A loading control method and device of a semiconductor processing equipment and a storage medium

Abstract

This application relates to the field of semiconductor processing technology, and more particularly to a feeding control method, apparatus, and storage medium for semiconductor processing equipment. The method includes: for each semiconductor packaged workpiece located in a hopper, during the process of controlling a pushing component to push the semiconductor packaged workpiece to a workpiece conveying mechanism, determining whether the placement posture of the semiconductor packaged workpiece is a preset posture; if the placement posture of the semiconductor packaged workpiece is the preset posture, controlling the workpiece conveying mechanism to convey the semiconductor packaged workpiece to a position near the calibration stage in the semiconductor processing equipment; if the placement posture of the semiconductor packaged workpiece is not the preset posture, controlling a push-back mechanism to push the semiconductor packaged workpiece back into the hopper. This application can push abnormal workpieces back into the hopper during the front-end feeding stage of the semiconductor processing equipment, reducing downtime and improving the operational continuity of the semiconductor processing equipment.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing technology, and in particular to a feeding control method, apparatus and storage medium for semiconductor processing equipment. Background Technology

[0002] In semiconductor processing equipment, a pusher assembly is typically used to push the workpieces out of the hopper one by one. The workpieces pushed out of the hopper are then transferred one by one to the calibration table via a workpiece transfer mechanism, so that they can enter other stations in the semiconductor processing equipment, such as the cutting station and the cleaning station, to complete the loading of the workpieces on the semiconductor processing equipment.

[0003] However, sometimes the workpieces inside the material box are placed incorrectly, such as upside down or left-right reversed. After the incorrectly placed workpiece is transferred to the calibration table, it cannot be processed further. This not only causes the incorrectly placed workpiece to occupy the workstation, but also requires the workpiece to be removed from the semiconductor processing equipment before the semiconductor processing equipment can resume operation. This causes the semiconductor processing equipment to stop and jam during processing, affecting the production efficiency of the semiconductor processing equipment. Summary of the Invention

[0004] This application provides a feeding control method, apparatus, and storage medium for semiconductor processing equipment, which can intercept and push abnormally oriented workpieces back into the material box during the front-end feeding stage of the semiconductor processing equipment, thereby effectively maintaining the continuous processing sequence of qualified workpieces in the material box, significantly reducing downtime of the semiconductor processing equipment, and improving the operational continuity of the semiconductor processing equipment.

[0005] A first aspect provides a feeding control method for a semiconductor processing equipment, applied to a semiconductor processing equipment including a feeding mechanism, a workpiece conveying mechanism, and a push-back mechanism. The feeding mechanism includes a material box and a pushing component. The pushing component is used to push semiconductor packaged workpieces from the material box one by one onto the workpiece conveying mechanism. The push-back mechanism is used to push at least some of the semiconductor packaged workpieces pushed out of the material box by the pushing component back into the material box. The method includes: For each semiconductor packaged workpiece located in the material box, during the process of controlling the pusher component to push the semiconductor packaged workpiece to the workpiece conveying mechanism, it is determined whether the placement posture of the semiconductor packaged workpiece is the preset placement posture. If the semiconductor package workpiece is placed in a preset orientation, the workpiece conveying mechanism is controlled to convey the semiconductor package workpiece to the position corresponding to the calibration table in the semiconductor processing equipment. If the semiconductor package workpiece is not placed in the preset orientation, the push-back mechanism will be controlled to push the semiconductor package workpiece back into the cassette.

[0006] Optionally, a QR code label is provided on the target area of ​​the semiconductor packaged workpiece; the semiconductor processing equipment also includes a scanning module, which is used to scan and identify the area corresponding to the preset portion when the semiconductor packaged workpiece is pushed out of the cassette, wherein the target area is located on the preset portion of the semiconductor packaged workpiece when the semiconductor packaged workpiece is in a preset placement posture; for each semiconductor packaged workpiece in the cassette, during the process of controlling the pushing component to push the semiconductor packaged workpiece to the workpiece conveying mechanism, it is determined whether the placement posture of the semiconductor packaged workpiece is the preset placement posture, including: For each semiconductor packaged workpiece located in the material box, when the pusher component pushes the semiconductor packaged workpiece out of the material box from a preset part, the barcode scanning module is used to scan and identify the area corresponding to the preset part to obtain the barcode recognition result of whether the QR code label is recognized. If the scanning result shows that a QR code label has been identified, then the placement posture of the semiconductor packaged workpiece is determined to be the preset placement posture. If the QR code label is not recognized, it is determined that the placement posture of the semiconductor packaged workpiece is not the preset placement posture.

[0007] Optionally, the scanning module is used to scan and recognize the area corresponding to the preset part to obtain a scanning and recognition result indicating whether the QR code label has been recognized, including: The scanning module is controlled to perform cyclic scanning and recognition of the area corresponding to the preset part at a preset number of scans. If the scanning module obtains the QR code information corresponding to the QR code label, it determines that the scanning recognition result is that the QR code label has been recognized. If the scanning module does not obtain the QR code information corresponding to the QR code label, the supplementary light source used to supplement the scanning module's scanning recognition will be turned on, so that the scanning module can perform cyclic scanning recognition of the area corresponding to the preset part in the supplementary light state for a preset number of scans. If the scanning module obtains the QR code information corresponding to the QR code label under supplementary lighting, then the scanning recognition result is determined to be that the QR code label has been recognized. If the scanning module does not obtain the QR code information corresponding to the QR code label under supplementary lighting conditions, the scanning recognition result is determined to be that the QR code label was not recognized.

[0008] Optionally, the workpiece conveying mechanism includes a base, and a set of conveyor wheels and a conveyor belt assembly mounted on the base. The set of conveyor wheels is used to convey the semiconductor packaged workpiece pushed by the pusher assembly to the conveyor belt assembly. The conveyor belt assembly is used to convey the semiconductor packaged workpiece conveyed by the set of conveyor wheels to the position corresponding to the calibration table. If the placement posture of the semiconductor packaged workpiece is a preset placement posture, the workpiece conveying mechanism is controlled to convey the semiconductor packaged workpiece to the position corresponding to the calibration table in the semiconductor processing equipment, including: If the semiconductor package workpiece is placed in a preset orientation, the pusher assembly is controlled to push the semiconductor package workpiece onto the conveyor wheel assembly. After the portion corresponding to the target length of the semiconductor packaged workpiece is pushed onto the conveyor wheel assembly, the conveyor wheel assembly is controlled to rotate, so that the semiconductor packaged workpiece moves onto the conveyor belt assembly under the action of the conveyor wheel assembly, so that the conveyor belt assembly transports the semiconductor packaged workpiece to the position corresponding to the calibration table in the semiconductor processing equipment.

[0009] Optionally, the push-back mechanism includes a push-back component and a cylinder assembly. The push-back component has a waiting position and a push-back ready position. When the push-back component is in the waiting position, it is positioned below the semiconductor packaged workpiece. When the push-back component is in the push-back ready position, the push-back component and the side of the semiconductor packaged workpiece away from the cassette move closer to each other. The cylinder assembly is connected to the push-back component and is used to drive the push-back component to move horizontally and / or vertically. If the placement posture of the semiconductor packaged workpiece is not a preset placement posture, the push-back mechanism is controlled to push the semiconductor packaged workpiece back into the cassette, including: If the placement posture of the semiconductor packaged workpiece is not the preset placement posture, the control cylinder assembly drives the push-back component to move from the waiting position to the push-back ready position. The control cylinder assembly drives the pusher component, which is located in the push-back preparation position, to move towards the material box, so that the semiconductor package workpiece is pushed back into the material box by the pusher component; After the semiconductor packaged workpiece is pushed back into the cassette, the control cylinder assembly moves the pusher from its current position to the push-back preparation position, and then to the waiting position.

[0010] Optionally, the push-back mechanism further includes an obstruction detection module disposed on the push-back component; if the placement posture of the semiconductor packaged workpiece is not a preset placement posture, the control cylinder assembly drives the push-back component to move from the waiting position to the push-back preparation position, including: If the placement posture of the semiconductor package workpiece is not the preset placement posture, the pusher assembly is controlled to stop applying the pushing force to the semiconductor package workpiece. The occlusion detection module is used to detect the portion of the semiconductor packaged workpiece ejected from the cassette, and the duration of occlusion of the occlusion detection module by the semiconductor packaged workpiece is recorded. If the recorded occlusion duration exceeds the preset duration, the control cylinder assembly will move the push-back component from the waiting position to the push-back preparation position.

[0011] Optionally, it also includes: The number of semiconductor packaged workpieces with a preset placement orientation is counted. If the counted number is less than the number of semiconductor packaged workpieces initially placed in the hopper, a first alarm message will be issued after all semiconductor packaged workpieces with the preset placement posture have been transferred to the position corresponding to the calibration table in the semiconductor processing equipment, to remind that there are semiconductor packaged workpieces in the hopper with a placement posture that is not the preset placement posture.

[0012] Optionally, it also includes: During the process of controlling the feeding component to push the semiconductor packaged workpieces in the material box one by one to the workpiece conveying mechanism, if the placement posture of the first to the preset placement posture of the semiconductor packaged workpieces is not the preset placement posture, a second alarm message will be issued to remind the operator to check the installation of the material box.

