Showerhead having components removably coupled to one another

By designing a removable coupled nozzle panel and cover structure, the problems of ineffective volume and uneven airflow in nozzle cleaning and maintenance are solved, achieving more efficient cleaning and gas delivery and reducing particulate contamination.

CN122249586APending Publication Date: 2026-06-19LAM RES CORP

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
LAM RES CORP
Filing Date
2024-09-18
Publication Date
2026-06-19

AI Technical Summary

Technical Problem

Existing chemical deposition systems suffer from problems such as ineffective volume, uneven airflow, and particulate contamination during cleaning and maintenance. Furthermore, the nozzle assembly has low cleaning efficiency, making it difficult to effectively remove deposits and prevent particle formation.

Method used

A nozzle structure was designed in which the nozzle panel and cover are removably coupled and each has a flow path surface with a corrosion-resistant layer, allowing for direct cleaning and maintenance, reducing ineffective volume, and improving gas delivery and flow control.

Benefits of technology

It enables a more efficient cleaning and maintenance process, reduces particulate contamination, improves gas flow uniformity and cleaning fluid coverage, and reduces undesirable ineffective volume.

✦ Generated by Eureka AI based on patent content.

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Abstract

A nozzle panel for semiconductor processing is provided. The panel may include a front surface having a first outer diameter, a back surface offset from the front surface, a body portion spanning between the front surface and the back surface and at least partially forming the front surface and the back surface, a plurality of through holes extending from the front surface through the body portion to the back surface, and a peripheral wall adjacent to the back surface surrounding the plurality of through holes and including a plurality of first straight wall segments, each first straight wall segment may intersect with an adjacent first straight wall segment at a corner, and each corner may alternate between an interior corner and an exterior corner.
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Description

[0001] References merged The PCT application form is filed together with this specification as part of this application. Each application listed in the concurrently filed PCT application form that claims a benefit or priority with this application is incorporated herein by reference in its entirety for all purposes. Background Technology

[0002] The background description provided herein is for the purpose of presenting the general context of this disclosure. The work of the currently designated inventors within the scope described in this background section, as well as aspects of the specification that could not be identified as prior art at the time of filing, are neither express nor implied admissions of prior art to this disclosure.

[0003] Chemical deposition systems can be used to deposit films on substrates such as semiconductor wafers. Examples of chemical deposition systems include plasma-enhanced chemical vapor deposition (PECVD) systems, chemical vapor deposition (CVD) systems, and atomic layer deposition (ALD) systems. Such systems may include one or more nozzles disposed within a processing chamber to define a substrate processing area. The substrate processing area may be defined between the underside of the nozzle and a wafer support (i.e., a pedestal, substrate support, etc.), which may be disposed below each nozzle and configured to support the substrate within the substrate area. The underside of the nozzle may include ports facing the wafer support and configured to supply one or more precursor gases to facilitate the deposition of a material layer onto the substrate. The chemical deposition system may further include a fore-end pipeline fluidly connected to the processing chamber to exhaust the precursor gases from the processing chamber. Summary of the Invention

[0004] In some implementations, a nozzle panel for semiconductor processing may be provided. The nozzle panel may include: a front surface having a first outer diameter; a back surface offset from the front surface; a body portion spanning between the front surface and the back surface and at least partially forming the front and back surfaces; a plurality of through holes extending from the front surface through the body portion to the back surface; and a peripheral wall adjacent to the back surface, surrounding the plurality of through holes, and including a plurality of first straight wall segments, wherein: each first straight wall segment intersects with an adjacent first straight wall segment at a corner, and each corner alternates between an interior corner and an exterior corner.

[0005] In some implementations, the peripheral wall may further have multiple second straight wall segments, each of which may be longer than any first straight wall segment, may be inserted between two first straight wall segments, and may intersect with each first straight wall segment at an interior corner.

[0006] In some such implementations, each second vertical wall segment can be at least four times the length of any first vertical wall segment.

[0007] In some implementations, for each interior angle, the two first straight wall segments can form an angle of less than 180 degrees, and for each exterior angle, the two first straight wall segments can form an angle of greater than 180 degrees.

[0008] In some implementations, each first vertical wall segment can be oriented at approximately 90 degrees relative to the adjacent first vertical wall segment.

[0009] In some implementations, each first vertical wall segment can be oriented at a non-perpendicular angle relative to the adjacent first vertical wall segment.

[0010] In some implementations, the vias can be arranged in a rectangular pattern.

[0011] In some implementations, the vias can be arranged in a triangular pattern.

[0012] In some implementations, the nozzle panel may also have: a plurality of internal gas channels extending through the body portion in a plane parallel to the front surface; and a plurality of ports fluidly connected to the plurality of internal gas channels, wherein each port may pass through the front surface and extend from the front surface to and terminate in the corresponding internal gas channel, a first set of internal gas channels may be parallel to each other and parallel to a first direction, and a second set of internal gas channels may be parallel to each other and parallel to a second direction perpendicular to the first direction.

[0013] In some such implementations, the port can be fluidly isolated from the internal gas channels in the body section.

[0014] In some implementations, the nozzle panel may also include a plurality of internal gas channels extending through the body portion in a plane parallel to the front surface, wherein a first set of internal gas channels may be parallel to each other and parallel to a first direction, a second set of internal gas channels may be parallel to each other and parallel to a second direction oriented at approximately 60 degrees to the first direction, and a third set of internal gas channels may be parallel to each other and parallel to a third direction oriented at approximately 60 degrees to both the first and second directions.

[0015] In some implementations, the peripheral wall may also have a sealing seat that extends around the central axis of the nozzle panel and has an outer seat diameter greater than the outermost point of the back surface, and the sealing seat may have a back sealing surface facing the central axis and forming an acute angle with the central axis.

[0016] In some implementations, each through-hole may have: a first portion extending a first length from the back surface into the body portion and having a first inner diameter, and a second portion extending a second length from the front surface to the first portion and having a second inner diameter smaller than the first inner diameter.

[0017] In some implementations, each through-hole may have: a first portion extending a first length from the back surface to the engagement point, and at least two branches fluidly connected to the first portion, each branch extending from the engagement point to the front surface and through the front surface.

[0018] In some implementation schemes, the first vertical wall segment can form a stepped sidewall.

[0019] In some implementations, each through hole may have an outer diameter, and the shortest distance between the outermost through hole and the peripheral wall may be the shortest offset distance measured from the center of each through hole to the peripheral wall, which is less than or equal to the outer diameter.

[0020] In some such implementations, the peripheral wall may have an outer wall boundary extending around the central axis of the nozzle panel, and the front surface may have an outer surface diameter larger than the outer wall boundary.

[0021] In some such implementations, the outer wall boundary can be circular.

[0022] In some implementations, the nozzle panel can be configured to be connected to a cover plate, and when connected to the cover plate, an air chamber can be formed between the back surface of the nozzle panel and the cover plate, and the air chamber can be fluidly connected to a through hole.

[0023] In some such implementations, the nozzle panel may also have a plurality of internal gas channels extending through the body portion in a plane parallel to the front surface, wherein a first set of internal gas channels may be parallel to each other and parallel to a first direction, a second set of internal gas channels may be parallel to each other and parallel to a second direction different from the first direction, and when connected to the nozzle cover, the inflation chamber may be fluidly isolated from the internal gas channels.

[0024] In some implementations, a nozzle panel for semiconductor processing may be provided. The nozzle panel may have: a front surface having a first outer diameter; a back surface offset from the front surface; a body portion spanning between the front surface and the back surface and at least partially forming the front and back surfaces; and a plurality of through holes extending from the front surface through the body portion to the back surface; wherein each through hole includes: a first segment extending from the back surface for a first length to a junction point, and at least two branches fluidly connected to the first segment, each branch extending from the junction point to the front surface and through the front surface.

[0025] In some implementations, each first segment may have a first diameter, and each branch may have a second diameter equal to or less than the first diameter.

[0026] In some such implementations, the second diameter can be smaller than the first diameter.

[0027] In some implementations, each branch can have the same length as the other branches.

[0028] In some implementations, each via can have three branches.

[0029] In some implementations, the nozzle panel also has multiple internal gas channels extending through the body portion in a plane parallel to the front surface, wherein a first set of internal gas channels may be parallel to each other and parallel to a first direction, and a second set of internal gas channels may be parallel to each other and parallel to a second direction different from the first direction.

[0030] In some such implementations, the first direction can be perpendicular to the second direction.

[0031] In some such implementations, the nozzle panel may also have a third set of internal gas channels that are parallel to each other and parallel to a third direction, wherein the second direction may be oriented at approximately 60 degrees to the first direction, and the third direction may be oriented at approximately 60 degrees to the first direction and at approximately 60 degrees to the second direction.

[0032] In some implementations, a nozzle panel for semiconductor processing can be provided. The nozzle panel may have: a front surface having a first outer diameter; a back surface offset from the front surface; a body portion spanning between the front surface and the back surface and at least partially forming the front and back surfaces; and a plurality of through holes extending from the front surface through the body portion to the back surface; wherein each through hole may have: a first segment extending from the back surface and having a first inner diameter, and a second segment extending from the front surface to the first segment and having a second inner diameter smaller than the first inner diameter, the front surface being planar, the back surface being non-planar, and the body portion having a variable thickness.

