Automobile chip quick mounting and fixing connection structure
By using a mechanical automotive chip rapid installation and fixing connection structure, which utilizes extrusion blocks and guide frames to fix the chip and conduct heat, the problem of increased size and weight caused by electric telescopic rods is solved, improving installation efficiency and chip stability, and reducing energy consumption and space occupation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- UNIV OF SCI & TECH BEIJING
- Filing Date
- 2026-02-26
- Publication Date
- 2026-06-16
AI Technical Summary
In the existing technology, the structure of the electric telescopic rod driving four clamping arms to fix the chip is complex, which increases the size and weight of the system, requires an additional power supply, has high energy consumption, affects the layout of other key components and space utilization, and requires the chip position and angle to be adjusted in advance during installation.
The system employs a mechanical automotive chip quick-installation and fixing connection structure. By pulling and connecting the housing, the extrusion block and anti-slip pad are used to fix the chip. The guide frame and guide block are used to achieve limiting and heat conduction. Combined with the heat sink and fan, heat dissipation is achieved, thus avoiding the use of an electric drive system.
The simplified structure reduces the number and weight of components, lowers energy consumption, optimizes space layout, improves the chip's shock resistance and stability, ensures convenient quick installation and disassembly, and extends the chip's lifespan.
Smart Images

Figure CN122228009A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of chip mounting technology, and in particular to a quick-mount and fixed connection structure for automotive chips. Background Technology
[0002] With the development of automotive electronics, chips play a crucial role in in-vehicle control, autonomous driving, and entertainment systems. Efficient chip installation and reliable mounting have become critical design challenges. To improve installation efficiency and ensure long-term stability, rapid-mount mounting connection structures have emerged. These structures improve chip installation precision, enhance system reliability, and adapt to the various challenges of the automotive environment. With the increasing prevalence of intelligent and new energy vehicles, the demand for chip installation and mounting will further increase, driving the continuous development of automotive electronic systems.
[0003] A search revealed a Chinese patent publication number CN222421493U for a quick mounting device for NTC chips. The device includes a base, with support plates symmetrically mounted on the top of the base. Fixing platforms are fixedly mounted on the top of the two support plates. Fixing components are provided on the top and bottom of the fixing platforms, allowing the chip to be fixed on all four sides using only one electric push rod without affecting the installation of other components on the chip.
[0004] This technology uses an electric telescopic rod to drive four clamping arms to fix the chip. The electric system has a complex structure, which increases the size and weight. It also requires an additional power source and has high energy consumption. The electric telescopic rod and its related drive and control components increase the size and weight of the system. In the limited space of a car, the increase in size and weight may affect the layout and space utilization of other key components, and may even have a certain impact on the overall performance of the car. Furthermore, the position and angle of the chip need to be adjusted in advance during installation.
[0005] Therefore, there is an urgent need for a quick-installation and fixed connection structure for automotive chips to solve the above problems. Summary of the Invention
[0006] The purpose of this invention is to solve the problems of existing technologies that use electric telescopic rods to drive four clamping arms to fix chips. These technologies have complex electric systems that increase size and weight, require additional power sources, and have high energy consumption. The electric telescopic rods and their related drive and control components also increase the size and weight of the system, affecting the arrangement of other key components and space utilization. Furthermore, the chip's position and angle need to be adjusted in advance during installation. Therefore, this invention proposes a quick-installation and fixing connection structure for automotive chips.
[0007] To achieve the above objectives, the present invention adopts the following technical solution:
[0008] A quick-installation and fixing connection structure for automotive chips includes a central housing and a limiting component. The top and bottom of the central housing are provided with heat insulation shells, and extrusion grooves are formed on the inner sidewalls on both sides of the central housing. A storage component is provided in the center of the central housing for placing and storing the automotive chip body. A contact copper piece is provided on the sidewall of one end of the automotive chip body, and a contact copper piece is provided on the inner sidewall of one end of the central housing. The two contact copper pieces are positioned correspondingly and support mutual contact.
[0009] The storage component includes a docking shell slidably connected to the central shell. Clamping components are provided on the outer side walls of both sides of the docking shell. The clamping components are used to clamp and limit the two sides of the automotive chip body. Guide frames are provided at the top and bottom of both sides of the docking shell. The limiting components include guide blocks. Each guide frame has a guide block slidably connected in it. The guide frame has an inclination in the vertical direction. Through the guide frame, the two guide blocks on the same side can move closer or further apart in the vertical direction.
