A low coefficient of expansion glass substrate display panel and a method for producing the same

Abstract

The application relates to the technical field of display screens, and particularly relates to a low-expansion-coefficient glass substrate display screen and a production method thereof, which comprises a circuit board, a glass substrate, a flexible conductive layer, a light-emitting layer and a glass panel; the glass substrate is provided with a bending gap; the flexible conductive layer is provided with a conductive connecting arm; the glass panel is provided with an upper bending block; and the circuit board is provided with a lower bending block; the upper bending block of the glass panel and the lower bending block of the circuit board are simultaneously used to stepwise and directional bend the conductive connecting arm of the flexible conductive layer in the assembling process, so that the traditional welding conductive connection mode is replaced, the welding-free conductive connection structure forming is realized, the faults such as virtual welding and open circuit caused by the welding process are avoided, the conductive connection forming and the layer body assembling are synchronously completed, the assembling process is simplified, the detachable layer body structure is matched with the bending conductive connection, the fault layer body can be targetedly disassembled in the later maintenance, the conductive structure does not need to be damaged, and the maintenance operation difficulty is greatly reduced.

Description

Technical Field

[0001] This invention relates to the field of display technology, specifically to a low coefficient of thermal expansion glass substrate display screen and its manufacturing method. Background Technology

[0002] OLED (Organic Light-Emitting Diode) displays, with their excellent characteristics such as self-illumination, high contrast, wide viewing angle, and low power consumption, have been widely used in various fields such as smartphones, tablets, smart wearable devices, and automotive displays, becoming one of the core development directions of the display industry.

[0003] In existing technologies, the mainstream packaging structure of OLED displays typically adopts a glass-based packaging scheme. The core light-emitting layer of the display is an organic light-emitting layer, and the power transmission layer is a flexible printed circuit board power supply layer (FPCB power supply layer). Both the organic light-emitting layer and the FPCB power supply layer are sandwiched between the glass substrate and the glass panel, and the glass substrate and the glass panel are fixed and encapsulated with adhesive to form a sealed cavity structure to isolate the organic light-emitting layer from external moisture, oxygen, etc., and to ensure the light-emitting performance and lifespan of the OLED display. At the same time, the end of the FPCB power supply layer away from the organic light-emitting layer extends to the outside of the glass substrate / glass panel and is electrically connected to the rigid circuit board by soldering to complete the power supply and signal transmission of the display.

[0004] Because the glass substrate and glass panel are directly bonded and cured with adhesive, forming an inseparable integral structure, the soldering connection between the FPCB power supply layer and the rigid circuit board is also a fixed connection method. When the OLED display malfunctions, the entire display unit cannot be disassembled for repair; the entire display unit must be replaced, significantly increasing product maintenance costs and user operating costs. Summary of the Invention

[0005] The purpose of this invention is to address the aforementioned shortcomings in the prior art by providing a low coefficient of thermal expansion glass substrate display screen and its manufacturing method.

[0006] The objective of this invention is achieved through the following technical solution: a low coefficient of thermal expansion glass substrate display screen, comprising a circuit board, a glass substrate, a flexible conductive layer, a light-emitting layer, and a glass panel; the glass substrate is detachably disposed on the top surface of the circuit board; the flexible conductive layer is detachably disposed on the top surface of the glass substrate; the light-emitting layer is detachably disposed on the top surface of the flexible conductive layer; and the glass panel is detachably disposed on the top surface of the light-emitting layer. The glass substrate has a through-bend notch; the flexible conductive layer has a conductive connecting arm; the conductive connecting arm is located at the bend notch; the glass panel has an upper bending block; the circuit board has a lower bending block; The upper bending block is used to bend the conductive connecting arm in the direction of the lower bending block; the lower bending block is used to bend the conductive connecting arm in the direction of the bottom surface of the glass substrate.

[0007] The present invention is further configured such that the bending notch is located at the edge of the glass substrate; and the conductive connecting arm is located at the edge of the flexible conductive layer.

[0008] The present invention is further configured such that an upper sealing ring is provided at the bottom of the edge of the glass panel; the upper sealing ring is used to abut against the top surface of the edge of the glass substrate; an upper bending block is provided at the bottom of the upper sealing ring; and the upper bending block is movably provided at the bending notch.

[0009] The present invention is further configured such that a lower sealing ring is provided at the top of the edge of the circuit board; the lower sealing ring is used to abut against the bottom surface of the edge of the glass substrate; a lower bending block is provided at the top of the lower sealing ring; the lower bending block is movably provided at the bending notch.

