A semiconductor apparatus having a detection edge ring horizontal landing pose
By setting up an optical detection system consisting of laser emitters and receivers in a semiconductor device, the horizontal attitude of the edge ring is detected in real time, which solves the problem of unreliable edge ring positioning detection in the prior art and achieves automated, real-time, and high-precision detection results.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHANGHAI BANGXIN SEMI TECHNOLOGY CO LTD
- Filing Date
- 2026-05-09
- Publication Date
- 2026-06-09
AI Technical Summary
Existing semiconductor equipment lacks a real-time detection device for the horizontal positioning posture of the edge ring, which leads to uneven wafer etching or equipment damage. Existing detection methods have low reliability and cannot achieve automated alarm.
A non-contact optical inspection system is formed by using a laser beam passing through a dielectric window to detect the horizontal attitude of the edge ring in real time. The laser beam path is adjusted by using deflection, axial and circumferential drive components to achieve automated, real-time and high-precision inspection.
It enables automated, real-time, and high-precision detection of the horizontal positioning posture of the edge ring, avoiding the unreliability of manual visual inspection, providing a direct monitoring method, and ensuring the stability of the process and the safety of the equipment.
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Figure CN122180355A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of wafer processing equipment technology, and more particularly to a semiconductor device for detecting the horizontal positioning posture of edge rings. Background Technology
[0002] In semiconductor manufacturing processes, wafers are placed on electrostatic chucks, and an edge ring descends via a drive cylinder to hold the wafer edges in place, serving to fix the wafer and regulate the airflow within the cavity. However, due to mechanical wear, air pressure fluctuations, obstructions from foreign objects, or jamming in the transmission mechanism, the edge ring may become skewed, jammed, or tilted to one side during its descent, preventing it from maintaining a horizontal position against the wafer. If this abnormal positioning is not detected in time, it can cause uneven etching in some areas of the wafer, or even break the wafer or damage the expensive electrostatic chuck in subsequent steps. Currently, existing etching equipment lacks dedicated devices for detecting this condition. Operators typically rely on visual inspection through an observation window or indirect judgment based on abnormal process parameters. This method is unreliable and cannot achieve automated alarm functionality. Summary of the Invention
[0003] This invention proposes a semiconductor device for detecting the horizontal positioning attitude of an edge ring. The purpose is to detect the horizontal attitude of the edge ring in real time during its descent by passing a laser beam horizontally through a dielectric window.
[0004] To achieve the above objectives, the present invention provides a semiconductor device for detecting the horizontal positioning posture of an edge ring, comprising a fixed platform, a laser emitter, a laser receiver, and a fixed base component; The fixed platform is located outside the dielectric window, and an electrostatic chuck is provided inside the dielectric window. A wafer is pressed against the top of the electrostatic chuck by an edge ring. An auxiliary detection device is provided on the fixed platform, which is used to detect the attitude of the laser emitter and the laser receiver. The fixing base component is disposed on the fixing platform and located between the fixing platform and the dielectric window; the fixing base component includes a deflection drive component, an axial drive component and a circumferential drive component. The laser emitter and the laser receiver are both disposed on the fixing platform through the deflection drive component, the axial drive component and the circumferential drive component, and the laser emitter and the laser receiver are respectively disposed on opposite sides outside the dielectric window, so as to detect the horizontal positioning posture of the edge ring during the process of the laser beam emitted by the laser emitter passing through the dielectric window and being received by the laser receiver.
[0005] Optionally, the deflection drive assembly includes a support portion and a rotating portion; The rotating part is fixedly inserted into the laser emitter and extends along the circumference of the electrostatic chuck, and the rotating part is rotatably disposed on the support part so that the laser emitter can swing in the axial direction of the electrostatic chuck with the rotating part as the center. The combined structure of the support and the rotating part is provided in two sets, one set of which is connected to the laser receiver and the other set of which is connected to the laser emitter.
[0006] Optionally, the deflection drive assembly further includes a first engagement portion, a second engagement portion, and a deflection drive element; The first engagement portion is located on the end of the laser emitter away from its emitting end. The second engagement portion engages with the first engagement portion. The deflection drive is located on the support portion, and its drive end is connected to the second engagement portion. The deflection drive drives the rotation of the second engagement portion so as to make the laser emitter pitch and deflect by cooperating with the first engagement portion.
[0007] Optionally, the axial drive assembly includes a second axial drive member and a support box; The second axial drive member is disposed on the inner wall of the support box, and its drive end is connected to the support part. The support part is movably disposed in the support box so that, under the drive of the second axial drive member, the laser emitter moves along the axial direction of the electrostatic chuck through the support part, so that the laser beam emitted by the adjusted laser emitter is suitable for the edge ring with various axial thicknesses.
[0008] Optionally, the support box is provided with a deflection through hole communicating with the inner cavity of the support box on the side near the electrostatic chuck. At least a portion of the laser emitter is disposed in the deflection through hole, and the axial height of the deflection through hole is greater than the axial height of the laser emitter, so as to avoid interference between the laser emitter and the support box when the laser emitter makes pitch deflection movements.
