. Detailed Implementation

[0039] To enable those skilled in the art to better understand the technical solutions of this application, the ejector pin device and semiconductor process equipment provided in this application will be described in detail below with reference to the accompanying drawings.

[0040] Please refer to the following: Figures 1 to 7 This application provides a ejector pin device 100 for use in semiconductor process equipment. Reflow processes typically employ a heating lamp 4 to heat the lower surface of a wafer 3. During the reflow process, the ejector pin device 100 supports the wafer 3, and the heating light from the heating lamp 4 irradiates the lower surface of the wafer 3, raising its temperature and causing the copper film on the wafer 3 to melt and fill the vias or trenches of the wafer 3.

[0041] The ejector pin assembly 100 includes an ejector pin 1 and a temperature measuring component 200. The ejector pin 1 is used to support the wafer 3. The temperature measuring component 200 includes a flexible connector 220 and a temperature measuring component 210. The fixed end (e.g., the lower end) of the flexible connector 220 is connected to the ejector pin 1, and the free end (e.g., the upper end) of the flexible connector 220 is located on the outer periphery of the upper end of the ejector pin 1. The temperature measuring component 210 is disposed at the free end of the flexible connector 220 and faces the ejector pin 1 when it is not under stress. The flexible connector 220 is configured to bend under the pressure of the wafer 3 when the ejector pin 1 supports the wafer, so that the temperature measuring component 210 fits the wafer 3.

[0042] Temperature sensing element 210 is used to measure the temperature of wafer 3 in real time during the reflow process, thereby ensuring the stability of the reflow process, promptly detecting anomalies, and reducing the risk of chip scrap. Furthermore, multiple temperature sensing elements 210 corresponding to the ejector pins 1 can also monitor the wafer temperature uniformity during the reflow process, thereby optimizing wafer temperature uniformity, ensuring chip yield, and increasing economic benefits. Moreover, utilizing the elasticity of the flexible connector 220 and positioning the temperature sensing element 210 at its free end ensures that the temperature sensing element 210 remains tightly fitted to the wafer 3 when the free end of the flexible connector 220 is pressed by the wafer 3, thus guaranteeing measurement stability. In addition, the flexible connector 220 also protects the temperature sensing element 210, allowing it to continue operating under high-temperature conditions under heating lamp irradiation.

[0043] In addition, semiconductor process equipment also includes a base 2, which can be used to support the wafer 3 in processes other than reflow, such as... Figure 7 As shown, the base 2 rises to the process position and supports the wafer 3, while the upper end of the ejector pin 1 is lower than the bearing surface of the base 2. The ejector pin assembly 100 includes, for example, at least three ejector pins 1, spaced circumferentially along the base 2, for collectively supporting the wafer 3. The base 2 has ejector pin holes 21 penetrating the base 2 in a vertical direction; the number of ejector pin holes 21 is the same as the number of ejector pins 1, and they are arranged in a one-to-one correspondence. During the reflow process, as... Figure 6 As shown, the base 2 descends to a low position below the process position. During this process, each ejector pin 1 can pass through the corresponding ejector pin hole 21 and contact the wafer 3 to support the wafer 3.

[0044] When ejector pin 1 is not supporting wafer 3, such as Figure 1 As shown, the free end of the flexible connector 220 is close to the upper end of the ejector pin 1. At this time, the circumferential diameter of the ejector pin 1 and the flexible connector 220 as a whole is smaller than the diameter of the ejector pin hole 21, so that the ejector pin 1 and the flexible connector 220 can pass through the corresponding ejector pin hole 21.

[0045] In some embodiments, there are at least two temperature sensing elements 200, and the free ends of the flexible connectors 220 of the at least two temperature sensing elements 200 are distributed circumferentially along the ejector pin 1. Each flexible connector 220 has a temperature sensing element 210 at its free end. Thus, when the ejector pin 1 contacts the wafer 3, the flexible connectors 220 of the at least two temperature sensing elements 200 bend simultaneously, causing each temperature sensing element 210 to contact different positions on the wafer, thereby allowing for multi-point temperature measurement of the wafer 3. The ejector pin device 100 typically includes at least three ejector pins 1 for jointly supporting the wafer 3. In this case, as shown... Figure 3 As shown, at least two temperature measuring points 22 are distributed around each of the at least three pins 1, for example... Figure 3 The four temperature measuring points 22 shown indicate that each ejector pin 1 has four corresponding temperature measuring components 200. This allows for multi-point temperature measurement of the wafer 3 and improves the uniformity of the distribution of multiple temperature measuring points 22 on the lower surface of the wafer 3, thereby making the temperature measurement more accurate. The aforementioned temperature measuring point 22 refers to the temperature measuring point 22 on the wafer 3 where the temperature measuring component 210 is in contact with the wafer 3.