[0033] In some implementations, the back surface can have a truncated conical surface.

[0034] In some such implementations, the back surface may also have a planar portion radially inward of the truncated conical surface.

[0035] In some implementations, the back surface can be a conical surface.

[0036] In some implementations, the nozzle panel may also have multiple internal gas channels extending through the body portion in a plane parallel to the front surface, wherein a first set of internal gas channels may be parallel to each other and parallel to a first direction, and a second set of internal gas channels may be parallel to each other and parallel to a second direction different from the first direction.

[0037] In some implementations, the first direction can be perpendicular to the second direction.

[0038] In some implementations, the nozzle panel may also have a third set of internal gas channels that are parallel to each other and parallel to a third direction, wherein the second direction may be oriented at approximately 60 degrees to the first direction, and the third direction may be oriented at approximately 60 degrees to the first direction and at approximately 60 degrees to the second direction.

[0039] In some implementations, a nozzle for semiconductor processing may be provided. The nozzle may have a panel according to any one of the above implementations; and a cover plate that contacts and is connected to the nozzle panel.

[0040] In some implementations, the nozzle may also have a nozzle collar that contacts and connects to the panel and cover.

[0041] In some implementations, the nozzle may also have a first heating element in the cover plate and a second heating element in the nozzle collar, wherein the first heating element and the second heating element are configured to heat the panel.

[0042] In some implementations, a nozzle may be provided, comprising a collar and a panel removably coupled to the collar using a first set of multiple fasteners. The collar and panel may each have multiple first gas collar surfaces and multiple first gas panel surfaces, which, when the collar is connected to the panel, collectively define a first set of first gas flow paths within the nozzle. Furthermore, for each of the first set of positions, when the collar is detached from the panel and viewed independently, there may be multiple direct lines of sight from that position to multiple corresponding viewpoints outside the collar, and each of the first set of positions may be located on one or more first gas collar surfaces. Similarly, for each of the second set of positions, when the panel is detached from the collar and viewed independently, there may be multiple direct lines of sight from that position to multiple corresponding viewpoints outside the panel, and each of the second set of positions may be located on one or more first gas panel surfaces. When the panel is assembled to the collar, for each of at least some of the first and second set of positions, there may not be a direct line of sight from that position to a corresponding viewpoint outside the assembled collar and panel. In addition, each of the first gas panel surfaces and each of the first gas collar surfaces may be coated with a corrosion-resistant layer.

[0043] In some implementations, the surface of the first gas collar may include one or more first gas inlets from a first set of first gas flow paths.

[0044] In some implementations, the surface of the first gas collar includes two first gas inlets on opposite sides of the collar's diameter.

[0045] In some such implementations, the surface of the first gas collar may include an inner annular surface, at least a portion of which faces radially inward toward the central axis of the nozzle. In such implementations, the first gas panel surface of the panel may include an outer annular surface, at least a portion of which faces radially outward from the central axis of the nozzle, and the inner annular surface of the collar and the outer annular surface of the panel may define an annular manifold of a first set of first gas channels, wherein when the collar is connected to the panel, the annular manifold fluid is inserted between the first gas inlet in the collar and a plurality of transverse channels in the panel.

[0046] In some such implementations, each of the first set of positions may be located on the inner annular surface of the collar.

[0047] In some further implementations, when the collar is assembled to the panel, for each of at least some of the positions in the first set, there may be no direct line of sight from that position to the corresponding viewpoint outside the assembled collar and panel.

[0048] In some implementations, each of the second set of positions may be located on the outer annular surface of the panel.

[0049] In some implementations, when the panel is assembled to the collar, for each of at least some of the positions in the second set of positions, there may be no direct line of sight from that position to the corresponding viewpoint outside the assembled collar and panel.

[0050] In some implementations, the first gas panel surface may include a plurality of peripheral feed chamber surfaces that define peripheral feed chambers in fluid communication with an annular manifold.

[0051] In some such implementations, each of the second set of positions may be located on the outer surface of the feed chamber of the panel.

[0052] In some implementations, when the panel is assembled to the collar, for each of at least some of the positions in the second set of positions, there may be no direct line of sight from that position to the corresponding viewpoint outside the assembled collar and panel.

[0053] In some implementations, the surface of the first gas panel may define a plurality of lateral channels fluidly connected to the annular manifold, the plurality of lateral channels including a first set of channels fluidly connected to the annular manifold and a second set of channels fluidly connected to the annular manifold, the first set of channels intersecting and fluidly connected to each other.

[0054] In some implementations, the channels in the first group of channels can be arranged to be parallel to each other, and the channels in the second group of channels can be arranged to be parallel to each other.

[0055] In some implementations, the channels in the first group of channels can be arranged orthogonally to the channels in the second group of channels.

[0056] In some implementations, each transverse channel may have a pair of opposite ends that terminate at a pair of portions of the annular outer surface and are respectively fluidly connected to the annular manifold.

[0057] In some implementations, the panel may further include multiple first gas distribution ports that are fluidly connected to the transverse channel.

[0058] In some implementations, the first gas panel surface may include a plurality of first port surfaces defining a first gas distribution port, and each of the second set of locations may be located on the first port surface of the panel.

[0059] In some implementations, when the panel is assembled to the collar, for each of at least some of the positions in the second set of positions, there may be no direct line of sight from that position to the corresponding viewpoint outside the assembled collar and panel.

[0060] In some implementations, the collar and the panel may each have multiple second gas collar surfaces and multiple second gas panel surfaces, which together define the first set of second gas flow paths within the nozzle when the collar and the panel are connected.

[0061] In some such implementations, the first set of second gas paths can be fluidly isolated from the first set of first gas paths within the nozzle.

[0062] In some alternative implementations, the second gas collar surface may include an inner peripheral surface facing the central axis of the nozzle, and the second gas panel surface may include a plurality of second port surfaces defining a plurality of second gas distribution ports.

[0063] In some such implementations, each of the first set of positions may be located on the inner peripheral surface of the collar.

[0064] In some implementations, each of the second set of positions may be located on the second port surface of the panel.

[0065] In some such implementations, when the panel is assembled to the collar, for each of at least some of the positions in the second set of positions, there may be no direct line of sight from that position to the corresponding viewpoint outside the assembled collar and panel.

[0066] In some implementations, the panel may have a first surface and a second surface, with a first gas distribution port extending from the lateral channel to the second surface and a second gas distribution port extending from the first surface to the second surface.

[0067] In some implementations, each first gas distribution port may have a first diameter, and each second gas distribution port may have a second diameter greater than the first diameter.

[0068] In some implementations, the second diameter of the second gas distribution port can be as high as 0.5 mm.

[0069] In some implementations, the second diameter of the second gas distribution port can be up to 1.5 mm. In some such implementations, each lateral channel can have a third diameter of up to 7 mm.

[0070] In some implementations, the nozzle may further include a cover plate removably coupled to a collar via a second set of multiple fasteners and having multiple second gas cover plate surfaces. At least some of the second gas cover plate surfaces, the second gas collar surfaces, and the second gas panel surfaces may collectively define a central feed inflation chamber.

[0071] In some such implementations, for each of the third set of positions, when the cover is detached from the collar and viewed individually, there may be multiple direct lines of sight from that position to the corresponding viewpoint outside the cover, and each of the third set of positions may be located on the surface of one or more second gas cover plates.

[0072] In some implementations, the cover plate may include an outer edge region and a central region disposed radially inward from the outer edge region. The cover plate may further include one or more first gas inlet openings located in the outer edge region and fluidly connected to one or more first gas inlets located in the collar. The cover plate may also include a second gas inlet opening located in the central region and fluidly connected to the central feed chamber.

[0073] In some implementations, the collar may include a heating element, and the one or more first gas inlets in the collar may be nonlinear and may pass between the heating element and the inner annular surface of the collar.

[0074] In some implementations, the corrosion-resistant layer may include nickel or aluminum oxide.

[0075] In some implementations, the corrosion-resistant layer can be generated using an electrochemical deposition process.

[0076] In some implementations, the first gas flow path in the first group may not include blind holes.

[0077] In some implementations, the collar may include a blind hole and a thermocouple located within the blind hole.

[0078] In some implementations, the first position in the first set of positions may include all positions located on the surface of the first gas collar.

[0079] In some implementations, all of the positions in the first set of positions on the surface of the first gas collar may define at least 80% of the total surface area of ​​the first gas collar surface.

[0080] Other applications of the invention will become apparent from the detailed description provided below. It should be understood that the detailed description and specific examples are for illustrative purposes only and are not intended to limit the scope of the invention. Attached Figure Description

[0081] The invention will be more fully understood from the detailed description and accompanying drawings, wherein: Figure 1 A schematic diagram of an exemplary semiconductor processing system with multiple exemplary nozzles is depicted.

[0082] Figure 2 Depicting Figure 1 An exploded perspective view of one of the nozzles, showing a nozzle with a cover, collar, and panel that are removably coupled to each other by multiple fasteners.

[0083] Figure 3 Depicting Figure 2 Top plan view of the nozzle.

[0084] Figure 4 Depicting Figure 3 Perspective section view taken along line 4-4 of the nozzle.

