Composition, method of processing a substrate

By using a combination of periodic acid and a specific compound, the problem of insufficient dissolution capacity for transition metal contents in the prior art is solved, and efficient removal of ruthenium contents on substrates is achieved, which is suitable for etching and polishing processes in semiconductor manufacturing.

CN122189643APending Publication Date: 2026-06-12FUJIFILM CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
FUJIFILM CORP
Filing Date
2021-08-04
Publication Date
2026-06-12

AI Technical Summary

⚠Technical Problem

Existing compositions have insufficient dissolving power when removing transition metal contents, especially ruthenium contents, from substrates, making it difficult to meet the requirements of efficient and high-precision manufacturing.

⚗Method used

A composition containing periodic acid or its salt and a specific compound is used to improve the solubility of transition metal contents by adjusting chloride ions and pH value. Specific steps include etching and removing ruthenium contents adhering to the surface and back of the substrate.

🎯Benefits of technology

It significantly improves the solubility of transition metal contents, enabling efficient removal of ruthenium contents from substrates, and is suitable for etching and polishing processes in semiconductor manufacturing.

✦ Generated by Eureka AI based on patent content.

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Abstract

An object of the present application is to provide a composition having excellent solubilizing ability for transition metal-containing substances (particularly, Ru-containing substances) and a substrate processing method. The composition of the present application contains at least one iodate compound selected from the group consisting of periodic acid, iodous acid, and salts thereof, and a compound represented by formula (1).
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