Mounting structure of electronic components

Abstract

The present application provides an electronic component mounting structure capable of suppressing generation of cracks in an electronic component. In an electronic component (10) mounting structure (1), each external electrode (16) includes a protruding portion (16c) provided at least partially extending to each of a main surface and each of side surfaces, when a direction in which a pair of lands (30) are aligned is set as an X direction, a direction in which the pair of lands (30) are separated is set as a separation direction, and a direction opposite to the pair of lands (30) is set as an opposite direction, opposite direction end portions of a solder (40) are located at any one of between opposite direction end portions (40a) of the protruding portion (16c) and separation direction end portions (16f) of the external electrode and the separation direction end portions (16f) of the external electrode in the X direction.

Description

Technical Field

[0001] This invention relates to an mounting structure for electronic components. Background Technology

[0002] Conventionally, this process involves soldering two-terminal electronic components such as multilayer ceramic capacitors and inductors onto a circuit board. Patent Document 1 discloses a mounting structure in which a pair of external electrodes located at both ends of the multilayer ceramic capacitor along its length are soldered to a pair of electrode pads located on the substrate.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2014-086606 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] If the ambient temperature changes during the use of electronic devices, stress will be generated in the electronic components due to the differences in the coefficients of linear expansion of the electronic components, solder, and substrate. Stress in the electronic components may lead to cracks at the boundary between the blank and the external electrodes. Furthermore, if electronic components with these cracks are exposed to a humid environment, their internal insulation resistance decreases, causing them to heat up, which may damage the electronic device.

[0008] Therefore, the object of the present invention is to provide an mounting structure for electronic components that can suppress the generation of cracks in electronic components.

[0009] Solution for solving the problem

[0010] To solve the aforementioned problem, the mounting structure of the electronic component of the present invention comprises: a pair of pads disposed opposite to each other on a substrate; solder disposed on the pads; and an electronic component comprising: a component body having a stacked dielectric layer and an internal electrode layer, including a pair of main surfaces opposite each other in a stacking direction, a pair of side surfaces opposite each other in a width direction orthogonal to the stacking direction, and a pair of end surfaces opposite each other in a length direction orthogonal to the stacking direction and the width direction; and a pair of external electrodes disposed on each of the end surfaces, each of the external electrodes being connected to each of the pads by means of the solder, each of the external electrodes including a protrusion extending to at least a portion of each of the main surfaces and each of the side surfaces, wherein when the direction in which the pair of pads are arranged is defined as the X direction, the direction in which the pair of pads are separated is defined as the separation direction, and the direction in which the pair of pads are opposite is defined as the opposing direction, the opposing direction end of the solder is located in the X direction at any one of the opposing direction end of the protrusion and the separating direction end of the external electrode and the separating direction end of the external electrode.

[0011] The effects of the invention

[0012] According to the present invention, it is possible to provide an mounting structure for an electronic component that can suppress the generation of cracks in the electronic component. Attached Figure Description

[0013] Figure 1 This is a perspective view showing the stacked ceramic capacitor, which is an electronic component, applied to the mounting structure of the electronic component in the first embodiment.

[0014] Figure 2 This is a top view showing the mounting structure of the electronic components according to the first embodiment.

[0015] Figure 3 yes Figure 2 Sectional view along line III-III.

[0016] Figure 4 This is a partially enlarged cross-sectional view showing the main parts of the mounting structure of the electronic components in the first embodiment.

[0017] Figure 5 This is a partially enlarged cross-sectional view showing the main parts of the mounting structure of the electronic components in the second embodiment.

[0018] Figure 6 This is a partially enlarged cross-sectional view showing the main parts of the mounting structure of the electronic components in the third embodiment.

[0019] Figure 7 This is a partially enlarged cross-sectional view showing the main parts of the mounting structure of the electronic components in the fourth embodiment.

[0020] Figure 8 This is a partially enlarged cross-sectional view showing the main parts of the mounting structure of the electronic components in the fifth embodiment.

[0021] Figure 9 This is a partially enlarged cross-sectional view showing the main parts of the mounting structure of the electronic components in the sixth embodiment.

[0022] Figure 10 This is a partially enlarged cross-sectional view showing the main parts of the mounting structure of the electronic components in the seventh embodiment. Detailed Implementation

[0023] The embodiments are described below with reference to the accompanying drawings.

[0024] (First Embodiment)

[0025] (Laminated ceramic capacitor)

[0026] based on Figure 1 This describes the general structure of the multilayer ceramic capacitor 10. Figure 1 The image shows a multilayer ceramic capacitor 10, which is an electronic component, used in the mounting structure of the electronic component in the first embodiment. The first embodiment is one way of mounting the multilayer ceramic capacitor 10 onto a substrate.

[0027] The multilayer ceramic capacitor 10 is generally rectangular in shape. The multilayer ceramic capacitor 10 includes a main body 11 and a pair of external electrodes 16. The main body 11 has an inner layer 12 formed by alternating layers of multiple dielectric layers 121 and internal electrode layers 122.

[0028] In this specification, the stacking direction of the dielectric layer 121 and the internal electrode layer 122 is designated as the "stacking direction T". The direction orthogonal to the stacking direction T is designated as the "length direction L". The direction orthogonal to both the stacking direction T and the length direction L is designated as the "width direction W". In addition, a pair of external electrodes 16 are arranged in the length direction L.

[0029] For example, the dimensions of the multilayer ceramic capacitor 10 can be 0.2 mm or more and 1.7 mm or less in the length direction L, 0.12 mm or more and 0.9 mm or less in the width direction W, and 0.12 mm or more and 0.9 mm or less in the stacking direction T, but it is not limited to these dimensions.

