Multilayer ceramic electronic component

Abstract

A multilayer ceramic electronic component is provided. The multilayer ceramic electronic component includes a ceramic main body having a plurality of dielectric layers and a plurality of internal electrodes disposed such that the dielectric layers are interposed between the plurality of internal electrodes. An external electrode is disposed on an outer portion of the ceramic main body. A coating layer is formed on a portion of an outer surface of the ceramic main body and includes at least one of a thermal stabilizer that removes radicals generated from a water repellent coating agent and an antioxidant that decomposes radical formation factors and a water repellent coating agent. The coating layer improves moisture resistance reliability and durability of the multilayer ceramic electronic component under thermal stress and environmental stress.

Description

Technical Field

[0001] This disclosure relates to a multilayer ceramic electronic component. Background Technology

[0002] Electronic components using ceramic materials include capacitors, inductors, piezoelectric components, varistors, and thermistors. Among these ceramic electronic components, multilayer ceramic capacitors (MLCCs) are used in a variety of electronic devices due to their small size, high capacitance, and ease of installation.

[0003] Multilayer ceramic capacitors are electronic components in the form of plates that are mounted on the substrates of various electronic products (such as imaging devices such as liquid crystal displays (LCDs), plasma display panels (PDPs), organic light-emitting diodes (OLEDs)), computers, and personal portable terminals such as smartphones) for charging and discharging.

[0004] As the operating environments of multilayer ceramic capacitors become more diverse, their moisture resistance and reliability are considered important.

[0005] A multilayer ceramic capacitor may include an inner electrode disposed inside a ceramic body and an outer electrode disposed outside the ceramic body and connected to the inner electrode. To achieve miniaturization and high capacitance of multilayer ceramic capacitors, methods can be sought to increase the effective capacitance of the multilayer ceramic capacitor (i.e., increase the size of the ceramic body) while minimizing the thickness of the outer electrode.

[0006] However, when the thickness of the outer electrode is reduced to increase the size of the ceramic body, the moisture resistance reliability of the multilayer ceramic capacitor may be decreased. Furthermore, during the plating process of the outer electrode, the penetration of the plating solution may cause defects in the internal structure of the outer electrode and the ceramic body, which may lead to a deterioration in the reliability of the final product, particularly in terms of characteristic degradation and failure during high-temperature and high-voltage operation. Summary of the Invention

[0007] One aspect of this disclosure is to provide a multilayer ceramic electronic component that can achieve miniaturization and high capacity while ensuring moisture-proof reliability.

[0008] However, the problems to be solved by the embodiments of this disclosure are not limited to those described above, and various extensions can be made within the scope of the technical concepts included in this disclosure.

[0009] A multilayer ceramic electronic component according to an embodiment may include: a ceramic body including a plurality of dielectric layers and a plurality of internal electrodes, the plurality of internal electrodes being configured such that the dielectric layers are located between the plurality of internal electrodes; an external electrode disposed on the exterior of the ceramic body; and a coating disposed on a portion of the outer surface of the ceramic body. The coating may include: a waterproof coating agent; and at least one of a heat stabilizer and an antioxidant, the heat stabilizer removing free radicals generated from the waterproof coating agent, and the antioxidant decomposing free radical forming factors.

[0010] The coating may include: a first layer comprising the heat stabilizer, the antioxidant, and the waterproofing agent; and a second layer disposed on the first layer and comprising the waterproofing agent.

[0011] The coating may include: a first layer comprising the heat stabilizer, the antioxidant, and the waterproof coating agent; a second layer disposed on the first layer and comprising the heat stabilizer; a third layer disposed on the second layer and comprising the antioxidant; and a fourth layer disposed on the third layer and comprising the waterproof coating agent.

[0012] The coating may include: a first layer comprising the heat stabilizer; a second layer disposed on the first layer and comprising the antioxidant; and a third layer disposed on the second layer and comprising the waterproof coating agent.

[0013] The coating may include: a first layer comprising the antioxidant; a second layer disposed on the first layer and comprising the heat stabilizer; and a third layer disposed on the second layer and comprising the waterproof coating agent.

[0014] The coating may include: a first layer comprising the heat stabilizer; and a second layer disposed on the first layer and comprising the waterproof coating agent.

[0015] The coating may be applied to the outer surface of the ceramic body, excluding the portion where the external electrode is located.

[0016] At least one of the ceramic body and the external electrode may include components of the coating.

[0017] The waterproof coating agent may include fluorinated compounds, which include at least one of fluorosilane compounds, perfluoropolyether (PFPE), polytetrafluoroethylene (PTFE), fluorinated ethylene propylene (FEP), and polyvinyl fluoride (PVF).

[0018] The heat stabilizer may include at least one selected from benzotriazole compounds, sebacic acid esters, and formamidinium compounds, wherein the benzotriazole compounds include hydroxyphenylbenzotriazole, the sebacic acid esters include at least one selected from bis(1,2,2,6,6-pentamethyl-4-piperidinyl) sebacic acid ester and bis(1-octyl-2,2,6,6-tetramethyl-4-piperidinyl) sebacic acid ester, and the formamidinium compounds include at least one selected from N-(4-alkoxycarbonylphenyl)-N'-alkyl-N'-benzamidinium, N-(4-methoxycarbonylphenyl)-N'-methyl-N'-benzamidinium, N-(4-ethoxycarbonylphenyl)-N'-methyl-N'-benzamidinium, and N-(4-ethoxycarbonylphenyl)-N'-ethyl-N'-benzamidinium.

[0019] The antioxidant may include at least one selected from phosphorus compounds and phenolic compounds, wherein the phosphorus compounds include phosphites and the phenolic compounds include at least one selected from hydrogenated methyl cinnamate, phenylpropionic acid, tetra[methylene-3-(3',5'-di-tert-butyl-4'-hydroxyphenyl)propionate]methane and triethylene glycol bis(3-tert-butyl-4-hydroxy-5-methylphenyl)propionate.

[0020] A multilayer ceramic electronic component according to another embodiment may include: a ceramic body including a plurality of dielectric layers and a plurality of internal electrodes, the plurality of internal electrodes being configured such that the dielectric layers are located between the plurality of internal electrodes; an external electrode disposed on the exterior of the ceramic body; and a coating disposed on a portion of the outer surface of the ceramic body. The coating may include: a fluorine compound; and at least one selected from benzotriazole compounds, sebacic acid esters, formamidinium compounds, phenolic compounds, and phosphorus compounds.

[0021] The coating may include: a first layer comprising at least one of the benzotriazole compound, the sebacic acid ester compound, and the formamidinium compound, at least one of the phenolic compound and the phosphorus compound, and the fluorine compound; and a second layer disposed on the first layer and comprising the fluorine compound.