[0009] Optionally, the circumferential drive assembly includes a support ring and a support slider; The support ring is disposed on the fixed platform and extends circumferentially along the electrostatic chuck. The support ring has an annular groove recessed from its inner ring wall to its outer ring wall. The support slider is connected to the end of the support box away from the electrostatic chuck, and the support slider is slidably disposed in the annular groove, so that the circumferential movement of the support slider in the annular groove drives the laser emitter to rotate circumferentially around the electrostatic chuck, thereby adjusting the incident position of the laser beam emitted by the laser emitter in the circumferential direction.
[0010] Optionally, the circumferential drive assembly further includes a third engagement portion, a fourth engagement portion, and a circumferential drive member; The third engagement part is disposed on the side wall of the annular slide groove and extends circumferentially along the annular slide groove. The fourth engagement part engages with the third engagement part. The circumferential drive member is disposed on the support slider, and its drive end extends axially along the electrostatic chuck and connects with the fourth engagement part. The circumferential drive member drives the rotation of the fourth engagement part and, through cooperation with the third engagement part, causes the laser emitter to rotate circumferentially.
[0011] Optionally, the combination structure of the laser emitter and the laser receiver is provided in multiple sets, and the multiple sets are arranged along the circumference of the electrostatic chuck, so that the beams emitted by each set intersect, so as to detect the horizontal positioning posture of the edge ring from different circumferential positions.
[0012] Optionally, a first axial drive member is provided on the fixed platform or the dielectric window, the drive end of the first axial drive member is connected to the bottom of the edge ring, and the first axial drive member is used to drive the edge ring to move axially on the electrostatic chuck.
[0013] The beneficial effects of this invention are as follows: This invention constructs a non-contact optical inspection system by setting a fixed base component on a fixed platform outside the dielectric window, and laser emitters and receivers mounted on it on opposite sides of the dielectric window. This system enables a laser beam to pass horizontally through the dielectric window, detecting the horizontal attitude of the edge ring in real time as it falls. When the edge ring fails to land horizontally, it will block or deflect the beam path, causing a change in the signal received by the laser receiver. This achieves automated, real-time, and high-precision detection of the edge ring's horizontal landing attitude, effectively avoiding the unreliability caused by manual visual inspection or indirect parameter judgment, and providing a direct and reliable monitoring method for preventing process abnormalities and equipment damage. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the structure of a semiconductor device for detecting the horizontal positioning posture of an edge ring according to an embodiment of the present invention; Figure 2 For the present invention Figure 1 A schematic diagram of the structure at the pitch and oscillation point of the laser emitter in the embodiment; Figure 3 For the present invention Figure 1 A schematic diagram of the structure at the circumferential rotation point of the laser emitter and laser receiver in the embodiment; Figure 4 For the present invention Figure 3 An enlarged structural diagram of position A in the embodiment.
[0015] Explanation of reference numerals in the attached figures: 1. Fixed platform; 2. Laser emitter; 3. Electrostatic chuck; 4. Edge ring; 5. Laser receiver; 6. First axial drive; 7. Fixed base component; 8. Auxiliary detection component; 9. Support part; 10. Rotating part; 11. First meshing part; 12. Second meshing part; 13. Deflection drive; 14. Second axial drive; 15. Support box; 151. Deflection through hole; 16. Support ring part; 161. Annular groove; 17. Support slider; 18. Third meshing part; 19. Fourth meshing part; 20. Circumferential drive. Detailed Implementation
[0016] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions in the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without inventive effort are within the scope of protection of this invention. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed following the word and its equivalents, but do not exclude other elements or objects.
[0017] To address the problems existing in the prior art, embodiments of the present invention provide a semiconductor device for detecting the horizontal positioning posture of an edge ring, such as... Figure 1 As shown, the semiconductor device for detecting the horizontal positioning posture of an edge ring includes a fixed platform 1, a laser emitter 2, a laser receiver 5, and a mounting bracket 7. The fixed platform 1 provides a stable base for the entire system to be installed outside the dielectric window, avoiding direct modification of the original internal structure (such as the electrostatic chuck 3). The mounting bracket 7 not only serves as the mounting carrier for the laser emitter 2 and the laser receiver 5, but its specific structure also provides a mechanism for adjusting the height, angle, and circumferential position of the laser components, thereby adapting to edge rings 4 of different sizes and detection requirements. Most importantly, by pairing the laser emitter 2 and the laser receiver 5 and placing them on opposite sides of the dielectric window, a horizontal beam path is formed that passes through the dielectric window. This non-contact, penetrating design allows the light beam to directly and in real-time detect any obstruction or deviation in the optical path during the descent of the edge ring 4. This transforms the physical orientation (horizontal or not) of the edge ring 4 into a change in optical signal that can be precisely sensed by the laser receiver 5. This enables automated, real-time, and high-precision detection of the positioning orientation of the edge ring 4, fundamentally solving the problems of low reliability and inability to provide real-time early warning caused by traditional methods that rely on manual visual inspection or indirect process parameter judgment.
