Diamond alloy heat dissipation cold plate

Abstract

The present application relates to a kind of diamond alloy heat-dissipating cold plate, it includes the substrate made of diamond alloy, cover plate, two connecting rings and two water taps;The substrate is opened with accommodating cavity, the accommodating cavity is provided with fin, the fin is surrounded with retaining wall, and the four around of the fin and the retaining wall are all left with gap to form flow channel;The cover plate is capped at the accommodating cavity opening of the substrate, and is sealed with the retaining wall Connection, form sealed heat exchange cavity;Two the connecting rings are set on the cover plate, and are communicated with the heat exchange cavity;Two the water taps are communicated with two the connecting rings respectively, for the in and out of cooling liquid.The present application has the effect of high heat conduction efficiency, strong structure adaptability, reliable sealing and stable heat dissipation performance.

Description

Technical Field

[0001] This invention relates to the field of composite material production technology, and in particular to a diamond alloy heat dissipation cold plate. Background Technology

[0002] As chip integration and computing power continue to increase, the heat density generated during operation increases dramatically. The thermal conductivity of traditional pure copper heat sinks is gradually approaching its limit, making it difficult to meet the heat dissipation requirements of high-power chips. This leads to problems such as chip performance degradation, shortened lifespan, or even burnout due to overheating. Therefore, there is an urgent need for a new type of heat sink with higher thermal conductivity and a more suitable structure.

[0003] Existing liquid cooling heat sinks mostly use pure copper or aluminum alloy as the substrate material, with a thermal conductivity of around 400 W / (m·K), which cannot achieve rapid heat dissipation and uniform distribution. At the same time, existing fins are mostly assembled after being independently processed, which not only results in large assembly errors and poor overall structural integrity, but also makes it difficult to flexibly adjust the shape and arrangement of the fins according to the heat dissipation requirements of different chips, leading to uneven flow field distribution and limited heat exchange efficiency. In addition, the sealing structure of existing heat sinks mostly uses adhesive bonding or ordinary welding, which has insufficient sealing reliability and is prone to coolant leakage, affecting the stable operation of the heat dissipation system.

[0004] To address the shortcomings of the prior art, this invention provides a diamond alloy heat dissipation plate. By employing a high thermal conductivity diamond-copper alloy substrate, a 3D-printed integrated fin and baffle structure, and a reliable laser welding sealing method, it effectively solves the problems of low thermal conductivity, poor structural adaptability, and insufficient sealing reliability of existing heat dissipation plates. Summary of the Invention

[0005] To address the shortcomings of existing technologies, the purpose of this invention is to provide a diamond alloy heat dissipation cold plate that has the advantages of high thermal conductivity, strong structural adaptability, reliable sealing, and stable heat dissipation performance.

[0006] The above-mentioned objective of this invention is achieved through the following technical solutions: A diamond alloy heat dissipation plate includes a substrate made of diamond alloy, a cover plate, two connecting rings and two water nozzles; The substrate has a receiving cavity, a fin is disposed in the receiving cavity, and a baffle is disposed around the fin. A gap is left between the fin and the baffle to form a flow channel. The cover plate seals the opening of the receiving cavity of the substrate and is sealed to the baffle wall to form a sealed heat exchange cavity; The two connecting rings are disposed on the cover plate and communicate with the heat exchange cavity; The two water nozzles are respectively connected to the two connecting rings for the inlet and outlet of coolant.

[0007] The above technical solution forms a compact and reliably sealed diamond alloy heat dissipation plate. The gap between the fins and the baffle wall forms a flow channel, ensuring that the coolant can flow smoothly in the heat exchange cavity and achieve efficient heat dissipation.

[0008] As a further technical solution of the present invention: the fins are multiple and arranged in an array to form a fin array, a first gap is formed between adjacent fins, and a second gap is formed between the fin array and the inner wall of the surrounding wall. The first gap and the second gap are interconnected to form the flow channel.

[0009] The above technical solution enables the coolant to flow evenly between adjacent fins and between the fin array and the inner walls of the baffle, forming a connected flow channel, increasing the heat exchange area, and improving the overall heat dissipation uniformity and efficiency.

[0010] As a further technical solution of the present invention: the fins and the baffle are integrally formed on the substrate by 3D printing process.

