Strain gauge chip sorting system and sorting method

Abstract

This invention belongs to the field of automated sorting technology, specifically relating to a strain gauge chip sorting system and method. The strain gauge chip sorting system includes: a sorting moving mechanism for providing multi-degree-of-freedom motion; a sorting suction cup module installed at the output end of the sorting moving mechanism for adsorbing and releasing individual strain gauge chips; a vision re-inspection module for identifying strain gauge chips to be picked up; a feeding module for receiving and accommodating the sorted strain gauge chips; and a control module connected to the sorting moving mechanism, the sorting suction cup module, the vision re-inspection module, and the feeding module. This invention, through its system structure including the sorting moving mechanism, the sorting suction cup module, the vision re-inspection module, and the control module, enables the vision re-inspection module to move synchronously with the suction cup module to dynamically correct its position. Combined with the precise control of the control module, this effectively solves the problems of chip damage, low efficiency, and manual dependence caused by position drift in existing technologies.

Description

Technical Field

[0001] This invention belongs to the field of automated sorting technology, specifically relating to strain gauge chip sorting system and sorting method. Background Technology

[0002] As a core precision component, strain gauge chips are characterized by their tiny size, intricate structure, and fragile, easily damaged surface. This places extremely high demands on the accuracy, efficiency, and automation of sorting and unloading. In the mass production of strain gauge chips, sorting and unloading is a crucial link between chip inspection and finished product storage, directly impacting product quality, production efficiency, and production costs. Currently, the sorting and unloading of strain gauge chips is mostly done manually or with semi-automated equipment, which has several significant drawbacks: Existing semi-automated equipment often uses fixed-mounted vision recognition modules for chip positioning. Due to the tiny size of strain gauge chips, relative positional deviations can easily occur between the fixed vision module and the chip picking mechanism, leading to inaccurate chip alignment during pickup, resulting in chip bumps and scratches, and affecting product yield. Furthermore, during the unloading process, the supply, replacement, and storage of full trays all rely on manual operation, requiring frequent interruptions to the production process. This not only significantly reduces production efficiency and increases labor costs but also easily introduces human error, affecting product quality stability.

[0003] Therefore, developing a strain gauge chip sorting system capable of precise positioning, single-chip sorting, automated tray transfer, and integrated control throughout the entire process has become a pressing technical challenge in this field. Summary of the Invention

[0004] To overcome the shortcomings of the prior art, the present invention provides a strain gauge chip sorting system and sorting method, which has the advantages of improving sorting accuracy, reducing chip damage risk, improving production efficiency and reducing reliance on manual labor.

[0005] This application provides a strain gauge chip sorting system, including: The sorting and moving mechanism is used to provide multi-degree-of-freedom motion; The sorting suction cup module is installed at the output end of the sorting moving mechanism and is used to adsorb and release individual strain gauge chips. The visual re-inspection module is installed on the sorting suction cup module and moves synchronously with it to identify the strain gauge chip to be picked up. The feeding module is used to receive and hold the sorted strain gauge chips; The control module is connected to the sorting moving mechanism, the sorting suction cup module, the vision re-inspection module, and the unloading module respectively. The control module is configured to: control the vision re-inspection module to identify the position of the target strain gauge chip, and based on the identification result, control the sorting moving mechanism to drive the sorting suction cup module to move to the corresponding position to pick up the chip, and finally place the chip in the unloading module.

[0006] Furthermore, this application also proposes that the material cutting module includes: Feeding bin; An empty disk stacking assembly is located in the unloading hopper and is used to stack and store empty disks that do not carry chips. A full-load disk stacking assembly is located in the unloading hopper and is used to stack and store full-load disks that have already carried chips. The transfer assembly is movably installed in the unloading hopper for transferring pallets between empty pallet stacking assemblies, unloading positions, and full pallet stacking assemblies. The carrier drive assembly is connected to the transfer assembly via a transmission mechanism and is used to drive the transfer assembly to move.

[0007] Furthermore, this application also proposes a sorting moving mechanism including a sorting X-axis linear module, a sorting Y-axis linear module, a sorting Z-axis linear module, and a sorting rotary module. The sorting rotary module is installed on the sliding part of the sorting Z-axis linear module, and the sorting suction cup module is installed on the output end of the sorting rotary module.

[0008] Furthermore, this application also proposes a sorting rotary module including a hollow turntable, a turntable module motor for driving the hollow turntable, and a suction cup rotating plate connected to the bottom of the hollow turntable, with the sorting suction cup module installed below the suction cup rotating plate.

[0009] Furthermore, this application also proposes a visual inspection module including an industrial camera, which is fixedly mounted on the side of the suction cup rotating plate via a camera bracket.

[0010] Furthermore, this application also proposes a sorting suction cup module including a suction cup assembly and a suction cup control valve assembly. The suction cup assembly includes multiple independently controlled vacuum nozzles, and the suction cup control valve assembly is used to control the start and stop of each vacuum nozzle.

