Methods, systems, and media for machining of precision microcellular arrays of alloy materials
By constructing a digital twin and an intelligent controller to conduct multi-dimensional performance index analysis, the problems of inter-hole interference and nonlinear material evolution were solved, thereby improving the accuracy and efficiency of micro-hole array stamping and ensuring product quality stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HEBEI WEIJIA METAL MESH CO LTD
- Filing Date
- 2026-03-05
- Publication Date
- 2026-06-09
AI Technical Summary
Existing technologies rely on single numerical simulations and lack systematic consideration, which makes it impossible to accurately handle the complex relationships between inter-hole interference, nonlinear material evolution, and multidimensional performance indicators, thus affecting the accuracy, efficiency, and quality stability of micro-hole array stamping.
By constructing a digital twin of the multi-hole array stamping process, using an intelligent controller to simulate the stamping scheme, dynamic game balance analysis and collaborative optimization of multi-dimensional performance indicators are carried out. Combined with a simulation solver and a random perturbation mechanism, the processing of the micro-hole array is optimized.
It has enabled intelligent and systematic optimization of the micro-hole array stamping process, improving stamping accuracy, production efficiency and product quality consistency.
Smart Images

Figure CN122172672A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of alloy sheet technology, and in particular to processing methods, systems and media for precision micropore arrays of alloy materials. Background Technology
[0002] With the widespread application of micro-hole arrays in high-end manufacturing fields such as aerospace, microfluidic chips, and precision electronic packaging, higher demands are being placed on the precision, efficiency, and controllability of micro-hole stamping processing of alloy materials. High-density micro-hole arrays typically require achieving micron-level pore size accuracy, uniform pore spacing, and controllable residual stress on thin plates or complex alloy materials. This poses significant challenges to the performance of stamping equipment, processing scheme design, and optimization of process parameters. Currently, existing micro-hole array stamping technologies mainly rely on manual experience or process optimization methods based on single numerical simulations. These methods lack systematic consideration in aspects such as hole group division, stamping sequence, pressure distribution, and time control, and are unable to fully reflect the complex relationships between inter-hole interference, material nonlinear evolution, and multi-dimensional performance indicators.
[0003] In summary, existing technologies suffer from technical problems due to their reliance on single numerical simulations and lack of systematic consideration. This leads to an inability to accurately handle the complex relationships between inter-hole interference, nonlinear material evolution, and multidimensional performance indicators, further affecting the accuracy, efficiency, and quality stability of micro-hole array stamping. Summary of the Invention
[0004] The purpose of this application is to provide a processing method, system, and medium for precision micro-hole arrays of alloy materials, in order to solve the technical problems in the prior art that rely on single numerical simulations and lack systematic consideration, which leads to the inability to accurately handle the complex relationships between inter-hole interference, nonlinear evolution of materials, and multidimensional performance indicators, and further affects the accuracy, efficiency, and quality stability of micro-hole array stamping.
[0005] In view of the above problems, this application provides a method, system and medium for processing precision micropore arrays of alloy materials.
[0006] In a first aspect, this application provides a method for processing precision micro-hole arrays of alloy materials, implemented through a processing system for precision micro-hole arrays of alloy materials, comprising: acquiring initial state parameters of the alloy sheet to be processed, the initial state parameters including sheet thickness parameters, residual stress field, and target micro-hole array arrangement data; constructing a digital twin of the multi-hole array stamping based on the initial state parameters, the digital twin mapping the geometric layout of the stamping device, material evolution characteristics, and global interaction of the stamping mechanical field in a virtual space; simulating the stamping scheme using the intelligent controller of the digital twin, and performing dynamic evolution simulation under different hole group divisions, stamping sequences, and pressure distribution configurations through a simulation solver, outputting multi-dimensional performance indicators corresponding to the simulated stamping scheme, the multi-dimensional performance indicators including stamping time, forming accuracy, energy consumption cost, and inter-hole interference degree; performing dynamic game balance analysis of the multi-dimensional performance indicators to establish a collaborative optimization strategy; and using the collaborative optimization strategy to execute micro-hole array stamping control of the alloy sheet to be processed.
[0007] Preferably, the processing method for precision micro-hole arrays of alloy materials further includes: treating each group of holes in the target micro-hole array as a game participant, configuring a strategy set for the game participants, the strategy set including stamping sequence, stamping pressure, and stamping time; establishing a dynamic utility function for each game participant, the dynamic utility function including a forming accuracy benefit term, a stamping time cost term, an energy consumption cost term, and an inter-hole interference penalty term; dynamically adjusting the weight of the inter-hole interference penalty term according to the inter-hole interference degree of the simulation solver; using the updated dynamic utility function to perform utility feedback for the corresponding strategy based on multi-dimensional performance indicators, and performing dynamic game iterative updates of the game participants based on the utility feedback to establish a collaborative optimization strategy.
[0008] Preferably, the processing method for precision micro-pore arrays of alloy materials further includes: setting a sliding verification window mapped to the iteration cycle; during the iterative update process, using the mapped sliding verification window to perform window game effect verification and establish sliding window verification feedback; if the sliding window verification feedback fails to meet the preset feedback threshold, a random perturbation mechanism is triggered; after performing strategy perturbation according to the random perturbation mechanism, iterative update management is performed.
[0009] Preferably, the processing method for precision micro-hole arrays of alloy materials further includes: activating the intelligent controller, using the initial state parameters as matching data, performing internal and external adaptive stamping strategy matching, and establishing a matching strategy set; performing matching strategy set fusion verification based on internal and external source confidence, and constructing a strategy space; configuring a simulated stamping scheme with adaptive granularity within the strategy space, and performing dynamic evolution simulation based on the configured simulated stamping scheme.
