A semiconductor chip batch mounting jig

Abstract

This invention relates to the field of semiconductor chip manufacturing technology, specifically disclosing a fixture for mass semiconductor chip mounting. The fixture includes a worktable, a first main body mounted on top of the worktable, a connecting arm mounted inside the first main body, a second main body mounted at one end of the connecting arm, and a housing mounted at the bottom of the second main body. A fixing plate is mounted on one side of the housing via two connecting brackets. Multiple vacuum adsorption mechanisms are arranged inside the fixing plate, each including multiple fixing tubes. Vacuum adsorption heads are mounted at the bottom ends of the fixing tubes. A detection mechanism is located at the bottom of the fixing plate, and clamping mechanisms are located at the bottom of the two connecting brackets. In this invention, the detection mechanism and clamping mechanism work together to comprehensively detect the coaxiality of the vacuum adsorption heads, ensuring precise movement of the vacuum adsorption heads during use, thereby improving the yield rate of chip mounting.

Description

Technical Field

[0001] This invention relates to the field of semiconductor chip manufacturing technology, and more specifically to a fixture for mass mounting of semiconductor chips. Background Technology

[0002] A semiconductor chip is a silicon wafer containing integrated circuits. Small in size yet powerful in function, it is a core component of computers or other electronic devices. It is manufactured through processes such as etching and wiring on semiconductor wafers to achieve specific circuit or system functions. Semiconductor chip mounting is a crucial step in semiconductor packaging, its function being to establish a secure mechanical connection and electrical conduction between the chip and the packaging carrier, while also providing a heat dissipation channel for the chip. During semiconductor chip mounting, the use of specialized fixtures allows for the simultaneous mounting of the chip carrier, semiconductor chip, and thermistor, improving mounting efficiency and yield.

[0003] In existing chip mounting fixtures, the vacuum adsorption mechanism is a key component, securing the chip through vacuum adsorption to ensure stability and accuracy during mounting. However, after a period of use, frequent contact and friction with the chip surface cause aging of the vacuum adsorption head material, affecting its shape and dimensional accuracy, leading to reduced coaxiality. Existing fixtures lack an automatic coaxiality detection mechanism for the vacuum adsorption head. If this reduction is not detected manually in time, continued use of the reduced coaxiality head will affect the accuracy of chip adsorption and mounting, impacting the chip placement yield. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a fixture for mass mounting of semiconductor chips.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A fixture for mass mounting of semiconductor chips includes a worktable. A first main body is mounted on the top of the worktable. A connecting arm is rotatably mounted inside the first main body. A second main body is rotatably mounted at the end of the connecting arm away from the first main body. A housing is mounted on the bottom of the second main body. A fixing plate is mounted on one outer wall of the housing via two connecting brackets. Multiple vacuum adsorption mechanisms are arranged inside the fixing plate. The multiple vacuum adsorption mechanisms include multiple fixing tubes. Vacuum adsorption heads are threadedly mounted on the bottom ends of the multiple fixing tubes. A detection mechanism for detecting the coaxiality of the multiple vacuum adsorption heads is provided at the bottom end of the fixing plate. A clamping mechanism is provided at the bottom of the two connecting brackets.

[0006] Optionally, a telescopic cylinder is installed inside the second main body, and the telescopic end of the telescopic cylinder is connected to the top of the box.

[0007] Optionally, the interior of the housing is pre-installed with a vacuum device, which is connected to the top of multiple fixed tubes via multiple flexible hoses.

[0008] Optionally, the detection mechanism includes multiple rings rotatably mounted on the bottom of a fixed plate. The multiple rings are located outside multiple fixed tubes, and the bottom ends of the multiple rings are connected to a movable ring via two electric telescopic rods.

[0009] Optionally, each of the multiple moving rings has two arc-shaped grooves inside, and an arc-shaped plate is rotatably installed inside each of the two arc-shaped grooves. A displacement sensor is installed inside each of the two arc-shaped plates.

