power storage device

By setting grooves and bending start points on the insulating plate, the problem of poor connection between the busbar module and external terminals under impact in the energy storage device is solved, achieving higher stability and safety.

CN122178081APending Publication Date: 2026-06-09TOYOTA JIDOSHA KK

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
TOYOTA JIDOSHA KK
Filing Date
2025-12-02
Publication Date
2026-06-09

AI Technical Summary

Technical Problem

When the energy storage device is subjected to an impact, poor connection may easily occur between the busbar module and the external terminals of the energy storage unit, leading to problems such as short circuits.

Method used

An insulating plate design is adopted, including grooves and bending points on the insulating plate to form gaps between busbar modules, in order to reduce impact stress concentration and prevent poor connection.

Benefits of technology

It effectively suppresses poor connection between the busbar module and external terminals, prevents short circuits, and improves the stability and safety of the energy storage device.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The present application provides a kind of electric storage device. Electric storage device has: first electric storage stack, including first electric storage unit;Second electric storage stack, with the adjacent manner of first electric storage stack, including second electric storage unit;Third electric storage stack, with the adjacent manner of second electric storage stack, including third electric storage unit;And wiring panel, be configured below first electric storage stack, second electric storage stack and third electric storage stack. Wiring panel includes insulating plate and is set to the first busbar module of insulating plate, second busbar module and third busbar module. First busbar module is electrically connected with first electric storage unit. Second busbar module is electrically connected with second electric storage unit. Third busbar module is electrically connected with third electric storage unit. Insulating plate has: first bending starting point, is set between first busbar module and second busbar module;And second bending starting point, is set between second busbar module and third busbar module.
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Description

Technical Field

[0001] This disclosure relates to energy storage devices. Background Technology

[0002] Chinese Patent Application Publication No. 116686151 discloses a battery (energy storage device) including an energy storage unit, wherein the electrode terminals (external terminals) of the energy storage unit are disposed on the lower surface of the energy storage unit. Summary of the Invention

[0003] In the event of an impact applied to the energy storage device from below, a poor connection may occur between the busbar module and the external terminals of the energy storage unit, which includes the energy storage unit and the busbar module disposed below the energy storage unit and electrically connected to the energy storage unit.

[0004] One object of this disclosure is to suppress the occurrence of poor connection between the busbar module and the external terminals of the energy storage unit in the event of an impact input to the energy storage device from below, the energy storage device including the energy storage unit and the busbar module disposed below the energy storage unit and electrically connected to the energy storage unit.

[0005] (1) An energy storage device according to one aspect of the present disclosure comprises: a first energy storage stack including a first energy storage unit; a second energy storage stack disposed adjacent to the first energy storage stack and including a second energy storage unit; a third energy storage stack disposed adjacent to the second energy storage stack and including a third energy storage unit; and a wiring panel disposed below the first energy storage stack, the second energy storage stack, and the third energy storage stack. The wiring panel includes an insulating plate and a first busbar module, a second busbar module, and a third busbar module disposed on the insulating plate. The first busbar module electrically connects the first energy storage unit, the second busbar module electrically connects the second energy storage unit, and the third busbar module electrically connects the third energy storage unit. The insulating plate has: a first bending start point disposed between the first busbar module and the second busbar module; and a second bending start point disposed between the second busbar module and the third busbar module.

[0006] (2) In the energy storage device described in (1) above, the first energy storage stack includes a plurality of first energy storage units arranged in a first direction. The plurality of first energy storage units include first energy storage units. The second energy storage stack is arranged adjacent to the first energy storage stack in a second direction intersecting the first direction, and includes a plurality of second energy storage units arranged in the first direction. The plurality of second energy storage units include second energy storage units. The third energy storage stack is arranged adjacent to the second energy storage stack in the second direction, and includes a plurality of third energy storage units arranged in the first direction. The plurality of third energy storage units include third energy storage units. A first busbar module electrically connects the plurality of first energy storage units. A second busbar module electrically connects the plurality of second energy storage units. A third busbar module electrically connects the plurality of third energy storage units.

[0007] (3) In the energy storage device described in (1) above, the first bending start point is the corner of the first groove formed in the insulating plate. The second bending start point is the corner of the second groove formed in the insulating plate.

[0008] (4) In the energy storage device described in (3) above, the first groove and the second groove are formed on the lower surface of the insulating plate.

[0009] (5) In the energy storage device described in (3) above, the first groove and the second groove are formed on the upper surface of the insulating plate.

[0010] (6) The energy storage device described in (3) above further comprises a housing housing that houses the first energy storage stack, the second energy storage stack, and the third energy storage stack. The housing housing includes a base plate. An insulating plate is disposed on the upper surface of the base plate. A first base plate groove located below the first groove and a second base plate groove located below the second groove are formed on the base plate.

[0011] (7) In the energy storage device described in (1) above, the insulating plate is formed of flexible resin.

[0012] (8) The energy storage device described in (3) above further includes a cooling device, which includes a first cooling plate and a second cooling plate. The first cooling plate is disposed between the first energy storage stack and the second energy storage stack. The second cooling plate is disposed between the second energy storage stack and the third energy storage stack. The first cooling plate is disposed above the first slot, and the second cooling plate is disposed above the second slot.

[0013] The above and other objects, features, aspects and advantages of the present invention will become clear from the following detailed description of the invention as understood in conjunction with the accompanying drawings. Attached Figure Description

[0014] Figure 1 This is a diagram that roughly represents a vehicle equipped with the energy storage device of Embodiment 1.

[0015] Figure 2 yes Figure 1 A schematic exploded perspective view of the energy storage device shown.

[0016] Figure 3 It is a general representation from Figure 1 The diagram shows a top view of the energy storage device with its top cover removed.

[0017] Figure 4 It means Figure 2 The diagram shows a three-dimensional view of the energy storage unit.

[0018] Figure 5 yes Figure 3 A cross-sectional view at the VV line.

[0019] Figure 6 This is a perspective view showing a wiring panel and a battery storage stack.

[0020] Figure 7 yes Figure 3 A sectional view along line VII-VII.

[0021] Figure 8 It is a bottom view showing three busbar modules, three energy storage stacks, and two cooling plates.

[0022] Figure 9 It is an enlarged representation Figure 7 A cross-sectional view of region IX in the diagram.

[0023] Figure 10 It is an enlarged representation Figure 9 The cross-sectional views of the grooves 51j and 51k shown.

[0024] Figure 11 This is a diagram showing the first modified example of the grooves 51j and 51k.

[0025] Figure 12 This is a diagram showing a second modified example of the grooves 51j and 51k.

[0026] Figure 13 This refers to the energy storage device in Embodiment 2. Figure 7 The area shown is an enlarged cross-sectional view of region IX.

[0027] Figure 14 It is an enlarged representation Figure 13 The cross-sectional views of the grooves 51u and 51v shown.

[0028] Figure 15 This is a diagram showing the first modified example of the grooves 51u and 51v.

[0029] Figure 16This is a diagram showing a second modified example of the grooves 51u and 51v.

[0030] Figure 17 This refers to the energy storage device in Implementation Method 3. Figure 7 The area shown is an enlarged cross-sectional view of region IX.

[0031] Figure 18 This refers to the energy storage device in embodiment 4. Figure 7 The area shown is an enlarged cross-sectional view of region IX. Detailed Implementation

[0032] Hereinafter, embodiments and variations of the present disclosure will be described in detail with reference to the accompanying drawings. Furthermore, identical or equivalent parts in the drawings will be labeled with the same reference numerals, and their descriptions will not be repeated.

