A design method of heat dissipation teeth based on speed simulation

Abstract

This invention proposes a heat dissipation tooth design method based on velocity simulation, including: establishing simulation models of the chip, fan, PCB board, and chassis; numerically simulating and calculating the fluid flow inside the entire chassis; defining the larger end of the chip's windward surface as 'a' and the smaller end as 'b' based on the chip's windward surface size, and constructing an end face on 'a'; capturing the velocity gradient of the chip's windward surface through numerical simulation, and classifying it according to the maximum velocity change value, thereby achieving a heterogeneous arrangement of heat dissipation tooth density. In areas with drastic velocity fluctuations, the heat transfer flux in high-kinetic-energy areas is significantly improved by reducing the tooth pitch to compress the fluid boundary layer, effectively eliminating extreme temperature rise values ​​on the chip surface; and by changing the geometric projection area of ​​the windward surface and the fluid angle of attack, the flow share is redistributed to ensure that the system still has sufficient heat dissipation redundancy under extreme high heat load conditions.

Description

Technical Field

[0001] This invention relates to the field of chip heat dissipation, and in particular to a heat dissipation tooth design method based on speed simulation. Background Technology

[0002] As the integration of high-performance computing chips continues to increase, the heat dissipation power per unit area increases dramatically, placing higher demands on the heat dissipation system inside the chassis. Existing heat dissipation fin designs typically employ a uniformly arranged fixed structure or simply perform geometric coverage based on the chip size.

[0003] However, in practical applications, due to the small internal space of the chassis and the interference from fan rotation, PCB board layout and surrounding components, the airflow field on the chip's front side often exhibits a high degree of non-uniformity. Traditional uniform heat dissipation tooth solutions cannot effectively cope with such fluctuations in flow velocity gradient: areas with low flow velocity are prone to local hot spots due to insufficient heat transfer coefficient, while areas with high flow velocity may experience severe pressure loss and turbulent noise due to improper arrangement of heat dissipation teeth, making it difficult to meet the thermal management requirements under extreme operating conditions. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the defects of the existing technology. The present invention proposes a heat dissipation tooth design method based on speed simulation.

[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solution: In a first aspect, the present invention provides a heat dissipation tooth design method based on velocity simulation, comprising: Establish simulation models of chips, fans, PCB boards, and chassis, and numerically simulate and calculate the fluid flow inside the entire chassis. Based on the size of the chip's windward side, the side with the larger windward side is designated as 'a', and the side with the smaller windward side is designated as 'b'. An end face is constructed on 'a'. Construct an arc S on the end face, with arc S passing through both ends of the end face and radius R. Arc S is the top end face of the arc-shaped heat dissipation tooth. Draw an arc S1 with radius R1 through the center of arc S. Arc S1 passes through the two endpoints AB of a. Arc S1 serves as the root end face of the heat dissipation tooth. The area formed between the end faces of arc S, arc S1, and arc-shaped heat dissipation teeth is the heat dissipation area; Along the arc surface S1, the heat dissipation area is divided into n equal segments S using heat dissipation fins. 11 S 12 S 13 ......S 1n Remove S 11 and S 1n A heat dissipation tooth array is constructed on the arc surface S1; A speed simulation was performed on the heat dissipation tooth array. Based on the speed simulation results, the maximum change value of the speed within each uniform region was compared. The distance between each heat dissipation tooth was determined based on the maximum change value of the speed, and the structure of the chip heat dissipation tooth was determined.

[0006] Preferably, the length L of the end face and the radius R of the arc S are determined according to the actual working conditions.

[0007] Preferably, the length L of the end face is greater than or equal to a, and the radius R of the arc S is greater than or equal to the length L of the end face.

[0008] Preferably, the thickness of the heat dissipation teeth is a fixed value.

[0009] Preferably, the maximum change value of the speed .

[0010] Preferably, With the set V1, V2, V3...V n By comparing the two, the distance between the heat dissipation fins can be determined.

[0011] Preferably, the method further includes determining the length L of the end face based on the density of the heat dissipation teeth.

[0012] Preferably, the heat dissipation teeth are subjected to speed simulation after the length L of the end face is determined. Based on the speed change value inside each uniform region, the heat dissipation teeth are stretched or cut along the upper surface of the chip according to the speed change value to determine the heat dissipation tooth structure.

[0013] Secondly, an electronic device includes: Memory and processor; The memory is used to store computer-executable instructions, and the processor is used to execute the computer-executable instructions. When the computer-executable instructions are executed by the processor, they implement the steps of the heat dissipation tooth design method based on speed simulation.

