Photovoltaic module manufacturing method

Abstract

The present application relates to a method for manufacturing an optoelectronic module, comprising the following steps: (1) providing a first circuit substrate; (2) providing a first cladding layer on the first circuit substrate; (3) providing a core layer containing a photosensitive material on the first cladding layer, and exposing the core layer to a light beam to form a light path; (4) providing a second cladding layer and a second circuit substrate, and placing the second circuit substrate on the side of the core layer opposite to the first circuit substrate, and placing the second cladding layer between the core layer and the second circuit substrate; (5) electrically connecting the first circuit substrate and the second circuit substrate by at least one conductive structure; and (6) fixing a plurality of optoelectronic elements on at least one of the first circuit substrate and the second circuit substrate. The method for manufacturing an optoelectronic module provided by the present application is simple in steps and can achieve high-speed signal transmission effect.

Description

Technical Field

[0001] This invention relates to optoelectronic boards, and more particularly to a method for manufacturing optoelectronic modules. Background Technology

[0002] In the conventional optoelectronic board manufacturing process with optical waveguide, a cladding layer and a transmission layer are sequentially laminated or coated on a circuit board. An exposure pattern is then formed on the transmission layer using a photoresist. Part of the transmission layer is removed through processes such as development and etching to form an optical channel. Finally, a cladding layer is laminated onto the transmission layer to form an optical waveguide structure.

[0003] However, the aforementioned process steps are complex, time-consuming, and costly. Furthermore, in existing exposure processes, the Gaussian energy distribution of the laser beam results in poor edge sharpness of the exposed pattern, leading to uneven edges in the optical channel and affecting light transmission. In addition, existing optoelectronic boards can only accommodate optoelectronic components on one side, limiting their application and signal transmission efficiency. The coupling between optoelectronic components, optical channels, and copper wires also suffers from difficulties in alignment, time-consuming processes, and poor coupling efficiency, all of which urgently require improvement.

[0004] Therefore, it is necessary to provide a novel and progressive method for manufacturing optoelectronic modules to solve the above problems. Summary of the Invention

[0005] The main objective of this invention is to provide a method for manufacturing an optoelectronic module that is simple in steps and can achieve high-speed signal transmission.

[0006] To achieve the above objectives, the present invention provides a method for manufacturing an optoelectronic module, comprising the following steps: (1) preparing a first circuit substrate; (2) providing a first cladding layer on the first circuit substrate; (3) providing a core layer containing a photosensitive material on the first cladding layer, and irradiating the core layer with a light beam to expose and form a light path; (4) preparing a second cladding layer and a second circuit substrate, wherein the second circuit substrate is provided on one side of the core layer relative to the first circuit substrate, and the second cladding layer is located between the core layer and the second circuit substrate; (5) electrically connecting the first circuit substrate and the second circuit substrate with at least one conductive structure; and (6) fixing a plurality of optoelectronic elements on at least one of the first circuit substrate and the second circuit substrate.

[0007] Preferably, in step (1), a first optical port and a second optical port are further provided on the first circuit board; in step (6), two optoelectronic components are connected to the first circuit board corresponding to the first optical port and the second optical port, respectively.

[0008] Preferably, in step (1), a first optical port is provided in the first circuit board; in step (4), a second optical port is provided in the second circuit board; in step (6), a photoelectric element is connected to the first circuit board corresponding to the first optical port, and another photoelectric element is connected to the second circuit board corresponding to the second optical port.

[0009] Preferably, two grooves extending from one of the first circuit board and the second circuit board toward the core layer and two inclined surfaces located in the two grooves are formed therein, and a light-reflecting surface is formed on each of the inclined surfaces; the two grooves are located on opposite sides of the first light port and the second light port.

[0010] Preferably, in step (5), at least one through hole is formed that penetrates the first circuit board, the first cladding layer, the core layer, the second cladding layer and the second circuit board, and a conductor is provided in each of the through holes.

[0011] Preferably, step (3) further includes:

[0012] The core layer is divided into complex imaging units arranged in a matrix;

[0013] Provide an exposure image, and classify each imaging unit into a lit area or a non-lit area based on the exposure image; and

[0014] The light beam illuminates at least a portion of the light-receiving areas to form the light path.

