A bidirectional vibration switch of a model 1210 chip package

Abstract

The application provides a bidirectional vibration switch of a 1210 type patch package, which comprises a vibration switch body, the vibration switch body comprises a cylindrical box, a top plane and a bottom plane, a cylindrical hole is formed in the middle of the cylindrical box, a copper ball is arranged in the cylindrical hole, the top plane is fixedly connected to the top of the cylindrical box, the bottom plane is fixedly connected to the bottom of the cylindrical box, the top surface of the bottom plane is provided with a front semicircle area and a rear semicircle area, and the bottom surface of the bottom plane is respectively welded with a first soldering pad, a second soldering pad, a third soldering pad and a fourth soldering pad. The application has the advantages of small size, four soldering pad design, small space occupation ratio, 1.05mm thickness of the vibration switch body, facilitating the miniaturization structure design of a circuit mainboard, gold plating process of the soldering pad, not easy to be oxidized, easy to produce a patch process, automatic production of the vibration switch production process and lower manufacturing cost.

Description

Technical Field

[0001] This invention relates to the field of vibration switch technology, and more particularly to a bidirectional vibration switch with a 1210 surface mount package. Background Technology

[0002] Current vibration switches are large or irregularly shaped, or even manually inserted, making it difficult to process or automate the manufacturing process after the finished product is shipped. The production process is semi-automatic, requiring manual edge grinding afterward. The components are also relatively thick, generally ranging from 1.8mm to 3mm, which is not conducive to product miniaturization. Summary of the Invention

[0003] To address the aforementioned technical problems, this invention provides a bidirectional vibration switch in a 1210 surface mount package, comprising a vibration switch body. The vibration switch body includes a cylindrical housing, a top plane, and a bottom plane. A cylindrical hole is formed in the middle of the cylindrical housing, and a copper ball is placed inside the cylindrical hole. The top plane is fixedly connected to the top surface of the cylindrical housing, and the bottom plane is fixedly connected to the bottom surface of the cylindrical housing. A first copper foil is provided on one side of the bottom plane, located on one side of the cylindrical hole, forming a front semicircular area with the first copper foil. A second copper foil is provided on one side of the bottom plane, located on the other side of the cylindrical hole, forming a rear semicircular area with the other side of the cylindrical hole. Both the first and second copper foils extend out of the cylindrical hole. A third copper foil is provided on the other side of the bottom plane. A first pad, a second pad, a third pad, and a fourth pad are respectively provided at the four corners of the bottom surface of the bottom plane.

[0004] Preferably, the copper ball has a diameter of 0.55 mm, the inner diameter of the cylindrical hole is 0.95 mm, and the surface of the copper ball is plated with a silver layer using a silver plating process.

[0005] Preferably, there is a gap between the first copper sheet and the second copper sheet.

[0006] Preferably, the first copper sheet, the second copper sheet, and the third copper sheet are all gold-plated and set on the top surface of the bottom plane.

[0007] Preferably, the first pad is located below the first copper layer and connected to the front semicircular area, the second pad is located below the second copper layer and connected to the second copper layer, and the third pad and the fourth pad are located below the third copper layer and connected to the third copper layer.

[0008] Preferably, the external dimensions of the vibration switch body are: length 2.2 mm, width 1.4 mm, and thickness 1.05 mm.

[0009] Compared with the prior art, the present invention provides a bidirectional vibration switch with a 1210 surface mount package, which has the following advantages: This invention features a small size, a four-pad design, and can also be mounted on the pads of the 1210 package, resulting in a small duty cycle. The vibration switch body is only 1.05mm thick, facilitating miniaturized circuit board design. The pads of the vibration switch body are gold-plated, making them less prone to oxidation and easier to manufacture using surface mount technology. The vibration switch manufacturing process is automated, resulting in lower manufacturing costs. Attached Figure Description

[0010] Figure 1 This is a three-dimensional structural diagram of the vibration switch body of the present invention; Figure 2 This is a schematic cross-sectional view of the vibration switch body of the present invention; Figure 3 This is a top view of the vibration switch body of the present invention; Figure 4 This is a circuit connection diagram of a product application example of the pedometer watch of the present invention.

[0011] In the diagram: 1. Cylindrical box; 2. Top plane; 3. Bottom plane; 4. First pad; 5. Second pad; 6. Third pad; 7. Fourth pad; 8. Cylindrical hole; 9. Copper ball; 10. First copper sheet; 11. Second copper sheet; 12. Third copper sheet; 13. Front semicircular area; 14. Rear semicircular area. Detailed Implementation

[0012] This invention relates to a bidirectional vibration switch in a 1210 surface mount package, such as... Figure 1-3As shown, the device includes a vibration switch body, which comprises a cylindrical housing 1, a top plane 2, and a bottom plane 3. A cylindrical hole 8 is formed in the middle of the cylindrical housing 1, and a copper ball 9 is placed inside the cylindrical hole 8. The top surface of the cylindrical housing 1 is fixedly connected to the top plane 2, and the bottom surface of the cylindrical housing 1 is fixedly connected to the bottom plane 3. A first copper sheet 10 is provided on one side of the cylindrical hole 8, forming a front semicircular area 13. A second copper sheet 11 is provided on the other side of the cylindrical hole 8, forming a rear semicircular area 14. The first copper sheet 10 and the second copper sheet 11... One end of each of the copper balls 1 extends into a cylindrical hole 8, ensuring that when the copper ball 9 rolls back and forth inside the cylindrical hole 8, it must contact one of the first copper sheet 10 and the second copper sheet 11. There is a gap between the first copper sheet 10 and the second copper sheet 11. The top surface of the other end of the bottom plane 3 is provided with a third copper sheet 12. The four corners of the bottom surface of the bottom plane 3 are respectively provided with a first pad 4, a second pad 5, a third pad 6, and a fourth pad 7. The first pad 4 is located below the first copper sheet 10 and is connected to the front semicircular area 13. The second pad 5 is located below the second copper sheet 11 and is connected to the second copper sheet 11. The third pad 6 and the fourth pad 7 are located below the third copper sheet 12 and are connected to the third copper sheet 12.

