Inverter and energy storage system comprising an inverter

Abstract

The present invention provides an inverter and an energy storage system including the inverter. The inverter includes a main housing, a heat sink housing covering one side of the main housing and having a plurality of heat sinks, and a circuit board unit disposed in an internal space defined by an assembly of the main housing and the heat sink housing. The circuit board unit has at least one circuit board configured for mutual conversion between DC power and AC power. The heat sink housing includes a support block that protrudes toward the internal space, and the circuit board is disposed on the support block.

Description

Technical Field

[0001] This disclosure relates to an inverter and an energy storage system including the inverter. Background Technology

[0002] Generally speaking, an inverter is a device that converts direct current (DC) generated by an electrical power generation device (such as a solar panel) into alternating current (AC) and stores the electrical energy in a battery that serves as an energy storage device. It can also supply AC power to household appliances that consume AC power and the power grid, and maintain power quality by regulating the output voltage and frequency.

[0003] Inverters can be used as standalone devices connected to solar panels, the power grid, etc., but they can also be integrated with other external devices, such as energy storage systems (ESS), to serve as an integrated solution. This configuration can improve the efficiency of power conversion and storage. Summary of the Invention

[0004] This disclosure provides an inverter capable of effectively dissipating internal heat, and an energy storage system including the inverter.

[0005] Additional aspects will be set forth in part in the description which follows, and in part will be obvious from the description or may be learned by practicing the embodiments set forth in this disclosure.

[0006] Embodiments of this disclosure may provide an inverter comprising: a main housing; a heat sink housing covering one side of the main housing and having a plurality of heat sinks; and a circuit board unit disposed in an internal space defined by an assembly of the main housing and the heat sink housing, the circuit board unit having at least one circuit board configured for mutual conversion between DC power and AC power, wherein the heat sink housing includes a support block projecting toward the internal space, and the circuit board is disposed on the support block.

[0007] In one embodiment, the inverter may further include a thermal pad disposed between the support block and the circuit board.

[0008] In one embodiment, the thermal pad may have elastic resilience.

[0009] In one embodiment, the height of the thermal pad can be less than the height of the support block.

[0010] In one embodiment, the inverter may further include a heating element disposed below the circuit board, and a thermal pad may be disposed between the heating element and the support block.

[0011] In one embodiment, the thermal pad may contact the support block, and the total area of ​​the thermal pad may be greater than the contact area between the thermal pad and the support block.

[0012] In one embodiment, the heat sink may further include a support protrusion extending toward and supporting the circuit board.

[0013] In one embodiment, the support protrusion may include a plurality of support protrusions arranged along the circumference of the support block.

[0014] In one embodiment, the support block may be arranged on the side of the heat sink housing opposite to the side where the heat sink is arranged.

[0015] In one embodiment, the support block can separate the circuit board from the inner surface of the heat sink housing by a predetermined distance.

[0016] Furthermore, another embodiment of this disclosure provides an energy storage system comprising: an inverter; and a storage device, wherein the inverter comprises: a main housing; a heat sink housing covering one side of the main housing and having a plurality of heat sinks; and a circuit board unit disposed in an internal space defined by an assembly of the main housing and the heat sink housing, the circuit board unit having at least one circuit board configured for mutual conversion between direct current and alternating current, the heat sink housing including a support block projecting toward the internal space, the circuit board disposed on the support block, and the inverter and the storage device being electrically connected to each other.

[0017] In one embodiment, the energy storage system may further include a thermally conductive pad disposed between the support block and the circuit board.

[0018] In one embodiment, the energy storage system may further include a heating element disposed beneath the circuit board, and a thermal pad may be disposed between the heating element and the support block.

[0019] In one embodiment, the heat sink may further include a support protrusion extending toward and supporting the circuit board.

[0020] In one embodiment, the support block may be arranged on the side of the heat sink housing opposite to the side where the heat sink is arranged.

[0021] Other aspects, features, and advantages beyond those described above will become apparent from the accompanying drawings, claims, and the following detailed description of this disclosure. Attached Figure Description

[0022] The above and other aspects, features and advantages of certain embodiments of this disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, wherein: Figure 1A block diagram of an energy storage and distribution system according to an embodiment of the present disclosure is shown schematically. Figure 2 A block diagram illustrating an energy storage system and controller according to an embodiment of the present disclosure is provided. Figure 3 A schematic diagram illustrating the coupling between an inverter and a storage device according to an embodiment of the present disclosure; Figure 4 for Figure 3 Exploded perspective view of the inverter in the diagram; Figure 5 for Figure 3 Exploded perspective view of some components; Figure 6 A rear view of an inverter according to an embodiment of this disclosure; Figure 7 For along Figure 3 A cross-sectional view taken by line III-III' in the middle; Figure 8 For along Figure 3 A cross-sectional view taken by the IV-IV' line; Figure 9 for Figure 8 An enlarged view of part A in the image. Detailed Implementation

[0023] The embodiments will now be described in detail, examples of which are shown in the accompanying drawings, wherein the same reference numerals always denote the same elements. These embodiments may take different forms and should not be construed as limited to the description set forth herein. Therefore, the embodiments are described below with reference only to the accompanying drawings to explain various aspects.

[0024] Because this disclosure allows for various variations and numerous embodiments, specific embodiments will be shown and described in detail in the accompanying drawings. The advantages and features of this disclosure, as well as methods of implementing this disclosure, will become clear from the embodiments described below in detail with reference to the accompanying drawings. However, this disclosure is not limited to the embodiments disclosed below, but can be implemented in various forms.

[0025] The embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. When describing with reference to the drawings, the same or corresponding parts will be indicated by the same reference numerals, and therefore, the description of the provided parts will be omitted.

[0026] In the following embodiments, terms such as "first" and "second" are used only to distinguish one component from another, and these components shall not be limited by these terms.

[0027] In the following embodiments, singular words also include plural meanings, provided that this does not contradict the context.

[0028] In the following embodiments, the terms “comprising,” “including,” “having,” etc., as used herein indicate the presence of the said feature or component, but do not exclude the presence or addition of one or more other features or components.

[0029] In the following embodiments, when an element such as a layer, region, or component is referred to as being "above," "in front of," "behind," or "below" another element, it may include situations where the elements are in direct contact, as well as situations where there may be intermediate elements.

[0030] For ease of description, the sizes of the components in the figures may be enlarged or reduced. For example, for ease of description, the dimensions and thicknesses of each element shown in the figures are arbitrarily provided, and therefore, this disclosure is not necessarily limited to those dimensions and thicknesses shown in the figures.