[0030] (Main body of the component)

[0031] The main body 11 is generally rectangular parallelepiped in shape. The main body 11 has a pair of main surfaces 17a opposite each other in the stacking direction T, a pair of side surfaces 17b opposite each other in the width direction W, and a pair of end surfaces 17c opposite each other in the length direction L.

[0032] The main body 11 has an inner layer 12 inside. The inner layer 12 has a multilayer structure in which multiple internal electrode layers 122 and multiple dielectric layers 121 are alternately stacked in the stacking direction T. The four sides of the inner layer 12 in the width direction W and the stacking direction T are covered by an outer dielectric ceramic layer 13, which is formed of the same material as the dielectric ceramic layer.

[0033] (Internal electrode layer)

[0034] The internal electrode layer 122 is formed of metallic materials such as Ni, Cu, Ag, Pd, Ag-Pd alloy, Au, etc., but is not limited to the above-mentioned metallic materials, and may also be formed of other conductive materials.

[0035] (Dielectric layer)

[0036] The dielectric layer 121 and the outer dielectric ceramic layer 13 are formed, for example, by sintering a ceramic material with barium titanate as the main component and other ceramic materials with high dielectric constants (such as ceramic materials with CaTiO3, SrTiO3, CaZrO3, etc. as the main components).

[0037] (External electrode)

[0038] A pair of external electrodes 16 are respectively disposed at both ends of the component body 11 along the length direction L. Each external electrode 16 covers a pair of end faces 17c of the component body 11. Alternatively, the pair of external electrodes 16 may also be disposed on a portion of a pair of main faces 17a and a portion of a pair of side faces 17b. For the plurality of internal electrode layers 122 of the inner layer portion 12, one side of an adjacent internal electrode layer in the stacking direction T is connected to one external electrode 16, and the other side is connected to another external electrode. The pair of external electrodes 16 each have an end face 16a along the length direction L.

[0039] The external electrode 16 is, for example, a laminated film consisting of a sintered metal layer and a plating layer. The sintered metal layer is formed, for example, by baking a paste of Cu, Ni, Ag, Pd, Ag-Pd alloy, Au, etc. The plating layer is, for example, a Ni plating layer and a Sn plating layer covering the Ni plating layer.

[0040] A multilayer ceramic capacitor 10 is manufactured, for example, by forming a pair of external electrodes 16 after the main body 11 is calcined, through processes such as baking and plating. It is also possible to simultaneously calcine a portion of the external electrodes 16 with the main body 11, and then form a plating layer on the external electrodes 16.

[0041] (Installation Structure)

[0042] based on Figure 2 and Figure 3 The mounting structure 1 of the first embodiment will be described. To distinguish it from the mounting structures 1 of other embodiments, the mounting structure 1 of the first embodiment will be designated as mounting structure 101. The other embodiments are the same.

[0043] like Figure 2 and Figure 3 As shown, the mounting structure 101 of the first embodiment includes a substrate 20, a pair of pads 30 disposed opposite to each other on the substrate 20, solder 40 at least partially disposed on each pad 30, and a multilayer ceramic capacitor 10. The multilayer ceramic capacitor 10 is mounted to the substrate 20 by soldering.

[0044] (Substrate)

[0045] The substrate 20 is formed into a sheet shape, for example, using an insulating material such as resin, glass, glass epoxy material, phenolic paper, or ceramic.

[0046] Wiring 33 is formed on the surface 20a of the substrate 20. The wiring 33 sandwiches the separation portion 21 in the middle, making it discontinuous. A pair of pads 30, which are part of the wiring 33 and are connected to the external electrode 16, are exposed on both sides of the separation portion 21. The pair of pads 30 are disposed separately on the surface 20a of the substrate 20. Therefore, the separation portion 21 can also be described as the area between the pair of pads 30. The pair of pads 30 are arranged in a manner that is the same in position as each other in a direction orthogonal to the direction in which each pad 30 is arranged.

[0047] (Wiring and pads)

[0048] The wiring 33, including the pads 30, is formed, for example, by depositing a highly conductive metal such as Cu or Ag on the surface 20a of the substrate 20. The pair of pads 30 are rectangular in shape when viewed from above, and have approximately the same shape and size as each other.

[0049] (Separate directions and relative directions)

[0050] In this specification, the direction orthogonal to the surface 20a of the substrate 20 is defined as the "Z direction". The direction orthogonal to the Z direction and in which a pair of pads 30 are arranged is defined as the "X direction". The direction orthogonal to both the X and Z directions is defined as the "Y direction". The direction in the X direction where a pair of pads 30 separate is defined as the "separation direction X1", and the direction where a pair of pads 30 face each other is defined as the "opposite direction X2". Furthermore, "pad thickness" refers to the dimension of the pad 30 in the Z direction.

[0051] Furthermore, the peripheral portions of a pair of pads 30 in the X and Y directions are designated as "peripheral portions 31". The end edge of the peripheral portion 31 on the side of the separating portion 21 is designated as "inner end edge 31a". The inner end edge 31a is a straight line extending along the Y direction.

[0052] (Insulating film)

[0053] The surface 20a of the substrate 20 is covered by an insulating film 22. The insulating film 22 is made of an insulating material, such as a solder resist. However, it is not limited to this; as the insulating material constituting the insulating film 22, an insulating coating material for substrates with resins such as polyolefin resin, acrylic resin, and polyurethane resin as its main components is preferably used. The insulating film 22 extends onto each pad 30, and a portion of the peripheral edge 31 of each pad 30 is covered by the insulating film 22. At the separation portion 21, the surface 20a of the substrate 20 is covered by the insulating film 22. Figure 2 In the image, the portion with the insulating film 22 is shown by dotted shading.

