Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component. The multilayer electronic component includes a main body including dielectric layers and first and second internal electrodes alternately arranged with the dielectric layers interposed between the first and second internal electrodes, a first external electrode provided on the main body and connected to the first internal electrode, and a second external electrode provided on the main body, connected to the second internal electrode, and spaced apart from the first external electrode, wherein a first region of a surface of the main body, which is provided between the first and second external electrodes, has an uneven shape including a plurality of peaks and a plurality of valleys, and when D1 represents an average depth of the uneven shape in a central portion of the first region and D2 represents an average depth of the uneven shape in a peripheral portion of the first region, D1 and D2 are different from each other.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2024-0180766, filed on December 6, 2024, with the Korean Intellectual Property Office, and Korean Patent Application No. 10-2025-0026324, filed on February 28, 2025, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] This disclosure relates to a multilayer electronic component. Background Technology

[0003] Multilayer ceramic capacitors (MLCCs, a type of multilayer electronic component) are chip capacitors that are charged or discharged from printed circuit boards mounted on various electronic products, such as image display devices (including liquid crystal displays (LCDs) and plasma display panels (PDPs)), computers, smartphones, mobile phones, and on-board chargers (OBCs) and DC-DC converters for electric vehicles.

[0004] Electrochemical ion migration (ECM) is a failure that can occur during the operation of MLCCs. It refers to the phenomenon where moisture is adsorbed onto the surface of the MLCC and reacts with the external electrodes to form metal ions. Due to an electric field, these metal ions migrate towards the negative electrode, couple with electrons, and precipitate as metal, forming a plating bridge between the external electrodes. When MLCCs are used in high-temperature and high-humidity environments, ion migration can lead to short circuits between the terminals of the external electrodes, potentially reducing MLCC performance due to increased leakage current and shortening its lifespan.

[0005] Typically, the following methods are used to suppress or delay ion migration: by applying a water-repellent coating to the surface of the MLCC body to increase the wetting angle of water droplets, resulting in fewer water droplets spreading on the surface of the MLCC.

[0006] However, water-repellent coatings, including those containing fluorine-based or silane-based compounds, are resin-based rather than particulate-based coatings, making it difficult to achieve superhydrophobic surfaces with a wetting angle greater than or equal to 150 degrees. Summary of the Invention

[0007] One aspect of this disclosure is to provide a multilayer electronic component that has improved moisture resistance reliability by mitigating the occurrence of electrochemical ion migration in the multilayer electronic component.

[0008] Another aspect of this disclosure is to provide a multilayer electronic component that realizes a droplet movement mode capable of suppressing ion migration in multilayer electronic components of various sizes.

[0009] Another aspect of this disclosure is to provide a body surface structure for a multilayer electronic component, which makes the body surface superhydrophobic.

[0010] However, this disclosure is not limited to the above description and can be more readily understood from the description of exemplary embodiments of this disclosure.

[0011] According to one aspect of this disclosure, a multilayer electronic component includes: a body comprising an alternating dielectric layer and a first inner electrode and a second inner electrode, wherein the dielectric layer is disposed between the first inner electrode and the second inner electrode; a first outer electrode disposed on the body and connected to the first inner electrode; and a second outer electrode disposed on the body, connected to the second inner electrode, and spaced apart from the first outer electrode, wherein a first region of the surface of the body disposed between the first outer electrode and the second outer electrode has an uneven shape, the uneven shape comprising a plurality of peaks and a plurality of valleys, and D1 and D2 are different from each other when D1 represents the average depth of the uneven shape in the central portion of the first region and D2 represents the average depth of the uneven shape in the peripheral portion of the first region.

[0012] According to another aspect of this disclosure, a multilayer electronic component includes: a body comprising alternating dielectric layers and a first inner electrode and a second inner electrode, wherein the dielectric layers are disposed between the first inner electrode and the second inner electrode; a first outer electrode disposed on the body and connected to the first inner electrode; and a second outer electrode disposed on the body, connected to the second inner electrode, and spaced apart from the first outer electrode, wherein a first region of the surface of the body disposed between the first outer electrode and the second outer electrode has an uneven shape, the uneven shape comprising a plurality of peaks and a plurality of valleys, and P1 and P2 being different from each other, wherein the average pitch represents the average value of the distance between any one peak of the uneven shape and the peak adjacent to the any one peak, P1 represents the average pitch of the uneven shape in the central portion of the first region, and P2 represents the average pitch of the uneven shape in the peripheral portion of the first region. Attached Figure Description

[0013] The above and other aspects, features and advantages of this disclosure will become clearer from the following detailed embodiments, taken in conjunction with the accompanying drawings, in which: Figure 1 This is a schematic perspective view of a multilayer electronic assembly according to an exemplary embodiment; Figure 2 It is along Figure 1 A cross-sectional view taken from line I-I' in the diagram; Figure 3This is an enlarged plan view showing the uneven shape of the first region according to an exemplary embodiment; Figure 4 yes Figure 3 A magnified view of region U in the image; Figure 5 This is a cross-sectional view illustrating an example of dividing a first region according to an exemplary embodiment; Figure 6 It is along Figure 1 A cross-sectional view taken from line II-II' in the diagram; Figure 7 This is an exploded perspective view of the main body according to an exemplary embodiment; Figure 8 This is a schematic perspective view of a multilayer electronic assembly according to another exemplary embodiment; Figure 9 It is along Figure 8 The cross-sectional view taken from line III-III' in the diagram; and Figure 10 It is shown Figure 9 A magnified plan view of the first region and the shape of the coating. Detailed Implementation

[0014] In the following description, exemplary embodiments of the present disclosure are illustrated with reference to the accompanying drawings. However, exemplary embodiments of the present disclosure can be modified in many different ways, and the scope of the present disclosure is not limited to the exemplary embodiments described below. Furthermore, exemplary embodiments of the present disclosure are provided to provide a more complete description of the disclosure to those skilled in the art. Therefore, for clarity, the shape and size of components in the drawings may be exaggerated, and the same reference numerals are used to identify the same components.

[0015] Furthermore, in order to clearly describe this disclosure in the accompanying drawings, parts irrelevant to the description have been omitted, and the dimensions (e.g., thickness) of each component shown in the drawings are arbitrarily shown for ease of description; therefore, this disclosure is not necessarily limited to what is shown. Additionally, components having the same function within the scope of the same concept are identified by the same reference numerals. Moreover, throughout the specification, when a part is referred to as "comprising" a component, unless otherwise specifically stated, it indicates that the part does not exclude the inclusion of other components, and may include other components as well.