[0018] In one embodiment, such as Figure 1 As shown, the fixed platform 1 is located outside the dielectric window, and the inner cavity of the dielectric window is provided with an electrostatic chuck 3. The top of the electrostatic chuck 3 is pressed with a wafer by an edge ring 4.
[0019] In one embodiment, such as Figure 1 As shown, the fixing base component 7 is disposed on the fixing platform 1 and located between the fixing platform 1 and the dielectric window. The fixing base component 7 includes a deflection drive assembly, an axial drive assembly, and a circumferential drive assembly. The laser emitter 2 and the laser receiver 5 are both disposed on the fixing platform 1 through the deflection drive assembly, the axial drive assembly, and the circumferential drive assembly.
[0020] In one embodiment, such as Figure 1 As shown, both the laser emitter 2 and the laser receiver 5 are mounted on the fixed base member 7, and the laser emitter 2 and the laser receiver 5 are respectively located on opposite sides outside the dielectric window (e.g., Figure 1 In this embodiment, the laser emitter 2 and the laser receiver 5 are positioned on the left and right sides of the dielectric window (with the laser emitter 2 and the laser receiver 5 arranged on the same optical path) to detect the horizontal positioning attitude of the edge ring 4 as the light beam emitted by the laser emitter 2 passes through the dielectric window and is received by the laser receiver 5. The laser emitter 2 and the laser receiver 5 are both mounted on the fixing base component 7 and positioned on opposite sides outside the dielectric window. The core advantage of this arrangement is that it cleverly and accurately achieves non-contact, penetrating, and real-time in-situ detection of the horizontal attitude of the edge ring 4. Specifically, this structure constructs a horizontal, stable optical detection path that traverses the entire cavity (i.e., the inner cavity of the dielectric window). When the edge ring 4 falls normally and horizontally above the electrostatic chuck 3, its position is lower than the beam path and will not obstruct the beam. However, if the edge ring 4 becomes abnormally horizontal due to tilting, jamming, or one-sided lifting, the lifted portion will intrude into this preset horizontal beam path, thereby obstructing or disturbing the beam. This change in physical orientation is immediately reflected in changes in the light signal (such as intensity and position) received by the laser receiver 5. By monitoring these signal changes, the system can determine in real time whether the edge ring 4 is in the correct horizontal positioning posture, thus providing direct automated monitoring and early warning capabilities for the stability of the process and equipment safety, effectively replacing the unreliable methods that rely on manual visual inspection or indirect process parameter inference.
[0021] In one embodiment, such as Figure 1As shown, an auxiliary detection component 8 is provided on the fixed platform 1. This component 8 is used to detect the attitude of the laser emitter 2 and the laser receiver 5, ensuring that the laser emitter 2 emits a beam in a horizontal attitude and that the beam is received by the laser receiver 5 in a horizontal attitude. This arrangement fundamentally ensures the accuracy of the detection benchmark and the reliability of the system itself. Specifically, the laser detection system determines the attitude of the edge ring 4 based on whether the horizontal beam is blocked. The auxiliary detection component 8 calibrates and monitors the attitude (such as installation level and angle) of the laser emitter 2 and the laser receiver 5. This effectively compensates for and eliminates mechanical deviations caused by equipment vibration, thermal deformation, long-term operation, or initial installation errors, thereby ensuring that the emission and reception axes of the laser beam remain strictly horizontal. Thus, when the edge ring 4 is in a normal attitude, the beam will not be falsely triggered; only when the edge ring 4 is indeed tilted upwards and not horizontal will the beam be reliably blocked. Therefore, the setting of auxiliary detection component 8 is a key link to improve the detection accuracy of the entire system and reduce false alarms and missed alarms. It ensures that the "zeroing" benchmark of the subsequent detection signal is accurate and error-free, making the detection results of the edge ring 4 anomaly highly reliable.
[0022] In one embodiment, the auxiliary detection component 8 can be a high-precision dual-axis tilt sensor (or inclinometer). This auxiliary detection component 8 can continuously and in real-time measure the tilt angles (i.e., pitch and roll angles) of the laser emitter 2 and laser receiver 5 relative to the horizontal plane, and feed this attitude data back to the device's control system. By comparing a preset horizontal reference with the sensor's measured values, the system can automatically determine whether the laser emitter 2 and laser receiver 5 are aligned and remain horizontal. If a deviation is detected, the control system can issue a calibration alarm or fine-tune the pitch angle of the laser emitter 2 and laser receiver 5, thereby ensuring the long-term stability and accuracy of the optical detection reference at the hardware level, providing a reliable prerequisite for the horizontal attitude detection of the edge ring 4.