[0011] Furthermore, this application also proposes an empty pallet stacking assembly including an empty pallet rack, an empty pallet support fork, and a drive cylinder for extending and retracting the empty pallet support fork. The empty pallet support fork is configured to retract when the transfer assembly removes the bottom empty pallet and to reset after the empty pallet is removed to support the upper empty pallet stack.

[0012] Furthermore, this application also proposes a full-load pallet stacking assembly including a full-load pallet rack and a full-load pallet baffle disposed at its bottom. The full-load pallet baffle is a one-way baffle that can be flipped upwards and is configured to allow the transfer assembly to lift the full-load pallet from below into the full-load pallet rack and prevent it from falling.

[0013] Furthermore, this application also proposes a transfer assembly including a horizontally movable mounting plate, a lifting cylinder disposed on the mounting plate, and a lifting plate connected to the drive end of the lifting cylinder, wherein the lifting plate is provided with a plurality of lifting rods for lifting the carrier plate.

[0014] Furthermore, this application also proposes a method for sorting strain gauge chips, applied to the aforementioned visual recognition and automatic sorting and unloading system, comprising the following steps: S1: Obtain the detection results and location information of the strain gauge chip to be sorted; S2: Control the unloading module so that its transfer component moves an empty pallet from the empty pallet stacking component to the unloading position; S3: Control the sorting moving mechanism to drive the sorting suction cup module and the vision re-inspection module to move, and use the vision re-inspection module to accurately locate the target chip based on the position information; S4: Based on the precise positioning results, control the sorting suction cup module to pick up the target chip; S5: Control the sorting and moving mechanism to transfer the picked-up chips and place them at the designated position on the empty tray at the unloading position; S6: Repeat steps S3 to S5 until the tray at the unloading position is fully loaded. S7: Control the unloading module so that its transfer component can move the full-loaded pallet from the unloading position to the full-loaded pallet stacking component for stacking and storage.

[0015] As can be seen from the above, the strain gauge chip sorting system and sorting method provided in this application, through a system structure including a sorting moving mechanism, a sorting suction cup module, a vision re-inspection module and a control module, realizes that the vision re-inspection module moves synchronously with the suction cup module to dynamically correct the position. Combined with the precise control of the control module, it effectively solves the problems of chip damage, low efficiency and manual dependence caused by position drift in the prior art. It has the advantages of improving sorting accuracy, reducing chip damage risk, improving production efficiency and reducing manual dependence. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram showing the structure of the strain gauge chip sorting system of the present invention; Figure 2 This is a schematic diagram showing the structure of the sorting and moving mechanism of the present invention; Figure 3express Figure 2 A magnified schematic diagram of the partial structure at point A in the middle; Figure 4 This is a schematic diagram showing the structure of the sorting suction cup module of the present invention; Figure 5 This is a schematic diagram showing the structure of the feeding module of the present invention; Figure 6 This is an exploded view of the material feeding module of the present invention. Figure 7 This is a schematic diagram showing the structure of the transfer component of the present invention; Figure 8 This is a schematic diagram showing the structure of the empty disk stacking assembly of the present invention; Figure 9 This is a schematic diagram showing the structure of the full-load disk stacking assembly of the present invention.

[0018] The symbols in the attached image are explained as follows: 1-Sorting moving mechanism; 11-Sorting X-axis linear module; 12-Sorting Y-axis linear module; 13-Sorting Z-axis linear module; 14-Sorting rotary module; 141-Hollow turntable; 142-Turntable module motor; 143-Suction cup rotating plate; 2-Sorting suction cup module; 21-Suction cup assembly; 22-Suction cup control valve assembly; 3-Vision inspection module; 31-Industrial camera; 32-Camera bracket; 4-Unloading module; 41-Unloading bin; 42-Empty pallet stacking assembly; 43-Full pallet stacking assembly; 44-Transfer assembly; 45-Platelet drive assembly; 421-Empty pallet rack; 422-Empty pallet support fork; 423-Drive cylinder; 431-Full pallet rack; 432-Full pallet baffle; 441-Mounting plate; 442-Lifting cylinder; 443-Lifting plate; 444-Lifting rod. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0020] Traditional strain gauge chip sorting and unloading relies heavily on manual labor or semi-automated equipment. This inherent positional deviation between the fixed vision module and the picking mechanism leads to inaccurate chip picking, increasing the risk of scratches and impacting product yield. Furthermore, the supply and storage of carrier trays require manual intervention, frequently interrupting production, reducing efficiency, increasing costs, and increasing the likelihood of human error, thus affecting product quality stability.

[0021] Please refer to Figures 1-9 In response, this embodiment proposes a strain gauge chip sorting system, including: Sorting moving mechanism 1 is used to provide multi-degree-of-freedom motion; The sorting suction cup module 2 is installed at the output end of the sorting moving mechanism 1 and is used to adsorb and release individual strain gauge chips. The visual re-inspection module 3 is installed on the sorting suction cup module 2 and moves synchronously with it to identify the strain gauge chip to be picked up. The feeding module 4 is used to receive and accommodate the sorted strain gauge chips; The control module is connected to the sorting moving mechanism 1, the sorting suction cup module 2, the vision re-inspection module 3 and the unloading module 4 respectively; The control module is configured to: control the vision re-inspection module 3 to identify the position of the target strain gauge chip, and based on the identification result, control the sorting moving mechanism 1 to drive the sorting suction cup module 2 to move to the corresponding position to pick up the chip, and finally place the chip in the unloading module 4.