[0054] (Insulating film on the pads and insulating film between the separation parts)

[0055] Furthermore, the portion of the insulating film 22 disposed on the surface of each pad 30 is designated as "pad-on insulating film 22a," and the portion disposed in the area overlapping with the separation portion 21 when viewed along the Z direction is designated as "inter-separation insulating film 22b." The insulating film 22 disposed on the separation portion 21 is included in the inter-separation insulating film 22b. When the inner edge 31a of the pad 30 becomes an inclined surface that slopes towards the substrate 20 in the opposite direction X2, the insulating film 22 disposed in the area overlapping this inclined surface when viewed along the Z direction is included in the inter-separation insulating film 22b, but not in the pad-on insulating film 22a. In this specification, "thickness of the insulating film 22" refers to the dimension of the insulating film 22 in the Z direction.

[0056] The length direction L of the stacked ceramic capacitor 10 mounted on the substrate 20 is approximately along the X direction, the width direction W is approximately along the Y direction, and the stacking direction T is approximately along the Z direction. Thus, one main surface 17a of the component body 11 is approximately parallel to the surface 20a of the substrate 20. Alternatively, the stacked ceramic capacitor 10 may not necessarily be mounted with its main surface 17a facing the substrate 20; one side surface 17b may also be mounted with its side facing the substrate 20.

[0057] One external electrode 16 of the multilayer ceramic capacitor 10 is connected to a pad 30 via solder 40, and the other external electrode 16 is connected to another pad 30 via solder 40. Figure 3As shown, the end face 16a of each external electrode 16 is substantially covered by solder 40. Alternatively, the end face 16a of each external electrode 16 may also be partially covered by solder 40. The multilayer ceramic capacitor 10 is arranged such that the center of its width direction W is substantially aligned with the center of the width direction W of each pad 30.

[0058] (Extended portion of the external electrode)

[0059] Each pair of external electrodes 16 includes a flat end-face covering 16b that covers the end face 17c of the component body 11, and an extension 16c that extends from the end-face covering 16b toward the opposite direction X2 and is disposed on a portion of a pair of main surfaces 17a and a portion of a pair of side surfaces 17b. The extension 16c covers only a portion of the end face 17c side of each main surface 17a and each side surface 17b. The extension 16c is generally cylindrical. The end of the extension 16c on the opposite direction X2 side forms the boundary portion between the external electrode 16 and the component body 11 (hereinafter referred to as "boundary portion 15"). Alternatively, the extension 16c may not necessarily be generally cylindrical. The extension 16c does not need to extend to all surfaces of each main surface 17a and each side surface 17b; it only needs to extend to at least one surface of each main surface 17a and each side surface 17b that is opposite to the substrate 20.

[0060] (The pads are opposite to the protruding part and the end of the protruding part)

[0061] The protrusion 16c of one main surface 17a of the cover component body 11 opposite to the substrate 20 is connected to the pad 30 by means of solder 40. Among the protrusions 16c, the protrusion 16c of one of the two main surfaces 17a of the cover component body 11 opposite to the substrate 20 and connected to the pad 30 by means of solder 40 or directly is called the pad-facing protrusion 16d.

[0062] (Extended end)

[0063] The end of the pad relative to the protrusion 16d in the opposite direction X2 is called the protrusion end 16e. The protrusion end 16e (dividing portion 15) is located in the separation direction X1, which is closer to the inner edge 31a of the pad 30 connected to the pad relative to the protrusion 16d.

[0064] Alternatively, the end (boundary portion 15) on the opposite direction X2 side of the pad-to-pad protrusion 16d can also be positioned at a position closer to the opposite direction X2 than or approximately the same as the inner edge 31a of the pad 30 connected to the pad-to-pad protrusion 16d. In this case, the pad insulating film 22a can be positioned between the pad-to-pad protrusion 16d and the pad 30, or it can be omitted. This structure will be explained later.

[0065] (Solder end)

[0066] Reference Figure 4 Indicate the position of the end 40a in the opposite direction. Figure 4 This is a partially enlarged cross-sectional view showing the main parts of the mounting structure 101 of the multilayer ceramic capacitor 10 according to the first embodiment. In the mounting structure 101 of the first embodiment, the solder 40 does not extend beyond the pad-to-pad protrusion 16d and does not reach the component body 11. That is, the solder 40 is not in contact with the component body 11.

[0067] (The protruding end and the separating end)

[0068] The end of the pad relative to the protruding portion 16d in the opposite direction X2 is designated as the protruding portion end 16e. Furthermore, the end of the external electrode 16 in the separating direction X1 is designated as the separating direction end 16f. The separating direction end 16f refers to the portion of the end face 16a of the external electrode 16 in the longitudinal direction L located closest to the separating direction X1 side.

[0069] (Solder end)

[0070] The end of the solder 40 on the pad 30 in the opposite direction X2 is set as the opposite direction end 40a.

[0071] (Position of the solder tip)

[0072] In the mounting structure 101 of the first embodiment, the opposite direction end 40a is located in the X direction at either between the protruding end 16e and the separating direction end 16f, or at the separating direction end 16f.

[0073] In the mounting structure 101 of the first embodiment, the opposite direction end 40a is located either between the protruding end 16e and the separating direction end 16f or on the separating direction end 16f.

[0074] By positioning the opposite direction end 40a in such a way that solder 40 is not present at the protruding end 16e or at a position beyond the protruding end 16e in the opposite direction X2, it is possible to prevent solder 40 from contacting the component body 11.