[0013] In a second aspect, a feeding control device for a semiconductor processing equipment is provided, applied to the semiconductor processing equipment, the semiconductor processing equipment including a feeding mechanism, a workpiece conveying mechanism, and a push-back mechanism, the feeding mechanism including a material box and a pushing assembly, the pushing assembly being used to push semiconductor packaged workpieces in the material box one by one onto the workpiece conveying mechanism, the push-back mechanism being used to push back at least a portion of the semiconductor packaged workpieces located on the workpiece conveying mechanism back into the material box; the device includes: The judgment module is used to determine whether the placement posture of each semiconductor package workpiece located in the material box is a preset placement posture during the process of controlling the pusher component to push the semiconductor package workpiece to the workpiece conveying mechanism. The first control module is used to control the workpiece conveying mechanism to convey the semiconductor packaged workpiece to the position corresponding to the calibration table in the semiconductor processing equipment if the placement posture of the semiconductor packaged workpiece is a preset placement posture. The second control module is used to control the push-back mechanism to push the semiconductor packaged workpiece back into the material box if the placement posture of the semiconductor packaged workpiece is not the preset placement posture.

[0014] Thirdly, a semiconductor processing apparatus is provided, comprising: a processor and a memory for storing a computer program, the processor for calling and running the computer program stored in the memory, and performing the methods as described in the first aspect or its various implementations.

[0015] Fourthly, a computer-readable storage medium is provided for storing a computer program that causes a computer to perform the methods described in the first aspect or its various implementations.

[0016] The technical solution provided in this application determines whether the placement posture of the semiconductor packaged workpiece in the cassette is a preset posture during the process of pushing the semiconductor packaged workpiece from the cassette to the workpiece conveying mechanism by controlling the pushing component. This enables the detection of the placement posture of the semiconductor packaged workpiece before it completely leaves the cassette and enters the conveying station, thus achieving pre-detection of the placement posture. Based on whether the placement posture of the semiconductor packaged workpiece is a preset posture, the system performs diversion control on each semiconductor packaged workpiece in the cassette. This intercepts and pushes workpieces with abnormal postures back into the cassette during the front-end loading stage of the semiconductor processing equipment, preventing abnormal workpieces from occupying the back-end station (the station near the calibration table of the workpiece conveying mechanism). This effectively maintains the continuous processing sequence of qualified workpieces in the cassette by the semiconductor processing equipment, significantly reduces downtime of the semiconductor processing equipment, and improves the operational continuity of the semiconductor processing equipment.

[0017] Other features and advantages of this disclosure will be described in detail in the following detailed description section. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 An application scenario diagram provided for an embodiment of this application; Figure 2 A flowchart illustrating a material loading control method for semiconductor processing equipment provided in this application embodiment; Figure 3 This is a schematic diagram of the structure of the feeding mechanism and the workpiece conveying mechanism provided in the embodiments of this application; Figure 4 This is a schematic diagram of the workpiece conveying mechanism provided in an embodiment of this application; Figure 5 A schematic diagram of the push-back component in the waiting position provided in an embodiment of this application; Figure 6 A schematic diagram of the push-back component in the push-back preparation position provided in an embodiment of this application; Figure 7 A schematic diagram of the push-back mechanism provided in the embodiments of this application; Figure 8 A schematic diagram of a loading control device for semiconductor processing equipment provided in this application embodiment; Figure 9 A schematic block diagram of a semiconductor processing apparatus provided in an embodiment of this application. Detailed Implementation

[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0021] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or server that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or devices.

[0022] In semiconductor processing equipment, especially dicing machines, a pusher assembly typically pushes workpieces out of the hopper one by one. The workpieces are then transferred to a calibration table via a workpiece transfer mechanism to enter other stations within the semiconductor processing equipment, such as the dicing and cleaning stations, thus completing the loading of workpieces onto the equipment. However, workpieces inside the hopper sometimes have incorrect orientations, such as being upside down or placed incorrectly. This prevents further processing after the incorrectly positioned workpiece is transferred to the calibration table. Not only does the incorrectly positioned workpiece occupy the calibration table, but it also needs to be removed from the semiconductor processing equipment to resume operation, affecting the continuous processing cycle and ultimately impacting the production efficiency of the semiconductor processing equipment.

[0023] To address at least one of the technical problems existing in the prior art or related technologies, this invention provides a feeding control method, apparatus, and storage medium for semiconductor processing equipment. The method includes: for each semiconductor packaged workpiece located in a hopper, during the process of controlling a pushing component to push the semiconductor packaged workpiece to a workpiece conveying mechanism, determining whether the placement posture of the semiconductor packaged workpiece is a preset placement posture; if the placement posture of the semiconductor packaged workpiece is the preset placement posture, controlling the workpiece conveying mechanism to convey the semiconductor packaged workpiece to a position near the calibration stage in the semiconductor processing equipment; if the placement posture of the semiconductor packaged workpiece is not the preset placement posture, controlling a push-back mechanism to push the semiconductor packaged workpiece back into the hopper. This application can push abnormal workpieces back into the hopper during the front-end feeding stage of the semiconductor processing equipment, reducing downtime and improving the operational continuity of the semiconductor processing equipment.

[0024] It should be understood that the technical solution of this application can be applied to the following scenarios, but is not limited to: In some possible ways, Figure 1 An application scenario diagram provided for an embodiment of this application, such as... Figure 1 As shown, this application scenario may include semiconductor processing equipment 110 and network device 120. Semiconductor processing equipment 110 can establish a connection with network device 120 via a wired network or a wireless network.

[0025] For example, the semiconductor processing equipment 110 can be a dicing machine or a cutting machine, but is not limited thereto. The network device 120 can be a terminal device or a server, but is not limited thereto. In one embodiment of this application, the semiconductor processing equipment 110 can send a request message to the network device 120, which can be used to request a determination of whether the placement posture of the semiconductor packaged workpiece is a preset placement posture. Further, the semiconductor processing equipment 110 can receive a response message sent by the network device 120, which includes a determination of whether the placement posture of the semiconductor packaged workpiece is a preset placement posture.

[0026] also, Figure 1 An exemplary semiconductor processing apparatus 110 and a network device 120 are provided, but other numbers of semiconductor processing apparatuses and network devices may be included in practice, and this application is not limited thereto.

[0027] In other possible implementations, the technical solution of this application may also be executed by the aforementioned semiconductor processing equipment 110, or by the aforementioned network equipment 120, and this application does not impose any restrictions on this.

[0028] After introducing the application scenarios of the embodiments of this application, the technical solution of this application will be described in detail below: Figure 2 The flowchart illustrates a method for controlling the loading of semiconductor processing equipment, as provided in this application embodiment, and can be implemented by, for example... Figure 1 The semiconductor processing apparatus 110 shown is used for execution, but is not limited to this. This method, applied to a semiconductor processing apparatus, may include the following steps: S210. For each semiconductor packaged workpiece located in the material box, during the process of controlling the pusher assembly to push the semiconductor packaged workpiece to the workpiece conveying mechanism, it is determined whether the placement posture of the semiconductor packaged workpiece is the preset placement posture.

[0029] Here, the placement posture can include the front and back orientation posture and the left and right orientation posture. The front and back orientation posture includes the front-facing posture and the back-facing posture. The left and right orientation posture includes the left and right placement postures of the two sides of the semiconductor package workpiece relative to the axis of the material box. The preset placement posture can be the posture of the left and right sides of the semiconductor package workpiece relative to the axis of the material box, which is: the preset placement posture is the posture of the semiconductor package workpiece being placed with its right side on the right side of the axis of the material box and the left side of the semiconductor package workpiece being on the left side of the axis of the material box.

[0030] See Figure 3 The semiconductor processing equipment includes a loading mechanism 1, a workpiece conveying mechanism 2, and a push-back mechanism 3. The loading mechanism 1 includes a material box 101 and a pushing component. The pushing component is used to push the semiconductor packaged workpieces in the material box 101 one by one onto the workpiece conveying mechanism 2. The push-back mechanism 3 is used to push at least a portion of the semiconductor packaged workpieces pushed out of the material box 101 by the pushing component back into the material box 101. Here, "at least a portion" can be a preset portion in subsequent steps.

[0031] The material box 101 has two open ends, and two opposite inner sidewalls of the material box 101 are provided with mounting grooves. The mounting grooves are used to fix the semiconductor packaged workpieces. One end of the material box 101 is located near the workpiece conveying mechanism 2, and the pushing component is located near the other end of the material box 101. The axis of the material box 101 and the axis of the workpiece conveying mechanism 2 are on the same straight line, so as to push the semiconductor packaged workpieces in the material box 101 onto the workpiece conveying mechanism 2 through the pushing component.

[0032] In addition, the feeding mechanism 1 also includes a lifting component 102. The material box 101 is detachably mounted on the lifting component 102. The lifting component 102 is used to move the material box 101 along the Y-axis to adjust the height of the material box 101. Before the semiconductor packaged workpiece in the material box 101 is pushed into the workpiece conveying mechanism 2 by the pushing component, the height of the material box 101 can be adjusted by the lifting component 102 until the height of the semiconductor packaged workpiece to be pushed into the workpiece conveying mechanism 2 in the material box 101 matches the height of the pushing component. Then, the height adjustment of the material box 101 by the lifting component 102 is stopped. Then, the semiconductor packaged workpiece is pushed towards the workpiece conveying mechanism 2 by the pushing component.