[0023] In one embodiment, the auxiliary detection component 8 can be mounted on the fixed platform 1 or directly on the housing of the laser emitter 2 and the laser receiver 5, forming a stable mechanical connection with the emitting and receiving optical axes of the laser emitter 2 and the laser receiver 5. Specifically, the auxiliary detection component 8 (such as a high-precision tilt sensor) can be embedded or fixed to the mounting flange of the laser emitter 2 and the laser receiver 5, the inner side of the housing near the optical window, or on its bearing axis, to ensure that the sensor can directly and accurately sense the attitude changes of the laser components themselves. By integrating the auxiliary detection component 8 with the laser device on the same rigid body, measurement errors introduced by relative displacement or vibration between components can be minimized, thereby achieving the most direct and highest fidelity monitoring of the horizontality (or parallelism) of the laser beam emitting and receiving axes. This positioning ensures the high coaxiality and consistency between the calibration reference and the detection optical path, which is crucial for ensuring the long-term stable and reliable operation of the system.
[0024] In one embodiment, such as Figure 2 As shown, the deflection drive assembly includes a support part 9 and a rotating part 10; the rotating part 10 is fixedly inserted into the laser emitter 2 and extends along the circumference of the electrostatic chuck 3, and the rotating part 10 is rotatably disposed on the support part 9, so that the laser emitter 2 can pitch and swing about the rotating part 10 in the axial direction of the electrostatic chuck 3; the combined structure of the support part 9 and the rotating part 10 is provided in two sets, one set is connected to the laser receiver 5, and the other set is connected to the laser emitter 2.
[0025] This embodiment provides independently adjustable and stable pitch angle adjustment for the laser emitter 2 and laser receiver 5, thereby ensuring precise alignment and adaptability of optical detection. Specifically, the rotating part 10 extends circumferentially along the electrostatic chuck 3 and serves as a rotation axis, allowing the laser emitter 2 and laser receiver 5 to perform fine pitch oscillation axially around this center. Setting up two sets of this combined structure and connecting them to the laser emitter 2 and laser receiver 5 respectively means that both the laser emitter 2 and laser receiver 5 possess their own independent pitch adjustment degrees of freedom. This design allows both to not only independently calibrate their horizontal attitude (in conjunction with the auxiliary detection component 8), but more importantly, when the cavity structure is not perfectly symmetrical on both sides of the dielectric window due to thermal deformation or installation deviation, the operator can finely adjust the emission angle of the emitted beam and the alignment angle of the receiver end separately. This ensures that regardless of the external environment, the laser beam can accurately pass through the dielectric window and be received along the optimal horizontal path, thereby guaranteeing the stability of the detection system and the reliability of the detection signal under various operating conditions.
[0026] In one embodiment, such as Figure 2As shown, the deflection drive assembly further includes a first engagement portion 11, a second engagement portion 12, and a deflection drive member 13; the first engagement portion 11 is disposed on the end of the laser emitter 2 away from its emitting end, the second engagement portion 12 is engaged with the first engagement portion 11, the deflection drive member 13 is disposed on the support portion 9, and its driving end is connected to the second engagement portion 12, the deflection drive member 13 drives the rotation of the second engagement portion 12, so as to carry the laser emitter 2 to pitch deflection motion through cooperation with the first engagement portion 11.
[0027] This embodiment provides a precise, controllable, and structurally stable automatic adjustment mechanism for realizing the pitch and deflection motion of the laser emitter 2. Specifically, the transmission structure converts the rotational motion of the deflection drive 13 into a fine-angle rotation of the laser emitter 2 around the axis of the rotating part 10 through the engagement of the second meshing part 12 and the first meshing part 11. Compared to purely manual adjustment, this design allows the control system to automatically and in real-time drive the deflection drive 13 to make fine adjustments based on the signals fed back by the auxiliary detection part 8, thereby quickly compensating for laser beam level deviations caused by equipment vibration, thermal deformation, or installation errors. The meshing transmission method has the advantages of precise transmission, no slippage, and good self-locking, ensuring that the adjusted angle position is firmly maintained and avoiding angle drift under process vibration environments. It essentially guarantees the long-term stability of the detection beam level reference and the high efficiency of adjustment, and is a key actuator for realizing automated, high-precision attitude detection and calibration.
[0028] In one embodiment, the first meshing portion 11 and the second meshing portion 12 can be a pair of meshing gears. The first meshing portion 11 can be a sector gear, semi-circular gear, or arc-shaped rack located at the end of the laser emitter 2 away from its emitting end, with its tooth profile extending along the axial direction of the rotating portion 10. The second meshing portion 12 can be a matching pinion, which is fixedly connected to the output shaft of the deflection drive 13. When the deflection drive 13 drives the second meshing portion 12 to rotate, the rotational motion is converted into a pitch deflection motion of the laser emitter 2 about the axis of the rotating portion 10 through meshing with the first meshing portion 11, thereby achieving precise and adjustable control of the laser beam emission angle.
[0029] In one embodiment, the deflection drive 13 can be a precision angle drive device, such as a small servo motor or stepper motor. The motor is fixedly mounted on the support 9, and its output shaft is directly connected to the second engagement part 12. When the pitch angle of the laser emitter 2 needs to be adjusted, the deflection drive 13 receives a command from the control system and drives its output shaft to rotate precisely, thereby causing the second engagement part 12 to rotate. Through the meshing transmission between the second engagement part 12 and the first engagement part 11 (such as a sector gear) fixed on the laser emitter 2, the rotational motion of the motor is converted into a limited-angle deflection of the laser emitter 2 around the axis of the rotating part 10, achieving fine-tuning and control of the horizontal emission attitude of the laser beam.
