Wafer test management method, system and electronic device for cleaning wafers

Abstract

The application provides a management method and system of a cleaning wafer for wafer testing and an electronic device, the method comprising: adding identification information to the cleaning wafer; in response to a task instruction, based on the identification information verification and spatial position determination of the cleaning wafer, controlling an automatic handling device to perform a pick-and-place operation; collecting consumption data generated by the cleaning wafer during use; based on the consumption data, analyzing the use state of the cleaning wafer, and when it is determined that the use state reaches a replacement condition, controlling the automatic handling device to perform a replacement operation. By adding an identity to the cleaning wafer and combining the automatic handling device with visual and code recognition capabilities, the application improves the automation level, management accuracy and operation efficiency of the wafer testing process.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing and testing technology, and in particular to a method, system and electronic device for managing clean wafers for wafer testing. Background Technology

[0002] In the field of wafer testing, probe cards need to be cleaned regularly to ensure testing accuracy. Traditional cleaning methods mainly use clean pads. However, due to the physical space limitations inside the probe station, the area that can be cleaned by the clean pad is very small and cannot be expanded. This makes it difficult to meet the high-efficiency testing scenario where the entire wafer can be tested with a single touch down, which requires large-area, high-precision cleaning and restricts the improvement of testing efficiency. Summary of the Invention

[0003] In view of this, the purpose of this application is to overcome the shortcomings of the prior art and provide a method, system and electronic device for managing clean wafers for wafer testing, so as to improve testing efficiency.

[0004] To achieve the above objectives, this application adopts the following technical solution:

[0005] In a first aspect, this application provides a method for managing clean wafers used in wafer testing, comprising: Add identification information to clean wafers; In response to the task instruction, based on the verification of the identification information and the determination of the spatial position of the clean wafer, the automated handling device is controlled to perform pick-up and place operations; Collect consumption data generated during the use of the cleaned wafer; Based on the consumption data, the usage status of the clean wafer is analyzed, and when the usage status is determined to meet the replacement conditions, the automated handling device is controlled to perform a replacement operation.

[0006] In one embodiment, the verification and spatial location determination based on the identification information of the clean wafer includes: Spatial positioning information of the cleaned wafer is obtained through visual recognition; The identification code of the clean wafer is obtained by reading the identification information; After the spatial positioning information and identity code are verified, the operation of grabbing the clean wafer is triggered.

[0007] In one embodiment, the consumption data includes the cumulative number of times the clean wafer has been used; the replacement condition includes the cumulative number of contacts reaching a preset threshold.

[0008] In one embodiment, adding identification information to the clean wafer includes: forming the identification information containing an identity code on the surface of the clean wafer using a laser method.

[0009] In one embodiment, the method further includes: Multiple management states are defined for the clean wafer, including available state, in use state, and replacement state; Based on the determination result that the consumption data has reached the replacement condition, the clean wafer is updated from the "in use" state to the "to be replaced" state, and the replacement operation is triggered.

[0010] Secondly, this application provides a management system for cleaning wafers for wafer testing, comprising: Control unit; Storage device for storing clean wafers with identification information; An automated handling device is communicatively connected to the control unit; The data acquisition unit is used to collect consumption data of the clean wafer during use; The control unit is configured as follows: In response to the task instruction, based on the verification of the identification information and the determination of the spatial position of the clean wafer, the automated handling device is controlled to perform pick-up and place operations; Receive and analyze the consumption data to determine whether the cleaned wafer has reached the replacement condition; When the replacement conditions are met, the automated handling device is controlled to perform the replacement operation.

[0011] In one embodiment, the automated handling device includes a visual recognition component and an encoding reading component; the visual recognition component is used to acquire spatial positioning information of the clean wafer, and the encoding reading component is used to read the identification information.

[0012] In one embodiment, an encoding device is also included for forming identification information containing an identity code on the surface of the clean wafer by laser.

[0013] In one embodiment, the physical specifications of the cleaned wafer are matched with those of the wafer being tested by the probe station.

[0014] Thirdly, this application provides an electronic device including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the management method for cleaning wafers for wafer testing as described in the first aspect.