[0046] In one specific embodiment of this application, such as Figure 3As shown, the four temperature measuring points 22 corresponding to one ejector pin 1 can be arranged in a square with the contact point between the ejector pin 1 and the wafer 3 as the center. The three ejector pins 1 can be evenly distributed along the circumference of the wafer 3, thus ensuring that the square formed by the temperature measuring points 22 around the three ejector pins 1 is also evenly distributed along the circumference of the wafer 3. This further improves the uniformity of the distribution of multiple temperature measuring points 22 on the lower surface of the wafer 3, thereby improving the accuracy of temperature measurement.

[0047] Furthermore, the diagonal of the square formed by the four temperature measuring points 22 after each ejector pin 1 is bonded to the wafer 3 can coincide with the projection of a diameter of the wafer 3 onto the horizontal plane. Therefore, the four temperature measuring points 22 can measure the temperature at multiple locations in the radial direction of the wafer 3, further improving the accuracy of temperature measurement. Of course, the number of temperature measuring components 200 corresponding to each ejector pin 1 is not limited to this. For example, the ejector pin device 100 may also include five temperature measuring components 200. The temperature measuring components 200 corresponding to each ejector pin 1 may also adopt other distribution methods. For example, in the embodiment where the ejector pin device 100 includes four temperature measuring components 200, the temperature measuring points 22 corresponding to each ejector pin 1 may also be distributed in a trapezoidal shape on the wafer 3.

[0048] In some embodiments, the connecting wire of the temperature sensing element 210 is used to transmit the temperature signal detected by the temperature sensing element 210. The connecting wire of the temperature sensing element 210 is disposed between the surfaces of the flexible connector 220 and the ejector pin 1 facing each other, and extends from the lower end of the ejector pin 1. Specifically, the connecting wire of the temperature sensing element 210 is located on the side of the flexible connector 220 facing the ejector pin 1, so that the flexible connector 220 can protect the connecting wire and ensure that the temperature sensing element 210 can be used continuously under the high temperature conditions of the heating lamp irradiation. Moreover, the end of the connecting wire away from the temperature sensing element 210 extends downward along the extension direction of the flexible connector 220 and extends from the lower end of the ejector pin 1, such as... Figure 6 and Figure 7 As shown, the connecting line is used to electrically connect to the vacuum connector 10 located on the bottom chamber wall of the process chamber of the semiconductor process equipment. The vacuum connector 10 is electrically connected to the temperature collector 11 located outside the process chamber, so that the temperature signal detected by the temperature sensor 210 can be transmitted to the temperature collector 11 through the vacuum connector 10.

[0049] During the reflow process, the temperature sensing unit 210 contacts the wafer 3, converts the acquired temperature signal into an electrical signal, and transmits it sequentially to the temperature collector 11 through the connecting wire and the vacuum connector 10. The temperature collector 11 collects the temperature data measured by each temperature sensing unit 210 corresponding to each ejector pin 1. The temperature collector 11 can be further connected to the controller 12, which determines the temperature distribution on the wafer 3 based on the position of each temperature sensing unit 210 and the measured temperature data, so that the corresponding heating lamp 4 can be replaced when an abnormal temperature occurs on the wafer 3.

[0050] Optional, such as Figure 6 and Figure 7 As shown, the temperature sensing unit 210 is a thermocouple, and the connecting wire is a thermocouple wire 230. The thermocouple can measure the temperature of the lower surface of the wafer 3, and the thermocouple wire 230 connects the thermocouple to the vacuum connector 10. Of course, the temperature sensing unit 210 is not limited to using a thermocouple; in practical applications, other temperature sensing elements can also be used to measure the temperature of the wafer 3, which is not limited here. In addition, the temperature sensing unit 210 can also use other methods to transmit the measured temperature signal to the external temperature collector 11.