[0022] The sorting and moving mechanism 1 can be composed of multiple independent linear or rotary motion units. Through the coordinated action of these motion units, the sorting and moving mechanism 1 can precisely position the sorting suction cup module 2 to any point in space. The sorting suction cup module 2 is installed at the output end of the sorting and moving mechanism 1 and is used to adsorb and release individual strain gauge chips. The vision re-inspection module 3 is installed on the sorting suction cup module 2 and moves synchronously with it to identify the strain gauge chips to be picked up, thereby determining the corresponding grade of the strain gauge chips. The unloading module 4 can be set in multiple independent placement areas, each area for storing chips of different grades. A control module is connected to the sorting and moving mechanism 1, the sorting suction cup module 2, the vision re-inspection module 3, and the unloading module 4 via signals. This control module can be a programmable logic controller (PLC) or an industrial computer, communicating with each actuator and sensor via wired or wireless means. The control logic is configured as follows: First, the vision re-inspection module 3 is controlled to acquire images and identify the position of the target strain gauge chip. Then, based on the identification results provided by the vision re-inspection module 3, the sorting moving mechanism 1 is controlled to drive the sorting suction cup module 2 to the precise position of the target chip, completing the chip pickup. Finally, the picked-up chip is moved to the designated position of the unloading module 4 and released, thus realizing the separate storage of chips of different grades.

[0023] This system achieves precise identification and positioning of micro-strain gauge chips by synchronously integrating the vision re-inspection module 3 with the sorting suction cup module 2. This effectively avoids the relative positional deviation between the traditional fixed vision module and the pickup mechanism, thereby reducing the risk of chip impact and scratches. Simultaneously, the automated coordination of the entire sorting, adsorption, and unloading process through the control module reduces manual intervention, improves sorting and unloading efficiency and product quality stability, and lowers production costs.

[0024] This embodiment also proposes a feeding module 4 including a feeding bin 41, an empty pallet stacking assembly 42, a full pallet stacking assembly 43, a transfer assembly 44, and a pallet drive assembly 45.

[0025] The unloading bin 41 is the main structure of the unloading module 4. It is usually a closed or semi-closed box to accommodate and protect the empty pallet stacking assembly 42, the full pallet stacking assembly 43 and the transfer assembly 44 inside, and to provide physical support and space for the stacking and transfer of pallets.

[0026] The empty disk stacking assembly 42 is specifically designed for the centralized storage of empty disks that are not yet loaded with any strain gauge chips. It is typically designed as a rack or trough structure capable of accommodating multiple empty disks in a stacked manner, allowing the system to automatically retrieve them as needed. Vertically stacked racks can be used, with empty disks supplied one by one by gravity or mechanical assistance.

[0027] The full-load disk stacking assembly 43 corresponds to the empty disk stacking assembly 42 and is used to centrally store full-load disks that have already carried strain gauge chips. Its structure can also be designed as a rack or trough, capable of receiving and storing multiple full-load disks in a stacked manner until a preset number is reached. A vertically stacked rack can be used, and the orderly stacking of full-load disks can be achieved through bottom support or lifting mechanisms.

[0028] The transfer component 44 is a key component that enables the automatic transfer of pallets within the unloading module 4. It is configured to move horizontally within the unloading bin 41 to transport empty pallets from the empty pallet stacking assembly 42 to the unloading position, and to transfer full pallets from the unloading position to the full pallet stacking assembly 43.

[0029] The tray drive assembly 45 is connected to the transfer assembly 44 and is responsible for providing driving force to precisely control the movement of the transfer assembly 44, ensuring that the transfer assembly 44 can accurately and smoothly move the tray to the predetermined position, thereby realizing the automated management of the tray.

[0030] In this embodiment, the empty tray stacking assembly 42 and the full tray stacking assembly 43 respectively achieve centralized and orderly storage of empty and full trays, greatly reducing the frequency of manual intervention. Furthermore, under the precise control of the tray drive assembly 45, the transfer assembly 44 can automatically move empty trays from the stacking area to the unloading position, and after chip sorting, transfer full trays to the full tray stacking area, thus realizing automatic tray supply, reception, and storage. This effectively solves the problems of low efficiency, error-proneness, and disruption to production continuity caused by manual operation in traditional unloading methods, significantly improving the automation level and production efficiency of the entire strain gauge chip sorting system, ensuring the continuity and stability of the chip sorting process, while reducing labor costs and operational risks.

