Exposure mask alignment control method and apparatus

Abstract

This application provides a method and apparatus for controlling the alignment of a photomask in an exposure machine. The exposure machine includes a measuring end, an exposure end, and a control end. The measuring end is used to place a wafer and includes a first sensor. The exposure end is used to expose the wafer using a photomask and includes a second sensor and a third sensor. The method includes: acquiring a first relative positional relationship between the second sensor and the photomask, a second relative positional relationship between the first sensor and the wafer, a third relative positional relationship between the third sensor and the second sensor, and a fourth relative positional relationship between the third sensor and the first sensor; obtaining a fifth relative positional relationship between the photomask and the wafer based on the first, second, third, and fourth relative positional relationships; and controlling the alignment of the photomask and the wafer based on the fifth relative positional relationship. Based on the method provided in this application, the throughput of the exposure machine can be improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a method and apparatus for controlling the alignment of photomasks in an exposure machine. Background Technology

[0002] In the semiconductor manufacturing process in the field of semiconductor technology, photolithography is an indispensable step in wafer manufacturing. The equipment required for photolithography is an exposure machine, which includes a measurement end and an exposure end. After aligning the photomask with the wafer at the exposure end, the wafer can be exposed.

[0003] Typically, it is necessary to first obtain the relative positional relationship between the sensor and the stage, and the relative positional relationship between the first sensor and the wafer, at the measurement end. Then, using the first sensor as an intermediary, the relative positional relationship between the stage and the wafer is obtained. Next, the stage is moved to the exposure end, and the relative positional relationship between the photomask and the stage is obtained first. Then, using the stage as an intermediary, the relative positional relationship between the photomask and the wafer is obtained, in order to achieve alignment between the photomask and the wafer.

[0004] However, this approach requires obtaining the relative positional relationship between the stage and the wafer at the measurement end first, and then moving the stage to the exposure end to obtain the relative positional relationship between the photomask and the wafer. The process is cumbersome, resulting in low throughput of the exposure machine. Summary of the Invention

[0005] In a first aspect, embodiments of this application provide a photomask alignment control method for an exposure machine, wherein the exposure machine includes a measuring end and an exposure end, wherein the measuring end is used to place a wafer and includes a first sensor, and the exposure end is used to expose the wafer using a photomask and includes a second sensor and a third sensor, the method comprising:

[0006] Obtain the first relative positional relationship between the second sensor and the photomask in the exposure end;

[0007] Obtain the second relative positional relationship between the first sensor and the wafer in the measurement end;

[0008] The positions of the third sensor and the second sensor in the exposure end are aligned to obtain a third relative positional relationship between the third sensor and the second sensor;

[0009] The positions of the third sensor in the exposure end and the first sensor in the measurement end are aligned to obtain a fourth relative positional relationship between the third sensor and the first sensor;

[0010] A fifth relative positional relationship between the photomask and the wafer is determined based on the first, second, third, and fourth relative positional relationships; and the photomask and the wafer are aligned based on the fifth relative positional relationship.

[0011] In one possible implementation, obtaining the first relative positional relationship between the second sensor and the photomask at the exposure end further includes:

[0012] Obtain the relative positional relationship between the second sensor and at least three first positioning points on the photomask;

[0013] Based on the relative positional relationship between the second sensor and at least three first positioning points on the photomask, the first relative positional relationship between the second sensor and the photomask is determined.

[0014] In one possible implementation, obtaining the second relative positional relationship between the first sensor and the wafer at the measuring end further includes:

[0015] The relative positional relationship between the first sensor and at least three second positioning points on the wafer is obtained, wherein the at least three second positioning points are used to characterize the contour features of the wafer;

[0016] The second relative positional relationship between the first sensor and the wafer is determined by the relative positional relationship between the first sensor and the at least three second positioning points.

[0017] In one possible implementation, determining the fifth relative positional relationship between the photomask and the wafer based on the first, second, third, and fourth relative positional relationships includes:

[0018] A sixth relative positional relationship between the photomask and the third sensor is determined based on the first and third relative positional relationships.