[0011] The above technical solutions can be used to flexibly manufacture fins and baffles of different shapes and arrangements according to actual heat dissipation needs using 3D printing. The structure is highly adaptable, and at the same time, it ensures reliable connection between the fins and baffles and good overall integrity, thereby improving the structural stability and heat exchange adaptability of the heat dissipation plate.

[0012] As a further technical solution of the present invention: a guide plate is provided on the top of the fin array, and the guide plate is provided with a waist-shaped guide hole and an arc-shaped notch, the waist-shaped guide hole and the arc-shaped notch respectively corresponding to the positions of the two connecting rings.

[0013] The above technical solution utilizes guide plates, waist-shaped guide holes, and arc-shaped notches to uniformly guide and distribute the coolant entering the heat exchange chamber, avoiding localized concentrated impact of the coolant and improving the uniformity of the flow field and the heat exchange effect.

[0014] As a further technical solution of the present invention: two mounting holes are provided on the cover plate, and the two connecting rings are respectively installed at the two mounting holes and connected to the heat exchange cavity.

[0015] The above technical solution enables precise positioning and reliable installation of the connecting ring on the cover plate, while ensuring stable communication between the connecting ring and the heat exchange cavity, thereby improving assembly accuracy and sealing reliability.

[0016] As a further technical solution of the present invention: the cover plate and the retaining wall, the cover plate and the connecting ring, and the connecting ring and the water nozzle are all sealed by laser welding.

[0017] The above technical solutions ensure reliable sealing and high connection strength at each joint, prevent coolant leakage, and improve the overall sealing performance and service life of the cold plate.

[0018] As a further technical solution of the present invention: the substrate is made of diamond copper alloy, which is obtained by hot pressing after PVD copper plating on the diamond surface.

[0019] The above technical solutions enable the substrate to have both high thermal conductivity and structural stability, resulting in better heat dissipation performance compared to traditional pure copper materials, thus improving the overall heat dissipation capacity and durability of the cold plate.

[0020] In summary, the present invention has at least one of the following beneficial technical effects: 1. This invention discloses a diamond alloy heat dissipation plate, which uses a diamond copper alloy substrate, combined with fins, baffles, cover plates, connecting rings and water nozzles to form a sealed heat exchange cavity and an internal flow channel, thereby achieving a high thermal conductivity and low flow resistance for efficient liquid cooling.

[0021] 2. This invention discloses a diamond alloy heat dissipation plate, which is integrally formed by 3D printing of fins and baffles, and the fin array is arranged to form a multi-gap interconnected flow channel. Combined with laser welding sealing and uniform flow guidance by the guide plate, the heat dissipation plate achieves the effects of strong structural adaptability, large heat exchange area, reliable sealing and stable flow field. Attached Figure Description

[0022] Figure 1 This is a top view of a diamond alloy heat dissipation plate according to the present invention.

[0023] Figure 2 This is an exploded view of a diamond alloy heat dissipation plate according to the present invention.

[0024] Figure 3 for Figure 2 Exploded view of the middle substrate, fins, baffles, and guide vanes.

[0025] Figure 4 for Figure 2 Enlarged view of the mid-fin array.

[0026] Figure 5 This is a schematic diagram of the coolant flow channels and cavity shape of the heat dissipation plate.

[0027] Reference numerals: 1. Base plate; 2. Cover plate; 21. Mounting hole; 3. Connecting ring; 4. Water nozzle; 5. Fin; 6. Baffle; 7. Guide plate; 71. Waist-shaped guide hole; 72. Arc-shaped notch. Detailed Implementation

[0028] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0029] In the description of this application, it should be noted that the terms "upper," "lower," "inner," "outer," "top / bottom," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0030] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installed," "equipped with," "sleeved / connected," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances. Example

[0031] Reference Figure 1 and Figure 2 This invention discloses a diamond alloy heat dissipation plate, comprising a base plate 1 made of diamond alloy, a cover plate 2, two connecting rings 3, and two water nozzles 4; the base plate 1 has a receiving cavity, in which fins 5 are arranged, and baffles 6 are arranged around the fins 5, with gaps left between the fins 5 and the baffles 6 to form flow channels; the cover plate 2 covers the opening of the receiving cavity of the base plate 1 and is sealed to the baffles 6 to form a sealed heat exchange cavity; the two connecting rings 3 are arranged on the cover plate 2 and communicate with the heat exchange cavity; the two water nozzles 4 are respectively sealed to the two connecting rings 3 for the inlet and outlet of coolant.