[0031] This embodiment further proposes that the sorting moving mechanism 1 includes a sorting X-axis linear module 11, a sorting Y-axis linear module 12, a sorting Z-axis linear module 13, and a sorting rotating module 14. The sorting rotating module 14 is installed on the sliding part of the sorting Z-axis linear module 13, and the sorting suction cup module 2 is installed on the output end of the sorting rotating module 14.

[0032] This embodiment specifically configures the sorting moving mechanism 1 to include a sorting X-axis linear module 11, a sorting Y-axis linear module 12, a sorting Z-axis linear module 13, and a sorting rotation module 14, with the sorting rotation module 14 mounted on the sliding part of the sorting Z-axis linear module 13 and the sorting suction cup module 2 mounted on the output end of the sorting rotation module 14 for hierarchical integration. This structure provides precise four-degree-of-freedom motion capability, not only enabling precise positioning of the sorting suction cup module 2 in three-dimensional space, but more importantly, allowing for precise angle adjustment of the sorting suction cup module 2 when picking up or placing chips through the sorting rotation module 14. This is crucial for processing strain gauge chips that may have random orientations or require specific placement angles, greatly improving the flexibility and accuracy of chip picking and placement. Meanwhile, since the visual re-inspection module 3 moves synchronously with the sorting suction cup module 2, this precise control with multiple degrees of freedom ensures that the visual re-inspection module 3 can identify and accurately position the chip from the best angle, further improving the sorting efficiency and reliability of the entire system.

[0033] This embodiment further proposes that the sorting rotation module 14 includes a hollow turntable 141, a turntable module motor 142 for driving the hollow turntable 141, and a suction cup rotation plate 143 connected to the bottom of the hollow turntable 141, with the sorting suction cup module 2 installed below the suction cup rotation plate 143.

[0034] The sorting rotary module 14 in this embodiment adopts a combined structure of a hollow turntable 141, a turntable module motor 142, and a suction cup rotating plate 143, and clearly defines the installation position of the sorting suction cup module 2. The turntable module motor 142 directly drives the hollow turntable 141 to rotate precisely, ensuring the smoothness of the rotation and the accuracy of the positioning. The suction cup rotating plate 143, as an extension of the bottom of the hollow turntable 141, provides a robust and synchronously rotating mounting platform for the sorting suction cup module 2, effectively avoiding vibration or positioning deviation that may occur during high-speed or frequent rotation. The sorting suction cup module 2 is installed below the suction cup rotating plate 143, which not only ensures its tight integration with the rotating platform but also optimizes the working space for picking up strain gauge chips. This structural design significantly improves the stability, accuracy, and reliability of the sorting suction cup module 2 during rotation, thereby ensuring the accurate picking and placement of strain gauge chips. It effectively solves the stability and accuracy problems that may exist in the rotation drive and installation of the sorting suction cup module 2, and thus improves the working efficiency and sorting quality of the entire vision recognition and automatic sorting and unloading system.

[0035] This embodiment further proposes that the visual inspection module 3 includes an industrial camera 31, which is fixedly mounted on the side of the suction cup rotating plate 143 via a camera bracket 32.

[0036] In this embodiment, the visual re-inspection module 3 is a component used for secondary, more refined visual inspection of the target strain gauge chip. Its main function is to confirm the precise position and orientation of the chip before the sorting suction cup module 2 picks it up, ensuring the accuracy of the picking operation. This module typically includes an image acquisition device, a light source, and an image processing unit, capable of capturing and analyzing images of the chip to provide high-precision positioning information. An industrial camera 31 is fixedly mounted to the side of the suction cup rotating plate 143 via a camera bracket 32, ensuring that the visual re-inspection module 3 and the sorting suction cup module 2 maintain a highly synchronized and stable relative position during rotation. This fixed mounting method significantly enhances the stability of the visual re-inspection module 3, effectively avoiding recognition errors caused by vibration or relative displacement during multi-degree-of-freedom motion of the sorting moving mechanism 1, especially when the sorting rotating module 14 rotates. This allows the visual re-inspection module 3 to continuously provide high-precision chip position information, greatly improving the success rate of the sorting suction cup module 2 in picking up the target chip and the overall system sorting efficiency.

[0037] This embodiment further proposes that the sorting suction cup module 2 includes a suction cup group 21 and a suction cup control valve assembly 22. The suction cup group 21 includes multiple independently controlled vacuum nozzles, and the suction cup control valve assembly 22 is used to control the start and stop of each vacuum nozzle.

[0038] In this embodiment, the sorting suction cup module 2 possesses more refined operational capabilities, effectively solving the challenge of accurately picking up individual strain gauge chips in complex scenarios. Multiple independently controlled vacuum nozzles allow the control module to selectively activate one or more of the most suitable vacuum nozzles for adsorption based on the position, size, and surrounding environment information of the target strain gauge chip identified by the vision re-inspection module 3. This selective adsorption mechanism significantly improves the accuracy and success rate of picking, avoiding mis-adsorption, missed adsorption, or interference with adjacent chips caused by excessive adsorption force or too wide adsorption range. Simultaneously, the introduction of the suction cup control valve assembly 22 provides reliable hardware support for the independent start and stop of each vacuum nozzle, enhancing the flexibility, efficiency, and reliability of the entire sorting and unloading process.

