A macro-channel vertical cavity surface emitting semiconductor laser

Abstract

The utility model discloses a macrochannel vertical cavity surface emitting semiconductor laser, including semiconductor laser main part, the surface both sides of semiconductor laser main part all are connected with heat abstract mechanism, both sides edges of semiconductor laser main part all are fixedly connected with connecting plate, the surface mounting of connecting plate has heat dissipation fan, the back of semiconductor laser main part is provided with wiring port. This macrochannel vertical cavity surface emitting semiconductor laser, through the setup of protection device, when the equipment is idle, the wiring port is vulnerable to external environment influence, and in the wiring port upper end sets up the protection plate, and the protection plate is driven to be close to the wiring port surface under the reverse force that both sides torsion spring provided, and seals the wiring port, thereby reached the effect that the wiring port is protected, avoided the wiring port long -term exposure in the external environment, received the influence of external dust and water vapor, and caused short circuit, shortened its life.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor laser technology, specifically to a macrochannel vertical cavity surface-emitting semiconductor laser. Background Technology

[0002] Currently, semiconductor laser cosmetic procedures commonly utilize semiconductor laser bars, which emit light through edge emission. These bars have a relatively long cavity length and a relatively high threshold current. In contrast, vertical-cavity surface-emitting lasers (VCSELs) have an extremely short cavity length and a low threshold current. A VCSEL is constructed by depositing reflective films on the upper and lower surfaces of a chip to create a vertically oriented emission cavity. The light output is perpendicular to the substrate, resulting in concentrated energy, a small divergence angle, good directionality, and high coupling efficiency. Through array distribution, it can achieve considerable optical power output, achievable operating temperatures up to 70°C, and stable, drift-free wavelength. VCSELs are currently primarily used in facial recognition, infrared surveillance, and night vision illumination.

[0003] A macrochannel vertical-cavity surface-emitting semiconductor laser disclosed in CN209401977U includes a laser module (1) and a heat sink module (2). The heat sink module (2) includes a heat sink body (21), water inlet holes (22) and water outlet holes (23) located on the left and right sides of the lower end of the heat sink body (21), and a partition plate (24) located in the middle of the heat sink body (21) to separate the water inlet holes (22) and water outlet holes (23). The lower end of the partition plate (24) is sealed to the heat sink body (21), and there is a gap between the upper end of the partition plate (24) and the top of the heat sink body (21) to form a water channel. The macrochannel vertical-cavity surface-emitting semiconductor laser provided by this utility model has a new heat sink structure, which improves the heat dissipation efficiency of the laser, and has a compact size and simple structure.

[0004] Although the aforementioned patent designs a new heat sink structure to improve the heat dissipation efficiency of the laser, and is compact and simple in structure, the device lacks a protective structure for the semiconductor laser's connection port. When the device is not in use, the connection port is exposed to the external environment for a long time, which is easily affected by external dust and moisture, causing short circuits and shortening its service life. Utility Model Content

[0005] The technical problem to be solved by this utility model is as follows: to provide a macrochannel vertical cavity surface-emitting semiconductor laser with high practicality, simple operation and relatively simple structure, which solves the problem of protecting the semiconductor laser terminal mentioned in the background art.

[0006] The objective of this utility model can be achieved through the following technical solutions:

[0007] A macrochannel vertical-cavity surface-emitting semiconductor laser includes a semiconductor laser body. Heat dissipation mechanisms are threadedly connected to both sides of the surface of the semiconductor laser body. Connecting plates are fixedly connected to both sides of the semiconductor laser body. Cooling fans are mounted on the surfaces of the connecting plates. A wiring port is provided on the back of the semiconductor laser body. A mounting block is provided above the wiring port, and a protective mechanism is installed inside the mounting block.

[0008] The heat dissipation mechanism includes heat dissipation fins threadedly connected to both sides of the surface of the semiconductor laser body, and a number of heat-conducting pillars are fixedly connected to one side of the heat dissipation fins.

[0009] The protective mechanism includes a fixed cylinder installed inside the mounting block, a torsion spring fixedly connected to one side of the fixed cylinder, a connecting rod fixedly connected to one side of the torsion spring, and a protective plate fixedly connected to one side of the connecting rod.

[0010] As a further embodiment of this utility model: the connecting rod is rotatably connected to the surface of the fixed cylinder, and an observation window is provided on the surface of the protective plate to facilitate observation of the wiring port.

[0011] As a further embodiment of this utility model: a handle is fixedly connected to the surface of the protective plate, and the surface of the handle is provided with anti-slip grooves to facilitate anti-slip.

[0012] As a further embodiment of this utility model: a dustproof mesh is installed on the surface of the cooling fan, and the dustproof mesh is made of stainless steel, which facilitates the blocking of dust.