[0051] In some embodiments, the width of the flexible connector 220 perpendicular to its extension direction gradually decreases from the fixed end to the free end. The portion of the flexible connector 220 near its fixed end has a relatively large width, which helps to improve the rigidity of the flexible connector 220. This not only avoids the flexible connector 220 being too elastic, which could cause the temperature measuring part 210 to fail to fit the wafer 3, but also improves the connection reliability between the flexible connector 220 and the ejector pin 1. The portion of the flexible connector 220 near its fixed end has a relatively small width, which makes the free end of the flexible connector 220 easier to bend.

[0052] Optionally, the flexible connector 220 can be made of silicone rubber, which has the advantages of high temperature resistance and good elasticity, and can maintain good elasticity even in high temperature environments. Of course, the flexible connector 220 can also be made of other materials. For example, the part of the flexible connector 220 near its fixed end can be made of a material with higher rigidity, and the part of the flexible connector 220 near its free end can be made of a material with better elasticity.

[0053] Optionally, the orthographic projection of the flexible connector 220 on the horizontal cross-section can be arc-shaped, so the overall flexible connector 220 can be groove-shaped, which improves the rigidity of the flexible connector 220 in the vertical direction, prevents the flexible connector 220 from bending when it is not subjected to the weight of the wafer, and ensures that the ejector pin 1 and the flexible connector 220 can be inserted into the corresponding ejector pin hole 21.

[0054] In some embodiments, when the free end of the flexible connector 220 is pressed by the wafer 3, in order to increase the bending degree of the flexible connector 220 to ensure that the temperature sensing element 210 can fit tightly against the wafer 3, such as... Figure 2As shown, the ejector pin 1 includes an ejector pin body 120 and a telescopic portion 110 disposed at the upper end of the ejector pin body 120. When in contact with the wafer, the upper end of the telescopic portion 110 descends a predetermined distance relative to the ejector pin body 120, so that the flexible connector 220 bends when pressed by the wafer. The aforementioned predetermined distance can be set according to specific needs. For example, after the telescopic portion 110 descends a predetermined distance due to contact with the wafer, the flexible connector 220 bends, at which time the temperature measuring element 210 faces the wafer 3, thereby being able to fit against the wafer 3.

[0055] In some embodiments, such as Figure 4 and Figure 5 As shown, the telescopic part 110 includes a telescopic head 1101 and an elastic member 1102. The telescopic head 1101 is disposed above the upper end of the ejector pin body 120 and is used to support the wafer 3. The elastic member 1102 is connected between the telescopic head 1101 and the upper end of the ejector pin body 120. The elastic member 1102 is used to achieve an elastic connection between the telescopic head 1101 and the ejector pin body 120. When the telescopic head 1101 comes into contact with the wafer, the elastic member 1102 undergoes compression deformation, causing the telescopic head 1101 to descend a preset distance relative to the ejector pin body 120. As the wafer descends with the telescopic head 1101, it will compress the flexible connector 220 and bend it, thereby causing the temperature measuring element 210 to conform to the wafer.

[0056] like Figure 4 As shown, the upper and lower ends of the elastic element 1102 abut against the telescopic head 1101 and the ejector body 120, respectively. When the telescopic head 1101 is not in contact with the wafer, the elastic force of the elastic element 1102 supports the telescopic head 1101, maintaining a certain vertical distance between it and the upper end of the ejector body 120. Simultaneously, the weight of the telescopic head 1101 compresses the elastic element 1102, but the deformation of the elastic element 1102 does not reach its maximum compression. Alternatively, the weight of the telescopic head 1101 is less than or equal to the elastic force of the elastic element 1102; in this case, the elastic element 1102 remains in its uncompressed original state. Figure 5 As shown, when the telescopic head 1101 contacts the wafer, the elastic element 1102 can be further compressed under the combined force of gravity of the wafer and the telescopic head 1101. The telescopic head 1101 moves towards the ejector pin body 120, shortening the length of the ejector pin 1. When the telescopic head 1101 is no longer in contact with the wafer, it moves away from the ejector pin body 120 under the action of the elastic element 1102, causing the ejector pin 1 to gradually return to its original length. For example, the elastic element 1102 is a spring. Of course, the elastic element 1102 can also be a flexible element made of materials such as rubber or silicone; this is not limited here.

