Material testing system configured to use structural component strain for load measurement

Abstract

A disclosed example material testing system includes a crosshead configured to be actuated to transmit a test force to a test specimen during a material test, a beam configured to hold an end of the test specimen opposite the crosshead, an actuator configured to actuate the crosshead and apply the test force to the test specimen, a sensor configured to measure deflection of at least one of the crosshead or the beam, and control circuitry configured to determine the force applied by the crosshead to the test specimen based on the measured deflection.

Description

[0001] Related applications This application claims the benefit of U.S. Patent Application No. 63 / 729,030, filed December 6, 2024, entitled “Material Testing Systems Configurated for Load Measurement Using Structural Component Strain”. The entire contents of U.S. Patent Application No. 63 / 729,030 are expressly incorporated herein by reference. Technical Field

[0002] This disclosure generally relates to materials testing systems and more specifically to materials testing systems configured to perform load measurements using the strain of structural components. Background Technology

[0003] Material testing machines are used to test the properties (e.g., tensile / compressive strength) of various material samples. The specific testing method (i.e., the test procedure) can vary depending on the material sample. Test files can be used to store data related to the test procedure. This test data is measured using one or more load sensors arranged in a load band containing the sample, such as the load applied to the test sample.

[0004] By comparing such systems with the contents of this disclosure as illustrated in the remainder of this application in conjunction with the accompanying drawings, those skilled in the art will clearly recognize the limitations and drawbacks of conventional and conventional methods. Summary of the Invention

[0005] This disclosure relates to a material testing system configured to perform load measurements using the strain of structural components, substantially as shown in at least one of the accompanying drawings and / or as described in conjunction with at least one of the accompanying drawings and set forth more fully in the claims.

[0006] These and other advantages, aspects, and novel features of this disclosure, along with their illustrated examples, will become more fully understood from the following description and accompanying drawings. Attached Figure Description

[0007] Figure 1 An exemplary material testing system according to some aspects of this disclosure is shown.

[0008] Figure 2 This disclosure illustrates some aspects of the present disclosure. Figure 1 A block diagram of an example material testing system.

[0009] Figure 3 Show connection to Figure 1 and Figure 2An exemplary implementation of a strain sensor for the bottom beam of a material testing system.

[0010] Figure 4 Show integration into Figure 1 and Figure 2 An exemplary implementation of a strain sensor for the bottom beam of a material testing system.

[0011] Figure 5A and 5B Shows connectable to Figure 1 and Figure 2 An exemplary strain sensor for the bottom beam or transverse headframe, used to achieve Figure 3 Strain sensor.

[0012] Figure 6 The connection between the lead screw and Figure 1 and Figure 2 An exemplary implementation of strain sensors between the transverse headframes.

[0013] Figure 7 Showing what can be implemented Figure 6 An exemplary strain sensor is used to measure the force applied to the test sample by the transverse headstock.

[0014] Figure 8 The connection at the guide post and Figure 1 and Figure 2 An exemplary implementation of strain sensors between the transverse headframes.

[0015] Figure 9 Is it using a connection to or built into Figure 1 and Figure 2 A flowchart illustrating an exemplary method for performing material testing using strain sensors in the transverse headstock or bottom beam of a material testing system, or in the lead screw or guide column of a material testing system.

[0016] The accompanying drawings are not necessarily drawn to scale. Where appropriate, the same or similar reference numerals are used in the drawings to indicate similar or identical elements. For example, reference numerals using letters (e.g., clip 124a, clip 124b) indicate instances of the same reference numeral (e.g., clip 124) that do not have that letter. Detailed Implementation

[0017] A universal materials testing system refers to a system capable of performing a variety of mechanical tests on a sample. Exemplary tests include tensile and / or compressive strength tests, torsion tests, shear tests, bending tests, tear tests, peel tests, friction tests, puncture tests, and / or tests involving other mechanical characteristics. A universal materials testing system places the sample in a “load band,” which typically includes the sample and a fixture that holds the sample in place during testing. Traditional materials testing systems measure the load applied to the sample by connecting the load band to an actuator via a load sensor, and provide the measurement signal from the load sensor to a monitoring system to calculate the test result. While load sensors are accurate and efficient for measuring the load on the sample, introducing load sensors into the load band requires the load sensor to be sized for the expected load, may be susceptible to breakage due to the exposed location of the load sensor, and reduces the sample height allowed for a given universal testing system.

[0018] The disclosed exemplary material testing systems eliminate the need for load sensors on the load band by measuring the load on a test sample using strain, deflection, and / or force in structural elements of the material testing system. Some disclosed examples involve attaching strain sensors to the surface of a transverse headstock or bottom beam supporting the load band, and measuring strain or deflection on the transverse headstock or bottom beam. In some disclosed examples, strain sensors may be integrated into structural elements (e.g., bottom beams, transverse headstocks) rather than being attached to or mounted to them. In still other disclosed examples, strain, deflection, or force on vertical elements such as lead screws, guide columns, or other support elements is measured to measure the force on the load band.

[0019] By measuring the load on the load band using strain or flexure on the transverse headstock and / or bottom beam and / or force on the lead screw and / or guide post, the disclosed examples may allow for a reduction in the number of parts required for a material testing system, a reduction or elimination of the risk of damage to load sensors that may require costly replacement, and / or an increase in the height range of samples that can be tested in a given material testing system.

[0020] According to some aspects of this disclosure, an example material testing system includes: a transverse headframe configured to be actuated during material testing to transfer a test force to a test specimen; a beam configured to hold one end of the test specimen opposite to the transverse headframe; an actuator configured to actuate the transverse headframe and apply a test force to the test specimen; a sensor configured to measure the deflection of at least one of the transverse headframe or the beam; and a control circuit system configured to determine the force applied to the test specimen by the transverse headframe based on the measured deflection.