[0010] The present invention is further configured such that the upper bending block and the lower bending block are positioned opposite each other.

[0011] The present invention is further configured such that a conductive boss is provided on the top of the circuit board; after the lower bending block bends the conductive connecting arm, the end of the conductive connecting arm is located between the bottom surface of the glass substrate and the top surface of the conductive boss.

[0012] The present invention is further configured such that the conductive protrusion is located on the inner side of the lower bending block; and a guide arc surface is provided between the lower bending block and the conductive protrusion.

[0013] The invention is further configured such that the circuit board is rotatably provided with a fixing post; the fixing post is fitted with a reset spring; and the glass substrate, the flexible conductive layer, and the glass panel are all provided with clearance holes for making way for the fixing post.

[0014] The present invention is further configured such that the low coefficient of expansion glass substrate display screen also includes a waterproof cover; the glass substrate, flexible conductive layer, light-emitting layer and glass panel are all fitted inside the waterproof cover; the waterproof cover is provided with a fixing hole; the top of the fixing post passes through the clearance hole and the fixing hole in sequence; The top of the fixing post has ratchet teeth arranged along the height direction on one side; the top of the fixing post has a semi-cylindrical structure on the other side; the waterproof cover has a spring piece that cooperates with the ratchet teeth.

[0015] A method for producing a glass substrate display screen with a low coefficient of thermal expansion includes the following steps: S1. Place the flexible conductive layer on the top surface of the glass substrate, and position the conductive connecting arm at the top of the bending notch. At this time, the conductive connecting arm and the flexible conductive layer are on the same horizontal plane. S2. Place the light-emitting layer on the top surface of the flexible conductive layer; S3. Place the glass panel on the top surface of the light-emitting layer, and bend the upper bending block downwards so that the conductive connecting arm passes into the bending notch and protrudes from the bottom of the bending notch. S4. Place the glass substrate on the top surface of the circuit board, and bend the conductive connecting arm towards the bottom surface of the glass substrate with the lower bending block, so that the end of the conductive connecting arm is located between the glass substrate and the circuit board.

[0016] The beneficial effects of this invention are as follows: This invention utilizes both the upper bending block of the glass panel and the lower bending block of the circuit board to perform step-by-step directional bending of the conductive connecting arms of the flexible conductive layer during the assembly process, replacing the traditional welding conductive connection method. This achieves the formation of a weld-free conductive connection structure, avoiding faults such as incomplete soldering and open circuits caused by welding processes. It also allows the formation of the conductive connection to be completed simultaneously with the layer assembly, simplifying the assembly process. Furthermore, the detachable layer structure combined with the bending conductive connection allows for targeted disassembly of faulty layers during later maintenance without damaging the conductive structure, significantly reducing the difficulty of maintenance operations. Attached Figure Description

[0017] The invention will be further illustrated with reference to the accompanying drawings, but the embodiments in the drawings do not constitute any limitation on the invention. For those skilled in the art, other drawings can be obtained based on the following drawings without any creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is an exploded view of the structure of the present invention; Figure 3 This is a cross-sectional view of the present invention; Figure 4 yes Figure 3 A magnified view of part A in the middle; Figure 5 This is a cross-sectional view from another perspective of the present invention; Figure 6 yes Figure 5 A magnified view of part B in the middle; Figure 7 This is a cross-sectional view of the disassembled invention; Figure 8 yes Figure 7 A magnified view of part C in the middle; Figure 9 This is a cross-sectional view from another perspective after the invention has been disassembled; The components include: 1. Circuit board; 11. Conductive boss; 2. Glass substrate; 21. Bending notch; 22. Clearance hole; 3. Flexible conductive layer; 31. Conductive connecting arm; 4. Light-emitting layer; 5. Glass panel; 6. Upper sealing ring; 61. Upper bending block; 7. Lower sealing ring; 71. Lower bending block; 72. Guide arc surface; 8. Fixing post; 81. Return spring; 82. Ratchet; 83. Semi-cylindrical structure; 9. Waterproof cover; 91. Fixing hole; 92. Spring. Detailed Implementation

[0019] The present invention will be further described in conjunction with the following embodiments.