[0015] The method for managing clean wafers used in wafer testing provided in this application achieves a complete automated closed loop from task triggering, precise pick-and-place, consumption monitoring to intelligent replacement by adding identification tags to the clean wafers and combining them with an automated handling device with visual and coding recognition capabilities. This not only solves the problem of insufficient cleaning area in traditional cleaning pads and adapts to high-efficiency testing scenarios, but also replaces the traditional manual operation mode through the aforementioned automated closed-loop management, thereby improving the automation level, management accuracy, and operational efficiency of the wafer testing process. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in this application or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 A flowchart illustrating a method for managing clean wafers for wafer testing, provided in another embodiment of this application; Figure 2 This is a schematic diagram of the lifecycle state transition of a clean wafer provided in an embodiment of this application; Figure 3 This is a structural block diagram of a management system for cleaning wafers for wafer testing provided in one embodiment of this application; Figure 4 This is a schematic diagram of an electronic device according to another embodiment of this application.

[0018] Marker explanation: 200. Management system; 210. Control unit; 220. Storage device; 230. Automated handling device; 231. Vision recognition component; 232. Encoding and reading component; 240. Data acquisition unit; 250. Encoding device; 1101. Processor; 1102. Memory; 1103. Input / output interface; 1104. Communication interface; 1105. Bus. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0020] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in the embodiments of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0021] In related technologies, to meet the demands for large-area, high-precision cleaning, some testing scenarios use larger clean wafers instead of cleaning pads. However, the management process for these clean wafers still has shortcomings. For example, traditional clean wafer usage relies heavily on manual operation, including manual searching, handling, placement, and judging replacement timing based on experience. The entire process lacks systematic and automated management, resulting in low efficiency, inaccurate positioning, and untimely status monitoring. It fails to provide effective full lifecycle management for clean wafers and makes it difficult to ensure they are always used in optimal condition. Therefore, there is an urgent need for a method and system that can automate and intelligently manage the entire clean wafer process to improve the efficiency and reliability of wafer testing.

[0022] To overcome the above-mentioned deficiencies, embodiments of this application provide a method, system, and electronic device for managing clean wafers used in wafer testing, which can realize automated and intelligent management of the entire process of clean wafers.

[0023] like Figure 1 As shown, an embodiment of this application provides a method for managing clean wafers for wafer testing, which includes the following steps: Step S10: Add identification information to the cleaned wafer; Step S20: In response to the task instruction, based on the verification of the identification information and spatial location determination of the clean wafer, control the automated handling device to perform pick-up and place operations; Step S30: Collect consumption data generated during the use of the cleaned wafer; Step S40: Analyze the usage status of the cleaned wafer based on the consumption data, and when it is determined that the usage status has reached the replacement condition, control the automated handling device to perform the replacement operation.

[0024] Step S10 is the clean wafer identification and warehousing step. In this embodiment, to solve the problems of untraceable and chaotic management of clean wafers, each new clean wafer is identified. For example, a high-precision laser marking machine is used to form a permanent identifier (such as a QR code or a directly etched character sequence) containing a unique identification code on the non-functional area surface of the clean wafer according to predetermined coding rules (e.g., sandpaper type_product model_compatible probe card material_actual thickness). Thus, the unique identification code enables independent identification and traceability of each clean wafer. After coding, the identification code and physical attribute information of the clean wafer are entered into the database of the control unit, its status is set to "available," and it is stored in a standard wafer storage cabinet. Here, the identification information refers to the carrier (such as a QR code), and the identification code refers to the data carried by the identification information.

[0025] Step S20 is the task triggering and intelligent pick-and-place step. When the probe station needs to perform a cleaning operation according to a preset program, or when the operator manually initiates a cleaning task through the Manufacturing Execution System (MES), the control unit or MES generates a task instruction containing the target cleaned wafer identification code and pick-and-place location information. The control unit responds to this task instruction and dispatches an automated handling device to perform the pick-and-place operation. As a specific implementation, the automated handling device can be a mobile robot (e.g., an automated guided vehicle / autonomous mobile robot). The probe station is also called a wafer probe tester or probe tester.