[0010] Optionally, the clamping mechanism includes a mounting plate installed at the bottom of two connecting frames. Multiple first electric push rods are mounted on the bottom of the mounting plate. Each of the telescopic ends of the multiple first electric push rods is equipped with a movable plate. Rotating blocks are rotatably mounted on the bottom of each of the multiple movable plates. The multiple rotating blocks are all fitted onto the outside of multiple fixed tubes. Two electromagnets are mounted on the bottom of each of the multiple rotating blocks.

[0011] Optionally, the rotating block is rotatably connected to the moving plate via a rotating ring at its top. A toothed ring is installed on the outer wall of the rotating ring, and a drive motor is installed inside the moving plate. A gear that meshes with the toothed ring is installed at the output end of the drive motor.

[0012] Optionally, both outer walls of the rotating block are connected to moving blocks via a second electric push rod. The bottom ends of the two moving blocks are provided with sliding grooves, and sliders are installed inside the two sliding grooves. Rectangular plates are installed at the bottom ends of the two sliders.

[0013] Optionally, two slide rods are slidably installed inside each of the two rectangular plates. Springs are fitted on the outer walls of the two slide rods. A mounting bracket is installed at the bottom of the two slide rods. A rotating plate is rotatably installed inside the mounting bracket.

[0014] Optionally, a vacuum head is installed on one side of the outer wall of the rotating plate, and a rubber pad is installed on the other side of the outer wall of the rotating plate. The vacuum head is connected to an externally preset vacuuming device through a pipe.

[0015] The beneficial effects of this invention are: 1. In this invention, the detection mechanism can automatically and periodically detect the coaxiality of the vacuum adsorption head. During the detection process, it can cooperate with the relevant components of the clamping mechanism to comprehensively detect the coaxiality of the vacuum adsorption head, ensuring that the coaxiality of the vacuum adsorption head and the fixing tube are consistent. This ensures that the vacuum adsorption head moves more accurately during use, thus guaranteeing the accuracy of chip adsorption, transfer, and placement, and improving the yield of chip placement.

[0016] 2. In this invention, during the adsorption, transfer, and mounting process of small circular or irregularly shaped chips using the device, multiple first electric push rods can be controlled to drive the bottom ends of two mounting brackets below the height of the vacuum adsorption head. This allows the bottom ends of the mounting brackets to preferentially contact the top of the light-emitting stage. Furthermore, the cooperation between multiple springs and sliding rods provides a buffering effect on the downward-moving vacuum adsorption head, preventing excessive contact force between the bottom end of the vacuum adsorption head and the chip, which could cause chip damage. This improves the safety of the chip adsorption and transfer process using multiple vacuum adsorption heads.

[0017] 3. In this invention, after multiple first electric push rods move the corresponding two mounting brackets and rotating plates to a position lower than the vacuum adsorption head, before the mounting brackets and rotating plates move downwards to contact the top of the light-emitting stage, multiple second electric push rods are controlled to move the moving blocks in a direction away from each other for adjustment. After the multiple rotating plates move to abut against the top of the light-emitting stage, the telescopic ends of the multiple second electric push rods are controlled to retract back to their original positions, and simultaneously multiple sliders are controlled to move in the corresponding grooves towards the direction closer to the vacuum adsorption head. This allows the multiple rotating plates to gather multiple chips towards the bottom of the vacuum adsorption head on the top of the light-emitting stage, enabling the subsequent multiple vacuum adsorption heads to quickly adsorb the chips, thereby improving the chip mounting efficiency. 4. In this invention, when multiple chips on the top of the light-emitting platform are pushed and gathered towards the vacuum adsorption head using multiple mounting brackets and rotating plates, the multiple rotating plates are controlled to rotate 180 degrees inside the corresponding mounting brackets. After the multiple mounting brackets and rotating plates gather the multiple chips on the top of the light-emitting platform towards the vacuum adsorption head, the multiple dust suction heads are activated to automatically remove and clean the dust, impurities, and debris generated after chip damage inside the multiple chips. This facilitates the tight adsorption of the bottom of the vacuum adsorption head onto the chip surface, improves the quality of subsequent chip mounting, and brings convenience to chip adsorption, transportation, and mounting. Attached Figure Description

[0018] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to the accompanying drawings.