[0010] A lifting frame is connected between two guide blocks on the same horizontal plane. A strong spring is provided on one side of the lifting frame. A heat transfer component is provided at the bottom of the strong spring. The heat transfer component is connected to a heat dissipation component through a heat conduction cylinder. A ventilation component is provided on the side wall of the heat insulation shell.
[0011] Optionally, a handle groove is provided on the outer wall of one end of the docking housing, and two sets of heat transfer components and heat dissipation components are provided, with the automotive chip body located between the two sets of heat transfer components.
[0012] Optionally, the clamping assembly includes two extrusion blocks. Two extrusion blocks are respectively provided on the two side walls of the mating housing. Anti-slip pads are fixedly connected to the opposite side of the extrusion blocks. The automotive chip body is located between the two anti-slip pads. The extrusion blocks are slidably connected to the extrusion groove. The extrusion groove has an inclination in the horizontal direction. When the two extrusion blocks slide along the extrusion groove, they move closer to each other.
[0013] Optionally, a guide cylinder is fixedly connected to the center of the lifting frame, and a strong spring is provided inside the guide cylinder. Four heat insulation cylinders are fixedly connected to the four corners of the top wall of the lifting frame.
[0014] Optionally, the heat transfer assembly includes a guide column, one end of which is connected to the inner wall of the guide cylinder by a strong spring, and the other end of which is fixedly connected to a heat-conducting pressing plate. The heat-conducting pressing plate is located at the bottom of the lifting frame, and four heat-conducting sliding rods are fixedly connected to the four corners of the heat-conducting pressing plate. Each heat-conducting sliding rod passes through the lifting frame and is slidably connected to the interior of the corresponding heat insulation cylinder.
[0015] Optionally, the heat dissipation component includes a heat dissipation plate, which is fixedly connected to the inner wall of the heat insulation shell. Heat conduction cylinders are provided at the four bottom corners of the heat dissipation plate, and heat dissipation fins are fixedly connected to both ends of the heat dissipation plate.
[0016] Optionally, a through groove is provided inside the heat-conducting cylinder, and the heat-conducting slide rod is slidably connected to the heat-conducting cylinder through the through groove.
[0017] Optionally, the ventilation assembly includes a partition plate, which is fixedly connected to one side wall of the heat insulation shell. The other side wall of the heat insulation shell is open and provided with a dustproof strip. Several dustproof strips are evenly arranged in an array along the width direction of the heat insulation shell. Multiple electric fans are fixedly connected to the partition plate. The heat insulation shell communicates with the outside through the opening in the side wall of the heat insulation shell.
[0018] Optionally, two mounting plates are fixedly connected to the outer sides of the bottom walls on both sides of the central housing, and the central housing is installed onto the vehicle through the mounting plates.
[0019] Optionally, the distance that the docking housing can be pulled out is equal to the distance that the guide block moves within the guide frame.
[0020] Compared with the prior art, the technical solution provided by this invention has at least the following beneficial effects:
[0021] In the above solution, by pulling the docking housing, the squeezing blocks and anti-slip pads on both sides slide within the squeezing groove. The squeezing groove squeezes the squeezing blocks and anti-slip pads, thus fixing the automotive chip body to the inside of the central housing after the chip body moves, completing the installation. The structure is simple and does not rely on a complex electric drive system, reducing the number of components and failure rate, and improving reliability. Secondly, this mechanical fixing method greatly reduces volume and weight, which helps to optimize the layout within the limited space of the car and reduces the impact on vehicle performance. In addition, since no additional power supply is required, this design can effectively reduce energy consumption, which is particularly suitable for electric vehicles and helps to extend the driving range. Through the tight cooperation of the squeezing blocks and anti-slip pads, the chip is fully fixed, enhancing shock resistance and stability, and ensuring its reliability during vehicle operation.
[0022] By limiting the guide block during the movement of the docking housing by the guide frame, the heat-conducting pressing plate is driven to contact the outer walls on both sides of the automotive chip body for heat conduction. Heat dissipation is achieved through heat sink and heat dissipation fins. This design can conduct heat efficiently, which helps to reduce the chip's operating temperature, prevent overheating, and improve the chip's stability and reliability. Through effective heat dissipation, the chip can be kept within a safe temperature range, extending its service life.