[0026] Step S30 involves data collection and status monitoring. The mobile robot transports and precisely places the picked-up cleaning wafer into the designated tray slot on the probe station. The probe station then begins cleaning the probe card using this cleaning wafer. The probe station's control system or its integrated sensors record the consumption data for this cleaning operation in real time, such as the number of single or cumulative touch-downs. This data is automatically uploaded to the control unit's database via a data acquisition unit (e.g., a data interface based on communication protocols such as SECS / GEM) and stored in association with the unique identification code of the cleaning wafer.

[0027] Step S40 is the intelligent analysis and automatic replacement decision-making step. The background monitoring program of the control unit continuously polls the database for the cumulative number of contacts of each clean wafer. When the number of contacts for a certain clean wafer reaches its preset threshold, the system sets its status to "disabled" in the database. This status change event automatically triggers a message notification to the system's task scheduling module. The task scheduling module then generates a new "replace clean wafer" instruction and pushes it to the task queue of the automated handling device, waiting for execution.

[0028] The "disabled" status flag serves as a trigger event, automatically updating the clean wafer's lifecycle status from "in use on the probe station" to "disabled" (or "pending replacement"). This status transition event is captured by the task scheduling module, which then generates a new "replace clean wafer" instruction containing the specific operational objective and pushes it to the task queue of the automated handling device.

[0029] Finally, the control unit sends the generated replacement task instruction to the automated handling device. The device then executes the intelligent pick-and-place process in step S20 again: it retrieves a new clean wafer with a "usable" status from the storage area and transports it to the probe station; at the same time, it removes the old wafer that has met the replacement conditions from the probe station, and can set its status to "scrap" according to the strategy and transport it to the scrap area, thus forming a complete "monitoring-decision-execution" closed loop.

[0030] The replacement operation involves removing the old wafer and placing the new one; specifically, a clean wafer that has met the replacement criteria is removed from the probe station, and a new clean wafer is retrieved from the storage device and placed on the probe station. The replacement operation specifically includes: the automated handling device first, according to instructions, removes the clean wafer that has met the replacement criteria from the probe station's carrier tray and transports it to the scrap area or designated recycling location; then, immediately or according to new instructions, a new clean wafer is grabbed from the available inventory in the storage device and transported to the probe station's carrier tray to complete the placement. The entire process follows the authentication and spatial positioning procedures in step S20.

[0031] The management method for clean wafers used in wafer testing provided in the embodiments of this application forms a complete automated management chain by linking identification information, verification-based pick-up and drop, consumption data monitoring and automatic replacement, etc. This transforms clean wafers from passive objects to be manually called upon to resources that can be actively and intelligently scheduled and managed by the system. It realizes the transformation from human experience-based decision-making to data-driven decision-making, improves the automation level and stability of the entire wafer testing process, and solves the problems of traditional clean wafer management relying on manual labor and lacking a closed loop.

[0032] In some embodiments, step S20, which involves verifying the identification information and determining the spatial location of the clean wafer, includes the following steps: Step S21: Obtain spatial positioning information of the clean wafer through visual recognition; Step S22: Obtain the identification code of the clean wafer by reading the identification information; Step S23: After the spatial positioning information and identity code verification are passed, the operation of grabbing the clean wafer is triggered.

[0033] Specifically, the process of determining the spatial position in step S21 includes: the mobile robot navigating to the front of the storage cabinet, its integrated visual recognition component (e.g., an industrial camera) scanning the storage cabinet, and using image recognition algorithms to locate the two-dimensional plane coordinates (X, Y), height (Z), and horizontal rotation angle (θ) of the clean wafer in the target storage slot, providing complete six-degree-of-freedom grasping guidance for the robotic arm.

[0034] The identification information verification process in step S22 includes: the encoding reading component (e.g., a QR code scanner) on the mobile robot reads the QR code on the wafer surface to obtain its identity code.