[0019] Figure 1This is a schematic diagram of the overall structure of a semiconductor chip mass mounting fixture proposed in this invention; Figure 2 for Figure 1 A structural diagram from another angle; Figure 3 This is a schematic diagram of the telescopic cylinder and the housing in this invention; Figure 4 This is a schematic diagram of the structure of multiple fixed tubes and vacuum adsorption heads in this invention; Figure 5 This is a schematic diagram of the detection mechanism in this invention; Figure 6 This is a schematic diagram of the structure of multiple clamping mechanisms in this invention; Figure 7 for Figure 6 A schematic diagram of the structure of one of the clamping mechanisms; Figure 8 This is a cross-sectional view of the fixing plate in this invention; Figure 9 This is a schematic diagram of the structure of the two sliders and the rotating plate in this invention.

[0020] In the diagram: 1. Workbench; 2. First main body; 3. Connecting arm; 4. Second main body; 5. Telescopic cylinder; 6. Box; 7. Connecting frame; 8. Fixing plate; 9. Fixing tube; 10. Vacuum suction head; 11. Hose; 12. Ring; 13. Electric telescopic rod; 14. Moving ring; 15. Arc plate; 16. Displacement sensor; 17. First electric push rod; 18. Mounting plate; 19. Moving plate; 20. Rotating block; 21. Moving block; 22. Second electric push rod; 23. Mounting frame; 24. Rotating plate; 25. Electromagnet; 26. Slide groove; 27. Drive motor; 28. Gear; 29. ​​Rotating ring; 30. Gear ring; 31. Slider; 32. Rectangular plate; 33. Slide rod; 34. Spring; 35. Dust suction head; 36. Rubber pad. Detailed Implementation

[0021] The technical solution of the present invention will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] Reference Figures 1-9A fixture for mass mounting of semiconductor chips includes a worktable 1. A first body 2 is mounted on the top of the worktable 1. A connecting arm 3 is rotatably mounted inside the first body 2. A second body 4 is rotatably mounted at the end of the connecting arm 3 away from the first body 2. A housing 6 is mounted on the bottom of the second body 4. A fixing plate 8 is mounted on one outer wall of the housing 6 via two connecting brackets 7. Multiple vacuum adsorption mechanisms are provided inside the fixing plate 8. The multiple vacuum adsorption mechanisms include multiple fixing tubes 9. Vacuum adsorption heads 10 are threadedly mounted on the bottom ends of the multiple fixing tubes 9. A detection mechanism for detecting the coaxiality of the multiple vacuum adsorption heads 10 is provided at the bottom of the fixing plate 8. A clamping mechanism is provided at the bottom of the two connecting brackets 7. With the help of the first driving device pre-set inside the first main body 2, the connecting arm 3 can be rotated and adjusted; with the help of the second driving device inside the connecting arm 3, the second main body 4 and the housing 6 and other components can be rotated and adjusted together, so as to facilitate the adjustment of the position of the multiple vacuum adsorption heads 10 and clamping mechanisms set on the housing 6 and its outer wall on one side, so that the multiple vacuum adsorption heads 10 and clamping mechanisms can adsorb and clamp the chip from the outside of the worktable 1 and transfer it to the top of the worktable 1, and place it on the top of the relevant chip carrier, so that it can be quickly attached to the chip carrier.

[0023] As a technical optimization of the present invention, a telescopic cylinder 5 is installed inside the second main body 4, and the telescopic end of the telescopic cylinder 5 is connected to the top of the box body 6. During the telescopic process, the telescopic end of the telescopic cylinder 5 can drive the box body 6 and its multiple vacuum adsorption heads 10 and clamping mechanism on one side to move up and down for adjustment.

[0024] As a technical optimization of the present invention, a vacuum device is pre-installed inside the housing 6. The vacuum device is connected to the top ends of multiple fixed tubes 9 via multiple flexible hoses 11. With the help of the vacuum device inside the housing 6 and the multiple flexible hoses 11, the vacuum adsorption heads 10 installed at the bottom ends of the multiple fixed tubes 9 can be controlled, so that the multiple vacuum adsorption heads 10 can perform vacuum adsorption and transfer of chips during use.