[0022] The coating may include: a first layer comprising at least one of the benzotriazole compound, the sebacic acid ester compound, and the formamidinium compound, at least one of the phenolic compound and the phosphorus compound, and the fluorine compound; a second layer disposed on the first layer and comprising at least one of the benzotriazole compound, the sebacic acid ester compound, and the formamidinium compound; a third layer disposed on the second layer and comprising at least one of the phenolic compound and the phosphorus compound; and a fourth layer disposed on the third layer and comprising the fluorine compound.

[0023] The coating may include: a first layer comprising at least one of the benzotriazole compound, the sebacic acid ester compound, and the formamidinium compound; a second layer disposed on the first layer and comprising at least one of the phenolic compound and the phosphorus compound; and a third layer disposed on the second layer and comprising the fluorine compound.

[0024] The coating may include: a first layer comprising at least one of the phenolic compound and the phosphorus compound; a second layer disposed on the first layer and comprising at least one of the benzotriazole compound, the sebacic acid ester compound, and the formamidinium compound; and a third layer disposed on the second layer and comprising the fluorine compound.

[0025] The coating may include: a first layer comprising at least one of the benzotriazole compound, the sebacic acid ester compound, and the formamidinium compound; and a second layer disposed on the first layer and comprising the fluorine compound.

[0026] The benzotriazole compounds may include hydroxyphenylbenzotriazole, the sebacate compounds may include at least one of bis(1,2,2,6,6-pentamethyl-4-piperidinyl) sebacate and bis(1-octyl-2,2,6,6-tetramethyl-4-piperidinyl) sebacate, the formamidinium compounds may include at least one of N-(4-alkoxycarbonylphenyl)-N'-alkyl-N'-benzamidinium, N-(4-methoxycarbonylphenyl)-N'-methyl-N'-benzamidinium, N-(4-ethoxycarbonylphenyl)-N'-methyl-N'-benzamidinium and N-(4-ethoxycarbonylphenyl)-N'-ethyl-N'-benzamidinium, and the fluorinated compounds may include at least one of fluorosilane compounds, perfluoropolyether (PFPE), polytetrafluoroethylene (PTFE), fluorinated ethylene propylene (FEP), and polyvinyl fluoride (PVF).

[0027] The phenolic compounds may include at least one of hydrogenated methyl cinnamate, phenylpropionic acid, tetra[methylene-3-(3',5'-di-tert-butyl-4'-hydroxyphenyl)propionate]methane and triethylene glycol bis(3-tert-butyl-4-hydroxy-5-methylphenyl)propionate, and the phosphorus compounds include phosphites.

[0028] At least one of the ceramic body and the external electrode may include components of the coating.

[0029] According to embodiments of multilayer ceramic electronic components, the effective capacity of multilayer ceramic electronic components can be increased, and the moisture resistance of multilayer ceramic electronic components can be improved by preventing the penetration of plating solution during the plating process.

[0030] However, it is readily understood that the effects of the embodiments are not limited to those described above, and various extensions can be made without departing from the concept and scope of this disclosure. Attached Figure Description

[0031] Figure 1 This is a schematic perspective view of a multilayer ceramic electronic assembly according to an embodiment.

[0032] Figure 2 It is shown Figure 1 An exploded three-dimensional view of the stacked structure of internal electrodes in a multilayer ceramic electronic component.

[0033] Figure 3 It is along Figure 1 The cross-sectional view taken from line II-II'.

[0034] Figures 4A to 4C This is a cross-sectional view of the manufacturing steps of a multilayer ceramic electronic component according to an embodiment.

[0035] Figure 5 This is a cross-sectional view showing a multilayer ceramic electronic assembly according to another embodiment.

[0036] Figure 6 This is a cross-sectional view showing a multilayer ceramic electronic component according to yet another embodiment.

[0037] Figure 7 This is a graph showing the waterproof coating performance of multilayer ceramic electronic components according to the embodiments and comparative examples.

[0038] Figure 8 This is a graph showing the waterproof coating performance of a multilayer ceramic electronic component according to another embodiment.

[0039] Figure 9 This is a graph showing the waterproof coating performance of a multilayer ceramic electronic component according to yet another embodiment. Detailed Implementation

[0040] In the following description, various embodiments of this disclosure will be detailed to enable those skilled in the art to readily implement the invention with reference to the accompanying drawings. For clarity in describing this disclosure, parts irrelevant to the description have been omitted from the drawings, and the same reference numerals are designated for the same or similar elements throughout the specification. Furthermore, some components in the drawings may be exaggerated, omitted, or shown schematically, and the dimensions of each component may not perfectly reflect the actual dimensions.

[0041] The accompanying drawings are provided only to facilitate understanding of the embodiments disclosed in this specification and should not be construed as limiting the concepts disclosed in this specification. It should be understood that this disclosure includes all variations, equivalents and alternatives without departing from the scope and concept of this disclosure.

[0042] Ordinal terms such as "first," "second," etc., will be used only to describe the various components and should not be interpreted as limiting them. These terms are only used to distinguish one component from others.

[0043] It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, it may be directly on the other element, or there may be an intermediate element present. In contrast, when an element is referred to as being "directly on" another element, there is no intermediate element present. Furthermore, in the specification, the terms "on" or "above" indicate that it is located above or below the object portion, and do not necessarily mean that it is located on the upper side of the object portion based on the direction of gravity.

[0044] It will also be understood that the terms “comprising / including” or “having” as used throughout the specification specify the presence of the stated features, quantities, steps, operations, components, parts, or combinations thereof, but do not exclude the presence or addition of one or more other features, quantities, steps, operations, components, parts, or combinations thereof. Therefore, unless explicitly stated otherwise, the words “comprising” and variations such as “including” or “containing” will be understood to imply the inclusion of the stated elements but not the exclusion of any other elements.

[0045] Furthermore, throughout the instruction manual, the phrase "in a plan view" refers to the view of the object from above, while the phrase "in a cross-sectional view" refers to the view of the cross-section taken by vertically cutting the object from the side.

[0046] Furthermore, throughout the specification, "connection" can refer not only to a situation where two or more components are directly connected, but also to a situation where two or more components are indirectly connected through other components, or to a situation where two or more components are physically and / or electrically connected, or to a situation where two or more components are called by different names according to their location or function, but are actually one unit.

[0047] Figure 1 This is a schematic perspective view of a multilayer ceramic electronic assembly according to an embodiment. Figure 2 It is shown Figure 1 An exploded three-dimensional view of the stacked structure of internal electrodes in a multilayer ceramic electronic component. Figure 3 It is along Figure 1 The cross-sectional view taken from line II-II'.

[0048] Reference Figures 1 to 3 According to this embodiment, the multilayer ceramic electronic component 100 includes a ceramic body 110, a first external electrode 120, a second external electrode 130, a plurality of first internal electrodes 150 and a plurality of second internal electrodes 160.

[0049] First, when defining directions to clearly describe this embodiment, the L-axis, W-axis, and T-axis shown in the figures represent axes indicating the length, width, and thickness directions of the multilayer ceramic electronic component 100, respectively.