[0030] In one embodiment, such as Figure 2 As shown, the axial drive assembly includes a second axial drive member 14 and a support box 15; the second axial drive member 14 is disposed on the inner wall of the support box 15, preferably connected to the inner bottom wall of the support box 15, and its drive end is connected to the support part 9. The support part 9 is movably disposed inside the support box 15 so that, driven by the second axial drive member 14, the laser emitter 2 moves along the axial direction of the electrostatic chuck 3 through the support part 9, so that the beam emitted by the adjusted laser emitter 2 is suitable for the edge ring 4 with various axial thicknesses.
[0031] This provides the laser emitter 2 with precise and adjustable displacement along the axial direction (i.e., vertical direction) of the electrostatic chuck 3, greatly enhancing the versatility and adaptability of the detection system. Specifically, the extension and retraction of the second axial drive component 14 (such as an electric push rod, a lead screw driven by a servo motor, etc.) can drive the support 9 to move vertically within the support box 15, thereby causing the entire laser emitter 2 assembly (including the rotating part 10 and the deflection drive component 13 on it) to rise and fall axially. The direct benefit of this design is that when different thicknesses of edge rings 4 need to be processed in the process cavity, or when the working surface height of the edge ring 4 changes slightly due to wear, the operator or control system can adjust the overall height of the laser emitter 2 (and the matching laser receiver 5) to precisely set the horizontal detection path of the laser beam at the most sensitive and suitable height position, such as aligning it with the thin edge or specific structural part of the edge ring 4 that is most prone to warping. This allows the same testing equipment to quickly and flexibly adapt to various process formulas and component specifications without major modifications to the mechanical structure, ensuring the effectiveness of testing and high utilization of the equipment, and solving the problem of the limited applicability of traditional fixed testing devices.
[0032] In one embodiment, such as Figure 2As shown, the support box 15 has a deflection through hole 151 communicating with the inner cavity of the support box 15 on the side near the electrostatic chuck 3. At least a portion of the laser emitter 2 is disposed within the deflection through hole 151, and the axial height of the deflection through hole 151 is greater than the axial height of the laser emitter 2 to avoid interference between the laser emitter 2 and the support box 15 when the laser emitter 2 performs pitch deflection motion. In this way, while ensuring that the support box 15 provides stable installation and axial movement guidance for the laser emitter 2, it also reserves the necessary swing space for the laser emitter 2 to perform pitch deflection motion, thereby completely avoiding structural interference.
[0033] Specifically, the main body or part of the laser emitter 2 (such as the end containing the first engaging part 11) extends through the deflection through-hole 151, and the axial height (i.e., vertical dimension) of the deflection through-hole 151 is designed to be greater than the axial height of the corresponding part of the laser emitter 2. This dimensional difference provides sufficient margin for the vertical swing of the laser emitter 2 during pitch adjustment. Regardless of whether the laser emitter 2 is tilted up or down, its outer shell will not collide or rub against the side wall of the support box 15 (i.e., the upper and lower edges of the deflection through-hole 151). This ensures that the precision angle adjustment driven by the deflection drive 13 can be performed smoothly and without obstruction, protects the transmission mechanism, maintains the adjustment accuracy, and is a key structural design that enables the entire pitch adjustment function to be realized and maintain long-term reliability.
[0034] In one embodiment, such as Figure 3 As shown, the circumferential drive assembly includes a support ring portion 16 and a support slider 17. The support ring portion 16 is disposed on the fixed platform 1 and extends circumferentially along the electrostatic chuck 3. The support ring portion 16 has an annular groove 161 recessed from its inner ring wall to its outer ring wall. The cavity of the annular groove 161 extends circumferentially along the support ring portion 16. The support slider 17 is connected to the end of the support box 15 away from the electrostatic chuck 3, and the support slider 17 is slidably disposed in the annular groove 161, so that the circumferential movement of the support slider 17 in the annular groove 161 causes the laser emitter 2 to rotate circumferentially around the electrostatic chuck 3, thereby adjusting the incident position of the beam emitted by the laser emitter 2 in the circumferential direction.
[0035] In this embodiment, the combined structure of the support ring 16, the annular groove 161, and the support slider 17 provides the laser emitter 2 (and its associated laser receiver 5) with continuous and stable rotational motion along the circumference of the electrostatic chuck 3 (i.e., around the cavity), thereby enabling flexible multi-point and multi-angle detection of the edge ring 4. Specifically, the support ring 16 and its annular groove 161 form a precise circular track, and the support slider 17 is connected to the support box 15 (carrying the laser emitter 2) and slides within this track. This design allows the entire laser detection unit (including the laser emitter 2, the laser receiver 5, the support box 15, and its internal adjustment mechanism) to move smoothly circumferentially around the central axis of the cavity as a whole. This configuration allows the operator or control system to precisely position the detection path of the laser beam at any specific location on the circumference of the edge ring 4 as needed, such as a sector known to be prone to wear, or to detect different circumferential positions in different process steps. This greatly expands the coverage and targeting of the inspection, enabling a single laser inspection system to not only determine the overall horizontal orientation of the edge ring 4, but also to assess its local unevenness or circumferential non-uniformity, thereby providing more comprehensive and refined process status monitoring and enhancing the equipment's fault diagnosis capabilities and process optimization potential.
