A suspended semiconductor wafer production wafer carrier

Abstract

This invention belongs to the field of wafer carrier technology, specifically a suspended semiconductor wafer production wafer carrier, including a carrier frame. Both ends of the carrier frame are fixedly connected to mounting brackets, and lifting rings are fixedly connected to the top two sides of the mounting brackets. Multiple sets of wafer arrangement and placement auxiliary components are arranged laterally on the upper surface of the carrier frame. Each wafer arrangement and placement auxiliary component includes a fixing plate fixedly connected to the upper surface of the carrier frame. A sliding plate is fixedly connected to the upper surface of the fixing plate, and a sliding groove is provided on one side of the sliding plate. Adjustment plates are slidably connected to both sides of the sliding groove. This invention utilizes wafer arrangement and placement auxiliary components to linearly arrange multiple wafers on a conveyor belt, eliminating the need for operators to frequently manually align each placement slot, making the process more convenient and labor-saving. It also avoids the possibility of wafer edges colliding due to operational errors, causing wear and affecting wafer quality.

Description

Technical Field

[0001] This invention belongs to the field of wafer carrier technology, specifically a wafer carrier for suspended semiconductor wafer production. Background Technology

[0002] A semiconductor wafer is a circular, thin-film substrate made from high-purity semiconductor materials through processes such as crystal pulling, slicing, and polishing. It is the physical basis for manufacturing semiconductor devices such as integrated circuits and discrete devices. During the fabrication of semiconductor wafers, they are usually placed in a carrier to facilitate wafer transfer.

[0003] Patent CN222562650U discloses a suspended semiconductor wafer carrier, including a first fixed base and a second fixed base. The second fixed base is located on one side of the first fixed base, and placement grooves are located on one side of both the first and second fixed bases. A first movable groove is located inside the top of the first and second fixed bases. This suspended semiconductor wafer carrier, through the inclusion of components such as a first connecting seat, allows for the rotation of an adjusting shaft by turning a handle. When the adjusting shaft rotates, the externally fitted movable blocks move towards each other, simultaneously causing the first and second sliders on one side to slide within the groove of the second fixed base. This adjusts the distance between the first and second fixed bases, allowing for adjustment of the placement width according to the wafer diameter. This provides greater stability and applicability during placement, solving the problem of inconvenient width adjustment based on wafer diameter.

[0004] However, the above technical solutions still have the following shortcomings in practical applications: The distance between the two mounting bases needs to be adjusted according to the diameter of the wafer so that the placement slots on the two mounting bases engage with the edge of the wafer, thereby ensuring the neatness and stability of the wafer placement and facilitating orderly retrieval later.

[0005] However, due to the large number of placement slots and their uniform arrangement along the length of the mounting base, when placing wafers in batches, personnel need to frequently align multiple wafers sequentially with different placement slots. This process is not only time-consuming and labor-intensive, but also prone to causing wafer edges to collide due to operational errors, resulting in wafer wear and affecting wafer quality. Summary of the Invention

[0006] In order to overcome the shortcomings of the prior art and solve at least one of the technical problems mentioned in the background art, the present invention proposes a wafer carrier for suspended semiconductor wafer production.

[0007] The technical solution adopted by the present invention to solve its technical problem is: a wafer carrier for suspended semiconductor wafer production, including a carrier frame, with fixed frames fixedly connected to both ends of the carrier frame, and lifting rings fixedly connected to both sides of the top of the fixed frames, and multiple sets of wafer arrangement and placement auxiliary components are arranged horizontally on the upper surface of the carrier frame; The wafer placement auxiliary assembly includes a fixed plate fixedly connected to the upper surface of the carrier frame. A sliding plate is fixedly connected to the upper surface of the fixed plate. A sliding groove is provided on one side of the sliding plate, and adjusting plates are slidably connected to both sides of the sliding groove. A conveyor belt for carrying the wafer is provided on the adjusting plate. The two adjusting plates cooperate to form a placement channel that matches the diameter of the wafer. The conveyor belt drives the wafer to move in the placement channel to form an arrangement.

