A communication optical fiber module heat dissipation structure

Abstract

This invention provides a heat dissipation structure for a communication fiber optic module, applicable to the field of heat dissipation technology for communication equipment. The structure includes: a protective housing, with two sets of protective housings fitted onto the upper and lower sides of a circuit board; a heat sink, detachably mounted on the side of the protective housing away from the circuit board, used to guide the operating heat of the circuit board to the outside of the protective housing, including a heat sink plate and a heat conduction chamber; a first fixing component, sleeved on one end of the two sets of protective housings, used to secure the fitted state of the protective housings and connect to a switch; and a second fixing component, sleeved on the other end of the two sets of protective housings, used to secure the fitted state of the protective housings and insert fiber optic connectors. This invention achieves efficient heat dissipation, convenient maintenance, and stable operation by optimizing the heat dissipation path, designing detachable heat dissipation components, and a reliable fixing structure.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology for communication equipment, and in particular to a heat dissipation structure for a communication fiber optic module. Background Technology

[0002] With the large-scale commercialization of 5G networks and the upgrading of data center computing power, communication fiber optic modules, as core components for information transmission, need to meet the requirements of high speed, low latency, and large capacity. The internal circuit boards of fiber optic modules are highly integrated, and heat-generating components (such as chips and optoelectronic devices) generate a large amount of heat during operation. If this heat cannot be dissipated in time, it will cause the internal temperature of the module to rise, leading to problems such as signal attenuation, reduced transmission speed, and accelerated device aging. In severe cases, it may even cause the module to crash, affecting the stability of the overall communication network.

[0003] The existing heat dissipation structure of communication fiber optic modules has many shortcomings: First, the heat dissipation method is singular, mostly relying on natural heat dissipation from the outer shell or conduction through simple heat sinks, resulting in low heat dissipation efficiency and difficulty in meeting the heat dissipation requirements of high-power fiber optic modules; Second, the heat dissipation structure and the module shell are mostly integrated into one design, making disassembly and assembly inconvenient, and making it impossible to replace the heat dissipation components separately during later maintenance, resulting in high maintenance costs.

[0004] To address the aforementioned technical problems, this invention proposes a heat dissipation structure for a communication fiber optic module. Summary of the Invention

[0005] The purpose of this application is to solve the technical problems of low heat dissipation efficiency and inconvenient disassembly and assembly in existing communication fiber optic module heat dissipation structures. Compared with the prior art, this application provides a heat dissipation structure for communication fiber optic modules, including: Protective housing, two sets of protective housings are fitted onto the top and bottom sides of the circuit board; A heat sink is detachably installed on the side of the protective housing away from the circuit board, and is used to guide the operating heat of the circuit board to the outside of the protective housing, including a heat sink plate and a heat conduction chamber. Fastener 1 is fitted onto one end of the two sets of protective housings to secure the housings in their mating state and connect the switch. The second fastener is fitted onto the other end of the two sets of protective housings to secure the housings in their mating state and to connect the fiber optic connector.

[0006] Furthermore, the protective housing includes an aluminum-magnesium alloy shell plate, and the aluminum-magnesium alloy shell plate has an assembly groove for installing heat sinks on the side away from the circuit board. The assembly groove has a plurality of heat sink holes that are evenly spaced. The heat-conducting chamber is disposed inside the heat dissipation plate. The bottom of the heat dissipation plate is provided with an outer tube body corresponding to the heat dissipation holes. The outer tube body is connected to the heat-conducting chamber. The top of the heat dissipation plate is provided with several heat dissipation fins. An upper circulation chamber is also provided between adjacent heat dissipation fins. The top of the upper circulation chamber is sealed by a cover plate. An inner tube is coaxially disposed inside the outer tube body. The top end of the inner tube extends through the heat dissipation plate and communicates with the upper circulation chamber.

[0007] Furthermore, the heat sink is provided with a filling port for filling the heat-conducting chamber with thermally conductive silicone.