[0057] In some embodiments, in order to ensure that the telescopic head 1101 can move along the axial direction of the ejector body 120, the telescopic head 1101 is provided with a first mating part, and the ejector body 120 is provided with a second mating part; the first mating part and the second mating part can be mated relative to each other along the axial direction of the ejector body 120 to limit the telescopic head 1101 from telescopically extending and retracting along the axial direction of the ejector body 120. In this way, the telescopic head 1101 can be prevented from swinging during the lifting and lowering process, and the ejector body 120 can stably support the wafer.

[0058] The first and second mating parts that achieve the above functions can have various structures. For example, the first mating part is a limiting cavity 1103 located at the lower end of the telescopic head 1101, and the second mating part is a limiting recess 1201 formed on the outer peripheral surface of the ejector body 120. The inner peripheral surface of the limiting cavity 1103 and the outer peripheral surface of the limiting recess 1201 can be relatively movable along the axial direction of the ejector body 120, thereby guiding the lifting and lowering of the telescopic head 1101. The elastic member 1102 is disposed in the limiting cavity 1103. Specifically, the limiting cavity 1103 has an internal space 1104 with an opening at the bottom. The elastic member 1102 is located in the internal space 1104, and its lower end abuts against the upper end of the ejector body 120 through the opening. The upper end of the elastic member 1102 abuts against the lower surface of the telescopic head 1101. During the lifting and lowering of the telescopic head 1101, the limiting cavity 1103 can rise and fall synchronously along the limiting recess 1201. Further, in some embodiments, both the limiting cavity 1103 and the limiting recess 1201 are annular and coaxially arranged with the ejector body 120, thus ensuring that the telescopic head 1101 and the ejector body 120 are coaxial. However, the embodiments of the present invention are not limited to this. In practical applications, the limiting cavity 1103 can also be composed of multiple cavity walls, which are spaced apart circumferentially along the ejector body 120; correspondingly, the limiting recess 1201 is composed of multiple limiting grooves, which are spaced apart circumferentially along the outer periphery of the ejector body 120. Each cavity wall corresponds one-to-one with a limiting groove, and each cavity wall can be inserted into the corresponding limiting groove from above and rise and fall along the limiting groove.

[0059] It should be noted that, as Figure 4 As shown, the bottom surface 1105 of the limiting recess 1201 is used to limit the lowest position of the telescopic head 1101. When the telescopic head 1101 contacts the wafer, the limiting cavity 1103 abuts against the bottom surface 1105, at which point the telescopic head 1101 cannot continue to descend. In this way, not only can the compression amount of the elastic element 1102 be limited, but also the lowest position of the telescopic heads 1101 corresponding to the multiple ejector pin bodies 120 can be kept at the same height, thereby ensuring that the wafer 3 supported by the multiple ejector pins 1 remains horizontal.

[0060] As another technical solution, this application also provides a semiconductor process apparatus, such as... Figure 6 and Figure 7 As shown, it includes a process chamber 300 and a base 2 disposed in the process chamber 300, a heating device, and a pin device 100 in any of the above embodiments.

[0061] The base 2 is used to support the wafer 3, and the base 2 has a pin hole 21 that penetrates the base 2 in a vertical direction (e.g., Figure 3 (As shown). The ejector pins 1 in the ejector pin assembly 100 are height-adjustable. In some embodiments, the ejector pin assembly 100 includes at least three ejector pins 1, which are distributed circumferentially at intervals along the base 2 to jointly support the wafer 3. The number of ejector pin holes 21 is the same as the number of ejector pins 1, and they are arranged in a one-to-one correspondence. Each ejector pin 1 can pass through each ejector pin hole 21 in a one-to-one correspondence, so that the upper end of the ejector pin 1 is higher or lower than the upper surface of the base 2.

[0062] Furthermore, in some embodiments, the semiconductor process equipment also includes a pin lifting mechanism 9, which is connected to each pin 1 in the pin device 100 and is used to drive each pin 1 to lift or lower.

[0063] A heating device is used to heat the wafer 3. The heating device includes, for example, a heating lamp 4, which radiates heat toward the wafer 3.

