Spot height measurement of solder paste board test method

Abstract

The application discloses a kind of tin cream board test methods of fixed point height measurement, comprising the following steps: step 1: providing automatic test equipment;Step 2: height measurement is carried out to all to-be-tested components of to-be-tested tin cream board;Step 3: the automatic test equipment according to the height value of each to-be-tested component, automatically calculates the corresponding needle height of each to-be-tested component when probe testing;Step 4: clamping probe moves to predetermined position, probe driving assembly works to drive two clamping probes to clamp to-be-tested component;Step 5: automatic test equipment takes to-be-tested component away from tin cream surface for testing, and after testing, component is returned to original position.The application adopts the method of fixed point height measurement, and the height of needle is detected in real time during testing, effectively solves the problem of inaccurate needle height caused by local deformation of tin cream board and height difference of components with same package size.

Description

Technical Field

[0001] This invention relates to the field of PCB board testing technology, and in particular to a method for testing solder paste boards with fixed-point height measurement. Background Technology

[0002] Adhesive strips refer to PCB boards with double-sided adhesive applied to their surface, upon which components are then attached. These are prototypes specifically made for first-article testing. Solder paste boards refer to PCB boards with solder paste printed on their surface, upon which components are placed. This is a material used in normal SMT production processes. Current technology using fully automated first-article testing machines (equipment with automatic first-article testing capabilities) can only test adhesive strips, not directly solder paste boards. Using fully automated equipment for adhesive strip testing during first-article inspection has the following disadvantages: 1. It requires specially made adhesive strips for first-article testing, wasting time and slowing down production; 2. After testing, the double-sided adhesive and components are removed, resulting in material waste. If solder paste boards are to be tested, current technology only allows manual handling. This method has the following disadvantages: low efficiency and slow manual operation cycle; high operational difficulty, requiring high levels of employee skill and technical expertise; lack of error-proofing, potentially leading to incorrect component handling and mistesting; and the possibility of new defects arising from manual intervention.

[0003] Therefore, existing technologies have shortcomings and need to be improved. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a method for testing solder paste boards by measuring height at fixed points.

[0005] The technical solution of the present invention is as follows: The present invention provides a method for testing solder paste boards by measuring height at fixed points, comprising the following steps: Step 1: Provide an automatic testing device, which includes a test probe assembly for holding components. The test probe assembly includes: a Z-axis lifting assembly, a rotating assembly, two clamping probes, two sets of probe driving assemblies, two Z-axis floating units, two X-axis floating units, and a ranging unit. The rotating assembly is mounted on the Z-axis lifting assembly and can move in the Z-axis direction under the drive of the Z-axis lifting assembly. The two probe driving assemblies are both mounted on the rotating assembly and can rotate under the drive of the rotating assembly. The two clamping probes are respectively connected to the two corresponding probe driving assemblies. The two clamping probes can move closer or further away under the drive of the two probe driving assemblies. Each clamping probe is connected to a Z-axis floating unit and an X-axis floating unit. The Z-axis floating unit and the X-axis floating unit are used to adjust the Z-axis floating amount and X-axis floating amount of the corresponding clamping probe, respectively. The ranging unit is connected to the Z-axis lifting assembly and is used to detect the distance to the component under test on the solder paste board below. Step 2: Measure the height of all components under test on the solder paste board and send the height data of each component under test to the automatic testing equipment; Step 3: The automatic testing equipment automatically calculates the corresponding probe height for each component under test during probe testing based on the height value of each component under test; Step 4: The automatic testing equipment controls the Z-axis lifting component and / or rotating component to work, driving the clamping probe to move to the predetermined position, and uses the ranging unit to measure the distance to ensure that the probe moves into place. The probe driving component works to drive the two clamping probes to move and clamp the component under test. Step 5: The automatic testing equipment removes the component under test from the solder paste surface, performs the test on the component under test, and puts the component back into its original position on the solder paste board after the test is completed.

[0006] Furthermore, the solution also includes step 6: repeat steps 4 to 5 to test each component under test in turn until all components under test have been tested.