[0021] In some exemplary material testing systems, sensors are mounted to a transverse headstock to measure deflection within the headstock. In some exemplary material testing systems, sensors are mounted to a lateral surface of the transverse headstock. In some exemplary material testing systems, sensors are integrated into the transverse headstock to measure its deflection.

[0022] In some exemplary material testing systems, sensors are mounted to a beam to measure its deflection. In some exemplary material testing systems, the beam is fixed and a transverse headstock moves relative to the beam. In some exemplary material testing systems, sensors are configured to measure the shear deflection of the transverse headstock or the beam. In some exemplary material testing systems, sensors are integrated into the beam to measure its deflection.

[0023] In some exemplary materials testing systems, sensors are attached to a transverse headframe or beam in a manner aligned with the direction of deflection on the headframe or beam when a force is applied to the test specimen. In some exemplary materials testing systems, a control circuitry is configured to monitor the force applied to the specimen based on measured deflection and displacement of the transverse headframe when a force is applied to the specimen.

[0024] In some exemplary material testing systems, the sensor includes at least one of a bending strain sensor, a capacitive strain sensor, a coded strain sensor, or an optical strain sensor. In some exemplary material testing systems, the actuator is configured to apply a test force to the test sample by actuating a transverse headframe. In some exemplary material testing systems, the actuator is supported by at least one of a transverse headframe or a beam and is configured to apply a test force to the test sample while the transverse headframe or beam provides a counterforce.

[0025] According to some aspects of this disclosure, an exemplary material testing system includes: a transverse headstock configured to be actuated during material testing to transmit a test force to a test sample; a lead screw coupled to the transverse headstock to drive the transverse headstock; an actuator configured to actuate the lead screw and apply a test force to the transverse headstock; a load sensor coupled between the lead screw and the transverse headstock and configured to measure the force applied by the lead screw to the transverse headstock; and a control circuit system configured to determine the force applied by the transverse headstock to the test sample based on the measured force.

[0026] In some exemplary material testing systems, the load sensor includes a donut-shaped load sensor having a through-hole through which a lead screw extends. In some exemplary material testing systems, the load sensor includes a first surface configured to be coupled to a transverse headstock and a second surface configured to be coupled to a lead screw. In some exemplary material testing systems, the first surface includes a top surface of the load sensor. In some exemplary material testing systems, the first surface includes an outer peripheral surface of the load sensor. In some exemplary material testing systems, the second surface includes a bottom surface of the load sensor coupled to a nut driven by the lead screw. In some exemplary material testing systems, the second surface includes an inner peripheral surface coupled to the lead screw via a bearing.

[0027] Some exemplary material testing systems further include: a second lead screw coupled to and configured to drive a transverse headstock; and a second load sensor coupled between the second lead screw and the transverse headstock and configured to measure a second force applied to the transverse headstock by the second lead screw, wherein a control circuitry is configured to determine a force applied to the test sample by the transverse headstock based on the measured second force. In some exemplary material testing systems, the load sensor includes a slip ring configured to transmit a measurement signal from the load sensor to the control circuitry.

[0028] According to some aspects of this disclosure, an exemplary material testing system includes: a transverse headframe; a guide post coupled to the transverse headframe for selectively supporting the transverse headframe; an actuator coupled to the transverse headframe and configured to apply a test force to a load band; a load sensor coupled between the guide post and the transverse headframe and configured to measure the force applied by the transverse headframe to the guide post; and control circuitry configured to determine the force applied by the actuator to the test sample based on the measured force.

[0029] Figure 1 An exemplary materials testing system 100 is shown. As illustrated, the materials testing system 100 includes a materials testing machine 102 (also called a universal testing machine) and a computing system 200 connected to the materials testing machine 102 via a cable 106. Although the diagram shows a physical connection, in some examples, the connection may be wireless rather than wired.

[0030] exist Figure 1 In some examples, the material testing machine 102 includes a frame 112. In some examples, the frame 112 provides rigid structural support for other components of the material testing machine 102. As shown, the frame 112 includes a top plate 114 and a bottom beam 116 connected by two columns 118. In some examples, the columns 118 of the frame 112 may accommodate guide rails and / or drive shafts 212 of the material testing machine 102 (see, for example, [link to relevant documentation]). Figure 2For example, post 118 may include two lead screws without guide rails, have one guide rail or more guide rails, or post 118 may include one lead screw and one or more guide rails.

[0031] exist Figure 1 In some examples, the movable lateral headstock 120 extends between the columns 118. In some examples, the movable lateral headstock 120 may be connected to a guide rail and / or a drive shaft 212 housed within the columns 118, and / or configured to move toward and / or away from the bottom beam 116 via (mechanical) actuation of the drive shaft 212. Although Figure 1 The example shows a movable transverse headstock 120, but in some examples, the material testing machine 102 may have multiple movable transverse headstocks 120 and / or other movable components.

[0032] exist Figure 1 In the example, fastener 122 is attached to the bottom beam 116 of the frame 112 and to the movable transverse headstock 120. As shown, the lower fastener 122a includes a clamp 124a, while the upper fastener 122b includes both the test sensor 126 and the clamp 124b. Although Figure 1 The example shows one test sensor 126 and two clamps 124, but in some examples, the material testing machine 102 may include more or fewer test sensors 126 and / or clamps 124.