[0023] The automotive chip body is clamped and fixed during the insertion process of the docking housing, and released during the extraction process, enabling rapid installation and removal of the automotive chip body. This improves the efficiency of installation and removal, saves time and labor costs, and is particularly suitable for production lines and maintenance processes. The operation is simple and reduces the reliance on complex tools. At the same time, it ensures that the chip is firmly clamped during installation, avoiding loosening or displacement caused by vibration or external force. During disassembly, releasing the chip body effectively reduces the risk of damage during the disassembly process and extends the chip's service life. Attached Figure Description
[0024] The accompanying drawings, which are incorporated herein and form part of the specification, illustrate embodiments of the invention and, together with the specification, further serve to explain the principles of the invention and enable those skilled in the art to practice and use the invention.
[0025] Figure 1 This is a schematic diagram of the overall structure of the present invention;
[0026] Figure 2 This is a schematic diagram of the internal structure of the central shell of the present invention;
[0027] Figure 3 This is a schematic diagram of the internal structure of the heat insulation shell of the present invention;
[0028] Figure 4 This is a schematic diagram of the heat sink portion of the present invention;
[0029] Figure 5 This is a schematic diagram of the internal structure of the guide cylinder of the present invention;
[0030] Figure 6 This is a schematic diagram of the automotive chip body structure of the present invention;
[0031] Figure 7 This is a schematic diagram showing the disassembled structure of the docking shell, the central shell, and the automotive chip body of the present invention.
[0032] [Figure Labels]
[0033] 1. Central housing; 2. Insulation housing; 3. Mounting plate; 4. Connecting housing; 5. Handle groove; 6. Dustproof strip; 7. Guide frame; 8. Guide block; 9. Lifting frame; 10. Heat-conducting pressing plate; 11. Heat-conducting slide bar; 12. Insulation cylinder; 13. Guide column; 14. Strong spring; 15. Guide cylinder; 16. Heat-conducting cylinder; 17. Heat sink plate; 18. Heat sink fins; 19. Partition plate; 20. Electric fan; 21. Extrusion groove; 22. Extrusion block; 23. Anti-slip pad; 24. Automotive chip body; 25. Contact copper sheet.
[0034] As shown in the figure, specific structures and devices are marked in the figure to clearly illustrate the structure of the embodiments of the present invention. However, this is only for illustrative purposes and is not intended to limit the present invention to this specific structure, device and environment. Those skilled in the art can adjust or modify these devices and environments according to specific needs. Detailed Implementation
[0035] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. It should also be noted that, to make the embodiments more comprehensive, the following embodiments are the best and preferred embodiments, and those skilled in the art can use other alternative methods to implement some well-known technologies; moreover, the accompanying drawings are only for more specific description of the embodiments and are not intended to specifically limit the present invention.
[0036] It should be noted that the use of terms such as "an embodiment," "an embodiment," "an exemplary embodiment," and "some embodiments" in the specification indicates that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments (whether explicitly described or not) should be within the knowledge of those skilled in the art.
[0037] Generally, terms can be understood at least partly from their use in context. For example, depending at least partly on the context, the term "one or more" as used herein can be used to describe any feature, structure, or characteristic in a singular sense, or a combination of features, structures, or characteristics in a plural sense. Additionally, the term "based on" can be understood not necessarily to convey an exclusive set of factors, but rather, alternatively, depending at least partly on the context, to allow for the presence of other factors that are not necessarily explicitly described.
[0038] It is understood that the meanings of “on”, “above”, and “above” in this invention should be interpreted in the broadest manner, such that “on” means not only “directly on” something, but also includes the meaning of being “on” something with an intervening feature or layer, and that “above” or “above” means not only “on” something, but also includes the meaning of being “on” something without an intervening feature or layer.
[0039] Furthermore, spatially related terms such as “below,” “under,” “lower,” “above,” and “upper” are used herein for convenience to describe the relationship of one element or feature to one or more other elements or features, as illustrated in the accompanying drawings. Spatially related terms are intended to cover different orientations in the use or operation of the device other than those depicted in the accompanying drawings. The device may be oriented in other ways, and the spatially related descriptive terms used herein can be interpreted similarly.
[0040] like Figures 1 to 7 As shown, this embodiment of the invention provides a quick-installation and fixing connection structure for automotive chips, including a central housing 1 and a limiting component. The top and bottom of the central housing 1 are provided with heat insulation housings 2, which are symmetrically distributed about the central housing 1 in the horizontal direction. The central housing 1 is a U-shaped structure with one end open. The inner sidewalls on both sides of the central housing 1 are provided with extrusion grooves 21. The central housing 1 is provided with a storage component for placing and storing the automotive chip body 24. A contact copper piece 25 is provided in the middle section of the inner sidewall at one end of the automotive chip body 24, and a contact copper piece 25 is provided in the middle section of the inner sidewall at one end of the central housing 1. The two contact copper pieces 25 are positioned correspondingly and can contact each other.
