Packaging structure and packaging process of silicon-based OLED device and silicon-based OLED display device

Abstract

This invention discloses a packaging structure for a silicon-based OLED device, including an OC layer, a light-emitting element disposed on a substrate, an inorganic encapsulation layer disposed on the side of the light-emitting element away from the substrate, and a composite encapsulation layer disposed between the inorganic encapsulation layer and the OC layer and bonded to the inorganic encapsulation layer, the OC layer, and the substrate. The composite encapsulation layer is made of organic materials and inorganic nanofiber materials. The packaging structure of this invention combines organic and inorganic nanofibers, while simultaneously creating micropores on the substrate. The cross-linked structure of the composite material improves the interfacial bonding strength. Using this composite structure effectively improves the bonding strength with the substrate and the OC layer, prevents cutting cracks from penetrating the encapsulation layer, reduces water and oxygen intrusion permeability, and improves the encapsulation effect. This invention also discloses a method for preparing the packaging structure of a silicon-based OLED device and a silicon-based OLED display device.

Description

Technical Field

[0001] This invention belongs to the field of optical display technology. Specifically, this invention relates to a packaging structure, packaging process, and silicon-based OLED display device. Background Technology

[0002] Micro OLED (Micro-Organic Light-Emitting Diode) displays have advantages such as small size, light weight, high contrast, fast response speed and low power consumption. In recent years, they have been widely used as near-eye displays in the fields of virtual reality (VR) and augmented reality (AR).

[0003] In silicon-based OLED devices, the TFE encapsulation layer is prone to stress due to the difference in thermal expansion coefficients with the OC layer (capping layer) in high-temperature and high-humidity environments, leading to delamination, spots on the product, and affecting its use. The encapsulation layer is fabricated on a whole surface using equipment such as plasma chemical vapor deposition (PECVD), inkjet printing (IJP), and atomic layer deposition. The encapsulation layer is a single organic or inorganic layer, and cracks during cutting can easily cause the encapsulation layer to fail.

[0004] A packaging structure for a silicon-based OLED device is provided, particularly concerning improving interfacial adhesion, which can effectively enhance the adhesion to the substrate and OC layer, prevent cutting cracks from invading the packaging layer, reduce water and oxygen intrusion penetration rate, and improve the packaging effect. Summary of the Invention

[0005] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention provides a packaging structure for a silicon-based OLED device, with the purpose of improving interfacial adhesion, effectively enhancing adhesion to the substrate and OC layer, preventing cutting cracks from penetrating the packaging layer, reducing water and oxygen intrusion penetration, and improving the packaging effect.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows: a packaging structure for a silicon-based OLED device, including an OC layer, a light-emitting element disposed on a substrate, an inorganic encapsulation layer disposed on the side of the light-emitting element away from the substrate, and a composite encapsulation layer disposed between the inorganic encapsulation layer and the OC layer and bonded to the inorganic encapsulation layer, the OC layer and the substrate, wherein the material of the composite encapsulation layer includes organic materials and inorganic nanofiber materials.

[0007] The inorganic nanofiber material is SiO or TiO.

[0008] The organic material is a polyurethane-based material.

[0009] The content of the inorganic nanofiber material is 10%-15%.

[0010] The substrate has micropores, and the composite encapsulation layer includes an embedding portion embedded in the micropores.

[0011] Multiple micropores are provided, and the depth of the micropores is between 200-400nm.

[0012] Multiple light-emitting elements are provided, and the multiple light-emitting elements are arranged side by side along two directions to form a matrix arrangement structure.

[0013] The present invention also provides a silicon-based OLED display device, including a substrate and a packaging structure for the silicon-based OLED device.

[0014] This invention also provides a method for fabricating a packaging structure for a silicon-based OLED device, comprising the following steps:

[0015] S1. Provide a substrate;

[0016] S2. A light-emitting element is formed on one side of the substrate;

[0017] S3. An inorganic encapsulation layer is formed on the side of the light-emitting element away from the substrate;

[0018] S4. A composite encapsulation layer is formed on the side of the inorganic encapsulation layer away from the substrate;

[0019] S5. An OC layer is formed on the side of the composite encapsulation layer away from the substrate.

[0020] In step S2, an etching process is used to form micropores on the substrate, with the depth of the micropores being between 200-400 nm.

[0021] In step S4, the composite encapsulation layer is embedded in the micropores.