[0019] A seventh relative positional relationship between the photomask and the first sensor is determined based on the sixth relative positional relationship and the fourth relative positional relationship;

[0020] The fifth relative position relationship is determined based on the seventh relative position relationship and the second relative position relationship.

[0021] In one possible implementation, aligning the photomask with the wafer based on the fifth relative positional relationship further includes:

[0022] Based on the fifth relative positional relationship, the moving distance of the wafer to the exposure end is obtained;

[0023] Based on the moving distance, the wafer is moved to the exposure end so that the photomask is aligned with the wafer.

[0024] Secondly, this application provides a photomask alignment control device for an exposure machine, wherein the exposure machine includes a measuring end and an exposure end, wherein the measuring end is used to place a wafer and includes a first sensor, and the exposure end is used to expose the wafer using a photomask and includes a second sensor and a third sensor, and the control device includes:

[0025] Memory stores the instructions executed by the computer;

[0026] The processor is configured to execute computer execution instructions stored in the memory, causing the control device to perform the method described above.

[0027] Thirdly, this application provides a computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, are used to implement the method described above. Attached Figure Description

[0028] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0029] Figure 1 This is a schematic diagram of the working scene of the exposure machine;

[0030] Figure 2 This is a schematic diagram of an exposure machine working scenario according to an embodiment of this application;

[0031] Figure 3 This is a flowchart illustrating the mask alignment control method for an exposure machine according to an embodiment of this application. Figure 1 ;

[0032] Figure 4 This is a flowchart illustrating the mask alignment control method for an exposure machine according to an embodiment of this application. Figure 2 ;

[0033] Figure 5 This is a top view of an exemplary photomask provided according to an embodiment of this application;

[0034] Figure 6 This is a schematic diagram of a first positioning point provided according to an embodiment of this application;

[0035] Figure 7 This is a flowchart illustrating the mask alignment control method for an exposure machine according to an embodiment of this application. Figure 3 ;

[0036] Figure 8 This is an exemplary wafer top view provided according to an embodiment of this application;

[0037] Figure 9 This is a schematic diagram of the second positioning point provided according to an embodiment of this application;

[0038] Figure 10 This is a flowchart illustrating the mask alignment control method for an exposure machine according to an embodiment of this application. Figure 4 ;

[0039] Figure 11 This is a flowchart illustrating the mask alignment control method for an exposure machine according to an embodiment of this application. Figure 5 ;

[0040] Figure 12 This is a schematic diagram of wafer and photomask alignment according to an embodiment of this application;

[0041] Figure 13 This is a schematic diagram of the structure of the photomask alignment control device of the exposure machine provided according to an embodiment of this application.

[0042] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0043] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application.

[0044] Figure 1 This is a schematic diagram illustrating the working scenario of an exposure machine. In the semiconductor manufacturing process within the semiconductor technology field, photolithography is an indispensable step in wafer fabrication, and the equipment required for photolithography is an exposure machine. Figure 1 The exposure machine shown includes a measuring end and an exposure end. The measuring end includes a stage ①, a wafer ② and a first sensor. The exposure end includes a lens ③ and a photomask ④. The first sensor is used to align with the wafer to obtain the relative positional relationship between the sensor and the wafer.

[0045] Typically, the relative positional relationship between the first sensor and the stage, and between the first sensor and the wafer, needs to be determined at the measurement end, using the first sensor as an intermediary. Then, after moving the stage to the exposure end, the relative positional relationship between the photomask and the stage is determined, using the stage as an intermediary, to achieve alignment between the photomask and the wafer.

[0046] However, this approach requires obtaining the relative positional relationship between the stage and the wafer at the measurement end first, and then moving the stage to the exposure end to obtain the relative positional relationship between the photomask and the wafer. The process is cumbersome, resulting in low throughput of the exposure machine.