[0016] Additionally, in the accompanying drawings, the x-direction refers to the first direction or thickness direction, the y-direction refers to the second direction or length direction, and the z-direction refers to the third direction or width direction. Furthermore, the stacking direction of the inner electrode or dielectric layer can be the thickness direction.

[0017] Figure 1 This is a schematic perspective view of a multilayer electronic assembly according to an exemplary embodiment.

[0018] Figure 2 It is along Figure 1 The cross-sectional view taken from line I-I' in the diagram.

[0019] Figure 3 This is an enlarged plan view showing the uneven shape of the first region according to an exemplary embodiment.

[0020] Figure 4 yes Figure 3 An enlarged view of region U in the image.

[0021] Figure 5 This is a cross-sectional view illustrating an example of dividing a first region according to an exemplary embodiment.

[0022] Figure 6 It is along Figure 1 The cross-sectional view taken from line II-II' in the diagram.

[0023] Figure 7 This is an exploded perspective view of the main body according to an exemplary embodiment.

[0024] In the following text, refer to Figures 1 to 7 A multilayer electronic assembly 100 according to exemplary embodiments of the present disclosure is described in detail.

[0025] A multilayer electronic assembly 100 according to an exemplary embodiment of the present disclosure may include: a body 110 including alternating dielectric layers 111 and a first inner electrode 121 and a second inner electrode 122, wherein the dielectric layers 111 are located between the first inner electrode 121 and the second inner electrode 122; a first outer electrode 130 disposed on the body 110 and connected to the first inner electrode 121; and a second outer electrode 140 disposed on the body 110, connected to the second inner electrode 122, and spaced apart from the first outer electrode 130. A first region R1 is a region on the surface of the body 110 disposed between the first outer electrode 130 and the second outer electrode 140. The first region R1 has an uneven shape including multiple peaks and multiple valleys. D1 and D2 are different from each other, wherein D1 represents the average depth of the uneven shape in the central portion rc of the first region R1, and D2 represents the average depth of the uneven shape in the peripheral portions ro1 and ro2 of the first region R1. A second region R2 is a region on the surface of the body 110 in contact with the first outer electrode 130 or the second outer electrode 140.

[0026] A multilayer electronic component 100 according to an exemplary embodiment of the present disclosure may include: a body 110 including alternating dielectric layers 111 and a first inner electrode 121 and a second inner electrode 122, wherein the dielectric layers 111 are located between the first inner electrode 121 and the second inner electrode 122; a first outer electrode 130 disposed on the body 110 and connected to the first inner electrode 121; and a second outer electrode 140 disposed on the body 110, connected to the second inner electrode 122, and spaced apart from the first outer electrode 130, wherein a first region R1 has an uneven shape including multiple peaks and multiple valleys. The first region R1 is a region on the surface of the body 110 disposed between the first outer electrode 130 and the second outer electrode 140. The second region R2 is a region on the surface of the body 110 in contact with either the first outer electrode 130 or the second outer electrode 140. P1 and P2 are different from each other. The average pitch represents the average interval between any peak of the non-flat shape and the peaks adjacent to that peak. P1 represents the average pitch of the non-flat shape in the central part rc of the first region R1, and P2 represents the average pitch of the non-flat shape in the outer parts ro1 and ro2 of the first region R1.

[0027] Reference Figure 2 The main body 110 may include a dielectric layer 111 and a first inner electrode 121 and a second inner electrode 122 alternately disposed in the x direction, and the dielectric layer 111 is located between the first inner electrode 121 and the second inner electrode 122.

[0028] The specific shape of the main body 110 is not particularly limited, and as... Figure 1 As shown, the body 110 may have a hexahedral shape or a shape similar to a hexahedron. Due to the shrinkage of the ceramic powder included in the body 110 during the sintering process, the body 110 may have a generally hexahedral shape, rather than a hexahedral shape with perfectly straight lines.

[0029] The main body 110 may have a first surface 1 and a second surface 2 that are opposite to each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and are opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1 and the second surface 2, connected to the third surface 3 and the fourth surface 4 and are opposite to each other in a third direction.

[0030] Multiple dielectric layers 111 included in the body 110 may be in a sintered state, and adjacent dielectric layers 111 may be integrated with each other, making it difficult to identify the boundaries between them without using a scanning electron microscope (SEM).

[0031] According to an exemplary embodiment of the present disclosure, the raw materials included in the dielectric layer 111 are not particularly limited as long as sufficient electrostatic capacitance can be obtained using them. For example, a barium titanate-based material, a lead composite perovskite-based material, or a strontium titanate-based material can be used. The barium titanate-based material may include BaTiO3-based ceramic powder, and examples of the BaTiO3-based ceramic powder may include BaTiO3 and / or (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc.

[0032] In addition, the raw materials included in the dielectric layer 111 may be powders such as barium titanate (BaTiO3) to which various ceramic additives, organic solvents, binders, dispersants, etc. are added for the purpose of the present disclosure.

[0033] Furthermore, the dielectric layer 111 may be in a sintered state, and the ceramic powder used as the material of the dielectric layer 111 may form dielectric grains and grain boundaries.

[0034] In addition, the average thickness td of the dielectric layer 111 is not particularly limited. For example, the average thickness td of the dielectric layer 111 may be greater than or equal to 0.2 μm and less than or equal to 2 μm, and in order to more easily achieve high capacitance and miniaturization of the multilayer electronic component 100, the average thickness td of the dielectric layer 111 may be less than or equal to 0.35 μm.

[0035] In addition, the average thickness td of the dielectric layer 111 may represent the average thickness td of at least one of the plurality of dielectric layers 111.

[0036] The average thickness td of dielectric layer 111 can be: an average of the thicknesses measured at 1 / 4, 2 / 4, and 3 / 4 points along the length direction of a single dielectric layer adjacent to the point where the center line of the capacitor formation in the length direction and the center line of the capacitor formation in the thickness direction intersect each other, respectively, from an image extracted by scanning a cross-section of the body 110 in the first and second directions using a scanning electron microscope (SEM) (the cross-section being polished to the center of the body 110 in the third direction). Based on this dielectric layer adjacent to the point where the center line of the capacitor formation in the length direction and the center line of the capacitor formation in the thickness direction intersect each other, the average thickness td of the dielectric layer can be further generalized by extending this average measurement to two dielectric layers each above and below this dielectric layer with equal spacing.