[0015] Preferably, after step (3), the refractive index of each of the light-receiving areas is greater than the refractive index of each of the non-light-receiving areas, and these light-receiving areas form the light path.

[0016] Preferably, after step (3), the refractive index of each of the light-receiving areas is less than the refractive index of each of the non-light-receiving areas, and these non-light-receiving areas form the light path.

[0017] Preferably, at least one of the first cladding layer and the first circuit board is selected from those comprising a light-absorbing material for absorbing at least a portion of the light beam.

[0018] Preferably, in step (1), at least one first positioning hole is further provided in the first circuit substrate; in step (3), at least one reference positioning pattern corresponding to the at least one first positioning hole is further exposed in the core layer; in step (4), at least one second positioning hole corresponding to the at least one reference positioning pattern is further provided in the second circuit substrate, and the first positioning hole, the reference positioning pattern and the second positioning hole that overlap each other in a thickness direction of the first circuit substrate constitute a phototarget positioning reference.

[0019] Preferably, the first circuit board and the second circuit board each include a conductive layer. Before step (6), the conductive layers of the first circuit board and the second circuit board are etched according to the phototarget positioning reference to form a plurality of electrical contacts for connecting the plurality of optoelectronic elements.

[0020] Preferably, in step (6), at least one of the photoelectric elements is aligned and fixed according to the optical target positioning reference.

[0021] Preferably, the first circuit board includes a conductive layer. In step (1), at least one third positioning hole is formed on one side of the first circuit board opposite to the conductive layer, and the conductive layer is etched to form a plurality of electrical contacts and at least one fourth positioning hole corresponding to and communicating with the at least one third positioning hole. The connected third positioning hole and the fourth positioning hole have different radial dimensions and constitute a substrate positioning reference.

[0022] Preferably, in step (3), the irradiation area of ​​the beam is determined based on the substrate positioning reference.

[0023] Preferably, in step (3), at least one reference positioning pattern corresponding to the substrate positioning references is further exposed on the core layer; in step (4), at least one fifth positioning hole corresponding to the at least one reference positioning pattern is further provided on the second circuit substrate, and the third positioning hole, the fourth positioning hole, the reference positioning pattern and the fifth positioning hole that overlap each other in a thickness direction of the first circuit substrate constitute a phototarget positioning reference.

[0024] The advantages of this invention are:

[0025] The optoelectronic module manufacturing method provided by this invention has simple steps and can achieve high-speed signal transmission. Attached Figure Description

[0026] Figures 1 to 7 This is a flowchart illustrating a first preferred embodiment of the present invention.

[0027] Figure 8 This is a partial top view of a core layer of the first preferred embodiment of the present invention.

[0028] Figures 9 to 15 This is a flowchart illustrating a second preferred embodiment of the present invention.

[0029] Figures 16 to 22 This is a flowchart illustrating a third preferred embodiment of the present invention.

[0030] Figures 23 to 29 This is a flowchart illustrating a fourth preferred embodiment of the present invention. Detailed Implementation

[0031] The following examples illustrate possible implementations of the present invention, but are not intended to limit the scope of protection of the present invention. The use of "a" or "at least one" before the terms mentioned herein is not a limitation on the quantity, and may also be "multiple" depending on the requirements. Such variations in quantity are also within the scope of protection, as will be stated in advance.

[0032] Please refer to Figures 1 to 8 This illustrates a first preferred embodiment of the present invention, a method for manufacturing the optoelectronic module 1 of the present invention, comprising the following steps.

[0033] Step (1): Prepare a first circuit board 10. The first circuit board 10 can be a rigid board (RPCB) or a flexible board (FPC), and can also be a single-sided board, double-sided board or multilayer board as required. In this step (1), a first optical port 11 and a second optical port 12 are provided on the first circuit board 10.

[0034] Step (2): A first cladding layer 20 is applied to the first circuit board 10. A cladding material can be applied to the first circuit board 10 and embedded in the first optical port 11 and the second optical port 12, and then the cladding material can be photocured or thermally cured to form the first cladding layer 20. Alternatively, the cladding material can be pre-formed into a dry film and then directly laminated to the first circuit board 10 to form the first cladding layer 20.