[0041] like Figures 1 to 7 As shown, the storage component includes a docking housing 4 slidably connected to the inner side of the central housing 1. The central housing 1 supports and limits the docking housing 4, allowing it to slide within the central housing 1. Two sets of guide frames 7 are provided on both sides of the docking housing 4, each set containing two guide frames 7. One guide frame 7 is located at the top and bottom of each side of the docking housing 4. Each guide frame 7 has an inclination in the vertical direction and is inclined towards the side wing of the docking housing 4. Specifically, the bottom end of the guide frame 7 located at the top of the side wing is connected to the top surface of the side wing of the docking housing 4, and the top end of the guide frame 7 located at the bottom of the side wing is connected to the bottom surface of the side wing of the docking housing 4.
[0042] The limiting assembly includes guide blocks 8. An opening is provided at the end of the guide frame 7 not connected to the side wing of the docking housing 4. A guide block 8 is slidably connected within each guide frame 7. The initial position of the guide block 8 is at the open end of the guide frame 7. During the insertion of the docking housing 4 into the central housing 1, the guide frame 7 moves, causing the guide block 8 to slide within the guide frame 7, resulting in two guide blocks 8 on the same side moving closer to each other in the vertical direction. A handle groove 5 is provided on the outer wall of one end of the docking housing 4. By pulling the handle groove 5, the docking housing 4 can slide within the central housing 1.
[0043] Clamping components are provided on the outer side walls of both sides of the docking housing 4. The two sets of clamping components are symmetrically arranged about the central axis of the automotive chip body 24 and are located on both sides of the storage end of the storage component. The clamping components are used to clamp and limit the two sides of the automotive chip body 24.
[0044] The limiting assembly includes a lifting frame 9, with a strong spring 14 installed inside the connecting end of the lifting frame 9. A heat transfer component is located at the bottom of the strong spring 14, which conducts heat from the automotive chip body 24. A heat-conducting cylinder 16 is located above the lifting frame 9, and a heat dissipation component is located at the top of the heat-conducting cylinder 16 to dissipate the heat transferred from the heat transfer component. A ventilation component is installed on the side wall of the heat insulation housing 2 to circulate air within the central housing 1.
[0045] The clamping assembly includes two compression blocks 22. Two compression blocks 22 are respectively provided on the two side walls of the docking housing 4. The compression blocks 22 are made of flexible material, allowing them to bend and automatically return to their original shape. Anti-slip pads 23 are fixedly connected to opposite sides of the compression blocks 22. The automotive chip body 24 is located between the two anti-slip pads 23. The docking housing 4 supports and fixes the compression blocks 22, and simultaneously supports and fixes the anti-slip pads 23. The anti-slip pads 23 also provide support between the compression blocks 22 and the automotive chip. The main bodies 24 are protected from each other. When the docking housing 4 is inserted into the central housing 1, the extrusion block 22 is slidably connected to the extrusion groove 21. The extrusion groove 21 extrudes and limits the extrusion block 22. The extrusion groove 21 is a groove with an inclination in the horizontal direction. When the docking housing 4 slides into the central housing 1, the extrusion block 22 slides along the extrusion groove 21. Due to the inclination of the extrusion groove 21, the extrusion block 22 gradually shifts towards the axis of the central housing 1. That is, the two extrusion blocks 22 gradually approach each other and clamp and fix the automotive chip body 24.
[0046] The guide frame 7 guides and limits the guide block 8. When the docking shell 4 drives the guide frame 7 to move towards the inner side of the central shell 1, the guide frame 7 has a certain slope. The slope compresses and guides the upper and lower guide blocks 8 that slide inside the guide frame 7 to move towards each other and get closer to each other. The two guide blocks 8 on the same horizontal plane are connected by a lifting frame 9. The center of the lifting frame 9 is fixedly connected to a guide cylinder 15, and the four corners of the top wall of the lifting frame 9 are fixedly connected to four heat insulation cylinders 12.