[0033] [Implementation Method 1]

[0034] Figure 1 This is a schematic diagram of a vehicle equipped with the energy storage device of Embodiment 1. The vehicle 2 includes a vehicle body 3 and an energy storage device 1. Examples of vehicles 2 include hybrid electric vehicles, plug-in hybrid electric vehicles, and battery electric vehicles. The energy storage device 1 is mounted on the bottom of the vehicle body 3.

[0035] Figure 2 yes Figure 1 A schematic exploded perspective view of the energy storage device shown. Figure 3 It is a general representation from Figure 1 The diagram shows a top view of the energy storage device with its top cover removed. Figure 4 It means Figure 2 The diagram shows a three-dimensional view of the energy storage unit. Figure 5 yes Figure 3 A cross-sectional view at the VV line. Figure 6 This is a perspective view showing a wiring panel and a battery storage stack.

[0036] Reference Figure 2 The energy storage device 1 includes multiple energy storage stacks 10, housing 20, insulating plate 30, panel components 40, wiring panel 50, equipment 60, and cooling device 70.

[0037] Multiple energy storage stacks 10 are disposed on the wiring panel 50. In Embodiment 1, the number of energy storage stacks 10 is 6, but the number of energy storage stacks 10 is not limited to 6.

[0038] Each energy storage stack 10 is formed as a cuboid that extends in a first direction. Multiple energy storage stacks 10 are arranged in a manner that intersects both the first direction and the vertical direction. The multiple energy storage stacks 10 are spaced apart in the second direction. In Embodiment 1, the first direction corresponds to the front-rear direction of the vehicle 2, and the second direction corresponds to the width direction of the vehicle 2. In Embodiment 1, the second direction is orthogonal to both the first direction and the vertical direction. The first direction is not limited to the front-rear direction of the vehicle 2. Furthermore, the second direction is not limited to the width direction of the vehicle 2.

[0039] Each energy storage stack 10 includes a plurality of energy storage units 100. The plurality of energy storage units 100 are arranged in a manner that follows a first direction.

[0040] Reference Figure 4 Each energy storage unit 100 includes an electrode body 112 and a unit housing 114.

[0041] The electrode body 112 can be composed of a wound body formed by winding positive and negative electrode plates with a separator between them, or it can be composed of a laminated body formed by stacking positive and negative electrode plates with a separator between them. The electrode body 112 is formed into a shape that is long in the second direction.

[0042] The battery cell housing 114 houses the electrode body 112. The battery cell housing 114 is formed in a cuboid shape. The battery cell housing 114 is made of a metal such as aluminum. The battery cell housing 114 includes a lower surface 114a and an upper surface 114b. The lower surface 114a and the upper surface 114b are arranged at a distance from each other in the vertical direction. The upper surface 114b is positioned above the lower surface 114a.

[0043] Each energy storage unit 100 also includes a battery cell exhaust valve SV. The battery cell exhaust valve SV is disposed on the lower surface 114a of the battery cell housing 114. Each energy storage unit 100 has the battery cell exhaust valve SV located at... Figure 2 The insulating plate 51 shown is configured above the through hole 51h.

[0044] Each energy storage unit 100 also includes a pair of external terminals 120a and 120b. In Embodiment 1, external terminal 120a is the positive terminal and external terminal 120b is the negative terminal. Alternatively, external terminal 120a may be the negative terminal and external terminal 120b may be the positive terminal.

[0045] A pair of external terminals 120a and 120b are disposed on the lower surface 114a of the battery cell housing 114. The pair of external terminals 120a and 120b are disposed at intervals in the width direction of the battery cell housing 114. The width direction of the battery cell housing 114 corresponds to the second direction.

[0046] Reference Figure 2 The housing 20 houses multiple energy storage stacks 10, wiring panels 50, equipment 60, and cooling devices 70. The housing 20 includes a lower housing 210 and an upper cover 220. The upper cover 220 is positioned above the lower housing 210.

[0047] The lower housing 210 is formed to open upwards. The lower housing 210 is formed of a metal such as aluminum. The lower housing 210 includes a base plate 212, a peripheral wall 214, a partition wall 216a, and a partition wall 216b.

[0048] The base plate 212 is formed in a plate shape. In Embodiment 1, the base plate 212 is formed in a solid shape. A plurality of through holes 212h are formed on the base plate 212 at intervals in the first direction and the second direction. Alternatively, the base plate 212 may be formed in a hollow shape.

[0049] Reference Figure 5 The base plate 212 includes a lower surface 212a and an upper surface 212b. The lower surface 212a and the upper surface 212b are arranged at a distance from each other in the vertical direction. The upper surface 212b is arranged above the lower surface 212a.

[0050] Reference Figure 2 The peripheral wall 214 rises from the outer periphery of the base plate 212. The peripheral wall 214 has a shape that surrounds the plurality of energy storage stacks 10.

[0051] Reference Figure 3 The peripheral wall 214 includes side walls 214a, 214b, end plates 214c and 214d. Side walls 214a, 214b, end plates 214c and 214d are each hollow. Alternatively, side walls 214a, 214b, end plates 214c and 214d may also be solid.

[0052] Sidewalls 214a and 214b are arranged spaced apart in a second direction. Sidewalls 214a and 214b are formed to extend in a first direction.

[0053] End plates 214c and 214d are spaced apart in a first direction. End plates 214c and 214d are formed to extend in a second direction. End plate 214c connects one end of sidewall 214a to one end of sidewall 214b. End plate 214d connects the other end of sidewall 214a to the other end of sidewall 214b.

[0054] Breathing membranes 218 and 219 are provided on end plate 214d (see reference). Figure 2Breathing membranes 218 and 219 are waterproof and breathable membranes. Breathing membranes 218 and 219 are formed, for example, from Gore-Tex (registered trademark). In the energy storage device 1, when the internal pressure inside the housing 20 rises, gas inside the housing 20 is discharged to the outside through breathing membranes 218 and 219. Conversely, when the internal pressure inside the housing 20 decreases, gas outside the housing 20 enters the housing 20 through breathing membranes 218 and 219. Furthermore, breathing membranes 218 and 219 can also be vent valves that open when the internal pressure inside the housing 20 reaches a reference value. These vent valves can also be check valves.

[0055] Fixing portions 90 are provided on sidewalls 214a, 214b, end plates 214c and 214d respectively. Each fixing portion 90 is hollow. Alternatively, each fixing portion 90 may be solid.

[0056] Each fixing part 90 is fixed to the vehicle body 3 (refer to) Figure 1 For example, a fixing part 91 is formed on the outer surface of the sidewall 214a. (See reference) Figure 5 The fixing part 91 is formed to protrude from the side wall 214a in a second direction. The fixing part 91 is fixed to the vehicle body 3 by a fastening member 95. For example, the vehicle body 3 includes the vehicle 2 (refer to...) Figure 1 The floor consists of lower side beams 3b spaced apart along its width, a crossbeam connecting the lower side beams 3b, and a floor panel. A fixing part 91 is fixed to the lower side beams 3b by a fastening member 95. Alternatively, the fixing part 91 can also be fixed to the floor panel.

[0057] Reference Figure 3 Partition walls 216a and 216b are disposed within the area surrounded by the base plate 212 and the peripheral wall 214. Partition wall 216a is disposed adjacent to end plate 214c. Partition wall 216b is disposed spaced apart from end plate 214d in a first direction. Both partition walls 216a and 216b are formed to extend in a second direction. Partition walls 216a and 216b have the function of constraining each energy storage stack 10 from both sides in the first direction. Partition walls 216a and 216b are each formed to be hollow. Alternatively, partition walls 216a and 216b may be formed to be solid.