[0031] Furthermore, it should be understood that for simplification purposes, or when deemed sufficient or necessary to describe, some elements may be omitted, only a portion of the elements may be shown, or the elements may be schematically represented in the accompanying drawings.

[0032] In the following embodiments, when an element is referred to as being “connected” to another element, this may include cases where the element is directly connected as well as cases where the element is indirectly connected to other elements between the elements.

[0033] Figure 1 A block diagram of an energy storage and distribution system according to an embodiment of the present disclosure is shown schematically.

[0034] Reference Figure 1 The energy storage and distribution system 1 can convert direct current (DC) electricity generated by the power generation device 10 (such as a solar panel) into alternating current (AC) electricity and supply AC electricity to the load 40, the power grid 50, etc., or it can store the power generated by the power generation device 10 in the storage device 200 and then convert and supply the stored power as needed.

[0035] The power generation device 10 refers to a device that generates electrical energy by converting various forms of energy, and can generate electrical energy in various ways according to the type of energy.

[0036] For example, the power generation device 10 may be a solar panel that converts sunlight into electricity using solar panels. However, this disclosure is not limited thereto, and the power generation device 10 may be provided as various devices, such as wind power generation devices or hydropower generation devices.

[0037] The energy storage system 20 stores electricity generated by the power generation device 10 (e.g., a solar panel) and converts the stored DC electricity into AC electricity to supply the AC electricity to an external destination. The energy storage system 20 may include an inverter 100 and a storage device 200.

[0038] Inverter 100 can be connected to or integrated with storage device 200. Therefore, DC power generated from power generation device 10 can be stored in storage device 200 and then converted into AC power by inverter 100 as needed to supply load 40, power grid 50, etc.

[0039] However, this disclosure is not limited thereto. Within the scope of technologies capable of converting between AC and DC power from an external power source, the inverter 100 may be connected to or integrated with various components of an energy storage and distribution system, such as converters, battery management systems (BMS), or power management systems.

[0040] The controller 30 is electrically connected to the energy storage system 20 and can receive operating data from the energy storage system 20 to monitor its operating status and control its operating conditions.

[0041] In some embodiments, the controller 30 can monitor the operating status of the inverter 100 in real time. In some embodiments, the controller 30 can receive information from the inverter 100 regarding various parameters of the power generation device 10, such as total power generation or AC voltage. In some embodiments, the controller 30 can generate an alarm to notify the user when a defect or malfunction occurs during the operation of the inverter 100.

[0042] Load 40 is a general term relating to any electrical-consuming device. Examples of load 40 may include household appliances, heating and cooling systems, lighting and equipment in commercial facilities, and machinery in industrial sites. Typically, since load 40 uses AC power, the DC power introduced to charge storage device 200 is converted to AC power by inverter 100 and then supplied to load 40.

[0043] The power grid 50 can be defined as a power grid for transmitting and distributing AC electricity converted by the inverter 100 to supply AC electricity to consumers. The power grid 50 can be connected to the distribution network of a house or building to distribute electrical energy supplied from the power generation device 10 or the energy storage system 20.

[0044] According to an embodiment of the present disclosure, the energy storage and distribution system 1 may be a power grid in which electrical energy generated by the power generation device 10 enters the energy storage system 20 to be stored in the storage device 200, or the stored electrical energy is converted and supplied to the load 40 and the power grid 50 for final delivery to consumers.

[0045] Figure 2 A block diagram illustrating an energy storage system and controller according to an embodiment of the present disclosure is shown for illustrative purposes.

[0046] Reference Figure 2Multiple energy storage systems 20 may be provided, and the multiple energy storage systems are connected to each other. The number of energy storage systems 20 is not limited to a specific number, and can be configured differently depending on the installation location of the energy storage systems 20, etc. However, for the sake of convenience, the following description will focus on an embodiment in which three energy storage systems 20a, 20b, and 20c are connected to the controller.

[0047] In one embodiment, the energy storage system may include a first energy storage system 20a, a second energy storage system 20b, and a third energy storage system 20c, which may be electrically connected to each other. For example, the first energy storage system 20a, the second energy storage system 20b, and the third energy storage system 20c may be connected to each other via cables to transmit electrical signals or allow current to flow between them.

[0048] According to embodiments of the present disclosure, the controller 30 can be connected to the first energy storage system 20a, the second energy storage system 20b, and the third energy storage system 20c via wired or wireless communication.

[0049] When the controller 30 is connected to the first energy storage system 20a, the second energy storage system 20b, and the third energy storage system 20c via a wired connection, the controller 30 can connect to the storage device of any one of the first energy storage system 20a, the second energy storage system 20b, and the third energy storage system 20c, and can receive operating data from the other storage devices.

[0050] In another embodiment, the controller 30 may be connected to each of the first energy storage system 20a, the second energy storage system 20b, and the third energy storage system 20c to receive their respective operating data.

[0051] In some embodiments, the controller 30 may be wirelessly connected to the energy storage system 20 to receive operational data via wireless communication.

[0052] Because the controller 30 monitors information related to the energy storage system 20 in real time and adjusts operating conditions, it can respond immediately to problems that occur during operation and output power consumption in real time, thereby more effectively performing the process of generating, storing and distributing electrical energy.

[0053] Figure 3 This diagram illustrates the coupling between an inverter and a storage device according to an embodiment of the present disclosure.

[0054] Reference Figure 3 According to embodiments of the present disclosure, the energy storage system 20 may include an inverter 100 and a storage device 200.

[0055] Inverter 100 and storage device 200 can be electrically connected to each other via a DC connector or an AC connector (not shown). Therefore, inverter 100 can receive DC power or convert received DC power into AC power to transmit AC power to an external destination.

[0056] In other words, the inverter 100 can be electrically connected to the storage device 200 to supply power to the storage device 200, or receive power from the storage device 200 to output power to an external destination.

[0057] Inverter 100 can be coupled to storage device 200 in the vertical direction. In this specification, the term "vertical direction" can refer to the z-axis direction. Figure 3 The vertical direction and the longitudinal direction of the storage device 200.

[0058] Storage device 200 may be an electrical storage device for storing electrical energy supplied from external power generation device 10. Therefore, although storage device 200 is described as an example of an electrical storage device in this specification, this disclosure is not limited thereto, and various modifications can be made to other external devices within the scope of technology that storage device 200 can be electrically connected to inverter 100 capable of converting between DC power and AC power.

[0059] Figure 4 yes Figure 3 An exploded perspective view of the inverter.