[0033] exist Figure 1 In the example, clamp 124 holds test sample 128. Although illustrated as (e.g., steel) rope / wire, in some examples, test sample 128 may be some other type of material and / or component. Although illustrated as a rope retainer, in some examples, clamp 124a and / or clamp 124b may alternatively or additionally be configured as a bolt retainer, wedge clamp, lateral action clamp, manual clamp, roller clamp, winch clamp, and / or syringe retainer. In some examples, one or both of clamp 124 may be replaced by a compression plate configured to compress test sample 128.

[0034] exist Figure 1 In one example, test sensor 126 is connected to clamp 124 so that test sensor 126 can measure the force acting on clamp 124 (and / or sample 128, transverse headstock 120, etc.). In some examples, test sensor 126 may be a load sensor. In some examples, test sensor 126 may be some other type of sensor.

[0035] In some examples, the material testing machine 102 may be configured for static mechanical testing. For example, the material testing machine 102 may be configured for compressive strength testing, tensile strength testing, shear strength testing, flexural strength testing, deflection strength testing, tear strength testing, peel strength testing (e.g., the strength of an adhesive), torsional strength testing, and / or any other compression and / or tensile testing. As an additional or alternative, the material testing machine 102 may be configured to perform dynamic testing.

[0036] In some examples, the material testing machine 102 is configured to interface with the computing system 200 to execute test methods. For example, the computing system 200 may interface with the controller 214 of the material testing machine 102 (see, for example, [link to relevant documentation]). Figure 2 ) Communicate to execute test methods.

[0037] Figure 2 This is a block diagram showing details of the computing system 200 and additional details of the material testing machine 102. Figure 2 In some examples, the exemplary material testing machine 102 includes one or more actuators 210 connected to one or more drive shafts 212. In some examples, the actuator 210 may be used to provide force to the drive shaft 212 and / or induce movement of the drive shaft 212. In some examples, the actuator 210 may include an electric motor, a pneumatic actuator, a hydraulic actuator, a piezoelectric actuator, a relay, and / or a switch.

[0038] The drive shaft 212 is further illustrated as being connected to the movable lateral headrest 120, such that movement of the drive shaft 212 via the actuator 210 will cause movement of the movable lateral headrest 120. Although in Figure 2 In the example, it is referred to as drive shaft 212, but in some examples, drive shaft 212 may be some other mechanical device that moves the movable lateral headstock 120 by means of actuator 210.

[0039] The exemplary material testing machine 102 further includes a controller 214 in electrical communication with the actuator 210. In some examples, the controller 214 may include a processing circuitry and / or a memory circuitry. In some examples, the controller 214 may be configured to control the material testing machine 102 based on one or more commands, control inputs, and / or test parameters. In some examples, the controller 214 may be configured to convert commands, control inputs, and / or test parameters (e.g., received from the computing system 200) into appropriate (e.g., electrical) signals that can be transmitted to the actuator 210, thereby controlling the operation of the material testing machine 102 (e.g., via the actuator 210). For example, the controller 214 may provide one or more signals that command more or less electrical power to be supplied to the actuator 210, thereby increasing or decreasing the applied force.

[0040] exist Figure 2 In some examples, controller 214 is further in electrical communication with fastener 122 (e.g., clamp 124 and test sensor 126). In some examples, controller 214 may be configured to convert commands, control inputs, and / or test parameters (e.g., received from computing system 200) into appropriate (e.g., electrical) signals that can be transmitted to clamp 124 to control the (e.g., clamping or releasing) operation of clamp 124. In some examples, controller 214 may be configured to convert commands, control inputs, and / or parameters (e.g., received from computing system 200) into appropriate (e.g., electrical) signals that can be transmitted to sensor 126 to control the operation of sensor 126. In some examples, controller 214 may be configured to convert measurement data received from sensor 126 and / or transmit the measurement data to computing system 200.

[0041] The exemplary controller 214 is further in electrical communication with the control panel 216 of the material testing machine 102. In some examples, the control panel 216 may include one or more input devices (e.g., buttons, switches, sliders, knobs, microphones, dials, and / or other electromechanical input devices). In some examples, the control panel 216 may be used by an operator to directly control the material testing machine 102. In some examples, the controller 214 may be configured to convert commands, control inputs, and / or test parameters received via the control panel 216 into appropriate (e.g., electrical) signals that are transmitted to the actuator 210 and / or clamp 124 to control the material testing machine 102.

[0042] The controller 214 is also illustrated to be in electrical communication with a network interface 218b of the material testing machine 102. In some examples, the network interface 218b includes hardware, firmware, and / or software to connect the material testing machine 102 to a complementary workstation network interface 218a of the computing system 200. In some examples, the controller 214 may receive information (e.g., commands) from the computing system 200 via the network interface 218, and / or transmit information (e.g., measurement data from sensors) to the computing system 200 via the workstation network interface 218.

[0043] exist Figure 2 In the example, computing system 200 includes test workstations 202 and user interface (UI) 204 interconnected with each other. As shown, UI 204 may include one or more input devices 206 configured to receive input from a user and one or more output devices 208 configured to provide output to a user.

[0044] In some examples, one or more input devices 206 may include one or more touchscreens, mice, keyboards, buttons, switches, sliders, knobs, microphones, dials, and / or other input devices 206. In some examples, one or more output devices 208 may include one or more displays / touchscreens, speakers, lights, haptic devices, and / or other output devices 208. In some examples, the output device 208 of UI 204 (e.g., a display screen) may output one or more diagrams of the material testing process 250, which are configured to allow users to set and / or execute test methods, and / or analyze the test results of the test methods. In some examples, the input device 206 of UI 204 may receive input from the user and transmit input data representing the user input to the test workstation 202.