[0033] To address the problem in existing semiconductor processing equipment, especially dicing machines, that lacks a pre-inspection process for semiconductor packaged workpieces, resulting in abnormal workpieces only being identified after being directly pushed to the back-end station, this step addresses this issue. Specifically, for each semiconductor packaged workpiece inside the cassette, the pushing action of the pushing component is monitored in real time. During the process of the workpiece moving from the cassette to the workpiece conveyor, the placement posture (orientation and orientation) of the workpiece is compared with a preset placement posture (compliant processing posture). This ensures the compliance of the workpiece's posture between the cassette and the conveyor, thus bringing the detection of the workpiece's placement posture forward. The posture determination is completed during the transition from pushing the workpiece from the cassette to the conveyor, controlling the quality of the workpieces from the source of the semiconductor processing equipment.

[0034] S220. If the placement posture of the semiconductor package workpiece is a preset placement posture, control the workpiece conveying mechanism to convey the semiconductor package workpiece to the position corresponding to the calibration stage in the semiconductor processing equipment.

[0035] When the placement posture of the semiconductor packaged workpiece is determined to be the preset placement posture, that is, when the front and back orientation and left and right orientation of the semiconductor packaged workpiece are in accordance with the preset placement posture, it can be determined that the semiconductor packaged workpiece is a workpiece that can enter the calibration table. At this time, the workpiece conveying mechanism can be started to smoothly and accurately transport the semiconductor packaged workpiece to the position corresponding to the calibration table. Then, the robot arm is used to move the semiconductor packaged workpiece to the calibration table for subsequent calibration processes.

[0036] In this step, after determining the placement posture of the semiconductor packaged workpiece to be the preset placement posture, the original normal conveying steps are retained. That is, the workpiece conveying mechanism is controlled to convey the semiconductor packaged workpiece to the position corresponding to the calibration table in the semiconductor processing equipment. This improves the processing efficiency of the semiconductor processing equipment for the semiconductor packaged workpiece. It can be seen that this step can achieve normal processing of qualified workpieces without adding an additional conveying step for qualified workpieces. This allows the semiconductor processing equipment to perform both workpiece inspection and screening and normal processing of the semiconductor packaged workpieces.

[0037] S230. If the placement posture of the semiconductor package workpiece is not the preset placement posture, control the push-back mechanism to push the semiconductor package workpiece back into the material box.

[0038] Here, the push-back mechanism pushes the semiconductor packaged workpiece back into the cassette. This can be understood as controlling the push-back mechanism to push the semiconductor packaged workpiece back into the cassette along the path that the pusher component pushed the semiconductor packaged workpiece out of.

[0039] When it is determined that the placement posture of the semiconductor packaged workpiece is not the preset placement posture, it is considered that the placement posture of the semiconductor packaged workpiece is abnormal. When there are problems such as being upside down or having the left and right reversed, the semiconductor packaged workpiece can be determined to be an abnormal workpiece. At this time, the push-back mechanism can be activated to push the semiconductor packaged workpiece in the opposite direction before it is completely removed from the material box and enters the conveying station, so that it returns to the material box for storage, thereby preventing the semiconductor packaged workpiece from continuing to flow to the station located at the rear end of the workpiece conveying mechanism.

[0040] In this step, after determining that the placement posture of the semiconductor packaged workpiece is not the preset placement posture, the push-back mechanism is controlled to push the semiconductor packaged workpiece back into the material box. This achieves the goal of pushing the semiconductor packaged workpiece back into the material box for storage before it completely leaves the material box and enters the transfer station, solving the problem in the prior art where abnormal workpieces occupy the calibration table and need to be removed separately. At the same time, after all qualified workpieces in the material box have been loaded, the abnormal workpieces pushed back into the material box can be uniformly corrected and reloaded, avoiding the scattering and damage of semiconductor packaged workpieces and further reducing the loss of semiconductor packaged workpieces.

[0041] Using the above method, during the process of pushing the semiconductor packaged workpieces in the cassette to the workpiece conveying mechanism by controlling the pushing component, it is determined whether the placement posture of the semiconductor packaged workpiece is a preset placement posture. This achieves the detection of the placement posture of the semiconductor packaged workpiece before it completely leaves the cassette and enters the workpiece conveying mechanism, thus realizing pre-detection of the placement posture of the semiconductor packaged workpieces. Based on whether the placement posture of the semiconductor packaged workpiece is a preset placement posture, the flow control of each semiconductor packaged workpiece in the cassette is performed. That is, when it is determined that the placement posture of the semiconductor packaged workpiece is a preset placement posture, the workpiece conveying mechanism is controlled to push the semiconductor packaged workpieces into the workpiece conveying mechanism. The packaged workpiece is conveyed to the position corresponding to the calibration table in the semiconductor processing equipment. When the placement posture of the semiconductor packaged workpiece is not the preset placement posture, the push-back mechanism is controlled to push the semiconductor packaged workpiece back into the material box. In order to intercept the workpiece with abnormal posture and push it back into the material box in the front-end loading stage of the semiconductor processing equipment, it can avoid the abnormal workpiece occupying the back-end station (the station of the workpiece conveying mechanism near the calibration table). Without stopping the machine to remove the abnormal workpiece, it can effectively maintain the continuous processing sequence of qualified workpieces in the material box of the semiconductor processing equipment, greatly reduce the downtime of the semiconductor processing equipment, and improve the operational continuity of the semiconductor processing equipment.

[0042] In some possible embodiments, a QR code label is provided on the target area of ​​the semiconductor package workpiece; the semiconductor processing equipment also includes a scanning module, which is used to scan and identify the area corresponding to the preset part when the semiconductor package workpiece is pushed out of the material box, wherein the target area is located on the preset part of the semiconductor package workpiece when the semiconductor package workpiece is in a preset placement posture.

[0043] The semiconductor packaged workpiece can be rectangular. A QR code label can be printed or affixed to a target area on a predetermined portion of the semiconductor packaged workpiece. The scanning module can be a barcode scanner, which can be used to perform targeted scanning and identification of the predetermined portion of the semiconductor packaged workpiece during its ejection from the cassette.

[0044] It should be noted that, when the semiconductor packaged workpiece is in a preset placement posture, the target area with the QR code label will be located on the preset part of the semiconductor packaged workpiece extending from the material box when the workpiece is pushed out of the material box. Only then can the scanning module scan the QR code label located on the preset part at this time. However, when the semiconductor packaged workpiece is not in a preset placement posture, that is, when the front and back of the semiconductor packaged workpiece are reversed and the left and right positions are reversed, the target area with the QR code label will not be located on the preset part of the semiconductor packaged workpiece extending from the material box, and the scanning module will not be able to scan the QR code label located on the preset part at this time.

[0045] Accordingly, for each semiconductor package workpiece located in the hopper, during the process of controlling the pusher assembly to push the semiconductor package workpiece to the workpiece conveying mechanism, determining whether the placement posture of the semiconductor package workpiece is the preset placement posture may include the following steps: S310. For each semiconductor packaged workpiece located in the material box, when the pusher component pushes the semiconductor packaged workpiece out of the material box from the preset part, the barcode scanning module is used to scan and identify the area corresponding to the preset part to obtain the barcode recognition result of whether the QR code label is recognized.

[0046] When the pusher component performs the pushing action and pushes the semiconductor packaged workpiece out of the box to a preset part (the semiconductor packaged workpiece is not completely removed from the box and is in a semi-pull-out state), the barcode scanning module scans the area corresponding to the preset part of the semiconductor packaged workpiece currently exposed in the box to identify whether a QR code label can be scanned in the area corresponding to the preset part, and finally generates two types of scanning results: "QR code label identified" or "QR code label not identified".

[0047] In this step, by setting the barcode scanning detection of the semiconductor packaged workpiece at the stage when the workpiece is partially pushed out of the cassette, the placement posture detection node of the semiconductor packaged workpiece is moved forward. At the same time, by using the barcode scanning module to perform fixed-point barcode scanning and recognition on the preset parts of the semiconductor packaged workpiece, not only is rapid barcode scanning and recognition of the preset parts of the semiconductor packaged workpiece achieved, but also the problems of traditional semiconductor packaged workpiece placement posture detection, such as human visual misjudgment, complex visual recognition algorithms, and susceptibility to light interference, are avoided. This provides accurate and objective recognition data for semiconductor packaged workpiece posture determination.

[0048] S320. If the scanning result shows that a QR code label has been identified, then the placement posture of the semiconductor packaged workpiece is determined to be the preset placement posture.

[0049] Since the target area with the QR code label will only be the preset placement posture when the semiconductor packaged workpiece is placed in the preset posture, that is, when the placement direction, front and back, and left and right positions of the semiconductor packaged workpiece are completely standard, the scanning module can determine that the current placement posture of the semiconductor packaged workpiece is the preset placement posture, that is, its placement position is not offset and its orientation is correct. The placement posture of the semiconductor packaged workpiece meets the processing requirements and is judged as a qualified workpiece.