[0037] The inner electrodes 121 and 122 may be alternately arranged in a first direction and the dielectric layer 111 is located between the inner electrodes 121 and 122.

[0038] The internal electrodes 121 and 122 may include a first internal electrode 121 and a second internal electrode 122. The first internal electrode 121 and the second internal electrode 122 may be alternately arranged opposite each other, with a dielectric layer 111 situated between the first internal electrode 121 and the second internal electrode 122. The first internal electrode 121 and the second internal electrode 122 may be connected to the third surface 3 and the fourth surface 4 of the body 110, respectively. Specifically, one end of the first internal electrode 121 may be connected to the third surface 3, and one end of the second internal electrode 122 may be connected to the fourth surface 4. That is, in the embodiment, the first internal electrode 121 and the second internal electrode 122 may be in contact with the third surface 3 and the fourth surface 4, respectively.

[0039] like Figure 2 As shown, the first inner electrode 121 may be spaced apart from the fourth surface 4 and exposed through the third surface 3, and the second inner electrode 122 may be spaced apart from the third surface 3 and exposed through the fourth surface 4. The first outer electrode 130 may be disposed on the third surface 3 of the body 110 and connected to the first inner electrode 121, and the second outer electrode 140 may be disposed on the fourth surface 4 of the body 110 and connected to the second inner electrode 122.

[0040] That is, the first inner electrode 121 can be connected to the first outer electrode 130 instead of the second outer electrode 140, and the second inner electrode 122 can be connected to the second outer electrode 140 instead of the first outer electrode 130. Therefore, the first inner electrode 121 can be spaced apart from the fourth surface 4 by a predetermined distance, and the second inner electrode 122 can be spaced apart from the third surface 3 by a predetermined distance. Here, the first inner electrode 121 and the second inner electrode 122 can be electrically isolated from each other by a dielectric layer 111 disposed between them.

[0041] There are no particular limitations on the materials included in the inner electrodes 121 and 122, and materials with excellent electrical conductivity can be used. For example, the inner electrodes 121 and 122 may include at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0042] Additionally, the internal electrodes 121 and 122 can be formed by printing a conductive paste for the internal electrodes onto a ceramic green sheet. The conductive paste for the internal electrodes includes at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. The printing method for the conductive paste for the internal electrodes may include screen printing, gravure printing, etc., and this disclosure is not limited thereto.

[0043] Furthermore, the average thickness te of the inner electrodes 121 and 122 does not need to be particularly limited. For example, the average thickness te of the inner electrodes 121 and 122 can be greater than or equal to 0.2 μm and less than or equal to 2 μm, and in order to more easily achieve high capacity and miniaturization of the multilayer electronic component 100, the average thickness te of the inner electrodes 121 and 122 can be less than or equal to 0.35 μm.

[0044] Furthermore, the average thickness te of the inner electrodes 121 and 122 can represent the average thickness te of at least one of the plurality of inner electrodes 121 and 122.

[0045] The average thickness te of the inner electrodes 121 and 122 can be: based on the average thickness measured at 1 / 4, 2 / 4, and 3 / 4 points along the length direction of a single inner electrode adjacent to the point where the center line of the capacitor formation in the length direction and the center line of the capacitor formation in the thickness direction intersect each other, respectively, from the inner electrodes obtained by scanning the body 110 in the first and second directions using a scanning electron microscope (the cross section is polished to the center of the body 110 in the third direction). Based on the inner electrode adjacent to the point where the center line of the capacitor formation in the length direction and the center line of the capacitor formation in the thickness direction intersect each other, the average thickness te of the inner electrodes can be further generalized by extending this average measurement to two inner electrodes each located above and below the inner electrode with equal intervals.

[0046] The main body 110 may include: a capacitor forming part Ac, in which a capacitor is formed by including an alternately arranged first inner electrode 121 and a second inner electrode 122 and a dielectric layer is disposed between the first inner electrode 121 and the second inner electrode 122; and covering parts 112 and 113, respectively disposed on one surface and another surface of the capacitor forming part Ac in a first direction.

[0047] The capacitance forming section Ac is the part that contributes to the capacitance of the capacitor, and as... Figure 7 As shown, the capacitor forming section Ac can be formed by repeatedly stacking a plurality of first inner electrodes 121 and a plurality of second inner electrodes 122 with a dielectric layer 111 between them.

[0048] Reference Figure 7 The covers 112 and 113 can be formed by stacking a single dielectric layer or two or more dielectric layers on the upper and lower surfaces of the capacitor forming portion Ac in the thickness direction, respectively, and can be mainly used to prevent damage to the inner electrode caused by physical stress and / or chemical stress.

[0049] Cover portions 112 and 113 do not include internal electrodes and may include the same material as the dielectric layer 111. That is, cover portions 112 and 113 may include ceramic materials (e.g., barium titanate (BaTiO3) based ceramic materials).

[0050] Furthermore, the average thickness tc of the covers 112 and 113 does not need to be particularly limited. However, in order to more easily achieve miniaturization and high capacity of the multilayer electronic component 100, the average thickness tc of the covers 112 and 113 can be less than or equal to 15 μm.

[0051] The average thickness tc of the covers 112 and 113 can represent the dimensions of the covers 112 and 113 in the first direction, and can be the average of the dimensions of the covers in the first direction measured at five points with equal intervals above or below the capacitor forming part Ac.

[0052] Reference Figure 6 In an exemplary embodiment, the multilayer electronic assembly 100 may further include edge portions 114 and 115, which may be disposed on one surface and the other surface of the capacitor forming portion Ac that are opposite each other in the third direction.

[0053] Reference Figure 6The edge portions 114 and 115 may include an edge portion 114 disposed on one surface of the capacitor forming portion Ac in the third direction and an edge portion 115 disposed on another surface of the capacitor forming portion Ac in the third direction. That is, the edge portions 114 and 115 may be disposed on two opposing surfaces of the capacitor forming portion Ac in the third direction (i.e., the width direction).

[0054] In addition, such as Figure 6 As shown, the edges 114 and 115 may represent the regions between the two ends of the first inner electrode 121 and the second inner electrode 122 in the third direction and the outer surface of the body 110.

[0055] Edges 114 and 115 are primarily used to prevent damage to the internal electrodes caused by physical and / or chemical stress.

[0056] Edges 114 and 115 can be formed by applying conductive paste for forming internal electrodes to the area of ​​the ceramic green sheet other than the area where the edges will be formed.