[0045] exist Figure 2 In the example, exemplary test workstation 202 includes a workstation network interface 218a. As shown, a workstation network interface 218a communicates with a network interface 218b of the material testing machine 102 via cable 106. As shown, test workstation 202 further includes the workstation network interface 218a communicating with a network 220 (e.g., the Internet). Figure 2 In this example, test workstation 202 communicates with remote interface 230 via network 220 and workstation network interface 218a. In some examples, test workstation 202 may communicate with one or more other test systems, servers, and / or other devices via network and / or workstation network interface 218a. As shown, workstation network interface 218a is electrically connected to the common electrical bus 222 of test workstation 202.

[0046] In some examples, the test workstation can be a computing device. Figure 2 In some examples, test workstation 202 includes workstation processing circuitry 224 connected to a common electrical bus 222. In some examples, workstation processing circuitry 224 may include one or more processors. In some examples, workstation processing circuitry 224 is configured to process information received from UI 204, data import device 108, and / or material testing machine 102.

[0047] In some examples, workstation processing circuitry 224 is configured to (e.g., via network interface 218a) send commands and / or test parameters to material testing machine 102. In some examples, workstation processing circuitry 224 is configured to output information to the operator via UI 204. In some examples, workstation processing circuitry 224 is configured to execute machine-readable instructions stored in workstation memory circuitry 226.

[0048] exist Figure 2In one example, test workstation 202 further includes a workstation memory circuitry 226 connected to a common electrical bus 222. As shown, workstation memory circuitry 226 includes a material testing process 250. In some examples, material testing process 250 includes machine-readable instructions. In some examples, workstation processing circuitry 224 is configured to execute the machine-readable instructions of material testing process 250 to communicate with material testing machine 102 (e.g., its controller 214) to perform tests on test sample 128.

[0049] In some examples, the test sample 128 is tested (and / or its test results are analyzed) according to a specific test method. In some examples, the test method is defined by parameters in a test file. The test file may include a (stored) dataset representing one or more parameters (e.g., test parameters, specimen / sample parameters, analysis parameters, etc.) that define at least a portion of the test method. For example, test parameters may include the date the test will take place, test identification information (e.g., serial number, name, type, description, etc.), the target start / end position of clamp 124, the target start / end position of transverse headstock 120, the target distance / direction of movement of transverse headstock 120, the target speed of movement of transverse headstock 120, the expected results of the test (e.g., location / type of fracture, distance moved before fracture, force applied before fracture, post-test characteristics of the sample, etc.), the time when sensor 126 should measure test values, and / or other parameters related to the specific test method. Sample parameters may include the date of manufacture / shipment / packaging of sample 128, identification information of sample 128 (e.g., number, name, description, etc.), pre-test characteristics of sample 128 (e.g., measured values / dimensions, material type, weight, color, shape, modulus, ultimate tensile strength, etc.), and / or other information related to a specific sample 128. Analysis parameters may include one or more algorithms that can be used to evaluate the results of the test method (and / or generate additional test results), one or more test result reporting formats, and / or one or more thresholds and / or threshold ranges (e.g., used to determine whether sample 128 passes or fails the test).

[0050] Figure 3 Show connection to Figure 1 and Figure 2 An exemplary embodiment of the strain sensor 300 of the bottom beam 116 of the material testing system 100. Figure 3An exemplary strain sensor 300 is mounted or attached to the bottom beam 116 to measure the strain and / or deflection of the bottom beam 116. The exemplary bottom beam 116 is subjected to strain due to the application of forces during material testing. The strain causes deflection of the bottom beam 116, which can be measured by the strain sensor 300. In the disclosed example, deflection and strain measurements are captured at least partially along the length of the bottom beam 116 or the transverse headstock 120, rather than simply along the load band as is done in material testing systems using conventional load sensors.

[0051] like Figure 3 As shown, strain sensor 300 is mounted to a lateral surface of bottom beam 116. For example, strain sensor 300 may be aligned with the direction of maximum deflection experienced by bottom beam 116 to improve the accuracy and / or precision of strain measurement. In other examples, strain sensor 300 is mounted in other orientations relative to bottom beam 116 and / or on other surfaces of bottom beam 116.

[0052] An exemplary strain sensor 300 is mounted to the bottom beam 116 using a nut post 306, which is also mounted to the nut post 306 using screws 304 or other fasteners. However, other mounting methods may be used.

[0053] The processing circuitry 224 receives strain or deflection measurements from the strain sensor 300 and calculates the load on the test sample 128 based on these measurements. To improve the accuracy of load measurement, the strain sensor 300 can be calibrated after installation. For example, after the strain sensor 300 is installed on the bottom beam 116, one or more loads are applied to the load band while the load is measured using the load sensor. The load measured by the load sensor and the deflection measurements measured by the strain sensor 300 are provided to the processing circuitry 224, which calculates the relationship between the measured deflection and the load present in the load band.

[0054] Figure 4 It shows integration in Figure 1 and Figure 2 An exemplary embodiment of the strain sensor 400 in the bottom beam 116 of the material testing system 100. Figure 4 The exemplary strain sensor 400 may be similar to Figure 3The strain sensor 300, except that the body 402 of the strain sensor 400 is configured to be integrated into the body of the bottom beam 116 (i.e., without the aid of fasteners). For example, the body of the strain sensor 400 may be directly coupled to the structure of the bottom beam 116 so that the deflection of the bottom beam 116 can be directly measured by the strain sensor 400. In some examples, the structure of the bottom beam 116 includes a surface to which a load sensor may be attached to directly measure the strain or deflection on the bottom beam 116.