[0020] Depend on Figures 1 to 9 As can be seen, the low expansion coefficient glass substrate 2 display screen described in this embodiment includes a circuit board 1, a glass substrate 2, a flexible conductive layer 3, a light-emitting layer 4, and a glass panel 5; the glass substrate 2 is detachably disposed on the top surface of the circuit board 1; the flexible conductive layer 3 is detachably disposed on the top surface of the glass substrate 2; the light-emitting layer 4 is detachably disposed on the top surface of the flexible conductive layer 3; the glass panel 5 is detachably disposed on the top surface of the light-emitting layer 4; wherein the flexible conductive layer 3 is the power supply layer of the flexible printed circuit board 1; the glass substrate 2 is provided with a bending notch 21; the flexible conductive layer 3 is provided with a conductive connecting arm 31; the conductive connecting arm 31 is disposed in the bending notch 21; the glass panel 5 is provided with an upper bending block 61; the circuit board 1 is provided with a lower bending block 71; the upper bending block 61 is used to bend the conductive connecting arm 31 towards the lower bending block 71; the lower bending block 71 is used to bend the conductive connecting arm 31 towards the bottom surface of the glass substrate 2.

[0021] In this embodiment, the low expansion coefficient glass substrate 2 display screen is installed by first placing the flexible conductive layer 3 on the top surface of the glass substrate 2, and placing the conductive connecting arm 31 at the top of the bending notch 21. At this time, the conductive connecting arm 31 and the flexible conductive layer 3 are on the same horizontal plane. Then, the light-emitting layer 4 is placed on the top surface of the flexible conductive layer 3. Next, the glass panel 5 is placed on the top surface of the light-emitting layer 4, and the upper bending block 61 bends the conductive connecting arm 31 downward at a 90-degree angle, so that the conductive connecting arm 31 passes into the bending notch 21 and protrudes from the bottom of the bending notch 21. Then, the glass substrate 2 is placed on the top surface of the circuit board 1, and the lower bending block 71 bends the conductive connecting arm 31 towards the bottom surface of the glass substrate 2 at a 90-degree angle, so that the end of the conductive connecting arm 31 is parallel to the glass substrate 2, and the end of the conductive connecting arm 31 is placed between the glass substrate 2 and the circuit board 1, thus completing the electrical conduction between the conductive connecting arm 31 and the circuit board 1.

[0022] This embodiment designs each core layer of the display screen as a detachable assembly structure, abandoning the traditional glue bonding method. This structurally enables the display screen to be disassembled and repaired, solving the problem of traditional non-disassembled packaging that requires complete scrapping after a failure. Simultaneously, by utilizing the upper bending block 61 of the glass panel 5 and the lower bending block 71 of the circuit board 1, the conductive connecting arms 31 of the flexible conductive layer 3 are bent in stages and directions during assembly, replacing the traditional welding conductive connection method. This achieves a weld-free conductive connection structure, avoiding faults such as incomplete soldering and open circuits caused by welding processes. Furthermore, the conductive connection formation is completed simultaneously with the layer assembly, simplifying the assembly process. The detachable layer structure, combined with the bent conductive connection, allows for targeted disassembly of faulty layers during later maintenance without damaging the conductive structure, significantly reducing the difficulty of maintenance operations.

[0023] This embodiment describes a low-expansion coefficient glass substrate 2 display screen, in which the bending notch 21 is located at the edge of the glass substrate 2; and the conductive connecting arm 31 is located at the edge of the flexible conductive layer 3. This embodiment places both the bending notch 21 and the conductive connecting arm 31 at the edges of their respective components, utilizing the unused edge space to arrange the bending and conductive connection structures. This avoids occupying the core display and conductive areas of the glass substrate 2 and the flexible conductive layer 3, ensuring the integrity of the core functional areas of the display screen from a layout perspective and preventing structural design from affecting display and conductivity performance. Simultaneously, the edge arrangement provides ample space for bending operations, allowing the upper bending block 61 and lower bending block 71 to bend the conductive connecting arm 31 more smoothly, reducing the likelihood of jamming or bending deformation, and improving the forming effect of bending and conductive connections.