[0008] Preferably, the two ends of the slide groove of the slide plate are rotatably connected to a bidirectional lead screw, and the two sides of the bidirectional lead screw are respectively threadedly connected to two adjusting plates.

[0009] Preferably, one end of the slide plate is fixedly connected to the second motor, and the output end of the second motor is fixedly connected to one end of the bidirectional lead screw.

[0010] Preferably, the carrier frame is also equipped with an integrated wafer attitude adjustment and anti-collision component; The integrated wafer attitude adjustment and anti-collision component includes a transverse plate slidably connected to one side of the upper surface of the carrier frame. A lifting block is slidably connected to one side of the transverse plate. A flipping frame is rotatably connected to one end of the lifting block. Multiple sliders are equidistantly mounted on the flipping frame along the transverse direction. A stop block is slidably inserted into the lower end of each slider. A pressing block is slidably connected to a groove on one side of the flipping frame. A winding wheel is rotatably connected to one end of the flipping frame near the transverse plate. A blocking cloth is wound on the winding wheel. The blocking cloth is slidably inserted through one side of the flipping frame. The end of the blocking cloth is fixedly connected to one side of the pressing block. A rotating rod is rotatably connected to one end of the slider. An electrostatic chuck is fixedly connected to one end of the rotating rod.

[0011] Preferably, one end of the transverse plate is threadedly connected to a lead screw, both ends of which are rotatably connected to the carrier frame. One end of the carrier frame is fixedly connected to a motor, and the output end of the motor is fixedly connected to one end of the lead screw.

[0012] Preferably, a cylinder is fixedly connected to one end of the transverse plate, the piston end of the cylinder is fixedly connected to one side of the lifting block, a motor is fixedly connected to one end of the lifting block, and the output end of the motor is fixedly connected to one end of the tilting frame.

[0013] Preferably, the integrated wafer attitude adjustment and anti-collision component further includes a transmission adjustment structure; The transmission adjustment structure includes multiple connecting rods 1 and 2. The ends of two adjacent connecting rods 1 are connected, and the ends of adjacent connecting rods 1 and 2 are rotatably connected. The middle of connecting rod 1 is rotatably connected to the top of the slider. One end of the front connecting rod 1 is rotatably connected to the slider, and one end of the rear connecting rod 1 is rotatably connected to the tilting frame. One end of the tilting frame is fixedly connected to cylinder 2, and the piston end of cylinder 2 is fixedly connected to one end of the foremost slider.

[0014] Preferably, one end of the extrusion block is threadedly connected to a lead screw two, both ends of the lead screw two are rotatably connected to a flipping frame, one end of the flipping frame is fixedly connected to a motor three, the output end of the motor three is fixedly connected to one end of the lead screw two, and one end of the flipping frame is fixedly connected to a motor six, the output end of the motor six is ​​fixedly connected to the middle of the winding wheel.

[0015] Preferably, one end of the slider is rotatably connected to a worm gear, one end of the rotating rod is fixedly connected to a worm wheel, the worm wheel is rotatably connected to the slider, the worm wheel and the worm gear mesh with each other, one end of the flipping frame is rotatably connected to a protrusion rod, the protrusion rod and multiple worm gears are slidably inserted into each other through keyways, one end of the flipping frame is fixedly connected to a motor, and the output end of the motor is fixedly connected to one end of the protrusion rod.

[0016] Preferably, a spring is fixedly connected to the lower end of the slider, and the other end of the spring is fixedly connected to the bottom of the inner wall of the stop block.

[0017] The beneficial effects of this invention are as follows: 1. The wafer carrier for suspended semiconductor wafer production described in this invention utilizes wafer arrangement and placement auxiliary components. When wafers need to be placed in batches, the wafers only need to be placed at the beginning of the conveyor belt, and the conveyor belt can sequentially deliver the wafers to the predetermined positions, thereby arranging multiple wafers linearly on the conveyor belt. This eliminates the need for operators to frequently manually align each placement slot, making it more convenient and labor-saving. It also avoids the situation where the edges of the placed wafers collide with each other due to operational errors, resulting in wear and affecting the quality of the wafers.