[0060] Reference Figure 4 The inverter 100 is capable of converting between DC and AC power supplied from an external source, and may include a main housing 110, a safety cover 120, a circuit board unit 130, a heat dissipation housing 140, and a cover 150.

[0061] The main housing 110, safety cover 120, circuit board unit 130, and heat sink 140 can be coupled to each other along a first direction. In this specification, the term "first direction" may refer to the x-axis direction, and the term "second direction" may refer to the y-axis direction.

[0062] The main housing 110 can be connected to the storage device 200 via a fixing member GM. A heat sink 140 covers one side of the main housing 110 and has multiple heat sinks 143. The heat sink defines an internal space in which the circuit board unit 130 can be arranged.

[0063] In this specification, the term "internal space" may refer to the space defined by the assembly of the main housing 110 and the heat sink 140. In other words, the internal space may refer to the space surrounded by the main housing 110 and the heat sink 140.

[0064] The main housing 110 may include: a body 111 forming an interior space; and a door 112 rotatably connected to the body 111 and covering an open area of ​​the body 111.

[0065] During normal operation, door 112 can be closed to maintain the airtightness of the interior space. However, when connecting inverter 100 to another component, or when it is necessary to install or replace components arranged inside inverter 100, the operator can perform the required tasks by rotating and opening or removing door 112.

[0066] A safety cover 120 covering the circuit board unit 130 can be installed in the internal space. The safety cover 120 is arranged on one side of the circuit board unit 130 to protect multiple circuit boards from the external environment, prevent the circuit boards from being exposed to the external environment when the door 112 is opened, and reduce the possibility of inverter 100 failure and malfunction.

[0067] In some embodiments, the safety cover 120 can physically isolate components through which current flows from workers, thereby preventing electric shock accidents and improving the safety of the working environment.

[0068] The circuit board unit 130 can be arranged in the internal space and can have at least one circuit board capable of converting between DC power and AC power.

[0069] In one embodiment, the circuit board unit 130 may include a first board, a second board, a third board, and a fourth board, which are configured as circuit boards. The first board, the second board, the third board, and the fourth board may be referred to as a "circuit board" or "multiple circuit boards".

[0070] Each circuit board can be provided as a filter board, motherboard, battery management and protection system (BMPS) board, switching-mode power supply (SMPS) board, etc., and may include power semiconductors such as metal-oxide-semiconductor field-effect transistors (MOSFETs) or insulated-gate bipolar transistors (IGBTs), control circuits, sensors, printed circuit boards, etc. Here, the individual circuit boards can be stacked and arranged within an internal space, or they can be arranged spaced apart from each other on the same plane.

[0071] The motherboard MP can be arranged between the safety cover 120 and the heat sink 140. The motherboard MP supporting at least one circuit board of the circuit board unit 130 can separate the internal space.

[0072] Multiple circuit boards can be arranged on opposite sides of the motherboard MP. In other words, the circuit boards can be arranged in multiple spaces separated by the motherboard MP. Therefore, although not shown in the accompanying drawings, the circuit boards can be arranged not only in the space between the safety cover 120 and the motherboard MP, but also in the space between the motherboard MP and the heat sink 140.

[0073] Therefore, the multiple circuit boards included in the circuit board unit 130 can be stacked and arranged along a first direction within the internal space of the inverter 100 for the energy storage system.

[0074] The safety cover 120 can be fastened and secured to the motherboard MP. In other words, the safety cover 120 can be fixed in place on the motherboard MP while covering a portion of the circuit board unit.

[0075] The motherboard MP can be pre-assembled with multiple coupling members (not shown) that support the safety cover 120 and connect the motherboard MP to the safety cover 120.

[0076] In one embodiment, the coupling member can be configured as a support member that secures the safety cover 120 to the motherboard MP and evenly distributes the load of the safety cover 120 to provide a stable support structure. In another embodiment, the coupling member can be configured as a bracket designed to maintain a predetermined interval between the safety cover 120 and the motherboard MP.

[0077] The heat sink 140 can be formed to protrude along a first direction. Since the heat sink 140 is formed to protrude outward, the inner side of the protruding area is formed in the form of a concave surface, thereby providing internal space.

[0078] Reference Figure 8 At least one circuit board can be accommodated in the space surrounded by the heat sink 140 and the motherboard MP. Therefore, the multiple circuit boards included in the circuit board unit 130 can be completely surrounded by the main housing 110, the safety cover 120 and the heat sink 140.

[0079] The heat sink 140 effectively dissipates heat generated from the circuit board unit 130 within the internal space to the outside. Therefore, the heat sink 140 prevents excessive heat buildup inside the inverter 100, which could lead to performance degradation of the circuit board or defects during operation.

[0080] The cover 150 surrounds the heat sink housing 140 and is connected to the main housing 110, and can be arranged to cover the side and top surfaces of the heat sink housing 140, thereby protecting the heat sink housing 140 from external influences.

[0081] In some embodiments, the cover 150 can physically prevent users or staff from contacting the surface of the heat sink 140 (the surface of the heat sink 140 reaches a high temperature due to heat generated from the internal circuit board), thereby protecting users and staff.

[0082] The lower portion of the cover 150 can be connected to the upper surface of the storage device 200. In some embodiments, the areas corresponding to the corners of the lower portion of the cover 150 can be fastened to the storage device 200 by fastening members FM. Therefore, the inverter 100 can be securely fixed to the storage device 200.

[0083] The fastening member FM is fastened to the cover 150, and the cover 150 can be connected to the storage device 200.

[0084] Multiple fastening components FM can be provided. Some of the multiple fastening components FM can be fixed to the rear surface portion of the body 111 by welding to secure the four corners of the cover 150 to the main housing 110, and more specifically, to the body 111.

[0085] In some embodiments, other fastening members in the plurality of fastening members FM may be fixed to the storage device 200 by welding to the opposite lower portion of the cover 150 ( Figure 4 (The lower side of the middle) is fixed to the storage device 200.

[0086] Because the main housing 110 is connected to the cover 150 via fastening member FM, and the cover 150 is connected to the storage device 200, the main housing 110 can be indirectly fixed to the storage device 200.

[0087] Inverter 100 may also include a stationary component GM and a support component SM.

[0088] The fixing member GM that connects the main housing 110 to the storage device 200 can be formed to extend in the vertical direction, such that one side of the fixing member can be connected to the main housing 110 and the other side of the fixing member can be connected to the storage device 200.