[0013] When the environment swings or shakes, the copper ball 9 will roll back and forth between the front semicircular area 13 and the rear semicircular area 14. When the copper ball rolls in the front semicircular area 13, it will be connected to the vertical surface of the cylindrical box 1, that is, connected to the first pad 4; when the copper ball rolls in the rear semicircular area 14, it will be connected to the vertical surface of the cylindrical box, that is, connected to the second pad 5, thereby realizing the alternating short-circuit and open-circuit connection of the two circuit networks of the first pad 4 and the second pad 5.

[0014] like Figure 4 As shown in the figure (①, ②, ③, and ④ represent the first pad 4, the second pad 5, the third pad 6, and the fourth pad 7, respectively; the front represents the front semicircular area 13, and the back represents the rear semicircular area 14), in practical applications, the first pad 4 and the second pad 5 on the bottom plane are usually connected to pull-up resistors to provide a high level. The first pad 4 and the second pad 5 are respectively connected to the two interrupt input terminals of the microcontroller chip. The vertical surface of the cylindrical box 1 is grounded. If the vibration continues, the copper ball 9 will roll back and forth, contacting the front semicircular area 13 and the rear semicircular area 14, and alternately connecting with the vertical surface of the cylindrical box 1. The first pad 4 and the second pad 5 will alternately output high and low pulse signals to the two IO ports of the microcontroller chip for reception. Through the step counting algorithm of the microcontroller software, the final product functions are realized, such as step counting, vibration triggering, motion detection, tilt sensing, and other trigger wake-up functions.

[0015] The copper ball 9 has a diameter of 0.55mm, and the inner diameter of the cylindrical hole 8 is 0.95mm. The surface of the copper ball 9 is plated with a silver layer to increase its conductivity. The first copper sheet 10, the second copper sheet 11, and the third copper sheet 12 are all plated with gold on the top surface of the bottom plane 3. The first pad 4, the second pad 5, the third pad 6, and the fourth pad 7 are also plated with gold on the bottom plane 3. The gold plating process makes it less prone to oxidation and easier to manufacture for surface mount technology.

[0016] The main body of the vibration switch has the following dimensions: 2.2mm in length, 1.4mm in width, and 1.05mm in thickness. It is a standard 1210 package and can be directly surface-mounted onto the 1210 package pads.

[0017] It is understood that the present invention has been described through some embodiments, and those skilled in the art will recognize that various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of the invention. Furthermore, under the teachings of the present invention, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of the invention. Therefore, the present invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the protection scope of the present invention.

Claims

1. A bidirectional vibration switch with a 1210 surface mount package, comprising a vibration switch body, characterized in that, The vibration switch body includes a cylindrical box (1), a top plane (2), and a bottom plane (3). A cylindrical hole (8) is opened in the middle of the cylindrical box (1). A copper ball (9) is placed inside the cylindrical hole (8). The top surface of the cylindrical box (1) is fixedly connected to the top plane (2), and the bottom surface of the cylindrical box (1) is fixedly connected to the bottom plane (3). A first copper sheet (10) is provided on one side of the bottom plane (3) located at one end of the top surface of the cylindrical hole (8). The first copper sheet (10) and one side of the cylindrical hole (8) form the front half. The circular area (13) has a second copper sheet (11) on the top surface of one end of the bottom plane (3) located on the other side of the cylindrical hole (8). The second copper sheet (11) forms a rear semi-circular area (14) with the other side of the cylindrical hole (8). One end of the first copper sheet (10) and the second copper sheet (11) both extend out of the cylindrical hole (8). The top surface of the other end of the bottom plane (3) has a third copper sheet (12). The bottom surface of the bottom plane (3) has a first pad (4), a second pad (5), a third pad (6), and a fourth pad (7) respectively at the four corners of the bottom surface.

2. The bidirectional vibration switch with a 1210 surface mount package according to claim 1, characterized in that: The copper ball (9) has a diameter of 0.55 mm, the cylindrical hole (8) has an inner diameter of 0.95 mm, and the surface of the copper ball (9) is plated with a silver layer.

3. A bidirectional vibration switch with a 1210 surface mount package as described in claim 1, characterized in that: There is a gap between the first copper sheet (10) and the second copper sheet (11).

4. A bidirectional vibration switch with a 1210 surface mount package as described in claim 1, characterized in that: The first copper sheet (10), the second copper sheet (11) and the third copper sheet (12) are all gold-plated on the top surface of the bottom plane (3).

5. A bidirectional vibration switch with a 1210 surface mount package as described in claim 1, characterized in that: The first pad (4) is located below the first copper sheet (10) and connected to the front semicircular area (13). The second pad (5) is located below the second copper sheet (11) and connected to the second copper sheet (11). The third pad (6) and the fourth pad (7) are located below the third copper sheet (12) and connected to the third copper sheet (12).

6. A bidirectional vibration switch with a 1210 surface mount package as described in claim 1, characterized in that: The external dimensions of the vibration switch body are: 2.2 mm in length, 1.4 mm in width, and 1.05 mm in thickness.

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