[0013] As a further embodiment of this utility model: one side of the terminal is electrically connected to a lead wire via a connector, and a power supply is provided at the end of the lead wire, which facilitates the transmission of electrical signals.

[0014] As a further embodiment of this utility model: mounting holes are provided on both sides of the surface of the semiconductor laser body, and positioning bolts are provided inside the mounting holes to facilitate fixing the semiconductor laser body.

[0015] As a further embodiment of this utility model: the surface of the heat dissipation fins is provided with threaded holes, and the internal threads of the threaded holes are connected to threaded posts, which facilitate the fixing of the heat dissipation fins.

[0016] The beneficial effects of this utility model are:

[0017] 1. By setting up a protective mechanism, the wiring port is easily affected by the external environment when the equipment is idle. Therefore, a protective plate is set at the top of the wiring port. Under the reverse force provided by the torsion springs on both sides, the protective plate is driven to stick tightly to the surface of the wiring port and seal the wiring port. This achieves the effect of protecting the wiring port and prevents the wiring port from being exposed to the external environment for a long time, which may cause short circuits and shorten its service life due to external dust and moisture.

[0018] 2. Through the design of the heat dissipation mechanism and cooling fan, heat is generated inside the device during use. To ensure normal operation, heat dissipation fins are installed on both sides of the semiconductor laser body. Several heat-conducting pillars on one side of the heat dissipation fins absorb the heat inside the semiconductor laser body and transfer it to the surface of the heat dissipation fins for heat exchange. In conjunction with the cooling fan on one side of the heat dissipation fins, airflow is blown onto the surface of the heat dissipation fins to accelerate the airflow around the heat dissipation fins, thereby improving the heat dissipation effect of the heat dissipation fins and ultimately achieving efficient heat dissipation of the semiconductor laser body. Attached Figure Description

[0019] The present invention will be further described below with reference to the accompanying drawings.

[0020] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0021] Figure 2 This is a schematic diagram of the heat dissipation mechanism of this utility model;

[0022] Figure 3 This is a schematic diagram of the protective mechanism structure of this utility model;

[0023] Figure 4 This is a schematic diagram of the power supply structure of this utility model.

[0024] In the diagram: 1. Semiconductor laser body; 2. Heat dissipation mechanism; 201. Heat dissipation fins; 202. Heat conduction column; 3. Connecting plate; 4. Cooling fan; 5. Mounting block; 6. Protective mechanism; 601. Fixing cylinder; 602. Torsion spring; 603. Connecting rod; 604. Protective plate; 7. Observation window; 8. Handle; 9. Dustproof net; 10. Lead wire; 11. Power supply; 12. Positioning bolt; 13. Threaded column. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0026] like Figure 1-4 As shown, a macrochannel vertical cavity surface-emitting semiconductor laser includes a semiconductor laser body 1. Heat dissipation mechanisms 2 are threadedly connected to both sides of the surface of the semiconductor laser body 1. The heat dissipation mechanisms 2 and cooling fans 4 are used to improve the heat dissipation effect of the heat dissipation fins 201, ultimately achieving efficient heat dissipation of the semiconductor laser body 1. Connecting plates 3 are fixedly connected to both sides of the semiconductor laser body 1, and cooling fans 4 are installed on the surface of the connecting plates 3. A wiring port is provided on the back of the semiconductor laser body 1, and a mounting block 5 is provided at the upper end of the wiring port. A protective mechanism 6 is installed inside the mounting block 5. Due to the protective mechanism 6, the wiring port is easily affected by the external environment when the equipment is idle. Therefore, a protective plate 604 is provided at the upper end of the wiring port. Under the reverse force provided by the torsion springs 602 on both sides, the protective plate 604 is driven to tightly adhere to the surface of the wiring port and seal the wiring port, thereby achieving the effect of protecting the wiring port and preventing it from being exposed to the external environment for a long time, causing short circuits and shortening its service life due to external dust and moisture.

[0027] The heat dissipation mechanism 2 includes heat dissipation fins 201 threadedly connected to both sides of the surface of the semiconductor laser body 1, and a plurality of heat-conducting pillars 202 are fixedly connected to one side of the heat dissipation fins 201.

[0028] The protective mechanism 6 includes a fixed cylinder 601 installed inside the mounting block 5. A torsion spring 602 is fixedly connected to one side of the fixed cylinder 601, a connecting rod 603 is fixedly connected to one side of the torsion spring 602, and a protective plate 604 is fixedly connected to one side of the connecting rod 603.

[0029] like Figure 3 As shown, the connecting rod 603 is rotatably connected to the surface of the fixed cylinder 601, and the surface of the protective plate 604 is provided with an observation window 7, which facilitates observation of the wiring port.