[0075] (End of insulating film)

[0076] Next, the arrangement of the insulating film 22 will be described. The end of the insulating film 22 in the separating direction X1 is designated as the insulating film end 22c. Figure 4In the example shown, the insulating film end 22c is in contact with the opposite direction end 40a. By positioning the insulating film end 22c at any of the following locations: on the protruding end 16e, between the protruding end 16e and the separating direction end 16f, or on the separating direction end 16f, it is possible to prevent the opposite direction end 40a from being located on or beyond the protruding end 16e. As a result, it is possible to reliably prevent the solder 40 from contacting the component body 11.

[0077] Next, the preferred position of the opposite end 40a on the pad 30 in the X direction will be described. For example... Figure 4 As shown, the range from the protruding end 16e to the separating end 16f is defined as range R1. The length of range R1 is set to 100. Within range R1, the position of the protruding end 16e is set to 0, and the position of the separating end 16f is set to 100. The position of the opposite end 40a within range R1 is 100 ≤ the position of the opposite end 40a < 0. That is, the opposite end 40a is located anywhere between the protruding end 16e and the separating end 16f, or on the separating end 16f. Thus, while ensuring the electrical connection between the pad and the protruding part 16d and the pad 30, it is also possible to reliably prevent the solder 40 from contacting the component body 11.

[0078] Preferably, the position of the opposite end 40a in the range R1 is 100 ≤ the position of the opposite end 40a in the range R2 is 5. It is also preferred that the end face 17c in the range R1 is 55 ≤ the position of the end face 17c is 5. Additionally, with... Figure 4 The numbers 5, 30, etc. related to the recorded range R1 indicate the approximate location.

[0079] More preferably, the position of the opposite direction end 40a is within the range R1 where 70 ≤ the position of the opposite direction end 40a ≤ 5 (range R3). This allows the solder 40 to easily cover the thicker portion in the stacking direction T of the opposite protrusion 16d of the pad. Even more preferably, the position of the opposite direction end 40a is within the range R1 where 30 ≤ the position of the opposite direction end 40a ≤ 5 (range R4). This helps to suppress the decrease in the adhesion of the solder 40.

[0080] (Soldering materials)

[0081] The type of solder 40 is not particularly limited as long as it has characteristics suitable for each external electrode 16 and each pad 30. For example, it can be Sn-Pb solder, Sn-Ag-Cu solder, Sn-Cu solder, Sn-Bi solder, etc.

[0082] (crack)

[0083] Sometimes, thermal shock or other factors can apply stress to the ceramic sintered body near the front end of the external electrode 16. In such cases, cracks may form in the component body 11, starting from the boundary 15 between the end edge of the external electrode 16's pad protrusion 16d and the component body 11. Figure 3 The area prone to this crack is indicated by the dashed circle BA.

[0084] Therefore, preferably, the solder 40 does not extend beyond the pad-relative protrusion 16d and does not reach the component body 11. Preferably, the solder 40 does not come into contact with the component body 11. In this case, it is not easy to apply stress to the boundary portion 15, thus suppressing the generation of cracks. In addition, not only the stress caused by thermal shock, but also the stress caused by the deflection of the substrate 20 is less likely to act on the boundary portion 15.

[0085] In the first embodiment, it is preferable to adjust the thickness of the insulating film 22a on the pad 30 appropriately according to the thickness of the preferred solder 40 on the pad 30.

[0086] Furthermore, the thickness of the insulating film 22, the thickness of the pad 30, and the thickness of the solder 40 disposed on the pad 30 can be measured, for example, in a cross-section obtained by cutting the mounting structure 101 of the first embodiment parallel to the X and Z directions, such that it passes through the central portion of the stacked ceramic capacitor 10 in the Y direction. For the thickness of the solder 40, for example, the thickness of the solder 40 is measured at multiple (e.g., three) locations equally spaced along the X direction in this cross-section, and the average value of the obtained values ​​is taken. The same applies to the insulating film 22 and the pad 30.

[0087] In the first embodiment, the brazing achieved by the solder 40 is performed, for example, by reflow soldering. That is, the multilayer ceramic capacitor 10 can be reflow soldered onto the substrate 20. Hereinafter, the mounting method of the multilayer ceramic capacitor 10 will be described.

[0088] First, before soldering, an insulating film 22 is disposed on the substrate 20. The insulating film 22 is disposed, for example, in a manner that covers a portion of the pad 30, including the peripheral portion 31. Next, a paste-like solder material is applied to the areas of the pad 30 not covered by the insulating film 22. Then, the multilayer ceramic capacitor 10 is disposed at a predetermined position on the pad 30. Finally, by curing the solder material, the external electrode 16 and the pad 30 are connected using solder 40.

[0089] (Second Implementation)

[0090] Next, refer to Figure 5The second embodiment will be described. The second embodiment modifies a portion of the first embodiment described above. Therefore, in the accompanying drawings, the same reference numerals are used to label the same structural elements as in the first embodiment, and the descriptions of these structural elements are omitted; only the differences will be described.

[0091] The mounting structure 103 of the second embodiment differs from the mounting structure 101 of the first embodiment in the position of the opposite end 40a of the solder 40. Figure 4 In the mounting structure 101 of the first embodiment shown, the opposing direction end 40a is disposed in the X direction between the protruding end 16e and the separating direction end 16f. Furthermore, in the mounting structure 101 of the first embodiment, the insulating film end 22c is located in the X direction between the protruding end 16e and the separating direction end 16f. In the mounting structure 103 of the second embodiment, the insulating film end 22c is located in the X direction at the protruding end 16e. Moreover, the opposing direction end 40a is disposed in the X direction facing the insulating film end 22c.