[0050] The thickness direction (T-axis direction) can be a direction perpendicular to the wide surface (main surface) of the sheet component. For example, the thickness direction (T-axis direction) can be used to mean the same as the direction of the stacked dielectric layer 140.

[0051] The length direction (L-axis direction) can be a direction parallel to the wide surface (main surface) of the sheet assembly, and can be a direction intersecting (e.g., orthogonal) to the thickness direction (T-axis direction). For example, the length direction (L-axis direction) can be the direction in which the first external electrode 120 and the second external electrode 130 face each other.

[0052] The width direction (W-axis direction) can be a direction parallel to the wide surface (main surface) of the sheet component, and can be a direction that intersects (e.g., orthogonal) both the thickness direction (T-axis direction) and the length direction (L-axis direction).

[0053] The ceramic body 110 may have a generally hexahedral shape, but this embodiment is not limited to this. Due to shrinkage during sintering, the ceramic body 110 may have a generally hexahedral shape, although not a perfect hexahedral shape. For example, the ceramic body 110 may have a generally parallelepiped shape, but the corners or vertices may have a rounded shape.

[0054] In this embodiment, for ease of description, the surfaces facing each other in the length direction (L-axis direction) can be defined as the first surface S1 and the second surface S2, the surfaces facing each other in the width direction (W-axis direction) and connecting the first surface S1 and the second surface S2 can be defined as the third surface S3 and the fourth surface S4, and the surfaces facing each other in the thickness direction (T-axis direction) and connecting the first surface S1 and the second surface S2 can be defined as the fifth surface S5 and the sixth surface S6.

[0055] Therefore, the first direction, which is the direction in which the first surface S1 and the second surface S2 face each other, can be the length direction (L-axis direction), and the second and third directions, which are perpendicular to the first direction and perpendicular to each other, can be the thickness direction (T-axis direction) and the width direction (W-axis direction), or the width direction (W-axis direction) and the thickness direction (T-axis direction), respectively.

[0056] The length of the ceramic body 110 can be represented as the maximum length of a plurality of line segments that connect the two outermost boundary lines of the ceramic body 110 that face each other in the length direction (L-axis direction) and are parallel to the length direction (L-axis direction) in the cross-section at the center of the width direction (W-axis direction) of the ceramic body 110. Alternatively, the length of the ceramic body 110 can be represented as the minimum length of a plurality of line segments that connect the two outermost boundary lines of the ceramic body 110 that face each other in the length direction (L-axis direction) and are parallel to the length direction (L-axis direction). Optionally, the length of the ceramic body 110 can be represented as the arithmetic mean of the lengths of at least two line segments that connect the two outermost boundary lines of the ceramic body 110 that face each other in the length direction (L-axis direction) and are parallel to the length direction (L-axis direction) in the cross-section.

[0057] The thickness of the ceramic body 110 can be expressed as the maximum length of a plurality of line segments that connect the two outermost boundary lines of the ceramic body 110 facing each other in the thickness direction (T-axis direction) at the center of the width direction (W-axis direction) of the ceramic body 110 in the length direction (L-axis direction) - thickness direction (T-axis direction) in the cross-sectional image taken by an optical microscope or scanning electron microscope (SEM). Alternatively, the thickness of the ceramic body 110 can be expressed as the minimum length of a plurality of line segments that connect the two outermost boundary lines of the ceramic body 110 facing each other in the thickness direction (T-axis direction) in the cross-sectional image taken by an optical microscope or scanning electron microscope (SEM). Furthermore, the thickness of the ceramic body 110 can also be expressed as the arithmetic mean of the lengths of at least two line segments that connect the two outermost boundary lines of the ceramic body 110 facing each other in the thickness direction (T-axis direction) in the cross-sectional image taken by an optical microscope or scanning electron microscope (SEM).

[0058] The width of the ceramic body 110 can be represented by the maximum length of a plurality of line segments that connect the two outermost boundary lines of the ceramic body 110 facing each other in the width direction (W-axis direction) and parallel to the width direction (W-axis direction) in an optical microscope or scanning electron microscope (SEM) photograph of a cross-section at the center of the ceramic body 110 in the thickness direction (T-axis direction) and in the length direction (L-axis direction) - width direction (W-axis direction). Alternatively, the width of the ceramic body 110 can be represented by the minimum length of a plurality of line segments that connect the two outermost boundary lines of the ceramic body 110 facing each other in the width direction (W-axis direction) and are parallel to the width direction (W-axis direction). On the other hand, the width of the ceramic body 110 can be represented by the arithmetic mean of the lengths of at least two line segments that connect the two outermost boundary lines of the ceramic body 110 facing each other in the width direction (W-axis direction) and are parallel to the width direction (W-axis direction) in the cross-section.

[0059] The ceramic body 110 may include multiple dielectric layers 140 stacked in the thickness direction (T-axis direction). The boundaries between the dielectric layers 140 may not be clear. For example, it may be difficult to see the boundaries between the dielectric layers 140 without using a scanning electron microscope (SEM), and the multiple dielectric layers 140 may appear as a monolithic structure.

[0060] The first inner electrode 150 and the second inner electrode 160 may be stacked alternately with a dielectric layer 140 between them. This stacking structure may be repeated within the ceramic body 110. The inner electrode closest to the fifth surface S5 of the ceramic body 110 may be either the first inner electrode 150 or the second inner electrode 160, and the inner electrode closest to the sixth surface S6 may be either the first inner electrode 150 or the second inner electrode 160.

[0061] The first inner electrode 150 and the second inner electrode 160 have different polarities and can be electrically insulated from each other by a dielectric layer 140 disposed between them.

[0062] The first inner electrode 150 and the second inner electrode 160 may be configured to be biased against each other in the longitudinal direction (L-axis direction) through a dielectric layer 140. The end of the first inner electrode 150 may be exposed through a first surface S1 of the ceramic body 110, and the end of the second inner electrode 160 may be exposed through a second surface S2 of the ceramic body 110. The end of the first inner electrode 150 exposed from the first surface S1 of the ceramic body 110 may be connected to the first outer electrode 120. The end of the second inner electrode 160 exposed from the second surface S2 of the ceramic body 110 may be connected to the second outer electrode 130.

[0063] The first inner electrode 150 and the second inner electrode 160 can be formed by printing a conductive paste containing a conductive metal onto the surface of the dielectric layer 140. For example, the inner electrodes can be formed by printing a conductive paste containing nickel (Ni) or a nickel (Ni) alloy onto the surface of the dielectric layer using screen printing or gravure printing. However, this embodiment is not limited to this.

[0064] For example, the average thickness of the first inner electrode 150 and the second inner electrode 160 can typically be greater than or equal to 0.1 μm and less than or equal to 2 μm.

