A to-can for packaging a laser

Abstract

This utility model relates to a TO tube socket for encapsulating lasers, comprising a socket disk, a copper tongue fixedly mounted on the right side of the socket disk, a heat dissipation microchannel formed on the inner side of the copper tongue, and two connecting holes respectively connected to the heat dissipation microchannel on the inner side of the socket disk. Connecting pipes extending to the left side of the socket disk are movably mounted on the inner side of each of the two connecting holes. This TO tube socket for encapsulating lasers, by setting a U-shaped heat dissipation microchannel within the copper tongue, and by setting connecting holes and connecting pipes extending to the outside of the socket disk, allows coolant to be introduced into the copper tongue of the TO tube from the outside through the connecting pipes, forming a coolant circuit. When the laser is operating, the flowing coolant contacts the inner wall of the heat dissipation microchannel, carrying away heat from the TO tube socket. Without affecting the normal specifications of the TO tube socket, the heat dissipation performance is stronger, which can meet the encapsulation requirements of higher power lasers.

Description

Technical Field

[0001] This utility model relates to the field of laser packaging technology, specifically a TO tube socket for packaging lasers. Background Technology

[0002] TO packaging, short for Transistor Outline, is a packaging technology that can also be called coaxial packaging. This technology was initially used in transistor devices, but because of its simple process, low cost, and flexible and convenient use, it has been widely used in the packaging of laser emitting and receiving devices.

[0003] For TO series laser packaging, TO56, TO9, etc. have become standards. Packaging material suppliers, laser chip packaging manufacturers, and manufacturers using laser diodes in the industry have all developed mature solutions according to the parameters of the corresponding specifications and standards. With the diversification of market demand, the power requirements of lasers are increasing. However, the existing TO package sockets are processed using a combination of materials such as copper tongue iron socket or all-copper socket. Due to the limited thermal conductivity of the socket, even if a higher power chip is packaged, the actual operating power of the chip will still be limited, which cannot meet the requirements of higher power laser chip packaging. Utility Model Content

[0004] This utility model provides the following technical solution: a TO tube socket for packaging lasers, including a tube socket disk, a copper tongue fixedly installed on the right side of the tube socket disk, a heat dissipation microchannel opened on the inner side of the copper tongue, and two connecting holes respectively connected to the heat dissipation microchannel on the inner side of the tube socket disk, and a connecting tube extending to the left side of the socket disk is movably installed on the inner side of each of the two connecting holes.

[0005] Furthermore, the copper tongue includes a flat copper tongue and an arc-shaped copper tongue, with the flat copper tongue and the arc-shaped copper tongue having adjacent sides that are adapted to each other.

[0006] Furthermore, the heat dissipation microchannel includes a planar copper tongue groove and an arc-shaped copper tongue groove, both of which are U-shaped and compatible. The planar copper tongue groove is located on the bottom surface of the planar copper tongue, and the arc-shaped copper tongue groove is located on the top surface of the arc-shaped copper tongue.

[0007] Furthermore, the heat dissipation microchannel has a V-shaped cross-section, and the two connecting holes are respectively connected in a straight line at both ends of the V-shaped heat dissipation microchannel. The heat dissipation microchannel and the two connecting holes are processed by stamping.

[0008] Furthermore, connecting rings are fixedly installed on the outer sides of both connecting pipes, and both connecting rings are fixedly connected to the pipe seat plate.

[0009] Furthermore, a conductive pin is fixedly installed on the left side of the tube base plate, extending through and to the right side of the tube base plate.

[0010] Compared with the prior art, the present invention provides a TO tube socket for packaging lasers, which has the following advantages:

[0011] 1. This TO tube socket for packaging lasers features a U-shaped heat dissipation microchannel within the copper tongue, along with a connecting hole and a connecting pipe extending to the outside of the socket. This allows coolant to be introduced into the copper tongue of the TO tube from the outside via the connecting pipe, forming a coolant circuit. When the laser is operating, the flowing coolant contacts the inner wall of the heat dissipation microchannel, carrying away heat from the TO tube socket. This provides superior heat dissipation performance without affecting the standard TO tube socket specifications, thus meeting the packaging requirements of higher-power lasers.

[0012] 2. This TO tube socket for packaging lasers features a V-shaped heat dissipation microchannel with connecting holes that are linearly connected to both ends of the V-shaped heat dissipation microchannel. This allows for direct drilling and perforation on a conventional TO tube to connect the two holes, achieving the same coolant circuit. The process of fabricating the microchannel is simpler, more convenient, and less costly. Attached Figure Description

[0013] Figure 1 This is a cross-sectional view of the structure of this utility model;

[0014] Figure 2 This is a front view of the structure of this utility model;

[0015] Figure 3 for Figure 1 A cross-sectional view along X-X';

[0016] Figure 4 This is a schematic diagram of the copper tongue structure of this utility model, wherein the left figure is the bottom surface of the planar copper tongue 31 structure, and the right figure is the top surface of the arc-shaped copper tongue 32 structure;

[0017] Figure 5 This is the left side diagram of the structure of this utility model;

[0018] Figure 6 Another utility model structure front view;

[0019] Figure 7 for Figure 2 A cross-sectional view along X-X'.

[0020] In the diagram: 1. Tube seat, 2. Conductive pin, 3. Copper tongue, 31. Flat copper tongue, 32. Curved copper tongue, 4. Heat dissipation microchannel, 5. Connecting hole, 6. Connecting tube. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figure 1-5 A TO tube socket for encapsulating lasers includes a tube socket disk 1. A copper tongue 3 is fixedly installed on the right side of the tube socket disk 1. A heat dissipation microchannel 4 is opened on the inner side of the copper tongue 3. Two connecting holes 5 are opened on the inner side of the tube socket disk 1, which are respectively connected to the heat dissipation microchannel 4. A connecting tube 6 extending to the left side of the tube socket disk 1 is movably installed on the inner side of the two connecting holes 5.