[0085] Figure 5 Depicting Figure 4 An enlarged view of area 1 of the nozzle shows the implementation of the nozzle, in which fasteners in a first group of multiple threaded fasteners removably connect the cover plate to the collar, while fasteners in a second group of multiple threaded fasteners removably connect the collar to the panel.

[0086] Figure 6 Depicting Figure 3 A cross-sectional view taken along line 6-6 of the nozzle depicts a cover, collar, and panel having a first flow path surface (which together define a first set of first gas flow paths including the peripheral feed chamber) and a second flow path surface (which together define a first set of second gas flow paths including the central feed chamber fluidly isolated from the peripheral feed chamber within the nozzle).

[0087] Figure 7 for Figure 6 An enlarged view of region 2 of the nozzle shows the implementation of the nozzle having a portion of a first set of first gas flow paths, including a first gas inlet opening in a cover plate, a first gas inlet in a collar, a peripheral feed chamber in a panel, and an annular manifold through which fluid is inserted between the first gas inlet and the peripheral feed chamber.

[0088] Figure 8 Depicting Figure 2 An enlarged perspective cross-section of a portion of the nozzle, without a cover plate, showing the contact leads for the heating element.

[0089] Figure 9 Depicting Figure 8 Another enlarged perspective cross-section of the nozzle shows the heating element and the blind hole configured to accommodate the thermocouple.

[0090] Figure 10 Depicting Figure 1 An exploded view of the nozzle, showing it without a cover and the collar detached from the panel.

[0091] Figure 11 Depicting Figure 10 A perspective section taken along line 11-11 of the collar shows that the collar has an inner peripheral surface and an inner annular surface, both of which face radially inward toward the central axis of the nozzle.

[0092] Figure 12 Depicting Figure 11 An enlarged view of region 3 of the collar, wherein when the collar is removed from the cover and viewed separately, the position of each of the inner peripheral surface and the inner annular surface is within multiple direct lines of sight from multiple corresponding viewpoints outside the collar.

[0093] Figure 13 Depicting Figure 10 A side view of the panel, showing the panel with a peripheral feed inflation chamber (containing multiple transverse channels).

[0094] Figure 14 Depicting Figure 13 A perspective section taken along line 14-14 of the panel shows a plurality of peripheral feed chambers defined by the surfaces of the peripheral feed chambers, having a first set of transverse channels and a second set of transverse channels. When the panel is detached from the collar and viewed alone, the positions on the surfaces of the peripheral feed chambers are located in multiple direct lines of sight from multiple corresponding viewpoints outside the panel.

[0095] Figure 15 Depicting Figure 13 Perspective section view taken along the panel line 15-15.

[0096] Figure 16 Depicting Figure 10 A perspective section of the panel, showing one of the channels in the first group of channels in the panel.

[0097] Figure 17 Depicting Figure 16 An enlarged view of area 4 of the panel, showing multiple first gas distribution ports located in the panel and fluidly connected to corresponding channels in the first group of channels.

[0098] Figure 18 Depicting Figure 10 A perspective cross-section of the panel, showing a portion of each of the first group of channels in the panel.

[0099] Figure 19 Depicting Figure 18 An enlarged view of area 5 of the panel, showing a plurality of second gas distribution ports extending from the surface of the second central feed chamber of the panel to the outward surface of the panel and fluidly isolated from the first set of channels within the panel.

[0100] Figure 20 Depicting Figure 6 A cross-sectional view of the cover plate, showing that when the cover plate is detached from the collar and viewed alone, the cover plate with the surface of the first central feed chamber is located in multiple direct lines of sight from multiple corresponding viewpoints outside the cover plate.

[0101] Figure 21 An off-angle view of another panel is depicted according to various implementation schemes.

[0102] Figure 22 Depicting Figure 21 A magnified, off-angle view of a portion of the panel.

[0103] Figure 23 Depicting Figure 21 A magnified, off-angle view of another part of the panel.

[0104] Figure 24 It depicts an off-angle view of a portion of another panel.

[0105] Figure 25 An enlarged cross-sectional view of a portion of another panel is depicted.

[0106] Figure 26 Depicting Figure 25 A magnified view of the panel.

[0107] Figure 27 Depicting Figure 21 A cross-sectional view of another part of the panel.

[0108] Figure 28 A schematic diagram depicting the panel and internal gas passages is shown.

[0109] Figure 29 An enlarged cross-sectional view of a portion of the panel is depicted.

[0110] Figure 30 An angular cross-sectional view of a nozzle with a panel connected to a nozzle collar and a cover plate is depicted.

[0111] Figure 31 An off-angle cross-section of a portion of the panel is depicted.

[0112] Figure 32 Depicting Figure 22 A magnified view of a portion of the image.

[0113] Figure 33 A schematic diagram of an implementation scheme for a multi-station processing tool is depicted.

[0114] Specific implementation scheme refer to Figure 1 The semiconductor processing system 100 (e.g., a chemical deposition system, a thermal processing system, etc.) includes one or more nozzles 102 configured to flow one or more process gases during one or more semiconductor processing operations (e.g., deposition processes, fabrication processes, thermal processing processes, etc.). The semiconductor processing system 100 further includes a processing chamber 104 having an internal volume 106 and one or more wafer supports 108 disposed within the internal volume 106 and configured to support a corresponding substrate 110. The one or more nozzles 102 (e.g., embedded nozzles, pendant nozzles, etc.) are disposed above the wafer supports 108 and are used to flow one or more process gases onto the substrate 110 during the one or more semiconductor processing operations performed within the internal volume 106 of the processing chamber 104.

[0115] The semiconductor processing system 100 further includes a gas distribution system 112 having multiple valves 114 controllable to selectively direct one or more process gases from multiple different gas sources 116 connectable to the gas distribution system 112 through one or more flow paths of each nozzle 102 to a corresponding substrate 110 within the internal volume 106 of the processing chamber 104. The flow path in each nozzle 102 may be defined by a corresponding flow path surface, and each flow path surface may have a corrosion-resistant layer or barrier layer, such as an anti-corrosion coating, protecting the corresponding flow path surface from the composition of the one or more process gases (e.g., containing chlorides, hydrogen chloride, etc.) and from corrosion caused by semiconductor processing operations. During semiconductor processing operations, the one or more process gases may cause untreated flow path surfaces (i.e., any flow path surface without a corrosion-resistant layer) to corrode and release particles into the one or more process gas streams. These particles may contaminate the corresponding wafers and cause one or more defects in those wafers.

[0116] The corrosion-resistant layer can be formed on the flow path surface of the nozzle by one or more electrochemical processes (e.g., electroplating, electroless plating, anodizing, etc.) prior to (i.e., before the nozzle is used in the semiconductor processing operation). The nozzle may be immersed in a chemical bath (e.g., plating bath, anodizing bath, etc.), and material from the chemical bath may be deposited onto the flow path surface that is in direct contact with the chemical bath. However, some nozzles may include multiple components brazed or welded together and may include one or more blind holes defining a portion of the flow path. Gas trapped in these blind holes may inhibit the flow of chemical bath into and / or out of the portion of the flow path defined by the blind hole, resulting in incomplete plating or ineffective removal of plating solution residues, either of which may then lead to subsequent particulate contamination problems during processing. If the chemical bath adequately reaches and treats all flow path surfaces, a portion of the chemical bath may accumulate in that portion of the flow path defined by the blind hole, and this portion of the chemical bath may not be adequately removed from these blind holes after the electrochemical process has been completed.

[0117] Maintenance of the nozzle during its service life includes periodic cleaning to remove material (e.g., particles, residues, etc.) deposited from the process gases during one or more semiconductor processing operations onto the flow path surfaces within the nozzle. Without periodic cleaning, the deposited material may impede the flow of the process gases through one or more flow paths within the nozzle, and the impeded airflow may adversely affect the semiconductor processing operation. Additionally, the deposited material may detach from the corresponding flow path surface, contaminate the corresponding wafer, and introduce defects into the wafer. The cleaning procedure may include introducing one or more high-speed cleaning fluids into the flow paths within the nozzle. The nozzle (e.g., a nozzle with brazed or welded components) may have flow paths defined by flow path surfaces that are not located outside the nozzle from any viewpoint or within one or more direct lines of sight of the cleaning nozzles located at that viewpoint.

[0118] Therefore, the cleaning fluid may not directly impact certain flowpath surfaces embedded within the nozzle (i.e., flowpath surfaces not directly in the line of sight of the cleaning nozzle). The cleaning fluid may subsequently indirectly impact flowpath surfaces not directly in the line of sight of the cleaning nozzle after being deflected or redirected by one or more upstream flowpath surfaces. If any cleaning fluid is received by flowpath surfaces not directly in the line of sight of the cleaning nozzle, the efficiency of the cleaning process is reduced because the velocity of the cleaning fluid reaching these flowpath surfaces may be significantly lower than the velocity of the cleaning fluid leaving the cleaning fluid nozzle. Furthermore, for nozzles with one or more portions of the flowpath defined by blind orifices, trapped gas may prevent the cleaning fluid from reaching these portions. Alternatively, if the cleaning fluid reaches and processes that portion of the flowpath defined by the blind orifice, a portion of the cleaning fluid may accumulate within the corresponding blind orifice, and the cleaning fluid may not be adequately removed from these blind orifices.

