Chip-in-board assembly and method of making same

Abstract

This invention relates to the field of circuit board technology, providing a chip-embedded circuit board assembly and its manufacturing method. The chip-embedded circuit board assembly includes: a prefabricated circuit board; a chip packaging unit embedded in the prefabricated circuit board, the back of which is provided with heat dissipation fins protruding from the lower surface of the prefabricated circuit board; and a dual-layer cooler disposed below the prefabricated circuit board, the dual-layer cooler including an oil-cooling cavity in contact with the heat dissipation fins and a water-cooling cavity in contact with the oil-cooling cavity, the interfaces of the oil-cooling cavity and the water-cooling cavity being exposed on the prefabricated circuit board. The heat dissipation fins are used to improve heat dissipation performance, and since the heat dissipation fins protrude outwards, the dual-layer cooler does not need to be embedded to achieve contact with the heat dissipation fins, ensuring that the interfaces of the oil-cooling cavity and the water-cooling cavity are exposed for pipeline connection; the oil-cooling cavity is used to cool the heat dissipation fins and provide insulation protection, while the water-cooling cavity is used to cool the oil-cooling cavity, improving thermal conductivity and thus enhancing the cooling effect on the chip packaging unit and the prefabricated circuit board.

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