[0010] Preferably, the processing method for precision micro-hole arrays of alloy materials further includes: obtaining a preset control precision of the alloy sheet to be processed; using the preset control precision as a matching parameter to set a uniform segmentation particle size; uniformly segmenting the strategy space according to the uniform segmentation particle size to establish a uniform segmentation result; obtaining the spatial concentration factor of the matching strategy set in the strategy space, and calculating the neighborhood distribution difference under each uniform segmentation particle size; using the spatial concentration factor and the neighborhood distribution difference to perform enhancement adjustment of the uniform segmentation result to establish an enhancement adjustment result; configuring a random perturbation scheme; and configuring a simulated stamping scheme according to the random perturbation scheme and the enhancement adjustment result.
[0011] Preferably, the processing method for precision micro-hole arrays of alloy materials further includes: activating the simulation solver to perform dynamic evolution simulation according to the hole group division, stamping sequence, and pressure distribution configuration of the simulated stamping scheme, wherein the simulation solver is a simulation processing unit of a digital twin; recording the local material state evolution of the hole group and adjacent hole groups under the dynamic evolution simulation, wherein the local material state evolution includes local plate thickness changes, residual stress distribution, and inter-hole displacement field; calculating the performance index of each hole group based on the local material state evolution, and establishing multi-dimensional performance indexes based on the performance indexes of the same simulated stamping scheme.
[0012] Preferably, the processing method for precision micro-hole arrays of alloy materials further includes: performing batch processing adaptation prototyping on the collaborative optimization strategy to establish a prototyping dataset; performing group adaptation evaluation on the prototyping dataset to establish group balance feedback; using the group balance feedback to perform collaborative optimization strategy compensation to generate a batch processing adaptation strategy; and performing processing management according to the batch processing adaptation strategy.
[0013] Preferably, the processing method for precision micro-pore arrays of alloy materials further includes: establishing a monitoring command; performing processing monitoring of the alloy sheet to be processed according to the monitoring command; establishing processing feedback; using the processing feedback to perform execution verification of the collaborative optimization strategy; establishing execution verification deviation; and issuing an abnormality early warning based on the execution verification deviation.
[0014] Secondly, this application also provides a processing system for precision micro-hole arrays of alloy materials, used to perform the processing method for precision micro-hole arrays of alloy materials as described in the first aspect, comprising: an initial state parameter acquisition module for acquiring initial state parameters of the alloy sheet to be processed, the initial state parameters including sheet thickness parameters, residual stress field, and target micro-hole array arrangement data; and a digital twin construction module for constructing a digital twin of the multi-hole array stamping based on the initial state parameters, the digital twin mapping the geometric layout of the stamping device, material evolution characteristics, and global interaction of the stamping mechanical field in a virtual space; The multi-dimensional performance index output module is used to simulate the stamping scheme using the intelligent controller of the digital twin, and then perform dynamic evolution simulation under different hole group divisions, stamping timing sequences, and pressure distribution configurations through a simulation solver. The module outputs multi-dimensional performance indices corresponding to the simulated stamping scheme, including stamping time, forming accuracy, energy consumption cost, and inter-hole interference. The collaborative optimization strategy establishment module is used to perform dynamic game balance analysis of the multi-dimensional performance indices and establish a collaborative optimization strategy. The micro-hole array stamping control execution module is used to execute the micro-hole array stamping control of the alloy sheet to be processed using the collaborative optimization strategy.
[0015] Thirdly, a computer-readable storage medium storing a computer program that, when executed, implements the steps of the method for processing precision micro-hole arrays of alloy materials as described in any one of the first aspects.
[0016] The technical solution provided in this application has at least the following technical effects or advantages: by realizing the technical goal of intelligent and systematic optimization of the micro-hole array stamping process, it achieves the technical effect of improving stamping accuracy, production efficiency and product quality consistency.
[0017] The above description is merely an overview of the technical solution of this application. To enable a clearer understanding of the technical means of this application and to facilitate its implementation according to the description, and to make the above and other objects, features, and advantages of this application more apparent, specific embodiments of this application are described below. It should be understood that the content described in this section is not intended to identify key or important features of the embodiments of this application, nor is it intended to limit the scope of this application. Other features of this application will become readily apparent through the following description. Attached Figure Description
[0018] To more clearly illustrate the technical solutions in this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely exemplary. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.
[0019] Figure 1 This is a schematic flowchart of the processing method for precision micro-hole arrays of alloy materials according to this application.
[0020] Figure 2 This is a schematic diagram of the structure of the processing system for precision micro-hole arrays of alloy materials used in this application.
[0021] Figure labeling: Initial state parameter acquisition module 1, digital twin construction module 2, multi-dimensional performance index output module 3, collaborative optimization strategy establishment module 4, micro-hole array stamping control execution module 5. Detailed Implementation
[0022] This application provides a processing method, system, and medium for precision micro-hole arrays in alloy materials. It addresses the technical problems in existing technologies where reliance on single numerical simulations and a lack of systematic consideration leads to inaccurate handling of inter-hole interference, material nonlinear evolution, and complex relationships between multi-dimensional performance indicators, further impacting the accuracy, efficiency, and quality stability of micro-hole array stamping. This achieves the technical goal of intelligent and systematic optimization of the micro-hole array stamping process, resulting in improved stamping accuracy, production efficiency, and product quality consistency.
[0023] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. It should be understood that this application is not limited to the exemplary embodiments described herein. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application. It should also be noted that, for ease of description, only the parts related to this application are shown in the accompanying drawings, not all of them.