[0055] Although Figure 3 and Figure 4 The example shows the strain sensor 300 mounted to or integrated within the bottom beam 116, but in other examples, the strain sensor 300 may be... Figure 3 or Figure 4 The strain sensor 400 is mounted to or integrated within the transverse headstock 120 in a similar manner to the bottom beam 116 shown in the diagram. For example, a strain sensor 300 may be mounted on the lateral surface of the transverse headstock 120 in a position and orientation most closely aligned with the direction of maximum deflection of the transverse headstock 120 during the application of force. A strain sensor 400 may be integrated into the structure of the transverse headstock 120 to directly measure deflection in the transverse headstock 120.

[0056] Exemplary sensors that can be used to implement strain sensors 300, 400 include bending strain sensors, capacitive strain sensors, encoder-type strain sensors, optical strain sensors, and / or any other type of strain sensor. Depending on the type of sensor, strain sensors 300, 400 may be oriented differently relative to the bottom beam 116 or the transverse headframe 120 to align sensors 300, 400 with the direction of maximum deflection of the bottom beam 116 or the transverse headframe 120.

[0057] Figure 5A An exemplary strain sensor 500 is shown, which can be coupled to... Figure 1 and Figure 2 The bottom beam 116 or the transverse head frame 120 is used to achieve Figure 3 Strain sensors 300 and 400. An exemplary strain sensor 500 is an S-type strain sensor that includes ends 502a and 502b and a central portion 504. A strain gauge 506 is coupled to the central portion 504 (e.g., coupled to a beam 508 extending across the central portion 504 located between the ends 502a and 502b) and outputs a strain signal representing tension or compression applied to a first end 502a (relative to the other end 502b), which causes deformation of the central portion 504.

[0058] Figure 5B An exemplary strain sensor 550 is shown, which can be coupled to Figure 1 and Figure 2 The bottom beam 116 or the transverse head frame 120 is used to achieve Figure 3 Strain sensors 300 and 400 are provided. An exemplary strain sensor 500 is an annular strain sensor, comprising an annular segment 552 connected between two end segments 554a and 554b. A strain sensor 556 is mounted to measure strain on the annular segment 552.

[0059] End sections 554a and 554b are connected to the bottom beam 116 or the transverse headframe 120, such that the deflection of the bottom beam 116 or the transverse headframe 120 pulls the end sections 554a and 554b apart. As the end sections 554a and 554b are pulled apart, the annular section 552 deforms, and this deformation is measured by the strain sensor 556 and converted into a strain measurement signal. The strain sensor 556 provides the strain measurement signal to the processing circuit system 224, which determines the load on the load band as described above.

[0060] In some examples, multiple strain sensors 300, 400 may be attached or mounted to the bottom beam 116 or the transverse headstock 120 with different orientations. For example, a first strain sensor 300 may be attached to the transverse headstock 120 or the bottom beam 116 aligned with the direction of maximum deflection in a tensile test, and a second strain sensor 300 may be attached to the transverse headstock 120 or the bottom beam 116 aligned with the direction of maximum deflection in a compression test. Additional strain sensors 300, 400 may be attached or mounted to the bottom beam 116 or the transverse headstock 120 for measuring deflection under other applied forces.

[0061] Figure 6 The connection between lead screws 604a and 604b is shown. Figure 1 and Figure 2 An exemplary embodiment of strain sensors 602a, 602b between the transverse headstock 120. Figure 6 In the example, strain sensors 602a and 602b are connected to lead screws 604a and 604b and support the transverse headstock 120. By driving the transverse headstock 120 using strain sensors 602a and 602b, the strain sensors 602a and 602b directly measure the force applied to the transverse headstock 120 through the lead screws 604a and 604b, and thus measure the force applied to the load band and the test sample 128.

[0062] Figure 7 Showing what can be used to implement Figure 6 Exemplary strain sensor 700 includes strain sensors 602a and 602b to measure the force applied to the test sample by a transverse headstock. Exemplary strain sensor 700 includes a donut-shaped body 702 having an inner peripheral surface 704 and an outer peripheral surface 706, an upper surface 708 and a lower surface 710.

[0063] An exemplary sensor 700 may be coupled to lead screws 604a, 604b via an inner peripheral surface 704, for example via a bearing (e.g., a ball bearing). In other examples, sensor 700 may be coupled to lead screws 604a, 604b via a lower surface 710, for example by being supported or otherwise coupled to a drive nut coupled to lead screws 604a, 604b.

[0064] The sensor 700 is further coupled to the transverse headstock 120 via an outer peripheral surface 706 and / or an upper surface 708. For example, the outer peripheral surface 706 may be coupled to an annular surface on the bottom or interior of the transverse headstock 120. In other examples, the bottom or inner surface of the transverse headstock 120 may be supported by, or otherwise coupled to, the upper surface 708 of the sensor 700.

[0065] The sensor 700 further includes one or more load sensors 712, which are coupled between (a) the inner peripheral surface 704 and / or lower surface 710 connected to the lead screws 604a, 604b and (b) the outer peripheral surface 706 and / or upper surface 708 connected to the transverse headstock 120. The load sensors 712 monitor strain and / or deflection between the transverse headstock 120 and the lead screws 604a, 604b. By introducing strain sensors 700 between the transverse headstock 120, which generates forces on the test specimen 128, and each lead screw 604a, 604b, the processing circuitry system 224 can determine the total load on the test specimen.

[0066] To transmit a signal from the load sensor 712 to the processing circuitry system 224, the exemplary sensor 700 may include a slip ring 714 that allows signal transmission as the lead screws 604a, 604b rotate relative to the sensor 700. The slip ring 714 may be located on any of the inner peripheral surface 704, the outer peripheral surface 706, the upper surface 708, and / or the lower surface 710, or a combination of these surfaces 704-710, in conjunction with corresponding contacts on the opposing surfaces of the material testing system 100 to transmit the signal to the processing circuitry system 224. In some examples, the “tracks” of the lead screws 604a, 604b may include slip rings or contacts, wherein slip rings in different tracks are electrically isolated. In some examples, the inner peripheral surface 704 of the sensor 700 includes opposing contacts or slip rings.