[0092] In the second embodiment, the above-described structure can prevent the solder 40 from contacting the component body 11.

[0093] In addition, such as Figure 5 As shown, alternatively, the insulating film 22 may have an upwardly raised portion at its end 22c, whereby the insulating film 22 connects with the protruding end 16e. This raised portion is referred to as the insulating film raised portion 22d. Furthermore, "upward" refers to the direction perpendicular to the surface 20a of the substrate 20 and the direction separating from the surface 20a.

[0094] By providing the insulating film protrusion 22d, the contact between the solder 40 and the component body 11 can be more reliably suppressed.

[0095] (Third implementation)

[0096] Next, refer to Figure 6 The third embodiment will be described. The third embodiment modifies a portion of the first embodiment described above. Therefore, in the accompanying drawings, the same reference numerals are used to label the same structural elements as in the first embodiment, and the descriptions of these structural elements are omitted; only the differences will be described.

[0097] The mounting structure 104 of the third embodiment differs from the mounting structure 101 of the first embodiment in the position of the opposite direction end 40a of the solder 40. Figure 4 In the mounting structure 101 of the first embodiment shown, the opposing direction end 40a is disposed in the X direction between the protruding end 16e and the separating direction end 16f. In the mounting structure 104 of the third embodiment, as... Figure 6As shown, the opposite direction end 40a is positioned near the end face 17c in the X direction. This will be explained below.

[0098] (Protruding part, flat part)

[0099] The surface of the pad relative to the protruding portion 16d is called the protruding surface 16h. The surface of the pad 30 is called the pad surface 30a. The portion of the pad relative to the protruding portion 16d where the protruding surface 16h is parallel to the pad surface 30a is called the protruding flat portion 16g. Figure 6 Position D indicates the position of the end of the protruding flat portion 16g in the opposite direction X2. Position E indicates the position of the end of the protruding flat portion 16g in the separating direction X1.

[0100] In the mounting structure 104 of the third embodiment, the flat portion 16g of the protrusion relative to the protrusion 16d is in contact with the pad 30 without the aid of solder 40. Between position D and position E, there is no solder 40 between the protrusion surface 16h and the pad surface 30a.

[0101] The opposite direction end 40a of solder 40 is located at position E at the end of the protruding flat portion 16g in the separating direction X1.

[0102] In the third embodiment, the opposite direction end 40a is located on the side of the separation direction X1, which is opposite to the portion of the protruding flat portion 16g and the pad 30. Therefore, it is possible to reliably prevent the solder 40 from contacting the component body 11.

[0103] In addition, by connecting the end face 16a of the external electrode 16 and the pad 30 with solder 40, the conductivity between the external electrode 16 and the pad 30 is ensured.

[0104] Furthermore, for the mounting structure 104 of the third embodiment, for example, when the external electrode 16 includes a plating layer, a tin plating layer is formed on the end face 16a of the external electrode 16, and no tin plating layer is formed on the protruding flat portion 16g of the external electrode 16, thereby making its formation easier.

[0105] (Fourth implementation)

[0106] Next, refer to Figure 7 The fourth embodiment will be described. The fourth embodiment modifies a portion of the first embodiment described above. Therefore, in the accompanying drawings, the same reference numerals are used to label the same structural elements as in the first embodiment, and the descriptions of these structural elements are omitted; only the differences will be described.

[0107] (Upper end of the pad)

[0108] The mounting structure 105 of the fourth embodiment differs from the mounting structure 101 of the first embodiment in the position of the pad 30. The end above the inner edge 31a of the pad 30 is referred to as the upper end portion 31b of the pad. As described above, "upper" refers to the direction perpendicular to the surface 20a of the substrate 20 and the direction that separates it from the surface 20a. The position P indicates the position of the upper end portion 31b in the X direction.

[0109] exist Figure 4 In the mounting structure 101 of the first embodiment shown, the upper end portion 31b of the pad is located at a position X2 relative to the protruding end portion 16e. In the mounting structure 105 of the fourth embodiment, as... Figure 7 As shown, the upper end 31b of the pad is located at the end 16e of the protrusion.

[0110] When the upper end 31b of the pad is located at the protrusion end 16e, similarly to the mounting structure 101 of the first embodiment, the opposite direction end 40a can be disposed at any point between the protrusion end 16e and the separation direction end 16f and on the separation direction end 16f.

[0111] For example, the insulating film end 22c of the insulating film 22a on the pad is positioned at the location where the opposite direction end 40a is to be positioned. Then, solder 40 is applied such that the opposite direction end 40a is in contact with the insulating film end 22c. Thus, the opposite direction end 40a can be positioned at the desired location.

[0112] The distance in the X direction between the upper end 31b of the pad and the end 22c of the insulating film is defined as the pad-on-insulating film distance. The pad-on-insulating film distance is the length of the pad-on-insulating film 22a in the X direction. Figure 7 The distance between the insulating film on the pads in the mounting structure 105 of the fourth embodiment shown is... Figure 4 The distance between the insulating films on the pads in the mounting structure 101 of the first embodiment is short. That is, in the mounting structure 105 of the fourth embodiment, the length of the insulating film 22a on the pads in the X direction is shorter than that in the mounting structure 101 of the first embodiment. Therefore, in the mounting structure 105 of the fourth embodiment, deviations in the bonding strength between the stacked ceramic capacitor 10 and the substrate 20 can be suppressed after mounting.