[0039] This embodiment further proposes that the empty pallet stacking assembly 42 includes an empty pallet rack 421, an empty pallet support fork 422, and a drive cylinder 423 for extending and retracting the empty pallet support fork 422. The empty pallet support fork 422 is configured to retract when the transfer assembly 44 removes the bottom empty pallet, and to reset after the empty pallet is removed to support the upper empty pallet stack.

[0040] Understandably, the empty pallet support fork 422 is configured to retract when the transfer assembly 44 removes the bottom empty pallet. This means that when the transfer assembly 44 moves to the unloading position and is ready to pick up the bottom empty pallet in the stack, the drive cylinder 423 receives a control signal and drives the empty pallet support fork 422 to retract inward, thus providing the necessary space for the smooth removal of the bottom empty pallet. Subsequently, after the empty pallet is successfully removed by the transfer assembly 44, the empty pallet support fork 422 quickly resets, that is, it re-extends under the action of the drive cylinder 423 to support the remaining empty pallet stack above. This precise coordinated action ensures the stability of the empty pallet stack, preventing the upper empty pallets from falling or tipping over due to loss of support.

[0041] This embodiment achieves stable stacking and precise individual release of empty trays through the empty tray stacking assembly 42. The empty tray rack 421 provides a stable stacking space, and the empty tray support fork 422, under the precise control of the drive cylinder 423, coordinates with the movement of the transfer assembly 44. It retracts promptly when the bottom empty tray is removed and quickly resets after removal, ensuring reliable support for the upper empty tray stack. This effectively solves the problems of jamming, tilting, or collapse that may occur during automated tray sorting, ensuring the continuity and stability of empty tray supply and significantly improving the operating efficiency and reliability of the entire strain gauge chip automatic sorting and unloading system.

[0042] This embodiment further proposes that the full-load pallet stacking assembly 43 includes a full-load pallet rack 431 and a full-load pallet baffle 432 disposed at its bottom. The full-load pallet baffle 432 is a one-way baffle that can be flipped upwards and is configured to allow the transfer assembly 44 to lift the full-load pallet from below into the full-load pallet rack 431 and prevent it from falling.

[0043] Understandably, when the transfer assembly 44 moves a full-loaded tray from the unloading position to below the full-loaded tray stacking assembly 43, the transfer assembly 44 will lift the full-loaded tray upwards. During the ascent, the full-loaded tray will contact the bottom of the full-loaded tray baffle 432 and apply an upward force, causing the baffle to flip upwards. Once the full-loaded tray has completely passed the baffle and entered the stacking area of ​​the full-loaded tray rack 431, the transfer assembly 44 will descend, and the full-loaded tray baffle 432 will automatically flip back to its original position under its own gravity or the action of the reset mechanism, thereby effectively supporting the newly entered full-loaded tray and all the full-loaded trays already stacked above it, preventing them from falling.

[0044] Through the above technical solution, this embodiment provides an efficient and reliable full-load pallet stacking mechanism. The full-load pallet rack 431 provides a stable stacking space for full-load pallets, while the one-way full-load pallet baffle 432, which can be flipped upwards at its bottom, cleverly solves the problem of fixing the full-load pallet after it enters the stacking area from below. When the transfer component 44 lifts the full-load pallet from below into the full-load pallet rack 431, the full-load pallet baffle 432 can flip upwards accordingly, providing a channel for the smooth entry of the full-load pallet. Once the full-load pallet has passed, the baffle will automatically reset, forming a reliable physical support, effectively preventing the full-load pallet from falling accidentally due to gravity, thereby ensuring the stability and safety of the full-load pallet stacking. This design not only simplifies the full-load pallet warehousing operation and improves stacking efficiency, but also avoids the risk of jamming or falling that may exist in traditional stacking methods, further improving the automation level and operational reliability of the entire unloading module 4.

[0045] This embodiment further proposes that the transfer assembly 44 includes a horizontally movable mounting plate 441, a lifting cylinder 442 disposed on the mounting plate 441, and a lifting plate 443 connected to the drive end of the lifting cylinder 442. The lifting plate 443 is provided with a plurality of lifting rods 444 for lifting the carrier plate.

[0046] Mounting plate 441 is the main structure of transfer assembly 44, configured to move horizontally within unloading bin 41 to transfer pallets from one location (e.g., below empty pallet stack assembly 42) to another location (e.g., below unloading position or full pallet stack assembly 43). Mounting plate 441 is typically supported by linear guides or a slider mechanism and driven by a drive unit (e.g., a stepper motor, servo motor with lead screw, or synchronous belt) to achieve precise horizontal positioning.

[0047] The lifting cylinder 442 is mounted on the mounting plate 441. Its function is to provide vertical power to meet the specific needs of lifting the pallet and to ensure stability and response speed under pallet load.