[0119] Some nozzles present additional or alternative challenges compared to those described above. For example, some nozzle assemblies may have an internal gas chamber, such as a centrally fed gas chamber formed between the cover plate (or top plate) and the panel, which may have a dead volume that could lead to undesirable effects, such as slow sweeping, poor sweeping and cleaning, uneven airflow, uneven deposition, high dilution that could waste process gases (e.g., precursors), and particle formation. For example, some dead volumes may be located at the outer edge of the gas chamber. Some nozzles may also have multiple via configurations, which can also produce undesirable effects, such as jetting (e.g., localized high-speed gas at the wafer plane) and uneven flow. This document provides nozzles and nozzle panels configured to provide numerous advantages, such as reduced undesirable dead volumes, smaller gas chamber volumes, and via configurations configured to improve flow control and gas delivery. Features of these designs are shown separately but can be combined in various implementations to form combinations not shown in the figures.

[0120] As described in detail below, the nozzle 102 includes multiple components (e.g., cover plate 118, collar 120, panel 122, etc.), each having one or more first flow path surfaces and / or one or more second flow path surfaces. These components are removably coupled to each other, wherein the first flow path surfaces (e.g., one or more first gas cover plate surfaces 124 of cover plate 118, one or more first gas collar surfaces 126 of collar 120, one or more first gas panel surfaces 128 of panel 122, etc.) collectively define a first set of first gas flow paths 140 in the nozzle 102, while the second flow path surfaces (e.g., one or more second gas cover plate surfaces 130 of cover plate 118, one or more second gas collar surfaces 132 of collar 120, one or more second gas panel surfaces 134 of panel 122, etc.) collectively define a first set of second gas flow paths 141 in the nozzle 102. When a component is detached from other components and viewed individually, the first and second flow path surfaces can each be located within multiple direct lines of sight from multiple corresponding viewpoints outside the component. Direct lines of sight at one or more locations on the first and second flow path surfaces allow fluid flow from outside each component to directly reach each location on both surfaces (e.g., during cleaning or plating operations), thus facilitating the application of a corrosion-resistant or barrier layer by electrochemical processes (e.g., electroplating, electroless plating, anodizing, etc.) without the risk of chemical bath buildup or inadequate removal from the component's flow path. Individual components (i.e., those detached from other components) can be immersed in a chemical bath (e.g., plating bath, anodizing bath, etc.), and the liquid in the chemical bath can flow along multiple vectors to directly impact and treat each location on each flow path surface in the nozzle, without any liquid buildup from the chemical bath or retention in any portion of the flow path within the component. In one implementation, the chemical bath may be a chemical solution containing a desired metal dissolved in the form of submicroscopic metal particles (positively charged ions) to provide a corrosion-resistant layer (e.g., a nickel layer, an ALD-based alumina layer, an anodic oxide layer, etc.). During periodic cleaning or maintenance throughout the nozzle's lifespan (e.g., when the plating layer may wear, corrode, or be damaged after a certain amount of use), components can be disassembled for cleaning and repair (e.g., replating, etc.). Direct line-of-sight at one or more locations on the first and second flow paths allows for the guidance of one or more cleaning fluids at a speed that enables shear forces to directly impact each location on each flow path surface along multiple vectors and clean these surfaces. Direct line-of-sight at one or more locations on the first and second flow paths allows for the cleaning of components, removal of process particles and residues, and subsequent replating without resulting in the accumulation or inadequate removal of cleaning fluid and / or replating bath.

[0121] refer to Figure 2-5The nozzle 102 includes a panel 122 removably coupled to a collar 120 using a first set of multiple fasteners 136 (e.g., bolts, etc.). The nozzle 102 further includes a cover plate 118 removably coupled to the collar 120 via a second set of multiple fasteners 138 (e.g., bolts, etc.). In other implementations, the panel 122 is removably coupled to the collar 120, and / or the cover plate 118 is removably coupled to the collar 120 via any number of fasteners and any suitable type of fastener (e.g., cam-lock fasteners, clamping mechanisms, etc.).

[0122] like Figure 6 and 7 As shown, the cover plate 118, collar 120, and panel 122 each have a plurality of first gas cover plate surfaces 124, a plurality of first gas collar surfaces 126, and a plurality of first gas panel surfaces 128. When the cover plate 118 is connected to the collar 120 and the collar 120 is connected to the panel 122, they collectively define a first set of first gas flow paths 140 within the nozzle 102. In this implementation, the cover plate 118 includes one or more first gas inlet openings 142 of the first set of first gas flow paths 140. These one or more first gas inlet openings 142 are configured to connect with the gas distribution system 112 (… Figure 1 The cover plate 118 may include an outer edge region 144 and a central region 146 disposed radially inward from the outer edge region 144. Figure 6 One or more first gas cover surfaces 124 of cover 118 may be located in outer edge region 144 and define one or more corresponding first gas inlet openings 142 (e.g., two first gas inlet openings 142 located on opposite sides of the outer edge region 144 of cover 118). Cover 118 may further include a second gas cover surface 130 located in central region 146 and defining second gas inlet openings 148 of a first set of second gas flow paths 141. Figure 6 The second gas inlet opening 148 is fluidly connected to the gas distribution system 112 and allows the flow of one or more process gases from one or more different gas sources 116.

[0123] One or more first gas collar surfaces 126 of collar 120 may define corresponding one or more first gas inlets 150 for a first set of first gas flow paths 140. The one or more first gas inlets 150 may be in fluid communication with the one or more first gas inlet openings 142 in cover plate 118. In this implementation, the one or more first gas collar surfaces 126 define two first gas inlets 150, located on opposite diameter sides of collar 120 and in fluid communication with two first gas inlet openings 142 in cover plate 118. Figure 7As shown, the collar 120 further includes a heating element 152, and the one or more first gas inlets 150 in the collar 120 are non-linear and configured to pass between the heating element 152 and the inner annular surface 154 of the collar 120. The collar 120 may further include a blind hole 156. Figure 9 ) and thermocouple 158 located in blind hole 156.

[0124] like Figure 7 Most clearly shown, one or more additional first gas collar surfaces 126 of collar 120 and one or more first gas panel surfaces 128 of panel 122 may together define an annular manifold 160 fluidly connected to the one or more first gas inlets 150. In this implementation, the additional first gas collar surface 126 of collar 120 may include an inner annular surface 154, at least a portion of which faces radially inward toward the central axis of nozzle 102 and has a first collar diameter CD1. The first gas panel surface 128 of panel 122 includes an outer annular surface 162, the panel diameter FD of which is smaller than the first collar diameter CD1 of the inner annular surface 154 of collar 120. At least a portion of the outer annular surface 162 faces radially outward from the central axis of nozzle 102 toward the inner annular surface 154 of collar 120. The inner annular surface 154 of collar 120 and the outer annular surface 162 of panel 122 define an annular manifold 160 of a first set of first gas flow paths 140. When the collar 120 is connected to the panel 122, the annular manifold 160 is fluid-inserted between the one or more first gas inlets 150 in the collar 120 and the peripheral feed chamber 164 in the panel 122.

[0125] refer to Figure 13-15 An additional first gas panel surface 128 of panel 122 may define a peripheral feed chamber 164 in fluid communication with an annular manifold 160. These first gas panel surfaces 128 may include a plurality of peripheral feed chamber surfaces 166 (e.g., Figure 14 The surface 168 of the first peripheral feed inflation chamber shown Figure 15 The second peripheral feed chamber surface 170, shown and facing the first peripheral feed chamber surface 168, defines a peripheral feed chamber 164 that is fluidly connected to the annular manifold 160.

[0126] In this implementation, the outer feed inflation chamber surface 166 defines the annular manifold 160. Figure 7 Multiple transverse channels 172 (i.e. transverse boreholes) are fluid-connected. Figure 16 A perspective sectional view of panel 122 is depicted, showing a complete channel in the first group of channels 174. Figure 17 Show Figure 17 A magnified view of area 4. Figure 18Another perspective section of panel 122 is depicted, showing a portion of all the channels in the first group of channels 174. Figure 19 Show Figure 18 An enlarged view of region 5. The transverse channel 172 may include a first set of channels 174 fluidly connected to the annular manifold 160 and a second set of channels 176 fluidly connected to the annular manifold 160. Each channel in the first set of channels 174 and the second set of channels 176 has a pair of opposing ends 178a, 178b, respectively terminating at a pair of portions of the outer annular surface 162 and respectively fluidly connected to the annular manifold 160. In this implementation, the second set of channels 176 may be a mirror image of the first set of channels. The channels in the first set of channels 174 may intersect and be fluidly connected to the channels in the second set of channels 176. The channels in the first set of channels 174 are arranged parallel to each other and parallel to a first direction D1, and the channels in the second set of channels 176 are arranged parallel to each other and parallel to a second direction D2. In this implementation, the channels in the first set of channels 174 are arranged orthogonally to the channels in the second set of channels 176 (e.g., the first direction D1 is orthogonal to the second direction D2). The first gas panel surface 128 further includes a plurality of first port surfaces 180 defining a plurality of first gas distribution ports 182 that are fluidly connected to the lateral channel 172 and extend from the second peripheral feed inflation chamber surface 170 of the panel 122 to the outward surface 184 of the panel 122. Figure 17 ).