[0008] Furthermore, a lower circulation chamber is provided between the protective shell and the circuit board. The lower circulation chamber is provided with several cross-shaped overflow holes and connection holes that are evenly distributed at equal intervals. The thermally conductive silicone in the thermally conductive chamber passes through the outer tube and the cross-shaped overflow holes in sequence to form a covering and bonding to the heating elements on the surface of the circuit board. The bottom end of the inner tube extends through the heat dissipation hole and communicates with the cross-shaped overflow hole. The lower circulation chamber is filled with composite phase change material, and the lower circulation chamber is connected to the upper circulation chamber through the inner tube.

[0009] Furthermore, the upper circulation chamber is also filled with a sponge filler, and a spring plate is sandwiched between the cover plate and the sponge filler, the spring plate having an elastic force to compress the sponge filler.

[0010] Furthermore, the fixing component one includes a clamp one, one end of the circuit board is provided with an output PIN angle, the clamp one is provided with an extension hole corresponding to the output PIN angle, the upper and lower sides of the clamp one are also symmetrically provided with a snap-fit ​​groove one, one end of the heat sink is provided with a pressure end plate that cooperates with the clamp one, the pressure end plate is provided with an elastic snap-fit ​​one that cooperates with the snap-fit ​​groove one, the other end of the heat sink is provided with a rotating hook, and the assembly groove is provided with a hanging groove that cooperates with the rotating hook; The first sleeve is also provided with symmetrical insertion strips on both sides, and each insertion strip is provided with a limiting groove on the opposite side. The end of the insertion strip away from the first sleeve is also provided with a second buckle groove.

[0011] Furthermore, protruding mating strips and recessed mating grooves are respectively fixed on the mating surfaces of the two sets of aluminum-magnesium alloy shell plates, and the mating strips and mating grooves are adapted to each other. The two sets of aluminum-magnesium alloy shell plates have respectively fixed insertion grooves on their opposite sides to cooperate with the insertion strips. The insertion grooves are provided with limiting blocks that cooperate with the limiting grooves and elastic buckles that cooperate with the second buckle groove.

[0012] Furthermore, the circuit board is provided with several anti-mistake grooves on both sides, and the mating surface of the aluminum-magnesium alloy shell is provided with anti-mistake blocks that cooperate with the anti-mistake grooves.

[0013] Furthermore, the second fixing component includes a second clamp, and the end of the aluminum-magnesium alloy shell plate away from the first fixing component is provided with a sleeve end that cooperates with the second clamp. The sleeve end is provided with a snap-fit ​​groove three, and the second clamp is provided with an elastic snap three that cooperates with the snap-fit ​​groove three. The end of the insertion strip is also provided with an anti-outward flip end. When the second clamp is sleeved on the sleeve end, the anti-outward flip end is simultaneously sleeved inside the second clamp. The second clamp is also provided with a female connector for inserting an optical fiber head on the side away from the protective shell.

[0014] Compared to existing technologies, the advantages of this application are: This invention features a heat dissipation component with upper and lower circulation chambers, resulting in high heat dissipation efficiency and stable temperature control. Thermally conductive silicone directly adheres to the heating element for rapid heat absorption, while phase change material buffers temperature fluctuations through latent heat of phase change. The upper and lower circulation chambers, along with the heat dissipation fins, accelerate heat transfer and dissipation, thus stabilizing the internal temperature of the circuit board. This effectively avoids problems such as signal attenuation and device aging caused by high temperatures, thereby improving the stability of module operation.

[0015] Easy to install and remove, low maintenance cost: The heat sink adopts a detachable design and is fixed to the protective shell and fasteners by elastic buckles, rotating hooks, and fasteners. No tools are required for the installation and removal process. The heat sink can be replaced individually or thermal conductive silicone can be added, reducing the later maintenance cost. The mating structure of the protective shell and the snap-fit ​​connection of the fasteners also facilitate the inspection and maintenance of the circuit board inside the module. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this application; Figure 2 This is a schematic diagram of the disassembly process of this application; Figure 3 This is a schematic diagram of the exploded structure of this application; Figure 4 This is an exploded view of the top surface structure of the heat sink proposed in this application; Figure 5 This is an exploded view of the bottom surface of the heat sink component proposed in this application; Figure 6 This is a schematic diagram of the exploded structure of the protective enclosure proposed in this application; Figure 7 This is a cross-sectional structural diagram of this application; Figure 8 for Figure 7 A magnified structural diagram of part A in the middle.