[0067] In some other examples, sensor 700 may include a wireless communication circuitry to transmit measurement signals or data to a communication circuitry (e.g., via communication interface 218a).

[0068] In some other examples, one or more lead screws 604 are used to move the transverse headstock 120 to the desired position, and then the transverse headstock 120 is clamped in place to allow the actuator to apply test force to the load band using the transverse headstock 120 as a fixed support beam. Figure 8 The connection at guide posts 804a, 804b and Figure 1 and Figure 2 An exemplary embodiment of strain sensors 802a, 802b between the transverse headstock 120. For example... Figure 8 As shown, the transverse headstock 120 can be clamped, locked, or otherwise secured to the guide posts 804a, 804b, or another component of the posts 118a, 118b to hold the transverse headstock 120 in the desired position.

[0069] Strain sensors 802a and 802b can be connected between the transverse headstock 120 and the uprights, columns, or other supporting structures. Strain sensors 802a and 802b can be used with... Figure 7 The strain sensor 700 is implemented in the same or similar manner, except that (if used) the inner circumferential surface 704 can be configured to be selectively clamped onto the guide posts 804a, 804b as an alternative and addition to sliding on the guide posts 804a, 804b. In other examples, the strain sensors 802a, 802b can be supported by locking clips 806a, 806b (e.g., on the lower surface 710), which can be selectively clamped onto the guide posts 804a, 804b to support the transverse headstock 120 in a desired position. In these examples, the strain sensors 802a, 802b are positioned between the locking clips 806a, 806b and the transverse headstock 120 to measure the strain applied to the guide posts 804a, 804b by the transverse headstock 120.

[0070] In order to apply force to the load band (e.g., clamps 124a, 124b or other fasteners, test sample 128). Figure 8 The example material testing system 800 includes an actuator 808 coupled to a transverse headstock 120. The actuator 808 can be positioned on either side of the transverse headstock 120, as long as the actuator 808 can apply force to the load belt relative to the transverse headstock 120 (e.g., via clamps 124a, 124b).

[0071] When actuator 808 applies force to the load band and transverse headstock 120, strain sensors 802a, 802b measure the force or load between the transverse headstock 120 and guide posts 804a, 804b and provide the measurement signal to processing circuitry 224. Example processing circuitry 224 determines the total load applied to test sample 128 by actuator 808.

[0072] In other examples, strain sensors 300, 500, and 550 may be attached to the transverse headstock 120, and / or strain sensor 400 may be integrated into the transverse headstock 120 to measure the deflection of the transverse headstock 120 when the actuator 808 applies force to the load band.

[0073] Figure 9 This is a flowchart illustrating an exemplary method 900 for performing material testing using a strain sensor, which is coupled to or built into a... Figure 1 and Figure 2 The transverse head frame 120 or bottom beam 116 of the material testing system 100, or the lead screws 604a, 604b or guide columns 804a, 804b connected to or built into the material testing system 100.

[0074] In frame 902, the operator mounts or attaches one or more strain sensors (e.g., strain sensors 300, 500, 550) to the bottom beam 116 and / or the transverse headstock 120 of the material testing system 100, and / or mounts or attaches one or more strain sensors (e.g., strain sensors 602a, 602b, 700, 802a, 802b) to the lead screws 604a, 604b and / or guide posts 804a, 804b of the material testing system 100.

[0075] In box 904, the operator attaches the load sensor to the load band and communicatively connects the load sensor to the processing circuitry 224. For example, the operator may connect the load sensor between the transverse headstock 120 and clamp 124b, or between the bottom beam 116 and clamp 124a. In other examples, the operator may connect the load sensor between clamps 124a and 124b, for example, by clamping the load sensor with clamps 124a and 124b.

[0076] After the strain sensors are installed, the material testing system 100 performs a calibration procedure to establish the relationship between the deflection of the bottom beam 116 or the transverse headstock 120 and the force on the load band.

[0077] In block 906, processing circuitry 224 controls actuators (e.g., actuators 210, 808) to apply a calibration load to the load band. The calibration load may be a predetermined target load, and processing circuitry 224 may store one or more calibration loads to be applied by actuators 210, 808. In block 908, load sensors measure the applied calibration load and output one or more measurements to processing circuitry 224. In block 910, strain sensors 300, 400, 500, 602a, 602b, 700, 802a, 802b also measure strain or deflection on the transverse headstock 120, bottom beam 116, lead screws 604a, 604b, or guide posts 804a, 804b, and output strain measurements to processing circuitry 224. The processing circuitry 224 can receive measurements from the load sensor and strain measurements substantially simultaneously, and / or timestamped measurements from the load sensor and strain measurements, which allow the processing circuitry 224 to correlate the measurements. In other examples, a calibration load is applied for a predetermined duration to allow the load sensor and strain sensors 300, 400, 500, 602a, 602b, 700, 802a, 802b to establish corresponding measurements for comparison.

[0078] In box 912, processing circuitry 224 determines whether to apply an additional calibration load. For example, processing circuitry 224 may store a set of calibration loads within the desired measurement range of the materials testing system 100. In some examples, the calibration load may be higher and / or lower than the desired measurement range. If an additional calibration load is to be applied (box 912), processing circuitry 224 selects the next calibration load in box 914, and control returns to box 906 to apply the next calibration load.