[0047] Figure 2 This is a schematic diagram of the working scenario of the exposure machine according to the embodiments of this application, such as... Figure 2 As shown, compared to conventional practices, this application embodiment adds a second and a third sensor at the exposure end. First, the first relative positional relationship between the second sensor and the photomask, the second relative positional relationship between the first sensor and the wafer, the third relative positional relationship between the third sensor and the second sensor, and the fourth relative positional relationship between the third sensor and the first sensor are obtained. Then, based on the first, second, third, and fourth relative positional relationships, a fifth relative positional relationship between the photomask and the wafer is obtained. Finally, based on the fifth relative positional relationship, the alignment of the photomask and the wafer is controlled. Based on the method provided in this application, two sensors, a second and a third, are added at the exposure end. Using a multi-intermediary reference method, the relative position between the photomask and the wafer can be obtained when the wafer is at the measurement end. When the wafer reaches the exposure end, exposure is performed directly, improving the exposure efficiency of the exposure machine and thus increasing its throughput.

[0048] The technical solution of this application and how it solves the above-mentioned technical problems will be described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will be described below with reference to the accompanying drawings.

[0049] Figure 3 This is a flowchart illustrating the mask alignment control method for an exposure machine according to an embodiment of this application. Figure 1 The exposure machine includes a measuring end and an exposure end, wherein the measuring end is used to place the wafer and includes a first sensor, and the exposure end is used to expose the wafer using a photomask and includes a second sensor and a third sensor, such as... Figure 3 As shown, the method includes steps S301-S305.

[0050] In step S301, the first relative positional relationship between the second sensor and the photomask in the exposure end is obtained.

[0051] Based on the scenario example, a point can be selected in the space where the exposure machine is located as the far point to establish a spatial coordinate system. The coordinates of the second sensor and the photomask can be obtained through the established spatial coordinate system. Then, the relative positional relationship between the two can be characterized by the relative coordinate relationship between the second sensor and the photomask.

[0052] In step S302, the second relative positional relationship between the first sensor and the wafer in the measurement end is obtained.

[0053] Similarly, by establishing a spatial coordinate system, the coordinates of the first sensor and the wafer are obtained, thereby obtaining the relative coordinate relationship between the first sensor and the wafer. The relative coordinate relationship between the first sensor and the wafer is then used to characterize the second relative positional relationship between the two.

[0054] In step S303, the position between the third sensor and the second sensor in the exposure end is aligned to obtain a third relative positional relationship between the third sensor and the second sensor.

[0055] Combined with scenario examples, Figure 2 After obtaining the first relative positional relationship between the second sensor and the photomask, the position of the second sensor can be used as a reference to adjust the position of the third sensor in the three directions of the horizontal axis, vertical axis and vertical axis based on the spatial coordinate system, so that the third sensor and the second sensor can be aligned to obtain the relative coordinate relationship between the third sensor and the second sensor, and then the third relative positional relationship between the two can be obtained based on the relative coordinate relationship between the third sensor and the second sensor.

[0056] In step S304, the positions of the third sensor in the exposure end and the first sensor in the measurement end are aligned to obtain a fourth relative positional relationship between the third sensor and the first sensor.

[0057] Combined with scenario examples, Figure 2 Similarly, the position of the first sensor can be used as a reference, and the position of the third sensor in the three directions of horizontal axis, vertical axis and vertical axis can be adjusted based on the spatial coordinate system so that the third sensor can be aligned with the first sensor to obtain the relative coordinate relationship between the third sensor and the first sensor. Then, based on the relative coordinate relationship between the third sensor and the first sensor, the fourth relative position relationship between the two can be obtained.

[0058] In step S305, a fifth relative positional relationship between the photomask and the wafer is determined based on the first relative positional relationship, the second relative positional relationship, the third relative positional relationship, and the fourth relative positional relationship; and the photomask and the wafer are aligned based on the fifth relative positional relationship.

[0059] Combined with scenario examples, Figure 2 By using the first sensor, the third sensor, and the second sensor as intermediaries, a fifth relative positional relationship between the photomask and the wafer is obtained.