[0024] Example 1, please refer to the appendix. Figure 1 This application provides a method for processing precision micro-hole arrays of alloy materials, which is applied to a processing system for precision micro-hole arrays of alloy materials, and specifically includes the following steps: S1: Obtain the initial state parameters of the alloy sheet to be processed, including the sheet thickness parameters, residual stress field, and target micropore array arrangement data.
[0025] Specifically, obtaining the initial state parameters of the alloy sheet to be processed means collecting key basic data of the alloy sheet before formal processing. The alloy sheet to be processed is a sheet-like material made by melting two or more metals or metals and non-metallic materials, used in applications requiring high strength, corrosion resistance, or special physical properties. The initial state parameters refer to the inherent characteristic data of the alloy sheet before processing, which can directly affect the effect of subsequent stamping processes.
[0026] The initial state parameters include plate thickness, residual stress field, and target micropore array arrangement data. Plate thickness refers to the dimension of the alloy sheet to be processed in the thickness direction, which can affect the stamping accuracy and micropore forming quality. Residual stress field refers to the internal stress distribution that already exists in the alloy sheet during manufacturing or pre-processing, and may exist even without external force. Residual stress can cause unpredictable warping or deformation during the stamping process. For example, when the residual stress is large, asymmetrical deformation may occur around the stamped holes, directly affecting the overall accuracy of the micropore array. Target micropore array arrangement data refers to the distribution position, arrangement, and geometric parameters of the micropores on the sheet surface as required by the processing design. Micropore arrays are used for heat dissipation, weight reduction, or functional design.
[0027] S2: Construct a digital twin of the porous array stamping based on the initial state parameters. The digital twin maps the geometric layout of the stamping device, material evolution characteristics, and global interaction of the stamping mechanical field in virtual space.
[0028] Specifically, a digital twin of the multi-hole array stamping process is constructed based on initial state parameters. This involves using plate thickness parameters, residual stress field, and target micro-hole array arrangement data as inputs to create a virtual model corresponding to the actual processing environment. Multi-hole array stamping involves forming numerous neatly arranged small holes on the alloy sheet to be processed according to pre-designed rules. A digital twin is a virtual mapping technology used to replicate the real characteristics of a physical object in virtual space for simulation, prediction, and control.
[0029] A digital twin maps the geometric layout of a stamping device in virtual space, that is, it completely maps the shape, size, mold structure, and workpiece position of the actual stamping equipment to the virtual space. Geometric layout refers to the shape and relative position of each part of the equipment in space.
[0030] A digital twin maps the material evolution characteristics of a stamping device in virtual space, that is, the physical and mechanical changes exhibited by the alloy material to be processed during the stamping process. Material evolution characteristics include stress-strain relationships, plastic deformation laws, and hardening effects.
[0031] During the stamping process, not only are individual holes subjected to force, but there are also mechanical couplings between holes and between holes and boundaries. A digital twin maps the global interaction of the stamping mechanical field within a virtual space, that is, the distribution and transmission of stamping force on the alloy sheet to be processed. For example, when a hole is stamped, the surrounding material is simultaneously subjected to stress. If multiple holes are stamped simultaneously, the mechanical fields will superimpose, potentially leading to excessive deformation of localized sections of the sheet.
[0032] S3: After simulating the stamping scheme using the intelligent controller of the digital twin, the dynamic evolution simulation is performed under different hole group divisions, stamping sequence, and pressure distribution configurations through the simulation solver, and multi-dimensional performance indicators corresponding to the simulated stamping scheme are output. The multi-dimensional performance indicators include stamping time, forming accuracy, energy consumption cost, and inter-hole interference degree.
[0033] Furthermore, this application also includes: activating the intelligent controller, using the initial state parameters as matching data, performing internal and external adaptive stamping strategy matching, and establishing a matching strategy set; performing matching strategy set fusion verification based on internal and external source confidence, and constructing a strategy space; configuring a simulated stamping scheme with adaptive granularity within the strategy space, and performing dynamic evolution simulation based on the configured simulated stamping scheme.
[0034] Furthermore, this application also includes: obtaining a preset control precision of the alloy sheet to be processed; using the preset control precision as a matching parameter to set a uniform segmentation granularity; performing uniform segmentation of the strategy space according to the uniform segmentation granularity to establish a uniform segmentation result; obtaining the spatial concentration factor of the matching strategy set in the strategy space, and calculating the neighborhood distribution difference under each uniform segmentation granularity; using the spatial concentration factor and the neighborhood distribution difference to perform enhancement adjustment of the uniform segmentation result to establish an enhancement adjustment result; configuring a random perturbation scheme, and configuring a simulated stamping scheme according to the random perturbation scheme and the enhancement adjustment result.
[0035] Furthermore, this application also includes: activating the simulation solver to perform dynamic evolution simulation using the simulated stamping scheme according to the hole group division, stamping sequence, and pressure distribution configuration, wherein the simulation solver is a simulation processing unit of a digital twin; recording the local material state evolution of the hole group and adjacent hole groups under the dynamic evolution simulation, wherein the local material state evolution includes local plate thickness variation, residual stress distribution, and inter-hole displacement field; calculating the performance index of each hole group based on the local material state evolution, and establishing multi-dimensional performance indexes based on the performance indexes of the same simulated stamping scheme.