[0065] Here, the thickness of the inner electrode can refer to the average thickness of an inner electrode disposed between two dielectric layers. Based on a 10,000x magnified scanning electron microscope (SEM) image of a cross-section at the central portion of the ceramic body 110 in the width direction (W-axis direction) and length direction (L-axis direction) versus thickness direction (T-axis direction), the average thickness of the inner electrode can be the arithmetic mean of values ​​obtained by measuring the thickness of one inner electrode shown in the aforementioned cross-sectional image at 30 points with uniform intervals in the length direction (L-axis direction). These 30 points can be specified in the effective area described later. By measuring the average thickness of each of the 10 inner electrodes in this way and then obtaining the arithmetic mean of the measured values, the average thickness of the inner electrode can be more generalized.

[0066] When a voltage is applied to the first external electrode 120 and the second external electrode 130, charge accumulates between the first internal electrode 150 and the second internal electrode 160, which face each other. That is, capacitance can be obtained between the first internal electrode 150, which is electrically connected to the first external electrode 120, and the second internal electrode 160, which is electrically connected to the second external electrode 130. The capacitance of the multilayer ceramic electronic component 100 is proportional to the stacked area of ​​the first internal electrode 150 and the second internal electrode 160, which are stacked together along the thickness direction (T-axis direction).

[0067] In other words, the multilayer ceramic electronic assembly 100 may include an effective region and an edge region. The effective region may refer to the area where the first inner electrode 150 and the second inner electrode 160 are stacked along the thickness direction (T-axis direction), and the edge region may refer to the area between the first surface S1 of the ceramic body 110 and the effective region, and the area between the second surface S2 of the ceramic body 110 and the effective region.

[0068] Multilayer ceramic electronic components 100 are classified based on their length and width. Therefore, even in multilayer ceramic electronic components with the same length and width, the size of the ceramic body can vary depending on the thickness of the external electrode. That is, the ceramic body of a multilayer ceramic electronic component with a thinner external electrode can be larger than the ceramic body of a multilayer ceramic electronic component with a thicker external electrode. A larger ceramic body indicates a larger effective area, and further, a larger capacitance. Consequently, the capacitance can increase as the external electrode of the multilayer ceramic electronic component becomes thinner. In this embodiment, by forming a thin electrode layer on the first and second surfaces of the ceramic body, the thickness of the external electrode can be reduced, and beneficial effects can be obtained accordingly.

[0069] The first cover layer 143 and the second cover layer 145 may be disposed outside the effective area in the thickness direction (T-axis direction).

[0070] The first cover layer 143 is disposed between the fifth surface S5 of the ceramic body 110 and the inner electrode closest to the fifth surface S5. The second cover layer 145 is disposed between the sixth surface S6 of the ceramic body 110 and the inner electrode closest to the sixth surface S6.

[0071] That is, in the ceramic body 110, the first capping layer 143 can be disposed above the uppermost inner electrode, and the second capping layer 145 can be disposed below the lowermost inner electrode. The composition of the first capping layer 143 and the second capping layer 145 can be the same as the composition of the dielectric layer 140. The first capping layer 143 and the second capping layer 145 can be formed by stacking one or more dielectric layers on the outer surfaces of the uppermost inner electrode and the lowermost inner electrode, respectively.

[0072] The first cover layer 143 and the second cover layer 145 can be used to prevent damage to the first inner electrode 150 and the second inner electrode 160 due to physical or chemical stress.

[0073] The dielectric layer 140 may comprise a ceramic material having a high dielectric constant. For example, the ceramic material may comprise a dielectric ceramic containing components such as BaTiO3, CaTiO3, SrTiO3, or CaZrO3. Furthermore, these components may also include auxiliary components such as manganese (Mn) compounds, iron (Fe) compounds, chromium (Cr) compounds, cobalt (Co) compounds, and nickel (Ni) compounds. For example, the dielectric layer may be a (BaTiO3) where calcium (Ca), zirconium (Zr), etc., are partially dissolved in BaTiO3. 1-x Ca x TiO3, Ba(Ti 1-y Ca y O3、(Ba 1-x Ca x (Ti) 1-yZr y O3, Ba(Ti 1-y Zr y O3, etc., but this disclosure is not limited to these.

[0074] In addition, the dielectric layer 140 may also include at least one of ceramic additives, organic solvents, plasticizers, binders, and dispersants. The ceramic additives may be, for example, transition metal oxides or carbides, rare earth elements, magnesium (Mg), aluminum (Al), etc.

[0075] For example, the average thickness of the dielectric layer 140 can be from 0.1 μm to 10 μm, but this embodiment is not limited to this.

[0076] The first external electrode 120 and the second external electrode 130 may be provided with voltages of different polarities and may be electrically connected to the exposed portions of the first internal electrode 150 and the second internal electrode 160, respectively.

[0077] The first external electrode 120 and the second external electrode 130 are disposed on the exterior of the ceramic body 110. The first external electrode 120 and the second external electrode 130 may be disposed on both sides of the ceramic body 110 in the first direction.

[0078] The first external electrode 120 may be disposed on the first surface S1 of the ceramic body 110 and may extend to a portion of at least one of the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6. The second external electrode 130 may be disposed on the second surface S2 of the ceramic body 110 and may extend to a portion of at least one of the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6.

[0079] The first external electrode 120 and the second external electrode 130 may include a connecting portion and a strip portion. The connecting portion may be disposed on a first surface S1 or a second surface S2 of the ceramic body 110 and connected to an exposed portion of the first internal electrode 150 or an exposed portion of the second internal electrode 160. The strip portion may extend from the connecting portion and be disposed on a portion of at least one of the third surface S3, the fourth surface S4, the fifth surface S5, and the sixth surface S6 of the ceramic body 110.

[0080] The first external electrode 120 and the second external electrode 130 may include at least one of a conductive metal (such as copper (Cu), silver (Ag), or nickel (Ni)), and may also include glass and epoxy resin, etc. The first external electrode 120 and the second external electrode 130 may be formed by coating a conductive paste comprising a metal and sintering the conductive paste.

[0081] In addition, the multilayer ceramic electronic component 100 may also include a first plating layer 180 and a second plating layer 190.

[0082] A first plating layer 180 covers the first external electrode 120. The first plating layer 180 may include a first layer for ensuring the mechanical, electrical, and chemical stability of the external electrode, and a second layer made of a low-melting-point material to enable the soldering of multilayer ceramic electronic components. The first layer may be disposed on the first external electrode 120, and the second layer may be disposed on the first layer. The first layer may include nickel (Ni), and the second layer may include tin (Sn), but this embodiment is not limited thereto.

[0083] The second plating layer 190 covers the second external electrode 130. The second plating layer 190 may include a first layer and a second layer. The first layer may be disposed on the second external electrode 130, and the second layer may be disposed on the first layer. The first layer may include nickel (Ni), and the second layer may include tin (Sn), but this embodiment is not limited thereto.