[0060] Based on the fifth relative positional relationship between the photomask and the wafer, the position of the photomask can be fixed, and the wafer can be moved to a position at the exposure end that can be aligned with the photomask. This allows the wafer to be exposed directly after it arrives at the exposure end, eliminating the step of aligning the photomask and the wafer at the exposure end, thus improving the exposure efficiency of the exposure machine and increasing its production capacity.

[0061] Optional, Figure 4 This is a flowchart illustrating the mask alignment control method for an exposure machine according to an embodiment of this application. Figure 2 ,like Figure 4 As shown, step S301 further includes steps S401 and S402.

[0062] In step S401, the relative positional relationship between the second sensor and at least three first positioning points on the photomask is obtained.

[0063] Combined with scenario examples, Figure 5 This is an exemplary top view of a photomask provided according to an embodiment of this application, such as... Figure 5 As shown, the photomask includes multiple positioning points. Since three points can define a surface, any three positioning points can be selected from the multiple positioning points on the photomask as the first positioning points. The coordinates of each first positioning point and the coordinates of the second sensor can be determined through the established spatial coordinate system. The relative coordinate relationship between each first positioning point and the second sensor can be obtained through the coordinates of each first positioning point and the coordinates of the second sensor.

[0064] In step S402, based on the relative positional relationship between the second sensor and at least three first positioning points on the photomask, a first relative positional relationship between the second sensor and the photomask is determined.

[0065] The relative coordinate relationship between each first positioning point and the second sensor determines the relative coordinate relationship between the second sensor and the surface of the photomask. Based on this relative coordinate relationship, the first relative positional relationship between the two is obtained. Specifically, the second sensor emits light towards the first positioning points on the photomask, and then receives the reflected light from each location on the photomask. By analyzing the intensity of the reflected light at each location, the second sensor determines the specific location of the first positioning point. For example, the second sensor can be a photosensitive sensor, and the location with the highest intensity of reflected light received by the second sensor can be used as the specific location of the first positioning point. In this way, the specific locations of at least three first positioning points on the photomask are determined, thus obtaining the coordinates corresponding to at least three first positioning points on the photomask, and consequently, the relative positional relationship between the second sensor and each first positioning point.

[0066] Based on the method provided in this example, the purpose of obtaining the first relative positional relationship between the second sensor and the photomask is achieved.

[0067] Optionally, the number of first positioning points on the photomask is equal to or greater than three, wherein each first positioning point is randomly distributed on the photomask.

[0068] Combined with scenario examples, Figure 5 The positioning points on the photomask can be randomly distributed on the photomask, and the position of the surface can be determined by three points on the same surface. Therefore, three points can be randomly selected from the positioning points on the photomask as the first positioning points, so the position of the first positioning point is not fixed. Figure 6 As shown in the schematic diagram of the first positioning point provided in the embodiment of this application, if there are 6 positioning points on the photomask, namely positioning point A1, positioning point B1, positioning point C1, positioning point D1, positioning point E1 and positioning point F1, at least three positioning points can be arbitrarily selected as the first positioning point. For example, positioning point A1, positioning point B1 and positioning point C1 can be used as the first positioning point, or other three or more positioning points can be selected as the first positioning point. Based on the method provided in this example, the position and number of positioning points on the photomask are not limited, which can improve the flexibility of positioning point placement and the coverage of placement, and improve the accuracy of the second sensor in recognizing higher-order deformations of the photomask, thereby improving the efficiency of obtaining the first relative position between the second sensor and the photomask, and further improving the production capacity of the exposure machine.

[0069] Optional, Figure 7 This is a flowchart illustrating the mask alignment control method for an exposure machine according to an embodiment of this application. Figure 3 ,like Figure 7 As shown, step S302 further includes steps S701 and S702.

[0070] In step S701, the relative positional relationship between the first sensor and at least three second positioning points on the wafer is obtained, wherein the at least three second positioning points are used to characterize the contour features of the wafer.