[0089] Therefore, even when the door 112 is opened or removed, the fixing member GM can retain the front of the main body 111 and the storage device 200. Figure 4 The left side of the middle is fixed.

[0090] In some embodiments, when the inverter 100 and the storage device 200 are connected to each other, the fixing member GM can provide guidance so that each component can be aligned with a common center line in the vertical direction.

[0091] The support member SM is arranged between the heat dissipation housing 140 and the storage device 200. One surface of the support member SM can contact the storage device 200, and the opposite surface can contact the heat dissipation housing 140.

[0092] Therefore, the support member SM can stably support the lower portion of the heat sink housing 140 protruding in the first direction, and can space the heat sink housing 140 and the storage device 200 apart from each other by a preset interval. Multiple support members SM can be provided, and the multiple support members SM can be arranged on opposite sides of the heat sink housing 140 to distribute the weight of the heat sink housing 140, thereby providing more stable support.

[0093] The upper surface of the supporting member SM can be ( Figure 4 The upper side of the inverter 100 is masked to serve as a grounding connection between the heat dissipation housing 140 and the storage device 200. Therefore, the support member SM can physically support the inverter 100 while improving the electrical stability of the entire energy storage system 20.

[0094] Figure 5 for Figure 3 An exploded perspective view of certain components.

[0095] Reference Figure 5 The motherboard MP, daughterboard SP, and circuit board unit 130 can be arranged in the internal space between the main housing 110 and the heat sink housing 140.

[0096] The heat dissipation housing 140, which covers the main housing 110 and has an internal space, may include a first body 141 connected to the main housing 110 and a second body 142 extending from the first body 141 and arranged adjacent to the heat sink 143.

[0097] The second body 142 can be formed to protrude outward from the first body 141, thereby having an internal space. In other words, the second body 142 and the heat sink 143 can be arranged on the rear surface of the first body 141. Figure 5 (on the left side of the middle).

[0098] The motherboard MP is arranged between the main housing 110 and the heat sink 140 and supports the circuit board. The motherboard MP can separate the internal space defined by the main housing 110 and the heat sink 140.

[0099] The daughterboard SP, arranged inside the heat sink 140, can divide the internal space surrounded by the motherboard MP, the first body 141, and the second body 142. Therefore, the internal space surrounded by the main housing 110 and the heat sink 140 can be divided into a total of three spaces by the motherboard MP and the daughterboard SP.

[0100] In this specification, for ease of description, the space within the heat sink 140 surrounded by the motherboard MP and the first body 141 is defined as the first space S1, and the space surrounded by the daughterboard SP and the second body 142 is described as the second space S2. Furthermore, the space surrounded by the main housing 110 and the motherboard MP is defined as the third space S3.

[0101] The circuit board unit 130, which is arranged in an internal space and has multiple circuit boards, may include a first board 131, a second board 132, a third board 133, and a fourth board 134. Multiple circuit boards can be arranged in the internal space.

[0102] In some embodiments, the first plate 131 and the second plate 132 may be arranged in the first space S1 located inside the first body 141, the third plate 133 may be arranged in the second space S2, and the fourth plate 134 may be arranged in the third space S3.

[0103] The heat sink housing 140 may have a support block 1411 protruding toward the internal space, and the circuit board is arranged on the support block.

[0104] In this specification, the surface of the heat sink housing 140 on which the support block 1411 is arranged is defined as the inner surface IS.

[0105] Support blocks 1411 can protrude from the inner surface IS, and multiple support blocks 1411 can be arranged on the heat sink housing 140. Here, the circuit board unit 130 can be supported by multiple support blocks 1411 and can be arranged to be spaced apart from the inner surface IS by a predetermined interval.

[0106] The thermal pad TP placed between the support block 1411 and the circuit board can directly transfer the heat generated from the circuit board to the heat sink housing 140.

[0107] According to embodiments of the present disclosure, the thermal pad TP can be arranged on a plurality of support blocks 1411.

[0108] Figure 6 This is a rear view of an inverter according to an embodiment of the present disclosure.

[0109] Reference Figure 6 A heat dissipation housing 140 covering one side of the main housing 110 and having multiple heat dissipation fins 143 may include a first body 141, a second body 142 and multiple heat dissipation fins 143.

[0110] The first body 141 is connected to the main housing 110 and houses at least one circuit board. A heat sink 143 may be formed on a surface of the first body 141 opposite to the surface on which the circuit board is disposed. In some embodiments, the circuit board unit 130 may be disposed on the inner surface IS of the first body 141 forming the internal space, and the heat sink 143 may be formed on the surface opposite to the inner surface IS to protrude outward.

[0111] Therefore, the heat generated from the circuit board arranged in the internal space can be transferred through the first body 141 to the heat sink 143 and dissipated to the outside.

[0112] The second body 142, which is arranged adjacent to the heat sink 143 and has an internal space, can be formed to protrude from the first body 141 along a first direction. When the second body 142 protrudes outward, a space can be formed inside the second body 142 to accommodate an additional circuit board.

[0113] Therefore, within the inverter 100 according to an embodiment of the present disclosure, a plurality of circuit boards constituting the circuit board unit 130 can be stacked to be supported by the main board MP, the first body 141, and the second body 142.

[0114] Multiple heat sinks 143 can be set and arranged on the surface of the heat sink housing 140 to protrude outwards.

[0115] The heat sink 143 can extend vertically and can have an elongated shape. Multiple heat sinks 143 can be arranged on the heat sink housing 140, spaced apart from each other at predetermined intervals. Due to this optimized structure of the heat sink 143, the surface area of ​​the heat sink housing 140 can be maximized, and the heat dissipation efficiency can be improved.

[0116] The heat sink 143 may comprise various materials, such as metallic materials with high thermal conductivity, such as aluminum or copper. However, this disclosure is not limited thereto, and various modifications can be made to the materials within the scope of techniques that ensure high thermal conductivity and efficient heat dissipation from the interior of the heat sink housing 140.

[0117] Reference Figure 6 The connecting protrusion 1401 can be connected to the support member SM. Each connecting protrusion has a surface facing the storage device 200 and is formed from the lower part of the heat sink housing 140. Figure 6 (in the middle) is prominent.

[0118] In some embodiments, the connecting protrusion 1401 may be parallel to the following surface of the storage device 200 ( Figure 6The inverter 100 is mounted on the upper surface of the device 200. A support member SM can be arranged between the connecting protrusion 1401 and the storage device 200, which are arranged parallel to each other. One end of the support member SM can be connected to the storage device 200, and the other end of the support member SM can be connected to the connecting protrusion 1401.