[0032] Reference Figure 2 and Figure 4The fins 5 are sheet-like structures, with multiple fins 5 arranged in an array. A first gap is formed between adjacent fins 5, and a second gap is formed between the fin array and the inner walls of the baffle 6. The first and second gaps are interconnected, forming a parallel array-type flow channel structure. This allows the coolant to flow uniformly within the flow channel, effectively increasing the heat exchange area and improving the overall heat dissipation uniformity and efficiency of the heat dissipation plate. The fins 5 and the baffle 6 are integrally formed on the substrate 1 using 3D printing technology. This allows for flexible processing into different shapes and arrangements according to actual heat dissipation needs, resulting in stronger structural adaptability. Simultaneously, it ensures reliable connection and good overall integrity between the fins 5 and the baffle 6, further improving the structural stability and heat exchange adaptability of the heat dissipation plate.

[0033] Reference Figure 2 and Figure 3 All the arrayed fins 5 are equipped with a guide plate 7 on their tops. The guide plate 7 is located at the top center of the fin array. The guide plate 7 has waist-shaped guide holes 71 that extend laterally along the fin array. The waist-shaped guide holes 71 correspond vertically to the connecting ring 3 located in the middle of the cover plate 2. Its extension direction is perpendicular to the mainstream direction of the coolant after entering the flow channel, which can effectively expand the lateral distribution range of the coolant on the top of the fin array. An arc-shaped notch 72 is also provided on one side of the guide plate 7. The arc-shaped notch 72 is adapted to the position of another connecting ring 3 located at the edge of the fin array. The guide plate 7, waist-shaped guide holes 71 and arc-shaped notch 72 are used to uniformly guide and distribute the coolant entering the heat exchange cavity, avoid local concentrated impact of coolant, and improve the uniformity of the flow field and the heat exchange effect.

[0034] Reference Figure 2 The cover plate 2 has two mounting holes 21, one of which is located in the middle of the cover plate 2 and the other is located at the edge of the cover plate 2. The connecting ring 3 and the water nozzle 4 are both made of copper or stainless steel. The two connecting rings 3 are respectively installed in the two mounting holes 21 and are connected to the heat exchange cavity below, so as to realize the precise positioning and reliable installation of the connecting ring 3 on the cover plate 2, while ensuring the stable connection between the connecting ring 3 and the heat exchange cavity, improving the assembly accuracy and sealing reliability.

[0035] The cover plate 2 and the retaining wall 6, the connecting ring 3 and the cover plate 2, and the connecting ring 3 and the water nozzle 4 are all sealed by laser welding to ensure reliable sealing and high connection strength at each connection point, prevent coolant leakage, and improve the overall sealing performance and service life of the cold plate.

[0036] The substrate 1 is made of diamond copper alloy, which is produced by hot pressing after PVD copper plating on the diamond surface. This gives the substrate 1 both high thermal conductivity and structural stability, and better heat dissipation performance compared to traditional pure copper material, thus improving the overall heat dissipation capacity and durability of the cold plate. The specific preparation process is as follows: First, a substrate 1 is prepared using a diamond-copper alloy. Copper is first plated onto the surface of diamond particles using PVD, and then hot-pressed (at a temperature of about 1100℃) to ensure that the copper is uniformly and effectively attached and bonded to the diamond surface. Then, a fin 5 and a baffle 6 structure are integrally formed on the substrate 1 using 3D printing. The baffle 6 is used to seal the cavity and support the cover plate 2. The guide plate 7 is then laser-welded to the substrate 1, fin 5, and baffle 6 assembly to form a substrate assembly. At the same time, the connecting ring 3 is embedded into the corresponding mounting hole 21 of the cover plate 2 and laser-welded to the cover plate 2 to form the cover plate 2-connecting ring 3 assembly. The substrate assembly is then laser-welded to the cover plate 2-connecting ring 3 assembly to form the main structure of the cold plate. Finally, the water nozzle 4 is directly laser-welded to the connecting ring 3. The water nozzle 4 can be adapted to connect a stainless steel corrugated pipe or an EPDM pipe according to the usage requirements. The overall structure is then tested for sealing to ensure that the heat dissipation cold plate is leak-free.