[0030] like Figure 3 As shown, a handle 8 is fixedly connected to the surface of the protective plate 604, and the surface of the handle 8 is provided with anti-slip grooves to facilitate anti-slip.

[0031] like Figure 2 As shown, a dust filter 9 is installed on the surface of the cooling fan 4. The dust filter 9 is made of stainless steel and is designed to block dust.

[0032] like Figure 4 As shown, a lead wire 10 is electrically connected to one side of the terminal block via a connector. A power supply 11 is provided at the end of the lead wire 10, which facilitates the transmission of electrical signals.

[0033] like Figure 1 As shown, mounting holes are provided on both sides of the surface of the semiconductor laser body 1, and positioning bolts 12 are provided inside the mounting holes. The positioning bolts 12 facilitate the fixing of the semiconductor laser body 1.

[0034] like Figure 2 As shown, the surface of the heat dissipation fin 201 is provided with a threaded hole, and the threaded hole is internally connected to a threaded post 13, which facilitates the fixing of the heat dissipation fin 201.

[0035] The working principle of this utility model is as follows: When the equipment is idle, the connection port is easily affected by the external environment. Therefore, a protective plate 604 is set at the upper end of the connection port. Under the reverse force provided by the torsion springs 602 on both sides, the protective plate 604 is driven to stick tightly to the surface of the connection port and seal the connection port.

[0036] During use, heat is generated inside the device. To ensure that the device can be used normally, heat dissipation fins 201 are provided on both sides of the semiconductor laser body 1. Several heat conduction pillars 202 provided on one side of the heat dissipation fins 201 absorb the heat inside the semiconductor laser body 1 and transfer it to the surface of the heat dissipation fins 201 for heat exchange. In conjunction with the cooling fan 4 provided on one side of the heat dissipation fins 201, air is blown onto the surface of the heat dissipation fins 201 to accelerate the airflow near the heat dissipation fins 201.

[0037] The above description provides a detailed account of one embodiment of the present invention. However, this description is merely a preferred embodiment and should not be construed as limiting the scope of the present invention. All equivalent variations and improvements made within the scope of the claims of the present invention should still fall within the patent coverage of the present invention.

Claims

1. A macrochannel vertical-cavity surface-emitting semiconductor laser, comprising a semiconductor laser body (1), characterized in that: The semiconductor laser body (1) has heat dissipation mechanisms (2) threadedly connected to both sides of its surface. Connecting plates (3) are fixedly connected to both edges of the semiconductor laser body (1). A cooling fan (4) is mounted on the surface of the connecting plate (3). A wiring port is provided on the back of the semiconductor laser body (1). A mounting block (5) is provided at the upper end of the wiring port. A protective mechanism (6) is installed inside the mounting block (5). The heat dissipation mechanism (2) includes heat dissipation fins (201) threadedly connected to both sides of the surface of the semiconductor laser body (1), and a plurality of heat-conducting pillars (202) are fixedly connected to one side of the heat dissipation fins (201). The protective mechanism (6) includes a fixed cylinder (601) installed inside the mounting block (5), a torsion spring (602) is fixedly connected to one side of the fixed cylinder (601), a connecting rod (603) is fixedly connected to one side of the torsion spring (602), and a protective plate (604) is fixedly connected to one side of the connecting rod (603).

2. A macrochannel vertical-cavity surface-emitting semiconductor laser according to claim 1, characterized in that, The connecting rod (603) is rotatably connected to the surface of the fixed cylinder (601), and the surface of the protective plate (604) is provided with an observation window (7).

3. A macrochannel vertical-cavity surface-emitting semiconductor laser according to claim 1, characterized in that, A handle (8) is fixedly connected to the surface of the protective plate (604), and the surface of the handle (8) is provided with anti-slip grooves.

4. A macrochannel vertical-cavity surface-emitting semiconductor laser according to claim 1, characterized in that, The surface of the cooling fan (4) is equipped with a dustproof mesh (9), which is made of stainless steel.

5. A macrochannel vertical-cavity surface-emitting semiconductor laser according to claim 1, characterized in that, One side of the terminal is electrically connected to a lead wire (10) via a connector, and a power supply (11) is provided at the end of the lead wire (10).

6. A macrochannel vertical-cavity surface-emitting semiconductor laser according to claim 1, characterized in that, Mounting holes are provided on both sides of the surface of the semiconductor laser body (1), and positioning bolts (12) are provided inside the mounting holes.

7. A macrochannel vertical-cavity surface-emitting semiconductor laser according to claim 1, characterized in that, The surface of the heat dissipation fin (201) is provided with a threaded hole, and the threaded hole is internally connected with a threaded post (13).

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