[0025] As a technical optimization of the present invention, the detection mechanism includes multiple rings 12 rotatably mounted on the bottom of the fixed plate 8. The multiple rings 12 are all located outside the multiple fixed tubes 9, and the bottom ends of the multiple rings 12 are connected to a movable ring 14 through two electric telescopic rods 13.

[0026] As a technical optimization of this invention, each of the multiple moving rings 14 has two arc-shaped grooves inside, and an arc-shaped plate 15 is rotatably mounted inside each of the two arc-shaped grooves. A displacement sensor 16 is installed inside each of the two arc-shaped plates 15. Two third driving devices are pre-installed inside the moving rings 14, and the output ends of the two third driving devices are respectively connected to the rotating parts at one end of the two arc-shaped plates 15, thereby enabling the two arc-shaped plates 15 to rotate and adjust within the corresponding arc-shaped grooves. The displacement sensor 16 is an existing LVDT displacement sensor of the FCXA10 series, which can measure the diameter and coaxiality between different positions of shaft-like parts. During use, the sensor probe of the displacement sensor 16 extends to measure and read the deviation values ​​of the sensor at different positions of the vacuum adsorption head 10 and the fixed tube 9, thereby calculating the diameter deviation and coaxiality deviation at different positions of the vacuum adsorption head 10. This facilitates automatic detection of the coaxiality between the vacuum adsorption head 10 and the fixed tube 9, ensuring the accuracy of the vacuum adsorption head 10 in the chip adsorption and transfer process. As a technical optimization of the present invention, the clamping mechanism includes a mounting plate 18 installed at the bottom of two connecting frames 7. Multiple first electric push rods 17 are mounted on the bottom of the mounting plate 18. Each telescopic end of the multiple first electric push rods 17 is equipped with a movable plate 19. A rotating block 20 is rotatably mounted on the bottom end of each movable plate 19. Each rotating block 20 is fitted onto the outside of multiple fixed tubes 9. Two electromagnets 25 are mounted on the bottom of each rotating block 20. During the telescopic process of the multiple first electric push rods 17, the telescopic ends can drive the multiple movable plates 19 and rotating blocks 20 to move and adjust up and down on the corresponding fixed tubes 9 and vacuum suction heads 10 surfaces.

[0027] As an optimized technical solution of the present invention, the rotating block 20 is rotatably connected to the moving plate 19 via a rotating ring 29 at its top. A gear ring 30 is installed on the outer wall of the rotating ring 29, and a drive motor 27 is installed inside the moving plate 19. A gear 28 that meshes with the gear ring 30 is installed at the output end of the drive motor 27. The drive motor 27 starts and drives the gear 28 to rotate, so that the gear ring 30 rotates together with the rotating ring 29 and the rotating block 20.

[0028] As a technical optimization of the present invention, both outer walls of the rotating block 20 are connected to movable blocks 21 via second electric push rods 22. Each movable block 21 has a groove 26 at its bottom, and a slider 31 is installed inside each groove 26. A rectangular plate 32 is installed at the bottom of each slider 31. During the extension and retraction of the two second electric push rods 22, the two movable blocks 21 can move and adjust together on both sides of the rotating block 20. Linear motors are pre-installed inside each groove 26, and these motors can drive the two sliders 31 to move and adjust together within their respective grooves, thereby causing the rectangular plate 32 to move and adjust at the bottom of the movable block 21.

[0029] As a technical optimization of the present invention, two slide rods 33 are slidably installed inside the two rectangular plates 32, and springs 34 are fitted on the outer walls of the two slide rods 33. The bottom ends of the two slide rods 33 are jointly installed with a mounting bracket 23, and a rotating plate 24 is rotatably installed inside the mounting bracket 23. After the telescopic end of the first electric push rod 17 extends, it can drive the moving plate 19 and the rotating block 20 to move downward, so that the two mounting brackets 23 move downward together until the bottom ends of the two mounting brackets 23 abut against the top of the chip placement platform. As the telescopic end of the first electric push rod 17 continues to extend, the bottom ends of the two mounting brackets 23 continue to abut against the top of the chip placement platform. When the two mounting brackets 23 are compressed, the springs 34 are compressed at the bottom of the rectangular plate 32, and the top end of the slide rod 33 extends upward inside the rectangular plate 32. This allows the two mounting brackets 23, together with multiple springs 34 and slide rod 33, to buffer the downward moving vacuum suction head 10, avoiding excessive pressure between the bottom end of the vacuum suction head 10 and the chip, which could damage the chip.