[0119] The heat sink 140 can be connected to the support member SM via the connecting protrusion 1401 to be stably fixed to the storage device 200.

[0120] The connecting protrusions 1401 can be symmetrically arranged on opposite sides of the heat sink housing 140, and multiple support members SM can be provided to connect to the connecting protrusions 1401, thereby supporting the opposite sides of the heat sink housing 140.

[0121] With the connecting protrusion 1401 arranged on opposite sides of the heat sink housing 140 to support the opposite sides of the heat sink housing 140, the loads on the heat sink housing 140 and the circuit board unit 130 housed in the heat sink housing can be distributed to the opposite sides, and the risk of deformation or damage due to the load on the heat sink housing 140 can be reduced.

[0122] Furthermore, its resistance to external forces and vibrations increases, thus allowing it to maintain a stable balance.

[0123] A cover 150 surrounding the heat sink 140 and connected to the main housing 110 protects the heat sink 140 from external impacts. The cover 150 may include side covers 151 and connecting covers 152.

[0124] Side covers 151 extend along the side surface of the heat sink housing 140, and a pair of side covers 151 may be disposed on opposite side surfaces of the heat sink housing 140.

[0125] In other words, the side covers 151 can extend vertically from opposite side surfaces of the heat sink housing 140. The lower ends of the pair of side covers 151 ( Figure 7 The lower part of each part can be fastened to the storage device 200.

[0126] In this configuration, one end portion of a side cover 151 may be fastened to a fastening member FM (which is welded to the main housing 110) to connect to the main housing 110, and the opposite end portion may be fastened to another fastening member FM (which is welded to the storage device 200) to connect to the storage device 200.

[0127] A handle 1511 may be formed along one side of a side cover 151. The handle 1511 has the following structure: one surface of the side cover 151 is recessed in a first direction, and the handle may be formed by machining one surface of the side cover 151.

[0128] A handle 1511 may be formed in each of the pair of side covers 151. The pair of handles 1511 are formed in a symmetrical structure so that the operator can easily grip the cover 150 when installing and removing the inverter 100.

[0129] The cover 150 may include a connecting cover 152 that connects a pair of side covers 151 to each other. The connecting cover 152 is arranged between the side covers 151 and may extend in a second direction.

[0130] The cover 150 may have a plurality of cover holes 152h, which serve as channels between the interior and the exterior and extend in a first direction.

[0131] Multiple cover holes 152h can be arranged on the connecting cover 152 and can be spaced apart from each other on the connecting cover 152 at a predetermined interval. In some embodiments, the multiple cover holes 152h can be arranged to be spaced apart from each other in a second direction, which is the longitudinal direction of the connecting cover 152.

[0132] The cover hole 152h can be a channel through which heat dissipated from the heat sink 143 can escape. Because the multiple heat sinks 143 and the multiple cover holes 152h are arranged to be spaced apart from each other in the second direction, the heat dissipated through the heat sinks 143 can be easily dissipated to the outside through the cover holes 152h.

[0133] In addition, the cover hole 152h, which serves as a channel between the inside and outside of the cover 150, can promote air circulation between the inside and outside of the inverter 100 to prevent heat from accumulating in specific areas.

[0134] A fastening member FM having a curved shape and fastening to the cover 150 can connect the cover 150 to the storage device 200.

[0135] Multiple fastening components FM can be provided. Some of the multiple fastening components FM can be welded to the rear surface portion of the body 111 to secure the cover 150 to the body 111.

[0136] In some embodiments, a total of four fastening members FM can be welded to the rear surface portion of the body 111. The four fastening members FM can form two pairs, and these pairs can be respectively arranged on the upper portion (not shown) and the lower portion (not shown) of the body 111. Figure 6 (in the lower part of the middle).

[0137] In this configuration, the bent end and the other end of each of the two fastening members FM arranged in the lower portion of the body 111 can be connected to the cover 150 and the storage device 200, respectively. In some embodiments, the surface connecting the bent end to the other end can be welded to the rear surface portion of the body 111.

[0138] In some embodiments, some of the plurality of fastening members FM may each have an end welded to the storage device 200 and a corresponding lower end fastened to the cover 150. Figure 6 The other end of the cover (on the lower side) is used to secure the cover 150 to the storage device 100.

[0139] In other words, since the main housing 110 is connected to the cover 150 via the fastening member FM, and the cover 150 is connected to the storage device 200, the main housing 110 can be indirectly fixed to the storage device 200.

[0140] Figure 7 It is along Figure 3 The cross-sectional view taken from line III-III' in the diagram.

[0141] Reference Figure 7 Multiple circuit boards can be arranged in the first body 141. In some embodiments, the first board 131 and the second board 132 can be arranged in the first body 141.

[0142] The first plate 131 can be arranged on the inner surface IS of the heat sink housing 140 and supported by the support block 1411, while the second plate 132 can be directly supported by the sub-plate SP.

[0143] The first board 131 can be the main board of an inverter 100 capable of converting between DC and AC power, and the second board 132 can be a filter board that selectively allows signals in a specific frequency band to pass through or removes noise contained in the electrical signal to improve device performance. However, the type of each board is not limited to this, and boards with other functions can be provided as needed.

[0144] The support block 1411, which protrudes into the internal space and on which a circuit board is arranged, can be configured as a column shape with a preset cross-sectional area. Multiple support blocks 1411 can be disposed on the inner surface IS of the first body 141 and can be arranged to be spaced apart from each other.

[0145] The thermal pad TP can be disposed on the upper surface of the support block 1411. In other words, the support block 1411 can be connected to the inner surface IS of the first body 141, and the opposite side of the support block can be connected to the thermal pad TP.

[0146] The thermal pad TP placed between the support block 1411 and the circuit board can minimize the air gap between the support block 1411 and the circuit board and fill the surface irregularities between the components to maximize heat conduction efficiency.

[0147] Thermal pads (TP) can have elastic resilience. In some embodiments, thermal pads (TP) can be manufactured by mixing thermally conductive particles (such as metal oxides or nitrides) with an insulating material (such as silicone or polymers) and can be formed to be flexible.

[0148] Typically, the surface of a circuit board is not perfectly smooth, so tiny gaps may appear between the circuit board and the heat sink 140. In this case, a thermally conductive pad TP with elastic resilience and flexibility can make close contact with the irregular surface to remove air layers between the micro-gaps and maximize heat transfer efficiency.