[0058] Reference Figure 5 The upper cover 220 is provided in such a way that it closes the opening of the lower housing 210. For example, the outer peripheral edge of the upper cover 220 is fixed to the upper end of the side wall 214a.

[0059] Reference Figure 2The space formed by the lower housing 210 and the upper cover 220 houses multiple energy storage stacks 10, wiring panels 50, equipment 60 and cooling devices 70.

[0060] The insulating plate 30 is made of an electrically insulating component (e.g., a resin composition). The insulating plate 30 is, for example, formed in a plate shape. A plurality of through holes 30h are formed on the insulating plate 30 at intervals in a first direction and a second direction. The insulating plate 30 is disposed between the panel member 40 and the base plate 212 of the lower housing 210. (Refer to...) Figure 5 The insulating plate 30 is fixed to the lower surface 212a of the base plate 212.

[0061] Reference Figure 2 The panel component 40 functions to protect the base plate 212 of the lower housing 210. The panel component 40 is formed to cover the lower surface 212a of the insulating plate 30 and the base plate 212. The panel component 40 is, for example, formed in a plate shape. (See reference...) Figure 5 A sealing member 81 is disposed between the outer periphery of the panel member 40 and the lower surface 212a of the base plate 212. The outer periphery of the panel member 40 clamps the sealing member 81 in the middle and fixes it to the lower surface 212a of the base plate 212.

[0062] Reference Figure 2 The wiring panel 50 is positioned below the plurality of energy storage stacks 10. (Refer to...) Figure 6 The wiring panel 50 includes an insulating plate 51, multiple busbar modules 510, and multiple insulating protective bodies 52.

[0063] The insulating plate 51 is composed of an electrically insulating component (e.g., a resin composition). For example, the insulating plate 51 is formed of a flexible resin. The insulating plate 51 is, for example, formed in a plate shape. The insulating plate 51 is disposed on the upper surface 212b of the bottom plate 212 of the lower housing 210 (see reference). Figure 5 The partition wall 216a and partition wall 216b (see reference) Figure 2 The part between ).

[0064] The insulating plate 51 includes a lower surface 51a and an upper surface 51b. The lower surface 51a and the upper surface 51b are arranged at a distance from each other in the vertical direction. The upper surface 51b is arranged above the lower surface 51a.

[0065] On the upper surface 51b of the insulating plate 51, a plurality of grooves 51c are formed at intervals in a first direction and a second direction.

[0066] On the insulating plate 51, a plurality of through holes 51h are formed at intervals in the first direction and the second direction.

[0067] Multiple busbar modules 510 are disposed on the upper surface 51b of the insulating plate 51. Each busbar module 510 includes one or more busbars 500. In Embodiment 1, the busbar module 510 includes a busbar array 510a and busbar arrays 510b arranged at intervals from the busbar arrays 510a in a second direction. Both busbar arrays 510a and 510b include multiple busbars 500 arranged in a first direction. Alternatively, the number of busbar arrays included in the busbar module 510 may be one. Furthermore, the number of busbars 500 included in a busbar array may also be one.

[0068] The busbar 500 is formed of a conductive material such as metal. The busbar 500 electrically connects a pair of adjacent energy storage cells 100 in a first direction. The busbar 500 is disposed in a slot 51c and fixed to an insulating plate 51.

[0069] The energy storage stack 10 is disposed on the upper surface of the busbar module 510. The external terminals 120a and 120b of the plurality of energy storage units 100 included in the energy storage stack 10 are connected to the busbar module 510, thereby connecting the plurality of energy storage units 100 in series.

[0070] The insulating protective body 52 is made of a heat-resistant component (e.g., mica). The insulating protective body 52 is disposed on the upper surface 51b of the insulating plate 51. The insulating protective body 52 is disposed in such a way that it closes a plurality of through holes 51h arranged in a first direction. The insulating protective body 52 includes a strip portion 52a extending along the first direction and a plurality of closing portions 52b formed on the lower surface of the strip portion 52a. Each closing portion 52b is disposed within a through hole 51h.

[0071] Reference Figure 5 A space S is formed between the panel component 40 and the base plate 212. Space S serves as a conduit for gas discharged from the battery cell exhaust valve SV of the energy storage unit 100 to flow into the housing 20 (see reference). Figure 2 The exhaust path that discharges smoke externally plays its function.

[0072] Through holes 51h, 212h, and 30h are arranged vertically. A battery cell exhaust valve SV is positioned above the through hole 51h. That is, through holes 51h, 212h, and 30h are positioned opposite the battery cell exhaust valve SV. The sealing portion 52b of the insulating protective body 52 that seals the through hole 51h is also positioned opposite the battery cell exhaust valve SV. When gas is discharged from the battery cell exhaust valve SV, an opening is formed in the sealing portion 52b located below the battery cell exhaust valve SV, and this opening functions as a gas passage. By positioning the through holes 51h, 212h, and 30h opposite the battery cell exhaust valve SV, when gas is discharged from the battery cell exhaust valve SV, the gas flows through the through holes 51h, 212h, and 30h into the space S. The space S extends to... Figure 3 End plate 214d is shown.

[0073] When gas is discharged from any of the energy storage units 100, the gas diffuses through space S in the first direction and through... Figure 2 The breathing membranes 218 and 219 shown are discharged out of the housing 20.

[0074] Reference Figure 3 Equipment class 60 is disposed between partition wall 216b and end plate 214d. Equipment class 60 may also include junction boxes. Equipment class 60 may include relays, control devices, etc.

[0075] The cooling device 70 includes multiple cooling plates 71, an equipment cooler 72, upstream piping 73, and downstream piping 74.

[0076] Each cooling plate 71 is disposed between a pair of adjacent energy storage stacks 10 in the second direction. Each cooling plate 71 is formed as a plate that is longer in the first direction. Each cooling plate 71 has a flow path for the cooling medium to flow along the first direction. In Embodiment 1, the number of cooling plates 71 is 5, but the number of cooling plates 71 is not limited to 5. The number of cooling plates 71 is determined according to the number of energy storage stacks 10.

[0077] Equipment cooler 72 cools equipment 60. Equipment cooler 72 is located between base plate 212 and equipment 60.

[0078] Upstream pipe 73 and downstream pipe 74 are pipes through which cooling media (water, oil, etc.) pass. An inflow port 75 and an outflow port 76 are provided on the end plate 214c of the peripheral wall 214.

[0079] The upstream end of the upstream piping 73 is connected to the inflow port 75. The upstream piping 73 has six downstream ends. One downstream end of the upstream piping 73 is connected to the equipment cooler 72. The remaining downstream ends of the upstream piping 73 are connected to the cooling plates 71. The downstream piping 74 has six upstream ends. One upstream end of the downstream piping 74 is connected to the equipment cooler 72. The remaining upstream ends of the downstream piping 74 are connected to the cooling plates 71. The downstream end of the downstream piping 74 is connected to the outflow port 76. The cooling medium supplied from the inflow port 75 flows through the upstream piping 73 into each cooling plate 71 and the equipment cooler 72, and after cooling each energy storage unit 100 and equipment 60, flows out through the downstream piping 74 from the outflow port 76.