[0036] Specifically, the intelligent controller, the core control module within the digital twin, is a virtual control unit with algorithms and rules that can automatically generate or adjust processing schemes based on input conditions. Activating the intelligent controller involves inputting initial state parameters—such as plate thickness, residual stress field, and target micro-hole array arrangement—as matching data. This data forms the basis for scheme formulation. By simultaneously considering existing internal processing experience and imported expert rules or historical data, the controller executes internal and external adaptive stamping strategy matching to find the most suitable processing method for the alloy sheet conditions. The selected candidate schemes are then compiled into a set, establishing a matching strategy set. For example, the internal strategy might suggest hole-by-hole stamping, while the external strategy might suggest multi-hole simultaneous stamping.
[0037] The matching strategy set fusion verification is performed based on the confidence levels of internal and external sources to evaluate the credibility of solutions from different sources. Source confidence level is a metric for measuring the reliability of data or solutions. For example, the confidence level of internal simulation results might be 0.8, while the confidence level of external empirical data might be 0.6. Therefore, the internal solution will be given a higher weight during fusion. The fusion verification process combines solutions with different confidence levels and performs consistency checks to eliminate conflicting or unreasonable parts. After fusion, a multi-dimensional selection range is established, constructing a strategy space that includes all possible processing strategies and their parameter combinations.
[0038] Obtaining the preset control precision of the alloy sheet to be processed means pre-setting the precision standards required during the sheet processing, including the degree of consistency between the dimensions, shape, or position of the micro-holes after stamping and the target design. The preset control precision is used as a matching parameter and input into the strategy design process. The smallest unit scale used when regularly dividing the strategy space is set with uniform granularity; the smaller the granularity, the more refined the simulation scheme.
[0039] The policy space is uniformly partitioned based on a uniform partitioning granularity to ensure that each part is processed proportionally. The set of sub-regions formed after the multi-dimensional space partitioning is saved to establish the uniform partitioning result, which serves as the basis for subsequent simulations and optimizations.
[0040] Obtain the spatial concentration factor of the matching policy set in the policy space, and calculate the distribution of candidate policies in the space. The spatial concentration factor is an indicator that measures whether policies are concentrated; if most policies are clustered in a certain region of the space, the concentration factor is high.
[0041] Calculating the neighborhood distribution differences at each uniform segmentation granularity and comparing the degree of difference in the number or features of strategies between adjacent sub-regions can reflect whether the strategy distribution is balanced. Enhancement adjustments to the uniform segmentation results are performed using spatial concentration factors and neighborhood distribution differences. This involves refining the initially uniform segmentation, refining overly dense regions, and merging sparse regions, ultimately resulting in a more reasonable strategy segmentation and establishing the enhanced adjustment results.
[0042] Configure a random perturbation scheme to prevent the scheme from getting trapped in local optima. The random perturbation scheme can be to randomly shuffle the order of some policies, or to randomly increase or decrease the magnitude of certain policy parameters. Based on the random perturbation scheme and the enhancement adjustment results, configure the simulated stamping scheme for subsequent virtual simulation and performance evaluation. For example, in a space containing 100 policy points, enhancement adjustment might make 80 of the points more evenly distributed, while random perturbation would add 20 more variation points to the 80 points, thus expanding to 100 candidate schemes.
[0043] Dynamic evolution simulation is performed based on the configured simulated stamping scheme. Candidate schemes are run one by one in the virtual environment, and the evolution of material state, mechanical distribution, and inter-hole interference over time is observed. For example, if a scheme is set to stamp 4 holes first and then 8 holes, the simulation will record the entire process from initial stress to the superposition of inter-hole stress, and obtain the corresponding performance indicators of the scheme.
[0044] The simulation solver is activated to perform dynamic evolution simulation using a simulated stamping scheme, configured according to hole group division, stamping sequence, and pressure distribution. Hole group division divides the entire micro-hole array into several small groups for step-by-step processing and reduced mutual interference. Stamping sequence refers to the processing order of each hole group or individual hole over time; for example, stamping the left hole group before the right. Pressure distribution configuration refers to the magnitude and distribution of stamping pressure set for different hole groups or regions during processing, such as using lower pressure for edge regions and higher pressure for center regions. The simulation solver is the core computing module in the digital twin, capable of simulating the dynamic changes of the entire stamping process; hence, it is called dynamic evolution simulation, meaning it continuously tracks and calculates the stress and deformation of the material over time.
[0045] This simulation records the local material state evolution of hole groups and adjacent hole groups under dynamic evolution simulation, that is, continuously collecting material change information of each hole group and its surrounding area during the simulation process. Local material state evolution refers to the physical changes of the material over time in a microscopic or localized range. Local material state evolution includes local plate thickness variation, residual stress distribution, and inter-hole displacement field. Local plate thickness variation refers to the thinning or bulging of the alloy sheet material during stamping due to stress. Residual stress distribution refers to the stress field remaining inside the material after stamping, which may lead to subsequent deformation or cracking. The inter-hole displacement field describes the relative displacement between adjacent holes due to the transfer of processing stress; for example, deformation around one hole may cause positional changes in adjacent holes.
[0046] The performance indicators for each hole group are calculated based on the local material state evolution. The simulated thickness changes, stress distribution, and displacement are converted into quantitative indicators to evaluate the processing quality of the hole group. For example, the hole wall thickness reduction rate can be used as a forming accuracy indicator, and the residual stress peak can be used as a stability indicator. Furthermore, multi-dimensional performance indicators are established based on the performance indicators of the same simulated stamping scheme, meaning that the indicators of different hole groups are integrated to form a comprehensive performance description covering multiple dimensions. Multi-dimensional performance indicators typically include processing time, energy consumption, inter-hole interference, and forming accuracy, among other aspects. These comprehensive indicators allow for a complete comparison of the advantages and disadvantages of different simulation schemes.