[0050] In this step, by using the recognition result of the QR code label as the criterion for determining whether the placement posture is qualified, the placement posture of the semiconductor packaged workpiece can be quickly and accurately determined to meet the processing requirements without relying on complex vision algorithms.

[0051] S330. If the scanning result is that the QR code label is not recognized, then it is determined that the placement posture of the semiconductor packaged workpiece is not the preset placement posture.

[0052] If the semiconductor package workpiece is not placed in the preset orientation, such as being upside down or having its left and right orientations reversed, the target area with the QR code label will be located inside the material box or facing away from the scanning module. This will prevent the QR code label from being in the corresponding detection area of ​​the scanning module, thus causing the scanning module to fail to capture the QR code label and generate an unrecognized result. In this case, it can be determined that the semiconductor package workpiece is not placed in the preset orientation, which is an abnormal orientation and an abnormal workpiece.

[0053] In this step, by using the result of scanning the code and identifying that the QR code label was not recognized as the criterion for determining that the placement posture is unqualified, the placement posture of the semiconductor packaged workpiece can be quickly and accurately determined without relying on complex vision algorithms.

[0054] Using the above method, only a common barcode scanning module needs to be added to the existing semiconductor processing equipment to scan and identify the barcode on the preset part of the semiconductor packaged workpiece after it is pushed out of the material box. When the barcode scanning result shows that the QR code label is recognized, the placement posture of the semiconductor packaged workpiece is determined to be the preset placement posture. When the barcode scanning result shows that the QR code label is not recognized, the placement posture of the semiconductor packaged workpiece is determined to be different from the preset placement posture. This achieves the goal of using the QR code label as the sole physical determination criterion, unifying the determination standard for the placement posture of the semiconductor packaged workpiece. Not only is there no possibility of human judgment error, but its recognition logic is also simple and clear, requiring no complex image processing algorithms, and the requirements for chip computing power and hardware configuration are relatively low.

[0055] Furthermore, using a scanning module to scan and recognize the area corresponding to the preset part to obtain a scanning and recognition result indicating whether the QR code label has been recognized can include the following steps: S410: Control the scanning module to perform cyclic scanning and recognition of the area corresponding to the preset part by a preset number of scans.

[0056] When the pusher pushes the semiconductor packaged workpiece out of the preset part and into the scanning module's barcode detection station, by pre-setting a fixed number of scans, the barcode scanning module is controlled to continuously and cyclically scan the area corresponding to the preset part of the exposed semiconductor packaged workpiece multiple times. This can reduce the recognition error caused by accidental environmental interference to the scanning module and improve the stability of the scanning module's barcode label scanning and recognition under normal conditions.

[0057] In this step, the scanning module is controlled to perform cyclic scanning and recognition of the area corresponding to the preset part by a preset number of scans. This can effectively avoid the occasional scanning failure caused by instantaneous shaking of semiconductor packaged workpieces, slight dust, and brief light fluctuations, and improve the accuracy of scanning and recognizing QR code labels under normal working conditions.

[0058] S420. If the scanning module obtains the QR code information corresponding to the QR code label, then the scanning recognition result is determined to be that the QR code label has been recognized.

[0059] Here, during the process of scanning the corresponding area of ​​the preset part a preset number of times, as long as the scanning module successfully collects the pattern corresponding to the QR code label and parses and obtains the QR code information inside the QR code label once, the scanning result can be directly determined as the QR code label being recognized.

[0060] This step allows for the rapid identification and determination of semiconductor packaged workpieces in a well-ventilated, unobstructed environment, with a preset placement orientation.

[0061] S430. If the scanning module does not obtain the QR code information corresponding to the QR code label, the supplementary light source used to supplement the scanning module's scanning recognition is turned on, so that the scanning module can perform cyclic scanning recognition of the area corresponding to the preset part in the supplementary light state for a preset number of scans.

[0062] Here, the supplementary light source is used to provide supplementary lighting for the barcode scanning module. It can be turned on when the light is dim, reflective, or obstructed by dust, thus optimizing the scanning and recognition shooting environment of the barcode scanning module.

[0063] If the scanning module fails to collect valid QR code information corresponding to the QR code label after performing a preset number of scans on the corresponding area, it does not directly determine that the semiconductor packaged workpiece has an abnormal posture. Instead, it activates a supplementary light source to provide directional supplementary lighting to the scanning detection area of ​​the scanning module to eliminate scanning interference caused by dim light, shadows, workpiece reflections, and dust cover. After the supplementary lighting is completed, the scanning module performs a second round of cyclic scanning on the preset area with the same preset number of scans.

[0064] In this step, semiconductor packaged workpieces that fail to scan on the first attempt are not directly judged as abnormal. Instead, a supplementary light verification mechanism is added to optimize the lighting conditions of the scanning detection area corresponding to the scanning module. After eliminating environmental interference such as dim light, reflection, and shadow, a second cycle of scanning is performed to distinguish whether the cause of the initial scanning failure is an environmental fault or a workpiece posture fault, thereby significantly reducing the misjudgment rate of abnormal workpiece placement.

[0065] S440. If the scanning module obtains the QR code information corresponding to the QR code label under supplementary lighting, then the scanning recognition result is determined to be that the QR code label has been recognized.

[0066] Under illumination conditions with the supplementary light source on, during the second round of cyclic scanning of the area corresponding to the preset part, if the scanning module successfully parses the QR code information corresponding to the QR code label, the scanning is considered successful and the recognition result is that the QR code label is detected. This indicates that the placement and orientation of the semiconductor packaged workpiece are normal, and it is a qualified workpiece that can be processed normally.

[0067] In this step, for harsh working conditions such as low light, backlight, and workpiece surface reflection, supplemental lighting can be applied to the barcode scanning module to enable semiconductor packaged workpieces that were originally unrecognizable but are now in the preset placement position to successfully pass the inspection, avoiding unnecessary workpiece retraction and thus ensuring continuous material feeding.

[0068] S450. If the scanning module does not obtain the QR code information corresponding to the QR code label under supplementary lighting, the scanning recognition result is determined to be that the QR code label was not recognized.

[0069] After the two rounds of recognition processes, namely the normal cycle scanning in step S410 and the supplementary light cycle scanning in step S430, are completed, if the scanning module still cannot obtain the QR code information corresponding to the QR code label, then environmental interference such as light, dust, and shaking is excluded, and it can be determined that the QR code label itself is not in the scanning detection area. Finally, the scanning result is determined to be that the QR code label is not recognized, and the placement posture of the semiconductor packaged workpiece is not the preset placement posture.

[0070] In this step, after multiple scans and verifications of the preset portion of the semiconductor packaged workpiece in steps S410 and S430, the results of the abnormal placement posture of the semiconductor packaged workpiece are not only accurate, but also free from subjective judgment bias. This ensures that the abnormal workpieces finally selected are all genuinely misplaced workpieces, providing a precise execution basis for the push-back mechanism.

[0071] Using the above method, a two-layer recognition approach of "normal multiple-cycle scanning + supplementary light secondary-cycle scanning" is adopted for the area corresponding to the preset part of the semiconductor packaged workpiece. This approach can distinguish between scanning failures caused by abnormal actual posture and environmental interference, thereby avoiding misjudgment of semiconductor packaged workpieces with preset placement posture caused by environmental factors.

[0072] In some possible implementations, such as Figure 3 and Figure 4 As shown, the workpiece conveying mechanism 2 includes a base 201, a conveyor wheel assembly 202 and a conveyor belt assembly 203 mounted on the base 201. The conveyor wheel assembly 202 is used to convey the semiconductor packaged workpiece pushed by the pusher assembly to the conveyor belt assembly 203. The conveyor belt assembly 203 is used to convey the semiconductor packaged workpiece conveyed by the conveyor wheel assembly 202 to the corresponding position on the calibration table.

[0073] The conveyor belt assembly 203 includes a drive wheel set 2031 and a conveyor belt 2032 mounted on a base. The conveyor belt 2032 is connected to the drive wheel set 2031 for transmission. The drive wheel set 2031 drives the conveyor belt 2032 to rotate, so that the semiconductor packaged workpieces located on the conveyor belt 2032 move from inside the material box 101 to a position close to the calibration table. The length direction of the conveyor belt 2032 is parallel to the axial direction of the material box 101.

[0074] Here, the conveyor wheel assembly 202 may include a first conveyor wheel 2021 and a second conveyor wheel 2022. The second conveyor wheel 2022 is located below the first conveyor wheel 2021, and the gap between the first conveyor wheel 2021 and the second conveyor wheel 2022 corresponds to the upper surface of the conveyor belt 2032. When the pusher assembly pushes the semiconductor packaged workpiece from the material box 101 to the workpiece conveying mechanism 2, one end of the semiconductor packaged workpiece near the workpiece conveying mechanism 2 extends into the gap between the first conveyor wheel 2021 and the second conveyor wheel 2022. By controlling the rotation of the first conveyor wheel 2021 and the second conveyor wheel 2022, the semiconductor packaged workpiece can be moved onto the conveyor belt assembly as the first conveyor wheel 2021 and the second conveyor wheel 2022 rotate.