[0080] Furthermore, each cooling plate 71 may also be disposed between a pair of adjacent energy storage units 100 in the first direction. When each cooling plate 71 is disposed between a pair of adjacent energy storage units 100 in the first direction, each cooling plate 71 is formed as a plate that is longer in the second direction. When each cooling plate 71 is disposed between a pair of adjacent energy storage units 100 in the first direction, the plurality of energy storage stacks 10 may also be disposed without spacing in the second direction.

[0081] Figure 7 yes Figure 3 A sectional view along line VII-VII. Figure 8 It is a bottom view showing three busbar modules, three energy storage stacks, and two cooling plates. Figure 9 It is an enlarged representation Figure 7 A cross-sectional view of region IX in the diagram. Figure 10 It is an enlarged representation Figure 9 The cross-sectional views of the grooves 51j and 51k shown.

[0082] Reference Figure 7 The aforementioned plurality of energy storage stacks 10 include energy storage stack 11, energy storage stack 12, and energy storage stack 13. Energy storage stack 11 is an example of a "first energy storage stack" in this disclosure. Energy storage stack 12 is an example of a "second energy storage stack" in this disclosure. Energy storage stack 13 is an example of a "third energy storage stack" in this disclosure. Energy storage stack 12 is configured to be adjacent to energy storage stack 11 in a second direction. Energy storage stack 13 is arranged to be adjacent to energy storage stack 12 in a second direction. Energy storage stacks 11, 12, and 13 are sequentially arranged along the second direction.

[0083] The aforementioned plurality of cooling plates 71 includes cooling plate 71a and cooling plate 71b. Cooling plate 71a is an example of a "first cooling plate" in this disclosure. Cooling plate 71b is an example of a "second cooling plate" in this disclosure. Cooling plate 71a is a cooling plate 71 disposed between the energy storage stack 11 and the energy storage stack 12. Cooling plate 71a is formed to extend in a first direction. Cooling plate 71b is a cooling plate 71 disposed between the energy storage stack 12 and the energy storage stack 13. Cooling plate 71b is formed to extend in the first direction. In Embodiment 1, the energy storage stack 12 is configured to be adjacent to the energy storage stack 11 in a second direction, separated by cooling plate 71a. The energy storage stack 13 is configured to be adjacent to the energy storage stack 12 in a second direction, separated by cooling plate 71b. Alternatively, cooling plate 71a may not be disposed between the energy storage stack 11 and the energy storage stack 12. Alternatively, the cooling plate 71b may not be placed between the energy storage stack 12 and the energy storage stack 13.

[0084] Reference Figure 8 The energy storage stack 11 includes a plurality of energy storage units 101 arranged in a first direction. The energy storage stack 12 includes a plurality of energy storage units 102 arranged in a first direction. The energy storage stack 13 includes a plurality of energy storage units 103 arranged in a first direction. Energy storage unit 101 is an example of a "first energy storage unit" in this disclosure. Energy storage unit 102 is an example of a "second energy storage unit" in this disclosure. Energy storage unit 103 is an example of a "third energy storage unit" in this disclosure.

[0085] The aforementioned multiple busbar modules 510 include busbar module 511, busbar module 512, and busbar module 513. (See reference...) Figure 7 Busbar modules 511, 512, and 513 are disposed on the insulating plate 51. More specifically, busbar modules 511, 512, and 513 are disposed on the upper surface 51b of the insulating plate 51.

[0086] Reference Figure 8 Busbar module 511 is a busbar module 510 that electrically connects the plurality of energy storage units 101 in the plurality of busbar modules 510 described above. Busbar module 511 is an example of the "first busbar module" in this disclosure. External terminals 120a and 120b of the plurality of energy storage units 101 are connected to busbar module 511. The plurality of energy storage units 101 are connected to busbar module 511 in series via external terminals 120a and 120b.

[0087] Bus module 511 includes bus array 511a and bus array 511b. Bus array 511a is bus array 510a included in bus module 511, and bus array 511b is bus array 510b included in bus module 511. Bus array 511a includes bus 501a. Bus 501a is an example of bus 500 included in bus array 511a. Bus array 511b is positioned closer to bus module 512 than bus array 511a. Bus array 511b includes bus 501b. Bus 501b is an example of bus 500 included in bus array 511b.

[0088] The plurality of energy storage units 101 includes three adjacent energy storage units 101. These three adjacent energy storage units 101 include energy storage unit 101a, energy storage unit 101b, and energy storage unit 101c. Energy storage unit 101a is located at the center of the three adjacent energy storage units 101 in a first direction. Energy storage unit 101b is located to one side of energy storage unit 101a in the first direction. Energy storage unit 101c is located to the other side of energy storage unit 101a in the first direction. Busbar 501a electrically connects energy storage unit 101a and energy storage unit 101b. Busbar 501b electrically connects energy storage unit 101a and energy storage unit 101c.

[0089] Busbar module 512 is a busbar module 510 that electrically connects multiple energy storage units 102 in the aforementioned multiple busbar modules 510. Busbar module 512 is an example of a "second busbar module" in this disclosure. External terminals 120a and 120b of the multiple energy storage units 102 are connected to busbar module 512. The multiple energy storage units 102 are connected to busbar module 512 in series via external terminals 120a and 120b.

[0090] Bus module 512 includes bus array 512a and bus array 512b. Bus array 512a is bus array 510a included in bus module 512, and bus array 512b is bus array 510b included in bus module 512. Bus array 512a includes bus 502a. Bus 502a is an example of bus 500 included in bus array 512a. Bus array 512b is positioned closer to bus module 513 than bus array 512a. Bus array 512b includes bus 502b. Bus 502b is an example of bus 500 included in bus array 512b.

[0091] The plurality of energy storage units 102 includes three adjacent energy storage units 102. These three adjacent energy storage units 102 include energy storage unit 102a, energy storage unit 102b, and energy storage unit 102c. Energy storage unit 102a is located at the center of the three adjacent energy storage units 102 in a first direction. Energy storage unit 102b is located to one side of energy storage unit 102a in the first direction. Energy storage unit 102c is located to the other side of energy storage unit 102a in the first direction. Busbar 502a electrically connects energy storage unit 102a and energy storage unit 102b. Busbar 502b electrically connects energy storage unit 102a and energy storage unit 102c.

[0092] Busbar module 513 is a busbar module 510 that electrically connects the plurality of energy storage units 103 in the plurality of busbar modules 510 described above. Busbar module 513 is an example of a "third busbar module" in this disclosure. External terminals 120a and 120b of the plurality of energy storage units 103 are connected to busbar module 513. The plurality of energy storage units 103 are connected to busbar module 513 in series via external terminals 120a and 120b.

[0093] Bus module 513 includes bus array 513a and bus array 513b. Bus array 513a is bus array 510a included in bus module 513, and bus array 513b is bus array 510b included in bus module 513. Bus array 513a includes bus 503a. Bus 503a is an example of bus 500 included in bus array 513a. Bus array 513b is configured on the side opposite to bus module 512 compared to bus array 513a. Bus array 513b includes bus 503b. Bus 503b is an example of bus 500 included in bus array 513b.

[0094] The plurality of energy storage units 103 includes three adjacent energy storage units 103. These three adjacent energy storage units 103 include energy storage unit 103a, energy storage unit 103b, and energy storage unit 103c. Energy storage unit 103a is located at the center of the three adjacent energy storage units 103 in a first direction. Energy storage unit 103b is located to one side of energy storage unit 103a in the first direction. Energy storage unit 103c is located to the other side of energy storage unit 103a in the first direction. Busbar 503a electrically connects energy storage unit 103a and energy storage unit 103b. Busbar 503b electrically connects energy storage unit 103a and energy storage unit 103c.