[0035] The collaborative verification and grasping process in step S23 includes: the control unit (or the main controller of the automated handling device) compares the read identity code with the target code carried in the task instruction in real time and confirms the validity of the visual positioning information. The system determines that verification is successful only when the identity code matches and spatial positioning is successful, and then issues a grasping instruction to the robotic arm. The robotic arm drives the end effector (such as a vacuum suction cup) to complete precise grasping based on the spatial coordinates and angle parameters provided by the visual recognition component. After successful grasping, the unit sends a "grabbing successful" signal and the wafer identity code back to the control unit.

[0036] For example, after the mobile robot transports the cleaned wafer to the probe station, the vision recognition component identifies the carrier tray of the probe station and obtains the three-dimensional coordinates (X, Y, Z) of the target placement slot and the slot orientation angle. Based on these parameters, the robotic arm precisely positions the cleaned wafer above the slot. During the final placement process, the force sensor integrated into the end of the robotic arm detects the micro-force feedback of the wafer contacting the slot in real time. The control system then makes adaptive fine adjustments accordingly to ensure that the wafer is smoothly, without slippage, and without impact, embedded in the designated position.

[0037] In this embodiment, the automated handling device obtains the spatial coordinates of the wafer at the target location through a visual recognition component, and simultaneously / subsequently obtains the identity code through an encoding reading component. The two are jointly verified in the control unit. If either verification fails, a retry process is triggered. If the retry still fails, an error is reported.

[0038] The authentication and spatial positioning are achieved through a combination of visual recognition and encoded reading. This dual authentication mechanism aims to effectively reduce the risk of incorrect grabbing and retrieval, thus improving operational reliability. On one hand, visual recognition provides high-precision spatial positioning, ensuring the physical accuracy of grabbing and placement; on the other hand, encoded reading provides unique identity verification, forming a double check with the visual positioning result. This collaborative mechanism effectively prevents problems such as grabbing the wrong object (incorrect identity) or grabbing failure (positional deviation) that may occur in automated group management, improving the accuracy and fault tolerance of automated handling operations.

[0039] In some embodiments, the consumption data includes the cumulative number of times the cleaning wafer has been used; the replacement condition includes the cumulative number of contacts reaching a preset threshold.

[0040] Specifically, the consumption data is defined as the cumulative number of contacts, which is quantitatively linked to replacement conditions. This transforms the lifecycle management of clean wafers from vague qualitative judgments (such as visual inspection for wear) to precise quantitative management. By setting clear thresholds for the number of contacts, the system can objectively and consistently determine the usage status of each clean wafer, avoiding the subjectivity, lag, and inconsistency of manual judgment. This not only ensures that the probe card is always effectively cleaned but also prevents premature scrapping or overuse of clean wafers, achieving a balance between refined cost control and quality assurance.

[0041] In one preferred implementation, the consumption data is the cumulative number of times the clean wafer has been used; correspondingly, the replacement condition is when the cumulative number of contacts reaches a preset threshold. This quantitative indicator enables standardized management of clean wafer usage.

[0042] In other implementations, the consumption data includes, but is not limited to, at least one of the following: cumulative number of contacts, cumulative cleaning time, needle pressure data and its changing trend during the cleaning process, and test results data of the test wafer after cleaning. Replacement conditions are determined based on at least one parameter in the consumption data satisfying its corresponding preset rule. By integrating multi-dimensional data for analysis, more accurate monitoring and predictive maintenance of the cleaning wafer's usage status can be achieved.

[0043] The control unit can use a weighted scoring model to comprehensively evaluate various consumption data. For example, the weight of the cumulative number of contacts is set to 0.5, the weight of the needle pressure change rate is 0.3, and the weight of the contact resistance pass rate of the wafer after cleaning is 0.2. When the comprehensive score is lower than a preset threshold, the cleaned wafer is determined to meet the replacement conditions. This multi-dimensional comprehensive judgment can more accurately reflect the actual wear state of the cleaned wafer and avoid misjudgments caused by single counting.

[0044] In some embodiments, adding identification information to the clean wafer includes: forming identification information containing an identity code on the surface of the clean wafer using a laser method.