[0048] The lifting plate 443 is connected to the drive end (i.e., piston rod) of the lifting cylinder 442 and moves vertically as the lifting cylinder 442 extends and retracts. The lifting plate bears the weight of the carrier plate and is supported by an additional guiding mechanism (such as a guide sleeve or linear bearing) to ensure its smoothness and stability during vertical movement.

[0049] The lifting plate 443 is equipped with several lifting rods 444 for lifting the carrier tray. When the lifting plate 443 rises, the lifting rods 444 contact and lift the carrier tray; when the lifting plate 443 descends, the lifting rods 444 lower the carrier tray. This ensures that the carrier tray is stably and evenly stressed in the vertical direction, avoiding tilting or jamming.

[0050] Through the above-described technical solution, the transfer assembly 44 in this embodiment achieves precise horizontal positioning and stable vertical lifting. The horizontally movable mounting plate 441 is responsible for horizontally transferring the tray between different positions within the unloading bin 41. A lifting cylinder 442 mounted on the mounting plate 441 drives a lifting plate 443 connected to the driving end of the lifting cylinder 442, and several lifting rods 444 on it for lifting the tray. This allows the tray to be smoothly picked up from the empty tray stacking assembly 42 or placed into the full tray stacking assembly 43, and precisely positioned at the unloading position. This design effectively solves the coordination problem of horizontal and vertical movement of the tray during transfer, ensuring stable, efficient, and precise transfer of the tray, thereby improving the automation level and operational reliability of the entire strain gauge chip sorting system.

[0051] This embodiment further proposes a method for sorting strain gauge chips, applied to a visual recognition and automatic sorting and unloading system, including the following steps: S1: Obtain the detection results and location information of the strain gauge chip to be sorted; Understandably, the manufacturing process of strain gauges involves key steps such as wafer loading, resistance detection, laser cutting, and finished chip sorting. The system in this embodiment is an application device for the sorting stage. In this step, before the sorting and unloading process begins, the control module first obtains the quality status (i.e., detection results, such as excellent, qualified, unqualified, defect type, etc.) of each chip from the resistance detection equipment and laser cutting equipment, as well as its initial rough position coordinates and possible orientation information on the tray, as the basic data for subsequent precise positioning and sorting.

[0052] S2: Control the unloading module so that its transfer component moves an empty pallet from the empty pallet stacking component to the unloading position; In this step, the control module sends commands to the pallet drive assembly to move the transfer assembly. The transfer assembly first moves horizontally to below the empty pallet stack assembly. At this point, the empty pallet support fork temporarily retracts, allowing the transfer assembly's lifting rod to lift the bottom empty pallet from the bottom. Subsequently, the transfer assembly carries the empty pallet horizontally to the preset unloading position and places it smoothly on the unloading position, preparing for the subsequent placement of chips.

[0053] S3: Control the sorting moving mechanism to drive the sorting suction cup module and the vision re-inspection module to move, and use the vision re-inspection module to accurately locate the target chip based on the position information; In this step, based on the rough position information obtained in the first step, the control module directs the sorting X-axis linear module, the sorting Y-axis linear module, and the sorting Z-axis linear module to work together to move the sorting suction cup module and the vision re-inspection module (including an industrial camera) mounted on the side of its suction cup rotating plate to the area above the target chip. At this time, the industrial camera will capture a high-resolution image of the target chip and perform secondary recognition and analysis through image processing algorithms to correct for any minor deviations, obtain the chip's precise center coordinates and rotation angle, and ensure the accuracy of subsequent picking.

[0054] S4: Based on the precise positioning results, control the sorting suction cup module to pick up the target chip; After obtaining precise chip position and orientation information, the control module precisely controls the sorting movement mechanism, causing the sorting suction cup module to descend above the target chip. The suction cup control valve assembly is activated, causing one or more vacuum nozzles in the suction cup assembly to generate negative pressure, thereby firmly adsorbing the target strain gauge chip.

[0055] S5: Control the sorting and moving mechanism to transfer the picked-up chips and place them at the designated position on the empty tray at the unloading position; In this step, after the chip is successfully picked up, the control module again directs the sorting and moving mechanism to move the sorting suction cup module and the chip it has picked up to the preset, designated position above the empty tray at the unloading station. Once the designated position is reached, the suction cup control valve assembly releases the vacuum, and the chip is precisely and gently placed into the corresponding slot in the empty tray.

[0056] S6: Repeat steps S3 to S5 until the tray at the unloading position is fully loaded. In this step, the precise positioning, picking, and placement steps are repeated until the tray at the unloading position becomes a full tray. The control module continuously tracks the filling status of empty trays. Once all designated positions of the currently empty tray have been successfully filled, the empty tray is marked as a full tray.

[0057] S7: Control the unloading module so that its transfer component can move the full-loaded pallet from the unloading position to the full-loaded pallet stacking component for stacking and storage.