[0030] As a technical optimization of the present invention, a suction head 35 is installed on one outer wall of the rotating plate 24, and a rubber pad 36 is installed on the other outer wall of the rotating plate 24. The suction head 35 is connected to an externally preset suction device through a pipe. When the externally preset suction device is started, the suction head 35 can be driven to generate suction on the side away from the rotating plate 24, thereby automatically removing and cleaning the dust and debris mixed inside the chip to be adsorbed and transferred.

[0031] In this invention, when the user uses the device, such as Figure 1As shown, a light-emitting platform for placing chips to be mounted is provided on the right side of the workbench 1. Multiple chip carriers are placed on top of the workbench 1. After placing multiple chips on top of the light-emitting platform, if the chips are small, round, or irregularly shaped, the connecting arm 3 and the second main body 4 can rotate to move multiple vacuum suction heads 10 on one side of the housing 6 to the top of the light-emitting platform. As the telescopic cylinder 5 extends downwards, the multiple vacuum suction heads 10 come into contact with the tops of the chips at corresponding positions below. The vacuum equipment inside the housing 6 generates suction, causing the multiple vacuum suction heads 10 to... The adsorption head 10 automatically adsorbs multiple chips on the top of the light-emitting platform. At this time, the telescopic cylinder 5 retracts back to its original position, driving multiple vacuum adsorption heads 10 to automatically adsorb and grab multiple chips upwards. With the rotation of the connecting arm 3 and the second main body 4, multiple vacuum adsorption heads 10 and the chips adsorbed at their bottoms can be transferred to the top of multiple chip carriers on the worktable 1. The telescopic cylinder 5 is controlled to extend downwards, driving multiple adsorbed chips to be placed on the top of multiple chip carriers in sequence, achieving the effect of simultaneously mounting multiple round or irregularly shaped chips to chip carriers, realizing the batch mounting of chips.

[0032] If the chip is rectangular and large in size, the telescopic ends of multiple first electric push rods 17 can be controlled to extend downwards together, driving multiple moving plates 19 and rotating blocks 20 to move downwards along the outer walls of the corresponding fixed tube 9 and vacuum suction head 10 until multiple mounting brackets 23 are moved downwards to a height lower than the vacuum suction head 10. At this point, with the help of the rotational cooperation of the connecting arm 3 and the second main body 4, and the downward extension of the telescopic end of the telescopic cylinder 5, the bottom ends of multiple mounting brackets 23 are brought into contact with the top of the light-emitting stage, ensuring that multiple chips are located between the corresponding two mounting brackets 23. As the sliders 31 on both sides of the rotating block 20 move toward each other in the corresponding grooves 26, they also move toward each other, causing the two mounting brackets 23 and their internal rotating plates 24 to move toward each other as well. This allows the rubber pads 36 on the outer walls of the two rotating plates 24 that are close to each other to flexibly clamp the two ends of multiple chips on the top of the light-emitting platform. With the cooperation of the two mounting brackets 23 and their internal rotating plates 24, the large rectangular chips can be clamped and transferred to the top of the workbench 1 for mounting, which improves the applicability of the device.

[0033] During the adsorption, transfer, and mounting process of small, round, or irregularly shaped chips using the aforementioned device, the telescopic ends of multiple first electric push rods 17 can be simultaneously controlled to extend downwards by a certain distance, causing the bottom ends of the two mounting brackets 23 to be lower than the height of the vacuum adsorption head 10. This ensures that when the telescopic end of the telescopic cylinder 5 extends downwards to drive the multiple vacuum adsorption heads 10 to adsorb the chip on the top of the light-emitting platform, the bottom ends of the multiple mounting brackets 23 will preferentially contact the top of the light-emitting platform. Furthermore, the cooperation between the multiple springs 34 and the sliding rods 33 provides a buffering effect for the downward-moving vacuum adsorption heads 10, preventing excessive contact force between the bottom ends of the vacuum adsorption heads 10 and the chip, which could cause chip compression and damage. This improves the safety of the chip adsorption and transfer process by the multiple vacuum adsorption heads 10.