[0149] Furthermore, although the gap between each support block 1411 and the circuit board may be inconsistent during the design and assembly of the inverter 100, the thermal pad TP according to the embodiments of the present disclosure has elastic restoring force, such that the thickness of the thermal pad is adjusted when pressure is applied to the thermal pad to fill the gap between the support block 1411 and the circuit board and stably maintain the heat transfer path.

[0150] The thermal pad TP can be arranged to contact the support block 1411, and can be configured to have a cross-sectional area larger than that of the support block 1411. In other words, the total area of ​​the thermal pad TP can be relatively larger than the contact area with the support block 1411.

[0151] Therefore, although the first board 131 is supported by the support block 1411, the first board may not directly contact the support block 1411, thus preventing electrical short circuits between the circuit board and the heat sink 140.

[0152] The heating element HE may also be disposed on the first plate 131. In some embodiments, the heating element HE may be disposed below the first plate 131 facing the thermal pad TP. The heating element HE can refer to any component disposed on the circuit board that generates heat when current flows through it. For example, the heating element HE may include power devices such as transistors or diodes, resistors, coils, transformers, integrated circuits, etc.

[0153] The heating element HE can be arranged on the support block 1411, and the thermal pad TP can be arranged between the heating element HE and the support block 1411. Therefore, the heat generated by the heating element HE can be quickly discharged to the outside of the heat sink housing 140 through the thermal pad TP and the support block 1411.

[0154] In other words, the support block 1411 can be positioned at locations corresponding to the positions of the heating element HE arranged on the circuit board. Therefore, the heating element HE can be arranged on the surface of the circuit board supported by the support block 1411.

[0155] The heat sink 140 may have a support protrusion 1412 extending toward and supporting the circuit board. The support protrusion 1412 connects the circuit board to the heat sink 140, may be cylindrical, and may be threaded to allow insertion of fastening elements (e.g., screws). In an alternative embodiment, the support protrusion 1412 may have a boss shape.

[0156] When the first plate 131 is arranged in the heat sink housing 140, the support block 1411 and the support protrusion 1412 can support the first plate 131. Here, the support protrusion 1412 and the first plate 131 can be fastened together by separate fastening elements, and the position of the first plate 131 can be fixed to the heat sink housing 140.

[0157] Multiple support protrusions 1412 can be arranged and disposed along the circumference of the support block 1411. In some embodiments, the support protrusions 1412 can be disposed along each corner of the support block 1411. In some embodiments, the support protrusions 1412 can be disposed on opposite sides of the support block 1411. Figure 7 (The upper and lower sides or the left and right sides of the middle).

[0158] However, this disclosure is not limited thereto. Within the scope of the technology that the support protrusion 1412 can extend from the inner surface IS of the heat sink housing 140 toward the internal space and fix the position of the first plate 131, various modifications can be made, such as the support protrusion 1412 being arranged along the circumference of the first plate 131.

[0159] The support protrusion 1412 can fix the position of the first plate 131 to the heat sink housing 140 and set a gap between the first plate 131 and the support block 1411 so that the thermal pad TP is squeezed at a preset compression ratio.

[0160] That is, considering the compression ratio of the thermal pad TP, the support protrusion 1412 can be designed to have a negative dimension.

[0161] In addition, the support protrusion 1412 can be used as a stop to prevent the thermal pad TP from being over-compressed beyond the preset compression ratio.

[0162] In some embodiments, when the support protrusion 1412 is arranged around the support block 1411, the thermal pad TP may receive pressure in the direction toward the inner surface IS. Therefore, the circuit board can be prevented from bending or lifting due to the expansion of the thermal pad TP caused by its elastic restoring force, and the thermal pad TP can maintain close contact with the circuit board and the support block 1411 for efficient heat transfer.

[0163] The second plate 132 can be arranged on one side of the first plate 131. Figure 7(Right side of the middle). The second plate 132 can be supported by the sub-plate SP, which separates the space inside the first body 141 and the second body 142.

[0164] Although not shown in the accompanying drawings, the second space S2 may be disposed on the lower surface of the sub-plate SP, opposite to the surface on which the second plate 132 is disposed, and the third plate 133 may be disposed in the second space S1. This will be described in detail below.

[0165] In other words, the first plate 131 and the second plate 132 can be arranged in the first space S1 surrounded by the first body 141, the motherboard MP and the daughterboard SP. Here, the first plate 31 can be arranged on the inner surface IS of the heat sink housing 140. Specifically, the first plate 31 can be supported by the support block 1411 protruding from the inner surface IS and can be fixed in place by the support protrusion 1412.

[0166] The second plate 132 can be arranged on the sub-plate SP, which divides the internal space of the heat sink 140 into a first space S1 and a second space S2. The third plate 133 can be arranged in the second space S2, which is the space between the sub-plate SP and the second body 142. Therefore, the second plate 132 and the third plate 133 can be stacked inside the heat sink 140.

[0167] Figure 8 It is along Figure 3 A cross-sectional view taken from line IV-IV'. Figure 9 yes Figure 8 A magnified view of part A.

[0168] Reference Figure 8 and Figure 9 Multiple circuit boards can be stacked in the internal space. In some embodiments, the first board 131 and the second board 132 can be arranged in a first space S1, which is a space surrounded by a first body 141, a motherboard MP and a daughterboard SP.

[0169] In some embodiments, the third plate 133 can be arranged in the second space S2, which is the space surrounded by the second body 142 and the sub-plate SP. In this case, the second plate 132 and the third plate 133 can be arranged in the upper space and lower space of the sub-plate SP, respectively.

[0170] The fourth plate 134 can be arranged in the third space S3 surrounded by the main housing 110 and the main board MP. In this case, at least a portion of the fourth plate 134 can be covered by the safety cover 120. Therefore, even when the door 112 is opened, only the safety cover 120 can be exposed to the outside and can protect the internal fourth plate 134.

[0171] In the inverter 100 according to an embodiment of the present disclosure, the internal space is divided into three spaces by arranging the main board MP and the daughter board SP in the internal space defined by the combination of the main housing 110 and the heat sink housing 140, and the space utilization inside the inverter 100 is improved by arranging circuit boards in each space.

[0172] Furthermore, by arranging a first plate 131 comprising a plurality of heating elements HE on the inner surface IS of the first body 141 having a support block 1411 on one side and a heat sink 143 on the other side, the heat generated from the heating elements HE can be effectively transferred to the heat sink housing 140 and then discharged to the outside.

[0173] The support block 1411 and the support protrusion 1412 can each have a longitudinal direction ( Figure 8 The height along the X-axis (in the image).