[0057] In addition, in order to suppress the step difference caused by the inner electrodes 121 and 122, the edge portions 114 and 115 can be formed by stacking ceramic green sheets coated with conductive paste to form a stack body, cutting the stack body so that the inner electrodes 121 and 122 are exposed through the two side surfaces of the capacitor forming portion Ac that are opposite to each other in the third direction, and then stacking a single dielectric layer or two or more dielectric layers on the two side surfaces of the capacitor forming portion Ac in the third direction (i.e., the width direction).

[0058] The widths of the edges 114 and 115 do not need to be particularly limited. However, in order to more easily achieve miniaturization and high capacity of the multilayer electronic component 100, the average width of the edges 114 and 115 can be less than or equal to 15 μm.

[0059] The average width of the edges 114 and 115 can represent the average size of the edges 114 and 115 in the third direction, and can be the average size of the size of the edges in the third direction measured at five points with equal intervals on both sides of the capacitor forming part Ac in the third direction.

[0060] Reference Figure 1 External electrodes 130 and 140 can be disposed on the main body 110.

[0061] Reference Figure 1 and Figure 2The external electrodes 130 and 140 may include: a first external electrode 130 disposed on the body 110 and connected to the first internal electrode 121; and a second external electrode 140 disposed on the body 110, connected to the second internal electrode 122, and spaced apart from the first external electrode 130.

[0062] Here, the direction in which the first external electrode 130 and the second external electrode 140 are spaced apart from each other can be considered as the second direction.

[0063] Although this disclosure describes a multilayer electronic assembly 100 having two external electrodes 130 and 140, the number and / or shape of the external electrodes 130 and 140 may be changed depending on the shape of the internal electrodes and / or other purposes.

[0064] Reference Figure 2 The external electrodes 130 and 140 may include electrode layers 131 and 141 that are in contact with the third surface 3 and the fourth surface 4 of the body 110, respectively, and plating layers 132 and 133 and 142 and 143 respectively disposed on the electrode layers 131 and 141.

[0065] For a more specific example of electrode layers 131 and 141, electrode layers 131 and 141 may be sintered electrodes comprising conductive metal and glass, or resin-based electrodes comprising conductive metal and resin.

[0066] Alternatively, electrode layers 131 and 141 can be formed by sequentially forming a sintered electrode and a resin-based electrode on the body 110. Alternatively, electrode layers 131 and 141 can be formed by transferring a sheet including a conductive metal onto the body 110, or by transferring a sheet including a conductive metal onto a sintered electrode.

[0067] The conductive metal included in electrode layers 131 and 141 can be a material with excellent conductivity, and is not particularly limited thereto. For example, the conductive metal can be at least one of nickel (Ni), copper (Cu), and alloys thereof.

[0068] Platings 132, 133, 142, and 143 can be used to improve mounting characteristics. Platings 132, 133, 142, and 143 are not limited to any particular type, and platings 132, 133, 142, and 143 can be platings including at least one of nickel (Ni), tin (Sn), palladium (Pd), and alloys thereof, and may include multiple layers.

[0069] For a more specific example of plating layers 132, 133, 142, and 143, plating layers 132, 133, 142, and 143 may be nickel (Ni) plating layers or tin (Sn) plating layers, or may include a form in which nickel (Ni) plating layers and tin (Sn) plating layers are sequentially formed on electrode layers 131 and 141, or may include a form in which tin (Sn) plating layers, nickel (Ni) plating layers, and tin (Sn) plating layers are sequentially formed on electrode layers 131 and 141. Additionally, the plating layers may include multiple nickel (Ni) plating layers and / or multiple tin (Sn) plating layers.

[0070] Electrochemical ion migration (ECM) is one of the failures that may occur during the operation of the multilayer electronic assembly 100, and refers to the phenomenon in which plating bridges are formed between the external electrodes 130 and 140 when water droplets spread on the surface of the body 110. Ion migration may cause short circuits between the external electrodes 130 and 140 or increase leakage current, which may degrade the moisture-proof reliability of the multilayer electronic assembly 100.

[0071] Typically, a water-repellent coating is formed on the surface of the body 110 to increase the wetting angle of water droplets, resulting in less water droplets spreading on the surface of the body 110, thereby inhibiting or delaying ion migration. The water-repellent coating is a resin-based coating including fluorine-based or silane-based compounds. Therefore, in order to make the water-repellent coating possess both chemical and physical water-repellent properties, excessive surface treatment of the water-repellent coating may be required, and during this process, problems such as water-repellent coating peeling or excessively thick water-repellent coating formation may occur.

[0072] Therefore, the multilayer electronic component 100 according to the exemplary embodiments of the present disclosure can ensure improved moisture resistance reliability by making the surface of the body 110 include an uneven shape containing multiple peaks and multiple valleys, and adjusting the specific microstructure of the uneven shape at various locations on the surface of the body 110 so that the surface of the body 110 is water-repellent even without an excessively thick water-repellent coating, and by making water droplets spread less on the surface of the body 110 to minimize the occurrence of ion migration.

[0073] The following text describes in detail the specific microstructure of the uneven shape at various locations on the surface of the body 110.

[0074] Reference Figure 2 The surface of the body 110 according to the exemplary embodiment can be divided into a first region R1 and a second region R2. The first region R1 is disposed between the first external electrode 130 and the second external electrode 140, and the second region R2 is in contact with either the first external electrode 130 or the second external electrode 140. The first region R1 may include a central portion rc and peripheral portions ro1 and ro2. Here, the peripheral portions ro1 and ro2 may be regions disposed on both sides of the central portion rc in a second direction.

[0075] Reference Figure 3 The first region R1 may have an uneven shape including multiple peaks and multiple valleys.

[0076] The uneven shape in the first region R1 according to an exemplary embodiment of the present disclosure can be adjusted differently based on each specific region of the first region R1. Therefore, when a water droplet is formed on the surface of the body 110, a wetting angle gradient can be formed based on the position, and this gradient can generate a driving force for moving the water droplet toward the center of the surface of the body 110 or the periphery of the surface of the body 110, thereby suppressing the spread of the water droplet on the surface of the body 110 and effectively preventing ion migration in the multilayer electronic assembly 100.

[0077] This disclosure provides various methods for forming a wetting angle gradient based on the position on the surface of the body 110.