[0045] Specifically, a high-precision laser marking machine is used to engrave a unique QR code on the non-functional area surface of the clean wafer according to predetermined coding rules (e.g., sandpaper type, product model, compatible probe card material, actual thickness).

[0046] Compared to traditionally attached barcode labels, laser codes etched directly onto the wafer surface are less prone to detachment, contamination, or debris during handling, use, and cleaning, ensuring long-term reliable reading in the clean environment of semiconductor manufacturing. Furthermore, laser codes occupy little physical space, do not affect the functional surfaces of clean wafers, and facilitate the standardized processing of clean wafers by automated equipment.

[0047] In some embodiments, the method for managing clean wafers for wafer testing further includes: Define multiple management states for clean wafers, including available state, in-use state, and replacement state; Based on the determination result that the consumption data has reached the replacement condition, the clean wafer is updated from the in-use state to the replacement-pending state, and the replacement operation is triggered.

[0048] The management status of "available", "in use" and "to be replaced" defines the different stages of the clean wafer in the system. The management system can automatically change the management status based on consumption data and analysis results.

[0049] Furthermore, such as Figure 2 As shown, the management method for clean wafers used in wafer testing also includes full lifecycle status management of clean wafers, which can be used to maintain a discrete status identifier for each clean wafer. The full lifecycle status of a clean wafer includes, but is not limited to: standby status, being picked up / transported status, being used on the probe station, disabled (pending replacement) status, and scrapped status. Its status transition is automatically driven by system events. For example: a clean wafer in the standby status enters the being picked up / transported status after receiving a task instruction; after being successfully placed on the probe station and starting the probe cleaning operation, it transitions to the being used on the probe station status; when its consumption data is monitored to reach the replacement condition, it is automatically marked as disabled and a replacement task is triggered; after the replacement task is executed, the old clean wafer enters the scrapped status, and the new clean wafer enters the being used on the probe station status or returns to the standby status. Specifically, the transitions between states can be automatically driven by system events: from the standby state to the grab / transport state is triggered by a task instruction; from the grab / transport state to the probe station usage state is triggered by successful grabbing and placement on the probe station; from the probe station usage state to the disabled state is triggered by the consumption of data reaching the replacement condition; and from the disabled state to the scrapped state is triggered by the execution of a replacement operation to remove the old wafer.

[0050] It's important to note that management status (available, in use, awaiting replacement) defines the permissions and task objectives of the clean wafer within the management system. Lifecycle status (e.g., standby, being picked up / transported, used on the probe station, disabled, scrapped) is the physical execution level manifestation of management status, corresponding to the real-time stage of the clean wafer's spatial location and workflow. Management status and lifecycle status can be dynamically linked and automatically switched through system events (e.g., task triggering, data achievement): for example, when a clean wafer in the "available" management status is invoked by a task instruction, its lifecycle status immediately changes to "being picked up / transported"; when a clean wafer enters the "disabled" state during its lifecycle, its management status is simultaneously updated to "awaiting replacement," thus triggering the next round of scheduling.

[0051] Embodiments of this application also provide a management system 200 for cleaning wafers for wafer testing, used to implement the management method in any of the above embodiments.

[0052] like Figure 3 As shown, the clean wafer management system 200 for wafer testing is centered on the control unit 210 and also includes a storage device 220, an automated handling device 230, and a data acquisition unit 240. The units are connected and work together through a communication network.

[0053] Storage device 220 is used to store clean wafers with identification information. Automated handling device 230 is communicatively connected to control unit 210. Data acquisition unit 240 is used to acquire consumption data of clean wafers during use from the probe station.

[0054] The control unit 210 is configured as follows: In response to the task instructions, based on the verification of the identification information and spatial location of the clean wafer, the automated handling device 230 is controlled to perform pick-up and put-down operations; Receive and analyze consumption data to determine whether the cleaned wafers meet the replacement criteria; When the replacement conditions are met, the automated handling device 230 is controlled to perform the replacement operation.

[0055] Specifically, the control unit 210, as the system brain, can be an industrial server or a functional module integrated into the MES for task scheduling, data analysis, status management and instruction issuance.