[0047] A strong spring 14 is installed inside the guide cylinder 15. The heat transfer assembly includes a guide column 13, which is fixedly connected to the bottom end of the strong spring 14. The strong spring 14 connects the guide cylinder 15 and the guide column 13. A heat-conducting pressing plate 10 is fixedly connected to the bottom end of the guide column 13. The heat-conducting pressing plate 10 is installed at the bottom of the lifting frame 9. The guide column 13 supports and fixes the heat-conducting pressing plate 10. Four heat-conducting sliding rods 11 are fixedly connected to the four corners of the top wall of the heat-conducting pressing plate 10. Each heat-conducting sliding rod 11 passes through the lifting frame 9 and is slidably connected to the interior of the corresponding heat insulation cylinder 12. The heat insulation cylinder 12 limits the heat-conducting sliding rods 11 and restricts the lifting direction of the heat-conducting pressing plate 10.
[0048] Both the heat transfer component and the heat dissipation component are provided in two sets. The two sets of heat transfer components are arranged symmetrically above and below each other.
[0049] The heat dissipation assembly includes a heat sink 17, which is fixedly connected to the inner wall of the heat insulation housing 2. The heat sink 17 is disposed inside the heat insulation housing 2. Each of the four bottom corners of the heat sink 17 is provided with a heat-conducting cylinder 16. Heat dissipation fins 18 are fixedly connected to both ends of the heat sink 17. The top of each heat-conducting slide rod 11 is slidably connected to the corresponding heat-conducting cylinder 16, transferring heat to the heat-conducting cylinder 16 through the slide rod 11. The heat transferred by the heat-conducting pressing plate 10 and the heat-conducting slide rod 11 is transferred to the heat sink 17 and the heat dissipation fins 18 through the heat-conducting cylinder 16 for heat dissipation. The two heat-conducting pressing plates 10 are located above and below the automotive chip body 24, respectively, transferring heat from the automotive chip body 24. A through groove is formed inside the heat-conducting cylinder 16 for the heat-conducting slide rod 11 to slide within the groove.
[0050] The ventilation assembly includes a partition 19, which is fixedly connected to one side wall of the heat insulation shell 2. Dustproof strips 6 are provided on the other side wall of the heat insulation shell 2, and several dustproof strips 6 are evenly arranged in an array along the width direction of the heat insulation shell 2. Multiple electric fans 20 are fixedly connected to the side wall of the partition 19. The electric fans 20 draw in hot air from the central shell 1 and exhaust it, thereby reducing the internal temperature of the central shell 1.
[0051] Two mounting plates 3 are fixedly connected to the outer sides of the bottom walls on both sides of the central housing 1, and the central housing 1 is installed on the vehicle through the mounting plates 3.
[0052] The distance that the docking housing 4 can be pulled out is equal to the distance that the guide block 8 moves within the guide frame 7, thereby limiting the moving distance of the docking housing 4 and preventing the docking housing 4 from traveling too far and falling out of the central housing 1.
[0053] The working process of the technical solution provided by this invention is as follows:
[0054] In use, firstly, the automotive chip body 24 is placed into the docking housing 4, and then the docking housing 4 is pushed into the central housing 1. During this process, the extrusion groove 21 extrudes the extrusion block 22 on the outside of the docking housing 4, thereby causing the extrusion block 22 to drive the anti-slip pad 23 to clamp and fix the automotive chip body 24 on both sides. At the same time, the guide frame 7 moves synchronously, thereby limiting the guide block 8. The guide block 8, the lifting frame 9, and the guide cylinder 15 are simultaneously pulled towards the center of the central housing 1. During this process, the guide cylinder 15 drives the strong spring 14 to pull the automotive chip body... The outer wall of the 24 is pressed with a heat-conducting pressing plate 10, so that the upper and lower heat-conducting pressing plates 10 are respectively attached to the upper and lower sides of the automotive chip body 24. The heat on the automotive chip body 24 is transferred to the heat-conducting cylinder 16 through the heat-conducting sliding rod 11 on the heat-conducting pressing plate 10. At the same time, the heat is transferred to the heat sink 17 and the heat sink 18 through the heat sink 16 for heat dissipation. During the process, the hot air inside the central housing 1 is extracted through the partition 19, and the cold air is replenished into the central housing 1 through the dustproof strip 6, so as to achieve simultaneous cooling of the interior of the central housing 1 and the heat sink 17 and the heat sink 18.
[0055] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one, etc." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0056] This invention encompasses any substitutions, modifications, equivalent methods, and solutions made within the spirit and scope of this invention. To provide the public with a thorough understanding of this invention, specific details are described in detail in the following preferred embodiments; however, those skilled in the art will fully understand the invention even without these details. Furthermore, to avoid unnecessary misunderstanding of the essence of this invention, well-known methods, processes, procedures, components, and circuits are not described in detail.