[0035] Step (3): A core layer 30 containing a photosensitive material is placed on the first coating layer 20, and a light beam is used to irradiate the core layer 30 to form a light path 31. Figure 1 and Figure 2 As shown. The photosensitive material is, for example but not limited to, positive dry film photoresist, negative dry film photoresist, photosensitive film, etc. In detail, step (3) further includes: dividing the core layer 30 into a matrix arrangement of complex imaging units 33 (such as... Figure 8 (The area surrounded by the dashed line shown); provide an exposure image, and divide each imaging unit 33 into a light-receiving area 33a based on the exposure image (e.g., the area surrounded by the dashed line ... shown); provide an exposure image, and divide each imaging unit 33 into a light-receiving area 33a Figure 8 The light source irradiates at least a portion of the light-receiving areas 33a (shown as a dotted area) or a non-light-receiving area 33b to form the light path 31. Depending on the photosensitivity of the selected photosensitive material, the refractive index of each light-receiving area 33a after exposure is greater than the refractive index of each non-light-receiving area 33b, and the light-receiving areas 33a form the light path 31; or, the refractive index of each light-receiving area 33a after exposure is less than the refractive index of each non-light-receiving area 33b, and the non-light-receiving areas 33b form the light path 31.

[0036] It should be noted that in this embodiment, a maskless exposure technique is used for exposure. By adjusting the proportion of the total number of light-receiving areas 33a illuminated by the light beam, the light dose gradient at the boundary between the light-receiving areas 33a and the non-light-receiving areas 33b is adjusted, thereby enabling the light path 31 to obtain sharp edges through a single exposure. For example, the light beam can be reflected to the light-receiving areas 33a via a digital micromirror element (DMD), such that 25%, 50%, 75%, or 100% of the total number of light-receiving areas 33a are exposed by the light beam and have a refractive index different from that of the non-light-receiving areas 33b. Each light-receiving area 33a may be exposed only once or not at all. The un-light-receiving areas 33a can be exposed by the light energy of the adjacent and exposed light-receiving areas 33a. The light path 31 can be formed directly by baking and shaping without the need for a photomask, development, or etching. This operation is time-saving, cost-effective, and can effectively improve the edge sharpness of the light path. Whether each light-receiving area 33a is exposed by the light beam can be randomly selected, manually set, or selected according to preset rules. Preferably, at least one of the first cladding layer 20 and the first circuit board 10 is selected from materials that include a light-absorbing material. The light-absorbing material is used to absorb at least a portion of the light beam, for example, it can absorb light of a specific wavelength. This can reduce the reflection of the light beam to the core layer 30 via the first cladding layer 20 or the first circuit board 10 in step (3), thereby helping to improve the edge sharpness of the light path 31.

[0037] Step (4): Prepare a second cladding layer 40 and a second circuit board 50. The second circuit board 50 is positioned on the side of the core layer 30 opposite to the first circuit board 10, and the second cladding layer 40 is located between the core layer 30 and the second circuit board 50. Similarly, the second circuit board 50 can be a rigid PCB (RPCB) or a flexible PCB (FPC), and can be a single-sided, double-sided, or multilayer board as needed. The second cladding layer 40 can be first bonded to the core layer 30, and then the second circuit board 50 can be deposited on the second cladding layer 40; or, the second cladding layer 40 can be first bonded to the second circuit board 50, and then deposited together on the core layer 30, such as... Figure 3 and Figure 4 As shown. In this way, the first cover layer 20, the core layer 30 and the second cover layer 40 can not only be used to transmit optical signals, but also serve as dielectric layers, and at the same time have the function of bonding the first circuit board 10 and the second circuit board 50. No additional adhesive is needed, which effectively simplifies the processing steps and reduces the processing cost.

[0038] Step (5): Electrically connect the first circuit board 10 and the second circuit board 50 with at least one conductive structure 60, such as... Figure 5As shown. In this step (5), at least one through hole 61 is opened through the first circuit board 10, the first cladding layer 20, the core layer 30, the second cladding layer 40 and the second circuit board 50, and a conductor 62 is provided in each through hole 61. The conductor 62 is, for example, but not limited to, a solid or hollow conductive pillar, a conductive plating layer, etc., so as to realize the conduction of electrical signals between the first circuit board 10 and the second circuit board 50.