[0056] Storage device 220 is a standard wafer storage cabinet used to orderly store multiple clean wafers whose physical specifications match those of the wafer under test. This specification matching ensures compatibility with the subsequent automated handling device 230.

[0057] The automated handling device 230 is an integrated device that includes a mobile platform, a robotic arm, and a vision recognition component 231 (e.g., an industrial camera) and an encoding and reading component 232 (e.g., a QR code scanner) mounted at the end of the robotic arm. The automated handling device 230 receives instructions from the control unit 210 and is responsible for performing physical handling operations.

[0058] The data acquisition unit 240 includes data interfaces for sensors inside the probe station and protocol modules (such as SECS / GEM) for communicating with the probe station control system. The data acquisition unit 240 is used to receive and forward consumption data recorded by the probe station and associated with the clean wafer identification code in real time.

[0059] The data flow of the management system 200 follows a closed-loop path: the control unit 210 receives task instructions and issues them to the automated handling device 230; the handling device transmits the operation status and result data back; the probe station uploads consumption data to the control unit 210 through the data acquisition unit 240; after analyzing the data, the control unit 210 can generate new task instructions and issue them again.

[0060] The wafer testing clean wafer management system 200 provided in this application combines a control unit 210, a storage device 220, an automated handling device 230, and a data acquisition unit 240. This transforms the clean wafer from a passive object to be manually invoked into a resource that can be actively and intelligently scheduled and managed by the system. This achieves a shift from human experience-based decision-making to data-driven decision-making, improving the automation level and stability of the entire wafer testing process. As a result, it solves the problems of traditional clean wafer management relying on manual labor and lacking a closed loop.

[0061] In addition, the management system 200 can be directly embedded into existing wafer testing production lines, taking over the wafer cleaning management work that was originally all done manually, thereby realizing the unmanned, standardized and integrable nature of the wafer cleaning process at the physical level.

[0062] In some embodiments, the automated handling device 230 includes a mobile platform and a vision recognition component 231 and an encoding reading component 232 mounted on the mobile platform; the vision recognition component 231 is used to acquire spatial positioning information of the clean wafer, and the encoding reading component 232 is used to read identification information.

[0063] During the grasping and handling process, firstly, the vision recognition component 231 outputs positioning parameters; secondly, the encoding reading component 232 obtains the identity code and compares it with the system command; only when both are valid and consistent, the unit controller issues a "permit grasping" command to the robotic arm execution component; the robotic arm moves according to the positioning parameters, adsorbs the wafer through the vacuum suction cup, and at the same time, the force sensor monitors the adsorption force to ensure stability; finally, the unit sends a "grabbing successful" signal and the wafer identity code back to the control unit 210.

[0064] For example, the visual recognition component 231 includes a high-resolution industrial camera and a built-in image algorithm module. The camera is responsible for acquiring images of the physical environment, while the algorithm module processes the images in real time, analyzing features such as the edges and center point of the clean wafer, and finally outputting its precise positioning parameters in space, such as the X, Y, and Z coordinates and rotation angle. The encoding and reading component 232 includes a reader / writer capable of reading laser QR codes or RFID tags, responsible for non-contactly acquiring the unique identification code of the clean wafer.

[0065] The automated handling device 230 also includes a robotic arm execution assembly. The robotic arm execution assembly includes a robotic arm, a vacuum suction cup gripper mounted at the end of the robotic arm, and a force sensor integrated into the gripper. The force sensor detects contact force in real time to prevent damage to the wafer or carrier mechanism due to overload, while ensuring proper placement.

[0066] Specifically, before gripping, the vision recognition component 231 needs to identify the orientation of the positioning notch or flat edge on the clean wafer. Based on this, the robotic arm controller calculates the required rotation angle of the end effector to achieve posture pre-alignment before gripping and ensure stable gripping.

[0067] After placement, the vision recognition component performs secondary imaging to confirm the placement of the clean wafer. By comparing the image differences of the slot before and after placement or directly identifying the fit between the wafer edge and the slot edge, the placement is ultimately determined to be successful. The contact force stability signal fed back by the force sensor and the secondary visual confirmation signal together serve as the basis for determining the completion of the placement operation.