[0075] In this embodiment, by selecting a structure for the workpiece conveying mechanism consisting of a base 201, a conveyor wheel assembly 202, and a conveyor belt assembly 203, the conveyor wheel assembly 202 can serve as a transfer station, receiving semiconductor packaged workpieces pushed out of the material box 101 by the pushing component, completing the initial positioning of the semiconductor packaged workpiece and the conveyor belt assembly 203. Then, by controlling the conveyor wheel assembly 202, the semiconductor packaged workpiece pushed by the pushing component is conveyed to the conveyor belt assembly 203, so that the semiconductor packaged workpiece is conveyed onto the conveyor belt assembly 203, and then the semiconductor packaged workpiece can be conveyed to the corresponding position on the calibration table using the conveyor belt assembly 203.

[0076] Accordingly, if the semiconductor package workpiece is placed in a preset orientation, controlling the workpiece conveying mechanism to convey the semiconductor package workpiece to a position close to the calibration stage in the semiconductor processing equipment may include the following steps: S510. If the placement posture of the semiconductor packaged workpiece is the preset placement posture, then control the pusher assembly to push the semiconductor packaged workpiece onto the conveyor wheel assembly.

[0077] Here, after determining that the placement posture of the semiconductor packaged workpiece is the preset placement posture, that is, after determining that the placement posture of the semiconductor packaged workpiece is qualified, the pusher component is controlled to continuously perform the pushing action to push the semiconductor packaged workpiece from the material box to the conveyor wheel group, which serves as a transitional bearing station, thereby realizing the transfer connection between the material box and the conveyor belt assembly via the conveyor wheel group.

[0078] In this step, after determining the placement posture of the semiconductor packaged workpiece to be the preset placement posture, the pushing component is controlled to push the semiconductor packaged workpiece onto the transfer wheel set, which serves as a transfer transition structure, so that it can receive the qualified workpiece after inspection. This achieves the purpose of buffering the pushing impact force of the pushing component on the semiconductor packaged workpiece through the transfer wheel set, preventing the semiconductor packaged workpiece from slipping and tilting when it is pushed onto the conveyor belt assembly, thereby enabling the semiconductor packaged workpiece to be smoothly pushed onto the transfer wheel set.

[0079] S520. After the portion corresponding to the target length of the semiconductor packaged workpiece is pushed onto the conveyor wheel assembly, the conveyor wheel assembly is controlled to rotate, so that the semiconductor packaged workpiece moves onto the conveyor belt assembly under the action of the conveyor wheel assembly, so that the conveyor belt assembly transports the semiconductor packaged workpiece to the position corresponding to the calibration table in the semiconductor processing equipment.

[0080] As the pushing component continuously pushes the semiconductor packaged workpiece onto the conveyor roller assembly, until a portion of the workpiece reaches the preset target length and lands on the roller assembly, it can be determined that the workpiece's bearing position on the roller assembly meets the standard, and the pushing component stops. Then, the conveyor roller assembly is controlled to rotate, using the roller clamping and friction to smoothly move the semiconductor packaged workpiece, accurately transferring it to the conveyor belt assembly located at the rear of the roller assembly. Finally, the conveyor belt assembly performs linear transport, smoothly delivering the semiconductor packaged workpiece to the corresponding position on the calibration table.

[0081] In this step, the target length of the semiconductor packaged workpiece is used as the transfer trigger condition to control the rotation of the transfer wheel assembly, so that the semiconductor packaged workpiece can be moved onto the conveyor belt assembly under the action of the transfer wheel assembly, so that the semiconductor packaged workpiece can be smoothly transferred to the position corresponding to the calibration table.

[0082] Using the above method, after determining the placement posture of the semiconductor packaged workpiece to be the preset placement posture, the pusher assembly is controlled to push the semiconductor packaged workpiece onto the conveyor roller assembly. Then, after the part corresponding to the target length of the semiconductor packaged workpiece is pushed onto the conveyor roller assembly, the conveyor roller assembly is controlled to rotate so that the semiconductor packaged workpiece moves onto the conveyor belt assembly under the action of the conveyor roller assembly. This can ensure that the semiconductor packaged workpiece has a regular posture when it enters the calibration table and avoid the secondary deformation and displacement of qualified workpieces.

[0083] In some possible implementations, such as Figures 5 to 7 As shown, the push-back mechanism 3 includes a push-back component 301 and a cylinder assembly. The push-back component 301 has a waiting position (e.g., Figure 5 (as shown) and push back to the ready position (as shown) Figure 6 As shown, when the push-back component 301 is in the waiting position, the push-back component 301 is located below the semiconductor package workpiece; when the push-back component 301 is in the push-back preparation position, the push-back component 301 and the side of the semiconductor package workpiece away from the material box 101 move closer to each other; the cylinder assembly is connected to the push-back component and is used to drive the push-back component 301 to move in the horizontal direction and / or vertical direction.

[0084] A conveyor track 204 is provided between the first conveyor wheel 2021 and the second conveyor wheel 2022. Both the first conveyor wheel 2021 and the second conveyor wheel 2022 can extend into the conveyor track 204. When the pushing assembly pushes the semiconductor packaged workpiece in the material box 101, the semiconductor packaged workpiece can be pushed into the conveyor track 204 and come into contact with the semiconductor packaged workpiece located in the conveyor track 204, so that the semiconductor packaged workpiece moves towards the upper surface of the conveyor belt 2032 under the rotation driven by the first conveyor wheel 2021 and the second conveyor wheel 2022. When the push-back member 301 is in the waiting position, the push-back member 301 is located below the conveyor track 204.

[0085] Here, the cylinder assembly includes a first cylinder 302 and a second cylinder 303 connected to each other. The first cylinder 302 is mounted on the base 201 and located below the conveyor belt assembly 203. The first cylinder 302 is used to drive the second cylinder 303 to move along the length direction (X-axis direction) of the base 201. The push-back member 301 is mounted on the second cylinder 303. The second cylinder 303 is used to drive the push-back member 301 to move along the height direction (Y-axis direction) of the base 201.

[0086] After determining that the semiconductor packaged workpiece's posture does not conform to the preset placement posture, a drive command is immediately issued to the cylinder assembly to put the push-back component 301 in a waiting position. At this time, the push-back component 301 is located below the semiconductor packaged workpiece and will not obstruct or interfere with the normally transported semiconductor packaged workpiece. The cylinder assembly can drive the push-back component 301 to move upward and forward through a combination of horizontal and vertical displacement, so that the push-back component 301 is close to the side of the semiconductor packaged workpiece away from the material box 101, and finally stops at the push-back preparation position, completing the pre-push-back bonding and alignment preparation.

[0087] In this embodiment, the push-back mechanism is selected as a structure consisting of a push-back component 301 and a cylinder assembly. The push-back component has two working positions: a waiting position and a push-back preparation position. The cylinder assembly can drive the push-back component 301 to move in a linkage manner in the horizontal and vertical directions, so as to control the push-back component 301 to switch between the waiting position and the push-back preparation position, and to control the push-back component 301 to push the semiconductor packaged workpiece back into the material box 101.

[0088] Accordingly, if the placement posture of the semiconductor package workpiece is not the preset placement posture, the push-back mechanism is controlled to push the semiconductor package workpiece back into the cassette, which may include the following steps: S610. If the placement posture of the semiconductor packaged workpiece is not the preset placement posture, the control cylinder assembly drives the push-back component to move from the waiting position to the push-back preparation position.

[0089] After determining that the placement posture of the semiconductor packaged workpiece is not the preset placement posture, the control cylinder assembly drives the pusher to move from the waiting position to the push-back preparation position. This allows the pusher to move closer to the side of the semiconductor packaged workpiece away from the cassette, providing a precise force point for the pusher to push the semiconductor packaged workpiece back into the cassette. This lays the structural foundation for the smooth push-back of the semiconductor packaged workpiece and reduces the probability of breakage of the semiconductor packaged workpiece.

[0090] S620, the control cylinder assembly drives the pusher component located in the pusher preparation position to move towards the material box, so that the semiconductor package workpiece is pushed back into the material box by the pusher component.

[0091] After the pusher completes the alignment of the semiconductor packaged workpiece and stabilizes in the push-back preparation position, the cylinder assembly outputs a horizontal thrust, driving the pusher to move linearly towards the cassette. At this time, the pusher adheres to the side of the semiconductor packaged workpiece away from the cassette, pushing the workpiece with a straight, positive thrust. This pushes the semi-pushed workpiece back into the cassette, completing the abnormal workpiece retrieval action and preventing the abnormal workpiece from continuing to flow to the rear workpiece conveying mechanism.

[0092] S630. After the semiconductor packaged workpiece is pushed back into the material box, the control cylinder assembly drives the pusher to move from the current position to the push-back preparation position, and then to the waiting position.

[0093] The control cylinder assembly drives the pusher component to retract horizontally back to the pusher preparation position to eliminate the contact and squeezing between the pusher component and the edge of the semiconductor package workpiece; then the pusher component is controlled to descend vertically and return to its horizontal position, returning to the waiting position below the semiconductor package workpiece, completing one abnormal pusher process, and waiting for the next round of workpiece inspection and judgment.