[0084] The multilayer ceramic electronic assembly 100 according to this embodiment may include a coating 170 disposed on a portion of the outer surface of the ceramic body 110. The coating 170 may be disposed on the portion of the outer surface of the ceramic body 110 other than the portion where the first external electrode 120 and the second external electrode 130 are disposed.

[0085] Coating 170 may include a water-repellent coating agent to prevent plating solution from penetrating through the density-reduced portion of the external electrode or the lift portion between the external electrode and the ceramic body during the process of forming the coating on the external electrode. Furthermore, coating 170 may include at least one of a heat stabilizer and an antioxidant to prevent the coating from being damaged by the formation of free radicals from the water-repellent coating agent due to heat.

[0086] Here, the heat stabilizer removes free radicals generated from the waterproof coating agent, and the antioxidant decomposes free radical forming factors. Referring to reaction formula 1, when heat is applied to the waterproof coating agent component composed of the molecular formula R·H, free radicals ROO· are formed, and the heat stabilizer reacts with the free radicals ROO· to ​​remove the free radicals.

[0087] [Reaction Formula 1]

[0088] Here, the free radical ROO· combines with R·H to form ROOH (a free radical forming factor), and as shown in reaction formula 2, the antioxidant reacts with ROOH to decompose ROOH into ROH. Therefore, the decomposition of ROOH into RO· and ·OH to form free radicals can be prevented.

[0089] [Reaction 2]

[0090] In reactions 1 and 2, R can be a moiety of a hydrocarbon or a hydrocarbon derivative (e.g., a haloalkanes), such as a moiety of a fluorinated hydrocarbon in which at least one hydrogen atom is replaced by fluorine (F). Here, "moiety" refers to the remaining portion of an organic compound after the loss of some atoms.

[0091] Coating 170 can be formed using a single layer comprising at least one of a heat stabilizer and an antioxidant, and a waterproofing agent, or it can be formed using multiple layers, each comprising a heat stabilizer, an antioxidant, and a waterproofing agent. Various modifications are possible; for example, coating 170 can be formed using a single layer comprising all of a waterproofing agent, a heat stabilizer, and an antioxidant, or it can further include a layer comprising a waterproofing agent. Coating 170 can be formed using a first layer comprising a heat stabilizer, a second layer comprising an antioxidant, and a third layer comprising a waterproofing agent. Coating 170 can be formed using a first layer comprising an antioxidant, a second layer comprising a heat stabilizer, and a third layer comprising a waterproofing agent. Furthermore, coating 170 can be formed using a first layer comprising a heat stabilizer and a second layer comprising a waterproofing agent, or it can be formed using a first layer comprising all of a waterproofing agent, a heat stabilizer, and an antioxidant, a second layer comprising a heat stabilizer, a third layer comprising an antioxidant, and a fourth layer comprising a waterproofing agent.

[0092] Waterproof coating agents may include fluorinated compounds, and may include at least one of, for example, fluorosilane compounds, perfluoropolyether (PFPE), polytetrafluoroethylene (PTFE), fluorinated ethylene propylene (FEP), and polyvinyl fluoride (PVF).

[0093] The heat stabilizer removes free radicals generated from the waterproof coating agent and may include at least one of benzotriazole compounds, sebacic acid esters, and formamidinium compounds. For example, benzotriazole compounds may include hydroxyphenylbenzotriazole, sebacic acid esters may include at least one of bis(1,2,2,6,6-pentamethyl-4-piperidinyl) sebacic acid ester and bis(1-octyl-2,2,6,6-tetramethyl-4-piperidinyl) sebacic acid ester, and formamidinium compounds may include at least one of N-(4-alkoxycarbonylphenyl)-N'-alkyl-N'-benzamidinium, N-(4-methoxycarbonylphenyl)-N'-methyl-N'-benzamidinium, N-(4-ethoxycarbonylphenyl)-N'-methyl-N'-benzamidinium, and N-(4-ethoxycarbonylphenyl)-N'-ethyl-N'-benzamidinium.

[0094] Antioxidants break down free radical forming factors and may include at least one of phenolic compounds and phosphorus compounds. For example, phenolic compounds may include at least one of hydrogenated methyl cinnamate, phenylpropionic acid, tetramethyl-3-(3',5'-di-tert-butyl-4'-hydroxyphenyl)propionate, and triethylene glycol bis(3-tert-butyl-4-hydroxy-5-methylphenyl)propionate, and phosphorus compounds may include phosphite compounds.

[0095] At least one of the first external electrode 120, the second external electrode 130, and the ceramic body 110 may include the aforementioned components of the coating 170. Specifically, the components of the coating 170 may fill the gaps on the surfaces of the first external electrode 120 and the second external electrode 130, or the gaps on the surface of the ceramic body 110, or fill the raised portions between the ceramic body 110 and the first external electrode 120 and the second external electrode 130, to prevent moisture from penetrating into the ceramic body 110.

[0096] In this embodiment, the coating 170 includes: a first layer 171, including a heat stabilizer, an antioxidant, and a waterproof coating agent; and a second layer 173, disposed on the first layer 171 and including a waterproof coating agent.

[0097] The ceramic body 110, the first external electrode 120, and the second external electrode 130 may include component 171a of the first layer 171. In particular, component 171a, which is mixed with a heat stabilizer, an antioxidant, and a waterproof coating agent, may fill the gaps on the surfaces of the first external electrode 120 and the second external electrode 130 or the gaps on the surface of the ceramic body 110, or fill the boundary between the ceramic body 110 and the first external electrode 120 and the second external electrode 130.

[0098] According to this embodiment, since the first layer 171 includes all of the heat stabilizer, antioxidant, and waterproof coating agent, free radicals formed by heat energy can be removed, and the deterioration of the first layer 171 can be suppressed by decomposing free radical forming factors. Furthermore, since the second layer 173 is disposed on the first layer 171, the waterproof performance of the coating 170 can be further improved.

[0099] In the following text, reference will be made to Figures 4A to 4C The process for manufacturing multilayer ceramic electronic components according to the embodiments is described in detail. Figures 4A to 4C This is a cross-sectional view of the manufacturing steps of a multilayer ceramic electronic component according to an embodiment.

[0100] Reference Figure 4AA first layer 171 comprising a heat stabilizer, an antioxidant, and a waterproof coating agent, and a second layer 173 comprising a waterproof coating agent can be formed on the outer surface of the ceramic body 110 and the outer surfaces of the first external electrode 120 and the second external electrode 130. Here, component 171a of the first layer 171 can fill the gaps in the surfaces of the first external electrode 120 and the second external electrode 130 or the gaps in the surface of the ceramic body 110, or fill the boundary between the ceramic body 110 and the first external electrode 120 and the second external electrode 130.