[0047] Multi-dimensional performance indicators include stamping time, forming accuracy, energy consumption, and inter-hole interference. Stamping time refers to the time required to complete one stamping operation, used to measure production efficiency. Forming accuracy refers to the degree of deviation between the stamped product and design requirements, reflecting processing quality and consistency. Energy consumption refers to the electrical or other energy consumed by the equipment during the stamping process; its magnitude is related to the economic efficiency and environmental friendliness of production. Inter-hole interference refers to the degree of mutual influence between adjacent holes or features during the stamping process due to die arrangement or stamping force transmission.
[0048] S4: Perform dynamic game balance analysis on multi-dimensional performance indicators and establish collaborative optimization strategies.
[0049] Furthermore, this application also includes: treating each group of holes in the target micro-hole array as a game participant, configuring a strategy set for the game participants, the strategy set including stamping sequence, stamping pressure, and stamping time; establishing a dynamic utility function for each game participant, the dynamic utility function including a forming accuracy benefit term, a stamping time cost term, an energy consumption cost term, and an inter-hole interference penalty term; dynamically adjusting the weight of the inter-hole interference penalty term according to the inter-hole interference degree of the simulation solver; using the updated dynamic utility function to perform utility feedback on the corresponding strategy based on multi-dimensional performance indicators, and performing dynamic game iterative updates of the game participants based on the utility feedback to establish a collaborative optimization strategy.
[0050] Furthermore, this application also includes: setting a sliding verification window mapped to the iteration cycle; during the iterative update process, using the mapped sliding verification window to perform window game effect verification and establishing sliding window verification feedback; if the sliding window verification feedback fails to meet the preset feedback threshold, a random perturbation mechanism is triggered; after performing strategy perturbation according to the random perturbation mechanism, iterative update management is performed.
[0051] Specifically, each group of holes in the target micro-hole array is considered a player in the game. This means that in an array structure composed of many tiny holes, each group of holes is regarded as an independent decision-maker. The meaning of a player in the game model is that an individual can independently choose a strategy and bear the consequences. The strategy set refers to a series of options that the player in the game can choose from. For example, in stamping manufacturing, the stamping sequence can be adjusted to determine which hole is processed first, the stamping pressure can be set to control the stability of the forming, and the stamping time can affect the efficiency.
[0052] A dynamic utility function is established for each player in the game, and a mathematical function is designed for each hole group to measure its gains and costs in the stamping process. The dynamic utility function includes a forming accuracy gain term, a stamping time cost term, an energy consumption cost term, and an inter-hole interference penalty term. The forming accuracy gain term reflects the positive benefits of higher hole group forming quality; the stamping time cost term reflects the burden of lower efficiency due to longer stamping time; the energy consumption cost term indicates that higher energy consumption leads to higher costs; and the inter-hole interference penalty term indicates that the stronger the influence between holes, the greater the penalty, thus forming a dynamic trade-off relationship.
[0053] The weight of the inter-hole interference penalty term is dynamically adjusted based on the inter-hole interference level in the simulation solver. This means that the simulation tool calculates the degree of mutual interference between different holes during the stamping process and uses this as a weighting factor to adjust the importance of the inter-hole interference penalty term. For example, when the distance between adjacent holes is 5 mm, the interference level is high, and the penalty weight may be set to 0.8, while when the distance is 10 mm, the interference level is low, and the penalty weight may be reduced to 0.3.
[0054] The updated dynamic utility function is used to provide utility feedback for the corresponding strategy based on multi-dimensional performance indicators. This means that multi-dimensional indicators such as stamping time, forming accuracy, energy consumption cost, and inter-hole interference are combined to calculate and compare different strategies, and obtain the utility feedback result of each strategy.
[0055] Setting a sliding verification window that maps to the iteration cycle means that in a multi-round game or optimization iteration process, each iteration cycle corresponds to a verification interval that moves forward over time. The sliding verification window is a dynamically changing detection range that can cover a portion of the latest iteration results. It is used to continuously track the performance of the algorithm or strategy within that cycle, similar to a moving average window used in data processing, which can filter out short-term fluctuations and keep things updated in real time.
[0056] During the iterative update process, a sliding verification window based on the mapping is used to perform window game effect verification. That is, within each window, the stability and effectiveness of the strategies involved in the game are checked, thereby evaluating the performance of the local iteration results. For example, it verifies whether the accuracy of stamping is within the target range and whether the energy consumption is below a certain limit. At the same time, a sliding window verification feedback is established to convert the results into quantitative evaluation values, providing a reference for subsequent adjustments.
[0057] If the sliding window verification feedback fails to meet the preset feedback threshold, a random perturbation mechanism is triggered. This means that when the verification result is lower than the preset standard, a random perturbation mechanism is introduced to avoid getting trapped in a local optimum. The preset feedback threshold can be a critical value where the molding accuracy is less than 95% or the energy consumption exceeds 100 joules. The role of the random perturbation mechanism is to artificially break the fixed state of the current strategy and increase uncertainty, such as randomly changing the stamping sequence or time allocation, thereby exploring new solution spaces.
[0058] After the strategy is perturbed according to the random perturbation mechanism, iterative update management is performed, that is, the effect is verified again by reusing the sliding verification window, and a collaborative optimization strategy is established by combining the result update strategy after perturbation, so as to ensure that the overall optimization process can maintain stable convergence and avoid premature convergence to an undesirable solution.
[0059] S5: Utilize the aforementioned collaborative optimization strategy to perform micro-hole array stamping control on the alloy sheet to be processed.
[0060] Furthermore, this application also includes: performing batch processing adaptation sampling on the collaborative optimization strategy to establish a sampling dataset; performing group adaptation evaluation on the sampling dataset to establish group balance feedback; using the group balance feedback to perform collaborative optimization strategy compensation to generate a batch processing adaptation strategy; and performing processing management according to the batch processing adaptation strategy.