[0094] In this step, by adopting a step-by-step orderly reset, first horizontally releasing the force and then vertically storing it, the action is smooth and impact-free, avoiding disturbance to the workpiece arrangement in the material box during the push-back reset process, preventing secondary placement misalignment problems, and ensuring the loading accuracy of the next batch of workpieces.

[0095] By adopting the above method, the problem of interference to the semiconductor packaged workpiece conveying from the cassette to the workpiece conveying mechanism caused by long-term exposure of the push-back parts can be avoided. It also eliminates problems such as push-back misalignment, workpiece jamming, and collision damage to the semiconductor packaged workpiece, and greatly improves the stability of the abnormal workpiece recycling process.

[0096] Furthermore, the push-back mechanism also includes an obstruction detection module mounted on the push-back component.

[0097] The push-back component integrates an obstruction detection module, which can be a photoelectric obstruction sensor. This module is used to detect the obstruction status of the semiconductor packaged workpiece extending out of the material box in real time. By statistically analyzing the duration of continuous obstruction, it determines whether the semiconductor packaged workpiece has reached a stable extension state and uses this as the trigger condition for the push-back component to start displacement.

[0098] Accordingly, if the placement posture of the semiconductor packaged workpiece is not the preset placement posture, the control cylinder assembly to move the push-back component from the waiting position to the push-back ready position may include the following steps: S710. If the placement posture of the semiconductor package workpiece is not the preset placement posture, control the pusher assembly to stop applying the pushing force to the semiconductor package workpiece.

[0099] After determining that the placement posture of the semiconductor packaged workpiece does not conform to the preset placement posture, an instruction is immediately issued to control the pusher component to stop applying the pushing force to the semiconductor packaged workpiece, thereby locking the power output of the pusher component and stopping the pusher component from applying the outward pushing force to the current semiconductor packaged workpiece. This keeps the semiconductor packaged workpiece in the current half-pushed stationary state for a moment, and it no longer continues to move outward, reserving a stable working condition for the subsequent push-back operation.

[0100] S720: The occlusion detection module is used to detect the portion of the semiconductor packaged workpiece pushed out of the cassette, and the duration of occlusion of the occlusion detection module by the semiconductor packaged workpiece is counted.

[0101] After the pushing assembly stops pushing, the obstruction detection module installed on the push-back component starts the detection function in real time. Specifically, the obstruction detection module detects the part of the semiconductor packaged workpiece that is extending out of the material box. The obstruction detection module continuously collects obstruction signals and keeps a timer. By statistically analyzing the continuous obstruction time of the semiconductor packaged workpiece to the obstruction detection module in real time, it can be determined whether the current extension state of the semiconductor packaged workpiece is stable and whether there are unstable conditions such as shaking, slippage, or suspension.

[0102] S730 If the recorded occlusion duration exceeds the preset duration, the control cylinder assembly drives the push-back component to move from the waiting position to the push-back preparation position.

[0103] When the duration of continuous occlusion as recorded by the occlusion detection module exceeds a preset duration, it can be determined that the current abnormal semiconductor package workpiece has completely stopped, the extension length meets the standard, and there is no shaking or slippage. The semiconductor package workpiece is in a safe and pushable state. Only at this time is a drive command allowed to be issued to control the cylinder assembly to move the push-back component from the low waiting position upward and forward to the push-back preparation position to complete the alignment of the semiconductor package workpiece. If the occlusion duration does not meet the standard, it is determined that the workpiece shaking has not been eliminated, and the push-back component's positioning action is delayed.

[0104] By adopting the above method, it is possible to ensure that the placement posture of the abnormal semiconductor packaged workpiece is stable before controlling the push-back component to perform the push-back action on the semiconductor packaged workpiece, which greatly reduces the probability of jamming and misalignment and improves the safety of the push-back action on the semiconductor packaged workpiece.

[0105] In some possible implementations, the method may further include: S810. Count the number of semiconductor packaged workpieces with a preset placement posture; In the material box, after inspecting the semiconductor packaged workpieces placed in a preset orientation, and after all semiconductor packaged workpieces in the preset orientation have been processed by the semiconductor processing equipment, the number of qualified workpieces processed is counted. Here, the counting method can rely on the judgment signal triggered by the semiconductor processing equipment. Data is recorded once each qualified workpiece is processed, and the number of qualified workpieces processed in the material box of this batch is updated in real time, forming traceable batch processing data.

[0106] S820. If the counted number is less than the number of semiconductor packaged workpieces initially placed in the hopper, after all semiconductor packaged workpieces with the preset placement posture have been transferred to the position corresponding to the calibration table in the semiconductor processing equipment, a first alarm message is issued to remind that there are semiconductor packaged workpieces in the hopper with a placement posture that is not the preset placement posture.

[0107] The initial total number of semiconductor packaged parts initially loaded into the hopper is pre-entered, and the statistical count of all semiconductor packaged parts placed in the preset orientation is retrieved in real time for difference calculation. If the statistical count of all semiconductor packaged parts placed in the preset orientation is less than the initial total number, it indicates that some parts are being continuously pushed back into the hopper due to abnormal orientation and have not flowed out of the hopper to complete the loading process, thus determining that there are parts with abnormal orientation remaining in the current hopper. If the two counts are equal, it means that all parts in this batch are in acceptable orientation and there are no abnormal parts remaining.

[0108] Therefore, after determining that the number of statistically significant semiconductor packaged workpieces is less than the number of semiconductor packaged workpieces initially placed in the hopper, all semiconductor packaged workpieces with the preset placement posture are transferred to the corresponding position near the calibration table in the semiconductor processing equipment. This means that all semiconductor packaged workpieces with the preset placement posture have been transferred out of the hopper. At this time, the first alarm message is issued to remind the operator that there are semiconductor packaged workpieces with a non-preset placement posture in the hopper, and to remind the operator to manually sort out the semiconductor packaged workpieces with an unqualified placement posture that are currently left in the hopper.

[0109] In some possible embodiments, the method may further include: during the process of controlling the pusher assembly to push the semiconductor packaged workpieces in the cassette one by one to the workpiece conveying mechanism, if the placement posture of the first to the first preset placement posture of the semiconductor packaged workpieces is not the preset placement posture, a second alarm message is issued to remind the operator to check the installation of the cassette.

[0110] Here, as the feeding component continuously pushes the semiconductor packaged workpieces in the hopper, the placement posture of the continuously detected semiconductor packaged workpieces is sequentially counted. If, starting from the first semiconductor packaged workpiece, all workpieces up to a preset number are determined to have abnormal postures and no qualified workpieces flow out, random individual placement errors can be ruled out, and the issue can be determined to be an overall installation offset or clamping failure of the hopper. At this point, by triggering a second alarm message, the operator can be reminded to check the installation status of the hopper and promptly correct and re-lock the hopper to avoid invalid batch feeding of semiconductor packaged workpieces in the hopper.

[0111] Figure 8 This is a schematic diagram of a loading control device 900 for a semiconductor processing equipment according to an embodiment of the present invention. The loading control device 900 is applied to a semiconductor processing equipment, which includes a loading mechanism, a workpiece conveying mechanism, and a push-back mechanism. The loading mechanism includes a material box and a pushing assembly. The pushing assembly is used to push semiconductor packaged workpieces from the material box one by one onto the workpiece conveying mechanism. The push-back mechanism is used to push at least a portion of the semiconductor packaged workpieces located on the workpiece conveying mechanism back into the material box. The loading control device 900 for the semiconductor processing equipment includes: The judgment module 910 is used to determine whether the placement posture of each semiconductor package workpiece located in the material box is a preset placement posture during the process of controlling the pusher component to push the semiconductor package workpiece to the workpiece conveying mechanism. The first control module 920 is used to control the workpiece conveying mechanism to convey the semiconductor package workpiece to the position corresponding to the calibration table in the semiconductor processing equipment if the placement posture of the semiconductor package workpiece is a preset placement posture. The second control module 930 is used to control the push-back mechanism to push the semiconductor packaged workpiece back into the material box if the placement posture of the semiconductor packaged workpiece is not the preset placement posture.

[0112] In some implementations, a QR code label is provided on the target area of ​​the semiconductor package workpiece; the semiconductor processing equipment also includes a scanning module, which is used to scan and identify the area corresponding to the preset portion when the semiconductor package workpiece is pushed out of the cassette, wherein the target area is located on the preset portion of the semiconductor package workpiece when the semiconductor package workpiece is in a preset placement posture; the judgment module 910 includes: The barcode scanning result acquisition unit is used to scan the area corresponding to the preset part for each semiconductor packaged workpiece located in the material box when the pusher component pushes the semiconductor packaged workpiece out of the material box from the preset part, and obtain the barcode scanning result of whether the QR code label is recognized. The first placement posture determination unit is used to determine the placement posture of the semiconductor packaged workpiece as the preset placement posture if the scanning and recognition result is that a QR code label has been recognized. The second placement posture determination unit is used to determine that the placement posture of the semiconductor packaged workpiece is not the preset placement posture if the scanning and recognition result is that no QR code label is recognized.