[0101] Specifically, the first layer 171 can be formed by coating a slurry containing a heat stabilizer, an antioxidant, and a waterproofing agent onto the outer surface of the ceramic body 110 and the outer surfaces of the first external electrode 120 and the second external electrode 130, and then drying it. The heat stabilizer can be mixed in an amount of 1 to 10 parts by weight per 100 parts by weight of the waterproofing agent, and the antioxidant can be mixed in an amount of 1 to 10 parts by weight per 100 parts by weight of the waterproofing agent.

[0102] Reference Figure 4B The coating 170 formed on the outer surfaces of the first external electrode 120 and the second external electrode 130 is removed by dry polishing or wet polishing. Even after removing the coating 170, components 171a of the first layer 171 filling the outer surfaces of the first external electrode 120 and the second external electrode 130 may remain. In this case, ROH may remain as component 171a of the first layer 171, where R can be a hydrocarbon group, for example, a hydrocarbon group in which at least one hydrogen atom is replaced by fluorine (F). Therefore, the outer surfaces of the first external electrode 120 and the second external electrode 130 can be completely sealed.

[0103] Reference Figure 4C A first plating layer 180 and a second plating layer 190 are formed on the outer surfaces of the first external electrode 120 and the second external electrode 130 after the coating 170 has been removed. Since the ceramic body 110, the first external electrode 120 and the second external electrode 130 are sealed by the coating 170, the penetration of the plating solution during the plating process can be suppressed.

[0104] In the following text, reference will be made to Figure 5 and Figure 6 A more detailed description is provided of the multilayer ceramic electronic components according to the various embodiments. Figure 5 This is a cross-sectional view showing a multilayer ceramic electronic assembly according to another embodiment. Figure 6 This is a cross-sectional view showing a multilayer ceramic electronic component according to yet another embodiment.

[0105] Figure 5 and Figure 6 The multilayer ceramic electronic component shown has the same characteristics as the reference. Figures 1 to 3The multilayer ceramic electronic components described in the embodiments have a substantially the same construction. In the following, different constructions will be described, and the same constructions will use the same reference numerals. Constructions not described separately may be interchangeable with those described elsewhere. Figures 1 to 3 The embodiments shown are constructed in the same manner.

[0106] Reference Figure 5 The multilayer ceramic electronic component according to this embodiment includes a coating 170 disposed on a portion of the outer surface of a ceramic body 110. The coating 170 may be disposed on the portion of the outer surface of the ceramic body 110 other than the portion where the first external electrode 120 and the second external electrode 130 are disposed.

[0107] The coating 170 includes: a first layer 171, including a heat stabilizer, an antioxidant, and a waterproof coating agent; a second layer 173, disposed on the first layer 171 and including a heat stabilizer; a third layer 175, disposed on the second layer 173 and including an antioxidant; and a fourth layer 177, disposed on the third layer 175 and including a waterproof coating agent.

[0108] The ceramic body 110, the first external electrode 120, and the second external electrode 130 may include component 171a of the first layer 171. In particular, component 171a, which is mixed with a heat stabilizer, an antioxidant, and a waterproof coating agent, may fill the gaps on the surfaces of the first external electrode 120 and the second external electrode 130 or the gaps on the surface of the ceramic body 110, or fill the boundary between the ceramic body 110 and the first external electrode 120 and the second external electrode 130.

[0109] Reference Figure 6 The multilayer ceramic electronic component according to this embodiment includes a coating 170 disposed on a portion of the outer surface of a ceramic body 110. The coating 170 may be disposed on the portion of the outer surface of the ceramic body 110 other than the portion where the first external electrode 120 and the second external electrode 130 are disposed.

[0110] The coating 170 includes: a first layer 171 including a heat stabilizer; a second layer 173 disposed on the first layer 171 and including an antioxidant; and a third layer 175 disposed on the second layer 173 and including a waterproof coating agent.

[0111] The ceramic body 110, the first external electrode 120, and the second external electrode 130 may include component 171a of the first layer 171. In particular, component 171a, including a heat stabilizer, may fill the gaps on the surfaces of the first external electrode 120 and the second external electrode 130 or the gaps on the surface of the ceramic body 110, or fill the boundary between the ceramic body 110 and the first external electrode 120 and the second external electrode 130.

[0112] Experimental Example 1 In the following text, reference will be made to Figure 7 Describe the moisture-proof reliability of the embodiments and comparative examples.

[0113] Figure 7 This is a graph showing the waterproof coating performance of multilayer ceramic electronic components according to the embodiments and comparative examples. Figure 7 In the diagram, solid lines (a) represent examples, and dashed lines (b) represent comparative examples.

[0114] exist Figure 7 In the embodiment, the multilayer ceramic electronic component has the following characteristics: Figures 1 to 3 The diagram illustrates a multilayer ceramic electronic assembly with a coating structure disposed on a portion of the outer surface of a ceramic body. Specifically, the coating has a structure comprising a first layer (including a heat stabilizer, antioxidant, and waterproofing agent) and a second layer (disposed on the first layer and including the waterproofing agent). Furthermore, in the comparative example, the coating contains only the waterproofing agent.

[0115] Specifically, a slurry obtained by mixing a heat stabilizer, an antioxidant, and a waterproof coating agent is applied to the outer surface of a ceramic body and the outer surfaces of the first and second external electrodes and dried to form a first layer. A slurry containing the waterproof coating agent is then applied to the formed first layer and dried to form a second layer. Here, perfluoropolyether (PFPE), a fluorinated compound, is used as the waterproof coating agent, hydroxyphenylbenzotriazole is used as the heat stabilizer, and phenylpropionic acid is used as the antioxidant. The heat stabilizer and the antioxidant are used at a ratio of 10 parts by weight per 100 parts by weight of the waterproof coating agent.

[0116] The performance of waterproof coatings is measured using contact angle measurement methods, specifically the static contact angle measurement method (sessile drop method). Specifically, a multilayer ceramic electronic component wafer is exposed to 85°C and 85% RH (relative humidity) for a specific period (e.g., 250 hours, 500 hours, 750 hours, and 1000 hours), with a droplet placed on the wafer surface. The resulting contact angle is measured using optical instruments.

[0117] Reference Figure 7 In the case of the embodiment (solid line (a)), even after 2000 hours, the contact angle remained greater than or equal to 100 degrees, demonstrating good waterproof performance. However, in the case of the comparative example (dashed line (b)), the contact angle rapidly decreased after 1500 hours, dropping below 90 degrees. This is because the waterproof coating agent constituting the coating in the comparative example formed free radicals through heat, thereby damaging the coating. Therefore, in the case of the embodiment, it can be seen that the moisture resistance was significantly improved compared to the comparative example.

[0118] Experiment Example 2 In the following text, reference will be made to Figure 8 The moisture-proof reliability of a multilayer ceramic electronic component according to another embodiment is described.

[0119] Figure 8 This is a graph showing the waterproof coating performance of a multilayer ceramic electronic component according to another embodiment.