[0017] Explanation of the labels in the diagram: 1. Fastener 1; 11. Hoop 1; 12. Extension hole; 13. Snap-fit ​​groove 1; 14. Connecting strip; 141. Limiting groove; 142. Snap-fit ​​groove 2; 143. Anti-outward flip end; 2. Heat dissipation components; 201. Heat conduction chamber; 202. Filling port; 21. Heat dissipation plate; 211. Rotary hook; 212. Pressure-bearing end plate; 213. Elastic buckle one; 22. Heat dissipation fins; 23. Upper circulation chamber; 24. Cover plate; 25. Spring plate; 26. Sponge filler; 27. Outer tube; 28. Inner tube; 29. ​​Lower circulation chamber; 291. Cross overflow hole; 292. Connection hole; 3. Fastener II; 31. Hoop II; 311. Elastic Clip III; 32. Plug-in Female Connector; 4. Circuit board; 41. Foolproof slot; 42. Output pin angle; 5. Protective outer shell; 501. Anti-fool block; 502. Mating strip; 503. Mating groove; 51. Aluminum-magnesium alloy shell plate; 52. Insertion groove; 521. Limiting block; 522. Elastic buckle II; 53. Assembly groove; 531. Heat dissipation hole; 532. Hanging groove; 54. Socket end; 541. Buckle groove III. Detailed Implementation

[0018] The embodiments will be described clearly and completely with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments in this application without creative effort are within the scope of protection of this application.

[0019] Example 1

[0020] This invention provides a heat dissipation structure for a communication fiber optic module. Please refer to [link / reference]. Figure 1 - Figure 8 It includes a protective outer shell 5, a heat dissipation component 2, a first fixing component 1, and a second fixing component 3; Please refer to this first. Figure 6 Two sets of protective shells 5 are fitted together on the upper and lower sides of the circuit board 4 to form a closed protective space to protect the circuit board 4 and internal components, while providing a mounting base for the heat sink 2. Please refer to this first. Figure 4 - Figure 5 The heat sink 2 is detachably installed on the side of the protective shell 5 away from the circuit board 4. Its core function is to guide the operating heat of the circuit board 4 to the outside of the protective shell 5, including the heat sink 21 and the heat conduction chamber 201, so as to realize the rapid conduction and dissipation of heat. Please refer to this first. Figure 3 The fastener 1 is fitted onto one end of the two sets of protective shells 5 and has a dual function: first, to fasten the mating state of the protective shells 5 and prevent loosening; second, to connect to the switch and realize signal transmission. Fixing component 2 3 is sleeved on the other end of the two sets of protective shells 5, and works with fixing component 1 to fix the entire protective shell 5. It is also used to insert fiber optic connectors to ensure the stability of the fiber optic connection.

[0021] More specifically, the protective shell 5 includes an aluminum-magnesium alloy shell plate 51. The aluminum-magnesium alloy material is both lightweight and has high thermal conductivity, which can quickly conduct the heat transferred by the circuit board 4. The aluminum-magnesium alloy shell plate 51 has an assembly groove 53 for installing the heat sink 2 on the side away from the circuit board 4. The assembly groove 53 is adapted to the heat sink plate 21 of the heat sink 2 to ensure the fit after installation. The assembly groove 53 has a number of equally spaced heat dissipation holes 531, which provide channels for heat conduction and heat dissipation medium circulation.

[0022] On the mating surfaces of the two sets of aluminum-magnesium alloy shell plates 51, there are respectively a raised mating strip 502 and a recessed mating groove 503. The mating strip 502 and the mating groove 503 are matched to ensure the positioning accuracy of the two sets of protective shells 5 when they are mated, and avoid poor heat dissipation contact caused by mating misalignment. On the opposite sides of the two sets of aluminum-magnesium alloy shell plates 51, there are respectively a plug groove 52 that cooperates with the plug strip 14. The plug groove 52 is provided with a limiting block 521 that cooperates with the limiting groove 141 and an elastic buckle 522 that cooperates with the second buckle groove 142. Through the engagement of the limiting block 521 with the limiting groove 141 and the buckling of the second elastic buckle 522 with the second buckle groove 142, the reliable connection between the fixing part 1 and the protective shell 5 is realized.