[0071] Combined with scenario examples, Figure 8 This is an exemplary top view of a wafer provided according to embodiments of this application, such as... Figure 8 As shown, the wafer includes multiple positioning points. Since three points can define a surface, any three positioning points can be selected from the multiple positioning points on the wafer as second positioning points. The coordinates of each second positioning point and the coordinates of the first sensor can be determined by establishing a spatial coordinate system. The relative coordinate relationship between each second positioning point and the first sensor can be obtained by using the coordinates of each second positioning point and the coordinates of the first sensor. Figure 9 This is a schematic diagram of the second positioning point provided according to an embodiment of this application, such as... Figure 9 As shown, positioning points A2, B2, C2 and D2 are located at the edge of the wafer. Therefore, determining the second positioning point from the positioning points at the edge of the wafer can more accurately determine the wafer outline. So at least 3 of the positioning points A2, B2, C2 and D2 can be selected as the determined second positioning points.

[0072] In step S702, the second relative positional relationship between the first sensor and the wafer is determined by the relative positional relationship between the first sensor and the at least three second positioning points.

[0073] With a scenario example, a first sensor can emit light towards a second positioning point on the photomask. The first sensor then receives reflected light from each location on the wafer. By analyzing the intensity of the reflected light at each location on the wafer, the first sensor determines the specific location of the second positioning point. For example, the first sensor can be a photosensitive sensor, aligning the wafer with the position where the intensity of the reflected light received by the sensor is highest, and using this method, the specific locations of at least three second positioning points on the photomask are determined, thus obtaining the coordinates of at least three second positioning points on the photomask. This leads to the relative positional relationship between the first sensor and each second positioning point. Finally, using the principle of three points defining a plane, the second relative positional relationship between the first sensor and the plane where the wafer is located is determined.

[0074] Based on the method provided in this example, it is possible to obtain a second relative positional relationship between the first sensor and the wafer.

[0075] Optional, Figure 10 This is a flowchart illustrating the mask alignment control method for an exposure machine according to an embodiment of this application. Figure 4 ,like Figure 10As shown, step S305 further includes steps S1001-S1003.

[0076] In step S1001, a sixth relative positional relationship between the photomask and the third sensor is determined based on the first relative positional relationship and the third relative positional relationship.

[0077] Combined with scenario examples, Figure 2 The first relative position relationship is the relative coordinate relationship between the second sensor and the photomask, and the third relative position relationship is the relative coordinate relationship between the second sensor and the third sensor. Therefore, the relative coordinate relationship between the photomask and the third sensor can be obtained by using the second sensor as an intermediary, which is the sixth relative position relationship.

[0078] In step S1002, a seventh relative positional relationship between the photomask and the first sensor is determined based on the sixth relative positional relationship and the fourth relative positional relationship.

[0079] Similarly, using the scenario example, the sixth relative position relationship is the relative coordinate relationship between the photomask and the third sensor, and the fourth relative position relationship is the relative coordinate relationship between the third sensor and the first sensor. Therefore, the relative coordinate relationship between the photomask and the first sensor can be obtained by using the third sensor as an intermediary, which is the seventh relative position relationship.

[0080] In step S1003, the fifth relative position relationship is determined based on the seventh relative position relationship and the second relative position relationship.

[0081] Similarly, using the scenario example, the seventh relative position relationship is the relative coordinate relationship between the photomask and the first sensor, and the second relative position relationship is the relative coordinate relationship between the first sensor and the wafer. Therefore, the first sensor can be used as an intermediary to obtain the relative coordinate relationship between the wafer and the photomask, thus obtaining the fifth relative position relationship.

[0082] Based on the method provided in this example, it is possible to obtain the fifth relative positional relationship between the photomask and the wafer.

[0083] Optional, Figure 11 This is a flowchart illustrating the mask alignment control method for an exposure machine according to an embodiment of this application. Figure 5 ,like Figure 11 As shown, step S306 further includes steps S1101 and S1102.

[0084] In step S1101, based on the fifth relative positional relationship, the moving distance of the wafer to the exposure end is obtained.