[0018] 2. The suspended semiconductor wafer manufacturing wafer carrier of this invention utilizes an integrated wafer attitude adjustment and anti-collision component. Whenever a wafer reaches a predetermined position on the conveyor belt, a stop descends, limiting and blocking the wafer from both sides. This prevents the wafer from slipping due to inertia or equipment vibration, thus avoiding damage caused by edge collisions between adjacent wafers. Furthermore, with the coordinated operation of electrostatic chucks and multiple adjustment structures, adaptive adjustment of the wafer attitude is achieved, allowing for both flat arrangement and longitudinal stacking, thus adapting to different usage requirements. It also facilitates the longitudinal placement of multiple sets of wafer pick-up forks to remove wafers, thereby improving subsequent wafer processing efficiency. Attached Figure Description

[0019] The invention will now be further described with reference to the accompanying drawings.

[0020] Figure 1 This is a three-dimensional structural schematic diagram of the present invention; Figure 2 This is a schematic diagram of the three-dimensional structure at the transverse sliding plate. Figure 3 yes Figure 2 Enlarged view of a portion of point A in the middle; Figure 4 This is a schematic diagram of the three-dimensional structure of the lifting block; Figure 5 yes Figure 4 Enlarged view of a section at point B in the middle; Figure 6 This is a schematic diagram of the three-dimensional structure of the slide plate; Figure 7 This is a schematic diagram of the three-dimensional structure of the stop block; Figure 8 This is a schematic diagram of the planar structure showing the connection between the slider and the stop. Figure 9 This is a schematic diagram of the three-dimensional structure of two parts of the cylinder; Figure 10 This is a schematic diagram of the three-dimensional structure from another perspective at the transverse sliding plate; Figure 11 yes Figure 10 Enlarged view of a section at point C; Figure 12 yes Figure 10 Enlarged view of a section at point D; Figure 13 This is a schematic diagram of the three-dimensional structure of the adjustment plate.

[0021] In the diagram: 1. Carrier frame; 2. Lifting ring; 3. Transverse plate; 4. Lead screw one; 5. Motor one; 6. Fixing plate; 7. Double-acting lead screw; 8. Motor two; 9. Adjusting plate; 10. Conveyor belt; 11. Cylinder one; 12. Lifting block; 13. Motor four; 14. Tilting frame; 15. Cylinder two; 16. Protrusion rod; 17. Worm gear; 18. Worm wheel; 19. Slide plate; 20. Connecting rod one; 21. Connecting rod two; 22. Sliding block; 23. Extrusion block; 24. Winding wheel; 25. Blocking cloth; 26. Rotating rod; 27. Stop block; 28. Motor six; 29. ​​Lead screw two; 30. Motor three; 31. Spring; 32. Electrostatic chuck; 33. Fixing frame; 34. Motor five. Detailed Implementation

[0022] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0023] Please refer to Figures 1-13 The present invention provides a technical solution: a wafer carrier for suspended semiconductor wafer production, including a carrier frame 1, with fixed frames 33 fixedly connected to both ends of the carrier frame 1, and lifting rings 2 fixedly connected to the top two sides of the fixed frames 33. Multiple sets of wafer arrangement and placement auxiliary components are arranged horizontally on the upper surface of the carrier frame 1. The wafer placement auxiliary assembly includes a fixed plate 6 fixedly connected to the upper surface of the carrier frame 1. A sliding plate 19 is fixedly connected to the upper end face of the fixed plate 6. A sliding groove is provided on one side of the sliding plate 19, and an adjusting plate 9 is slidably connected to both sides of the sliding groove. A conveyor belt 10 for carrying wafers is provided on the adjusting plate 9. The two adjusting plates 9 cooperate with each other to form a placement channel that matches the diameter of the wafer. The conveyor belt 10 drives the wafer to move in the placement channel to form an arrangement.

[0024] In this embodiment, as Figure 6 and Figure 13 As shown, the two ends of the slide plate 19 are rotatably connected to a double-acting screw 7, and the two sides of the double-acting screw 7 are threadedly connected to two adjusting plates 9 respectively.

[0025] One end of the slide plate 19 is fixedly connected to the motor 2 8, and the output end of the motor 2 8 is fixedly connected to one end of the bidirectional lead screw 7.