[0014] Thirdly, a computer-readable storage medium storing computer-executable instructions that, when executed by a processor, implement the steps of the speed simulation-based heat dissipation tooth design method.

[0015] Compared with the prior art, the beneficial effects of the present invention include: capturing the flow velocity gradient on the windward side of the chip through numerical simulation and classifying it according to the maximum velocity change value, realizing the heterogeneous arrangement of heat dissipation tooth density; significantly improving the heat transfer flux in high kinetic energy regions by reducing the tooth pitch to compress the fluid boundary layer in areas with drastic flow velocity fluctuations, effectively eliminating the extreme temperature rise on the chip surface; and redistributing the flow share by changing the geometric projection area of ​​the windward side and the fluid angle of attack, ensuring that the system still has sufficient heat dissipation redundancy under extreme high heat load conditions. Attached Figure Description

[0016] The disclosure of this invention is illustrated with reference to the accompanying drawings. It should be understood that the drawings are for illustrative purposes only and are not intended to limit the scope of protection of this invention. In the drawings, the same reference numerals are used to refer to the same parts. Wherein: Figure 1 A diagram showing the temperature distribution in the chassis of an embodiment of this application; Figure 2 The diagram schematically illustrates the velocity distribution across the cross-section of a chip according to the present invention.

[0017] Figure 3 The schematic diagram shows the frontal view of the chip according to the present invention.

[0018] Figure 4 The diagram schematically shows the end face of the arc-shaped heat dissipation tooth according to the present invention.

[0019] Figure 5 The diagram schematically shows the root of the arc-shaped heat dissipation tooth according to the present invention.

[0020] Figure 6 A schematic diagram illustrating the equal division according to the present invention is shown.

[0021] Figure 7 The diagram schematically shows the end face structure of the arc-shaped heat dissipation teeth according to the present invention.

[0022] Figure 8 The diagram schematically shows the length of the arc-shaped heat dissipation teeth according to the present invention.

[0023] Figure 9 The schematic diagram shows a schematic representation of the arc-shaped heat dissipation tooth structure according to the present invention.

[0024] Figure 10 The schematic diagram shows a rectangular heat dissipation tooth structure according to the present invention.

[0025] Figure 11 The diagram illustrates an electronic device based on a speed simulation-based heat dissipation tooth design method according to the present invention. Detailed Implementation

[0026] It is readily understood that, based on the technical solution of this invention, those skilled in the art can propose various interchangeable structural methods and implementations without altering the essential spirit of the invention. Therefore, the following detailed embodiments and accompanying drawings are merely illustrative examples of the technical solution of this invention and should not be considered as the entirety of the invention or as limitations or restrictions on the technical solution of this invention.

[0027] Example 1, referring to Figures 1-11As one embodiment of the present invention, a heat dissipation tooth design method based on speed simulation is provided, comprising: S100: Establish simulation models of chips, fans, PCB boards, and chassis; numerically simulate and calculate the fluid flow inside the entire chassis; and study and analyze the velocity distribution of the fluid cross-section at the chip's windward side. S200: Based on the size of the chip's windward side, define the end with the larger windward side as a and the end with the smaller windward side as b, and construct an end face on a; S300: Construct an arc S on the end face, the arc S passes through both ends of the end face, the radius of the arc S is R, and the arc S is the top end face of the arc-shaped heat dissipation tooth; S400: Draw an arc S1 with radius R1 through the center of arc S. Arc S1 passes through the two endpoints AB of a. Arc S1 serves as the root end face of the heat dissipation tooth. The area formed between arc S, arc S1 and the end face of the arc heat dissipation tooth is the heat dissipation area. S500: Along the arc surface S1, the heat dissipation area is divided into n equal segments S using heat dissipation fins. 11 S 12 S 13 ......S 1n Remove S 11 and S 1n A heat dissipation tooth array is constructed on the arc surface S1; S600: Perform speed simulation on the heat dissipation tooth array, compare the maximum change value of the speed within each uniform region based on the speed simulation results, determine the distance between each heat dissipation tooth based on the maximum change value of the speed, and determine the structure of the chip heat dissipation tooth.

[0028] As one can imagine, a straight line L1 is constructed on the end face, with a certain distance between L1 and the end face. The end face serves as the root end face of the heat dissipation tooth, and the area between the end face and the straight line L1 is the heat dissipation area, forming a rectangular heat dissipation tooth.