[0024] This embodiment describes a low-expansion coefficient glass substrate 2 display screen. The bottom edge of the glass panel 5 is provided with an upper sealing ring 6. The upper sealing ring 6 abuts against the top surface of the edge of the glass substrate 2. An upper bending block 61 is located at the bottom of the upper sealing ring 6. The upper bending block 61 is movably disposed within a bending notch 21. The upper bending block 61 and the upper sealing ring 6 can be integrally molded silicone parts. This embodiment achieves an integrated design of the sealing structure and the bending structure by integrating the upper bending block 61 at the bottom of the upper sealing ring 6. The abutment and contact between the upper sealing ring 6 and the top surface of the glass substrate 2 forms an interlayer seal between the glass panel 5 and the glass substrate 2, preventing external moisture and oxygen from intruding through gaps. Simultaneously, the upper bending block 61 is movably disposed within the bending notch 21, allowing it to be inserted into the bending notch 21 when bending the conductive connecting arm 31, resulting in a cleaner and more reliable overall structure.

[0025] In this embodiment, a low expansion coefficient glass substrate 2 display screen is provided with a lower sealing ring 7 at the top edge of the circuit board 1; the lower sealing ring 7 is used to abut against the bottom surface of the edge of the glass substrate 2; a lower bending block 71 is provided at the top of the lower sealing ring 7; the lower bending block 71 is movably provided in the bending notch 21; wherein the lower bending block 71 and the lower sealing ring 7 can be integrally formed silicone parts. This embodiment integrates a lower bending block 71 at the top of the lower sealing ring 7, achieving an integrated design of the lower sealing structure and the secondary bending structure. By utilizing the abutment and contact between the lower sealing ring 7 and the bottom surface of the glass substrate 2, an interlayer seal is formed between the circuit board 1 and the glass substrate 2. This, together with the upper sealing ring 6, forms a double-layer interlayer seal, significantly improving the waterproof and oxygen-proof protection effect of the display screen. The lower bending block 71 is movably positioned within the bending notch 21, allowing the bending block to flexibly adapt to the deformation trajectory of the conductive connecting arm 31 during the secondary bending process. This enables the lower bending block 71 to be inserted into the bending notch 21 when bending the conductive connecting arm 31, resulting in a cleaner and more reliable overall structure.

[0026] In this embodiment, a low-expansion coefficient glass substrate 2 display screen is provided, wherein the upper bending block 61 and the lower bending block 71 are arranged facing each other. This arrangement ensures that after the conductive connecting arm 31 undergoes its first downward bend, it can be bent a second time along the direction of the facing lower bending block 71. This maintains a consistent bending force direction for the conductive connecting arm 31, resulting in a pre-defined, regular bending trajectory and preventing deviations or twisting.

[0027] In this embodiment, a low expansion coefficient glass substrate 2 display screen is provided with a conductive protrusion 11 on the top of the circuit board 1; after the lower bending block 71 bends the conductive connecting arm 31, the end of the conductive connecting arm 31 is located between the bottom surface of the glass substrate 2 and the top surface of the conductive protrusion 11.

[0028] In this embodiment, the bending block 71 bends the conductive connecting arm 31 at a 90-degree angle toward the bottom surface of the glass substrate 2, so that the end of the conductive connecting arm 31 is parallel to the glass substrate 2, and the end of the conductive connecting arm 31 is located between the bottom surface of the glass substrate 2 and the top surface of the conductive protrusion 11, thus completing the electrical conduction between the conductive connecting arm 31 and the circuit board 1, replacing the traditional welding conduction method.

[0029] In this embodiment, a low-expansion coefficient glass substrate 2 display screen is provided, wherein the conductive protrusion 11 is disposed on the inner side of the lower bending block 71; a guide arc surface 72 is provided between the lower bending block 71 and the conductive protrusion 11. In this embodiment, by placing the conductive protrusion 11 on the inner side of the lower bending block 71, the conductive connecting arm 31 can naturally extend towards the conductive protrusion 11 after a second bend. With the help of the guide arc surface 72 between the lower bending block 71 and the conductive protrusion 11, the smooth guiding effect of the guide arc surface 72 guides the conductive connecting arm 31 to smoothly transition from the bent state to a horizontal state that fits against the conductive protrusion 11, avoiding end deformation and warping caused by direct hard contact between the conductive connecting arm 31 and the conductive protrusion 11 after bending.

[0030] This embodiment describes a low-expansion coefficient glass substrate 2 display screen. The circuit board 1 is rotatably equipped with a fixing post 8; a return spring 81 is fitted around the fixing post 8; the glass substrate 2, flexible conductive layer 3, and glass panel 5 are all perforated with clearance holes 22 to allow the fixing post 8 to move. This embodiment utilizes the clearance holes 22 through the fixing post 8 to provide precise positioning guidance for the assembly of the glass substrate 2, flexible conductive layer 3, and glass panel 5, preventing horizontal misalignment of the layers during assembly and ensuring the bonding accuracy and structural alignment accuracy between the layers.