[0023] The aluminum-magnesium alloy shell plate 51 has a sleeve end 54 at the end away from the fixing component 1, which is matched with the clamp 31. The sleeve end 54 has a snap-fit ​​groove 541 for matching with the elastic snap-fit ​​311 of the fixing component 3. The mating surface of the aluminum-magnesium alloy shell plate 51 has a foolproof block 501 that matches the foolproof groove 41. By matching the foolproof block 501 with the foolproof groove 41, the reverse or offset of the circuit board 4 is avoided during installation, ensuring the alignment of the heat-generating element and the heat dissipation structure.

[0024] A heat-conducting chamber 201 is disposed within the heat dissipation plate 21 to store thermally conductive silicone. The thermally conductive silicone has a high thermal conductivity and can quickly absorb the heat transferred by the protective shell 5. The bottom of the heat dissipation plate 21 is provided with an outer tube 27 corresponding to the heat dissipation holes 531. The outer tube 27 is connected to the heat-conducting chamber 201 and is inserted into the heat dissipation holes 531 to realize the connection between the heat-conducting chamber 201 and the inner side of the protective shell 5. The top of the heat dissipation plate 21 is provided with several heat dissipation fins 22, which increase the contact area with air and accelerate heat dissipation. An upper circulation chamber 23 is also provided between adjacent heat dissipation fins 22. The top of the upper circulation chamber 23 is sealed by a cover plate 24 to form a closed space. An inner tube 28 is coaxially provided inside the outer tube 27. The top end of the inner tube 28 extends through the heat dissipation plate 21 and communicates with the upper circulation chamber 23, providing a channel for the heat transfer of the phase change material.

[0025] The heat sink 21 is provided with a filling port 202, which is used to fill the heat conduction chamber 201 with thermally conductive silicone. After filling, it can be sealed with a sealing plug (not shown) to prevent leakage or moisture of the thermally conductive silicone. One end of the heat sink 21 is provided with a pressure end plate 212 that cooperates with the clamp 11. The pressure end plate 212 is provided with an elastic buckle 213 that cooperates with the buckle groove 13. By the engagement of the elastic buckle 213 with the buckle groove 13, one end of the heat sink 21 is fixed to the fastener 1. The other end of the heat sink 21 is provided with a rotating hook 211. The assembly groove 53 is provided with a hooking groove 532 that cooperates with the rotating hook 211. After the rotating hook 211 is rotated, it is inserted into the hooking groove 532, thereby fixing the other end of the heat sink 21 to the protective shell 5. The double fixing structure ensures the reliability of the heat sink 2 after installation.

[0026] The upper circulation chamber 23 is also filled with a sponge filler 26. The sponge filler 26 has an adsorption and buffering function, which can adsorb a small amount of liquid medium generated during the phase change of the phase change material, and at the same time buffer the impact of vibration on the heat dissipation structure. A spring plate 25 is also sandwiched between the cover plate 24 and the sponge filler 26. The spring plate 25 has an elastic force to compress the sponge filler 26, so that the sponge filler 26 fits tightly against the inner wall of the upper circulation chamber 23, ensuring the continuity of heat transfer, and at the same time preventing the sponge filler 26 from shifting.

[0027] The fastener 1 includes a clamp 11, which is made of elastic plastic and has a certain degree of shrinkage, allowing it to be tightly fitted onto the ends of the two sets of protective shells 5. One end of the circuit board 4 is provided with an output PIN angle 42, and the clamp 11 is provided with an extension hole 12 corresponding to the output PIN angle 42. The output PIN angle 42 passes through the extension hole 12 and connects to the switch to realize signal transmission. The upper and lower sides of the clamp 11 are also symmetrically provided with snap-fit ​​grooves 13 for cooperating with the elastic snap-fit ​​213 of the heat sink 21. The two sides of the clamp 11 are also symmetrically provided with plug strips 14. Each side of the plug strip 14 is provided with a limiting groove 141. The end of the plug strip 14 away from the clamp 11 is also provided with a snap-fit ​​groove 242. The end of the plug strip 14 is also provided with an anti-overturning end 143, which can prevent the plug strip 14 from overturning under force and improve the reliability of the connection.