[0061] Furthermore, this application also includes: establishing a monitoring instruction, performing processing monitoring of the alloy sheet to be processed according to the monitoring instruction, and establishing processing feedback; using the processing feedback to perform execution verification of the collaborative optimization strategy, and establishing execution verification deviation; and issuing an abnormality early warning based on the execution verification deviation.
[0062] Specifically, the adaptation prototyping of the collaborative optimization strategy for mass production involves applying the stamping strategy obtained through digital twins and game-theoretic iterative optimization to actual or virtual sheet metal samples for trial processing. This verifies the applicability of the strategy in mass production. The processing parameters, forming results, and performance indicators of each prototyping are recorded to form a complete dataset for analysis and optimization, thus establishing a prototyping dataset. Adaptation prototyping refers to testing on small-scale or representative samples to ensure that the strategy can be extended to mass production.
[0063] Perform a population fit evaluation on the sample dataset to assess the performance of the collaborative optimization strategy within the population. The population fit evaluation focuses on the balance and consistency among multiple samples. For example, comparing the aperture errors of 10 plates, if the average error is 0.02 mm and the maximum error is 0.05 mm, it indicates that the strategy fits well within the population. Convert the population fit evaluation results into feedback information to establish population balance feedback, which guides strategy adjustments. If excessive interference between holes is found in some plates, the stamping sequence or pressure that needs adjustment can be marked in the feedback.
[0064] The collaborative optimization strategy is compensated by utilizing group equilibrium feedback. This involves modifying and compensating for the original collaborative optimization strategy based on group feedback information to generate a batch processing adaptation strategy. The batch processing adaptation strategy is the final solution for multi-piece sheet metal or large-scale production environments, balancing efficiency, accuracy, and energy consumption. Processing management is then executed based on the batch processing adaptation strategy, applying the modified strategy to actual production management. This includes setting parameters such as stamping sequence, pressure, and time to ensure that batch processing achieves the expected goals. For example, if the original strategy is suitable for a single sheet metal, but a 20% increase in energy consumption is observed during batch processing, adjusting the stamping pressure and sequence after strategy compensation can reduce energy consumption back to the original level while maintaining forming accuracy.
[0065] Furthermore, monitoring instructions are established, which involves creating a set of specific monitoring rules and operational requirements for the processing. These monitoring instructions guide the system in collecting key data during processing, such as stamping pressure, stamping time, hole diameter, and plate thickness variations, to ensure that the processing meets expected standards.
[0066] The monitoring of the alloy sheet to be processed is executed according to the monitoring instructions. This means that data is continuously collected according to the monitoring instructions during the actual or virtual stamping process to track the processing status of the sheet in real time, thereby detecting abnormalities or deviations from the target. The actual processing data monitored is organized into analyzable feedback information, including the processing results and deviation indicators of each hole group, and a processing feedback is established.
[0067] The execution verification of the collaborative optimization strategy utilizes processing feedback. This involves comparing and analyzing the actual monitored processing results with the expected effects of the collaborative optimization strategy to verify the effectiveness of the strategy under real processing conditions. The execution verification deviation refers to the quantified difference between the actual processing results and the strategy's expectations. For example, if the strategy expects the aperture error to be no more than 0.01 mm, while the actual feedback is 0.02 mm, then the execution verification deviation is 0.01 mm.
[0068] Anomaly warnings are issued based on the deviation from the verification process. When the deviation exceeds a preset threshold, an alarm is automatically issued to remind operators or the management system that there may be a processing abnormality or equipment failure, and corrective measures need to be taken.
[0069] In summary, the processing method for precision micro-hole arrays of alloy materials provided in this application has the following technical effects: by realizing the technical goal of intelligent and systematic optimization of the micro-hole array stamping process, it achieves the technical effects of improving stamping accuracy, production efficiency and product quality consistency.
[0070] Example 2: Based on the same inventive concept as the processing method for precision micro-pore arrays of alloy materials in the foregoing examples, this application also provides a processing system for precision micro-pore arrays of alloy materials. Please refer to the appendix. Figure 2 The system includes: an initial state parameter acquisition module 1, used to acquire the initial state parameters of the alloy sheet to be processed, including sheet thickness parameters, residual stress field, and target micro-hole array arrangement data; a digital twin construction module 2, used to construct a digital twin of the multi-hole array stamping based on the initial state parameters, wherein the digital twin maps the geometric layout of the stamping device, material evolution characteristics, and global interaction of the stamping mechanical field in virtual space; a multi-dimensional performance index output module 3, used to simulate the stamping scheme using the intelligent controller of the digital twin, and then perform dynamic evolution simulation under different hole group divisions, stamping sequence, and pressure distribution configurations through a simulation solver, outputting multi-dimensional performance indices corresponding to the simulated stamping scheme, including stamping time, forming accuracy, energy consumption cost, and inter-hole interference degree; a collaborative optimization strategy establishment module 4, used to perform dynamic game balance analysis of the multi-dimensional performance indices and establish a collaborative optimization strategy; and a micro-hole array stamping control execution module 5, used to execute the micro-hole array stamping control of the alloy sheet to be processed using the collaborative optimization strategy.