[0174] The height h1 of the support block 1411 can be less than the height h3 of the support protrusion 1412. Therefore, when the position of the first plate 131 is fixed inside the heat sink housing 140 by the support protrusion 1412, a gap corresponding to the height difference between the support block 1411 and the first plate 131 can be formed between the support block 1411 and the support protrusion 1412.

[0175] A thermal pad TP can be placed between the support block 1411 and the first plate 131 to fill the gap between the two components. Because the thermal pad TP transfers heat from the first plate 131 to the support block 1411, it can improve heat dissipation performance.

[0176] The height h2 of the thermal pad TP can be less than the height h1 of the support block 1411. In this case, when the support protrusion 1412 and the first plate 131 are fastened together, the thermal pad TP can be compressed at a preset compression ratio to fill the gap between the first plate 131 and the support block 1411.

[0177] In some embodiments, in order to compress the thermal pad TP at a preset compression ratio, the height h3 of the support protrusion 1412 can be designed as a negative dimension.

[0178] When the thermal pad TP is arranged between the first plate 131 and the support block 1411, and the support protrusion 1412 fixes the position of the first plate 131, the height h3 of the support protrusion 1412 can be basically the same as the sum of the height h1 of the support block 1411, the height h2 of the compressed thermal pad TP, and the height of the heating element HE.

[0179] The support block 1411 can be arranged on the side of the heat sink housing opposite to the side where the heat sink is arranged. In other words, a plurality of outwardly extending heat sinks 143 can be formed on the surface of the first body 141 opposite to the inner surface IS of the support block 1411. Therefore, the heat transferred to the heat sink housing 140 through the thermal pad TP and the support block 1411 can be immediately discharged to the outside through the heat sinks 143.

[0180] In the heat dissipation housing 140, the first plate 131, the heating element HE, the thermal pad TP, the support block 1411 and the heat sink 143 can be arranged in order from top to bottom.

[0181] The heat dissipation housing 140 may include a material with high thermal conductivity, such as a metallic material (e.g., aluminum or copper), and can effectively dissipate heat generated in the internal space to the outside.

[0182] The heat sink 140 may have a first body 141, a second body 142, and a heat sink 143. In this case, the first body 141, the second body 142, and the heat sink 143 may be integrally formed. In an alternative embodiment, the heat sink 140 may be manufactured by die casting.

[0183] The heat generated by the heating element HE arranged on the first plate 131 can be transferred to the support block 1411 via the thermal pad TP, and the heat transferred to the support plate 1411 can be discharged to the outside through the outwardly extending heat sink 143.

[0184] Here, the thermal pad TP can be arranged between the support block 1411 and the first plate 131 to transfer the heat generated from the heating element HE to the heat sink housing 140.

[0185] Here, the thermal pad TP may include a material with elastic resilience, allowing the thickness of the thermal pad to be adjusted as needed, and the thermal pad TP may be in close contact with the irregular surfaces of the first plate 131 and the support block 1411 to minimize contact thermal resistance caused by the air insulation layer and maximize heat transfer efficiency.

[0186] The support block 1411 can separate the circuit board from the inner surface IS of the heat sink housing 140 by a predetermined distance. Therefore, the circuit board and the inner surface IS can be arranged to maintain a constant distance and ensure sufficient insulation distance.

[0187] The inverter 100 according to the embodiments of the present disclosure has the effect of preventing electrical short circuits by primarily ensuring an insulation distance by physically separating the circuit board and the heat sink 140, and secondly by arranging a thermally conductive pad TP with insulating properties between the circuit board and the heat sink 140.

[0188] The heat sink housing 140 may have a second body 142 arranged adjacent to the heat sink 143 and having an internal space. Here, the internal space of the second body 142 may be a second space S2. The third plate 133 may be arranged in the second body 142.

[0189] The second body 142 may have a sub-support block 1421 protruding toward the interior space, on which the circuit board is arranged. Here, the circuit board supported by the sub-support block 1421 may be a third board 133.

[0190] Multiple sub-support blocks 1421 can be arranged in the second body 142 and can be spaced apart from each other.

[0191] A thermal pad TP can be placed between the sub-support block 1421 and the circuit board. Therefore, the heat generated by the circuit board can be effectively transferred to the sub-support block 1421.

[0192] The second body 142 may also have a sub-support protrusion 1422, which extends toward the circuit board and supports the circuit board. Multiple sub-support protrusions 1422 may be provided, and the multiple sub-support protrusions 1422 may be arranged along the circumference of the sub-support block 1421.

[0193] The heating element HE can be arranged below the circuit board, which is located in the second body 142. The thermal pad TP can be arranged between the heating element HE and the sub-support block 1421, and can contact the circuit board over an area larger than that of the heating element HE.

[0194] The sub-support block 1421, sub-support protrusion 1422 and third plate 133 in the second body 142 are basically the same as the support block 1411, support protrusion 1412 and first plate 131 in the first body 141 in terms of operation effect and arrangement relationship, so their detailed description will be omitted.

[0195] The operating principles and effects of the inverter 100 and energy storage system 20 according to embodiments of the present disclosure will be described below.

[0196] An inverter 100 according to an embodiment of the present disclosure may include a main housing 110, a safety cover 120, a circuit board unit 130, a heat sink housing 140, a cover 150, a fixing member GM, and a support member SM.

[0197] Reference Figure 4 A circuit board unit 130 having at least one circuit board can be arranged in an internal space defined by an assembly of a main housing 110 and a heat sink 140. In this case, the main board MP and the daughter board SP can be stacked in the internal space to divide the internal space into a first space S1, a second space S2, and a third space S3.

[0198] Reference Figures 7 to 9 The first board 131 and the second board 132 can be arranged in the space surrounded by the heat sink 140, the main board MP and the daughter board SP.

[0199] The first plate 131 can be arranged on the support block 1411, and can be supported by multiple support blocks 1411. The heating element HE can be arranged on the lower surface of the first plate 131. Figure 8 On the lower surface of the heating element HE, a support block 1411 is disposed on the surface. That is, the support block 1411 can be formed at a position corresponding to the position of the heating element HE.

[0200] A thermal pad TP can be disposed between a first plate 131 and a support block 1411, with a heating element HE disposed on the first plate. The thermal pad TP, which fills the gap between the first plate 131 and the support block 1411 and transfers the heat generated by the heating element HE to the heat sink housing 140, may include a material with elastic resilience.