[0039] Step (6): Fix a plurality of optoelectronic elements 70 onto at least one of the first circuit board 10 and the second circuit board 50, such as Figure 7 As shown. In this step (6), two optoelectronic components 70 are connected to the first circuit board 10 corresponding to the first optical port 11 and the second optical port 12, respectively. The plurality of optoelectronic components 70 include, for example, top-emitting VCSELs, bottom-emitting VCSELs, driver ICs, photodetectors, transimpedance amplifiers (TIAs), etc., which can be selected as needed.

[0040] Furthermore, after step (5), two grooves 80 extending from one of the first circuit board 10 and the second circuit board 50 toward the core layer 30, and two inclined surfaces 81 respectively located within the two grooves 80, are formed on each inclined surface 81; the two grooves 80 are respectively located on opposite sides of the first light port 11 and the second light port 12. Each light-reflecting surface can be, for example, formed by depositing a metal coating on an inclined surface 81, so that light signals can be transmitted between each optoelectronic element 70 and the core layer 30.

[0041] The optoelectronic module 1 can be manufactured through the aforementioned steps. The steps are simple and time-saving, and it can realize high-speed signal transmission between the first circuit board 10 and the second circuit board 50, with a wide range of applications. It should be noted that the first circuit board 10 and the first cladding layer 20, and the second circuit board 50 and the second cladding layer 40 are not limited to being directly stacked in contact. They can also be indirectly stacked with other structures as needed.

[0042] Preferably, in step (1), at least one first positioning hole 13 is further formed in the first circuit substrate 10; in step (3), at least one reference positioning pattern 32 corresponding to the at least one first positioning hole 13 is further exposed in the core layer 30; in step (4), at least one second positioning hole 51 corresponding to the at least one reference positioning pattern 32 is further formed in the second circuit substrate 50, and the first positioning hole 13, the reference positioning pattern 32 and the second positioning hole 51 overlap in a thickness direction of the first circuit substrate 10 to form a phototarget positioning reference S1. The first circuit substrate 10 and the second circuit substrate 50 each include a conductive layer 14, 52. Before step (6), the conductive layers 14, 52 of the first circuit substrate 10 and the second circuit substrate 50 are etched according to the phototarget positioning reference S1 to form a plurality of electrical contacts 14a, 52a for connecting the plurality of optoelectronic elements 70. Since the reference positioning pattern 32 is constructed synchronously with the optical path 31, the optical target positioning reference S1 allows light to pass through and can be used as a positioning reference for making the plurality of electrical contacts 14a, 52a, thereby improving the positioning accuracy of the plurality of electrical contacts 14a, 52a. In this step (6), at least one of the optoelectronic elements 70 is aligned and fixed according to the optical target positioning reference S1, resulting in good coupling effect. In this embodiment, the plurality of optoelectronic elements 70 includes a positive light emitting VCSEL 71 and a control chip 72. The positive light emitting VCSEL 71 only needs to be aligned with the first optical port 11 according to the optical target positioning reference S1 and fixed to the first circuit board 10, and then electrically connected to the control chip 72 by wire bonding, which is convenient for assembly. In other embodiments, the plurality of optoelectronic elements may also include a back-emitting VCSEL. The back-emitting VCSEL can be aligned with the first optical port according to the optical target positioning reference, and simultaneously aligned with the plurality of electrical contacts and connected to the first circuit board by flip-chip bonding.