[0029] By using speed simulation feedback of the heat dissipation tooth array, the density of heat dissipation teeth is dynamically increased in areas with large speed variations. This gradient-based non-uniform tooth distribution strategy enables deep coupling between the heat dissipation surface area and the flow rate fluctuation law. This not only significantly improves the heat exchange efficiency in local high-flow-rate areas, but also achieves adaptive equilibrium of the chip surface temperature field by optimizing the flux distribution in low-speed areas. Ultimately, while reducing fan power consumption, it greatly improves the overall heat transfer flux and reliability of the heat dissipation system.

[0030] Example 2, refer to Figures 1-11 As an embodiment of the present invention, a heat dissipation tooth design method based on speed simulation is provided based on the above embodiment.

[0031] In this embodiment, the length L of the end face and the radius R of the arc S are not fixed, but are dynamically determined based on the heat dissipation power of the chip and the actual airflow conditions inside the chassis.

[0032] To ensure that the heat dissipation fins can completely cover the core heat source area of ​​the chip, the length L of the end face is set to be greater than or equal to a, while the radius R of the arc S is greater than or equal to the length L of the end face, so as to maintain the overall expansion distribution of the heat dissipation fins and induce airflow to converge towards the center of the chip.

[0033] The thickness of the heat dissipation fins is kept constant to ensure the stability of the heat transfer resistance.

[0034] Based on the velocity simulation results, compare the maximum velocity change within each uniform region: When △V max When V1 is greater than or equal to 1, the tooth pitch of the heat dissipation tooth is set to h. When V2≤△V max When <V1, the pitch of the heat dissipation teeth is set to p; When V3≤△V max When <V2, the pitch of the heat dissipation teeth is set to q; ... Where q > p > h, V1, V2, V3…V n The determination is based on actual needs.

[0035] The system automatically determines the range of each segment and then accurately determines the spacing between the heat dissipation teeth. When the velocity change gradient is at its highest level, the system reduces the tooth spacing to compress the fluid boundary layer and achieve high-efficiency heat extraction.

[0036] It is conceivable that, in order to further reduce wind resistance and noise while maintaining the stability of heat exchange thermal resistance, the tooth thickness between arc S1 and arc S of the heat dissipation tooth is constructed with a small wave-like undulation along the airflow direction, while keeping the average value constant. This micro-deformation can disrupt the stability of laminar flow between the teeth and induce micro-turbulence, thereby further improving heat exchange efficiency without increasing fan power consumption.

[0037] By setting the end face length L and the arc radius R as variable parameters that are dynamically adjusted according to heat dissipation power and wind speed, it is ensured that the heat dissipation surface always accurately covers the core area of ​​the chip heat source on a geometric scale, thus solving the problem of insufficient effective heat exchange area utilization of traditional fixed heat sinks under dynamic operating conditions.

[0038] Example 3, referring to Figures 1-11 As an embodiment of the present invention, a heat dissipation tooth design method based on speed simulation is provided based on the above embodiment.

[0039] The length L of the end face is determined or modified in reverse based on the final distribution density of the heat dissipation teeth. When the tooth density in a local area reaches the physical limit due to drastic fluctuations in flow velocity, extending the length L of the end face not only expands the envelope of the heat dissipation area, but also redistributes the flow share between the teeth by changing the geometric projection area of ​​the windward side, ensuring that the heat dissipation system still has sufficient redundancy under extreme high heat load conditions.

[0040] As can be imagined, if the heat exchange redundancy is still insufficient after the end face length L is corrected to the preset maximum threshold, the tilt angle of the end face relative to the chip surface can be adjusted according to the simulated flow velocity vector direction. By changing the angle of the windward side, the heat exchange frequency of the fluid between the teeth can be increased within a limited physical envelope range, thus ensuring the heat dissipation stability of the system in extreme environments.

[0041] A correlation mapping between the distribution density of heat dissipation fins and the geometric dimensions of the end face was established, which solved the performance bottleneck after the fin distribution reached its physical limit due to severe flow velocity fluctuations in local areas. By extending the end face length L in reverse, the physical envelope range of the heat dissipation area was directly increased, and the secondary distribution of flow was achieved by changing the geometric projection area of ​​the windward surface, which effectively alleviated the flux pressure in the high-density area.

[0042] Example 4, refer to Figures 1-11 As an embodiment of the present invention, a heat dissipation tooth design method based on speed simulation is provided based on the above embodiment.