[0037] Reference Figure 2 and Figure 5 The workflow of this invention is as follows: Coolant enters from one of the water nozzles 4 and flows directly into the corresponding connecting ring 3. After passing through the connecting ring 3, it enters the upper part of the heat exchange cavity and is then evenly distributed into the heat exchange cavity through the waist-shaped guide hole 71 of the guide plate 7, forming a coolant cavity shape. Subsequently, it flows in the parallel array flow channel structure, passing sequentially through the first gap between adjacent fins 5 and the second gap between the fin array and the inner walls of the baffle 6, fully exchanging heat with the highly thermally conductive substrate 1 and fins 5, and carrying away the heat generated by the chip. After heat exchange, the coolant is collected through the arc-shaped notch 72 to another connecting ring 3 and flows out directly through the corresponding water nozzle 4, completing one liquid cooling cycle, continuously removing heat, and ensuring that the chip operates stably at a suitable temperature.

[0038] The implementation principle of this invention is as follows: First, the substrate 1 is made of diamond-copper alloy. After PVD copper plating on the diamond surface, it is hot-pressed to form a dense composite material with a thermal conductivity as high as 600-950 W / (m·K), which is 1.5-2.4 times higher than pure copper, significantly reducing thermal resistance and enabling rapid heat dissipation. Second, the fins 5 and baffles 6 are integrally formed by 3D printing, and a parallel array flow channel structure is formed between adjacent fins 5 and between the fin array and the inner walls of the baffles 6, which are interconnected. The increased surface area of ​​the coolant on the heat dissipation structure allows the coolant to flow evenly across the surface of each fin 5, significantly improving convective heat transfer efficiency. Simultaneously, the guide plate 7, along with its waist-shaped guide holes 71 and arc-shaped notches 72, optimizes the guidance of the coolant, achieving uniform distribution and orderly collection, reducing flow resistance and local turbulence, and improving flow field stability. Finally, laser welding seals are used between the cover plate 2 and the baffle 6, the connecting ring 3 and the cover plate 2, and the connecting ring 3 and the water nozzle 4, ensuring reliable overall sealing of the cold plate and preventing leakage. Through the synergistic effect of the high thermal conductivity material, optimized flow channels, precision molding, and reliable sealing, this invention achieves high thermal conductivity, low flow resistance, and highly efficient and stable liquid cooling performance.

[0039] The embodiments described herein are preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Therefore, all equivalent changes made in accordance with the structure, shape, and principle of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A diamond alloy heat dissipation plate, characterized in that, It includes a base plate (1) made of diamond alloy, a cover plate (2), two connecting rings (3) and two water nozzles (4); The substrate (1) has a receiving cavity, a fin (5) is provided in the receiving cavity, and a baffle (6) is provided around the fin (5). A gap is left between the fin (5) and the baffle (6) to form a flow channel. The cover plate (2) covers the opening of the receiving cavity of the substrate (1) and is sealed to the baffle wall (6) to form a sealed heat exchange cavity; The two connecting rings (3) are disposed on the cover plate (2) and communicate with the heat exchange cavity; The two water nozzles (4) are respectively connected to the two connecting rings (3) for the inlet and outlet of coolant.

2. The diamond alloy heat dissipation plate according to claim 1, characterized in that, The fins (5) are multiple and arranged in an array to form a fin array. A first gap is formed between adjacent fins (5), and a second gap is formed between the fin array and the inner walls of the baffle (6). The first gap and the second gap are interconnected to form the flow channel.

3. The diamond alloy heat dissipation plate according to claim 1, characterized in that, The fins (5) and the retaining wall (6) are integrally formed on the substrate (1) by 3D printing process.

4. The diamond alloy heat dissipation plate according to claim 1, characterized in that, The top of the fin array is provided with a flow guide plate (7), and the flow guide plate (7) is provided with a waist-shaped flow guide hole (71) and an arc-shaped notch (72). The waist-shaped flow guide hole (71) and the arc-shaped notch (72) correspond to the positions of the two connecting rings (3) respectively.

5. A diamond alloy heat dissipation plate according to claim 1, characterized in that, The cover plate (2) has two mounting holes (21), and the two connecting rings (3) are respectively installed at the two mounting holes (21) and connected to the heat exchange cavity.

6. The diamond alloy heat dissipation plate according to claim 1, characterized in that, The cover plate (2) and the retaining wall (6), the cover plate (2) and the connecting ring (3), and the connecting ring (3) and the water nozzle (4) are all sealed by laser welding.

7. A diamond alloy heat dissipation plate according to claim 1, characterized in that, The substrate (1) is made of diamond copper alloy, which is obtained by hot pressing after PVD copper plating on the diamond surface.

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