[0120] exist Figure 8 In another embodiment, the multilayer ceramic electronic component has the following characteristics: Figure 5 The diagram illustrates a multilayer ceramic electronic component with a coating structure disposed on a portion of the outer surface of a ceramic body. Specifically, the coating comprises: a first layer including a heat stabilizer, an antioxidant, and a waterproofing agent; a second layer disposed on the first layer and including a heat stabilizer; a third layer disposed on the second layer and including an antioxidant; and a fourth layer disposed on the third layer and including a waterproofing agent.

[0121] Specifically, a slurry obtained by mixing a heat stabilizer, an antioxidant, and a waterproof coating agent is applied to the outer surface of a ceramic body and the outer surfaces of the first and second external electrodes and dried to form a first layer. A slurry containing a heat stabilizer is then applied to the first layer and dried to form a second layer. A slurry containing an antioxidant is then applied to the second layer and dried to form a third layer. Finally, a slurry containing a waterproof coating agent is applied to the third layer and dried to form a fourth layer. Here, perfluoropolyether (PFPE), a fluorinated compound, is used as the waterproof coating agent, hydroxyphenylbenzotriazole is used as the heat stabilizer, and phenylpropionic acid, a phenolic compound, is used as the antioxidant. The heat stabilizer and the antioxidant are used at a ratio of 10 parts by weight per 100 parts by weight of the waterproof coating agent.

[0122] The performance of waterproof coatings is measured using contact angle measurement methods, specifically the static contact angle measurement method (horizontal drop method). Specifically, a multilayer ceramic electronic component wafer is exposed to 85°C and 85% RH (relative humidity) for a specific period of time (e.g., 250 hours, 500 hours, 750 hours, and 1000 hours), and a droplet is placed on the wafer surface. The resulting contact angle is measured using optical instruments.

[0123] Reference Figure 8 As can be seen, in this embodiment, even after 2000 hours, the contact angle remains greater than or equal to 100 degrees, demonstrating good waterproof performance. Therefore, in this embodiment, it can be seen that the moisture resistance is significantly improved.

[0124] Experimental Example 3 In the following text, reference will be made to Figure 9 The moisture-proof reliability of multilayer ceramic electronic components according to various embodiments is described.

[0125] Figure 9 This is a graph showing the waterproof coating performance of a multilayer ceramic electronic component according to yet another embodiment. Figure 9 In the diagram, the dashed line (c) represents Example 1, and the solid line (d) represents Example 2.

[0126] exist Figure 9 In the example, the multilayer ceramic electronic component according to Embodiment 1 has the following characteristics: Figure 6 The diagram illustrates a multilayer ceramic electronic assembly with a coating structure disposed on a portion of the outer surface of a ceramic body. Specifically, the coating comprises: a first layer including a heat stabilizer; a second layer disposed on the first layer and including an antioxidant; and a third layer disposed on the second layer and including a waterproof coating agent. Furthermore, in the multilayer ceramic electronic assembly according to Embodiment 2, the coating is disposed on a portion of the outer surface of the ceramic body and comprises: a first layer including an antioxidant; a second layer disposed on the first layer and including a heat stabilizer; and a third layer disposed on the second layer and including a waterproof coating agent.

[0127] Specifically, in Example 1, a slurry containing a heat stabilizer is coated onto the outer surface of the ceramic body and the outer surfaces of the first and second external electrodes and dried to form a first layer. A slurry containing an antioxidant is then coated onto the first layer and dried to form a second layer. Finally, a slurry containing a waterproof coating agent is coated onto the second layer and dried to form a third layer. Similarly, in Example 2, a slurry containing an antioxidant is coated onto the outer surface of the ceramic body and the outer surfaces of the first and second external electrodes and dried to form a first layer. A slurry containing a heat stabilizer is then coated onto the first layer and dried to form a second layer. Finally, a slurry containing a waterproof coating agent is coated onto the second layer and dried to form a third layer. Here, perfluoropolyether (PFPE), a fluorinated compound, is used as the waterproof coating agent, hydroxyphenylbenzotriazole is used as the heat stabilizer, and phenylpropionic acid, a phenolic compound, is used as the antioxidant.

[0128] At this time, a heat stabilizer is used at a rate of 10 parts by weight per 100 parts by weight of the waterproof coating agent, and an antioxidant is used at a rate of 10 parts by weight per 100 parts by weight of the waterproof coating agent.

[0129] The performance of waterproof coatings is measured using contact angle measurement methods, specifically the static contact angle measurement method (horizontal drop method). Specifically, a multilayer ceramic electronic component wafer is exposed to 85°C and 85% RH (relative humidity) for a specific period of time (e.g., 250 hours, 500 hours, 750 hours, and 1000 hours), and a droplet is placed on the wafer surface. The resulting contact angle is measured using optical instruments.

[0130] Reference Figure 9 As can be seen, in Example 1 (dashed line (c)), the contact angle remained at 120 degrees even after 2400 hours, demonstrating good waterproof performance. Similarly, in Example 2 (solid line (d)), the contact angle remained almost 120 degrees even after 2400 hours, also exhibiting good waterproof performance. Therefore, in Examples 1 and 2, it can be seen that the moisture resistance was significantly improved.

[0131] While embodiments of the present disclosure have been described above, the present disclosure is not limited thereto, and various modifications may be made within the scope of the claims, detailed description and drawings, and these modifications naturally fall within the scope of the present disclosure.

Claims

1. A multilayer ceramic electronic component, comprising: A ceramic body includes multiple dielectric layers and multiple internal electrodes, wherein the multiple internal electrodes are configured such that the dielectric layers are located between the multiple internal electrodes; The external electrode is disposed on the outside of the ceramic body; as well as A coating is applied to a portion of the outer surface of the ceramic body. The coating includes: Waterproof coating agent; and At least one of a heat stabilizer and an antioxidant, wherein the heat stabilizer removes free radicals generated from the waterproof coating agent, and the antioxidant decomposes free radical forming factors.

2. The multilayer ceramic electronic component as described in claim 1, wherein, The coating comprises: a first layer comprising the heat stabilizer, the antioxidant, and the waterproofing agent; and a second layer disposed on the first layer and comprising the waterproofing agent.

3. The multilayer ceramic electronic component as described in claim 1, wherein, The coating comprises: The first layer includes the heat stabilizer, the antioxidant, and the waterproof coating agent; The second layer is disposed on the first layer and includes the heat stabilizer; A third layer, disposed on the second layer and including the antioxidant; and The fourth layer is disposed on the third layer and includes the waterproof coating agent.

4. The multilayer ceramic electronic component as described in claim 1, wherein, The coating comprises: The first layer includes the heat stabilizer; A second layer, disposed on the first layer and including the antioxidant; and The third layer is disposed on the second layer and includes the waterproof coating agent.

5. The multilayer ceramic electronic component as described in claim 1, wherein, The coating comprises: The first layer includes the antioxidant; A second layer, disposed on the first layer and including the heat stabilizer; and The third layer is disposed on the second layer and includes the waterproof coating agent.