[0036] It is worth noting that, in order to ensure that the beam emitted by the laser emitter 2 can be received by the laser receiver 5, both the laser emitter 2 and the laser receiver 5 are adjusted synchronously when their positions are adjusted.
[0037] In one embodiment, such as Figure 4 As shown, the circumferential drive assembly further includes a third engagement part 18, a fourth engagement part 19, and a circumferential drive member 20; the third engagement part 18 is disposed on the side wall of the annular slide groove 161 and extends circumferentially along the annular slide groove 161; the fourth engagement part 19 engages with the third engagement part 18; the circumferential drive member 20 is disposed on the support slider 17, and its drive end extends axially along the electrostatic chuck 3 and is connected to the fourth engagement part 19; the circumferential drive member 20 drives the rotation of the fourth engagement part 19 and, through cooperation with the third engagement part 18, causes the laser emitter 2 to perform circumferential rotational motion.
[0038] This provides a precise, controllable, and stable automated drive mechanism for the circumferential rotation of the laser emitter 2, replacing manual sliding adjustment. Specifically, the circumferential drive 20 (e.g., a motor) is fixed to the support slider 17, and its drive shaft drives axially and connects to the fourth meshing part 19 (e.g., a pinion). The fourth meshing part 19 meshes with the third meshing part 18 (e.g., a ring rack) extending circumferentially along the side wall of the annular groove 161. When the circumferential drive 20 operates, it drives the fourth meshing part 19 to rotate. Through the meshing transmission between the third meshing part 18 and the fourth meshing part 19, the rotational motion is efficiently and accurately converted into the circumferential linear motion of the support slider 17 and the entire detection unit along the annular groove 161. This design achieves automated and programmed control of the circumferential position of the detection point. According to the preset program or real-time requirements, the laser beam can be quickly and accurately positioned at any specified angle on the circumference of the edge ring 4 for scanning or fixed-point detection, thereby greatly improving the automation level, positioning accuracy, and detection efficiency of the detection. It is an advanced function that meets the needs of complex process monitoring.
[0039] In one embodiment, the structure of the third meshing part 18 and the fourth meshing part 19 is the same as that of the first meshing part 11 and the second meshing part 12, and they are all gear pairs. The difference lies in their shape. This allows the gear pair to be adapted to different environments by adjusting the shape of the gear pair according to the actual working conditions.
[0040] In one embodiment, multiple sets of the combined structure of the laser emitter 2 and the laser receiver 5 are arranged circumferentially along the electrostatic chuck 3, causing the beams emitted by each set to intersect, thereby detecting the horizontal positioning posture of the edge ring 4 from different circumferential positions. This arrangement of multiple sets of laser emitters 2 and laser receivers 5, arranged circumferentially along the electrostatic chuck 3 with intersecting beams, has the main advantage of enabling multi-point, multi-angle, and redundant detection of the horizontal positioning posture of the edge ring 4, thus significantly improving the comprehensiveness, accuracy, and reliability of the detection. Specifically, by emitting intersecting laser beams from different circumferential positions (e.g., two mutually perpendicular directions), the height or posture of multiple key positions (e.g., front, back, left, and right) on the circumference of the edge ring 4 can be detected simultaneously. This design can not only detect the overall tilt of the edge ring 4 (e.g., a single side tilting up), but also effectively identify complex anomalies such as local unevenness, twisting, or point protrusions. The detection network composed of multiple beams provides redundant signals. Even if one beam is misjudged due to special obstruction (such as random dust), the signals from other beams can still provide accurate judgments, greatly reducing the probability of false alarms and missed alarms and ensuring the robustness of the detection results. This enables the system to more comprehensively and accurately assess the true attitude of edge ring 4, providing a higher level of protection for the stability of the process and the safety of the equipment.
[0041] In one embodiment, the combined structure of multiple sets of laser emitters 2 and laser receivers 5 can be divided into two parts. One part is arranged on the same radial plane and spaced around the circumference, preferably at equal intervals. The other part is arranged on different axial planes. This enables comprehensive and three-dimensional detection of the three-dimensional posture of the edge ring 4, significantly improving the detection accuracy, reliability, and ability to identify complex anomalies. Specifically, the combined structure of multiple sets of laser emitters 2 and laser receivers 5 arranged on the same radial plane and at equal intervals around the circumference can simultaneously monitor the posture of the edge ring 4 at the same horizontal height (i.e., radial plane) from multiple directions (such as front, back, left, and right). This can effectively detect whether the edge ring 4 has undergone overall tilting, unilateral warping, or circumferential uneven torsion deformation at that height.