[0031] This embodiment describes a low-expansion coefficient glass substrate 2 display screen, which further includes a waterproof cover 9. The glass substrate 2, flexible conductive layer 3, light-emitting layer 4, and glass panel 5 are all fitted inside the waterproof cover 9. The waterproof cover 9 is provided with a through fixing hole 91. The top of the fixing post 8 is sequentially inserted through the clearance hole 22 and the fixing hole 91. One side of the top of the fixing post 8 is provided with ratchet teeth 82 arranged along the height direction. The other side of the top of the fixing post 8 is a semi-cylindrical structure 83. The waterproof cover 9 is provided with a spring piece 92 that cooperates with the ratchet teeth 82.

[0032] Specifically, in this embodiment, during the installation of the low expansion coefficient glass substrate 2 display screen, the flexible conductive layer 3 is first placed on the top surface of the glass substrate 2, and the conductive connecting arm 31 is positioned at the top of the bending notch 21, at which point the conductive connecting arm 31 and the flexible conductive layer 3 are on the same horizontal plane; then the light-emitting layer 4 is placed on the top surface of the flexible conductive layer 3; next, the glass panel 5 is placed on the top surface of the light-emitting layer 4, and the upper bending block 61 bends the conductive connecting arm 31 downwards at a 90-degree angle, so that the conductive connecting arm 31 passes into the bending notch 21 and protrudes from the bottom of the bending notch 21; then the waterproof cover 9 is placed on the top surface of the glass panel 5, so that the glass substrate 2, the flexible conductive layer 3, the light-emitting layer 4, and the glass panel 5 are all fitted onto the glass substrate 2. Inside the waterproof cover 9, aligning the clearance holes 22 and fixing holes 91, the waterproof cover 9, glass substrate 2, flexible conductive layer 3, light-emitting layer 4, and glass panel 5 are inserted into the fixing post 8. The waterproof cover 9, glass substrate 2, flexible conductive layer 3, light-emitting layer 4, and glass panel 5 are pushed downwards together. The lower bending block 71 bends the conductive connecting arm 31 90 degrees toward the bottom surface of the glass substrate 2, so that the end of the conductive connecting arm 31 is parallel to the glass substrate 2, and the end of the conductive connecting arm 31 is located between the glass substrate 2 and the circuit board 1, completing the electrical conduction between the conductive connecting arm 31 and the circuit board 1. The waterproof cover 9 and the fixing post 8 are fixed by the cooperation of the ratchet 82 and the spring piece 92.

[0033] When disassembly is required, simply rotate the fixing post 8 so that the semi-cylindrical structure 83 of the fixing post 8 is aligned with the spring piece 92. After the spring piece 92 separates from the ratchet 82, the return spring 81 resets, thus allowing the various components to be separated.

[0034] The method for producing a low coefficient of thermal expansion glass substrate 2 display screen according to this embodiment includes the following steps: S1. Place the flexible conductive layer 3 on the top surface of the glass substrate 2, and make the conductive connecting arm 31 located at the top of the bending notch 21. At this time, the conductive connecting arm 31 and the flexible conductive layer 3 are on the same horizontal plane. S2. Place the light-emitting layer 4 on the top surface of the flexible conductive layer 3; S3. Place the glass panel 5 on the top surface of the light-emitting layer 4, and bend the conductive connecting arm 31 downward with the upper bending block 61 so that the conductive connecting arm 31 passes into the bending notch 21 and protrudes from the bottom of the bending notch 21. S4. Place the glass substrate 2 on the top surface of the circuit board 1, and bend the conductive connecting arm 31 towards the bottom surface of the glass substrate 2 with the lower bending block 71, so that the end of the conductive connecting arm 31 is located between the glass substrate 2 and the circuit board 1.

[0035] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the essence and scope of the technical solutions of the present invention.