[0113] In some possible implementations, the unit for obtaining the QR code recognition result includes: The first scanning and recognition subunit is used to control the scanning module to perform cyclic scanning and recognition of the area corresponding to the preset part at a preset number of scanning times. The first QR code recognition result determination subunit is used to determine that the QR code recognition result is that the QR code label has been recognized if the QR code module obtains the QR code information corresponding to the QR code label. The second QR code recognition subunit is used to control the supplementary light source for supplementing the QR code recognition of the QR code module to turn on if the QR code module does not obtain the QR code information corresponding to the QR code label, so that the QR code module can perform cyclic scanning recognition of the area corresponding to the preset part in the state of supplementary light and scan the QR code a preset number of times. The second QR code recognition result determination subunit is used to determine the QR code recognition result as QR code label recognition if the QR code module obtains the QR code information corresponding to the QR code label under supplementary lighting. The third QR code recognition result determination subunit is used to determine that the QR code recognition result is "QR code label not recognized" if the scanning module does not obtain the QR code information corresponding to the QR code label under supplementary lighting conditions.

[0114] In some implementations, the workpiece conveying mechanism includes a base, and a set of conveyor wheels and a conveyor belt assembly mounted on the base. The set of conveyor wheels is used to convey the semiconductor packaged workpiece pushed by the pusher assembly to the conveyor belt assembly, and the conveyor belt assembly is used to convey the semiconductor packaged workpiece conveyed by the set of conveyor wheels to the corresponding position on the calibration table; the first control module 920 includes: The first control unit is used to control the pushing assembly to push the semiconductor packaged workpiece onto the conveyor wheel set if the placement posture of the semiconductor packaged workpiece is a preset placement posture. The second control unit is used to push the portion corresponding to the target length of the semiconductor packaging workpiece onto the conveyor wheel assembly, and then control the conveyor wheel assembly to rotate, so that the semiconductor packaging workpiece moves onto the conveyor belt assembly under the action of the conveyor wheel assembly, so that the conveyor belt assembly transports the semiconductor packaging workpiece to the position corresponding to the calibration table in the semiconductor processing equipment.

[0115] In some implementations, the push-back mechanism includes a push-back member and a cylinder assembly. The push-back member has a waiting position and a push-back ready position. When the push-back member is in the waiting position, it is positioned below the semiconductor package workpiece. When the push-back member is in the push-back ready position, it moves closer to the side of the semiconductor package workpiece away from the cassette. The cylinder assembly is connected to the push-back member and is used to move the push-back member horizontally and / or vertically. The second control module 930 includes: The third control unit is used to control the cylinder assembly to move the push-back component from the waiting position to the push-back preparation position if the placement posture of the semiconductor package workpiece is not the preset placement posture. The fourth control unit is used to control the cylinder assembly to move the push-back component located in the push-back preparation position toward the material box, so that the semiconductor package workpiece is pushed back into the material box by the push-back component; The fifth control unit is used to control the cylinder assembly to move the pusher from its current position to the push-back preparation position, and then to the waiting position, after the semiconductor packaging workpiece is pushed back into the material box.

[0116] In some implementations, the push-back mechanism further includes an obstruction detection module mounted on the push-back component; the third control unit includes: The push force control subunit is used to control the push assembly to stop applying push force to the semiconductor package workpiece if the placement posture of the semiconductor package workpiece is not the preset placement posture. The occlusion duration determination subunit is used to detect the portion of the semiconductor packaged workpiece pushed out of the cassette using the occlusion detection module, and to count the occlusion duration of the semiconductor packaged workpiece on the occlusion detection module. The cylinder assembly control subunit is used to control the cylinder assembly to move the push-back component from the waiting position to the push-back preparation position if the statistically recorded occlusion duration exceeds the preset duration.

[0117] In some implementations, the loading control device 900 of the semiconductor processing equipment further includes: The statistics module is used to count the number of semiconductor packaged workpieces with a preset placement posture; The first alarm module is used to issue a first alarm message after all semiconductor packaged workpieces with the preset placement posture have been transferred to the position corresponding to the calibration table in the semiconductor processing equipment if the counted number is less than the number of semiconductor packaged workpieces initially placed in the material box. This is to remind that there are semiconductor packaged workpieces in the material box with a placement posture that is not the preset placement posture.

[0118] In some implementations, the loading control device 900 of the semiconductor processing equipment further includes: The second alarm module is used to issue a second alarm message when the semiconductor packaged workpieces in the material box are pushed one by one from the control pusher component to the workpiece conveying mechanism. If the placement posture of the first to the preset placement posture of the semiconductor packaged workpieces is not the preset placement posture, the second alarm message will be issued to remind the operator to check the installation of the material box.

[0119] It should be understood that the embodiments of the feeding control device for semiconductor processing equipment and the embodiments of the feeding control method for semiconductor processing equipment can correspond to each other, and similar descriptions can be found in the embodiments of the feeding control method for semiconductor processing equipment. To avoid repetition, further details are omitted here. Specifically, Figure 8 The semiconductor processing equipment loading control device 900 shown can execute the above-described embodiment of the semiconductor processing equipment loading control method. The aforementioned and other operations and / or functions of each module in the semiconductor processing equipment loading control device 900 are respectively for implementing the corresponding process in the above-described semiconductor processing equipment loading control method. For the sake of brevity, they will not be described in detail here.

[0120] The loading control device 900 of the semiconductor processing equipment according to an embodiment of the present invention has been described above from the perspective of functional modules, in conjunction with the accompanying drawings. It should be understood that this functional module can be implemented in hardware, in software instructions, or in a combination of hardware and software modules. Specifically, each step of the loading control method embodiment of the semiconductor processing equipment in the present invention can be completed by integrated logic circuits in the processor and / or by software instructions. The steps of the loading control method of the semiconductor processing equipment disclosed in the present invention can be directly manifested as execution by a hardware decoding processor, or by a combination of hardware and software modules in the decoding processor. Optionally, the software module can be located in a mature storage medium in the art, such as random access memory, flash memory, read-only memory, programmable read-only memory, electrically erasable programmable memory, registers, etc. This storage medium is located in memory, and the processor reads information from the memory and, in conjunction with its hardware, completes the steps of the loading control method embodiment of the semiconductor processing equipment described above.

[0121] Figure 9 This is a schematic block diagram of a semiconductor processing apparatus 110 according to an embodiment of the present invention.

[0122] like Figure 9 As shown, the semiconductor processing equipment 110 may include: The system includes a memory 111 and a processor 112. The memory 111 stores computer programs and transfers the program code to the processor 112. In other words, the processor 112 can retrieve and run the computer programs from the memory 111 to implement the methods described in the embodiments of the present invention.

[0123] For example, the processor 112 can be used to execute the above-described method embodiments according to instructions in the computer program.

[0124] In some embodiments of the present invention, the semiconductor processing apparatus 110 may include, but is not limited to: General-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc.

[0125] In some embodiments of the present invention, the memory 111 includes, but is not limited to: Volatile memory and / or non-volatile memory. Non-volatile memory can be read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), or flash memory. Volatile memory can be random access memory (RAM), used as an external cache. By way of example, but not limitation, many forms of RAM are available, such as Static RAM (SRAM), Dynamic RAM (DRAM), Synchronous DRAM (SDRAM), Double Data Rate SDRAM (DDR SDRAM), Enhanced Synchronous DRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), and Direct Rambus RAM (DR RAM).

[0126] In some embodiments of the present invention, the computer program may be divided into one or more modules, which are stored in the memory 111 and executed by the processor 112 to perform the method provided by the present invention. The one or more modules may be a series of computer program instruction segments capable of performing a specific function, which describe the execution process of the computer program in the controller.

[0127] like Figure 9 As shown, the semiconductor processing equipment 110 may further include: Transceiver 113, which can be connected to processor 112 or memory 111.

[0128] The processor 112 can control the transceiver 113 to communicate with other devices; specifically, it can send information or data to other devices or receive information or data sent by other devices. The transceiver 113 may include a transmitter and a receiver. The transceiver 113 may further include antennas, and the number of antennas may be one or more.

[0129] It should be understood that the various components in the semiconductor processing equipment are connected through a bus system, which includes a data bus, a power bus, a control bus, and a status signal bus.

[0130] The present invention also provides a semiconductor processing equipment, including the above-mentioned semiconductor processing equipment feeding control device.

[0131] The present invention also provides a computer storage medium having a computer program stored thereon, which, when executed by a computer, enables the computer to perform the methods of the above-described method embodiments. Alternatively, one embodiment of the present invention also provides a computer program product containing instructions that, when executed by a computer, cause the computer to perform the methods of the above-described method embodiments.

[0132] When implemented using software, it can be implemented wholly or partially as a computer program product. This computer program product includes one or more computer instructions. When these computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of the present invention are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another via wired (e.g., coaxial cable, fiber optic, Digital Subscriber Line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that integrates one or more available media. The available medium can be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., Digital Video Disc (DVD)), or a semiconductor medium (e.g., Solid State Disk (SSD)).

[0133] Those skilled in the art will recognize that the modules and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0134] In the several embodiments provided by this invention, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of modules is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple modules or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between devices or modules may be electrical, mechanical, or other forms.