[0078] In an exemplary embodiment, when D1 represents the average depth of the uneven shape in the central portion rc of the first region R1 and D2 represents the average depth of the uneven shape in the peripheral portions ro1 and ro2 of the first region R1, D1 and D2 can be adjusted to be different from each other, thereby forming a wetting angle gradient based on the position on the surface of the body 110. In another exemplary embodiment, when the average pitch represents the average value of the interval between any peak of the uneven shape and the peak adjacent to that peak, P1 represents the average pitch of the uneven shape in the central portion rc of the first region R1 and P2 represents the average pitch of the uneven shape in the peripheral portions ro1 and ro2 of the first region R1, P1 and P2 can be adjusted to be different from each other, thereby forming a wetting angle gradient based on the position on the surface of the body 110.

[0079] In an exemplary embodiment of this disclosure, the specific shape of the non-flat shape in the first region R1 may be represented by at least one of the average depth and the average pitch, and an example of a method for measuring the average depth or average pitch based on various locations in the first region R1 is as follows.

[0080] First, the multilayer electronic component 100 can be polished to the center in the third direction to obtain a cross-section of the multilayer electronic component 100 in the first and second directions, and then surface treatment can be performed. Next, a 50μm × 30μm region in the center of the central portion rc and the peripheral portions ro1 and ro2 in the second direction can be observed using a scanning electron microscope (SEM) at an accelerating voltage of 15kV and a magnification of 3000, and a roughness curve can be formed based on the valleys forming the lowest points in this region using an image processing program such as ImageJ. Next, as Figure 3As shown, the arithmetic mean of the roughness curves can be obtained to derive the average line m. Then, the distances from each of the multiple peaks to the average line m in a first direction can be measured as Da, Db, Dc, Dd, De, etc., and the distances from any given peak to the peak adjacent to it in a second direction can be measured as Pa, Pb, Pc, Pd, etc. Here, the average depth D and average pitch P can be represented as follows.

[0081] Average depth D = (Da + Db + Dc + Dd + De...) / (number of peaks).

[0082] Average pitch P = (Pa + Pb + Pc + Pd ...) / (number of peaks - 1).

[0083] The method for adjusting the average depth (D) and average pitch (P) based on various locations in the first region R1 according to exemplary embodiments of this disclosure is not particularly limited. For example, it can be implemented by using selective wet etching to change the etching reaction driving force based on each region. The adjustment variable of the etching reaction driving force can be adjusted based on temperature, time, or concentration. In an exemplary embodiment, when the multilayer electronic component 100 is immersed in the etching solution while being vertically loaded, the immersion (reaction) time of each region in the etching solution can be adjusted by specifically adjusting the immersion height (or removal speed / time) of the multilayer electronic component 100. In another exemplary embodiment, selective wet etching can also be performed by attaching (covering) a component having a material (such as rubber) that does not react with the etching solution to a specific surface of the body and adjusting the contact between the component and the solution.

[0084] In an exemplary embodiment, the average depth (D2) of the uneven shapes in the peripheral portions ro1 and ro2 may be less than the average depth (D1) of the uneven shapes in the central portion rc. Specifically, D1 / D2 may be greater than 1.0 and less than 10.0 (i.e., within the range of 1.0 to 10.0 excluding endpoint values). In this case, water droplets formed on the surface of the body 110 may move from the central portion rc, which has a relatively high surface tension, to the peripheral portions ro1 and ro2, which have a relatively low surface tension, thereby suppressing or mitigating ion migration that may occur when water droplets spread on the surface of the body 110.

[0085] Furthermore, when D1 / D2 is less than or equal to 1.0, it may be difficult to generate a driving force sufficient to cause the water droplet to move. When D1 / D2 is greater than or equal to 10.0, the likelihood of degradation or breakage of the multilayer electronic component 100 during the process of forming an uneven shape in the first region R1 increases. Therefore, in an exemplary embodiment, D1 / D2 can be adjusted to be greater than 1.0 and less than 10.0 so that a driving force sufficient to cause the water droplet to move can be generated, and degradation or breakage of the multilayer electronic component 100 can be suppressed or mitigated simultaneously.

[0086] In another exemplary embodiment, the average depth (D2) of the uneven shape in the peripheral portions ro1 and ro2 may be greater than the average depth (D1) of the uneven shape in the central portion rc. Specifically, D2 / D1 may be greater than 1.0 and less than 10.0 (i.e., within the range of 1.0 to 10.0 excluding endpoint values). In this case, water droplets formed on the surface of the body 110 may move from the peripheral portions ro1 and ro2, which have relatively high surface tension, to the central portion rc, which has relatively low surface tension, thereby suppressing or mitigating ion migration that may occur when water droplets spread on the surface of the body 110.

[0087] Furthermore, when D2 / D1 is less than or equal to 1.0, it may be difficult to generate a driving force sufficient to cause the water droplet to move. When D2 / D1 is greater than or equal to 10.0, the likelihood of degradation or breakage of the multilayer electronic component 100 during the process of forming an uneven shape in the first region R1 increases. Therefore, in another exemplary embodiment, D2 / D1 can be adjusted to be greater than 1.0 and less than 10.0 so that a driving force sufficient to cause the water droplet to move can be generated, and degradation or breakage of the multilayer electronic component 100 can be suppressed or mitigated simultaneously.

[0088] In an exemplary embodiment, the average pitch (P2) of the uneven shapes in the peripheral portions ro1 and ro2 may be greater than the average pitch (P1) of the uneven shapes in the central portion rc. Specifically, P1 / P2 may be greater than 0.1 and less than 0.6. In this case, water droplets formed on the surface of the body 110 may move from the central portion rc, which has a relatively high surface tension, to the peripheral portions ro1 and ro2, which have a relatively low surface tension, thereby suppressing or mitigating ion migration that may occur when water droplets spread on the surface of the body 110.

[0089] If P1 / P2 is less than or equal to 0.1, the multilayer electronic component 100 is more likely to deteriorate or break during the process of forming excessive differences in the average pitch at various locations. When P1 / P2 is greater than or equal to 0.6 and less than 1.0, it may be difficult to form a driving force sufficient to cause the movement of water droplets.

[0090] In another exemplary embodiment, the average pitch (P2) of the uneven shapes in the peripheral portions ro1 and ro2 may be smaller than the average pitch (P1) of the uneven shapes in the central portion rc. Specifically, P2 / P1 may be greater than 0.1 and less than 0.6 (i.e., within the range of 0.1 to 0.6 (excluding the end values)). In this case, the water droplets formed on the surface of the main body 110 may move from the peripheral portions ro1 and ro2 having a relatively high surface tension to the central portion rc having a relatively low surface tension, thereby suppressing or reducing the ion migration that may occur when the water droplets formed on the surface of the main body 110 spread.