Claims

1. A low coefficient of thermal expansion glass substrate (2) display screen, characterized in that: The device includes a circuit board (1), a glass substrate (2), a flexible conductive layer (3), a light-emitting layer (4), and a glass panel (5); the glass substrate (2) is detachably disposed on the top surface of the circuit board (1); the flexible conductive layer (3) is detachably disposed on the top surface of the glass substrate (2); the light-emitting layer (4) is detachably disposed on the top surface of the flexible conductive layer (3); and the glass panel (5) is detachably disposed on the top surface of the light-emitting layer (4). The glass substrate (2) has a bending notch (21) through it; the flexible conductive layer (3) has a conductive connecting arm (31); the conductive connecting arm (31) is located at the bending notch (21); the glass panel (5) has an upper bending block (61); the circuit board (1) has a lower bending block (71); The upper bending block (61) is used to bend the conductive connecting arm (31) in the direction of the lower bending block (71); the lower bending block (71) is used to bend the conductive connecting arm (31) in the direction of the bottom surface of the glass substrate (2).

2. The low coefficient of thermal expansion glass substrate (2) display screen according to claim 1, characterized in that: The bending notch (21) is located at the edge of the glass substrate (2); the conductive connecting arm (31) is located at the edge of the flexible conductive layer (3).

3. The low coefficient of thermal expansion glass substrate (2) display screen according to claim 1, characterized in that: The bottom edge of the glass panel (5) is provided with an upper sealing ring (6); the upper sealing ring (6) is used to abut against the top surface of the edge of the glass substrate (2); the upper bending block (61) is provided at the bottom of the upper sealing ring (6); the upper bending block (61) is movably provided at the bending notch (21).

4. A low coefficient of thermal expansion glass substrate (2) display screen according to claim 1, characterized in that: The circuit board (1) has a lower sealing ring (7) at the top edge of its edge; the lower sealing ring (7) is used to abut against the bottom surface of the edge of the glass substrate (2); the lower bending block (71) is located at the top of the lower sealing ring (7); the lower bending block (71) is movably located at the bending notch (21).

5. A low coefficient of thermal expansion glass substrate (2) display screen according to claim 1, characterized in that: The upper bending block (61) and the lower bending block (71) are positioned opposite each other.

6. A low coefficient of thermal expansion glass substrate (2) display screen according to claim 1, characterized in that: The circuit board (1) has a conductive boss (11) on its top; after the lower bending block (71) bends the conductive connecting arm (31), the end of the conductive connecting arm (31) is located between the bottom surface of the glass substrate (2) and the top surface of the conductive boss (11).

7. A low coefficient of thermal expansion glass substrate (2) display screen according to claim 6, characterized in that: The conductive boss (11) is located on the inner side of the lower bending block (71); a guide arc surface (72) is provided between the lower bending block (71) and the conductive boss (11).

8. A low coefficient of thermal expansion glass substrate (2) display screen according to claim 1, characterized in that: The circuit board (1) is rotatably provided with a fixing post (8); the fixing post (8) is covered with a reset spring (81); the glass substrate (2), the flexible conductive layer (3) and the glass panel (5) are all provided with a clearance hole (22) for making way for the fixing post (8).

9. A low coefficient of thermal expansion glass substrate (2) display screen according to claim 8, characterized in that: The low expansion coefficient glass substrate (2) display screen also includes a waterproof cover (9); the glass substrate (2), flexible conductive layer (3), light-emitting layer (4) and glass panel (5) are all fitted inside the waterproof cover (9); the waterproof cover (9) is provided with a fixing hole (91); the top of the fixing post (8) is sequentially inserted through the clearance hole (22) and the fixing hole (91); The top of the fixed post (8) is provided with ratchet teeth (82) arranged along the height direction on one side; the top of the fixed post (8) is a semi-cylindrical structure (83); the waterproof cover (9) is provided with a spring piece (92) that cooperates with the ratchet teeth (82).

10. A method for producing a display screen based on a low coefficient of thermal expansion glass substrate (2) according to any one of claims 1-9, characterized in that: Includes the following steps: S1. Place the flexible conductive layer (3) on the top surface of the glass substrate (2) and make the conductive connecting arm (31) located at the top of the bending notch (21). At this time, the conductive connecting arm (31) and the flexible conductive layer (3) are on the same horizontal plane. S2. Place the light-emitting layer (4) on the top surface of the flexible conductive layer (3); S3. Place the glass panel (5) on the top surface of the light-emitting layer (4), and bend the conductive connecting arm (31) downward with the upper bending block (61) so that the conductive connecting arm (31) passes into the bending notch (21) and protrudes from the bottom of the bending notch (21). S4. Place the glass substrate (2) on the top surface of the circuit board (1), and bend the conductive connecting arm (31) towards the bottom surface of the glass substrate (2) with the lower bending block (71), so that the end of the conductive connecting arm (31) is located between the glass substrate (2) and the circuit board (1).

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