[0026] Specifically, in the existing technology, the distance between the two fixing seats needs to be adjusted according to the diameter of the wafer so that the placement slots on the two fixing seats engage with the edge of the wafer, thereby ensuring the neatness and stability of the wafer placement so that it can be retrieved in an orderly manner later.

[0027] However, due to the large number of placement slots and their uniform arrangement along the length of the mounting base, when placing wafers in batches, personnel need to frequently align multiple wafers sequentially with different placement slots. This process is not only time-consuming and labor-intensive, but also prone to causing wafer edges to collide due to operational errors, resulting in wafer wear and affecting wafer quality.

[0028] Therefore, in order to solve the above problems, the working principle of this embodiment is as follows: First, each group of wafers can only place one type of wafer of the same specification at a time when placing auxiliary components.

[0029] Based on the diameter of the wafer, the motor 8 drives the bidirectional lead screw 7 to rotate, so that the two adjusting plates 9 can slide in opposite directions or away from each other in the groove of the sliding plate 19 at the same time, thereby adjusting the distance between the two adjusting plates 9 and making the distance match the diameter of the wafer.

[0030] When wafers need to be placed in batches, simply place the wafers on the end of the adjusting plate 9 away from the slide plate 19, with the bottom edges of both sides of the wafers in contact with the upper surface of the conveyor belt 10. Then start the conveyor belt 10, and the wafers will move toward the slide plate 19 until they are blocked by the slide plate 19.

[0031] Repeat the above operation, and each subsequent wafer only needs to be placed at the end of the conveyor belt 10 to automatically move to the designated position, so that multiple wafers are arranged linearly on the conveyor belt 10. This eliminates the need for operators to frequently manually align each placement slot, which is more convenient and labor-saving. It also avoids the situation where the edges of the placed wafers collide with each other due to operational errors, which would cause wear and affect the quality of the wafers.

[0032] Once a sufficient number of wafers have been placed on the conveyor belt 10, the two adjusting plates 9 are brought closer together by rotating the bidirectional lead screw 7 driven by the motor 8. The adjusting plates 9 clamp the wafers, ensuring their stability during placement. At this point, the carrier frame 1 can be suspended and transferred using the lifting ring 2.

[0033] Furthermore, since there are multiple sets of wafer arrangement and placement auxiliary components, wafers of different specifications can be placed separately for easy retrieval later.

[0034] In this embodiment, as Figures 1-5 , Figures 7-12 As shown, the carrier frame 1 is also equipped with an integrated wafer attitude adjustment and anti-collision component; The integrated wafer attitude adjustment and anti-collision component includes a transverse plate 3 slidably connected to one side of the upper surface of the carrier frame 1. A lifting block 12 is slidably connected to one side of the transverse plate 3. A flipping frame 14 is rotatably connected to one end of the lifting block 12. Multiple sliders 22 are equidistantly slidably mounted on the flipping frame 14 along the transverse direction. A stop block 27 is slidably inserted into the lower end of the slider 22. A pressing block 23 is slidably connected to a groove on one side of the flipping frame 14. A winding wheel 24 is rotatably connected to one end of the flipping frame 14 near the transverse plate 3. A blocking cloth 25 is wound on the winding wheel 24. The blocking cloth 25 is slidably inserted through one side of the flipping frame 14. The end of the blocking cloth 25 is fixedly connected to one side of the pressing block 23. A rotating rod 26 is rotatably connected to one end of the slider 22. An electrostatic chuck 32 is fixedly connected to one end of the rotating rod 26.

[0035] One end of the transverse plate 3 is threadedly connected to a lead screw 4. Both ends of the lead screw 4 are rotatably connected to the carrier frame 1. One end of the carrier frame 1 is fixedly connected to a motor 5. The output end of the motor 5 is fixedly connected to one end of the lead screw 4.

[0036] One end of the transverse plate 3 is fixedly connected to a cylinder 11. The piston end of the cylinder 11 is fixedly connected to one side of the lifting block 12. One end of the lifting block 12 is fixedly connected to a motor 4 13. The output end of the motor 4 13 is fixedly connected to one end of the tilting frame 14.