[0042] Meanwhile, by placing the combined structure of another part of the laser emitter 2 and laser receiver 5 on different axial planes (i.e., at different vertical heights), a layered, multi-planar laser detection network is constructed. This layout can not only detect the levelness of the edge ring 4 on a single cross-section, but also detect whether its horizontal attitude is consistent at different heights, thereby identifying more complex three-dimensional attitude anomalies such as bending, twisting, or conical or non-parallel movement of the edge ring 4 during its descent. Combining layered detection in the circumferential and axial directions enables the system to obtain multi-dimensional, high-density information on the attitude of the edge ring 4, thereby more accurately determining the fault mode and providing a higher level of protection for process stability and equipment safety.
[0043] In one embodiment, such as Figure 1 As shown, a first axial drive member 6 is provided on the fixed platform 1 or the dielectric window. The driving end of the first axial drive member 6 is connected to the bottom of the edge ring 4. The first axial drive member 6 is used to drive the edge ring 4 to move axially on the electrostatic chuck 3. The main advantage of providing the first axial drive member 6 on the fixed platform 1 or the dielectric window and connecting its driving end to the bottom of the edge ring 4 is that it provides an active and controllable actuator for the axial (vertical) movement of the edge ring 4, making the "pressing down" and "lifting up" actions of the edge ring 4 themselves a process step that can be precisely controlled and linked with the detection system.
[0044] Specifically, the first axial drive component 6 (such as a cylinder or a lead screw mechanism driven by a servo motor) enables automated lifting and lowering of the edge ring 4. This not only meets the basic requirements for clamping and loosening the wafer during the process, but more importantly, when the laser detection system detects an abnormal positioning posture of the edge ring 4 (such as skewness or jamming), the control system can immediately command the first axial drive component 6 to stop, retract, or make micro-adjustments, thereby avoiding damage to the wafer or electrostatic chuck 3 caused by forced pressing. Furthermore, active control also enables the equipment to perform "pre-inspection" or "cleaning cycles," such as first raising the edge ring 4 to the laser beam height for a level pre-inspection, confirming it is normal before pressing it down, or raising it during maintenance for inspection and cleaning. Therefore, the first axial drive component 6 transforms the edge ring 4 from a passive, purely mechanical actuator into a monitorable, feedback-enabled, and adjustable active control unit, greatly enhancing the automation level, process safety, and maintainability of the equipment.
[0045] In one embodiment, the number of the first axial drive members 6 is set to several, and they are arranged at equal intervals along the circumference of the electrostatic chuck 3, so as to work together to drive the lifting and lowering of the edge ring 4.
[0046] By reverse reasoning, the laser emitter 2 and the laser receiver 5 can also be used to detect whether one or more of the first axial drive units 6 have malfunctioned. Specifically, when the semiconductor device is equipped with multiple independently driving first axial drive units 6 that drive different regions or segmented edge rings, multiple combinations of the laser emitter 2 and the laser receiver 5 can be configured to align their beams with the segments controlled by different first axial drive units 6. During the overall rise or fall of the edge ring 4, the control system can synchronously monitor the signal of each group of laser beams. If a group of laser beams experiences abnormal, continuous obstruction, intensity fluctuation, or spot deviation within the predetermined stroke range of its corresponding first axial drive unit 6, while the signals of other groups of laser beams are normal, it indicates that the first axial drive unit 6 corresponding to the segment with the abnormal signal has experienced a separate malfunction, such as insufficient output of the cylinder or motor of the first axial drive unit 6, jamming of the transmission mechanism, failure of the position sensor, or abnormal control signal. Through this multi-point, zoned optical monitoring and signal comparison, the system can achieve synchronous and independent diagnosis of the working status of multiple first axial drive components 6, accurately locate which one or several first axial drive components 6 have failed, thus providing a direct basis for accurate equipment maintenance and rapid troubleshooting.
[0047] In one embodiment, the semiconductor device for detecting the horizontal positioning attitude of the edge ring can be a plasma etching device or a chemical vapor deposition device, particularly a chamber module where precise control of the process uniformity in the wafer edge region is required. In these devices, the wafer is placed on an electrostatic chuck 3 and clamped and fixed by an edge ring 4 (or edge clamping ring, focusing ring). In the etching process, the horizontal orientation of the edge ring 4 directly affects the gas flow distribution and plasma uniformity at the wafer edge, thereby affecting the etching rate and contour consistency; in the deposition process, it relates to the edge uniformity of the film thickness. The detection device described in this invention can be integrated outside the reaction chamber of such a device, with its laser beam passing horizontally through a dielectric window to monitor the orientation of the edge ring 4 in real time during the wafer clamping process. When the edge ring 4 is detected to be tilted or tilted to one side due to mechanical failure, foreign objects or wear, the system can alarm or interlock control in real time, thereby effectively preventing wafer fragments, damage to the electrostatic chuck 3 or uneven process caused by abnormal positioning of the edge ring 4, and significantly improving the process stability, product yield and operational safety of key semiconductor manufacturing equipment.