[0095] Reference Figure 7The wiring panel 50 is disposed below the energy storage stack 11, energy storage stack 12 and energy storage stack 13. As described above, the wiring panel 50 includes an insulating plate 51, a plurality of busbar modules 510 and a plurality of insulating protectors 52.

[0096] Reference Figure 9 and Figure 10 The insulating plate 51 has first bending points j1, j2, j3 disposed between the busbar module 511 and the busbar module 512, and second bending points k1, k2, k3 disposed between the busbar module 512 and the busbar module 513. Figure 10 The portions enclosed by dashed lines represent the first bending origins j1, j2, j3 and the second bending origins k1, k2, k3. Specifically, grooves 51j and 51k are formed in the insulating plate 51. Groove 51j is an example of a "first groove" in this disclosure. Groove 51k is an example of a "second groove" in this disclosure.

[0097] A groove 51j is formed on the lower surface 51a of the insulating plate 51. The groove 51j extends along a first direction. The groove 51j is located below the first gap P1 between busbar modules 511 and 512. The first gap P1 is between busbar arrays 511b and 512a. First bending points j1, j2, and j3 are the corners of the groove 51j. That is, the groove 51j has corners at the first bending points j1, j2, and j3. Figure 10 In the example shown, the first bending start points j1 and j3 are the angular parts in the groove 51j, and the first bending start point j2 is the bent part in the groove 51j.

[0098] A groove 51k is formed on the lower surface 51a of the insulating plate 51. The groove 51k extends along a first direction. The groove 51k is located below the second gap P2 between the busbar module 512 and the busbar module 513. The second gap P2 is between the busbar array 512b and the busbar array 513a. The second bending points k1, k2, and k3 are the corners of the groove 51k. That is, the groove 51k has corners at the second bending points k1, k2, and k3. Figure 10 In the example shown, the second bending start points k1 and k3 are the angular parts in the groove 51k, and the second bending start point k2 is the bending part in the groove 51k.

[0099] The busbar module 512 is fixed in the region Q between the groove 51j with the first bending start points j1, j2, j3 as corners and the groove 51k with the second bending start points k1, k2, k3 as corners in the insulating plate 51.

[0100] The upper surface 51b of the insulating plate 51 is formed flat. Alternatively, the upper surface 51b may not be flat. The upper surface 51b may also bulge above the groove 51j and above the groove 51k.

[0101] The upper surface 212b of the base plate 212 is curved along the lower surface 51a of the insulating plate 51. Grooves 212j and 212k are formed on the lower surface 212a of the base plate 212. Groove 212j is an example of a "first base plate groove" in this disclosure. Groove 212k is an example of a "second base plate groove" in this disclosure. Grooves 212j and 212k are formed extending along a first direction. Groove 212j is located below groove 51j. Groove 212k is located below groove 51k.

[0102] The insulating plate 30 includes a lower surface 30a and an upper surface 30b. The lower surface 30a and the upper surface 30b are arranged at a distance from each other in the vertical direction. The upper surface 30b is positioned above the lower surface 30a. The upper surface 30b of the insulating plate 30 is curved along the lower surface 212a of the base plate 212. A groove 30j and a groove 30k are formed on the lower surface 30a of the insulating plate 30. The groove 30j and the groove 30k are respectively formed in a manner extending along a first direction. The groove 30j is located below the groove 51j. The groove 30k is located below the groove 51k. Alternatively, the lower surface 30a may be formed flat.

[0103] Cooling plate 71a is disposed above groove 51j. Cooling plate 71a is positioned upwards from groove 51j. Cooling plate 71b is disposed above groove 51k. Cooling plate 71b is positioned upwards from groove 51k. Alternatively, cooling plate 71a may not be disposed above groove 51j. Alternatively, cooling plate 71b may not be disposed above groove 51k.

[0104] By forming grooves 51j and 51k in the insulating plate 51, when an impact is applied to the energy storage device 1 from below, stress concentrates in the grooves 51j and 51k, reducing the stress applied to region Q. That is, region Q is less prone to deformation when an impact is applied to the energy storage device 1 from below. Therefore, poor connection between the busbar module 512 fixed to region Q and the external terminals 120a and 120b (external terminals 120a and 120b of the plurality of energy storage units 102 included in the energy storage stack 12) connected to the busbar module 512 is suppressed. Because poor connection between the busbar module 512 and the external terminals 120a and 120b connected to the busbar module 512 is suppressed, short circuits between the plurality of energy storage units 102 are also suppressed.

[0105] Furthermore, the base plate 212 has a groove 212j located below the groove 51j and a groove 212k located below the groove 51k. As a result, when an impact is input to the energy storage device 1 from below, the stress tends to concentrate in the groove 51j and the groove 51k.

[0106] Furthermore, since the insulating plate 30 has a groove 30j located below the groove 51j and a groove 30k located below the groove 51k, stress tends to concentrate in the groove 51j and groove 51k when an impact is input to the energy storage device 1 from below.

[0107] Cooling plate 71a is positioned above the tank portion 51j, and cooling plate 71b is positioned above the tank portion 51k, thereby effectively utilizing the limited space within the energy storage device 1. Cooling plate 71a is positioned upwards from the tank portion 51j, and cooling plate 71b is positioned upwards from the tank portion 51k, thereby preventing the impact from reaching cooling plates 71a and 71b when an impact is input to the energy storage device 1 from below.

[0108] Thus, the energy storage device 1 in Embodiment 1 includes: an energy storage stack 11, including an energy storage unit 101; an energy storage stack 12, arranged adjacent to the energy storage stack 11, and including an energy storage unit 102; an energy storage stack 13, arranged adjacent to the energy storage stack 12, and including an energy storage unit 103; an insulating plate 51, disposed below the energy storage stack 11, the energy storage stack 12, and the energy storage stack 13; and busbar modules 511, 512, and 513, which are disposed on the insulating plate 51. The insulating plate 51 has first bending points j1, j2, and j3 disposed between the busbar modules 511 and 512, and second bending points k1, k2, and k3 disposed between the busbar modules 512 and 513.

[0109] Therefore, when an impact is applied to the energy storage device 1 from below, stress concentrates on the groove portion 51j with corners at the first bending points j1, j2, j3 and the groove portion 51k with corners at the second bending points k1, k2, k3, thus reducing the stress in the region Q between the groove portions 51j and 51k in the insulating plate 51. That is, region Q is less prone to deformation when an impact is applied to the energy storage device 1 from below. Therefore, the energy storage device 1 in Embodiment 1 can suppress the occurrence of poor connection between the busbar module 512 fixed to region Q and the external terminals 120a, 120b (external terminals 120a, 120b of the energy storage unit 102 included in the energy storage stack 12) connected to the busbar module 512.

[0110] Furthermore, in the energy storage device 1 of Embodiment 1, the energy storage stack 11 includes a plurality of energy storage units 101. The energy storage stack 12 includes a plurality of energy storage units 102. The energy storage stack 13 includes a plurality of energy storage units 103. The busbar module 511 electrically connects the plurality of energy storage units 101. The busbar module 512 electrically connects the plurality of energy storage units 102. The busbar module 513 electrically connects the plurality of energy storage units 103. As described above, the energy storage device 1 of Embodiment 1 can suppress the occurrence of poor connection between the busbar module 512 fixed in the region Q between the slot 51j and the slot 51k and the external terminals 120a, 120b connected to the busbar module 512. Since the occurrence of poor connection between the busbar module 512 and the external terminals 120a, 120b connected to the busbar module 512 is suppressed, short circuits among the plurality of energy storage units 102 included in the energy storage stack 12 are also suppressed.