[0127] refer to Figure 6When the cover plate 118 is connected to the collar 120 and the collar 120 is connected to the panel 122, the second gas cover plate surface 130, the second gas collar surface 132, and the second gas panel surface 134 together define a first set of second gas flow paths 141 within the nozzle 102. In this implementation, at least some of the second gas cover plate surface 130, the second gas collar surface 132, and the second gas panel surface 134 define a central feed chamber 186 that is fluidly connected to the second gas inlet opening 148 in the central region 146 of the cover plate 118. The second gas collar surface 132 includes an inner peripheral surface 188 that faces radially inward toward the central axis of the nozzle 102. The inner peripheral surface 188 may have a second collar diameter CD2 that is smaller than the first collar diameter CD1 of the inner annular surface 154. In other implementations, the second collar diameter CD2 of the inner peripheral surface 188 may be equal to or greater than the first collar diameter CD1 of the inner annular surface 154. The second gas cover surface 130 and the second gas panel surface 134 respectively include a first central feed inflation chamber surface 190 of cover 118 and a second central feed inflation chamber surface 192 of panel 122, which face each other and are spaced apart from each other. The inner peripheral surface 188 of collar 120, the first central feed inflation chamber surface 190 of cover 118, and the second central feed inflation chamber surface 192 of panel 122 together define a central feed inflation chamber surface 186 fluidly connected to the second central feed inflation chamber surface 192 in the central region of cover 118. An additional second gas panel surface 134 may further include a plurality of second port surfaces 194 extending from the second central feed inflation chamber surface 192 of panel 122 to the outwardly facing surface 184 of panel 122. Figure 19 The second port surface 194 may define a plurality of second gas distribution ports 196 that are fluidly connected to the central feed gas chamber 186.

[0128] The first gas flow path 140 (e.g., through the first gas inlet opening 142 in the cover plate 118, the first gas inlet 150 in the collar 120, the annular manifold 160, the peripheral feed chamber 164 in the panel 122, and the first gas distribution port 182 in the panel 122) is fluidly isolated within the nozzle 102 from the first second gas flow path 141 (e.g., through the second gas inlet opening 148 in the cover plate 118, the central feed chamber 186, and the second gas distribution port 196 in the panel 122). Neither the first gas flow path 140 nor the first second gas flow path 141 includes blind holes.

[0129] When each component is detached from the others and viewed individually, one or more locations on the flow path surface may be within multiple direct lines of sight from a corresponding viewpoint outside that component. These direct lines of sight allow the component to have an aspect ratio higher than a predetermined ratio threshold (e.g., 1,000:1), and the corrosion-resistant layer maintains conformality (i.e., a homogeneous coating of uniform thickness) on all flow path surfaces of each component. In one implementation, each first gas distribution port 182 has a first diameter DP1, and each second gas distribution port has a second diameter DP2 greater than the first diameter DP1. The first diameter DP1 of the first gas distribution port 182 may be up to 0.5 mm (e.g., when the corrosion-resistant layer is made of ALD-based Al2O3); the second diameter DP2 of the second gas distribution port 196 may be up to 1.0 mm; and the diameter CP of each lateral channel 172 may be up to 6.0 mm.

[0130] refer to Figure 10-12 For each of the first set of positions, when the collar 120 is detached from the panel 122 and the cover plate 118 and viewed independently, there are multiple corresponding viewpoints from that position to the outside of the collar 120 (e.g., Figure 12 Multiple direct lines of sight (VP1, VP2, VP3, VP4, VP5, and VP6). Each of the first set of locations is situated on one or more first gas ring surfaces 126 (e.g., the one or more first gas inlets 150 in the ring 120, the inner annular surface 154 of the ring 120) and one or more second gas ring surfaces (e.g., the inner peripheral surface 188 of the ring 120). When the ring 120 is detached from the panel 122 and the cover 118 and viewed individually, each of these locations is configured to receive and be directly impacted by electrolyte from the chemical bath during the plating process or replating process (e.g., without any change in flow direction within the relevant component). Each of these surfaces is configured to allow fluid to flow through the ring 120 and prevent fluid from accumulating in or being inadequately cleared from the first and second gas paths within the ring 120. In one implementation, the direct line of sight to these locations allows each of these locations to receive and be directly impacted by a high-speed flow of cleaning fluid, for example, during a cleaning procedure to remove residues (e.g., material deposited from one or more process gases) or a stripping process to remove degraded, eroded, or worn corrosion-resistant layers before a replating process.

[0131] In one implementation, the first position in the first set of positions includes all positions located on the first gas collar surface 126 and the second gas collar surface 132 (e.g., 100% of the total surface area of ​​the first gas collar surface 126 and the second gas collar surface 132, respectively). In other implementations, all positions in the first set of positions on the first gas collar surface 126 and the second gas collar surface 132 respectively define at least 80% of the total surface area of ​​the first gas collar surface 126 and the second gas collar surface 132. When the collar 120 is assembled to the cover plate 118 and the panel 122, for each of at least some of the positions in the first set of positions, there is no direct line of sight from that position to the corresponding viewpoint outside the assembled panel 122, collar 120, and cover plate 118.

[0132] refer to Figure 13-15 For each of the second set of positions, when panel 122 is detached from collar 120 and viewed independently, there are multiple corresponding viewpoints from that position to the outside of panel 122 (e.g., Figure 14 The second set of locations are located on multiple direct lines of sight from viewpoints VP7, VP8, VP9, ​​VP10, VP11, and VP12. Each of these locations is situated on one or more first gas panel surfaces 128 (e.g., the outer annular surface 162 of panel 122, the first peripheral feed gas chamber surface 168 of panel 122, the second peripheral feed gas chamber surface 170 of panel 122, the first port surface 180 of panel 122, etc.) and one or more second gas panel surfaces 134 (e.g., the second central feed gas chamber surface 192 of panel 122, the second port surface 194 of panel 122). Each of these locations is configured to receive and be directly impacted by electrolyte from the chemical bath during the plating or replating process when panel 122 is detached from collar 120 and cover plate 118 and viewed individually. Each of these surfaces is configured to allow fluid to flow through panel 122 and prevent fluid from accumulating in or being inadequately removed from the first and second gas paths within panel 122. In one implementation, the direct line of sight to these locations allows each of these locations to receive and be directly impacted by a high-speed flow of cleaning fluid, for example, during a cleaning procedure to remove residues (e.g., material deposited from one or more process gases) or a stripping process to remove degraded, eroded, or worn corrosion-resistant layers before a replating process.

[0133] In one implementation, the first position in the second set of positions includes all positions located on the first gas panel surface 128 and the second gas panel surface 134 (e.g., 100% of the total surface area of ​​the first gas panel surface 128 and the second gas panel surface 134, respectively). In other implementations, all positions in the second set of positions on the first gas panel surface 128 and the second gas panel surface 134 respectively define at least 80% of the total surface area of ​​the first gas panel surface 128 and the second gas panel surface 134. When the panel 122 is assembled to the collar 120 and the collar 120 is assembled to the cover plate 118, for each of at least some of the positions in the second set of positions, there is no direct line of sight from that position to the corresponding viewpoint outside the assembled panel 122, collar 120, and cover plate 118.

[0134] refer to Figure 20 For each of the third set of positions, when the cover plate 118 is detached from the collar 120 and the panel 122 and viewed independently, there are multiple corresponding viewpoints from that position to the outside of the cover plate 118 (e.g., Figure 18 The third set of locations are located on one or more of the first gas cover surface 124 (e.g., the first gas inlet opening 142 in cover 118) and the second gas cover surface 130 (e.g., the second gas inlet opening 148 in cover 118, the first central feed gas chamber surface 190 in cover 118, etc.). When cover 118 is detached from collar 120 and panel 122 and viewed individually, each of these locations is configured to receive and be directly impacted by electrolyte from the chemical bath during plating or replating processes. Each of these surfaces is configured to drain or remove electrolyte from cover 118 and prevent electrolyte buildup in or from being adequately removed from the first and second gas paths within cover 118. In one implementation, the direct line of sight to these locations allows each of these locations to receive and be directly impacted by a high-speed flow of cleaning fluid, for example, during a cleaning procedure to remove residues (e.g., material deposited from one or more process gases) or a stripping process to remove degraded, eroded, or worn corrosion-resistant layers before a replating process.

[0135] In one implementation, the first position in the third set of positions includes all positions located on the first gas cover surface 124 and the second gas cover surface 130 (e.g., 100% of the total surface area of ​​the first gas cover surface 124 and the second gas cover surface 130, respectively). In other implementations, all positions in the third set of positions on the first gas cover surface 124 and the second gas cover surface 130 define at least 80% of the total surface area of ​​the first gas cover surface 124 and the second gas cover surface 130, respectively. When the cover 118 is assembled to the collar 120 and the panel 122, for each of at least some of the positions in the third set, there is no direct line of sight from that position to a corresponding viewpoint (e.g., VP13 to VP15) outside the assembled panel 122, collar 120, and cover 118.