[0048] While embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of the present invention. Furthermore, the present invention described herein may have other embodiments and can be implemented or carried out in various ways.
Claims
1. A semiconductor device for detecting the horizontal positioning posture of an edge ring, characterized in that, Includes a fixed platform, laser emitter, laser receiver, and mounting base components; The fixed platform is located outside the dielectric window, and an electrostatic chuck is provided inside the dielectric window. A wafer is pressed against the top of the electrostatic chuck by an edge ring. An auxiliary detection device is provided on the fixed platform, which is used to detect the attitude of the laser emitter and the laser receiver. The fixing base component is disposed on the fixing platform and located between the fixing platform and the dielectric window; the fixing base component includes a deflection drive component, an axial drive component and a circumferential drive component. The laser emitter and the laser receiver are both disposed on the fixing platform through the deflection drive component, the axial drive component and the circumferential drive component, and the laser emitter and the laser receiver are respectively disposed on opposite sides outside the dielectric window, so as to detect the horizontal positioning posture of the edge ring during the process of the laser beam emitted by the laser emitter passing through the dielectric window and being received by the laser receiver.
2. The semiconductor device for detecting the horizontal positioning posture of an edge ring according to claim 1, characterized in that, The deflection drive assembly includes a support part and a rotating part; The rotating part is fixedly inserted into the laser emitter and extends along the circumference of the electrostatic chuck, and the rotating part is rotatably disposed on the support part so that the laser emitter can swing in the axial direction of the electrostatic chuck with the rotating part as the center. The combined structure of the support and the rotating part is provided in two sets, one set of which is connected to the laser receiver and the other set of which is connected to the laser emitter.
3. The semiconductor device for detecting the horizontal positioning posture of an edge ring according to claim 2, characterized in that, The deflection drive assembly further includes a first engagement part, a second engagement part, and a deflection drive element; The first engagement portion is located on the end of the laser emitter away from its emitting end. The second engagement portion engages with the first engagement portion. The deflection drive is located on the support portion, and its drive end is connected to the second engagement portion. The deflection drive drives the rotation of the second engagement portion so as to make the laser emitter pitch and deflect by cooperating with the first engagement portion.
4. The semiconductor device for detecting the horizontal positioning posture of an edge ring according to claim 2, characterized in that, The axial drive assembly includes a second axial drive component and a support box; The second axial drive member is disposed on the inner wall of the support box, and its drive end is connected to the support part. The support part is movably disposed in the support box so that, under the drive of the second axial drive member, the laser emitter moves along the axial direction of the electrostatic chuck through the support part, so that the laser beam emitted by the adjusted laser emitter is suitable for the edge ring with various axial thicknesses.
5. The semiconductor device for detecting the horizontal positioning posture of an edge ring according to claim 4, characterized in that, The support box has a deflection through hole on the side near the electrostatic chuck that communicates with the inner cavity of the support box. At least a portion of the laser emitter is disposed in the deflection through hole, and the axial height of the deflection through hole is greater than the axial height of the laser emitter, so as to avoid interference between the laser emitter and the support box when the laser emitter makes pitch and deflection movements.
6. The semiconductor device for detecting the horizontal positioning posture of an edge ring according to claim 4, characterized in that, The circumferential drive assembly includes a support ring and a support slider; The support ring is disposed on the fixed platform and extends circumferentially along the electrostatic chuck. The support ring has an annular groove recessed from its inner ring wall to its outer ring wall. The support slider is connected to the end of the support box away from the electrostatic chuck, and the support slider is slidably disposed in the annular groove, so that the circumferential movement of the support slider in the annular groove drives the laser emitter to rotate circumferentially around the electrostatic chuck, thereby adjusting the incident position of the laser beam emitted by the laser emitter in the circumferential direction.
7. The semiconductor device for detecting the horizontal positioning posture of an edge ring according to claim 6, characterized in that, The circumferential drive assembly further includes a third engagement part, a fourth engagement part, and a circumferential drive component; The third engagement part is disposed on the side wall of the annular slide groove and extends circumferentially along the annular slide groove. The fourth engagement part engages with the third engagement part. The circumferential drive member is disposed on the support slider, and its drive end extends axially along the electrostatic chuck and connects with the fourth engagement part. The circumferential drive member drives the rotation of the fourth engagement part and, through cooperation with the third engagement part, causes the laser emitter to rotate circumferentially.
8. The semiconductor device for detecting the horizontal positioning posture of an edge ring according to claim 1, characterized in that, The laser emitter and the laser receiver are arranged in multiple sets, and the multiple sets are arranged circumferentially along the electrostatic chuck, so that the beams emitted by each set intersect, so as to detect the horizontal positioning posture of the edge ring from different circumferential positions.
9. The semiconductor device for detecting the horizontal positioning posture of an edge ring according to claim 1, characterized in that, A first axial drive member is provided on the fixed platform or the dielectric window. The drive end of the first axial drive member is connected to the bottom of the edge ring. The first axial drive member is used to drive the edge ring to move axially on the electrostatic chuck.