[0079] When no additional calibration load is applied (box 912), in box 916, the processing circuitry 224 determines a relationship based on the strain measurements and the measured calibration load. For example, the processing circuitry 224 may perform recursive or other curve fitting based on the strain measurements corresponding to the calibration load measured by the load sensor. The processing circuitry 224 may store this relationship as an algorithm, a lookup table, and / or using any other format or data storage. In box 918, the operator removes the load sensor from the load strip.

[0080] In block 920, processing circuitry 224 determines whether to perform a material test. For example, processing circuitry 224 may receive a command from an operator to begin a material test (e.g., tensile test, compression test, etc.). The command may be received along with test inputs and / or test parameters that affect the material test. If a material test is to be performed (block 920), then in block 922, processing circuitry 224 controls actuators 210, 808 to apply a test load to a load band. For example, actuators 210, 808 may drive lead screws 604a, 604b to apply force to the test sample 128 connected between the transverse headstock 120 and the bottom beam 116.

[0081] In block 924, processing circuitry 224 measures strain or deflection on the transverse headstock 120 or bottom beam 116, or measures the force between the transverse headstock 120 and lead screws 604a, 604b or guide posts 804a, 804b, and outputs the strain measurement to processing circuitry 224. In block 926, based on the measured strain, deflection, or force, and based on the established relationships, processing circuitry 224 determines the load profile for the material test. For example, processing circuitry 224 may convert a set of strain, deflection, or force measurements (or their curves) into a corresponding set of force measurements (or their curves) representing the material test, and / or the force measurements may be equivalent to measurements output by load sensors disposed in the load band.

[0082] In block 928, processing circuitry 224 outputs material test results. For example, processing circuitry 224 may display a graph of test forces via user interface 204 (e.g., via a display), store material test results in storage circuitry 226, and / or transmit material test results to one or more external devices via communication interface 218a. After outputting material test results (block 928), or if a material test is not performed at a specific time (block 920), control returns to block 920 to determine whether to perform a material test (or another material test).

[0083] This method and / or system can be implemented in hardware, software, or a combination of hardware and software. This method and / or system can be implemented centrally in at least one computing system or distributed, where different elements are distributed across several interconnected computing systems or cloud systems. Any type of computing system or other device suitable for performing the methods described herein is appropriate. A typical hardware and software combination may be a general-purpose computing system having a program or other code that, when loaded and executed, controls the computing system to perform the methods described herein. Another typical implementation may include an application-specific integrated circuit (ASIC) or chip. Some implementations may also include a non-volatile machine-readable (e.g., computer-readable) medium (e.g., a flash drive, optical disc, magnetic disk, etc.) storing one or more lines of machine-executable code that enables the machine to perform the processes described herein.

[0084] As used herein, "and / or" means any one or more items in a list connected by "and / or". For example, "x and / or y" means any element in the three-element set {(x), (y), (x, y)}. In other words, "x and / or y" means "one or both of x and y". Similarly, "x, y and / or z" means any element in the seven-element set {(x), (y), (z), (x, y), (x, z), (y, z), (x, y, z)}. In other words, "x, y and / or z" means "one or more of x, y, and z".

[0085] As used herein, the terms “for example” and “for instance” are used to give one or more non-restrictive examples, instances, or illustrations.

[0086] As used herein, the terms “connection,” “connected to,” and “connected to” each refer to a structural and / or electrical connection, whether it be attachment, affixation, joining, bonding, fastening, linking, and / or other form of fixation. As used herein, the term “attachment” means attachment, affixation, joining, bonding, fastening, linking, and / or other form of fixation. As used herein, the term “connection” means attachment, affixation, joining, bonding, fastening, linking, and / or other form of fixation.

[0087] As used herein, the terms “circuit” and “circuit system” refer to physical electronic components (i.e., hardware) and any software and / or firmware (“code”) that may be used to configure, be executed by, and / or otherwise associate with that hardware. As used herein, a particular processor and memory may constitute a first “circuit” when executing a first line or more of code, and a second “circuit” when executing a second line or more of code. As used herein, a circuit system is “operable” and / or “configured” to perform a function when it contains the necessary hardware and / or code (if required) required to perform that function, regardless of whether the performance of that function is disabled or enabled (e.g., through user-configurable settings, factory settings, etc.).

[0088] As used herein, control circuitry may include digital and / or analog circuitry systems, discrete and / or integrated circuit systems, microprocessors, DSPs, etc., software, hardware, and / or firmware; they may be located on one or more circuit boards and constitute part or all of the controller, and / or be used to control the material testing process, and / or control the material testing system (e.g., a universal material testing system).

[0089] As used herein, the term "processor" refers to a processing device, apparatus, program, circuit, component, system, or subsystem, whether implemented in hardware, physically manifested in software, or both, and whether or not it is programmable. The term "processor" as used herein includes, but is not limited to: one or more computing devices, hardwired circuitry, signal modification devices and systems, devices and machines for controlling systems, central processing units, programmable devices and systems, field-programmable gate arrays, application-specific integrated circuits (ASICs), systems-on-a-chip (SoCs), systems containing discrete components and / or circuitry, state machines, virtual machines, data processors, processing facilities, and any combination thereof. For example, the processor can be any type of general-purpose microprocessor or microcontroller, digital signal processing (DSP) processor, application-specific integrated circuit (ASIC), graphics processing unit (GPU), reduced instruction set computer (RISC) processor with an advanced RISC (ARM) core, etc. The processor may be coupled to and / or integrated with a storage device.