[0111] Furthermore, in the energy storage device 1 of Embodiment 1, the first bending points j1, j2, j3 are the corners of the groove portion 51j, and the second bending points k1, k2, k3 are the corners of the groove portion 51k. Therefore, when an impact is applied to the energy storage device 1 from below, stress tends to concentrate in the groove portion 51j with the first bending points j1, j2, j3 as corners and the groove portion 51k with the second bending points k1, k2, k3 as corners, thus reducing the stress in the region Q between the groove portion 51j and the groove portion 51k in the insulating plate 51.

[0112] In Embodiment 1, a groove 212j located below groove 51j and a groove 212k located below groove 51k are formed on the base plate 212. Therefore, when an impact is input to the energy storage device 1 from below, stress tends to concentrate in grooves 51j and 51k. This suppresses the occurrence of poor connections between the busbar module 512 fixed in the region Q between grooves 51j and 51k and the external terminals 120a and 120b (external terminals 120a and 120b of the energy storage unit 102 included in the energy storage stack 12) connected to the busbar module 512.

[0113] In Embodiment 1, the insulating plate 51 is formed of flexible resin. Therefore, according to the energy storage device 1 in Embodiment 1, it is easy to form grooves 51j and 51k in the insulating plate 51.

[0114] In Embodiment 1, cooling plate 71a is disposed above tank portion 51j, and cooling plate 71b is disposed above tank portion 51k. Therefore, according to the energy storage device 1 in Embodiment 1, the limited space within the energy storage device 1 can be effectively utilized.

[0115] Furthermore, the shapes of the grooves 51j and 51k are not limited to... Figure 10The shapes shown are as follows. The shapes of grooves 51j and 51k could also be, for example, [other shapes]. Figure 11 The shape shown. Figure 11 This is a diagram showing the first modified example of the grooves 51j and 51k. In Figure 11 The areas enclosed by dashed lines represent the first bend starting points j1, j2, j3 and the second bend starting points k1, k2, k3. Figure 11 In the example shown, the first bending starting points j1, j2, and j3 are the angular parts of the groove 51j, and the second bending starting points k1, k2, and k3 are the angular parts of the groove 51k. That is, the groove 51j and the groove 51k can also each have all the angular parts.

[0116] The shapes of the grooves 51j and 51k can also be, for example, Figure 12 The shape shown. Figure 12 This is a diagram showing a second modified example of the grooves 51j and 51k. In Figure 12 The portions surrounded by dashed lines represent the first bending points j1, j2, j3, j4 and the second bending points k1, k2, k3, k4. The insulating plate 51 has first bending points j1, j2, j3, j4 disposed between busbar modules 511 and 512, and second bending points k1, k2, k3, k4 disposed between busbar modules 512 and 513. The first bending points j1, j2, j3, j4 are the corners of the groove portion 51j. That is, the groove portion 51j has corners formed by the first bending points j1, j2, j3, j4. The second bending points k1, k2, k3, k4 are the corners of the groove portion 51k. That is, the groove portion 51k has corners formed by the second bending points k1, k2, k3, k4. Figure 12 In the example shown, the first bending points j1, j2, j3, and j4 are the bending portions in the groove 51j, and the second bending points k1, k2, k3, and k4 are the bending portions in the groove 51k. That is, the grooves 51j and 51k can also each have the shape of complete corner bending.

[0117] [Implementation Method 2]

[0118] In Embodiment 1, grooves 51j and 51k are formed on the lower surface 51a of the insulating plate 51. In contrast, in Embodiment 2, grooves are formed on the upper surface of the insulating plate 51.

[0119] Figure 13 This refers to the energy storage device in Embodiment 2. Figure 7 The area shown is an enlarged cross-sectional view of region IX. Figure 14 It is an enlarged representation Figure 13 Cross-sectional views of the grooves 51u and 51v shown. (Refer to...) Figure 13 and Figure 14 In embodiment 2, the insulating plate 51 of the energy storage device 1A has first bending points u1, u2, u3 disposed between the busbar module 511 and the busbar module 512, and second bending points v1, v2, v3 disposed between the busbar module 512 and the busbar module 513. Figure 14 The portions surrounded by dashed lines represent the first bending points u1, u2, u3 and the second bending points v1, v2, v3. Specifically, in Embodiment 2, the insulating plate 51 of the energy storage device 1A has grooves 51u and 51v. Groove 51u is an example of the "first groove" in this disclosure. Groove 51v is an example of the "second groove" in this disclosure.

[0120] A groove 51u is formed on the upper surface 51b of the insulating plate 51. The groove 51u is formed extending along a first direction. The groove 51u is located below the first gap P1. The first bending points u1, u2, and u3 are the corners of the groove 51u. That is, the groove 51u has corners formed by the first bending points u1, u2, and u3. Figure 14 In the example shown, the first bending start points u1 and u3 are the angular parts in the groove 51u, and the first bending start point u2 is the bent part in the groove 51u.

[0121] A groove 51v is formed on the upper surface 51b of the insulating plate 51. The groove 51v extends in a first direction. The groove 51v is located below the second gap P2. The second bending points v1, v2, and v3 are the corners of the groove 51v. That is, the groove 51v is a groove with the second bending points v1, v2, and v3 as its corners. The second bending points v1 and v3 are the angular parts of the groove 51v, and the second bending point v2 is the bent part of the groove 51v.

[0122] The busbar module 512 is fixed in the region Q1 between the groove 51u with the first bending points u1, u2, u3 as corners and the groove 51v with the second bending points v1, v2, v3 as corners in the insulating plate 51. The lower surface 51a of the insulating plate 51 is formed flatly along the upper surface 212b of the base plate 212.

[0123] The upper surface 212b of the base plate 212 is formed flat. Grooves 212j and 212k are formed on the lower surface 212a of the base plate 212. Groove 212j is an example of a "first base plate groove" in this disclosure. Groove 212k is an example of a "second base plate groove" in this disclosure. Grooves 212j and 212k are formed extending along a first direction. Groove 212j is located below groove 51u. Groove 212k is located below groove 51v.

[0124] The upper surface 30b of the insulating plate 30 is curved along the lower surface 212a of the base plate 212. Grooves 30j and 30k are formed on the lower surface 30a of the insulating plate 30. Grooves 30j and 30k are formed extending in a first direction. Groove 30j is located below groove 51u. Groove 30k is located below groove 51v. Alternatively, the lower surface 30a may be formed flat.

[0125] Cooling plate 71a is disposed above the groove 51u. Cooling plate 71a is positioned upwards from the groove 51u. Cooling plate 71b is disposed above the groove 51v. Cooling plate 71b is positioned upwards from the groove 51v. Alternatively, cooling plate 71a may not be disposed above the groove 51u. Alternatively, cooling plate 71b may not be disposed above the groove 51v.

[0126] In other respects, the energy storage device 1A is the same as the energy storage device 1 in Embodiment 1.

[0127] When an impact is applied to the energy storage device 1A in Embodiment 2 from below, stress concentrates on the groove portion 51u with corners at the first bending points u1, u2, u3 and the groove portion 51v with corners at the second bending points v1, v2, v3. Stress is reduced in the region Q1 between the groove portions 51u and 51v in the insulating plate 51. That is, region Q1 is less prone to deformation when an impact is applied to the energy storage device 1A from below. Therefore, the energy storage device 1A in Embodiment 2 can suppress the occurrence of poor connection between the busbar module 512 fixed to region Q1 and the external terminals 120a, 120b (external terminals 120a, 120b of the energy storage unit 102 included in the energy storage stack 12) connected to the busbar module 512.