[0113] (Fifth implementation)

[0114] Next, refer to Figure 8 The fifth embodiment is described below. The fifth embodiment modifies a portion of the aforementioned first and fifth embodiments. Therefore, in the accompanying drawings, the same reference numerals are used to label the same structural elements as in the first and fifth embodiments, and the descriptions of these structural elements are omitted; only the differences are described.

[0115] The mounting structure 106 of the fifth embodiment differs from the mounting structure 101 of the first embodiment and the mounting structure 105 of the fourth embodiment in the position of the pad 30.

[0116] exist Figure 4 In the first embodiment shown, the upper end portion 31b of the pad is located at a position X2 relative to the protruding end portion 16e. Furthermore, in the fourth embodiment, the upper end portion 31b of the pad is located at the position of the protruding end portion 16e. In the fifth embodiment, as... Figure 8 As shown, the upper end 31b of the pad is located further apart in the X1 direction than the protruding end 16e. In the fifth embodiment, the distance in the X direction between the two opposing pads 30 is shorter than the distance in the X direction between the two opposing protruding ends 16e.

[0117] In the mounting structure 106 of the fifth embodiment, the opposite direction end 40a does not easily reach the protruding end 16e along the pad surface 30a. This is because the pad surface 30a only exists at a position further away in the separation direction X1 than the protruding end 16e. Therefore, for the mounting structure 106 of the fifth embodiment, it is easier to prevent the solder 40 from contacting the component body 11.

[0118] Furthermore, in the mounting structure 106 of the fifth embodiment, the insulating film end 22c of the insulating film 22 is positioned at the location where the opposite direction end 40a is to be positioned. The opposite direction end 40a is less likely to travel beyond the insulating film end 22c. Therefore, the mounting structure 106 of the fifth embodiment can more reliably prevent the solder 40 from contacting the component body 11.

[0119] (Sixth implementation)

[0120] Next, refer to Figure 9 The sixth embodiment will be described. The sixth embodiment modifies a portion of the fifth embodiment described above. Therefore, in the accompanying drawings, the same reference numerals are used to label the same structural elements as in the fifth embodiment, and the descriptions of these structural elements are omitted; only the differences will be described.

[0121] The mounting structure 107 of the sixth embodiment differs from the mounting structure 106 of the fifth embodiment in the presence or absence of the insulating film 22. Figure 8 In the mounting structure 106 of the fifth embodiment shown, an insulating film 22 (inter-part insulating film 22b) is disposed in the separating portion 21. In the mounting structure 107 of the sixth embodiment, as shown... Figure 9 As shown, the insulating film 22 is not provided in the separating portion 21. The portion in the mounting structure 106 of the fifth embodiment where the insulating film 22b between the separating portions is provided becomes the gap portion 23 in the sixth embodiment.

[0122] In the mounting structure 107 of the sixth embodiment, the opposite direction end 40a is not in contact with the insulating film 22 in the opposite direction X2. Therefore, the solder 40 wets and diffuses along the opposite protrusion 16d of the pad. The portion where the solder 40 wets and diffuses is referred to as the wetting and diffusion portion 40c. Figure 9 In the example shown, a solder 40 immersion and diffusion portion 40c is formed near the opposite end 40a.

[0123] In the mounting structure 107 of the sixth embodiment, the opposite direction end 40a is located either between the protruding end 16e and the separating direction end 16f, or on the separating direction end 16f. This is because the upper end 31b of the pad is positioned at a predetermined distance away from the protruding end 16e along the separating direction X1.

[0124] In the mounting structure 107 of the sixth embodiment, by positioning the upper end 31b of the solder pad at a predetermined position, it is possible to prevent the solder 40 from contacting the component body 11 without configuring the separating inter-part insulating film 22b and the insulating film 22. In other words, in the mounting structure 107 of the sixth embodiment, it is possible to prevent the solder 40 from contacting the component body 11 without making special considerations regarding the configuration of the insulating film 22.

[0125] (Seventh implementation)

[0126] Next, refer to Figure 10 The seventh embodiment is described below. The seventh embodiment modifies a portion of the fifth and sixth embodiments described above. Therefore, in the accompanying drawings, the same reference numerals are used to label the same structural elements as in the fifth and sixth embodiments, and descriptions of these structural elements are omitted; only the differences are described.

[0127] (Comparison with the fifth embodiment)

[0128] The mounting structure 108 of the seventh embodiment will be described in comparison with the mounting structure 106 of the fifth embodiment. The mounting structure 108 of the seventh embodiment differs from the mounting structure 106 of the fifth embodiment in the length of the insulating film 22, which is located at a position further away from the protruding end 16e in the separation direction X1.

[0129] The distance in the X direction from the end of the protrusion 16e to the end of the insulating film 22c is defined as the distance of the protrusion of the insulating film. Figure 10 The distance of the insulating film protrusion in the mounting structure 108 of the seventh embodiment shown is... Figure 8 The insulating film protrusion of the mounting structure 106 shown in the fifth embodiment has a short distance. Figure 8In the mounting structure 106 of the fifth embodiment shown, the insulating film end 22c extends beyond the protruding end 16e and reaches the upper end 31b of the pad. Figure 10 In the mounting structure 108 of the seventh embodiment shown, although the insulating film end 22c extends beyond the protruding end 16e, it only extends to the front of the upper end 31b of the pad. Therefore, the distance of the insulating film protrusion in the mounting structure 108 of the seventh embodiment is shorter than the distance of the insulating film protrusion in the mounting structure 106 of the fifth embodiment.