[0034] Furthermore, after the telescopic ends of the aforementioned multiple first electric push rods 17 extend downwards, driving the corresponding two mounting brackets 23 and rotating plates 24 to a position lower than the vacuum adsorption head 10, the telescopic ends of the subsequent telescopic cylinder 5 extend downwards, causing the bottom ends of the multiple mounting brackets 23 and rotating plates 24 to first abut against the top of the light-emitting platform. Since the chip positions on the top of the light-emitting platform are relatively dispersed, if the top of the light-emitting platform is not equipped with a related vibration mechanism or gathering mechanism, the chips dispersed at different positions on the top of the light-emitting platform will vibrate or be pushed together towards the central position, making it impossible for the multiple vacuum adsorption heads 10 to quickly adsorb and transfer the chips on the top of the light-emitting platform. In this case, before the multiple mounting brackets 23 and rotating plates 24 move downwards to contact the top of the light-emitting platform, multiple second... The telescopic ends of the electric push rods 22 extend together, driving the two moving blocks 21 on both sides of the multiple rotating blocks 20 to move and adjust in a direction away from each other. This in turn drives the positions of the multiple mounting brackets 23 and rotating plates 24 to move and adjust together, so that the distance between the corresponding two rotating plates 24 is adjusted to the maximum. After the multiple rotating plates 24 move to abut against the top of the light-emitting stage, the telescopic ends of the multiple second electric push rods 22 are controlled to retract back to their original positions. At the same time, the multiple sliders 31 are controlled to move in the corresponding grooves 26 towards the direction of approaching the vacuum adsorption head 10. This drives the multiple rotating plates 24 to gather the multiple chips towards the bottom of the vacuum adsorption head 10 on the top of the light-emitting stage, so that the multiple vacuum adsorption heads 10 can quickly adsorb the chips, thereby improving the chip mounting efficiency.

[0035] Furthermore, when multiple chips on the top of the light-emitting platform are pushed and gathered towards the vacuum adsorption head 10 by means of multiple movable mounting brackets 23 and rotating plates 24, the multiple rotating plates 24 can be controlled to rotate 180 degrees inside the corresponding mounting brackets 23 during the downward extension of the telescopic cylinder 5 to move the mounting brackets 23 and rotating plates 24 downward. This causes the dust suction heads 35 mounted on one side of the multiple rotating plates 24 to rotate to a position close to the vacuum adsorption head 10. After the multiple mounting brackets 23 and rotating plates 24 gather the multiple chips on the top of the light-emitting platform towards the vacuum adsorption head 10, the multiple dust suction heads 35 are activated to automatically remove and clean the dust, impurities, and debris generated after chip damage inside the multiple chips. This facilitates the tight adsorption of the bottom of the vacuum adsorption head 10 onto the chip surface, improves the quality of subsequent chip mounting, and brings convenience to chip adsorption, transportation, and mounting.

[0036] After a period of use, the bottom of the vacuum adsorption head 10 needs to be cleaned. At this time, the telescopic ends of the two corresponding electric telescopic rods 13 can be controlled to extend downward together, pushing the moving ring 14 to move downward to a position lower than the vacuum adsorption head 10, ensuring that the bottom of the vacuum adsorption head 10 is flush with the top of the two arc plates 15. At this time, the two arc plates 15 can be controlled to rotate sequentially inside the corresponding arc grooves, causing the soft pads attached to the top of the two arc plates 15 to automatically clean the dust and impurities attached to the bottom of the vacuum adsorption head 10, so that the vacuum adsorption head 10 can tightly adsorb the chip in the future.