[0043] Based on the heat dissipation tooth structure after determining the end face length L, a depth velocity simulation is performed again.

[0044] Based on the specific velocity variation values ​​within each uniform region, this embodiment is no longer limited to two-dimensional planar tooth layout optimization. Instead, it longitudinally stretches or trims the heat dissipation teeth along the upper surface of the chip according to the velocity variation values. For regions where the flow velocity decreases, the heat transfer loss caused by insufficient flow velocity is compensated by increasing the height of the heat dissipation teeth (stretching). For scouring regions with extremely high flow velocities, the height of the heat dissipation teeth is appropriately trimmed to reduce the stress load on the windward side and optimize the flow channel opening. This three-dimensional structural fine-tuning ensures that each physical dimension of the heat dissipation teeth is mapped one-to-one with the kinetic energy distribution of the fluid.

[0045] As can be imagined, when simulation results show that there is fluid stagnation in a certain area due to excessively high heat dissipation teeth, the system automatically maps out honeycomb-shaped drag-reducing through holes on the side of the stretched heat dissipation teeth according to the local extreme value of the velocity gradient. The diameter of these through holes is proportional to the velocity-pressure gradient at that location. By releasing the locally accumulated static pressure energy, the heat dissipation effect of the heat dissipation teeth is ensured.

[0046] By longitudinally stretching or cutting the heat dissipation fins, the heat exchange capacity is precisely distributed in the vertical space. In the flow rate attenuation zone, the insufficient kinetic energy is compensated by increasing the fin height, and in the scouring zone, the flow channel opening is optimized by reducing the fin height. This significantly reduces the structural stress load on the windward side, allowing the chip surface temperature to drop faster.

[0047] This embodiment also provides a schematic diagram of an electronic device structure based on a speed simulation-based heat dissipation tooth design method. The electronic device is intended to represent various forms of digital computers, such as laptops, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframes, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processors, cellular phones, smartphones, wearable devices (such as helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and its... The functions described herein are merely illustrative and are not intended to limit the implementation of the invention as described and / or claimed herein.

[0048] Electronic device 10 includes at least one processor 11 and a memory, such as a read-only memory (ROM) 12 or a random access memory (RAM) 13, communicatively connected to the at least one processor 11. The memory stores computer programs executable by the at least one processor. The processor 11 can perform various appropriate actions and processes based on the computer programs stored in the ROM 12 or loaded from storage unit 18 into the RAM 13. The RAM 13 may also store various programs and data required for the operation of electronic device 10. The processor 11, ROM 12, and RAM 13 are interconnected via a bus 14. An input / output (I / O) interface 15 is also connected to the bus 14.

[0049] Multiple components in electronic device 10 are connected to I / O interface 15, including: input unit 16, such as keyboard, mouse, etc.; output unit 17, such as various types of displays, speakers, etc.; storage unit 18, such as disk, optical disk, etc.; and communication... Communication unit 19, such as a network interface card (NIC), modem, wireless transceiver, etc. Communication unit 19 allows electronic device 10 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.

[0050] Processor 11 can be a variety of general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. Processor 11 performs the various methods and processes described above, such as a heat sink design method based on speed simulation.

[0051] In some embodiments, a heat dissipation tooth design method based on speed simulation can be implemented as a computer program, which is used by... It is contained in a computer-readable storage medium, such as storage unit 18. In some embodiments, a portion or part of the computer program is included in the storage medium. All of these can be loaded and / or installed onto the electronic device 10 via ROM 12 and / or communication unit 19. When the computer program When the sequence is loaded into RAM 13 and executed by processor 11, one or more steps of a speed simulation-based heat sink design method described above can be performed. Alternatively, in other embodiments, processor 11 can be configured to perform a speed simulation-based heat sink design method by any other suitable means (e.g., by means of firmware).

[0052] The various implementations of the systems and technologies described above in this article can be applied to digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), and systems-on-chips. The implementation may be carried out in a system of components (SOC), a load-programmable logic device (CPLD), computer hardware, firmware, software, and / or combinations thereof. These various implementations may include: implementation in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transferring data and instructions to the storage system, the at least one input device, and the at least one output device.

[0053] Computer programs used to implement the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when executed by the processor, the computer programs cause the functions / operations specified in the flowcharts and / or block diagrams to be performed. The computer programs may be executed entirely on a machine, partially on a machine, or as a standalone software package, partially on a machine and partially on a remote machine, or entirely on a remote machine or server.