[0057] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.
Claims
1. A quick-installation and fixing connection structure for automotive chips, comprising a central housing, characterized in that, It also includes a limiting component, a heat insulation shell at the top and bottom of the central shell, extrusion grooves on the inner walls of both sides of the central shell, and a storage component in the center of the central shell for placing and storing the automotive chip body; a contact copper piece is provided on the side wall of one end of the automotive chip body, and a contact copper piece is provided on the inner wall of one end of the central shell; the two contact copper pieces are positioned correspondingly and support mutual contact. The storage component includes a docking shell slidably connected to the central shell. Clamping components are provided on the outer side walls of both sides of the docking shell. The clamping components are used to clamp and limit the two sides of the automotive chip body. Guide frames are provided at the top and bottom of both sides of the docking shell. The limiting components include guide blocks. Each guide frame has a guide block slidably connected in it. The guide frame has an inclination in the vertical direction. Through the guide frame, the two guide blocks on the same side can move closer or further apart in the vertical direction. A lifting frame is connected between two guide blocks on the same horizontal plane. A strong spring is provided on one side of the lifting frame. A heat transfer component is provided at the bottom of the strong spring. The heat transfer component is connected to a heat dissipation component through a heat conduction cylinder. A ventilation component is provided on the side wall of the heat insulation shell.
2. The automotive chip quick-installation and fixing connection structure according to claim 1, characterized in that, A handle groove is provided on the outer wall of one end of the docking housing. There are two sets of heat transfer components and two sets of heat dissipation components. The automotive chip body is located between the two sets of heat transfer components.
3. The automotive chip quick-installation and fixing connection structure according to claim 1, characterized in that, The clamping assembly includes two extrusion blocks. Two extrusion blocks are respectively provided on the two side walls of the mating housing. Anti-slip pads are fixedly connected to the opposite side of the extrusion blocks. The automotive chip body is located between the two anti-slip pads. The extrusion blocks are slidably connected to the extrusion groove. The extrusion groove has an inclination in the horizontal direction. When the two extrusion blocks slide along the extrusion groove, they move closer to each other.
4. The automotive chip quick-installation and fixing connection structure according to claim 2, characterized in that, The lifting frame is fixedly connected to a guide cylinder at its center, and a strong spring is installed inside the guide cylinder. Four heat insulation cylinders are fixedly connected to the four corners of the top wall of the lifting frame.
5. The automotive chip quick-installation and fixing connection structure according to claim 4, characterized in that, The heat transfer assembly includes a guide column. One end of the guide column is connected to the inner wall of the guide cylinder by a strong spring. The other end of the guide column is fixedly connected to a heat-conducting pressing plate. The heat-conducting pressing plate is located at the bottom of the lifting frame. Four heat-conducting sliding rods are fixedly connected to the four corners of the heat-conducting pressing plate. Each heat-conducting sliding rod passes through the lifting frame and slides inside the corresponding heat insulation cylinder.
6. The automotive chip quick-installation and fixing connection structure according to claim 5, characterized in that, The heat dissipation assembly includes a heat dissipation plate, which is fixedly connected to the inner wall of the heat insulation shell. Heat conduction cylinders are provided at the four corners of the bottom of the heat dissipation plate, and heat dissipation fins are fixedly connected to both ends of the heat dissipation plate.
7. The automotive chip quick-installation and fixing connection structure according to claim 6, characterized in that, The heat-conducting cylinder has a through groove, and the heat-conducting slide rod is slidably connected to the heat-conducting cylinder through the through groove.
8. The automotive chip quick-installation and fixing connection structure according to claim 1, characterized in that, The ventilation assembly includes a partition plate, which is fixedly connected to one side wall of the heat insulation shell. The other side wall of the heat insulation shell is open and equipped with a dustproof strip. Several dustproof strips are evenly arranged in an array along the width direction of the heat insulation shell. Multiple electric fans are fixedly connected to the partition plate. The heat insulation shell communicates with the outside world through the opening in the side wall of the heat insulation shell.
9. The automotive chip quick-installation and fixing connection structure according to claim 1, characterized in that, Two mounting plates are fixedly connected to the outer sides of the bottom walls on both sides of the central housing, and the central housing is installed onto the vehicle through the mounting plates.
10. The automotive chip quick-installation and fixing connection structure according to claim 3, characterized in that, The distance that the docking housing can be pulled out is equal to the distance that the guide block moves within the guide frame.