[0085] Based on the scenario example, since the fifth relative positional relationship between the photomask and the wafer represents the relative coordinate relationship between the photomask and the wafer, the distance that the wafer needs to move when it reaches the exposure end and is aligned with the photomask can be calculated according to the relative coordinate relationship between the photomask and the wafer. Figure 12 This is a schematic diagram of wafer and photomask alignment according to an embodiment of this application, as shown below. Figure 12 As shown, the wafer can be aligned with the photomask when it is moved directly below the photomask. Therefore, the distance the wafer moves on the horizontal axis can be obtained based on the relative coordinate relationship between the photomask and the wafer.

[0086] In step S1102, based on the moving distance, the wafer is moved to the exposure end so that the photomask is aligned with the wafer.

[0087] Based on the scenario example, after obtaining the movement distance of the wafer on the horizontal axis, the control terminal of the exposure stage can directly control the wafer to move the corresponding movement distance to be directly below the photomask and aligned with the photomask.

[0088] Based on the method provided in this example, the wafer can be moved a corresponding distance and then directly aligned with the photomask. This allows the wafer to be exposed immediately upon reaching the exposure end, eliminating waiting time and improving the efficiency of wafer exposure, thereby increasing the capacity of the exposure station.

[0089] Figure 13 This is a schematic diagram of the photomask alignment control device for an exposure machine according to an embodiment of this application. The exposure machine includes a measuring end and an exposure end. The measuring end is used to place a wafer and includes a first sensor. The exposure end is used to expose the wafer using a photomask and includes a second sensor and a third sensor, such as... Figure 13 As shown, the photomask alignment control device 50 of the exposure machine includes:

[0090] Memory 502 stores computer-executed instructions; and

[0091] Processor 501 is configured to execute computer execution instructions stored in the memory, causing the control device to perform the method described above.

[0092] Optionally, the device 50 also includes a communication component 503. The processor 501, memory 502, and communication component 503 are connected via a bus 504.

[0093] In a specific implementation, at least one processor 501 executes computer execution instructions stored in memory 502, causing at least one processor 501 to perform the above-described method.

[0094] The specific implementation process of processor 501 can be found in the above method embodiments, and its implementation principle and technical effect are similar. It will not be repeated here.

[0095] The photomask alignment control method and apparatus for an exposure machine provided in this application embodiment include a measuring end, an exposure end, and a control end. The measuring end is used to place a wafer, and the exposure end includes a photomask, a first sensor, a second sensor, and a third sensor. The method is applied to the control end and includes: firstly, acquiring a first relative positional relationship between the second sensor and the photomask, a second relative positional relationship between the first sensor and the wafer, a third relative positional relationship between the third sensor and the second sensor, and a fourth relative positional relationship between the third sensor and the first sensor; then, based on the first, second, third, and fourth relative positional relationships, obtaining a fifth relative positional relationship between the photomask and the wafer; and finally, controlling the alignment of the photomask and the wafer based on the fifth relative positional relationship. Based on the method provided in this application, two sensors, a second and a third sensor, are added to the exposure end. Using a multi-intermediary reference method, the relative position between the photomask and the wafer can be obtained when the wafer is at the measuring end. When the wafer reaches the exposure end, exposure is performed directly, improving the exposure efficiency of the exposure machine and thus increasing its throughput.

[0096] In the above embodiments, it should be understood that the processor can be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), etc. The general-purpose processor can be a microprocessor or any conventional processor. The steps of the method disclosed in this invention can be directly implemented by a hardware processor, or implemented by a combination of hardware and software modules within the processor.

[0097] The memory may include random access memory (RAM) and may also include non-volatile memory (NVM), such as at least one disk storage device.

[0098] The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus, etc. Buses can be categorized as address buses, data buses, control buses, etc. For ease of illustration, the buses shown in the accompanying drawings are not limited to a single bus or a single type of bus.

[0099] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the above-described method.

[0100] This application also provides a computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, implement the above-described method.