[0058] Once the empty pallet becomes a full pallet, the control module again drives the pallet drive assembly 45, causing the transfer assembly 44 to move. The transfer assembly 44 lifts the full pallet from the unloading position and moves it horizontally to the full pallet stacking assembly 43. The lifting rod 444 of the transfer assembly 44 lifts the full pallet upward, allowing it to enter the full pallet rack 431 for stacking. The full pallet baffle 432 acts as a one-way baffle that can flip upward, allowing the full pallet to be lifted in and automatically resetting after the transfer assembly 44 is removed, preventing the full pallet from falling due to gravity, thereby achieving orderly stacking and storage of full pallets.

[0059] Through the above technical solution, this embodiment provides a highly automated, precise, and efficient strain gauge chip sorting and unloading process. This method ensures accurate chip picking through precise visual positioning and, combined with an automated tray transfer and chip placement mechanism, achieves fully unmanned operation from chip identification and picking to tray filling and stacking. This significantly improves the efficiency and accuracy of sorting and unloading, reduces the complexity and error rate of manual operation, and ensures the continuous and stable operation of the production line, effectively solving the problems of tray transfer and orderly chip filling.

[0060] The following example will provide a more detailed explanation of the above technical solution: On the strain gauge chip production line, the strain gauge chips, after initial inspection, are scattered in the sorting area and need to be accurately picked up and placed into carrier trays. Traditional fixed vision recognition systems often fail to pick up the tiny chips accurately due to relative positional deviations between the picking mechanism and the vision module, resulting in chip damage. Furthermore, the supply and storage of carrier trays rely on manual labor, which is inefficient and prone to errors.

[0061] This system effectively solves the aforementioned problems through integrated design. First, the control module receives the detection results and approximate location information of the strain gauge chips to be sorted. When the sorting and unloading process starts, the control module first instructs the unloading module 4 to prepare the tray. Driven by the tray drive component 45, the transfer component 44 in the unloading module 4 removes an empty tray from the empty tray stacking component 42. Specifically, the empty tray support fork 422 of the empty tray stacking component 42 retracts under the action of the drive cylinder 423, allowing the bottom empty tray to be lifted and moved out by the lifting rod 444 of the transfer component 44. This empty tray is then transferred to the unloading position by the transfer component 44, and the empty tray support fork 422 resets to support the upper empty tray stack.

[0062] Once the empty tray is ready, the control module begins coordinating chip pickup. The sorting movement mechanism 1, composed of a sorting X-axis linear module 11, a sorting Y-axis linear module 12, a sorting Z-axis linear module 13, and a sorting rotation module 14, drives the sorting suction cup module 2 and the vision re-inspection module 3 mounted on it to the approximate area of ​​the chip to be picked up. Unlike the fixed-mounted vision modules in existing technologies, the vision re-inspection module 3 (including an industrial camera 31) in this system is mounted on the sorting suction cup module 2 and moves synchronously with it. When the sorting suction cup module 2 approaches the target chip, the industrial camera 31 of the vision re-inspection module 3 precisely positions the target chip, acquiring its accurate three-dimensional coordinates and orientation information. This follow-up vision re-inspection method effectively avoids relative positional deviations between the fixed vision module and the pickup mechanism, ensuring accurate positioning.

[0063] Based on the precise positioning results provided by the vision re-inspection module 3, the control module precisely controls the sorting moving mechanism 1, driving the sorting suction cup module 2 to move directly above the target chip. The sorting rotation module 14, through the cooperation of the hollow turntable 141 and the suction cup rotation plate 143, can adjust the rotation angle of the sorting suction cup module 2 to adapt to the chip's orientation. The suction cup assembly 21 of the sorting suction cup module 2 includes multiple independently controlled vacuum nozzles. The suction cup control valve assembly 22 selectively activates one or more vacuum nozzles based on the chip size and position information, precisely adsorbing the target strain gauge chip. This independently controlled nozzle design improves the flexibility and success rate of the pick-up process.

[0064] After the chip is attracted, the control module controls the sorting moving mechanism 1 again to move the picked-up chip from the sorting area to the unloading position of the unloading module 4. The sorting suction cup module 2 is precisely aligned with the designated position of the empty tray above the unloading position, and then the suction cup control valve assembly 22 releases the vacuum, placing the chip smoothly into the empty tray.

[0065] The picking and placing process is repeated. The control module continuously controls the sorting moving mechanism 1 to drive the sorting suction cup module 2 and the vision re-inspection module 3 to accurately locate and pick up the next target chip, and place it in the designated position of the empty tray at the unloading position. When the empty tray is filled with chips and becomes a full tray, the control module instructs the unloading module 4 to transfer the full tray. The transfer component 44 starts again, moving the full tray from the unloading position to the full tray stacking component 43. The full tray baffle 432 of the full tray stacking component 43 flips upward, allowing the transfer component 44 to lift the full tray from below into the full tray rack 431 for stacking and storage. Then the baffle resets to prevent the full tray from falling. At the same time, the transfer component 44 will take a new empty tray from the empty tray stacking component 42 and transfer it to the unloading position, preparing for the next round of chip sorting.