[0135] The modules described as separate components may or may not be physically separate. The components shown as modules may or may not be physical modules; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. For example, the functional modules in the various embodiments of this application may be integrated into one processing module, or each module may exist physically separately, or two or more modules may be integrated into one module.

[0136] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A feeding control method for a semiconductor processing equipment, applied to a semiconductor processing equipment, the semiconductor processing equipment including a feeding mechanism, a workpiece conveying mechanism, and a push-back mechanism, the feeding mechanism including a material box and a pushing assembly, the pushing assembly being used to push semiconductor packaged workpieces in the material box one by one onto the workpiece conveying mechanism, and the push-back mechanism being used to push at least a portion of the semiconductor packaged workpieces pushed out of the material box by the pushing assembly back into the material box; characterized in that, The method includes: For each semiconductor packaged workpiece located in the material box, during the process of controlling the pushing component to push the semiconductor packaged workpiece to the workpiece conveying mechanism, it is determined whether the placement posture of the semiconductor packaged workpiece is a preset placement posture. If the semiconductor package workpiece is placed in a preset orientation, the workpiece conveying mechanism is controlled to convey the semiconductor package workpiece to a position close to the calibration table in the semiconductor processing equipment. If the placement posture of the semiconductor packaged workpiece is not the preset placement posture, the push-back mechanism is controlled to push the semiconductor packaged workpiece back into the material box.

2. The feeding control method for semiconductor processing equipment according to claim 1, characterized in that, A QR code label is provided on the target area of ​​the semiconductor packaged workpiece; the semiconductor processing equipment further includes a scanning module, which is used to scan and identify the area corresponding to the preset portion when the semiconductor packaged workpiece is pushed out of the material box, wherein, when the semiconductor packaged workpiece is in a preset placement posture, the target area is located on the preset portion of the semiconductor packaged workpiece; for each semiconductor packaged workpiece located in the material box, during the process of controlling the pushing component to push the semiconductor packaged workpiece to the workpiece conveying mechanism, determining whether the placement posture of the semiconductor packaged workpiece is the preset placement posture includes: For each semiconductor packaged workpiece located in the material box, when the pusher component pushes the semiconductor packaged workpiece out of the material box from the preset part, the scanning module is used to scan and identify the area corresponding to the preset part to obtain the scanning and identification result of whether the QR code label is identified. If the scanning and recognition result is that the QR code label is recognized, then the placement posture of the semiconductor packaged workpiece is determined to be the preset placement posture; If the scanning result indicates that the QR code label is not recognized, then it is determined that the placement posture of the semiconductor packaged workpiece is not the preset placement posture.

3. The feeding control method for semiconductor processing equipment according to claim 2, characterized in that, The step of using the scanning module to scan and recognize the area corresponding to the preset portion, and obtaining a scanning and recognition result of whether the QR code label has been recognized, includes: The scanning module is controlled to perform cyclic scanning and identification of the area corresponding to the preset portion at a preset number of scans. If the scanning module obtains the QR code information corresponding to the QR code label, then the scanning recognition result is determined to be that the QR code label has been recognized; If the scanning module does not obtain the QR code information corresponding to the QR code label, the supplementary light source used to supplement the scanning recognition of the scanning module is turned on, so that the scanning module performs cyclic scanning recognition of the area corresponding to the preset part in the supplementary light state for a preset number of scans. If the scanning module obtains the QR code information corresponding to the QR code label under supplementary lighting, then the scanning recognition result is determined to be that the QR code label has been recognized. If the scanning module does not obtain the QR code information corresponding to the QR code label under supplementary lighting conditions, then the scanning recognition result is determined to be that the QR code label was not recognized.

4. The feeding control method for semiconductor processing equipment according to claim 1, characterized in that, The workpiece conveying mechanism includes a base, and a conveyor wheel assembly and a conveyor belt assembly mounted on the base. The conveyor wheel assembly is used to convey the semiconductor packaged workpiece pushed by the pusher assembly to the conveyor belt assembly. The conveyor belt assembly is used to convey the semiconductor packaged workpiece conveyed by the conveyor wheel assembly to the position corresponding to the calibration table. If the placement posture of the semiconductor packaged workpiece is a preset placement posture, controlling the workpiece conveying mechanism to convey the semiconductor packaged workpiece to the position corresponding to the calibration table in the semiconductor processing equipment includes: If the semiconductor package workpiece is placed in a preset orientation, the pusher assembly is controlled to push the semiconductor package workpiece onto the conveyor wheel assembly. After the portion corresponding to the target length of the semiconductor packaged workpiece is pushed onto the conveyor wheel assembly, the conveyor wheel assembly is controlled to rotate, so that the semiconductor packaged workpiece moves onto the conveyor belt assembly under the action of the conveyor wheel assembly, so that the conveyor belt assembly transports the semiconductor packaged workpiece to the position corresponding to the calibration table in the semiconductor processing equipment.

5. The feeding control method for semiconductor processing equipment according to claim 1, characterized in that, The push-back mechanism includes a push-back component and a cylinder assembly. The push-back component has a waiting position and a push-back ready position. When the push-back component is in the waiting position, it is located below the semiconductor packaged workpiece. When the push-back component is in the push-back ready position, the push-back component and the side of the semiconductor packaged workpiece away from the cassette move closer to each other. The cylinder assembly is connected to the push-back component and is used to drive the push-back component to move horizontally and / or vertically. If the placement posture of the semiconductor packaged workpiece is not a preset placement posture, the push-back mechanism is controlled to push the semiconductor packaged workpiece back into the cassette, including: If the placement posture of the semiconductor packaged workpiece is not the preset placement posture, then control the cylinder assembly to drive the push-back component to move from the waiting position to the push-back preparation position; The cylinder assembly is controlled to move the push-back component, which is located in the push-back preparation position, toward the material box, so that the semiconductor package workpiece is pushed back into the material box by the push-back component; After the semiconductor packaged workpiece is pushed back into the hopper, the cylinder assembly is controlled to move the pusher from its current position to the push-back preparation position, and then to the waiting position.

6. The feeding control method for semiconductor processing equipment according to claim 5, characterized in that, The push-back mechanism further includes an obstruction detection module disposed on the push-back component; the step of controlling the cylinder assembly to move the push-back component from the waiting position to the push-back preparation position if the placement posture of the semiconductor package workpiece is not a preset placement posture includes: If the placement posture of the semiconductor package workpiece is not the preset placement posture, then the pusher assembly is controlled to stop applying the pushing force to the semiconductor package workpiece; The occlusion detection module is used to detect the portion of the semiconductor packaged workpiece pushed out of the cassette, and the duration of occlusion of the occlusion detection module by the semiconductor packaged workpiece is counted. If the recorded occlusion duration exceeds a preset duration, the cylinder assembly is controlled to move the push-back component from the waiting position to the push-back preparation position.

7. The feeding control method for semiconductor processing equipment according to claim 1, characterized in that, Also includes: The number of semiconductor packaged workpieces with a preset placement orientation is counted. If the counted number is less than the number of semiconductor packaged workpieces initially placed in the hopper, then after all semiconductor packaged workpieces with the preset placement posture have been transferred to the position corresponding to the calibration table in the semiconductor processing equipment, a first alarm message is issued to remind that there are semiconductor packaged workpieces in the hopper with a placement posture that is not the preset placement posture.

8. The feeding control method for semiconductor processing equipment according to claim 1, characterized in that, Also includes: During the process of controlling the feeding component to push the semiconductor packaged workpieces in the material box one by one to the workpiece conveying mechanism, if the placement posture of the first to the preset placement posture of the semiconductor packaged workpieces is not the preset placement posture, a second alarm message is issued to remind the operator to check the installation of the material box.

9. A feeding control device for a semiconductor processing equipment, applied to a semiconductor processing equipment, the semiconductor processing equipment including a feeding mechanism, a workpiece conveying mechanism, and a push-back mechanism, the feeding mechanism including a material box and a pushing assembly, the pushing assembly being used to push semiconductor packaged workpieces in the material box one by one onto the workpiece conveying mechanism, and the push-back mechanism being used to push back at least a portion of the semiconductor packaged workpieces located on the workpiece conveying mechanism back into the material box; characterized in that, The device includes: The judgment module is used to determine whether the placement posture of each semiconductor package workpiece located in the material box is a preset placement posture during the process of controlling the pushing component to push the semiconductor package workpiece to the workpiece conveying mechanism. The first control module is used to control the workpiece conveying mechanism to convey the semiconductor packaged workpiece to a position close to the calibration table in the semiconductor processing equipment if the placement posture of the semiconductor packaged workpiece is a preset placement posture. The second control module is used to control the push-back mechanism to push the semiconductor packaged workpiece back into the material box if the placement posture of the semiconductor packaged workpiece is not a preset placement posture.

10. A semiconductor processing apparatus, characterized in that, include: A processor and a memory, the memory being used to store a computer program, the processor being used to invoke and run the computer program stored in the memory to perform the method of any one of claims 1-8.

11. A computer-readable storage medium, characterized in that, Used to store a computer program that causes a computer to perform the method as described in any one of claims 1-8.

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