[0064] When preparing thin films on wafer 3, such as Figure 7 As shown, the base 2 is located at the process position, and the wafer 3 is placed on the base 2. At this time, the upper end of each ejector pin 1 is lower than the bearing surface of the base 2. When the thin film preparation is completed and the reflow process begins, as... Figure 6 As shown, the substrate 2 descends from the process position to the low position, and each ejector pin 1 passes through the ejector pin hole 21 of the substrate 2, lifting the wafer 3 from the substrate 2. At this time, the wafer 3 is supported by each ejector pin 1 and separated from the substrate 2. The heating lamp 4 irradiates the lower surface of the wafer 3 to heat it. After the reflow process is completed, each ejector pin 1 descends to a position where its upper end is below the bearing surface of the substrate 2, at which point the wafer 3 falls onto the substrate 2. After the temperature of the wafer 3 drops to room temperature, the substrate 2 rises to the process position to continue thin film preparation (e.g., preparation of copper thin film). This cycle is repeated multiple times until the wafer reaches the specified bottom coverage.

[0065] In some embodiments, for each ejector pin 1, there are at least two temperature measuring components 200, and the temperature measuring components 210 of the at least two temperature measuring components 200 located at the free ends of the flexible connectors 210 are evenly distributed on the circumference centered on the contact point between the ejector pin 1 and the wafer 3; in this way, when the ejector pin 1 and the wafer 3 come into contact, the flexible connectors 220 of the at least two temperature measuring components 200 bend simultaneously, so that each temperature measuring component 210 is in contact with different positions on the wafer, thereby measuring the temperature of the wafer 3 at multiple points.

[0066] In one specific embodiment of this application, such as Figure 3 As shown, the four temperature measuring points 22 corresponding to one ejector pin 1 can be arranged in a square with the contact point between the ejector pin 1 and the wafer 3 as the center. The three ejector pins 1 can be evenly distributed along the circumference of the wafer 3, thus ensuring that the square formed by the temperature measuring points 22 around the three ejector pins 1 is also evenly distributed along the circumference of the wafer 3. This further improves the uniformity of the distribution of multiple temperature measuring points 22 on the lower surface of the wafer 3, thereby improving the accuracy of temperature measurement.

[0067] Furthermore, the diagonal of the square formed by the four temperature measuring points 22 after each ejector pin 1 is bonded to the wafer 3 can coincide with the projection of a diameter of the wafer 3 onto the horizontal plane. Therefore, the four temperature measuring points 22 can measure the temperature at multiple locations in the radial direction of the wafer 3, further improving the accuracy of temperature measurement. Of course, the number of temperature measuring components 200 corresponding to each ejector pin 1 is not limited to this. For example, the ejector pin device 100 may also include five temperature measuring components 200. The temperature measuring components 200 corresponding to each ejector pin 1 may also adopt other distribution methods. For example, in the embodiment where the ejector pin device 100 includes four temperature measuring components 200, the temperature measuring points 22 corresponding to each ejector pin 1 may also be distributed in a trapezoidal shape on the wafer 3.

[0068] In embodiments where the ejector device 100 includes at least three ejector pins 1, such as Figure 3 As shown, at least two temperature measuring points 22 are distributed around each of the at least three pins 1, for example... Figure 3 The four temperature measuring points 22 shown indicate that each ejector pin 1 has four corresponding temperature measuring components 200. This allows for multi-point temperature measurement of the wafer 3 and improves the uniformity of the distribution of multiple temperature measuring points 22 on the lower surface of the wafer 3, thereby making the temperature measurement more accurate. The aforementioned temperature measuring point 22 refers to the temperature measuring point 22 on the wafer 3 where the temperature measuring component 210 is in contact with the wafer 3.

[0069] In some embodiments, the connecting wire of the temperature sensing element 210 is used to transmit the temperature signal detected by the temperature sensing element 210. The connecting wire of the temperature sensing element 210 is disposed between the surfaces of the flexible connector 220 and the ejector pin 1 facing each other, and extends from the lower end of the ejector pin 1. Specifically, the connecting wire of the temperature sensing element 210 is located on the side of the flexible connector 220 facing the ejector pin 1, so that the flexible connector 220 can protect the connecting wire and ensure that the temperature sensing element 210 can be used continuously under the high temperature conditions of the heating lamp irradiation. Moreover, the end of the connecting wire away from the temperature sensing element 210 extends downward along the extension direction of the flexible connector 220 and extends from the lower end of the ejector pin 1, such as... Figure 6 and Figure 7 As shown, the connecting line is electrically connected to a vacuum connector 10 located on the bottom chamber wall of the process chamber 300 of the semiconductor process equipment. This vacuum connector 10 is electrically connected to a temperature collector 11 located outside the process chamber, so that the temperature signal detected by the temperature sensor 210 can be transmitted to the temperature collector 11 through the vacuum connector 10. The vacuum connector 10 can maintain the seal of the process chamber 300 and prevent process gas leakage.