[0101] The aforementioned readable storage medium can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk. The readable storage medium can be any available medium accessible to a general-purpose or special-purpose computer.

[0102] An exemplary readable storage medium is coupled to a processor, enabling the processor to read information from and write information to the readable storage medium. Of course, the readable storage medium can also be a component of the processor. The processor and the readable storage medium can reside in an Application Specific Integrated Circuit (ASIC). Alternatively, the processor and the readable storage medium can exist as discrete components in the device.

[0103] The division of units is merely a logical functional division; in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be indirect coupling or communication connection through some interfaces, devices, or units, and may be electrical, mechanical, or other forms.

[0104] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0105] In addition, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0106] If a function is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this invention, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0107] Those skilled in the art will understand that all or part of the steps of the above-described method embodiments can be implemented by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When executed, the program performs the steps of the above-described method embodiments; and the aforementioned storage medium includes various media capable of storing program code, such as ROM, RAM, magnetic disks, or optical disks.

[0108] Finally, it should be noted that other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. A method for controlling the alignment of a photomask in an exposure machine, characterized in that, The exposure machine includes a measuring end and an exposure end, wherein the measuring end is used to place a wafer and includes a first sensor, and the exposure end is used to expose the wafer using a photomask and includes a second sensor and a third sensor; the method includes: Obtain the first relative positional relationship between the second sensor and the photomask in the exposure end; Obtain the second relative positional relationship between the first sensor and the wafer in the measurement end; The positions of the third sensor and the second sensor in the exposure end are aligned to obtain a third relative positional relationship between the third sensor and the second sensor; The positions of the third sensor in the exposure end and the first sensor in the measurement end are aligned to obtain a fourth relative positional relationship between the third sensor and the first sensor; A fifth relative positional relationship between the photomask and the wafer is determined based on the first, second, third, and fourth relative positional relationships; and the photomask and the wafer are aligned based on the fifth relative positional relationship.

2. The method according to claim 1, characterized in that, The step of obtaining the first relative positional relationship between the second sensor and the photomask in the exposure end further includes: Obtain the relative positional relationship between the second sensor and at least three first positioning points on the photomask; Based on the relative positional relationship between the second sensor and at least three first positioning points on the photomask, the first relative positional relationship between the second sensor and the photomask is determined.

3. The method according to claim 1, characterized in that, The step of obtaining the second relative positional relationship between the first sensor and the wafer in the measurement end further includes: The relative positional relationship between the first sensor and at least three second positioning points on the wafer is obtained, wherein the at least three second positioning points are used to characterize the contour features of the wafer; The second relative positional relationship between the first sensor and the wafer is determined by the relative positional relationship between the first sensor and the at least three second positioning points.

4. The method according to claim 1, characterized in that, Determining the fifth relative positional relationship between the photomask and the wafer based on the first, second, third, and fourth relative positional relationships includes: A sixth relative positional relationship between the photomask and the third sensor is determined based on the first and third relative positional relationships. A seventh relative positional relationship between the photomask and the first sensor is determined based on the sixth relative positional relationship and the fourth relative positional relationship; The fifth relative position relationship is determined based on the seventh relative position relationship and the second relative position relationship.

5. The method according to any one of claims 1-4, characterized in that, The step of aligning the photomask with the wafer based on the fifth relative positional relationship further includes: Based on the fifth relative positional relationship, the moving distance of the wafer to the exposure end is obtained; Based on the moving distance, the wafer is moved to the exposure end so that the photomask is aligned with the wafer.

6. A photomask alignment control device for an exposure machine, characterized in that, The exposure machine includes a measuring end and an exposure end. The measuring end is used to place the wafer and includes a first sensor. The exposure end is used to expose the wafer using a photomask and includes a second sensor and a third sensor. The control device includes: a memory storing computer-executed instructions; and A processor configured to execute computer execution instructions stored in the memory, causing the control device to perform the method as described in any one of claims 1-5.

7. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions, which, when executed by a processor, are used to implement the method as described in any one of claims 1-5.

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