[0037] Meanwhile, since displacement sensors 16 are installed inside both arc plates 15, after the vacuum adsorption head 10 has been used for a period of time, the telescopic ends of the corresponding two electric telescopic rods 13 can be controlled to extend and retract up and down, driving the moving ring 14 and the two arc plates 15 to move and adjust up and down on the outer wall of the vacuum adsorption head 10 and the fixed tube 9 together, so that the two displacement sensors 16 can simultaneously detect different longitudinal positions of the outer wall of the vacuum adsorption head 10 and the fixed tube 9. Furthermore, since two electromagnets 25 are installed at the bottom of each of the multiple rotating blocks 20, the downward extension of the telescopic ends of the two electric telescopic rods 13 drives the moving ring 14 to move downward synchronously, causing the two arc-shaped plates 15 to move to a state flush with the two electromagnets 25. At this time, the two arc-shaped plates 15 are controlled to rotate in opposite directions, so that the outer walls of the two rotated arc-shaped plates 15 are magnetically fixed to their corresponding electromagnets 25. As the drive motor 27 starts, it drives the gear 28 to rotate, causing the gear ring 30 to rotate along with the rotating ring 29 and the rotating blocks 20, thereby driving the moving ring 14, the two electric telescopic rods 13 and the ring 12 to rotate together. The two displacement sensors 16 are simultaneously rotated and adjusted at the bottom of the fixed plate 8. After the rotation adjustment, they can detect different lateral positions of the vacuum adsorption head 10 and the fixed tube 9, read the deviation values ​​of the sensors at different positions of the vacuum adsorption head 10 and the fixed tube 9, and calculate the diameter deviation and coaxiality deviation at different positions of the vacuum adsorption head 10. This allows for automatic detection of the coaxiality between the vacuum adsorption head 10 and the fixed tube 9, ensuring that the coaxiality of the vacuum adsorption head 10 and the fixed tube 9 is consistent. This ensures that the vacuum adsorption head 10 moves more accurately during use, and also ensures the accuracy of chip adsorption, transfer and placement.

[0038] If the two displacement sensors 16 detect a deviation in the coaxiality between the vacuum adsorption head 10 and the fixing tube 9, it indicates that the installation position of the vacuum adsorption head 10 at the bottom of the fixing tube 9 is offset. This makes it impossible to guarantee the accuracy of the vacuum adsorption head 10 in subsequent chip adsorption, transfer, and placement. In this case, the vacuum adsorption head 10 needs to be disassembled and replaced. The two rotating plates 24 located on both sides of the vacuum adsorption head 10 can be controlled to rotate 90 degrees together inside the corresponding mounting bracket 23 to ensure that both rotating plates 24 are rotated to a horizontal state. With the help of the two sliders 31, they move towards the vacuum adsorption head 10 inside the corresponding slide groove 26, thereby driving the two rotated plates 24 after rotation adjustment. The closer end moves to abut against the outer wall of the vacuum adsorption head 10. Since both rotating plates 24 are made of rubber, both rotating plates 24 can abut against the outer wall of the vacuum adsorption head 10 tightly, and the friction is large. At this time, the drive motor 27 drives the gear 28 to rotate, so that the gear ring 30 drives the rotating ring 29, the rotating block 20 and the two rotating plates 24 to rotate together with the rotation of the gear 28. As the two rotating plates 24 rotate, the corresponding first electric push rod 17 can be synchronously controlled to extend downward, which can drive the vacuum adsorption head 10, which is clamped and fixed by the two rotating plates 24, to be twisted down and detached from the bottom end of the fixing tube 9, thus achieving the effect of automatically disassembling the vacuum adsorption head 10. After the new vacuum adsorption head 10 is placed between the two rotating plates 24 after the rotation adjustment, and is clamped and fixed by the two rotating plates 24, as the corresponding first electric push rod 17 retracts upward and the drive motor 27 drives the rotating block 20 and other components to reverse, the new vacuum adsorption head 10 can be automatically installed. This makes it easier to assemble and disassemble the vacuum adsorption head 10 during actual use, improving the applicability of the clamping mechanism. After the new vacuum adsorption head 10 is automatically installed at the bottom of the fixed tube 9, the coaxiality of the vacuum adsorption head 10 and the fixed tube 9 is further detected by the two displacement sensors 16 in the above steps, thereby ensuring the accuracy of the installation position of the new vacuum adsorption head 10.