[0136] The first gas collar surface 126 of collar 120, the second gas collar surface 132 of collar 120, the first gas panel surface 128 of panel 122, the second gas panel surface 134 of panel 122, the first gas cover surface 124 of cover plate 118, and the second gas cover surface 130 of cover plate 118 each have a corrosion-resistant layer or a barrier layer to protect the corresponding flow path surface from the effects of the composition of one or more process gases (e.g., containing chlorides, hydrogen chloride, etc.) and the semiconductor processing operation. The corrosion-resistant layer may include nickel or aluminum oxide, and the corrosion-resistant layer may be generated by an electrochemical deposition process. The corrosion-resistant layer may be generated on each of these flow path surfaces by one or more electrochemical processes (e.g., electroplating, electroless plating, anodizing, etc.) prior to (i.e., before the use of the nozzle in the semiconductor processing operation). The nozzle can be immersed in a chemical bath (e.g., plating bath, anodizing bath, etc.), and the material from the chemical bath can be deposited onto the flow path surface that is in direct contact with the chemical bath, without any liquid from the chemical bath subsequently accumulating in the flow path or not being adequately removed from these flow paths after the plated parts are removed from the chemical bath.

[0137] This document provides additional or alternative panel implementations. Some such panels have peripheral sidewalls configured to reduce the ineffective volume within the central feed chamber of the nozzle. In some instances, the peripheral sidewalls may have multiple straight sidewalls that intersect adjacent straight sidewalls at alternating corners between interior and exterior angles. In some implementations, the peripheral sidewalls may have a stepped shape. The peripheral sidewalls are configured to minimize the open volume within the chamber outside the outermost orifice. The shape of the peripheral sidewall is configured to conform to the orifice pattern, and the wall may be close to the outermost orifice, for example, as close as possible to the orifice within given manufacturing constraints, and in some instances, tangent to the orifice edge.

[0138] Figure 21An off-angle view of another panel according to various implementations is depicted. Here, panel 2122 has a body portion 2191 that at least partially forms or defines a back surface 2192 and a front surface 2184. As can be seen, the back surface 2192 is offset from the front surface 2184, and the body portion 2191 spans between the front surface 2184 and the back surface 2192. In some instances, these surfaces may be parallel or substantially parallel to each other (e.g., differing from parallelism by less than 5%). The back surface 2192 may be the same surface as the second center-feed inflation chamber surface 192 provided herein, while the front surface 2184 may be the same surface as the outward-facing surface 184 provided herein. The front surface 2184 is configured to face the substrate for processing. The back surface 2192 is configured to form a center-feed inflation chamber, such as inflation chamber 186, with a cover plate 118.

[0139] Panel 2122 also includes a plurality of through-holes 2196 that extend from the back surface 2192 through the entire body portion 2191 and reach the front surface 2184. These through-holes 2196 may be identical to the plurality of second gas distribution ports 196 provided above. As described, when cover 118 is attached to panel 2122, these through-holes 2196 are fluidly connected to the central feed inflation chamber 186 and provide fluid connection from the inflation chamber 186 to the exterior of the front surface 2184; this will be discussed below and in [further details to be added]. Figure 30 As shown in the image. In some instances, such as... Figure 21 In this process, the vias 2196 may have a constant diameter and may extend along a linear path perpendicular to the back surface 2192. The vias 2196 may also have a port surface 2194 similar to the second port surface 194 provided above.

[0140] The panel 2122 of this document also has a peripheral wall 2151 adjacent to the back surface 2192, surrounding the plurality of through holes 2196, and having a plurality of first straight wall segments 2153, four of which are labeled 2153A-D. Each first straight wall segment 2153 intersects with an adjacent first straight wall segment 2153 at a corner, and each corner may alternate between an interior angle and an exterior angle. For interior angles, two first straight wall segments form, for example, an angle less than 180 degrees, such as approximately 120 degrees, approximately 90 degrees, and approximately 60 degrees. For exterior angles, two first straight wall segments form, for example, an angle greater than 180 degrees, such as approximately 240 degrees and approximately 270 degrees. These corners will be referenced to Figure 22 Further discussion, Figure 22 Depicting Figure 21 A magnified, off-angle view of a portion of the panel.

[0141] Here Figure 22 In, it is shown Figure 21A portion of panel 2122, and four exemplary first straight wall segments labeled 2153A-D. First straight wall segment 2153A intersects with an adjacent first straight wall segment 2153B at an interior angle 2155A. First straight wall segments 2153A and 2153B form an angle less than 180 degrees at this interior angle 2155A, for example, approximately 90 degrees in this example. First straight wall segment 2153B intersects with an adjacent first straight wall segment 2153C at an exterior angle 2157A. These first straight wall segments 2153B and 2153C form an angle greater than 180 degrees at this exterior angle 2157A, for example, approximately 270 degrees in this example. First straight wall segment 2153C intersects with an adjacent first straight wall segment 2153D at another interior angle 2155B, and these first straight wall segments 2153A and 2153B form another angle less than 180 degrees, for example, approximately 90 degrees in this example. The first straight wall segment 2153D intersects the adjacent first straight wall segment 2153E at another external angle 2157B, and these first straight wall segments form an angle greater than 180 degrees, for example, approximately 270 degrees in this example. These angles between each first straight wall segment alternate between interior and exterior angles, such as... Figure 22 As shown. Return to reference. Figure 21 Some exemplary interior angles 2155 and exterior angles 2157 are marked.

[0142] In some implementations, the peripheral wall may have one or more second straight wall segments longer than the first straight wall segment. A second straight wall segment may span between the two first straight wall segments, and the corresponding intersection point between the second straight wall segment and the two first straight wall segments may be located at an interior angle. (Return to Reference) Figure 21 The peripheral wall 2151 has a second straight wall segment 2159A spanning between the first straight wall segments 2153F and 2153G. The second straight wall segment 2159A intersects the first straight wall segment 2153F at an interior angle 2155F, and the second straight wall segment 2159A intersects the first straight wall segment 2153G at another interior angle 2155G. In some implementations, the two second straight wall segments are located on either side of a plurality of first straight wall segments. For example, see... Figure 21 The second vertical wall segment 2159A and the second vertical wall segment 2159B are located on opposite ends or sides of a set of first vertical wall segments.

[0143] Figure 23 Depicting Figure 21 A magnified, off-center view of another part of the panel. Compared to Figure 21 For clarity, many markings have been removed. Here, a set of first straight wall segments 2161 (along with alternating interior and exterior angles) is surrounded by a dotted shape. As can be seen, this set of first straight wall segments 2161 is interposed between two second straight wall segments 2159A and 2159B. The second straight wall segments are longer than the first straight wall segments. In some instances, the second straight wall segments are at least two, three, four, five, or six times longer than the first straight wall segments. Figure 23Two interior angles 2155F and 2155G are also visible, where the second straight wall segment 2159A intersects with the first straight wall segments 2153F and 2153G respectively. In some instances, the peripheral wall 2151 can be considered as a stepped sidewall or a stepped wall.

[0144] In some implementations, each first vertical wall segment can be oriented at approximately 90 degrees relative to the adjacent first vertical wall segment. For example, see reference. Figure 22 The first straight wall segment 2153A is oriented at approximately 90 degrees to the adjacent first straight wall segment 2153B; the first straight wall segment 2153B is oriented at approximately 90 degrees to the adjacent first straight wall segments 2153A and 2153C; the first straight wall segment 2153C is oriented at approximately 90 degrees to the adjacent first straight wall segments 2153B and 2153D; and the first straight wall segment 2153D is oriented at approximately 90 degrees to the adjacent first straight wall segment 2153C. In some such implementations, interior angles form an angle of approximately 90 degrees, while exterior angles form an angle of approximately 270 degrees. The orientations of adjacent straight wall segments can alternate and repeat. For example, each other first straight wall segment can be oriented parallel to each other. Figure 22 In the first vertical wall segments 2153A, 2153C and 2153E, they are parallel to each other, and the first vertical wall segments 2153B, 2153D and 2153F are parallel to each other.

[0145] In some implementations, each first vertical wall segment may be oriented at a non-perpendicular angle relative to the adjacent first vertical wall segment. For example, these angles may include, for instance, about 60 degrees, about 120 degrees, 140 degrees, about 160 degrees, about 200 degrees, about 220 degrees, about 240 degrees, or about 260 degrees. Figure 24 An off-angle view of a portion of another panel is depicted. Here, panel 2422 has a body portion 2491 of front surface 2484 offset from back surface 2492 and a plurality of through holes 2496 extending from front surface 2484 through body portion 2491 to back surface 2492. The peripheral wall 2451 has a plurality of first straight wall segments 2453 oriented at a non-perpendicular angle relative to adjacent first straight wall segments 2453.