[0043] Reference Figures 9 to 15The second preferred embodiment of the present invention shown differs from the first preferred embodiment in that the plurality of optoelectronic elements 70 are disposed on the first circuit board 10a and the second circuit board 50a. Therefore, in step (1), a first optical port 11 is further provided in the first circuit board 10a; in step (4), a second optical port 53 is further provided in the second circuit board 50a; in step (6), one optoelectronic element 70 is connected to the first circuit board 10a corresponding to the first optical port 11, and another optoelectronic element 70 is connected to the second circuit board 50a corresponding to the second optical port 53. In this embodiment, the plurality of optoelectronic elements 70 may include a positively emitting VCSEL 71, a control chip 72, a light receiver 73, and a cross-group amplifier 74. The positively emitting VCSEL 71 and the control chip 72 are disposed on the first circuit board 10a, and the light receiver 73 and the cross-group amplifier 74 are disposed on the second circuit board 50a, thereby enabling the transmission of optoelectronic signals on opposite sides of the optoelectronic module 1a. In other embodiments, the plurality of optoelectronic elements may also be selected from other types of light emitters, light receivers, and other related components as needed.

[0044] Reference Figures 16 to 22 The third preferred embodiment of the present invention shown differs from the first preferred embodiment in that, in step (1), at least one third positioning hole 15 is formed on one side of the first circuit substrate 10b opposite to the conductive layer 14, 52, and the conductive layer 14, 52 is etched to form a plurality of electrical contacts 14a, 52a and at least one corresponding fourth positioning hole 16 communicating with the at least one third positioning hole 15. The communicating third positioning hole 15 and the fourth positioning hole 16 have different radial dimensions and constitute a substrate positioning reference S2. In step (3), the irradiation area of ​​the light beam is determined based on the substrate positioning reference S2, that is, the forming position of the exposure pattern on the core layer 30 is determined by the substrate positioning reference S2. Since the at least one fourth positioning hole 16 is formed synchronously with the plurality of electrical contacts 14a, 52a, when viewing the substrate positioning reference S2 along a thickness direction of the conductive layer 14, 52, the hole wall of the at least one fourth positioning hole 16 can be seen, and thus can be used as a positioning reference for forming the optical path 31, so that the optical path 31 is accurately aligned with the plurality of electrical contacts 14a, 52a.

[0045] In this embodiment, in step (3), at least one reference positioning pattern 32 corresponding to the substrate positioning references S2 is exposed and formed on the core layer 30; in step (4), at least one fifth positioning hole 54 corresponding to the at least one reference positioning pattern 32 is passed through the second circuit substrate 50b, and a third positioning hole 15, a fourth positioning hole 16, a reference positioning pattern 32 and a fifth positioning hole 54 that overlap in the thickness direction of the first circuit substrate 10b constitute a light target positioning reference S1a. Thus, in step (6), the plurality of optoelectronic elements 70 can also be connected according to the light target positioning reference S1a for easy photocoupler coupling. In other embodiments, each substrate positioning reference can also be misaligned with a light target positioning reference as described in the first preferred embodiment; the optoelectronic module may also only have the light target positioning reference or the substrate positioning reference.

[0046] Reference Figures 23 to 29 The fourth preferred embodiment of the present invention shown differs from the aforementioned third preferred embodiment in that the plurality of optoelectronic elements 70 are disposed on the first circuit board 10c and the second circuit board 50c. Similar to the aforementioned second preferred embodiment, by changing the position of the second optical port 53, optoelectronic signals can be transmitted on opposite sides of the optoelectronic module 1c.

[0047] The above description describes the preferred embodiments of the present invention and the technical principles applied thereto. For those skilled in the art, any obvious changes such as equivalent transformations or simple substitutions based on the technical solutions of the present invention, without departing from the spirit and scope of the present invention, shall fall within the protection scope of the present invention.

Claims

1. A method for manufacturing an optoelectronic module, characterized in that, Includes the following steps: (1) Prepare a first circuit board; (2) A first coating layer is provided on the first circuit board; (3) A core layer containing a photosensitive material is provided on the first coating layer, and the core layer is exposed by a beam of light to form a light path. (4) Prepare a second cover layer and a second circuit board, wherein the second circuit board is located on the side of the core layer relative to the first circuit board, and the second cover layer is located between the core layer and the second circuit board. (5) The first circuit board and the second circuit board are electrically connected by at least one conductive structure; and (6) Fix a plurality of optoelectronic elements on at least one of the first circuit board and the second circuit board.

2. The optoelectronic module manufacturing method as described in claim 1, characterized in that, In step (1), a first optical port and a second optical port are respectively provided on the first circuit board; in step (6), two optoelectronic components are respectively connected to the first circuit board corresponding to the first optical port and the second optical port.