[0070] During the reflow process, the temperature sensing unit 210 contacts the wafer 3, converts the acquired temperature signal into an electrical signal, and transmits it sequentially to the temperature collector 11 through the connecting wire and the vacuum connector 10. The temperature collector 11 collects the temperature data measured by each temperature sensing unit 210 corresponding to each ejector pin 1. The temperature collector 11 can be further connected to the controller 12, which determines the temperature distribution on the wafer 3 based on the position of each temperature sensing unit 210 and the measured temperature data, so that the corresponding heating lamp 4 can be replaced when an abnormal temperature occurs on the wafer 3.

[0071] Figure 6 and Figure 7 In the specific embodiment shown, the process chamber 300 is a traditional physical vapor deposition chamber. For example... Figure 6 As shown, a shielding liner 7 is provided on the upper part of the process chamber 300, and the shielding liner 7 is detachably connected to the inner wall of the process chamber 300. The shielding liner 7 is used to prevent the film material from depositing on the inner wall of the chamber during the preparation of copper thin films, thus preventing contamination of the chamber. The size of the wafer 3 can be specifically 12 inches. Of course, the technical solution of this application can also be used to process wafers 3 of other sizes, which is not limited here. The base 2 is located inside the shielding liner 7, and a shielding ring 8 is also provided at the lower part of the shielding liner 7. The shielding ring 8 overlaps with the shielding liner 7. During the thin film deposition process, the base 2 can cooperate with the shielding ring 8 and the shielding liner 7, and the three together form a process space. The thin film preparation process is carried out in this process space. The wafer 3 covers the upper surface of the base 2 to prevent the film material from sputtering onto the base 2 and affecting the use of the base 2.

[0072] Optionally, the base 2 can be a low-temperature electrostatic chuck, which can apply electrostatic adsorption to the wafer 3 to prevent it from slipping. Furthermore, it can cool the wafer 3 during the thin film fabrication process, keeping it at a low temperature to prevent excessively large copper film grains from affecting performance.

[0073] Optionally, the temperature collector 11 can be fixed to the outer wall of the process chamber 300 using screws. The temperature collector 11 collects the thermoelectric potential signal output by the thermocouple wire 230 and converts it into the corresponding temperature value. These temperature values ​​are transmitted to the controller 12 through the signal line of the temperature collector 11. The controller 12 may specifically include an upper computer and a lower computer. The lower computer is connected to the temperature collector 11, and the upper computer reads the values ​​from the lower computer through a network cable and displays certain specific values ​​after processing them through some algorithms. In this embodiment, the upper computer can display the following values: the temperature values ​​measured by all temperature measuring points 22, the mean of all temperature measuring points 22, the value range of all temperature measuring points 22 (the upper and lower boundaries of the value range are the maximum and minimum temperature values, respectively), and the uniformity of all temperature measuring points 22 (variance of all temperature measuring points 22 / mean × 100%). Of course, the values ​​displayed by the upper computer are not limited to these. Users can set the values ​​displayed by the upper computer as needed, which is not limited here.

[0074] In some embodiments, the heating device further includes a first reflector 5 and a second reflector 6, with the heating lamp 4 located below the first reflector 5. The first reflector 5 has a first reflective surface for reflecting the heating light to the second reflector 6, and the second reflector 6 has a second reflective surface for reflecting the reflected light to the lower surface of the wafer 3.

[0075] Specifically, the heating lamp 4 is positioned below the shielding liner 7. The heating lamp 4 uses infrared heating to provide a heat source for heating the wafer during the copper reflow process. The output power of the heating lamp 4 is adjustable according to different heating requirements. To improve the heating uniformity of the heating lamp 4, the aforementioned first reflector 5 and second reflector 6 can be used during the reflow process. The first reflector 5 is used to shield the heating lamp 4, preventing it from directly irradiating the wafer 3. The first reflector 5 is detachably connected to the inner wall of the process chamber 300, facilitating the removal and installation of the heating lamp 4. The surface of the first reflector 5 near the heating lamp 4 is polished and serves as the first reflective surface. Light from the upper part of the heating lamp 4 is reflected onto the first reflective surface and then onto the second reflector 6 located below the heating lamp 4. The second reflector 6 is fixed to the chamber wall of the process chamber 300, and the surface of the second reflector 6 near the heating lamp 4 is a polished arc-shaped surface, which serves as the second reflective surface. The light reflected by the heating lamp 4 and the first reflector 5 is reflected a second time after hitting the second reflective surface, and then reflected onto the lower surface of the wafer 3. During the reflection process, the light is redistributed, thereby improving the uniformity of the light hitting the lower surface of the wafer, so as to achieve a more uniform heating effect.