[0022] The encapsulation structure of the silicon-based OLED device of the present invention combines organic and inorganic nanofibers and creates micropores on the substrate. The cross-linking structure of the composite material improves the interfacial bonding force. Using this composite structure can effectively improve the bonding force with the substrate and OC layer, prevent cutting cracks from invading the encapsulation layer, reduce water and oxygen intrusion penetration rate, and improve the encapsulation effect. Attached Figure Description

[0023] This manual includes the following figures, which illustrate the following:

[0024] Figure 1 This is a schematic diagram of the packaging structure of the silicon-based OLED device of the present invention;

[0025] Figure 2 This is a top view of the packaging structure of the silicon-based OLED device of the present invention;

[0026] Figure 3 This is a schematic diagram showing the arrangement of OLED devices on a whole silicon substrate;

[0027] Figures 4-7 This is a schematic diagram illustrating the fabrication process of the packaging structure of the silicon-based OLED device of the present invention;

[0028] The following are labeled in the figure: 1. Substrate; 2. Micro-hole; 3. Light-emitting element; 4. Inorganic encapsulation layer; 5. Composite encapsulation layer; 5-1. First encapsulation part; 5-2. Second encapsulation part; 5-3. Third encapsulation part; 5-4. Embedding part; 6. OC layer; 7. Glass cover plate; 8. Cutting channel. Detailed Implementation

[0029] The specific embodiments of the present invention will be further described in detail below with reference to the accompanying drawings, in order to help those skilled in the art to have a more complete, accurate and in-depth understanding of the concept and technical solutions of the present invention, and to facilitate its implementation.

[0030] It should be noted that in the following embodiments, the terms "first," "second," and "third" do not represent an absolute distinction in structure and / or function, nor do they represent the order of execution; they are merely for the convenience of description.

[0031] Firstly, such as Figure 1 As shown, this embodiment of the invention provides a packaging structure for a silicon-based OLED device, including an OC layer 6, a light-emitting element 3 disposed on a substrate 1, an inorganic encapsulation layer 4 disposed on the side of the light-emitting element 3 away from the substrate 1, and a composite encapsulation layer 5 disposed between the inorganic encapsulation layer 4 and the OC layer 6 and bonded to the inorganic encapsulation layer 4, the OC layer 6 and the substrate 1. The material of the composite encapsulation layer 5 includes organic materials and inorganic nanofiber materials.

[0032] Specifically, the embodiments of the present invention relate to film encapsulation technology in the display or semiconductor fields. By utilizing an organic and inorganic nanofiber composite structure, the water and oxygen intrusion permeability is reduced, thereby improving the bonding strength between the encapsulation layer and the substrate 1, strengthening the bonding force between the encapsulation layer and the OC layer 6, and enhancing the product encapsulation effect.

[0033] In embodiments of the present invention, such as Figure 1 As shown, micropores 2 are provided on the substrate 1, and the composite encapsulation layer 5 includes an embedding portion 5-4 embedded in the micropores 2. Multiple micropores 2 are provided and distributed around the outer periphery of the light-emitting element 3, with the depth of the micropores 2 between 200-400 nm.

[0034] In this embodiment of the invention, the material of the inorganic encapsulation layer 4 includes one or more combinations of AlO, SiN, and SiO.

[0035] In this embodiment of the invention, the organic material is a polyurethane-based material. The inorganic nanofiber material is SiO or TiO. The content of the inorganic nanofiber material is 10%-15%.

[0036] In this embodiment of the invention, a composite encapsulation layer 5 is prepared on the inorganic encapsulation layer 4. The composite encapsulation layer 5 is a composite of organic and inorganic nanofibers. SiO or TiO nanofibers are added to the organic material, which is polyurethane. The nanofibers have superhydrophobic properties and are prepared by aerogel method, electrospinning, etc. The length of the nanofibers is between 2um and 10um, and the nanofiber content is between 10% and 15%. The nanofibers are uniformly coated by spin coating or inkjet printing. The organic and inorganic nanofibers composite forms a good cross-linked structure with high adhesion, which can improve the bonding force with OC adhesive. At the same time, the inorganic nanofibers have a good hydrophobic and oxygen barrier effect, which can effectively extend the water and oxygen invasion path and improve the encapsulation effect.

[0037] In embodiments of the present invention, such as Figure 1 and Figure 7 As shown, the composite encapsulation layer 5 includes a first encapsulation part 5-1, a second encapsulation part 5-2, and a third encapsulation part 5-3. The first encapsulation part 5-1 is disposed on the substrate 1 and is bonded to the substrate 1. The second encapsulation part 5-2 simultaneously surrounds the light-emitting element 3 and the organic encapsulation layer and is bonded to both the light-emitting element 3 and the organic encapsulation layer. The third encapsulation part 5-3 is located on the top surface of the organic encapsulation layer and is bonded to it. The upper end of the second encapsulation part 5-2 is fixedly connected to the third encapsulation part 5-3, and the lower end of the second encapsulation part 5-2 is fixedly connected to the first encapsulation part 5-1. An embedded part 5-4 is fixedly connected to the first encapsulation part 5-1 and is located below the first encapsulation part 5-1. Multiple embedded parts 5-4 are provided, and each embedded part 5-4 is embedded in a micro-hole 2 and is bonded to the substrate 1.

[0038] In embodiments of the present invention, such as Figure 1 and Figure 3 As shown, multiple light-emitting elements 3 are arranged side-by-side along two directions to form a matrix arrangement. Multiple OLED devices are mounted on the entire silicon substrate, and cleavage channels 8 are provided.