[0007] Furthermore, the automatic testing equipment includes a height detection component capable of detecting the height value of each component under test on the solder paste board. In step 2, the height value of each component under test on the solder paste board is detected by the automatic testing equipment.

[0008] Furthermore, the height detection component is: a dot matrix laser sensing device, a linear scanning laser sensing device, or a 3D camera device.

[0009] Furthermore, the automated testing equipment also includes a test follow-up camera assembly for capturing images of the clamping position of the clamping probe during testing.

[0010] The beneficial effects of the present invention using the above scheme are as follows: 1. By using an automatic testing device to test components taken directly from the solder paste board, the problem of interference and misjudgment of test results caused by the conductivity of solder paste in the prior art is solved, ensuring accurate results; 2. By using a fixed-point height measurement method, the height of the probe is detected in real time during testing, effectively solving the problem of inaccurate probe height caused by local deformation of the solder paste board and height differences of components with the same package size; 3. The test probes are treated with anti-sticking material to prevent component defects caused by accidentally touching the solder paste and pulling it off; 4. Each clamping probe is connected to the Z-axis floating unit and the X-axis floating unit to avoid excessive clamping force and ensure clamping stability. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the structure of an automatic testing device according to an embodiment of the present invention.

[0012] Figure 2 This is a schematic diagram of the structure of a test needle assembly according to an embodiment of the present invention.

[0013] Figure 3 This is a schematic diagram of the structure of the Z-axis floating unit and the two X-axis floating units in an embodiment of the present invention. Detailed Implementation

[0014] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0015] Please refer to the following: Figures 1 to 3 In this embodiment, the present invention provides a method for testing solder paste boards by measuring height at fixed points, comprising the following steps: Step 1: Provide an automated testing device, which includes: a height detection component 2 for detecting the height value of each component under test, a test follow-up camera component 3 for capturing images of the clamping position of the clamping probe 11 during the test, and a test probe component 1 for clamping the component.

[0016] In this embodiment, the height detection component 2 is a 3D camera device. The test probe component 1 includes: a Z-axis lifting component 16, a rotation component, two clamping probes 11, two sets of probe driving components 14, two Z-axis floating units 13, two X-axis floating units 12, and a ranging unit. The rotation component is mounted on the Z-axis lifting component 16 and can move in the Z-axis direction under the drive of the Z-axis lifting component 16. The two probe driving components 14 are both mounted on the rotation component and can rotate under the drive of the rotation component. The two clamping probes 11 are respectively connected to the two corresponding probe driving components 14. The two clamping probes 11 can move in the Z-axis direction under the drive of the rotation component. Driven by the probe driving component 14, the probes move closer to or further away from each other. Each clamping probe 11 is connected to a Z-axis floating unit 13 and an X-axis floating unit 12. The Z-axis floating unit 13 and the X-axis floating unit 12 are used to adjust the Z-axis floating amount and X-axis floating amount of the corresponding clamping probe 11, respectively, to ensure that the clamping probe 11 is set in an accurate position and to avoid excessive clamping force. The ranging unit is connected to the Z-axis lifting component 16 to detect the distance to the components on the solder paste board below, which can ensure accurate descent position when the clamping probe 11 is controlled to descend in the future.

[0017] Step 2: The height testing component 2 of the automatic testing equipment measures the height of all components under test on the solder paste board and sends the height data of each component under test to the automatic testing equipment.

[0018] Step 3: The automatic testing equipment automatically calculates the corresponding pin height of each component under test during the probe test based on the height value of each component under test, providing effective reference data for subsequent control of the descent of the clamping probe 11.

[0019] Step 4: The automatic testing equipment controls the Z-axis lifting assembly 16 and the selective rotation assembly to move the clamping probe 11 to the predetermined position. During the movement of the clamping probe, the ranging unit measures the distance in real time to ensure that the probe moves into place. The probe driving assembly 14 works to move the two clamping probes 11 to clamp the component under test. It is worth noting that, in order to achieve more displacement, the Z-axis lifting assembly 16 can be set on the X-axis motion assembly and the Y-axis motion assembly, so that the clamping probe 11 can have more flexible movement.