[0076] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of this application, and this application is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this application, and these modifications and improvements are also considered to be within the scope of protection of this application.

Claims

1. A ejector pin device, used in semiconductor process equipment, characterized in that, It includes a push pin and a temperature measuring component, wherein the push pin is used to support the wafer; The temperature measuring component includes a flexible connector and a temperature measuring element. The fixed end of the flexible connector is connected to the ejector pin, and the free end of the flexible connector is located on the outer periphery of the upper end of the ejector pin. The temperature measuring element is disposed at the free end and faces the ejector pin. The flexible connector is configured to bend under the pressure of the wafer when the ejector pin supports the wafer, so that the temperature measuring element fits the wafer.

2. The ejector pin device according to claim 1, characterized in that, The connecting wire of the temperature measuring element is disposed between the surfaces of the flexible connector and the ejector pin that are opposite to each other, and extends from the lower end of the ejector pin.

3. The ejector pin device according to claim 1, characterized in that, The width of the flexible connector, perpendicular to its extension direction, gradually decreases from the fixed end to the free end.

4. The ejector device according to any one of claims 1-3, characterized in that, The temperature measuring components are at least two, and the free ends of the flexible connectors of the at least two temperature measuring components are distributed at circumferential intervals along the ejector pin.

5. The ejector device according to any one of claims 1-3, characterized in that, The ejector pin includes an ejector pin body and a telescopic portion disposed at the upper end of the ejector pin body. When in contact with the wafer, the upper end of the telescopic portion descends a predetermined distance relative to the ejector pin body, so that the flexible connector bends when compressed by the wafer.

6. The ejector pin device according to claim 5, characterized in that, The telescopic part includes a telescopic head and an elastic element, wherein the telescopic head is disposed above the upper end of the ejector pin body for supporting the wafer; the elastic element is connected between the telescopic head and the upper end of the ejector pin body.

7. The ejector pin device according to claim 6, characterized in that, The telescopic head is provided with a first mating part, and the ejector pin body is provided with a second mating part; The first mating part and the second mating part are movable relative to each other along the axial direction of the ejector body to restrict the telescopic head from telescopically extending or retracting along the axial direction of the ejector body.

8. The ejector pin device according to claim 7, characterized in that, The first mating part is a limiting cavity disposed at the lower end of the telescopic head, and the second mating part is a limiting recess formed on the outer peripheral surface of the ejector body. The inner peripheral surface of the limiting cavity and the outer peripheral surface of the limiting recess can be mated relative to each other along the axial direction of the ejector body. The elastic element is disposed in the limiting cavity.

9. The ejector pin device according to claim 1, characterized in that, The flexible connector is made of silicone rubber.

10. A semiconductor process apparatus, characterized in that, It includes a process chamber and a base disposed in the process chamber, a heating device, and the ejector device according to any one of claims 1 to 9; The base is used to support the wafer, and the base has a pin hole that penetrates the base in a vertical direction; The ejector pin in the ejector pin device is liftable and can pass through the ejector pin hole so that the upper end of the ejector pin is higher or lower than the upper surface of the base; The heating device is used to heat the wafer.

11. The semiconductor process equipment according to claim 10, characterized in that, The temperature measuring component is at least two, and the temperature measuring components of the at least two temperature measuring components located at the free end of the flexible connector are evenly distributed on the circumference centered on the contact point between the ejector pin and the wafer.

12. The semiconductor process equipment according to claim 10, characterized in that, It also includes a vacuum connector and a temperature collector, wherein, The vacuum connector is disposed on the bottom chamber wall of the process chamber and is electrically connected to the connecting wire of the temperature measuring element. The temperature collector is located outside the process chamber and is electrically connected to the vacuum connector temperature sensor to collect the wafer temperature detected by the temperature sensor.

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