[0068] In some embodiments, the clean wafer management system 200 for wafer testing further includes an encoding device 250 for forming identification information containing a unique identification code on the surface of the clean wafer by laser.

[0069] The coding device 250 is specifically a laser marking machine, used to engrave a unique identification code on the surface of clean wafers before they are put into storage. The coding device 250 achieves an automated front-end closed loop for clean wafer storage management. It integrates the coding process from offline, manual operations into the online management system 200, ensuring that each clean wafer entering storage is immediately assigned a standard, system-recognizable identity and synchronized with the database information.

[0070] In some embodiments, the physical specifications of the cleaned wafer are matched with those of the wafer being tested by the probe station.

[0071] By designing the clean wafer to match the physical specifications of the wafer under test, the clean wafer can be directly compatible with the existing wafer carrier mechanism of the probe station, enabling automatic loading and use without any modification to the probe station. At the same time, the standardized wafer form factor allows for seamless integration into existing automated wafer material handling systems in the factory.

[0072] Corresponding to any of the above embodiments, this application also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the program, it implements the management method for clean wafers for wafer testing of any of the above embodiments, and the above management method can be implemented in software form.

[0073] Figure 4 This embodiment illustrates a more specific hardware structure of an electronic device, which may include a processor 1101, a memory 1102, an input / output interface 1103, a communication interface 1104, and a bus 1105. The processor 1101, memory 1102, input / output interface 1103, and communication interface 1104 are interconnected internally via the bus 1105.

[0074] The processor 1101 can be implemented using a general-purpose CPU (Central Processing Unit), microprocessor, application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this specification.

[0075] The memory 1102 can be implemented in the form of ROM (Read Only Memory), RAM (Random Access Memory), static storage device, dynamic storage device, etc. The memory 1102 can store the operating system and other applications. When the technical solutions provided in the embodiments of this specification are implemented by software or firmware, the relevant program code is stored in the memory 1102 and is called and executed by the processor 1101.

[0076] Input / output interface 1103 is used to connect input / output modules to realize information input and output. Input / output modules can be configured as components in the device (not shown in the figure) or externally connected to the device to provide corresponding functions. Input devices may include keyboards, mice, touch screens, microphones, various sensors, etc., and output devices may include displays, speakers, vibrators, indicator lights, etc.

[0077] The communication interface 1104 is used to connect the communication module (not shown in the figure) to enable communication between this device and other devices. The communication module can communicate via wired means (such as USB, Ethernet cable, etc.) or wireless means (such as mobile network, WIFI, Bluetooth, etc.).

[0078] Bus 1105 includes a pathway for transmitting information between various components of the device, such as processor 1101, memory 1102, input / output interface 1103, and communication interface 1104.

[0079] It should be noted that although the above-described device only shows the processor 1101, memory 1102, input / output interface 1103, communication interface 1104, and bus 1105, in specific implementations, the device may also include other components necessary for normal operation. Furthermore, those skilled in the art will understand that the above-described device may only include the components necessary for implementing the embodiments of this specification, and not necessarily all the components shown in the figures.

[0080] The electronic devices described above are used to implement the management method for clean wafers for wafer testing in any of the foregoing embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0081] Corresponding to any of the above embodiments, this application also provides a non-transitory computer-readable storage medium storing computer instructions for causing a computer to execute the management method for clean wafers for wafer testing as described in any of the above embodiments.

[0082] The computer-readable medium of this embodiment includes permanent and non-permanent, removable and non-removable media, and information storage can be implemented by any method or technology. Information can be computer-readable instructions, data structures, program modules, or other data. Examples of computer storage media include, but are not limited to, phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, CD-ROM, digital versatile optical disc (DVD) or other optical storage, magnetic tape, magnetic magnetic disk storage or other magnetic storage devices, or any other non-transfer medium that can be used to store information accessible by a computing device.