[0146] For example, the first straight wall segment 2453A is adjacent to the first straight wall segment 2453B, and the two segments intersect with an exterior angle 2457A forming an angle greater than 180 degrees. Here, the first straight wall segment 2453A is oriented at a non-perpendicular angle relative to the first straight wall segment 2453B (which is the same angle as the exterior angle 2457A), and this angle can range from, for example, about 180 degrees to about 270 degrees, such as about 200 degrees, about 220 degrees, about 225 degrees, about 240 degrees, or about 260 degrees. Further as... Figure 24As shown, the first straight wall segment 2453B intersects the adjacent first straight wall segment 2453C at an interior angle 2455A (which forms an angle of less than 180 degrees). The first straight wall segment 2453B is oriented at another non-perpendicular angle relative to the first straight wall segment 2453C (which is the same angle as the interior angle 2455A), and this angle can range, for example, from more than 90 degrees to about 175 degrees, such as about 100 degrees, about 120 degrees, about 135 degrees, about 140 degrees, about 160 degrees, or about 175 degrees. In some such instances, the peripheral wall 2451 can be considered as a stepped sidewall or a stepped wall, even if the first straight wall segments are not perpendicular to each other.

[0147] Similarly, at outer corner 2457B, the first straight wall segment 2453C intersects with the adjacent first straight wall segment 2453D (forming an angle greater than 180 degrees), and these two segments may be oriented relative to each other in the same or within the same range as the outer segments 2453A and 2453B. Furthermore, at inner corner 2455B, the first straight wall segment 2453D intersects with the adjacent first straight wall segment 2453E (forming an angle less than 180 degrees), and these two segments may be oriented relative to each other in the same or within the same range as the outer segments 2453B and 2453C. Similar to panel 2122, two longer second straight wall segments may be located on either side or at the end of a set of first straight wall segments. Figure 24 In the middle, a second straight wall segment 2459A intersects with a first straight wall segment 2453F (which intersects with an adjacent first straight wall segment 2453E at an outer corner 2457C). Another straight wall segment 2459B intersects with another first straight wall segment 2453A at the other end of the plurality of first straight wall segments.

[0148] As described herein, the peripheral sidewalls are configured to reduce the inefficient volume of the central feed chamber 186 when panel 2122 is connected to cover 118. In some implementations, the first straight wall section is configured to surround and be adjacent to or close to the external through-hole to reduce this undesirable inefficient volume. In some instances, the first straight wall section may have different configurations based on the pattern of the through-hole. For example, refer to [reference]. Figure 21 Through-holes 2196 are arranged in a square or rectangular pattern on the back surface 2192. To reduce undesirable ineffective volume while still providing sufficient gas and / or plasma flux to the front surface 2184, the peripheral wall 2151 and its first and straight wall sections are close to and adjacent to the outermost through-holes, some of which are designated 2196A. The vertical orientation of the first sidewall sections relative to each other and relative to the second straight wall sections enables the peripheral wall 2151 to be close to all the outermost holes 2196A.

[0149] In another example, return to reference. Figure 24Through-holes 2496 are arranged in a triangular pattern on the back surface 2492. To reduce undesirable ineffective volume while still providing sufficient gas and / or plasma flux to the front surface 2484, the peripheral wall 2451 and its first straight wall segments are close to and adjacent to the outermost through-holes, some of which are labeled 2496A. The non-perpendicular orientation of the first straight wall segments relative to each other and to the second straight wall segments enables the peripheral wall 2451 to be close to all the outermost through-holes 2496A.

[0150] In some implementations, each through-hole has an outer diameter, and the shortest distance between the outermost through-hole and the peripheral wall is the shortest offset distance measured from the center of each through-hole to the peripheral wall, which is, for example, less than or equal to the outer diameter of the through-hole, less than or equal to twice the outer diameter, less than or equal to three times the outer diameter, less than or equal to four times the outer diameter, or less than or equal to six times the outer diameter. For example, in Figure 32 (It depicts) Figure 22 In a partially enlarged view, the outermost through-hole 2196 is shown surrounded by a dashed line shape 2133. An outermost through-hole 2196A is marked, and it is offset from the peripheral wall 2151 by an offset distance 2135A (measured from the center 2137 of through-hole 2196A to the peripheral wall 2151 (e.g., the first straight wall segment 2153A)). This shortest offset distance 2135B may be less than or equal to twice the outer diameter of through-hole 2196A. Another outermost through-hole 2196B is offset from the peripheral wall 2151 by a shortest offset distance 2135B (measured from the center 2137 of through-hole 2196B to the peripheral wall 2151 (e.g., the outer corner 2157A)). This shortest offset distance 2135B may be less than or equal to four times the outer diameter of through-hole 2196B.

[0151] The through-holes in the panel can have various configurations. As provided above, the through-holes can be arranged differently on the back surface, such as rectangular, triangular, rhomboid, rhomboid with a central hole, radially symmetrical circular holes, different hole densities, radial circles, Vogle spirals, etc. The through-holes can also have different arrangements that penetrate the body portion of the panel. (See reference) Figure 21 and 22 The through-hole 2196 is a straight shape with a constant inner diameter. In some instances, each through-hole 2196 extends from the back surface 2192 through the body portion 2191 to the front surface 2184 along an axis perpendicular to the back surface 2192. The inner diameter remains the same along the entire length of each through-hole.

[0152] In some implementations, each through-hole may have a stepped or variable cross-sectional area along its length. See also Figure 24The through-hole 2496 is straight and extends from the back surface 2492 through the body portion 2491 to the front surface 2484 along an axis perpendicular to the back surface 2492. Here, the through-hole 2496 has a stepped inner diameter. For example, each through-hole 2496 has a total length L, a first portion 2463 adjacent to or extending through the back surface 2492 with a first diameter Ø1, and a second portion 2465 adjacent to or extending through the front surface 2484 with a second diameter Ø2. The first and second portions 2463 and 2465 intersect each other at point P1. In some embodiments, the first diameter Ø1 is larger than the second diameter Ø2, such as... Figure 24 As shown. This configuration offers several advantages. For example, the panel can increase heat transfer across the entire plate, thus providing thermal non-uniformity, and the aperture exit prevents hollow cathode discharge. In some instances, stepped apertures provide a low total aperture pressure drop, and the small exit is configured to prevent hollow cathode discharge. In some other implementations, the first diameter Ø1 is smaller than the second diameter Ø2.

[0153] In some other implementations, the through-hole may have a linear portion fluidly connected to multiple branches and may have a tripod shape. For example, each through-hole may have a straight linear portion extending from the back surface within the body portion to a junction or branch point, and two or more branches may extend from the junction to the front surface. Figure 25 An enlarged cross-sectional view of a portion of another panel is depicted. Here, panel 2522 has features that can be used with... Figure 22 The same back surface 2592 and peripheral sidewalls 2551 are shown in the figure. For example, the first straight wall segment 2553A-F and its intersection at the inner angle 2555 and the outer angle 2557 are... Figure 21 and 22 The same as shown. In some other embodiments, the peripheral sidewalls may be as described herein, for example... Figure 24 Those. In some implementations, the peripheral sidewalls may have other configurations, such as circular walls.

[0154] Figure 25 The panel 2522 has through holes 2596, each having a linear portion fluidly connected to multiple branches or forks. For example, the through hole 2596A, enclosed by a dashed ellipse, has a first portion 2567 having a first diameter, which is adjacent to or extends through the back surface 2592 and extends a first length to the junction point JP1. The through hole 2596A also has a second portion having multiple branches 2569A and 2569B that are fluidly connected to the first portion 2567 at the junction point JP1 and extend from the junction point JP1 to and through the front surface 2584.

[0155] Some features of through holes with multiple branches Figure 26 It is even clearer in the middle, Figure 26 Depicting Figure 25The enlarged portion of the panel. Here... Figure 26 As can be seen, through-hole 2596A, along with a portion of the back surface 2592 and the front surface 2584, is visible. The first portion 2567 of through-hole 2596A is a linear portion with a constant inner diameter Ø1 or aperture, which, in some implementations, extends along an axis 2571 perpendicular to the back surface 2592. The first portion has a length L1 measured from the back surface 2592 to the joint point JP1. Two branches 2569A and 2569B of the second portion 2573 extend from the joint point JP1 to and through the front surface 2584. Each of the two branches 2569A and 2569B has an inner diameter Ø2 that may be the same as or smaller than the inner diameter Ø1 of the linear portion 2567. The two branches 2569A and 2569B are also oriented at an obtuse angle relative to the axis 2571. For example, a first angle θ1 is formed between the first part 2567 and the first branch 2569A, which is, for example, an obtuse angle, such as 175 degrees, 165 degrees, 145 degrees, 135 degrees or 120 degrees. A second angle θ2 is formed between the first part 2567 and the second branch 2569B, which is, for example, an obtuse angle, such as 175 degrees, 165 degrees, 145 degrees, 135 degrees or 120 degrees.

[0156] although Figure 25 and 26 Two branches are shown, but in some implementations, these multiple branches have three or more branches. Each branch may be equidistant from each other around axis 2571, and each branch may deviate from the first axis at an obtuse angle. In some instances, each branch may have a branch length. Figure 26 In BL1, branches can have the same branch length. In some instances with internal gas channels, such channels restrict the location and configuration of vias. These branched vias can advantageously provide more outlets to a single inlet, thus avoiding the limitation of the via pattern by internal gas channels. Increasing the number of via outlets offers many advantages, such as reducing undesirable gas jetting (localized high-speed gas on the wafer plane), reducing pressure drop across the panel, and reducing the outlet via size to prevent hollow cathode discharge. Gas jetting is affected by gas outlet velocity, via spacing, and outlet angle. The branched vias presented herein reduce or eliminate these challenges.