[0023] In this embodiment, the copper tongue 3 includes a flat copper tongue 31 and an arc-shaped copper tongue 32, with the flat copper tongue 31 and the arc-shaped copper tongue 32 having adjacent sides that are compatible.

[0024] In this embodiment, the heat dissipation microchannel 4 includes a planar copper tongue groove and an arc-shaped copper tongue groove. Both the planar copper tongue groove and the arc-shaped copper tongue groove are U-shaped and compatible. The planar copper tongue groove is located on the bottom surface of the planar copper tongue 31, and the arc-shaped copper tongue groove is located on the top surface of the arc-shaped copper tongue 32.

[0025] In this embodiment, connecting rings are fixedly installed on the outer sides of both connecting pipes 6, and both connecting rings are fixedly connected to the pipe seat plate 1.

[0026] In this embodiment, a conductive pin 2 is fixedly installed on the left side of the tube base plate 1, extending through and to the right side of the tube base plate 1.

[0027] This TO tube socket for packaging lasers features a U-shaped heat dissipation microchannel 4 within the copper tongue 3, a connecting hole 5 communicating with the heat dissipation microchannel 4, and a connecting pipe 6 extending to the outside of the socket disk 1. Coolant can be introduced into the copper tongue 3 of the TO tube from the outside through the connecting pipe 6, forming a coolant circuit. When the laser is operating, the flowing coolant contacts the inner wall of the heat dissipation microchannel 4, carrying away heat from the TO tube socket. This provides stronger heat dissipation performance without affecting the normal TO tube socket specifications, thus meeting the packaging requirements of higher power lasers.

[0028] Example 2

[0029] Please see Figure 6-7A TO tube socket for encapsulating lasers includes a tube socket disk 1. A copper tongue 3 is fixedly installed on the right side of the tube socket disk 1. A heat dissipation microchannel 4 is opened on the inner side of the copper tongue 3. Two connecting holes 5 are opened on the inner side of the tube socket disk 1, which are respectively connected to the heat dissipation microchannel 4. A connecting tube 6 extending to the left side of the tube socket disk 1 is movably installed on the inner side of the two connecting holes 5.

[0030] In this embodiment, the copper tongue 3 includes a flat copper tongue 31 and an arc-shaped copper tongue 32, with the flat copper tongue 31 and the arc-shaped copper tongue 32 having adjacent sides that are compatible.

[0031] In this embodiment, the heat dissipation microchannel 4 has a V-shaped cross section, and the two connecting holes 5 are connected in a straight line at both ends of the V-shaped heat dissipation microchannel 4. The heat dissipation microchannel 4 and the two connecting holes 5 are processed by stamping.

[0032] In this embodiment, connecting rings are fixedly installed on the outer sides of both connecting pipes 6, and both connecting rings are fixedly connected to the pipe seat plate 1.

[0033] In this embodiment, a conductive pin 2 is fixedly installed on the left side of the tube base plate 1, extending through and to the right side of the tube base plate 1.

[0034] This TO tube socket for encapsulating lasers features a V-shaped heat dissipation microchannel 4 and a connecting hole 5 that is linearly connected to both ends of the V-shaped heat dissipation microchannel 4. This allows for direct drilling and perforation on a conventional TO tube to connect the two holes, achieving the same coolant circuit. The process of fabricating the microchannel is simpler, more convenient, and less costly.

[0035] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0036] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A TO tube socket for packaging lasers, comprising a socket disk (1), characterized in that: A copper tongue (3) is fixedly installed on the right side of the tube seat plate (1). A heat dissipation microchannel (4) is opened on the inner side of the copper tongue (3). Two connecting holes (5) are opened on the inner side of the tube seat plate (1) respectively connected to the heat dissipation microchannel (4). A connecting pipe (6) extending to the left side of the seat plate (1) is movably installed on the inner side of the two connecting holes (5).

2. A TO tube socket for packaging lasers according to claim 1, characterized in that: The copper tongue (3) includes a flat copper tongue (31) and an arc-shaped copper tongue (32), with the flat copper tongue (31) and the arc-shaped copper tongue (32) having adjacent sides that are compatible.

3. A TO tube socket for packaging lasers according to claim 2, characterized in that: The heat dissipation microchannel (4) includes a planar copper tongue groove and an arc-shaped copper tongue groove. Both the planar copper tongue groove and the arc-shaped copper tongue groove are U-shaped and compatible. The planar copper tongue groove is located on the bottom surface of the planar copper tongue (31), and the arc-shaped copper tongue groove is located on the top surface of the arc-shaped copper tongue (32).

4. A TO tube socket for packaging lasers according to claim 1, characterized in that: The heat dissipation microchannel (4) has a V-shaped cross section, and the two connecting holes (5) are connected in a straight line at both ends of the V-shaped heat dissipation microchannel (4). The heat dissipation microchannel (4) and the two connecting holes (5) are processed by stamping.

5. A TO tube socket for packaging a laser according to claim 1, characterized in that: Both of the two connecting pipes (6) are fixedly installed with connecting rings on their outer sides, and both connecting rings are fixedly connected to the pipe seat plate (1).

6. A TO tube socket for packaging a laser according to claim 1, characterized in that: A conductive pin (2) is fixedly installed on the left side of the tube seat plate (1) and extends through to the right side of the tube seat plate (1).

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