[0037] The integrated wafer attitude adjustment and anti-collision component also includes a transmission adjustment structure; The transmission adjustment structure includes multiple connecting rods 20 and 21. The ends of two adjacent connecting rods 20 are connected, and the ends of adjacent connecting rods 20 and 21 are rotatably connected. The middle of connecting rod 20 is rotatably connected to the top of slider 22. One end of the front connecting rod 20 is rotatably connected to slider 22, and one end of the rear connecting rod 20 is rotatably connected to tilting frame 14. One end of tilting frame 14 is fixedly connected to cylinder 15, and the piston end of cylinder 15 is fixedly connected to one end of the frontmost slider 22.

[0038] One end of the extrusion block 23 is threadedly connected to a lead screw 29. Both ends of the lead screw 29 are rotatably connected to the flipping frame 14. One end of the flipping frame 14 is fixedly connected to a motor 30. The output end of the motor 30 is fixedly connected to one end of the lead screw 29. One end of the flipping frame 14 is fixedly connected to a motor 6 28. The output end of the motor 6 28 is fixedly connected to the middle of the winding wheel 24.

[0039] One end of the slider 22 is rotatably connected to a worm gear 17, and one end of the rotating rod 26 is fixedly connected to a worm wheel 18. The worm wheel 18 is rotatably connected to the slider 22, and the worm wheel 18 and the worm gear 17 mesh with each other. One end of the flipping frame 14 is rotatably connected to a protrusion rod 16, and the protrusion rod 16 and multiple worm gears 17 are slidably inserted into each other through keyways. One end of the flipping frame 14 is fixedly connected to a motor 34, and the output end of the motor 34 is fixedly connected to one end of the protrusion rod 16.

[0040] A spring 31 is fixedly connected to the lower end of the slider 22, and the other end of the spring 31 is fixedly connected to the bottom of the inner wall of the stop block 27.

[0041] Specifically, while the above embodiments can achieve wafer arrangement, when using the conveyor belt 10 to arrange wafers, the conveyor belt 10 needs to stop after the wafer reaches a predetermined position. If the contact surface between the wafer and the conveyor belt 10 is smooth and has a low coefficient of friction, the wafer is prone to slippage due to inertia when the conveyor belt 10 stops. When the wafer spacing is close, slippage may cause the subsequent wafer to collide with the previous one, resulting in edge collision damage to the wafer.

[0042] Furthermore, after the wafers are transferred to the designated process, they need to be removed from the conveyor belt 10 using pick-up forks. To improve efficiency, multiple sets of pick-up forks are usually arranged at equal intervals along the longitudinal direction to pick up multiple wafers at a time. However, the wafers on the conveyor belt 10 are all laid flat, and such longitudinally equidistant pick-up forks are often suitable for vertically inserted wafer racks, making it difficult to simultaneously pick up multiple flat wafers from the horizontal conveyor surface at one time, thus affecting the efficiency of subsequent processing.

[0043] Therefore, in order to solve the above problems, the working principle of this embodiment is as follows: First, based on the orientation of the wafer arrangement and placement auxiliary components to be used, the motor 5 drives the lead screw 4 to rotate, causing the transverse plate 3 to move laterally on the carrier frame 1, and adjusting the lateral position of the flipping frame 14 so that the flipping frame 14 is above the corresponding wafer arrangement and placement auxiliary components.

[0044] Furthermore, based on the diameter of the wafer, the cylinder 215 drives the slider 22 on one side to slide on the flipping frame 14. With the transmission and cooperation of multiple connecting rods 120 and 21, multiple sliders 22 can slide simultaneously on the flipping frame 14, thereby adjusting the distance between two adjacent sliders 22 and making the distance equal to the diameter of the wafer.