[0128] In the energy storage device 1A of Embodiment 2, a groove 212j located below the groove 51u and a groove 212k located below the groove 51v are formed on the base plate 212. Therefore, when an impact is input to the energy storage device 1A from below, stress tends to concentrate in the grooves 51u and 51v. This suppresses the occurrence of poor connections between the busbar module 512 fixed in the region Q1 between the grooves 51u and 51v and the external terminals 120a and 120b (external terminals 120a and 120b of the energy storage unit 102 included in the energy storage stack 12) connected to the busbar module 512.

[0129] Furthermore, the shapes of the grooves 51u and 51v are not limited to... Figure 14 The shapes shown are as follows. The shapes of the grooves 51u and 51v could also be, for example, [other shapes]. Figure 15 The shape shown. Figure 15This is a diagram showing a first modified example of the grooves 51u and 51v. Figure 15 The areas enclosed by dashed lines represent the first bend starting points u1, u2, u3 and the second bend starting points v1, v2, v3. Figure 15 In the example shown, the first bending starting points u1, u2, and u3 are the angular parts of the groove 51u, and the second bending starting points v1, v2, and v3 are the angular parts of the groove 51v. That is, the groove 51u and the groove 51v can also each have all the angular parts.

[0130] The shapes of the grooves 51u and 51v can also be, for example, Figure 16 The shape shown. Figure 16 This is a diagram showing a second modified example of the grooves 51u and 51v. Figure 16 The portions enclosed by dashed lines represent the first bending points u1, u2, u3, u4 and the second bending points v1, v2, v3, v4. The insulating plate 51 has first bending points u1, u2, u3, u4 disposed between busbar modules 511 and 512, and second bending points v1, v2, v3, v4 disposed between busbar modules 512 and 513. The first bending points u1, u2, u3, u4 are the corners of the groove portion 51u. That is, the groove portion 51u has corners formed by the first bending points u1, u2, u3, u4. The second bending points v1, v2, v3, v4 are the corners of the groove portion 51v. That is, the groove portion 51v has corners formed by the second bending points v1, v2, v3, v4. Figure 16 In the example shown, the first bending points u1, u2, u3, u4 are the bending portions in the groove 51u, and the second bending points v1, v2, v3, v4 are the bending portions in the groove 51v. That is, the grooves 51u and 51v can also each have a shape with all the corners bent.

[0131] [Implementation Method 3]

[0132] In Embodiment 1, grooves 51j and 51k are formed on the lower surface 51a of the insulating plate 51, but no grooves are formed on the upper surface 51b of the insulating plate 51. In contrast, in Embodiment 3, grooves are formed on both the lower and upper surfaces of the insulating plate 51.

[0133] Figure 17 This refers to the energy storage device in Implementation Method 3. Figure 7The diagram shows a magnified cross-sectional view of region IX. In embodiment 3, the insulating plate 51 of the energy storage device 1B has grooves 51j, 51k, 51u, and 51v. Grooves 51j and 51u are examples of the "first groove" in this disclosure. Grooves 51k and 51v are examples of the "second groove" in this disclosure.

[0134] Grooves 51j and 51k are formed on the lower surface 51a of the insulating plate 51. Grooves 51j and 51k are formed extending along a first direction. Groove 51j is located below the first gap P1. Groove 51k is located below the second gap P2. As described above, groove 51j has corners at the first bending points j1, j2, and j3, and groove 51k has corners at the second bending points k1, k2, and k3 (see reference). Figure 10 ).

[0135] Grooves 51u and 51v are formed on the upper surface 51b of the insulating plate 51. Grooves 51u and 51v are formed extending along a first direction. Groove 51u is located below the first gap P1 and above groove 51j. Groove 51v is located below the second gap P2 and above groove 51k. As described above, groove 51u is a groove with corners at the first bending points u1, u2, u3, and groove 51v is a groove with corners at the second bending points v1, v2, v3 (see reference). Figure 14 ).

[0136] The busbar module 512 is fixed in the region Q between the groove 51j with the first bending start points j1, j2, j3 as corners and the groove 51k with the second bending start points k1, k2, k3 as corners in the insulating plate 51.

[0137] The upper surface 212b of the base plate 212 is curved along the lower surface 51a of the insulating plate 51. Grooves 212j and 212k are formed on the lower surface 212a of the base plate 212. Groove 212j is an example of a "first base plate groove" in this disclosure. Groove 212k is an example of a "second base plate groove" in this disclosure. Grooves 212j and 212k are formed extending along a first direction. Groove 212j is located below grooves 51j and 51u. Groove 212k is located below grooves 51k and 51v.

[0138] The upper surface 30b of the insulating plate 30 is curved along the lower surface 212a of the base plate 212. Grooves 30j and 30k are formed on the lower surface 30a of the insulating plate 30. Grooves 30j and 30k are formed extending in a first direction. Groove 30j is located below groove 51j. Groove 30k is located below groove 51k. Alternatively, the lower surface 30a may be formed flat.

[0139] Cooling plate 71a is disposed above slots 51j and 51u. Cooling plate 71a is positioned upwards from slots 51j and 51u. Cooling plate 71b is disposed above slots 51k and 51v. Cooling plate 71b is positioned upwards from slots 51k and 51v. Alternatively, cooling plate 71a may not be disposed above slots 51j and 51u. Alternatively, cooling plate 71b may not be disposed above slots 51k and 51v.

[0140] In other respects, the energy storage device 1B is the same as the energy storage device 1 in Embodiment 1.

[0141] When an impact is applied to the energy storage device 1B in Embodiment 3 from below, stress concentration occurs in the groove portion 51j with corners at the first bending points j1, j2, j3; the groove portion 51k with corners at the second bending points k1, k2, k3; the groove portion 51u with corners at the first bending points u1, u2, u3; and the groove portion 51v with corners at the second bending points v1, v2, v3. Stress is reduced in the region Q between the groove portions 51j and 51k in the insulating plate 51. In other words, region Q is less prone to deformation when an impact is applied to the energy storage device 1B from below. Therefore, the energy storage device 1B in embodiment 3 can suppress the occurrence of poor connection between the busbar module 512 fixed in region Q and the external terminals 120a, 120b (external terminals 120a, 120b of the energy storage unit 102 included in the energy storage stack 12) connected to the busbar module 512.

[0142] In the energy storage device 1B of Embodiment 3, a groove 51j and a groove 212j located below the groove 51u, as well as a groove 51k and a groove 212k located below the groove 51v, are formed on the base plate 212. Therefore, when an impact is input to the energy storage device 1B from below, stress tends to concentrate in the grooves 51j, 51k, 51u, and 51v. This suppresses the occurrence of poor connections between the busbar module 512 fixed in the region Q between the grooves 51j and 51k and the external terminals 120a and 120b (external terminals 120a and 120b of the energy storage unit 102 included in the energy storage stack 12) connected to the busbar module 512.

[0143] Alternatively, the busbar module 512 can also be fixed in region Q1 between slots 51u and 51v. In this case, when an impact is input to the energy storage device 1B from below, stress is concentrated in slots 51j, 51k, 51u, and 51v, and the stress applied to region Q1 in the insulating plate 51 is reduced. Therefore, poor connection between the busbar module 512 fixed in region Q1 and the external terminals 120a and 120b (external terminals 120a and 120b of the energy storage unit 102 included in the energy storage stack 12) connected to the busbar module 512 is suppressed.