[0090] As used herein, the terms “memory” and / or “storage device” refer to computer hardware or circuitry used to store information for use by a processor and / or other digital devices. The memory and / or storage device can be any suitable type of computer memory, or any other type of electronic storage medium, such as read-only memory (ROM), random access memory (RAM), cache memory, optical disc read-only memory (CD-ROM), electro-optical memory, magneto-optical memory, programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), computer-readable media, etc. Memory may include, for example: non-volatile memory, non-volatile processor-readable media, non-volatile computer-readable media, non-volatile RAM (DRAM), volatile memory, ferroelectric RAM (FRAM), first-in-first-out (FIFO) memory, last-in-first-out (LIFO) memory, stack memory, non-volatile RAM (NVRAM), static RAM (SRAM), cache, buffer, semiconductor memory, magnetic memory, optical memory, flash memory, flash memory card, compact flash memory card, memory card, secure digital storage card, microcard, mini-card, expansion card, smart card, memory stick, multimedia card, picture card, flash storage, user identity module (SIM) card, hard disk drive (HDD), solid-state drive (SSD), etc. Memory may be configured to store code, instructions, applications, software, firmware, and / or data, and may be external, internal, or both external and internal relative to the processor.

[0091] Although the disclosed methods and systems have been described with reference to exemplary embodiments, those skilled in the art will understand that various modifications can be made and equivalent solutions can be used without departing from the scope of the methods and / or systems. Furthermore, many modifications can be made to adapt specific situations or materials to the teachings of this disclosure without departing from its scope. Therefore, the methods and systems of this disclosure are not intended to be limited to the specific embodiments disclosed, but rather will cover all embodiments falling within the scope of the appended claims.

Claims

1. A material testing system, comprising: A transverse headstock, configured to be actuated during material testing to transfer test forces to the test sample; A beam, configured to hold the test sample at one end opposite the transverse headframe; An actuator configured to actuate the lateral headstock and apply a test force to the test sample; Sensors configured to measure the deflection of at least one of the transverse headframe or the beam; as well as A control circuit system configured to determine the force applied to the test sample by the lateral headframe based on measured deflection.

2. The material testing system of claim 1, wherein the sensor is mounted to the transverse headframe to measure the deflection in the transverse headframe.

3. The material testing system of claim 2, wherein the sensor is mounted on the lateral surface of the transverse headstock.

4. The material testing system of claim 1, wherein the sensor is integrated into the transverse headframe to measure the deflection of the transverse headframe.

5. The material testing system of claim 1, wherein the sensor is mounted to the beam to measure the deflection of the beam.

6. The material testing system of claim 5, wherein the beam is fixed and the transverse headstock moves relative to the beam.

7. The material testing system of claim 1, wherein the sensor is configured to measure the shear deflection of the transverse headframe or the beam.

8. The material testing system of claim 1, wherein the sensor is integrated into the beam to measure the deflection of the beam.

9. The material testing system of claim 1, wherein the sensor is attached to the transverse headframe or the beam in a manner aligned with the deflection direction on the transverse headframe or the beam when a force is applied to the test sample by the transverse headframe.

10. The material testing system of claim 1, wherein the control circuitry is configured to monitor the force applied to the sample based on the deflection and displacement of the transverse headframe measured when a force is applied to the sample.

11. The material testing system of claim 1, wherein the sensor comprises at least one of a bending strain sensor, a capacitive strain sensor, a coded strain sensor, or an optical strain sensor.

12. The material testing system of claim 1, wherein the actuator is configured to apply a test force to the test sample by actuating the transverse headstock.

13. The material testing system of claim 1, wherein the actuator is supported by at least one of the transverse headframe or the beam and is configured to apply the test force to the test sample while the transverse headframe or the beam provides a counterforce.

14. A material testing system, comprising: A transverse headstock, configured to be actuated during material testing to transfer test forces to the test sample; A lead screw is connected to the transverse headstock to drive the transverse headstock; An actuator configured to actuate the lead screw and apply the test force to the transverse headstock; A load sensor is connected between the lead screw and the transverse headstock and is configured to measure the force applied by the lead screw to the transverse headstock; as well as A control circuit system configured to determine the force applied to the test sample by the transverse headframe based on the measured force.

15. The material testing system of claim 14, wherein the load sensor comprises a donut-shaped load sensor having a through hole through which the lead screw extends.

16. The material testing system of claim 15, wherein the load sensor includes a first surface configured to be coupled to the transverse headstock and a second surface configured to be coupled to the lead screw.

17. The material testing system of claim 16, wherein the first surface includes the top surface of the load sensor.

18. The material testing system of claim 16, wherein the first surface includes the outer peripheral surface of the load sensor.

19. The material testing system of claim 16, wherein the second surface includes the bottom surface of the load sensor, the bottom surface being coupled to a nut driven by the lead screw.

20. The material testing system of claim 16, wherein the second surface includes an inner circumferential surface connected to the lead screw via a bearing.

21. The material testing system of claim 14, further comprising: A second lead screw is connected to the transverse headstock and configured to drive the transverse headstock; as well as A second load sensor is coupled between the second lead screw and the transverse headstock and configured to measure a second force applied by the second lead screw to the transverse headstock, wherein the control circuitry is configured to determine the force applied by the transverse headstock to the test sample based on the measured second force.

22. The material testing system of claim 14, wherein the load sensor includes a slip ring configured to transmit a measurement signal from the load sensor to the control circuit system.

23. A material testing system, comprising: Horizontal headframe; Guide posts, which are connected to the transverse headframe to selectively support the transverse headframe; An actuator, coupled to the transverse headstock and configured to apply the test force to the load band; A load sensor is coupled between the guide post and the transverse headframe and configured to measure the force applied to the guide post by the transverse headframe; as well as A control circuit system configured to determine the force applied to the test sample by the actuator based on the measured force.

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