[0045] In its initial state, the extrusion block 23 is located at one end of the tilting frame 14 near the transverse plate 3 and is not in contact with any of the stops 27. Whenever a wafer moves to a designated position with the conveyor belt 10, the motor 30 drives the lead screw 29 to rotate, causing the extrusion block 23 to slide a certain distance and press against the inclined surface of a stop 27, causing the stop 27 to move downwards. The spring 31 is stretched, allowing the stop 27 to pass through the gap between the two adjusting plates 9. At this point, the stop 27 forms a blocking element on one side of the wafer. This operation is then repeated. Whenever a wafer moves to a designated position, the extrusion block 23 moves a certain distance, accompanied by the descent of a stop 27. Simultaneously, the motor 6 28 drives the winding wheel 24 to rotate, unwinding the blocking cloth 25 so that it adheres to the upper end of the descended stop 27, preventing the stop 27 from resetting.

[0046] The wafers placed on the conveyor belt 10 are blocked on both sides by the blocks 27, preventing them from slipping due to inertia or equipment vibration, thus avoiding damage caused by the wafer edges colliding with each other. In addition, since the spacing between adjacent blocks 27 is adapted to the wafer diameter, the placement length of the conveyor belt 10 is reasonably utilized while blocking the wafers.

[0047] When multiple sets of wafer pickers, equidistant along the longitudinal direction, need to remove wafers, the aforementioned adjustment operation can be performed again to adjust the spacing between adjacent electrostatic chucks 32, ensuring that each electrostatic chuck 32 is aligned with a wafer. Then, cylinder 11 drives the lifting block 12 to descend, causing multiple electrostatic chucks 32 to adhere to the wafer surface, and the electrostatic chucks 32 then hold the wafer in place. Simultaneously, multiple wafers are lifted, detaching them from between the two adjusting plates 9. Subsequently, motor 4 13 drives the flipping frame 14 to rotate 90 degrees, changing the arrangement of multiple wafers from horizontal to vertical.

[0048] Since multiple worm gears 17 and protrusion rods 16 are slidably connected via keyways, the worm gears 17 remain mounted on the protrusion rods 16 regardless of how the slider 22 moves. After the flipping frame 14 rotates 90 degrees, the motor 34 drives the protrusion rods 16 to rotate, causing multiple worm gears 17 to rotate simultaneously, and also causing multiple worm wheels 18 and rotating rods 26 to rotate simultaneously. The multiple rotating rods 26 then rotate 90 degrees synchronously. At this point, multiple wafers are laid flat along the longitudinal direction. Then, the spacing of the pick-up forks is adjusted adaptively, allowing multiple pick-up forks to simultaneously contact the surfaces of multiple wafers, and then all wafers can be removed together.

[0049] This enables adaptive changes to the wafer orientation, allowing for both flat arrangement and vertical stacking, thus adapting to different usage requirements. It also facilitates the use of multiple sets of wafer pickers arranged at equal intervals along the longitudinal direction to remove the wafers, thereby improving the efficiency of subsequent wafer processing.

[0050] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer carrier for suspended semiconductor wafer production, comprising a carrier frame (1), wherein fixed frames (33) are fixedly connected to both ends of the carrier frame (1), and lifting rings (2) are fixedly connected to both sides of the top of the fixed frames (33), characterized in that: The upper surface of the carrier frame (1) is provided with multiple sets of wafer arrangement and placement auxiliary components along the transverse direction; The wafer placement auxiliary component includes a fixed plate (6) fixedly connected to the upper surface of the carrier frame (1). A sliding plate (19) is fixedly connected to the upper end face of the fixed plate (6). A sliding groove is provided on one side of the sliding plate (19), and an adjusting plate (9) is slidably connected to both sides of the sliding groove. A conveyor belt (10) for carrying the wafer is provided on the adjusting plate (9). The two adjusting plates (9) cooperate with each other to form a placement channel that matches the diameter of the wafer. The conveyor belt (10) drives the wafer to move in the placement channel to form an arrangement state.

2. The wafer carrier for suspended semiconductor wafer production according to claim 1, characterized in that: The slide plate (19) has a two-way screw (7) rotatably connected to both ends of the slide groove. The two-way screw (7) is threaded to two adjusting plates (9) on both sides respectively.

3. The wafer carrier for suspended semiconductor wafer production according to claim 2, characterized in that: One end of the slide plate (19) is fixedly connected to the second motor (8), and the output end of the second motor (8) is fixedly connected to one end of the bidirectional lead screw (7).

