Display device

By setting buffer holes on the outer portion of the cover plate of the display module and the side filler, a circumferential buffer structure is formed, which solves the problem of stress transmission of the display panel caused by the deformation of the middle frame and improves the deformation resistance and impact resistance of the display device.

CN122177019APending Publication Date: 2026-06-09WUHAN TIANMA MICRO ELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
WUHAN TIANMA MICRO ELECTRONICS CO LTD
Filing Date
2026-05-09
Publication Date
2026-06-09

AI Technical Summary

Technical Problem

Under stress conditions, the deformation of the mid-frame in existing display modules causes the LIPO adhesive to directly transmit stress to the display panel, leading to circuit cracks and reliability issues, and insufficient resistance to deformation and impact.

Method used

Multiple buffer holes are set on the outer expansion part of the cover plate of the display module and the side filler to form a circumferential buffer structure, which absorbs external impact and deformation stress and avoids direct transmission to the display panel.

Benefits of technology

It improves the display module's resistance to deformation and impact, reduces circuit cracks and display abnormalities, and enhances overall reliability.

✦ Generated by Eureka AI based on patent content.

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    Figure CN122177019A_ABST
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Abstract

This disclosure relates to the field of display technology, and more particularly to a display device. The display device includes a display module, a cover plate, and a filler adhesive. The cover plate covers the display surface of the display module and extends beyond the display module, with the portion of the cover plate not covered by the display module constituting the extended portion. The filler adhesive covers the extended portion and at least a portion of the side surfaces of the display module, and the filler adhesive has multiple buffer holes, the projections of which along the thickness direction of the display module at least partially surround the display module. The aforementioned display device improves the overall deformation resistance, impact resistance, and drop resistance reliability of the display device.
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