[0028] The fixing component 2 3 includes a clamp 2 31, which is structurally adapted to the clamp 1 11 and is fitted onto the other end of the protective shell 5. The clamp 2 31 is provided with an elastic buckle 3 311 that cooperates with the buckle groove 3 541. The connection between the fixing component 2 3 and the protective shell 5 is achieved by the buckle 3 311 engaging with the buckle groove 3 541. When the clamp 2 31 is fitted onto the fitting end 54, the anti-outward flip end 143 is simultaneously fitted into the clamp 2 31, further restricting the displacement of the insertion strip 14. The side of the clamp 2 31 away from the protective shell 5 is also provided with a female plug 32 for inserting the optical fiber head. The interface size of the female plug 32 is precisely adapted to the optical fiber head to ensure the stability of the optical fiber connection.

[0029] A lower circulation chamber 29 is provided between the protective shell 5 and the circuit board 4. The lower circulation chamber 29 is made of high-temperature resistant plastic and is fixed to the inner side of the mating surface of the aluminum-magnesium alloy shell plate 51. The lower circulation chamber 29 is provided with several equidistantly arranged cross-shaped overflow holes 291 and connecting holes 292. The cross-shaped overflow holes 291 provide a channel for the flow of thermally conductive silicone and heat transfer, and the connecting holes 292 are used to fix the lower circulation chamber 29 to the protective shell 5. The thermally conductive silicone in the thermally conductive chamber 201 passes through the outer tube 27 and the cross-shaped overflow holes 291 in sequence to form a coating and adhesion to the heating element on the surface of the circuit board 4, directly absorbing the heat generated by the heating element. The bottom end of the inner tube 28 extends through the heat dissipation hole 531 and connects with the cross overflow hole 291. The lower circulation chamber 29 is filled with phase change material. The phase change material is a paraffin-based composite phase change material with a phase change temperature of 40-60℃ and a latent heat of ≥200kJ / kg. It can undergo phase change after absorbing heat and store a large amount of heat through the latent heat of phase change to achieve temperature buffering. The lower circulation chamber 29 is connected to the upper circulation chamber 23 through the inner tube 28. The heat absorbed by the composite phase change material can be transferred to the upper circulation chamber 23 through the inner tube 28, and then conducted to the heat dissipation plate 21 and heat dissipation fins 22 through the sponge filler 26, and finally dissipated into the air.

[0030] The circuit board 4 has several anti-misalignment grooves 41 on both sides. The anti-misalignment grooves 41 cooperate with the anti-misalignment blocks 501 of the aluminum-magnesium alloy shell plate 51 to ensure the accuracy of the installation and positioning of the circuit board 4.

[0031] When the communication fiber optic module of the present invention is working, the heating elements on the surface of the circuit board 4, such as chips and optoelectronic devices, generate a large amount of heat, which radiates and diffuses into the surrounding environment. The thermally conductive silicone in the heat-conducting chamber 201 is directly wrapped and bonded to the heating element through the outer tube 27 and the cross overflow hole 291. Because the thermally conductive silicone has a high thermal conductivity, it can quickly absorb the heat generated by the heating element and prevent heat from accumulating on the surface of the heating element. The phase change material in the lower circulation chamber 29 absorbs the heat transferred by the thermally conductive silicone through the cross overflow hole 291. When the heat reaches the phase change temperature, the phase change material undergoes a phase change, transforming from a solid to a liquid state. It stores a large amount of heat through the latent heat of phase change, thus buffering the internal temperature of the module and preventing a sudden temperature rise. At the same time, when the phase change material changes from a solid to a liquid state, it is adsorbed by the sponge filler 26, thereby increasing the volume of the sponge filler 26. On the other hand, when the temperature rises, the elasticity of the spring plate 25 will decrease. Combining the above factors, after the sponge filler 26 adsorbs the liquid phase change material, it will squeeze the spring plate 25. When the temperature drops, the elasticity of the spring plate 25 recovers. At this time, the spring plate 25 squeezes the sponge filler 26, causing the adsorbed phase change material in the sponge filler 26 to flow back into the lower circulation chamber 29 until it transforms into a solid state, waiting for the next cycle. The heat absorbed by the thermally conductive silicone in the heat-conducting chamber 201 is partly transferred directly to the heat sink 21, and then conducted to the heat sink fins 22 through the heat sink 21; another part of the heat is transferred through the thermally conductive silicone to the composite phase change material in the lower circulation chamber 29. The heat stored in the composite phase change material is transferred through the inner tube 28 to the sponge filler 26 in the upper circulation chamber 23. Under the pressure of the spring plate 25, the sponge filler 26 is tightly attached to the inner wall of the upper circulation chamber 23, transferring the heat to the heat sink 21 and the heat sink fins 22. The heat dissipation fins 22 have a large air contact area, which dissipates heat to the external environment quickly through natural convection and thermal radiation, completing the entire heat dissipation cycle. When the module's operating load decreases or it stops working, the heat generated by the heating element decreases, the internal temperature of the module drops, the composite phase change material releases the stored latent heat of phase change, and changes from liquid to solid. The released heat is transferred to the outside through the above-mentioned reverse path, ensuring that the internal temperature of the module drops steadily and avoiding device damage caused by a sudden drop in temperature.