[0020] Step 5: The automatic testing equipment removes the component under test from the solder paste surface, performs the test on the component under test, and returns the component to its original position on the solder paste board after the test is completed, and then tests the next component under test.

[0021] Step 6: Repeat steps 4 and 5 to test each component under test in turn until all components under test have been tested.

[0022] It is worth noting that during the process of clamping the probe 11, the test follow-up camera component 3 can follow the clamping situation throughout the process and provide timely warnings and detection of situations such as missed clamping or incorrect clamping.

[0023] This solution offers the following advantages: 1. By utilizing automated testing equipment to test components removed directly from the solder paste board, it solves the problem of interference and misjudgment caused by the conductivity of solder paste in existing technologies, ensuring accurate test results. 2. The use of a fixed-point height measurement method allows for real-time detection of the probe height during testing, effectively addressing inaccurate probe heights caused by localized solder paste board deformation and height differences between components of the same package size. 3. The test probes are treated with an anti-stick coating to prevent accidental contact with solder paste and subsequent component defects. 4. Each clamping probe 11 is connected to the Z-axis floating unit 13 and the X-axis floating unit 12, preventing excessive clamping force and ensuring clamping stability.

[0024] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for testing solder paste boards by fixed-point height measurement, characterized in that, The process includes the following steps: Step 1: Providing an automatic testing device, the automatic testing device including a test probe assembly for clamping components, the test probe assembly including: a Z-axis lifting assembly, a rotating assembly, two clamping probes, two sets of probe driving assemblies, two Z-axis floating units, two X-axis floating units, and a ranging unit. The rotating assembly is mounted on the Z-axis lifting assembly and can move in the Z-axis direction under the drive of the Z-axis lifting assembly. Both probe driving assemblies are mounted on the rotating assembly and can rotate under the drive of the rotating assembly. The two clamping probes are respectively connected to the two corresponding probe driving assemblies. The two clamping probes can move closer or further apart under the drive of the two probe driving assemblies. Each clamping probe is respectively connected to a Z-axis floating unit and an X-axis floating unit. The Z-axis floating unit and the X-axis floating unit are respectively used to control the Z-axis floating amount and X-axis floating amount of the corresponding clamping probe. The momentum is adjusted, and the ranging unit is connected to the Z-axis lifting assembly to detect the distance to the component under test on the solder paste board below; Step 2: The height of all components under test on the solder paste board is measured, and the height data of each component under test is sent to the automatic testing equipment; Step 3: The automatic testing equipment automatically calculates the corresponding pin height of each component under test during probe testing based on the height value of each component under test; Step 4: The automatic testing equipment controls the Z-axis lifting assembly and / or the rotating assembly to move the clamping probe to a predetermined position, and measures the distance in real time through the ranging unit during the movement of the clamping probe to ensure that the probe moves to the correct position. The probe driving assembly drives the two clamping probes to clamp the component under test; Step 5: The automatic testing equipment removes the component under test from the solder paste surface, tests the component under test, and puts the component back to its original position on the solder paste board after the test is completed.

2. The solder paste board testing method for fixed-point height measurement according to claim 1, characterized in that, It also includes step 6: repeat steps 4 to 5 to test each component under test in turn until all components under test have been tested.

3. The solder paste board testing method for fixed-point height measurement according to claim 1, characterized in that, The automatic testing equipment includes a height detection component that can detect the height value of each component under test on the solder paste board. In step 2, the height value of each component under test on the solder paste board is detected by the automatic testing equipment.

4. The solder paste board testing method for fixed-point height measurement according to claim 3, characterized in that, The height detection component is: a dot matrix laser sensing device, a linear scanning laser sensing device, or a 3D camera device.

5. The method for testing solder paste boards by fixed-point height measurement according to any one of claims 1 to 4, characterized in that, The automated testing equipment also includes a test follow-up camera assembly for capturing images of the clamping position of the clamping probe during testing.

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