[0130] In the mounting structure 108 of the seventh embodiment, the insulating film end 22c is located further towards the opposite direction X2. Therefore, the opposite direction end 40a is also located further towards the opposite direction X2. As a result, the distance in the X direction between the solder 40 and the pad protrusion 16d is longer.

[0131] Regarding the distance in the X direction from the opposite end 40a to the end face 17c, Figure 10 The distance ratio of the mounting structure 108 in the seventh embodiment shown Figure 8 The distance of the mounting structure 106 in the fifth embodiment shown is long.

[0132] Thus, in the mounting structure 108 of the seventh embodiment, by shortening the distance of the insulating film protrusion from the protrusion end 16e to the insulating film end 22c, the distance from the opposite direction end 40a to the end face 17c is lengthened. As a result, the resistance between the external electrode 16 and the pad 30 can be reduced.

[0133] Furthermore, in the mounting structure 108 of the seventh embodiment, the insulating film end 22c is positioned beyond the protruding end 16e in the separating direction X1. Therefore, it is possible to prevent the solder 40 from contacting the component body 11.

[0134] (Comparison with the 6th embodiment)

[0135] Next, the mounting structure 108 of the seventh embodiment will be described in comparison with the mounting structure 107 of the sixth embodiment. The mounting structure 108 of the seventh embodiment differs from the mounting structure 107 of the sixth embodiment in the presence or absence of the insulating film 22. Figure 9 In the mounting structure 107 of the sixth embodiment shown, the insulating film 22 is not disposed in the separating portion 21. Figure 10 In the installation structure 108 of the seventh embodiment shown, an insulating film 22 (inter-part insulating film 22b) is disposed in the separating part 21.

[0136] like Figure 10As shown, in the mounting structure 108 of the seventh embodiment, the inter-part insulating film 22b is formed to extend beyond the protruding end 16e in the separation direction X1. This inter-part insulating film 22b can prevent the solder 40 from being located at or beyond the protruding end 16e and from contacting the component body 11.

[0137] Therefore, in the mounting structure 108 of the seventh embodiment, compared with the mounting structure 107 of the sixth embodiment, the upper end portion 31b of the pad can be positioned further in the opposite direction X2. This is because, in the mounting structure 108 of the seventh embodiment, even when the solder 40 wets and diffuses in the opposite direction X2 from the upper end portion 31b of the pad, the wetting and diffusion of the solder 40 is prevented by the separating inter-part insulating film 22b before contact with the component body 11.

[0138] By positioning the upper end 31b of the pad closer to the opposite direction X2, the length in the X direction where the solder 40 contacts the opposite protrusion 16d of the pad can be extended. Regarding the distance in the X direction from the opposite end 40a to the end face 17c, Figure 10 The distance ratio of the mounting structure 108 in the seventh embodiment shown Figure 9 The distance of the mounting structure 107 in the sixth embodiment shown is long. By making the distance in the X direction from the opposite end 40a to the end face 17c longer, the resistance between the external electrode 16 and the pad 30 can be reduced.

[0139] Furthermore, by positioning the upper end 31b of the pad closer to the opposite direction X2, the alignment of the stacked ceramic capacitor 10 when mounting it onto the substrate 20 becomes easier.

[0140] This invention is not limited to the embodiments described herein, and variations and improvements within the scope of achieving the purpose of this invention are included in this invention.

[0141] For example, the multilayer ceramic capacitor 10 in the described embodiment is one example of an electronic component. However, it is not limited to this type of electronic component, and other two-terminal electronic components such as inductors can also be used. For example, in the case of an inductor, the main body of the component is made of magnetic ceramic or the like.

[0142] Furthermore, the present invention includes the following combinations.

[0143] <1> An mounting structure for an electronic component, wherein,

[0144] The mounting structure of the electronic component includes: a pair of pads disposed opposite each other on a substrate; solder disposed on the pads; and an electronic component having: a component body having a stacked dielectric layer and an internal electrode layer, including a pair of main surfaces opposite each other in the stacking direction, a pair of side surfaces opposite each other in a width direction orthogonal to the stacking direction, and a pair of end surfaces opposite each other in a length direction orthogonal to the stacking direction and the width direction; and a pair of external electrodes disposed on each of the end surfaces, each of the external electrodes being connected to each of the pads by means of the solder, each of the external electrodes including a protrusion extending to at least a portion of each of the main surfaces and each of the side surfaces, wherein when the direction in which the pair of pads are arranged is defined as the X direction, the direction in which the pair of pads are separated is defined as the separation direction, and the direction in which the pair of pads are opposite is defined as the relative direction, the relative direction end of the solder is located in the X direction at any one of the relative direction end of the protrusion and the separation direction end of the external electrode.

[0145] <2> Based on the installation structure of the electronic components in <1>, wherein,

[0146] The distance in the X direction between the opposite end of the protrusion and the opposite end of the solder is more than 5% and less than 100% of the distance in the X direction between the opposite end of the protrusion and the end face.

[0147] <3> According to the installation structure of the electronic components in <1> or <2>, wherein,

[0148] The mounting configuration of this electronic component includes an insulating film disposed on the pads.

[0149] The separating end of the insulating film is located in the X direction at any of the following locations: between the opposite end of the protrusion, between the opposite end of the protrusion and the separating end of the external electrode, and at the separating end of the external electrode.

[0150] <4> According to the installation structure of any one of the electronic components in <1> to <3>, where,

[0151] The mounting configuration of the electronic component has an insulating film disposed on the pads, with the opposite ends of the solder abutting the separating ends of the insulating film.