[0066] Through the above process, this system achieves precise positioning of strain gauge chips, single-chip sorting, automated tray transfer, and integrated control throughout the entire process. Compared with existing technologies that rely on manual tray supply, replacement, and full-load tray storage, this system significantly improves production efficiency, reduces labor costs, eliminates human error, and ensures product quality stability. The synchronous movement of the vision re-inspection module 3 and the sorting suction cup module 2 solves the problem of relative positional deviation between the traditional fixed vision module and the picking mechanism, greatly improving picking accuracy and avoiding chip damage.

[0067] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A strain gauge chip sorting system, characterized in that, include: The sorting and moving mechanism is used to provide multi-degree-of-freedom motion; The sorting suction cup module is installed at the output end of the sorting moving mechanism and is used to adsorb and release individual strain gauge chips. A visual re-inspection module is installed on the sorting suction cup module and moves synchronously with it to identify the strain gauge chip to be picked up. The feeding module is used to receive and hold the sorted strain gauge chips; The control module is connected to the sorting moving mechanism, the sorting suction cup module, the vision re-inspection module and the unloading module respectively; The control module is configured to: control the visual inspection module to identify the position of the target strain gauge chip, and based on the identification result, control the sorting moving mechanism to drive the sorting suction cup module to move to the corresponding position to pick up the chip, and finally place the chip in the unloading module.

2. The strain gauge chip sorting system as described in claim 1, characterized in that, The feeding module includes: Feeding bin; An empty disk stacking assembly is provided in the unloading hopper for stacking and storing empty disks that do not carry chips; A full-load disk stacking assembly is provided in the unloading bin for stacking and storing full-load disks that have already carried chips; A transfer assembly is movably disposed within the unloading hopper for transferring pallets between the empty pallet stacking assembly, the unloading point, and the full-load pallet stacking assembly. A carrier drive assembly is connected to the transfer assembly for driving the transfer assembly to move.

3. The strain gauge chip sorting system as described in claim 1, characterized in that, The sorting and moving mechanism includes a sorting X-axis linear module, a sorting Y-axis linear module, a sorting Z-axis linear module, and a sorting rotary module. The sorting rotary module is installed on the sliding part of the sorting Z-axis linear module, and the sorting suction cup module is installed on the output end of the sorting rotary module.

4. The strain gauge chip sorting system as described in claim 3, characterized in that, The sorting rotary module includes a hollow turntable, a turntable module motor that drives the hollow turntable, and a suction cup rotating plate connected to the bottom of the hollow turntable. The sorting suction cup module is installed below the suction cup rotating plate.

5. The strain gauge chip sorting system as described in claim 4, characterized in that, The visual inspection module includes an industrial camera, which is fixedly mounted on the side of the suction cup rotating plate via a camera bracket.

6. The strain gauge chip sorting system as described in claim 1, characterized in that, The sorting suction cup module includes a suction cup assembly and a suction cup control valve assembly. The suction cup assembly includes multiple independently controlled vacuum nozzles, and the suction cup control valve assembly is used to control the start and stop of each vacuum nozzle.

7. The strain gauge chip sorting system as described in claim 2, characterized in that, The empty pallet stacking assembly includes an empty pallet rack, an empty pallet support fork, and a drive cylinder for extending and retracting the empty pallet support fork. The empty pallet support fork is configured to retract when the transfer assembly removes the bottom empty pallet and to reset after the empty pallet is removed to support the upper empty pallet stack.

8. The strain gauge chip sorting system as described in claim 2, characterized in that, The full-load pallet stacking assembly includes a full-load pallet rack and a full-load pallet baffle disposed at its bottom. The full-load pallet baffle is a one-way baffle that can be flipped upwards and is configured to allow the transfer assembly to lift the full-load pallet from below into the full-load pallet rack and prevent it from falling.

9. The strain gauge chip sorting system as described in claim 2, characterized in that, The transfer assembly includes a horizontally movable mounting plate, a lifting cylinder mounted on the mounting plate, and a lifting plate connected to the drive end of the lifting cylinder. The lifting plate is provided with a plurality of lifting rods for lifting the carrier plate.

10. A sorting method, applied to the strain gauge chip sorting system as described in any one of claims 1-9, characterized in that, Includes the following steps: S1: Obtain the detection results and location information of the strain gauge chip to be sorted; S2: Control the unloading module so that its transfer component moves an empty pallet from the empty pallet stacking component to the unloading position; S3: Control the sorting moving mechanism to drive the sorting suction cup module and the vision re-inspection module to move, and use the vision re-inspection module to accurately locate the target chip based on the position information; S4: Based on the precise positioning results, control the sorting suction cup module to pick up the target chip; S5: Control the sorting and moving mechanism to transfer the picked-up chips and place them at the designated position of the empty tray at the unloading position; S6: Repeat steps S3 to S5 until the tray at the unloading position becomes a full tray. S7: Control the unloading module so that its transfer component moves the full-loaded tray from the unloading module to the full-loaded tray stacking component for stacking and storage.

Images