[0083] The computer instructions stored in the storage medium of the above embodiments are used to cause the computer to execute the management method for clean wafers for wafer testing as described in any of the above embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0084] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this application (including the claims) is limited to these examples; within the framework of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of this application as described above, which are not provided in the details for the sake of brevity.

[0085] Additionally, to simplify the description and discussion, and to avoid obscuring the embodiments of this application, the well-known power / ground connections to integrated circuit (IC) chips and other components may or may not be shown in the provided drawings. Furthermore, the apparatus may be shown in block diagram form to avoid obscuring the embodiments of this application, and this also takes into account the fact that the details of the implementation of these block diagram apparatuses are highly dependent on the platform on which the embodiments of this application will be implemented (i.e., these details should be fully understood by those skilled in the art). While specific details (e.g., circuits) have been set forth to describe exemplary embodiments of this application, it will be apparent to those skilled in the art that the embodiments of this application can be implemented without these specific details or with variations thereof. Therefore, these descriptions should be considered illustrative rather than restrictive.

[0086] Although this application has been described in conjunction with specific embodiments thereof, many substitutions, modifications, and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. For example, other memory architectures (e.g., dynamic RAM) may be used with the embodiments discussed.

[0087] The embodiments of this application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this application should be included within the protection scope of this application.

Claims

1. A method for managing clean wafers used in wafer testing, characterized in that, include: Add identification information to clean wafers; In response to the task instruction, based on the verification of the identification information and the determination of the spatial position of the clean wafer, the automated handling device is controlled to perform pick-up and place operations; Collect consumption data generated during the use of the cleaned wafer; Based on the consumption data, the usage status of the clean wafer is analyzed, and when the usage status is determined to meet the replacement conditions, the automated handling device is controlled to perform a replacement operation.

2. The method for managing clean wafers for wafer testing according to claim 1, characterized in that, The verification and spatial location determination based on the identification information of the clean wafer includes: Spatial positioning information of the cleaned wafer is obtained through visual recognition; The identification code of the clean wafer is obtained by reading the identification information; After the spatial positioning information and identity code are verified, the operation of grabbing the clean wafer is triggered.

3. The method for managing clean wafers for wafer testing according to claim 1, characterized in that, The consumption data includes the cumulative number of times the clean wafer has been used; the replacement condition includes the cumulative number of contacts reaching a preset threshold.

4. The method for managing clean wafers for wafer testing according to claim 1, characterized in that, The method of adding identification information to the clean wafer includes: forming the identification information containing an identity code on the surface of the clean wafer using a laser method.

5. The method for managing clean wafers for wafer testing according to claim 1, characterized in that, The method further includes: Multiple management states are defined for the clean wafer, including available state, in use state, and replacement state; Based on the determination result that the consumption data has reached the replacement condition, the clean wafer is updated from the "in use" state to the "to be replaced" state, and the replacement operation is triggered.

6. A management system for cleaning wafers for wafer testing, characterized in that, include: Control unit; Storage device for storing clean wafers with identification information; An automated handling device is communicatively connected to the control unit; The data acquisition unit is used to collect consumption data of the clean wafer during use; The control unit is configured as follows: In response to the task instruction, based on the verification of the identification information and the determination of the spatial position of the clean wafer, the automated handling device is controlled to perform pick-up and place operations; Receive and analyze the consumption data to determine whether the cleaned wafer has reached the replacement condition; When the replacement conditions are met, the automated handling device is controlled to perform the replacement operation.

7. The management system for clean wafers for wafer testing according to claim 6, characterized in that, The automated handling device includes a visual recognition component and an encoding reading component; the visual recognition component is used to acquire the spatial positioning information of the clean wafer, and the encoding reading component is used to read the identification information.

8. The management system for clean wafers for wafer testing according to claim 6, characterized in that, It also includes an encoding device for forming identification information containing an identity code on the surface of the clean wafer by laser.

9. The management system for clean wafers for wafer testing according to claim 6, characterized in that, The physical specifications of the cleaned wafer are matched with those of the wafer tested by the probe station.

10. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the program, it implements the method as described in any one of claims 1 to 5.

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