[0152] <5> According to the installation structure of any one of the electronic components in <1> to <4>, where,

[0153] The mounting structure of the electronic component has an insulating film disposed on the substrate, wherein the separating direction end of the insulating film is located in the X direction at any one of the opposite direction end of the protrusion, the opposite direction end of the protrusion and the separating direction end of the external electrode, and the separating direction end of the external electrode.

[0154] <6> According to the installation structure of any one of the electronic components in <1> to <5>, wherein,

[0155] The mounting structure of the electronic component has an insulating film disposed on the substrate, wherein the opposite-direction ends of the solder are connected to the separating-direction ends of the insulating film.

[0156] <7> According to the installation structure of any one of the electronic components in <1> to <6>, wherein,

[0157] The mounting structure of the electronic component includes: a pair of pads disposed opposite each other on a substrate; solder disposed on the pads; and an electronic component having: a component body having a stacked dielectric layer and an internal electrode layer, including a pair of main surfaces opposite each other in the stacking direction, a pair of side surfaces opposite each other in a width direction orthogonal to the stacking direction, and a pair of end surfaces opposite each other in a length direction orthogonal to the stacking direction and the width direction; and a pair of external electrodes disposed on each of the end surfaces, each of the external electrodes being connected to each of the pads by means of the solder, each of the external electrodes including a protrusion extending to at least a portion of each of the main surfaces and each of the side surfaces, wherein when the direction in which the pair of pads are arranged is defined as the X direction, the direction in which the pair of pads are separated is defined as the separation direction, and the direction in which the pair of pads are opposite is defined as the opposing direction, the opposing direction end of the solder is located in the X direction at any one of the end surfaces and the separating direction end of the external electrodes.

[0158] Explanation of reference numerals in the attached figures

[0159] 1. Mounting structure; 10. Multilayer ceramic capacitor (electronic component); 16. External electrode; 16c. Protrusion; 16d. Relative protrusion of pad; 16e. End of protrusion; 16f. End in the separating direction; 16g. Flat part of protrusion; 17c. End face; 22. Insulating film; 22c. End of insulating film; 30. Pad; 31. Peripheral part; 31b. Upper end of pad; 40. Solder; 40a. End in the opposite direction; X1. Separating direction; X2. Opposite direction.

Claims

1. An mounting structure for an electronic component, wherein, The mounting structure of this electronic component includes: A pair of pads are disposed opposite each other on the substrate; Solder, which is respectively disposed on the pads; and An electronic component includes: a component body having stacked dielectric layers and internal electrode layers, comprising a pair of main surfaces opposite each other in the stacking direction, a pair of side surfaces opposite each other in a width direction orthogonal to the stacking direction, and a pair of end surfaces opposite each other in a length direction orthogonal to both the stacking direction and the width direction; and a pair of external electrodes respectively disposed on each of the end surfaces, each of the external electrodes being connected to each of the pads by means of solder. Each of the external electrodes includes a protrusion that extends into at least a portion of each of the main surfaces and each of the side surfaces. When the direction in which the pair of pads are arranged is defined as the X direction, the direction in which the pair of pads are separated is defined as the separation direction, and the direction in which the pair of pads are opposite is defined as the opposite direction... The opposite direction end of the solder is located in the X direction at any of the opposite direction end of the protrusion and the separation direction end of the external electrode, and at the separation direction end of the external electrode.

2. The mounting structure of the electronic component according to claim 1, wherein, The distance in the X direction between the opposite end of the protrusion and the opposite end of the solder is more than 5% and less than 100% of the distance in the X direction between the opposite end of the protrusion and the end face.

3. The mounting structure of the electronic component according to claim 1 or 2, wherein, The mounting configuration of this electronic component includes an insulating film disposed on the pads. The separating end of the insulating film is located in the X direction at any of the following locations: between the opposite end of the protrusion, between the opposite end of the protrusion and the separating end of the external electrode, and at the separating end of the external electrode.

4. The mounting structure of the electronic component according to any one of claims 1 to 3, wherein, The mounting configuration of this electronic component includes an insulating film disposed on the pads. The opposite ends of the solder are connected to the separating ends of the insulating film.

5. The mounting structure of the electronic component according to any one of claims 1 to 4, wherein, The mounting structure of the electronic component has an insulating film disposed on the substrate. The separating end of the insulating film is located in the X direction at any of the following locations: between the opposite end of the protrusion, between the opposite end of the protrusion and the separating end of the external electrode, and at the separating end of the external electrode.

6. The mounting structure of the electronic component according to any one of claims 1 to 5, wherein, The mounting structure of the electronic component has an insulating film disposed on the substrate. The opposite ends of the solder are connected to the separating ends of the insulating film.

7. The mounting structure of the electronic component according to any one of claims 1 to 6, wherein, The mounting structure of this electronic component includes: A pair of pads are disposed opposite each other on the substrate; Solder, which is respectively disposed on the pads; and An electronic component includes: a component body having stacked dielectric layers and internal electrode layers, comprising a pair of main surfaces opposite each other in the stacking direction, a pair of side surfaces opposite each other in a width direction orthogonal to the stacking direction, and a pair of end surfaces opposite each other in a length direction orthogonal to both the stacking direction and the width direction; and a pair of external electrodes respectively disposed on each of the end surfaces, each of the external electrodes being connected to each of the pads by means of solder. Each of the external electrodes includes a protrusion that extends into at least a portion of each of the main surfaces and each of the side surfaces. When the direction in which the pair of pads are arranged is defined as the X direction, the direction in which the pair of pads are separated is defined as the separation direction, and the direction in which the pair of pads are opposite is defined as the opposite direction... The opposite direction end of the solder is located in the X direction at either the end face and the separation direction end of the external electrode or at the separation direction end of the external electrode.

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