[0039] The encapsulation structure of the silicon-based OLED device described above, which combines an organic layer with inorganic nanofibers and simultaneously creates micropores on substrate 1, has the following advantages:

[0040] 1. Enhances adhesion to OC adhesive, improving encapsulation performance;

[0041] 2. Improves waterproof and oxygen-permeability performance, extending product lifespan;

[0042] 3. Enhances substrate adhesion and effectively prevents cutting cracks from damaging the encapsulation layer.

[0043] Secondly, such as Figure 1 As shown, the present invention provides a silicon-based OLED display device, including a substrate 1, a glass cover plate 7, and a packaging structure for the silicon-based OLED device as described above. A light-emitting element 3 is disposed on the substrate 1, and the glass cover plate 7 is disposed on the OC layer 6. The substrate 1 is a CMOS silicon substrate and has a CMOS driving circuit. The light-emitting element 3 is an OLED device.

[0044] Thirdly, embodiments of the present invention provide a method for fabricating a packaging structure for a silicon-based OLED device, comprising the following steps:

[0045] S1. Provide a substrate;

[0046] S2. A light-emitting element 3 is formed on one side of the substrate;

[0047] S3. An inorganic encapsulation layer 4 is formed on the side of the light-emitting element 3 away from the substrate;

[0048] S4. A composite encapsulation layer 5 is formed on the side of the inorganic encapsulation layer 4 away from the substrate;

[0049] S5. An OC layer 6 is formed on the side of the composite encapsulation layer 5 away from the substrate.

[0050] In step S1 above, the substrate is a CMOS silicon substrate. A CMOS silicon substrate is formed by fabricating a CMOS driving circuit on the silicon substrate, such as... Figure 4 As shown.

[0051] In step S2 above, a light-emitting element 3 is fabricated on a substrate, and micropores 2 are formed on the surface of the substrate around the light-emitting element 3, such as... Figure 5 As shown.

[0052] In step S2 above, an etching process is used to form micropores 2 on the substrate, with the depth of the micropores 2 being between 200-400 nm.

[0053] In step S3 above, an inorganic encapsulation layer 4 is fabricated on the light-emitting element 3 using equipment such as PECVD and ALD. Figure 6 As shown.

[0054] In step S4 above, a composite encapsulation layer 5 is prepared on the inorganic encapsulation layer 4, such as... Figure 7 As shown.

[0055] In step S5 above, an OC layer 6 is prepared on the composite encapsulation layer 5, and a glass cover plate 7 is prepared on the OC layer 6, as follows. Figure 7As shown.

[0056] The present invention has been described above by way of example with reference to the accompanying drawings. Obviously, the specific implementation of the present invention is not limited to the above-described manner. Any non-substantial improvements made using the inventive concept and technical solution; or the direct application of the inventive concept and technical solution to other situations without modification, are all within the protection scope of the present invention.

Claims

1. A packaging structure for a silicon-based OLED device, comprising an OC layer, a light-emitting element disposed on a substrate, and an inorganic encapsulation layer disposed on the side of the light-emitting element away from the substrate, characterized in that, It also includes a composite encapsulation layer disposed between the inorganic encapsulation layer and the OC layer and bonded to the inorganic encapsulation layer, the OC layer and the substrate, wherein the material of the composite encapsulation layer includes organic materials and inorganic nanofiber materials.

2. The packaging structure of the silicon-based OLED device according to claim 1, characterized in that, The inorganic nanofiber material is SiO or TiO.

3. The packaging structure of the silicon-based OLED device according to claim 1, characterized in that, The organic material is a polyurethane-based material.

4. The packaging structure of the silicon-based OLED device according to any one of claims 1 to 3, characterized in that, The content of the inorganic nanofiber material is 10%-15%.

5. The packaging structure of the silicon-based OLED device according to any one of claims 1 to 3, characterized in that, The substrate has micropores, and the composite encapsulation layer includes an embedding portion embedded in the micropores.

6. The packaging structure of the silicon-based OLED device according to claim 5, characterized in that, Multiple micropores are provided, and the depth of the micropores is between 200-400nm.

7. The packaging structure of the silicon-based OLED device according to any one of claims 1 to 3, characterized in that, Multiple light-emitting elements are provided, and the multiple light-emitting elements are arranged side by side along two directions to form a matrix arrangement structure.

8. A silicon-based OLED display device, characterized in that, The encapsulation structure includes a substrate and the silicon-based OLED device as described in any one of claims 1 to 7.

9. The method for fabricating the packaging structure of the silicon-based OLED device as described in any one of claims 1 to 7, characterized in that, Including the following steps: S1. Provide a substrate; S2. A light-emitting element is formed on one side of the substrate; S3. An inorganic encapsulation layer is formed on the side of the light-emitting element away from the substrate; S4. A composite encapsulation layer is formed on the side of the inorganic encapsulation layer away from the substrate; S5. An OC layer is formed on the side of the composite encapsulation layer away from the substrate.

10. The method for fabricating the packaging structure of the silicon-based OLED device according to claim 9, characterized in that, In step S2, an etching process is used to form micropores on the substrate, with the depth of the micropores being between 200-400 nm. In step S4, the composite encapsulation layer is embedded in the micropores.

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