[0032] In terms of fixation and protection, the two sets of protective shells 5 achieve precise alignment through the concave-convex adaptation of the mating strip 502 and the mating groove 503. Fixing component 1 and fixing component 2 are respectively sleeved on both ends of the protective shell 5. Reliable fixation is achieved through the cooperation of the insertion strip 14 and the insertion groove 52 and the snap-fit ​​of the elastic buckle, preventing the module from loosening during insertion, removal or vibration. The cooperation of the anti-fooling block 501 and the anti-fooling groove 41 ensures that the circuit board 4 is installed and positioned accurately, avoiding misalignment of the heat-generating components and heat dissipation structure, which affects the heat dissipation effect.

[0033] The present invention utilizes a heat sink 2 with an upper circulation chamber 23 and a lower circulation chamber 29, which achieves high heat dissipation efficiency and stable temperature control. The thermally conductive silicone directly adheres to the heating element for rapid heat absorption, and the phase change material buffers temperature fluctuations through latent heat of phase change. The upper circulation chamber 23, the lower circulation chamber 29, and the heat dissipation fins 22 accelerate heat transfer and dissipation, thereby stabilizing the internal temperature of the circuit board 4 and effectively avoiding problems such as signal attenuation and device aging caused by high temperature, thus improving the stability of module operation.

[0034] Easy to install and remove, low maintenance cost: The heat sink 2 adopts a detachable design and is fixed to the protective shell 5 and the fixing part 1 by elastic buckle 213 and rotating hook 211. No tools are required for the installation and removal process. The heat sink 2 can be replaced separately or thermal conductive silicone can be added, which greatly reduces the later maintenance cost. The mating structure of the protective shell 5 and the buckle connection of the fixing part also facilitate the inspection and maintenance of the circuit board 4 inside the module.

[0035] The above description is merely the best implementation method adopted in light of current practical needs, but the scope of protection of this application is not limited thereto.

Claims

1. A heat dissipation structure for a communication fiber optic module, characterized in that, include: Protective housing (5), two sets of protective housing (5) are fitted onto the upper and lower sides of the circuit board (4); Heat sink (2), which is detachably installed on the side of the protective shell (5) away from the circuit board (4) to guide the operating heat of the circuit board (4) to the outside of the protective shell (5), including heat sink (21) and heat conduction chamber (201). The fastener (1) is fitted onto one end of the two sets of protective shells (5) to secure the protective shells (5) in their mating state and to connect the switch. The second fastener (3) is fitted onto the other end of the two sets of protective shells (5) to secure the protective shells (5) in their mating state and to insert the fiber optic connector.

2. The heat dissipation structure for a communication fiber optic module according to claim 1, characterized in that, The protective shell (5) includes an aluminum-magnesium alloy shell plate (51). The aluminum-magnesium alloy shell plate (51) has an assembly groove (53) for installing heat sink (2) on the side away from the circuit board (4). The assembly groove (53) has a plurality of heat dissipation holes (531) evenly spaced. The heat-conducting chamber (201) is located inside the heat dissipation plate (21). The bottom of the heat dissipation plate (21) is provided with an outer tube (27) corresponding to the heat dissipation holes (531). The outer tube (27) is connected to the heat-conducting chamber (201). The top of the heat dissipation plate (21) is provided with several heat dissipation fins (22). An upper circulation chamber (23) is also provided between adjacent heat dissipation fins (22). The top of the upper circulation chamber (23) is sealed by a cover plate (24). An inner tube (28) is coaxially provided inside the outer tube (27). The top end of the inner tube (28) extends through the heat dissipation plate (21) and communicates with the upper circulation chamber (23).