[0091] If P2 / P1 is less than or equal to 0.1, the possibility of deterioration or breakage of the multilayer electronic component 100 during the process of forming an excessive difference in the average pitch at each position increases. When P2 / P1 is greater than or equal to 0.6 and less than 1.0, it may be difficult to form a driving force sufficient to cause the movement of the water droplets.

[0092] In addition, the average depth and average pitch in the central portion rc and the peripheral portions ro1 and ro2 of the first region R1 may show opposite situations. Specifically, when D1 / D2 is greater than 1.0 and less than 10.0, P1 / P2 may be greater than 0.1 and less than 0.6 (i.e., within the range of 0.1 to 0.6 (excluding the end values)), and when D2 / D1 is greater than 1.0 and less than 10.0, P2 / P1 may be greater than 0.1 and less than 0.6.

[0093] The peripheral portions ro1 and ro2 of the first region R1 may be divided into a first peripheral portion ro1 adjacent to the first external electrode 130 and a second peripheral portion ro2 adjacent to the second external electrode 140, and D2a and P2a respectively represent the average depth and average pitch of the uneven shapes in the first peripheral portion ro1, and D2b and P2b respectively represent the average depth and average pitch of the uneven shapes in the second peripheral portion ro2.

[0094] In an exemplary embodiment, D2a < D1 < D2b. In this way, the water droplets formed on the surface of the main body 110 may move toward the second external electrode 140, thereby suppressing or reducing the ion migration that may occur when the water droplets formed on the surface of the main body 110 spread.

[0095] In another exemplary embodiment, D2a > D1 and D2b > D1. In this way, the water droplets formed on the surface of the main body 110 may move toward the first external electrode 130, thereby suppressing or reducing the ion migration that may occur when the water droplets formed on the surface of the main body 110 spread.

[0096] In an exemplary embodiment, P2a < P1 < P2b. In this manner, the water droplet formed on the surface of the main body 110 can move toward the first outer electrode 130, thereby suppressing or alleviating the ion migration that may occur when the water droplet formed on the surface of the main body 110 spreads.

[0097] In another exemplary embodiment, P2a > P1 and P2b > P1. In this manner, the water droplet formed on the surface of the main body 110 can move toward the second outer electrode 140, thereby suppressing or alleviating the ion migration that may occur when the water droplet formed on the surface of the main body 110 spreads.

[0098] Referring to Figure 2 , in an exemplary embodiment, when the first region R1 is divided into three parts in the direction in which the first outer electrode 130 and the second outer electrode 140 are spaced apart from each other, the central portion rc of the first region R1 can be the portion disposed in the middle, and when the first region R1 is divided into three parts in the direction in which the first outer electrode 130 and the second outer electrode 140 are spaced apart from each other, the peripheral portions ro1 and ro2 of the first region R1 can be the portions disposed on both sides of the central portion rc.

[0099] The central portion rc of the first region R1 and the peripheral portions ro1 and ro2 can be defined differently according to the distance between the first outer electrode 130 and the second outer electrode 140.

[0100] Referring to Figure 5 , in an exemplary embodiment, in the multilayer electronic component 100 having a size such that the distance between the first outer electrode 130 and the second outer electrode 140 is greater than or equal to 0.1 mm and less than or equal to 1.0 mm, the peripheral portions ro1 and ro2 of the first region R1 can be regions extending 50 μm from the end of the first outer electrode 130 toward the second outer electrode 140 and regions extending 50 μm from the end of the second outer electrode 140 toward the first outer electrode 130, respectively, and the central portion rc of the first region R1 can be the region disposed between the peripheral portions ro1 and rox2.

[0101] In a multilayer electronic assembly 100 having a spacing between the first external electrode 130 and the second external electrode 140 that is greater than or equal to 0.1 mm and less than or equal to 1.0 mm, the distance between the first external electrode 130 and the second external electrode 140 can be small. Therefore, when a water droplet moves toward the central portion on the surface of the body 110, the effect of suppressing ion migration may be insufficient due to the size of the water droplet itself. Therefore, when the spacing between the first external electrode 130 and the second external electrode 140 is greater than or equal to 0.1 mm and less than or equal to 1.0 mm (i.e., within the range of 0.1 mm to 1.0 mm (excluding the endpoint values)), the water droplet can move to the peripheral portions ro1 and ro2. In other words, in the exemplary embodiment, when the distance between the first external electrode 130 and the second external electrode 140 is greater than or equal to 0.1 mm and less than or equal to 1.0 mm (i.e., within the range of 0.1 mm to 1.0 mm (excluding the endpoint values)), at least one of the conditions that D1 / D2 is greater than 1.0 and less than 10.0 and P1 / P2 is greater than 0.1 and less than 0.6 can be satisfied.

[0102] Reference Figure 5 In an exemplary embodiment, in a multilayer electronic assembly 100 having a size such that the distance between the first external electrode 130 and the second external electrode 140 is greater than 1.00 mm, the peripheral portions ro1 and ro2 of the first region R1 may be regions extending 100 μm from the end of the first external electrode 130 toward the second external electrode 140 and regions extending 100 μm from the end of the second external electrode 140 toward the first external electrode 130, respectively, and the central portion rc of the first region R1 may be the region disposed between the peripheral portions ro1 and ro2.

[0103] In a multilayer electronic assembly 100 having a dimension such that the distance between the first external electrode 130 and the second external electrode 140 is greater than 1.00 mm, the distance between the first external electrode 130 and the second external electrode 140 may be sufficiently large. Therefore, water droplets can move to the central portion rc instead of to the peripheral portions ro1 and ro2, thereby preventing degradation of moisture-proof reliability. That is, in an exemplary embodiment, when the distance between the first external electrode 130 and the second external electrode 140 is greater than 1.00 mm, at least one of the conditions D2 / D1 being greater than 1.0 and less than 10.0 and P2 / P1 being greater than 0.1 and less than 0.6 can be satisfied.

[0104] In an exemplary embodiment, both D1 and D2 can be greater than or equal to 1 μm and less than or equal to 10 μm.

[0105] When D1 or D2 is less than 1 μm, water droplets formed on the surface of the body 110 may not be able to generate sufficient surface tension, and when D1 or D2 is greater than 10 μm, the possibility of deterioration or breakage of the multilayer electronic component 100 increases.

[0106] In an exemplary embodiment, both P1 and P2 can be greater than or equal to 1 μm and less than or equal to 30 μm. When P1 or P2 is less than 1 μm, the possibility of degradation or breakage of the multilayer electronic component 100 increases, and when P1 or P2 is greater than 30 μm, water droplets formed on the surface of the body 110 may not generate sufficient surface tension.