[0071] Furthermore, the processing system for precision micro-hole arrays of alloy materials is also used for: treating each group of holes in the target micro-hole array as a game participant, configuring a strategy set for the game participants, the strategy set including stamping sequence, stamping pressure, and stamping time; establishing a dynamic utility function for each game participant, the dynamic utility function including forming accuracy gain term, stamping time cost term, energy consumption cost term, and inter-hole interference penalty term; dynamically adjusting the weight of the inter-hole interference penalty term according to the inter-hole interference degree of the simulation solver; using the updated dynamic utility function to perform utility feedback for the corresponding strategy based on multi-dimensional performance indicators, and performing dynamic game iterative updates of the game participants based on the utility feedback to establish a collaborative optimization strategy.
[0072] Furthermore, the processing system for precision micro-pore arrays of alloy materials is also used for: setting a sliding verification window mapped to the iteration cycle; during the iterative update process, using the mapped sliding verification window to perform window game effect verification and establish sliding window verification feedback; if the sliding window verification feedback fails to meet the preset feedback threshold, a random perturbation mechanism is triggered; after performing strategy perturbation according to the random perturbation mechanism, iterative update management is performed.
[0073] Furthermore, the processing system for precision micro-hole arrays of alloy materials is also used to: activate the intelligent controller, use the initial state parameters as matching data, perform internal and external adaptive stamping strategy matching, and establish a matching strategy set; perform matching strategy set fusion verification based on internal and external source confidence, and construct a strategy space; adaptively configure simulated stamping schemes within the strategy space, and perform dynamic evolution simulation based on the configured simulated stamping schemes.
[0074] Furthermore, the processing system for precision micro-pore arrays of alloy materials is also used for: obtaining a preset control precision of the alloy sheet to be processed; using the preset control precision as a matching parameter to set a uniform segmentation particle size; uniformly segmenting the strategy space according to the uniform segmentation particle size to establish a uniform segmentation result; obtaining the spatial concentration factor of the matching strategy set in the strategy space, and calculating the neighborhood distribution difference under each uniform segmentation particle size; using the spatial concentration factor and the neighborhood distribution difference to perform enhancement adjustment of the uniform segmentation result to establish an enhancement adjustment result; configuring a random perturbation scheme; and configuring a simulated stamping scheme according to the random perturbation scheme and the enhancement adjustment result.
[0075] Furthermore, the processing system for precision micro-hole arrays of alloy materials is also used for: activating the simulation solver to perform dynamic evolution simulation according to the hole group division, stamping sequence, and pressure distribution configuration of the simulated stamping scheme, wherein the simulation solver is a simulation processing unit of a digital twin; recording the local material state evolution of the hole group and adjacent hole groups under the dynamic evolution simulation, wherein the local material state evolution includes local plate thickness changes, residual stress distribution, and inter-hole displacement field; calculating the performance index of each hole group based on the local material state evolution, and establishing multi-dimensional performance indexes based on the performance indexes of the same simulated stamping scheme.
[0076] Furthermore, the processing system for precision micro-pore arrays of alloy materials is also used for: performing batch processing adaptation prototyping for the collaborative optimization strategy and establishing a prototyping dataset; performing group adaptation evaluation of the prototyping dataset and establishing group balance feedback; using the group balance feedback to perform collaborative optimization strategy compensation, generating a batch processing adaptation strategy, and performing processing management according to the batch processing adaptation strategy.
[0077] Furthermore, the processing system for precision micro-pore arrays of alloy materials is also used for: establishing monitoring instructions, executing processing monitoring of the alloy sheet to be processed according to the monitoring instructions, and establishing processing feedback; using the processing feedback to execute the execution verification of the collaborative optimization strategy and establishing execution verification deviation; and issuing an abnormality early warning based on the execution verification deviation.
[0078] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The processing method and specific examples for precision micro-hole arrays of alloy materials in the foregoing embodiment one are also applicable to the processing system for precision micro-hole arrays of alloy materials in this embodiment. Through the foregoing detailed description of the processing method for precision micro-hole arrays of alloy materials, those skilled in the art can clearly understand the processing system for precision micro-hole arrays of alloy materials in this embodiment. Therefore, for the sake of brevity, it will not be described in detail here.
[0079] In Embodiment 3, based on the same inventive concept as the processing method for precision micro-hole arrays of alloy materials in the foregoing embodiments, this application also provides a computer-readable storage medium storing a computer program, which, when executed, implements the steps of the processing method for precision micro-hole arrays of alloy materials described in any one of Embodiment 1.
[0080] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
[0081] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of this application and its equivalents, this application also intends to include such modifications and variations.
Claims
1. A method for processing precision micro-hole arrays of alloy materials, characterized in that, The method includes: Obtain the initial state parameters of the alloy sheet to be processed, including sheet thickness parameters, residual stress field, and target micropore array arrangement data; A digital twin of the porous array stamping is constructed based on the initial state parameters. The digital twin maps the geometric layout of the stamping device, the material evolution characteristics, and the global interaction of the stamping mechanical field in virtual space. After simulating the stamping scheme using the intelligent controller of the digital twin, the dynamic evolution simulation is performed under different hole group divisions, stamping sequence, and pressure distribution configurations through the simulation solver. The simulation outputs multi-dimensional performance indicators corresponding to the simulated stamping scheme, including stamping time, forming accuracy, energy consumption cost, and inter-hole interference. Perform dynamic game balance analysis on multi-dimensional performance indicators and establish collaborative optimization strategies; The aforementioned collaborative optimization strategy is used to perform micro-hole array stamping control on the alloy sheet to be processed.