[0054] In the context of this invention, a computer-readable storage medium can be a tangible medium that may contain or store a computer program for use by or in conjunction with an instruction execution system, apparatus, or device. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination thereof. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable memory (EPM), and other similar media. Read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination of the above.

[0055] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or an LCD (liquid crystal display) for displaying information to the user. The device includes a monitor and a keyboard and pointing device (e.g., a mouse or trackball) through which the user provides input to the electronic device. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or haptic feedback); and input from the user can be received in any form (including voice input, speech input, or haptic input).

[0056] The systems and technologies described herein can be implemented in computing systems that include backend components (e.g., as data servers), or middleware components (e.g., application servers), or frontend components (e.g., user computers with graphical user interfaces or web browsers through which users can interact with implementations of the systems and technologies described herein), or any combination of such backend, middleware, or frontend components. The components of the system can be interconnected via digital data communication of any form or medium (e.g., communication networks). Examples of communication networks include local area networks (LANs), wide area networks (WANs), blockchain networks, and the Internet.

[0057] A computing system can include clients and servers. Clients and servers are generally located far apart and typically interact through communication networks. The client-server relationship is created by computer programs running on the respective computers and having a client-server relationship with each other. The server can be a cloud server, also known as a cloud computing server or cloud host, which is a hosting product within the cloud computing service system to address the shortcomings of traditional physical hosts and VPS services, such as high management difficulty and weak business scalability.

[0058] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0059] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A heat dissipation tooth design method based on speed simulation, characterized in that, include: Establish simulation models of chips, fans, PCB boards, and chassis, and numerically simulate and calculate the fluid flow inside the entire chassis. Based on the size of the chip's windward side, the side with the larger windward side is designated as 'a', and the side with the smaller windward side is designated as 'b'. An end face is constructed on 'a'. Construct an arc S on the end face, with arc S passing through both ends of the end face and radius R. Arc S is the top end face of the arc-shaped heat dissipation tooth. Draw an arc S1 with radius R1 through the center of arc S. Arc S1 passes through the two endpoints AB of a. Arc S1 serves as the root end face of the heat dissipation tooth. The area formed between the end faces of arc S, arc S1, and arc-shaped heat dissipation teeth is the heat dissipation area; Along the arc surface S1, the heat dissipation area is divided into n equal segments S using heat dissipation fins. 11 S 12 S 13 ......S 1n Remove S 11 and S 1n A heat dissipation tooth array is constructed on the arc surface S1; A speed simulation was performed on the heat dissipation tooth array. Based on the speed simulation results, the maximum change value of the speed within each uniform region was compared. The distance between each heat dissipation tooth was determined based on the maximum change value of the speed, and the structure of the chip heat dissipation tooth was determined.

2. The heat dissipation tooth design method based on speed simulation according to claim 1, characterized in that, The length L of the end face and the radius R of the arc S are determined according to the actual working conditions.

3. The heat dissipation tooth design method based on speed simulation according to claim 2, characterized in that, The length L of the end face is greater than or equal to a, and the radius R of the arc S is greater than or equal to the length L of the end face.

4. The heat dissipation tooth design method based on speed simulation according to claim 1, characterized in that, The thickness of the heat dissipation teeth is a fixed value.

5. The heat dissipation tooth design method based on speed simulation according to claim 1, characterized in that, The maximum change in speed .

6. The heat dissipation tooth design method based on speed simulation according to claim 5, characterized in that, Will With the set V1, V2, V3...V n By comparing the two, the distance between the heat dissipation fins can be determined.

7. The heat dissipation tooth design method based on speed simulation according to claim 3, characterized in that, The method also includes determining the length L of the end face based on the density of the heat dissipation teeth.

8. The heat dissipation tooth design method based on speed simulation according to claim 7, characterized in that, After determining the length L of the end face, the heat dissipation tooth is subjected to speed simulation. Based on the speed change value inside each uniform region, the heat dissipation tooth is stretched or cut along the upper surface of the chip according to the speed change value to determine the heat dissipation tooth structure.

9. An electronic device, comprising: Memory and processor; The memory is used to store computer-executable instructions, and the processor is used to execute the computer-executable instructions. When the computer-executable instructions are executed by the processor, they implement the steps of the heat dissipation tooth design method based on speed simulation as described in any one of claims 1 to 8.

10. A computer-readable storage medium storing computer-executable instructions that, when executed by a processor, implement the steps of the speed simulation-based heat dissipation tooth design method according to any one of claims 1 to 8.

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