[0039] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A fixture for mass mounting of semiconductor chips, comprising a worktable (1), characterized in that, The workbench (1) is equipped with a first main body (2) on top. A connecting arm (3) is rotatably installed inside the first main body (2). A second main body (4) is rotatably installed at the end of the connecting arm (3) away from the first main body (2). A box (6) is installed at the bottom of the second main body (4). A fixing plate (8) is installed on one side of the outer wall of the box (6) through two connecting frames (7). Multiple vacuum adsorption mechanisms are provided inside the fixing plate (8). Multiple vacuum adsorption mechanisms include multiple fixing tubes (9). Vacuum adsorption heads (10) are threadedly installed at the bottom of the multiple fixing tubes (9). A detection mechanism for detecting the coaxiality of the multiple vacuum adsorption heads (10) is provided at the bottom of the fixing plate (8). A clamping mechanism is provided at the bottom of the two connecting frames (7).

2. The semiconductor chip mass mounting fixture according to claim 1, characterized in that, The second main body (4) is equipped with a telescopic cylinder (5), and the telescopic end of the telescopic cylinder (5) is connected to the top of the box (6).

3. A fixture for mass mounting of semiconductor chips according to claim 1, characterized in that, The box (6) is equipped with a vacuum device inside, which is connected to the top of multiple fixed tubes (9) through multiple flexible tubes (11).

4. A fixture for mass mounting of semiconductor chips according to claim 1, characterized in that, The detection mechanism includes multiple rings (12) rotatably mounted on the bottom of the fixed plate (8). The multiple rings (12) are all located outside the multiple fixed tubes (9). The bottom ends of the multiple rings (12) are connected to a movable ring (14) through two electric telescopic rods (13).

5. A fixture for mass mounting of semiconductor chips according to claim 4, characterized in that, Each of the multiple moving rings (14) has two arc-shaped grooves inside, and an arc plate (15) is rotatably installed inside each of the two arc-shaped grooves. A displacement sensor (16) is installed inside each of the two arc plates (15).

6. A fixture for mass mounting of semiconductor chips according to claim 1, characterized in that, The clamping mechanism includes a mounting plate (18) installed at the bottom of two connecting frames (7). Multiple first electric push rods (17) are installed at the bottom of the mounting plate (18). Movable plates (19) are installed at the telescopic ends of the multiple first electric push rods (17). Rotating blocks (20) are rotatably installed at the bottom of the multiple moving plates (19). The multiple rotating blocks (20) are all fitted on the outside of multiple fixed tubes (9). Two electromagnets (25) are installed at the bottom of the multiple rotating blocks (20).

7. A fixture for mass mounting of semiconductor chips according to claim 6, characterized in that, The rotating block (20) is rotatably connected to the moving plate (19) through a rotating ring (29) set at the top. A toothed ring (30) is installed on the outer wall of the rotating ring (29). A drive motor (27) is installed inside the moving plate (19). A gear (28) that meshes with the toothed ring (30) is installed at the output end of the drive motor (27).

8. A fixture for mass mounting of semiconductor chips according to claim 6, characterized in that, The outer walls of both sides of the rotating block (20) are connected to moving blocks (21) via the second electric push rod (22). The bottom ends of the two moving blocks (21) are provided with sliding grooves (26). The inside of the two sliding grooves (26) is equipped with sliders (31). The bottom ends of the two sliders (31) are equipped with rectangular plates (32).

9. A fixture for mass mounting of semiconductor chips according to claim 8, characterized in that, Two sliding rods (33) are slidably installed inside the two rectangular plates (32). Springs (34) are fitted on the outer walls of the two sliding rods (33). A mounting bracket (23) is installed at the bottom of the two sliding rods (33). A rotating plate (24) is rotatably installed inside the mounting bracket (23).

10. A fixture for mass mounting of semiconductor chips according to claim 9, characterized in that, A vacuum head (35) is installed on one side of the outer wall of the rotating plate (24), and a rubber pad (36) is installed on the other side of the outer wall of the rotating plate (24). The vacuum head (35) is connected to an externally preset vacuuming device through a pipe.

Images