4. The wafer carrier for suspended semiconductor wafer production according to claim 1, characterized in that: The carrier frame (1) is also equipped with an integrated wafer attitude adjustment and anti-collision component; The integrated wafer attitude adjustment and anti-collision component includes a transverse plate (3) slidably connected to one side of the upper surface of the carrier frame (1), a lifting block (12) slidably connected to one side of the transverse plate (3), a flipping frame (14) rotatably connected to one end of the lifting block (12), a plurality of sliders (22) are equidistantly slidably mounted on the flipping frame (14) along the transverse direction, a stop block (27) is slidably inserted into the lower end of the slider (22), a pressing block (23) is slidably connected to a groove on one side of the flipping frame (14), a winding wheel (24) is rotatably connected to one end of the flipping frame (14) near the transverse plate (3), a blocking cloth (25) is wound on the winding wheel (24), the blocking cloth (25) is slidably passed through one side of the flipping frame (14), the end of the blocking cloth (25) is fixedly connected to one side of the pressing block (23), a rotating rod (26) is rotatably connected to one end of the slider (22), and an electrostatic chuck (32) is fixedly connected to one end of the rotating rod (26).

5. A wafer carrier for suspended semiconductor wafer production according to claim 4, characterized in that: One end of the transverse plate (3) is threadedly connected to a lead screw (4), both ends of the lead screw (4) are rotatably connected to the carrier frame (1), one end of the carrier frame (1) is fixedly connected to a motor (5), and the output end of the motor (5) is fixedly connected to one end of the lead screw (4).

6. A wafer carrier for suspended semiconductor wafer production according to claim 4, characterized in that: One end of the transverse plate (3) is fixedly connected to a cylinder (11), the piston end of the cylinder (11) is fixedly connected to one side of the lifting block (12), one end of the lifting block (12) is fixedly connected to a motor (13), and the output end of the motor (13) is fixedly connected to one end of the flipping frame (14).

7. A wafer carrier for suspended semiconductor wafer production according to claim 4, characterized in that: The integrated wafer attitude adjustment and anti-collision component also includes a transmission adjustment structure; The transmission adjustment structure includes multiple connecting rods 1 (20) and connecting rod 2 (21). The ends of two adjacent connecting rods 1 (20) are connected, and the ends of adjacent connecting rods 1 (20) and connecting rod 2 (21) are rotatably connected. The middle part of the connecting rod 1 (20) is rotatably connected to the top of the slider (22). One end of the front connecting rod 1 (20) is rotatably connected to the slider (22), and one end of the rear connecting rod 1 (20) is rotatably connected to the flipping frame (14). One end of the flipping frame (14) is fixedly connected to a cylinder 2 (15), and the piston end of the cylinder 2 (15) is fixedly connected to one end of the frontmost slider (22).

8. A wafer carrier for suspended semiconductor wafer production according to claim 4, characterized in that: One end of the extrusion block (23) is threadedly connected to a lead screw (29), both ends of the lead screw (29) are rotatably connected to the flipping frame (14), one end of the flipping frame (14) is fixedly connected to a motor (30), the output end of the motor (30) is fixedly connected to one end of the lead screw (29), one end of the flipping frame (14) is fixedly connected to a motor (28), the output end of the motor (28) is fixedly connected to the middle of the winding wheel (24).

9. A wafer carrier for suspended semiconductor wafer production according to claim 4, characterized in that: One end of the slider (22) is rotatably connected to a worm (17), and one end of the rotating rod (26) is fixedly connected to a worm wheel (18). The worm wheel (18) is rotatably connected to the slider (22), and the worm wheel (18) meshes with the worm (17). One end of the flipping frame (14) is rotatably connected to a protrusion rod (16), and the protrusion rod (16) and multiple worms (17) are slidably connected through keyways. One end of the flipping frame (14) is fixedly connected to a motor (34), and the output end of the motor (34) is fixedly connected to one end of the protrusion rod (16).

10. A wafer carrier for suspended semiconductor wafer production according to claim 4, characterized in that: A spring (31) is fixedly connected to the lower end of the slider (22), and the other end of the spring (31) is fixedly connected to the bottom of the inner wall of the stop (27).

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