[0201] In this configuration, the cross-sectional area of ​​the thermal pad TP can be larger than that of the support block 1411 and the heating element HE. Therefore, electrical short circuits that could occur due to the first plate 131 directly contacting the heat sink housing 140 can be prevented.

[0202] In some embodiments, the support block 1411 has a preset height, and the first plate 131 can be spaced apart from the inner surface IS by the height h1 of the support block 1411. Therefore, an insulation distance corresponding to the height h1 of the support block 1411 can be ensured between the first plate 131 and the heat sink housing 140.

[0203] Reference Figure 9 The support block 1411 can be arranged on the side opposite to the heat sink 143. In other words, the heat sink 143 and the support block 1411 can be arranged on opposite sides of the inner surface IS. Therefore, the heat transferred to the support block 1411 through the thermal pad TP can be easily discharged to the outside through the heat sink 143.

[0204] In other words, the circuit board, heating element HE, thermal pad TP, support block 1411 and heat sink 143 can be arranged along the first direction, and the heat generated by the heating element HE can be transferred through the corresponding path, thereby easily dissipating to the outside.

[0205] Reference Figure 7 The heat sink 140 may have a support protrusion 1412 extending toward the circuit board. The support protrusion 1412 may be fastened to the circuit board to position the circuit board. Here, the circuit board may receive pressure in a direction toward the inner surface IS of the heat sink 140.

[0206] The support protrusion 1412 can be arranged adjacent to the support block 1411, and multiple support protrusions 1412 can be set and arranged to surround the support block 1411. Therefore, the support protrusion 1412 can apply force to the circuit board at a position adjacent to the support block 1411, and can prevent the circuit board from bending or lifting off the support block 1411 due to the elastic restoring force of the thermal pad TP.

[0207] However, this disclosure is not limited thereto. The support protrusion 1412 may be arranged along the inner circumferential surface of the heat sink 140. Various arrangements are possible within the scope of the technology in which the circuit board and the heat sink 140 can be connected to each other.

[0208] Reference Figure 8 The heat sink 140 can be arranged adjacent to the heat sink 143 and can also have internal space. The sub-board SP can be arranged between the second body 142 and the first body 141 to divide the space into a first space S1 and a second space S2.

[0209] The second space S2 is the space surrounded by the second body 142 and the sub-plate SP, and the third plate 133 can be arranged in the second space S2. Here, the second plate 132 can be arranged on the sub-plate SP and can be supported by the sub-plate SP.

[0210] The second body 142 may have a sub-support block 1421 protruding toward the third plate 133 and a sub-support protrusion 1422 extending in the same direction as the sub-support block 1425.

[0211] The thermal pad TP can be arranged between the sub-support block 1421 and the third plate 133, and the heat generated by the heating element HE arranged on the third plate 133 can be transferred through the thermal pad TP and the sub-support block 1425 to be discharged to the outside of the heat sink housing 140.

[0212] Sub-support protrusions 1422 are connected to the third plate 133, and multiple sub-support protrusions 1422 may be disposed in the second body 142. In some embodiments, the multiple sub-support protrusions 1422 may be arranged to surround the sub-support block 1421. Like the support protrusions 1412, the sub-support protrusions 1422 can apply force to the third plate 133 in a direction toward the second body 142, so that the third plate 33 can make close contact with the sub-support block 1421 and the thermal pad TP.

[0213] In the inverter 100 according to an embodiment of the present disclosure, since the thermal pad TP is arranged between the support block 1411 inside the heat sink housing 140 and the circuit board arranged on the support block 1411, it has the effect of easily dissipating the heat generated by the circuit board to the outside.

[0214] In addition, multiple support protrusions 1412 arranged around the support block 1411 ensure close contact between the circuit board and the thermal pad TP and the support block 1411, thereby improving thermal conductivity.

[0215] Although one embodiment of this disclosure has been described above, the spirit of this disclosure is not limited to the embodiment set forth in this specification. Those skilled in the art who understand the spirit of this disclosure can readily propose other embodiments by adding, modifying or deleting components within the same spirit and scope, but these embodiments will also fall within the spirit and scope of this disclosure.

Claims

1. An inverter, comprising: main housing; A heat dissipation housing, which covers one side of the main housing and has multiple heat dissipation fins; and A circuit board unit, arranged within an internal space defined by an assembly of the main housing and the heat sink, the circuit board unit having at least one circuit board configured for mutual conversion between direct current and alternating current. The heat dissipation housing includes a support block that protrudes toward the internal space, and the circuit board is arranged on the support block.

2. The inverter according to claim 1, the inverter further comprising a thermal pad disposed between the support block and the circuit board.

3. The inverter according to claim 2, wherein, The thermal pad has elastic recovery force.

4. The inverter according to claim 2, wherein, The height of the thermal pad is less than the height of the support block.

5. The inverter according to claim 2, further comprising a heating element disposed below the circuit board. in, The thermal pad is arranged between the heating element and the support block.

6. The inverter according to claim 2, wherein, The thermal pad contacts the support block, and The total area of ​​the thermal pad is greater than the contact area between the thermal pad and the support block.

7. The inverter according to claim 1, wherein, The heat dissipation housing further includes a support protrusion that extends toward and supports the circuit board.

8. The inverter according to claim 7, wherein, The support protrusions are configured as a plurality of support protrusions arranged along the circumference of the support block.

9. The inverter according to claim 1, wherein, The support block is arranged on the side of the heat sink housing opposite to the side where the heat sink is arranged.

10. The inverter according to claim 1, wherein, The support block separates the circuit board from the inner surface of the heat sink housing by a predetermined distance.

11. An energy storage system, comprising: Inverter; and Storage device, The inverter includes: main housing; A heat dissipation housing, which covers one side of the main housing and has multiple heat dissipation fins; and A circuit board unit, arranged within an internal space defined by an assembly of the main housing and the heat sink, the circuit board unit having at least one circuit board configured for mutual conversion between direct current and alternating current. The heat dissipation housing includes a support block that protrudes toward the internal space, and the circuit board is disposed on the support block. The inverter and the storage device are electrically connected to each other.

12. The energy storage system of claim 11, further comprising a thermally conductive pad disposed between the support block and the circuit board.

13. The energy storage system of claim 12, further comprising a heating element disposed below the circuit board. in, The thermal pad is arranged between the heating element and the support block.

14. The energy storage system according to claim 11, wherein, The heat dissipation housing further includes a support protrusion that extends toward and supports the circuit board.

15. The energy storage system according to claim 11, wherein, The support block is arranged on the side of the heat sink housing opposite to the side where the heat sink is arranged.

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