6. The multilayer ceramic electronic component as described in claim 1, wherein, The coating comprises: The first layer includes the heat stabilizer; and The second layer is disposed on the first layer and includes the waterproof coating agent.

7. The multilayer ceramic electronic component as described in claim 1, wherein, The coating is applied to the outer surface of the ceramic body, excluding the portion where the external electrode is located.

8. The multilayer ceramic electronic component as described in claim 1, wherein, At least one of the ceramic body and the external electrode includes components of the coating.

9. The multilayer ceramic electronic component according to any one of claims 1 to 8, wherein, The waterproof coating agent includes fluorinated compounds selected from the group consisting of fluorosilane compounds, perfluoropolyethers, polytetrafluoroethylene, fluorinated ethylene propylene, and polyvinyl fluoride.

10. The multilayer ceramic electronic component according to any one of claims 1 to 8, wherein, The heat stabilizer comprises at least one compound selected from the group consisting of benzotriazole compounds, sebacic acid esters, and formamidinides, wherein the benzotriazole compounds include hydroxyphenylbenzotriazole, the sebacic acid esters include at least one of bis(1,2,2,6,6-pentamethyl-4-piperidinyl) sebacic acid ester and bis(1-octyl-2,2,6,6-tetramethyl-4-piperidinyl) sebacic acid ester, and the formamidinides include at least one of N-(4-alkoxycarbonylphenyl)-N'-alkyl-N'-benzamidinide, N-(4-methoxycarbonylphenyl)-N'-methyl-N'-benzamidinide, N-(4-ethoxycarbonylphenyl)-N'-methyl-N'-benzamidinide, and N-(4-ethoxycarbonylphenyl)-N'-ethyl-N'-benzamidinide.

11. The multilayer ceramic electronic component according to any one of claims 1 to 8, wherein, The antioxidant comprises at least one compound selected from the group consisting of phosphorus compounds and phenolic compounds, wherein the phosphorus compounds include phosphites and the phenolic compounds include at least one selected from hydrogenated methyl cinnamate, phenylpropionic acid, tetra[methylene-3-(3',5'-di-tert-butyl-4'-hydroxyphenyl)propionate]methane and triethylene glycol bis(3-tert-butyl-4-hydroxy-5-methylphenyl)propionate.

12. The multilayer ceramic electronic component as claimed in claim 1, wherein, The heat stabilizer is present in an amount of 1 to 10 parts by weight per 100 parts by weight of the waterproof coating agent, and The antioxidant is present in an amount of 1 to 10 parts by weight per 100 parts by weight of the waterproof coating agent.

13. A multilayer ceramic electronic component, comprising: A ceramic body includes multiple dielectric layers and multiple internal electrodes, wherein the multiple internal electrodes are configured such that the dielectric layers are located between the multiple internal electrodes; The external electrode is disposed on the outside of the ceramic body; as well as A coating is applied to a portion of the outer surface of the ceramic body. The coating includes: Fluorine compounds; and At least one compound selected from the group consisting of benzotriazole compounds, sebacic acid esters, formamidinates, phenolic compounds, and phosphorus compounds.

14. The multilayer ceramic electronic component as described in claim 13, wherein, The coating comprises: The first layer includes at least one compound selected from the group consisting of the benzotriazole compounds, the sebacic acid esters, and the formamidinates; at least one compound selected from the group consisting of the phenolic compounds and the phosphorus compounds; and the fluorine compounds; and The second layer is disposed on the first layer and includes the fluorine compound.

15. The multilayer ceramic electronic component as described in claim 13, wherein, The coating comprises: The first layer includes at least one compound selected from the group consisting of the benzotriazole compounds, the sebacic acid esters and the formamidinium compounds, at least one compound selected from the group consisting of the phenolic compounds and the phosphorus compounds, and the fluorine compounds; The second layer is disposed on the first layer and includes at least one compound selected from the group consisting of the benzotriazole compounds, the sebacic acid ester compounds, and the formamidin compounds; A third layer, disposed on the second layer and comprising at least one compound selected from the group consisting of the phenolic compounds and the phosphorus compounds; and The fourth layer is disposed on the third layer and includes the fluorine compound.

16. The multilayer ceramic electronic component as described in claim 13, wherein, The coating comprises: The first layer includes at least one compound selected from the group consisting of the benzotriazole compounds, the sebacic acid ester compounds, and the formamidin compounds; A second layer, disposed on the first layer and comprising at least one compound selected from the group consisting of the phenolic compounds and the phosphorus compounds; and The third layer is disposed on the second layer and includes the fluorine compound.

17. The multilayer ceramic electronic component as described in claim 13, wherein, The coating comprises: The first layer includes at least one compound selected from the group consisting of the phenolic compounds and the phosphorus compounds; The second layer, disposed on the first layer, includes at least one compound selected from the group consisting of the benzotriazole compounds, the sebacic acid ester compounds, and the formamidinates; and The third layer is disposed on the second layer and includes the fluorine compound.

18. The multilayer ceramic electronic component as described in claim 13, wherein, The coating comprises: The first layer comprises at least one compound selected from the group consisting of the benzotriazole compounds, the sebacic acid ester compounds, and the formamidinates; and The second layer is disposed on the first layer and includes the fluorine compound.

19. The multilayer ceramic electronic component as described in any one of claims 13-18, wherein, The benzotriazole compounds include hydroxyphenylbenzotriazole. The sebacic acid esters include at least one of bis(1,2,2,6,6-pentamethyl-4-piperidinyl) sebacic acid ester and bis(1-octyl-2,2,6,6-tetramethyl-4-piperidinyl) sebacic acid ester. The formamidinium compounds include at least one selected from N-(4-alkoxycarbonylphenyl)-N'-alkyl-N'-benzamidinium, N-(4-methoxycarbonylphenyl)-N'-methyl-N'-benzamidinium, N-(4-ethoxycarbonylphenyl)-N'-methyl-N'-benzamidinium, and N-(4-ethoxycarbonylphenyl)-N'-ethyl-N'-benzamidinium. The fluorinated compounds include at least one of fluorosilane compounds, perfluoropolyethers, polytetrafluoroethylene, fluorinated ethylene propylene, and polyvinyl fluoride.

20. The multilayer ceramic electronic component as described in any one of claims 13-18, wherein, The phenolic compounds include at least one selected from hydrogenated methyl cinnamate, phenylpropionic acid, tetra[methylene-3-(3',5'-di-tert-butyl-4'-hydroxyphenyl)propionate]methane and triethylene glycol bis(3-tert-butyl-4-hydroxy-5-methylphenyl)propionate, and The phosphorus compounds include phosphite compounds.

21. The multilayer ceramic electronic component as described in claim 13, wherein, At least one of the ceramic body and the external electrode includes components of the coating.

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