3. The heat dissipation structure for a communication fiber optic module according to claim 2, characterized in that, The heat sink (21) is provided with a filling port (202), which is used to fill the heat-conducting chamber (201) with thermally conductive silicone.

4. The heat dissipation structure for a communication fiber optic module according to claim 3, characterized in that, The protective shell (5) and the circuit board (4) are further provided with a lower circulation chamber (29). The lower circulation chamber (29) is provided with several cross overflow holes (291) and connecting holes (292) evenly distributed at equal intervals. The thermal conductive silicone in the heat-conducting chamber (201) passes through the outer tube (27) and the cross overflow holes (291) in sequence to form a covering and bonding to the heating element on the surface of the circuit board (4). The bottom end of the inner tube (28) extends through the heat dissipation hole (531) and communicates with the cross overflow hole (291). The lower circulation chamber (29) is filled with composite phase change material. The lower circulation chamber (29) is connected to the upper circulation chamber (23) through the inner tube (28).

5. The heat dissipation structure for a communication fiber optic module according to claim 4, characterized in that, The upper circulation chamber (23) is also filled with a sponge filler (26), and a spring plate (25) is sandwiched between the cover plate (24) and the sponge filler (26). The spring plate (25) has an elastic force to compress the sponge filler (26).

6. The heat dissipation structure for a communication fiber optic module according to claim 5, characterized in that, The fixing component (1) includes a clamp (11), one end of the circuit board (4) is provided with an output PIN angle (42), the clamp (11) is provided with an extension hole (12) corresponding to the output PIN angle (42), the upper and lower sides of the clamp (11) are also symmetrically provided with a snap-fit ​​groove (13), one end of the heat sink (21) is provided with a pressure end plate (212) that cooperates with the clamp (11), the pressure end plate (212) is provided with an elastic snap-fit ​​(213) that cooperates with the snap-fit ​​groove (13), the other end of the heat sink (21) is provided with a rotating hook (211), and the assembly groove (53) is provided with a hanging groove (532) that cooperates with the rotating hook (211). The two sides of the first sleeve (11) are also symmetrically provided with plug strips (14), and each side of the plug strip (14) is provided with a limiting groove (141), and the end of the plug strip (14) away from the first sleeve (11) is also provided with a buckle groove (142).

7. The heat dissipation structure for a communication fiber optic module according to claim 6, characterized in that, On the mating surfaces of the two sets of aluminum-magnesium alloy shell plates (51), there are respectively a protruding mating strip (502) and a recessed mating groove (503), and the mating strip (502) and the mating groove (503) are matched in a concave-convex manner. The two sets of aluminum-magnesium alloy shell plates (51) are respectively fixed with plug grooves (52) that cooperate with plug strips (14) on opposite sides. The plug grooves (52) are provided with limiting blocks (521) that cooperate with limiting grooves (141) and elastic buckles (522) that cooperate with buckle grooves (142).

8. The heat dissipation structure for a communication fiber optic module according to claim 7, characterized in that, The circuit board (4) has several anti-mistake grooves (41) on both sides, and the mating surface of the aluminum-magnesium alloy shell plate (51) has anti-mistake blocks (501) that cooperate with the anti-mistake grooves (41).

9. The heat dissipation structure for a communication fiber optic module according to claim 8, characterized in that, The second fixing member (3) includes a second clamp (31). The aluminum-magnesium alloy shell plate (51) is provided with a sleeve end (54) that cooperates with the second clamp (31) at one end away from the first fixing member (1). The sleeve end (54) is provided with a snap groove (541). The second clamp (31) is provided with an elastic snap (311) that cooperates with the snap groove (541). The end of the insertion strip (14) is also provided with an anti-outward flip end (143). When the second clamp (31) is sleeved on the sleeve end (54), the anti-outward flip end (143) is simultaneously sleeved on the second clamp (31). The second sleeve (31) is also provided with a female connector (32) for inserting optical fiber heads on the side away from the protective shell (5).

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