[0144] [Implementation Method 4]

[0145] In Embodiment 1, grooves 51j and 51k are formed on the lower surface 51a of the insulating plate 51, and grooves 212j and 212k are formed on the lower surface 212a of the base plate 212. In contrast, in Embodiment 4, grooves are formed on the upper surface of the insulating plate 51 and on the upper surface of the base plate 212.

[0146] Figure 18 This refers to the energy storage device in embodiment 4. Figure 7 The diagram shows an enlarged cross-sectional view of region IX. In embodiment 4, the insulating plate 51 of the energy storage device 1C has a groove 51u and a groove 51v. Groove 51u is an example of a "first groove" in this disclosure. Groove 51v is an example of a "second groove" in this disclosure.

[0147] Grooves 51u and 51v are formed on the upper surface 51b of the insulating plate 51. Grooves 51u and 51v are formed extending along a first direction. Groove 51u is located below the first gap P1. Groove 51v is located below the second gap P2. As described above, groove 51u is a groove with corners at the first bending points u1, u2, and u3, and groove 51v is a groove with corners at the second bending points v1, v2, and v3 (see reference). Figure 14 ).

[0148] The busbar module 512 is fixed in the region Q1 between the groove 51u with the first bending start points u1, u2, u3 as corners and the groove 51v with the second bending start points v1, v2, v3 as corners in the insulating plate 51. The lower surface 51a of the insulating plate 51 is bent along the upper surface 212b of the base plate 212.

[0149] Grooves 212u and 212v are formed on the upper surface 212b of the base plate 212. Groove 212u is an example of a "first base plate groove" in this disclosure. Groove 212v is an example of a "second base plate groove" in this disclosure. Grooves 212u and 212v are formed extending along a first direction. Groove 212u is located below groove 51u. Groove 212v is located below groove 51v.

[0150] The lower surface 212a of the base plate 212 is formed flat. Furthermore, as... Figure 9 As shown, grooves 212j and 212k extending in the first direction may also be formed on the lower surface 212a. When grooves 212j and 212k are formed on the lower surface 212a, groove 212j is located below groove 51u, and groove 212k is located below groove 51v.

[0151] The upper surface 30b of the insulating plate 30 is formed flat. Furthermore, grooves 212j and 212k are formed on the lower surface 212a (see reference). Figure 9 In the case of ), the upper surface 30b bends along the lower surface 212a of the base plate 212.

[0152] The lower surface 30a of the insulating plate 30 is formed flat. Furthermore, as... Figure 9 As shown, a groove 30j extending in the first direction and a groove 30k extending in the first direction may also be formed on the lower surface 30a. The groove 30j and groove 30k are formed on the lower surface 30a (see reference). Figure 9 In the case of ), the groove 30j is located below the groove 51u, and the groove 30k is located below the groove 51v.

[0153] Cooling plate 71a is disposed above the groove 51u. Cooling plate 71a is positioned upwards from the groove 51u. Cooling plate 71b is disposed above the groove 51v. Cooling plate 71b is positioned upwards from the groove 51v. Alternatively, cooling plate 71a may not be disposed above the groove 51u. Alternatively, cooling plate 71b may not be disposed above the groove 51v.

[0154] In other respects, the energy storage device 1C is the same as the energy storage device 1 in Embodiment 1.

[0155] When an impact is applied to the energy storage device 1C in Embodiment 4 from below, stress concentrates on the groove portion 51u with corners at the first bending points u1, u2, u3 and the groove portion 51v with corners at the second bending points v1, v2, v3. Stress is reduced in the region Q1 between the groove portions 51u and 51v in the insulating plate 51. That is, region Q1 is less prone to deformation when an impact is applied to the energy storage device 1C from below. Therefore, the energy storage device 1C in Embodiment 4 can suppress the occurrence of poor connection between the busbar module 512 fixed to region Q1 and the external terminals 120a, 120b (external terminals 120a, 120b of the energy storage unit 102 included in the energy storage stack 12) connected to the busbar module 512.

[0156] In the energy storage device 1C of Embodiment 4, a groove 212u is formed on the base plate 212 below the groove 51u and a groove 212v is formed below the groove 51v. Therefore, when an impact is input to the energy storage device 1C from below, stress tends to concentrate in the grooves 51u and 51v. This suppresses the occurrence of poor connection between the busbar module 512 fixed in the region Q1 between the grooves 51u and 51v and the external terminals 120a and 120b (external terminals 120a and 120b of the energy storage unit 102 included in the energy storage stack 12) connected to the busbar module 512.

[0157] Embodiments of the present invention have been described, but should be considered as illustrative rather than restrictive in all respects. The scope of the invention is defined by the claims and is intended to include all modifications within the meaning and scope equivalent to the claims.

Claims

1. An energy storage device, wherein, The energy storage device includes: The first energy storage stack includes a first energy storage unit; The second energy storage stack is configured adjacent to the first energy storage stack and includes a second energy storage unit; The third energy storage stack is configured adjacent to the second energy storage stack and includes a third energy storage unit; and A wiring panel is disposed below the first, second, and third energy storage stacks. The wiring panel includes: Insulating board; and The first busbar module, the second busbar module, and the third busbar module are disposed on the insulating plate. The first busbar module electrically connects the first energy storage unit. The second busbar module electrically connects the second energy storage unit. The third busbar module electrically connects the third energy storage unit. The insulating plate has: a first bending start point, disposed between the first busbar module and the second busbar module; and a second bending start point, disposed between the second busbar module and the third busbar module.

2. The energy storage device according to claim 1, wherein, The first energy storage stack includes a plurality of first energy storage units arranged in a first direction, wherein the plurality of first energy storage units include the first energy storage units. The second energy storage stack is arranged adjacent to the first energy storage stack in a second direction, which intersects the first direction, and includes a plurality of second energy storage units arranged in the first direction, the plurality of second energy storage units including the second energy storage units. The third energy storage stack is configured adjacent to the second energy storage stack in the second direction and includes a plurality of third energy storage units arranged in the first direction, the plurality of third energy storage units including the third energy storage unit. The first busbar module electrically connects the plurality of first energy storage units. The second busbar module electrically connects the plurality of second energy storage units. The third busbar module electrically connects the plurality of third energy storage units.

3. The energy storage device according to claim 1, wherein, The first bending point is the corner of the first groove formed in the insulating plate. The second bending start point is the corner of the second groove formed in the insulating plate.

4. The energy storage device according to claim 3, wherein, The first groove and the second groove are formed on the lower surface of the insulating plate.

5. The energy storage device according to claim 3, wherein, The first groove and the second groove are formed on the upper surface of the insulating plate.

6. The energy storage device according to claim 3, wherein, The energy storage device also includes a housing that houses the first energy storage stack, the second energy storage stack, and the third energy storage stack. The housing includes a base plate. The insulating plate is disposed on the upper surface of the base plate. The base plate has a first base plate groove located below the first groove and a second base plate groove located below the second groove.

7. The energy storage device according to claim 1, wherein, The insulating board is formed of flexible resin.

8. The energy storage device according to claim 3, wherein, The energy storage device also includes a cooling device, which comprises a first cooling plate and a second cooling plate. The first cooling plate is disposed between the first energy storage stack and the second energy storage stack. The second cooling plate is disposed between the second energy storage stack and the third energy storage stack. The first cooling plate is positioned above the first groove. The second cooling plate is positioned above the second groove.