[0107] In an exemplary embodiment, the first region R1 may be a region having multiple peaks and multiple valleys, and represents a region having a specific depth from the outermost point on the outer surface of the body 110. Specifically, in an exemplary embodiment, the first region R1 may represent a region having a depth greater than or equal to 10 μm and less than or equal to 30 μm along a first direction from the outermost point on the outer surface of the body 110.

[0108] In an exemplary embodiment, the first region R1 may include a plurality of dielectric particles, and each of the plurality of dielectric particles included in the first region R1 may have an aspect ratio b / a that is greater than or equal to 0.8 and less than or equal to 1.2. Here, the aspect ratio of the dielectric particles may refer to the ratio b / a of the minor axis length b to the major axis length a of the dielectric particles.

[0109] In an exemplary embodiment, the average equivalent diameter of the plurality of dielectric particles included in the first region R1 may be greater than or equal to 50 nm and less than or equal to 400 nm. Here, the average equivalent diameter may be obtained based on a planar measurement method by observing the first region R1 using an optical microscope (OM) or a scanning electron microscope (SEM), but is not limited thereto, and may be the average of values ​​measured at two or more points with equal intervals on the left and right sides of the center of the first region R1 in a second direction.

[0110] Reference Figure 4 In an exemplary embodiment, the uneven shape may include: a main protrusion mp, extending continuously in a direction in which the dielectric layer 111 and the first inner electrode 121 and the second inner electrode 122 are alternately disposed; and branch protrusions bp, protruding from the main protrusion mp in a direction in which the first outer electrode 130 and the second outer electrode 140 are spaced apart from each other. Therefore, compared to an uneven shape without branch protrusions bp, Figure 4 The uneven shape ensures a larger surface area. Therefore, the effect of suppressing or mitigating ion migration according to this disclosure can be significantly improved.

[0111] Furthermore, a branch protrusion bp can be a region that branches from a main protrusion mp, and one or more branch protrusions bp can be formed by branching from a main protrusion mp.

[0112] Reference Figure 8 , Figure 9 and Figure 10 A coating 150 may be provided on a first region R1 of the multilayer electronic component 100' according to another exemplary embodiment. Therefore, the moisture resistance reliability of the multilayer electronic component 100' can be improved. There are no particular limitations on the components included in the coating 150 for improving the moisture resistance reliability of the multilayer electronic component 100'; for example, the coating 150 may include at least one of a fluorine-based compound and a silane compound.

[0113] The method for forming the coating 150 according to another exemplary embodiment is not particularly limited. For example, the coating 150 can be formed by immersing the multilayer electronic component 100' in a solution for forming the coating 150, or by using a deposition method.

[0114] Reference Figure 10 In another exemplary embodiment, the coating 150 may be formed conforming to the uneven shape of the first region R1. Specifically, the coating 150 may have an uneven shape in the first region R1, thereby achieving not only the water-repellent effect caused by the components included in the coating 150, but also the improved water-repellent effect caused by the uneven shape of the coating 150. Therefore, the moisture-proof reliability of the multilayer electronic component 100' can be further enhanced. Additionally, the driving force for moving water droplets formed on the surface of the coating 150 can be increased. As a result, ion migration occurring in the multilayer electronic component 100' can also be more effectively suppressed.

[0115] As described above, this disclosure provides a multilayer electronic component that has improved moisture resistance reliability by mitigating the occurrence of electrochemical ion migration in the multilayer electronic component.

[0116] This disclosure also provides a multilayer electronic component that implements a droplet movement mode capable of suppressing ion migration for multilayer electronic components of various sizes.

[0117] However, the various advantages and effects of this disclosure are not limited to those described above, and can be more readily understood in the process of describing specific exemplary embodiments of this disclosure.

[0118] Although exemplary embodiments of the present disclosure have been described in detail above, the present disclosure is not limited to the exemplary embodiments and drawings described above, and the scope of the present disclosure is defined only by the appended claims. Therefore, it is readily understood that various modifications and variations can be made by those skilled in the art without departing from the scope and spirit of the present disclosure as defined by the appended claims. These modifications and variations should also be understood to fall within the scope of the present disclosure.

[0119] Furthermore, the expression "exemplary embodiment" as used in this disclosure does not refer to the same exemplary embodiment as another, and is provided to emphasize the unique features of each exemplary embodiment. The exemplary embodiments provided herein do not preclude implementation in combination with features of another exemplary embodiment. For example, unless a contrary or contradictory description is provided in another exemplary embodiment, content described in a particular exemplary embodiment may be understood as a description relating to the other exemplary embodiment, even if such content is not described in another exemplary embodiment.

[0120] The terminology used herein is for describing exemplary embodiments only and is not intended to limit this disclosure. Unless the context otherwise requires, the singular form may also include the plural form.

[0121] While exemplary embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations may be made without departing from the scope of this disclosure as defined by the appended claims.

Claims

1. A multilayer electronic component, comprising: The main body includes an alternating dielectric layer and a first inner electrode and a second inner electrode, wherein the dielectric layer is located between the first inner electrode and the second inner electrode; A first external electrode is disposed on the main body and connected to the first internal electrode; as well as A second external electrode is disposed on the main body, connected to the second internal electrode, and spaced apart from the first external electrode. The surface of the main body, in a first region between the first and second external electrodes, has an uneven shape, comprising multiple peaks and valleys. D1 and D2 are different from each other, wherein D1 represents the average depth of the uneven shape in the central part of the first region, and D2 represents the average depth of the uneven shape in the peripheral part of the first region.

2. The multilayer electronic component according to claim 1, wherein, The central portion of the first region is the middle portion when the first region is divided into three parts in a direction that separates the first external electrode and the second external electrode from each other. The outer portion of the first region is the portion of the three portions disposed on both sides of the central portion in the direction in which the first external electrode and the second external electrode are spaced apart from each other.

3. The multilayer electronic component according to claim 1, wherein, The distance between the first external electrode and the second external electrode is greater than or equal to 0.1 mm and less than or equal to 1.0 mm. The peripheral portions of the first region are a region extending 50 μm from the end of the first external electrode toward the second external electrode and a region extending 50 μm from the end of the second external electrode toward the first external electrode. The central portion of the first region is the region located between the peripheral portions.