2. The processing method for precision micro-pore arrays of alloy materials as described in claim 1, characterized in that, Perform dynamic game equilibrium analysis on multi-dimensional performance indicators and establish collaborative optimization strategies, including: Each group of holes in the target micro-pore array is taken as a game participant, and a strategy set for the game participants is configured, which includes stamping sequence, stamping pressure and stamping time. Establish a dynamic utility function for each game participant, which includes a forming accuracy benefit term, a stamping time cost term, an energy consumption cost term, and an inter-hole interference penalty term; The weight of the inter-hole interference penalty term is dynamically adjusted based on the inter-hole interference degree of the simulation solver. The updated dynamic utility function is used to provide utility feedback for the corresponding strategy based on multi-dimensional performance indicators. Based on the utility feedback, the dynamic game of the game participants is executed to iterate and update the strategy, and a collaborative optimization strategy is established.
3. The processing method for precision micro-pore arrays of alloy materials as described in claim 2, characterized in that, Based on the aforementioned utility feedback, the dynamic game iteration update of the game participants is performed, including: Set up a sliding verification window that maps to the iteration cycle; During the iterative update process, the sliding verification window of the mapping is used to perform window game effect verification and establish sliding window verification feedback. If the sliding window verification feedback fails to meet the preset feedback threshold, a random perturbation mechanism is triggered. After the strategy perturbation is performed according to the random perturbation mechanism, iterative update management is performed.
4. The processing method for precision micro-pore arrays of alloy materials as described in claim 1, characterized in that, The intelligent controller utilizing a digital twin simulates the stamping process, including: The intelligent controller is activated, and the initial state parameters are used as matching data to perform internal and external adaptive stamping strategy matching to establish a matching strategy set. After performing fusion verification of the matching strategy set based on the confidence levels of internal and external sources, a strategy space is constructed. Within the strategy space, an adaptive granular configuration of the simulated stamping scheme is performed, and dynamic evolution simulation is executed based on the configured simulated stamping scheme.
5. The processing method for precision micro-pore arrays of alloy materials as described in claim 4, characterized in that, The simulated stamping scheme is configured with adaptive granularity within the strategy space, including: Obtain the preset control precision of the alloy sheet to be processed, and use the preset control precision as a matching parameter to set the uniform particle size. The strategy space is uniformly divided according to the uniform division granularity to establish a uniform division result; Obtain the spatial concentration factor of the matching strategy set in the strategy space, and calculate the neighborhood distribution difference under each uniform segmentation granularity. Use the spatial concentration factor and the neighborhood distribution difference to perform enhancement adjustment of the uniform segmentation result and establish the enhancement adjustment result. Configure a random perturbation scheme, and configure a simulated stamping scheme based on the random perturbation scheme and the enhancement adjustment results.
6. The processing method for precision micro-pore arrays of alloy materials as described in claim 1, characterized in that, The simulation solver performs dynamic evolution simulations under different hole group divisions, stamping sequences, and pressure distribution configurations, outputting multi-dimensional performance indicators corresponding to the simulated stamping scheme, including: The simulation solver is activated to perform dynamic evolution simulation by configuring the hole group division, stamping sequence, and pressure distribution according to the simulated stamping scheme. The simulation solver is a simulation processing unit of a digital twin. Record the local material state evolution of the hole group and adjacent hole groups under dynamic evolution simulation. The local material state evolution includes local plate thickness variation, residual stress distribution and inter-hole displacement field. The performance index of each hole group is calculated based on the local material state evolution, and a multi-dimensional performance index is established based on the performance index of the same simulated stamping scheme.
7. The processing method for precision micro-pore arrays of alloy materials as described in claim 1, characterized in that, The micro-hole array stamping control of the alloy sheet to be processed is performed using the aforementioned collaborative optimization strategy, including: Perform batch processing and adaptation prototyping on the aforementioned collaborative optimization strategy to establish a prototyping dataset; Perform population fit evaluation on the sampled dataset and establish population equilibrium feedback; The collaborative optimization strategy compensation is performed using the group balance feedback to generate a batch processing adaptation strategy, and processing management is performed according to the batch processing adaptation strategy.
8. The processing method for precision micro-hole arrays of alloy materials as described in claim 1, characterized in that, The micro-hole array stamping control of the alloy sheet to be processed is performed using the aforementioned collaborative optimization strategy, including: Establish monitoring instructions, execute processing monitoring of the alloy sheet to be processed according to the monitoring instructions, and establish processing feedback; The execution verification of the collaborative optimization strategy is performed using the processing feedback, and an execution verification deviation is established. Anomaly warnings will be issued based on the deviations in the execution verification.
9. A processing system for precision micro-hole arrays of alloy materials, characterized in that, The steps for implementing the processing method for precision micro-pore arrays of alloy materials according to any one of claims 1 to 8 include: The initial state parameter acquisition module is used to acquire the initial state parameters of the alloy plate to be processed, including plate thickness parameters, residual stress field, and target micropore array arrangement data. A digital twin construction module is used to construct a digital twin of a porous array stamping device based on the initial state parameters. The digital twin maps the geometric layout, material evolution characteristics, and global interaction of the stamping mechanical field of the stamping device in a virtual space. The multi-dimensional performance index output module is used to simulate the stamping scheme using the intelligent controller of the digital twin, and then perform dynamic evolution simulation under different hole group divisions, stamping sequence, and pressure distribution configurations through the simulation solver. The module outputs multi-dimensional performance indexes corresponding to the simulated stamping scheme, including stamping time, forming accuracy, energy consumption cost, and inter-hole interference degree. The collaborative optimization strategy establishment module is used to perform dynamic game balance analysis with multi-dimensional performance indicators and establish collaborative optimization strategies. The micro-hole array stamping control execution module is used to execute the micro-hole array stamping control of the alloy sheet to be processed using the aforementioned collaborative optimization strategy.
10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed, implements the steps of the processing method for precision micro-hole arrays of alloy materials as described in any one of claims 1 to 8.