3. The optoelectronic module manufacturing method as described in claim 1, characterized in that, In step (1), a first optical port is provided on the first circuit board; in step (4), a second optical port is provided on the second circuit board; in step (6), a photoelectric element is connected to the first circuit board corresponding to the first optical port, and another photoelectric element is connected to the second circuit board corresponding to the second optical port.

4. The method for manufacturing an optoelectronic module as described in claim 2 or 3, characterized in that, Two grooves extending from one of the first circuit board and the second circuit board toward the core layer and two inclined surfaces located in the two grooves are respectively formed, and a light-reflecting surface is formed on each of the inclined surfaces; the two grooves are respectively located on opposite sides of the first light port and the second light port.

5. The method for manufacturing an optoelectronic module as described in claim 1, characterized in that, In step (5), at least one through hole is formed through the first circuit board, the first cladding layer, the core layer, the second cladding layer and the second circuit board, and a conductor is provided in each of the through holes.

6. The method for manufacturing an optoelectronic module as described in claim 1, characterized in that, Step (3) further includes: The core layer is divided into complex imaging units arranged in a matrix; Provide an exposure image, and classify each imaging unit into a lit area or a non-lit area based on the exposure image; and The light beam illuminates at least a portion of the light-receiving areas to form the light path.

7. The method for manufacturing an optoelectronic module as described in claim 6, characterized in that, After step (3), the refractive index of each light-receiving area is greater than the refractive index of each non-light-receiving area, and these light-receiving areas form the light path.

8. The method for manufacturing an optoelectronic module as described in claim 6, characterized in that, After step (3), the refractive index of each of the light-receiving areas is less than the refractive index of each of the non-light-receiving areas, and these non-light-receiving areas form the light path.

9. The method for manufacturing an optoelectronic module as described in claim 1, characterized in that, At least one of the first cladding layer and the first circuit board is selected from those comprising a light-absorbing material for absorbing at least a portion of the light beam.

10. The method for manufacturing an optoelectronic module as described in claim 1, characterized in that, In step (1), at least one first positioning hole is further provided in the first circuit substrate; in step (3), at least one reference positioning pattern corresponding to the at least one first positioning hole is further exposed in the core layer; in step (4), at least one second positioning hole corresponding to the at least one reference positioning pattern is further provided in the second circuit substrate, and the first positioning hole, the reference positioning pattern and the second positioning hole that are relatively overlapping in a thickness direction of the first circuit substrate constitute a light target positioning reference.

11. The method for manufacturing an optoelectronic module as described in claim 10, characterized in that, The first circuit board and the second circuit board each include a conductive layer. Before step (6), the conductive layers of the first circuit board and the second circuit board are etched according to the optical target positioning reference to form a plurality of electrical contacts for connecting the plurality of optoelectronic elements.

12. The method for manufacturing an optoelectronic module as described in claim 10, characterized in that, In step (6), at least one of the photoelectric elements is aligned and fixed according to the optical target positioning reference.

13. The method for manufacturing an optoelectronic module as described in claim 1, characterized in that, The first circuit board includes a conductive layer. In step (1), at least one third positioning hole is opened on one side of the first circuit board relative to the conductive layer, and the conductive layer is etched to form a plurality of electrical contacts and at least one fourth positioning hole corresponding to and connected to the at least one third positioning hole. The connected third positioning hole and the fourth positioning hole have different radial dimensions and constitute a substrate positioning reference.

14. The method for manufacturing an optoelectronic module as described in claim 13, characterized in that, In step (3), the irradiation area of ​​the beam is determined based on the substrate positioning reference.

15. The method for manufacturing an optoelectronic module as described in claim 13, characterized in that, In step (3), at least one reference positioning pattern corresponding to the substrate positioning reference is formed by exposure on the core layer; in step (4), at least one fifth positioning hole corresponding to the at least one reference positioning pattern is provided in the second circuit substrate, and the third positioning hole, the fourth positioning hole, the reference positioning pattern and the fifth positioning hole that are relatively overlapping in a thickness direction of the first circuit substrate constitute a phototarget positioning reference.

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