4. The multilayer electronic component according to claim 1, wherein, The distance between the first external electrode and the second external electrode is greater than 1.0 mm. The peripheral portions of the first region are a region extending 100 μm from the end of the first external electrode toward the second external electrode and a region extending 100 μm from the end of the second external electrode toward the first external electrode. The central portion of the first region is the region located between the peripheral portions.

5. The multilayer electronic component according to claim 1, wherein, P1 and P2 are different from each other, wherein the average pitch refers to the average distance between any peak of the uneven shape and the peak adjacent to the any peak, P1 represents the average pitch of the uneven shape in the central part of the first region, and P2 represents the average pitch of the uneven shape in the peripheral part of the first region.

6. The multilayer electronic assembly according to claim 1, wherein, D1 / D2 is greater than 1.0 and less than 10.

0.

7. The multilayer electronic component according to claim 6, wherein, P1 / P2 is greater than 0.1 and less than 0.6, where the average pitch refers to the average distance between any peak of the uneven shape and the peak adjacent to the uneven shape, P1 represents the average pitch of the uneven shape in the central part of the first region, and P2 represents the average pitch of the uneven shape in the peripheral part of the first region.

8. The multilayer electronic component according to claim 1, wherein, D2 / D1 is greater than 1.0 and less than 10.

0.

9. The multilayer electronic component according to claim 8, wherein, When the average pitch is the average value of the pitches between any one peak of the uneven shape and the peak adjacent to the any one peak, P1 represents the average pitch of the uneven shape in the central portion of the first region, and P2 represents the average pitch of the uneven shape in the peripheral portion of the first region, P2 / P1 is greater than 0.1 and less than 0.

6.

10. The multilayer electronic assembly according to claim 1, wherein, D2a < D1 < D2b, where the first peripheral portion represents the peripheral portion of the first region adjacent to the first outer electrode, and the second peripheral portion represents the peripheral portion of the first region adjacent to the second outer electrode, and where D2a represents the average depth of the uneven shape in the first peripheral portion, and D2b represents the average depth of the uneven shape in the second peripheral portion.

11. The multilayer electronic assembly according to claim 1, wherein, D2a > D1 and D2b > D1, where the first peripheral portion represents the peripheral portion of the first region adjacent to the first outer electrode, and the second peripheral portion represents the peripheral portion of the first region adjacent to the second outer electrode, and where D2a represents the average depth of the uneven shape in the first peripheral portion, and D2b represents the average depth of the uneven shape in the second peripheral portion.

12. The multilayer electronic assembly according to claim 1, wherein, Both D1 and D2 are greater than or equal to 1 μm and less than or equal to 10 μm.

13. The multilayer electronic assembly according to claim 1, wherein, The first region includes a plurality of dielectric particles, and each of the plurality of dielectric particles has an aspect ratio greater than or equal to 0.8 and less than or equal to 1.

2.

14. The multilayer electronic assembly according to claim 13, wherein, The average equivalent diameter of the plurality of dielectric particles is greater than or equal to 50 nm and less than or equal to 400 nm.

15. The multilayer electronic assembly according to claim 1, wherein, The multi-layer electronic component further includes a coating provided on the first region.

16. The multilayer electronic assembly according to claim 15, wherein, The coating includes at least one of a silane-based compound and a fluorine-based compound.

17. The multilayer electronic assembly according to claim 1, wherein, The uneven shape includes: a main protrusion continuously extending in a direction in which the dielectric layer and the first inner electrode and the second inner electrode are alternately provided; and branch protrusions protruding from the main protrusion in a direction in which the first outer electrode and the second outer electrode are spaced apart from each other.

18. A multi-layer electronic component, comprising: A main body including a dielectric layer and a first inner electrode and a second inner electrode alternately provided, and the dielectric layer is interposed between the first inner electrode and the second inner electrode; A first outer electrode provided on the main body and connected to the first inner electrode; And A second outer electrode provided on the main body, connected to the second inner electrode, and spaced apart from the first outer electrode, where a first region on the surface of the main body between the first outer electrode and the second outer electrode has an uneven shape, the uneven shape includes a plurality of peaks and a plurality of valleys, and P1 and P2 are different from each other, where the average pitch represents the average value of the pitches between any one peak of the uneven shape and the peak adjacent to the any one peak, P1 represents the average pitch of the uneven shape in the central portion of the first region, and P2 represents the average pitch of the uneven shape in the peripheral portion of the first region.

19. The multilayer electronic assembly according to claim 18, wherein, P1 / P2 is greater than 0.1 and less than 0.

6.

20. The multilayer electronic assembly according to claim 18, wherein, P2 / P1 is greater than 0.1 and less than 0.

6.

21. The multilayer electronic assembly according to claim 18, wherein, P2a < P1 < P2b, where the first peripheral portion represents the peripheral portion of the first region adjacent to the first outer electrode, and the second peripheral portion represents the peripheral portion of the first region adjacent to the second outer electrode, and where P2a represents the average pitch of the uneven shape in the first peripheral portion, and P2b represents the average pitch of the uneven shape in the second peripheral portion.

22. The multilayer electronic assembly according to claim 18, wherein, P2a > P1 and P2b > P1, where the first peripheral portion represents the peripheral portion of the first region adjacent to the first outer electrode, and the second peripheral portion represents the peripheral portion of the first region adjacent to the second outer electrode, and where P2a represents the average pitch of the uneven shape in the first peripheral portion, and P2b represents the average pitch of the uneven shape in the second peripheral portion.

23. The multilayer electronic assembly according to claim 18, wherein, Both P1 and P2 are greater than or equal to 1 μm and less than or equal to 30 μm.

24. The multilayer electronic assembly according to claim 18, wherein, The first region includes a plurality of dielectric particles, and the plurality of dielectric particles each have an aspect ratio greater than or equal to 0.8 and less than or equal to 1.

2.

25. The multilayer electronic assembly according to claim 24, wherein, The average equivalent diameter of the plurality of dielectric particles is greater than or equal to 50 nm and less than or equal to 400 nm.

26. The multilayer electronic assembly according to claim 18, wherein, The multilayer electronic component further includes a coating provided on the first region.

27. The multilayer electronic assembly according to claim 26, wherein, The coating includes at least one of a silane-based compound and a fluorine-based compound.

28. The multilayer electronic component according to claim 18, wherein, The uneven shape includes: a main protrusion that continuously extends in a direction in which the dielectric layer and the first inner electrode and the second inner electrode are alternately provided; and branch protrusions that protrude from the main protrusion in a direction in which the first outer electrode and the second outer electrode are spaced apart from each other.

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