[0157] In some implementations, similar to those described above, the panel may have multiple internal gas channels fluidly connected to multiple ports. Gas is configured to flow from the periphery of the panel through the internal gas channels to the ports and into the process volume containing the substrate below the nozzle. The internal gas channels and ports are fluidly isolated within the body portion from vias extending from the front surface to the back surface to provide two separate gas chambers for distributing multiple components (e.g., gases, plasma, etc.) to the substrate. The internal gas channels may be the same as the multiple lateral channels 172 formed by the peripheral feed gas chamber surface 166 provided herein. As used herein, the internal gas channels may be the same as any lateral channels. Panels provided herein (e.g., panels 2122, 2422, and 2522) may have such lateral channels, and these panels may be considered "dual-chamber" panels. In some other embodiments, the panel may not have these lateral channels and may be considered a "single-chamber" panel.

[0158] For example, return to reference Figure 6 , 7 16 and 17, process gases are configured to flow into an annular manifold 160 extending around the outer surface 162 of panel 122. This gas flow defines the peripheral feed chamber 164 of the plurality of transverse channels 172 (which may also be referred to as internal gas channels), and then flows to gas distribution ports 180 and 182. Figure 17 As seen, these gas distribution ports 180 and 182 pass through the front surface 184 and extend from and terminate in the corresponding transverse channel 172. These gas distribution ports 180 and 182 are also fluidly isolated from the through-hole or the second gas distribution port 196. In other words, the gas distribution ports 180 and 182 do not intersect with or are fluidly connected to the through-hole or the second gas distribution port 196 in the panel. This can be considered as a dual-chamber configuration of the panel.

[0159] In some implementation schemes, the arrangement of the transverse passages can be similar to the above. Figure 13-15 Provided. For example, the first array of transverse channels is arranged parallel to each other and parallel to direction D1, while the second array of transverse channels is arranged parallel to each other and parallel to a second direction D2, the second direction D2 being perpendicular to the first direction D1. In some implementations, these transverse channels are also arranged in a plane parallel to the front surface of the panel.

[0160] In some implementations, panels 2122, 2422, and 2522 do not have any lateral channels and can be considered as “single-chamber” panels. In some other implementations, panels 2122, 2422, and 2522 may have the same internal gas channels, or in other words, they have the same lateral channels as described above. These panels 2122, 2422, and 2522 may have a first array of internal gas channels arranged parallel to each other and parallel to a first direction D1, and a second array of internal gas channels arranged parallel to each other and parallel to a second direction D2 (perpendicular to the first direction D1). In some implementations, these internal gas channels are also arranged in a plane parallel to the front surface of the panel. Return to Reference Figure 21 Panel 2122 has multiple lateral channels, such as lateral channels 2172 and 2174 that are parallel to each other and extend in the parallel direction D1 (which can also be regarded as internal gas channels), similar to Figure 18 and 19 In this figure (which is a cross-section of panel 2122), multiple transverse channels 2172 and 2174 are cut open, and their circular cross-sectional areas are visible and marked. In addition, such transverse channels 2172, 2174, or internal gas channels, are shown in dashed lines, extending through panel 2122.

[0161] In another example, panel 2422 has transverse channels 2472 and 2474 extending through the body portion 2491 of panel 2422. Furthermore, in this figure (which is a cross-section of panel 2422), multiple transverse channels 2472 and 2474 are cut open and visible, with their cross-sectional circular areas marked. Figure 23 In the diagram, an internal gas channel 2175A (i.e., a transverse channel) of the first array is shown in dashed lines and can be seen extending parallel to the first direction D1 through the body portion 2191. An internal gas channel 2175B (i.e., a transverse channel) of the second array is also shown in dashed lines and can be seen extending parallel to the second direction D2 (perpendicular to the first direction D1) through the body portion 2191.

[0162] Although Figure 21-25 Not shown, but each panel 2122, 2422, and 2522 having a transverse channel (which is also considered an internal gas channel) also has a plurality of gas distribution ports (also referred to herein as ports) fluidly connected to each internal gas channel and fluidly isolated from the other plurality of through-holes 2196, 2496, and 2596. These gas distribution ports may be identical to the plurality of first port surfaces 180 and the plurality of first gas distribution ports 182 provided above. For example, as Figure 17As shown, each of these gas distribution ports (i.e., each port) extends from and terminates in the corresponding transverse channel (or internal gas channel) from the front surfaces 2184, 2484, and 2584. These gas distribution ports do not extend through the back surface 2192.

[0163] Figure 27 Depicting Figure 21 A cross-sectional view of another portion of the panel. Here, the cross-section is parallel to the second direction D2 and along an internal gas passage 2175B, which can also be viewed as a transverse passage / internal gas passages 2172 and 2174. This internal gas passage 2175B is parallel to direction D2 and parallel to other internal gas passages not visible here. Figure 27 The panel 2122 shown also has the plurality of gas ports 2182 extending through the front surface 2184, through a portion of the body portion 2191, and reaching a corresponding internal gas channel 2175B. These ports 2182 terminate at the corresponding internal gas channel 2175B and fluidly connect the corresponding internal gas channel 2175B to the environment adjacent to the front surface 2184. These ports 2182 are fluidly isolated from the through-holes 2196. The corresponding internal gas channel 2175B is not fluidly connected to any through-holes in the body portion 2191. This fluid isolation allows gas to flow from the periphery of the panel 2122 through the internal gas channels 2175 and through the ports 2182, and is isolated from any gas or plasma fluid traveling through the through-holes.

[0164] As provided above, when the transverse channels or internal gas channels are arranged parallel to mutually perpendicular directions, a square structure can be formed in the panel body portion between the channels. For example, see... Figure 14 and 15 In the cross-sections of these figures, surfaces 166, 168 and 170 form a square structure 177 between the transverse channels.

[0165] In other implementations, the internal gas channels (or lateral channels) may be arranged at non-perpendicular angles relative to each other. For example, the panel may have three groups of multiple internal gas channels, each group having parallel gas channels and each group oriented at an acute angle relative to adjacent internal gas channels. For example, one group of multiple internal gas channels may be oriented parallel to a first direction D1, a second group may be oriented parallel to a second direction D2, the second direction D2 being oriented at an acute angle relative to the first direction D1, such as 60 degrees, 45 degrees, or 30 degrees. A third group of multiple internal gas channels may be oriented parallel to a third direction D3, the third direction D3 being oriented at an acute angle relative to both the first direction D1 and the second direction D2, such as 60 degrees, 45 degrees, or 30 degrees. In some implementations, orienting different multiple gas channels at acute angles relative to each other can result in a hexagonal arrangement of the gas channels. In some such implementations, the second direction D2 and the third direction D3 may be oriented at approximately 60 degrees to the first direction D1.

[0166] Figure 28 A schematic diagram depicts a panel and internal gas channels. Here, panel 2822 is shown as circular and has three groups of multiple internal gas channels arranged parallel to three different directions. The first direction D1 is shown as horizontal, the second direction D2 is oriented at an angle θ3 to the first direction D1, and the third direction D3 is oriented at another angle θ4 to the first direction D1 in the opposite rotational direction. Angles θ3 and θ4 are both acute angles and in some implementations they may be the same and may range from about 60 degrees to about 15 degrees, and may be, for example, about 60 degrees each, about 45 degrees each, about 30 degrees each, or about 15 degrees each. The first group of multiple internal gas channels is arranged parallel to each other and parallel to the first direction D1; for clarity, only two are shown here and labeled 2872A. The second group of multiple internal gas channels is arranged parallel to each other and parallel to the second direction D2; for clarity, only two are shown here and labeled 2872B. Similarly, the third group of multiple internal gas channels is arranged parallel to each other and parallel to the third direction D3. For clarity, only two are shown here and labeled 2872C. This arrangement of the three groups of multiple internal gas channels results in a hexagonal structure between the internal gas channels at different angles. As can be seen further, each direction is oriented at the same angle relative to the adjacent direction. For example, direction D2 is oriented at an acute angle θ3 with the first and third directions D1 and D3, and direction D3 is also oriented at an acute angle θ4 with the first and second directions D1 and D2, where angles θ3 and θ4 are the same, for example, about 60 degrees.

[0167] Figure 29 An enlarged cross-sectional view of a portion of the panel is depicted. Here, the view is along an axis parallel to the back surface and the front surface, and the section is parallel to the back surface and located between the front and back surfaces. Figure 29The panel 2822 in the middle can be connected with Figure 28 The same as above, and has three groups of multiple internal gas channels arranged at acute angles relative to adjacent directions. Three directions D1-D3 are shown, and two internal gas channels in each of the three groups are indicated by different line types. Similar to the above, the first group of multiple internal gas channels is arranged or oriented parallel to each other and parallel to the first direction D1; two of these internal gas channels 2972A are shown with dashed lines. The second group of multiple internal gas channels is arranged or oriented parallel to each other and parallel to the second direction D2; two of these internal gas channels 2972B are shown with dashed lines. The third group of multiple internal gas channels is arranged or oriented parallel to each other and parallel to the third direction D3; two of these internal gas channels 2972C are shown with dotted lines. As can be seen, a hexagonal structure 2979 is formed between six internal gas channels, or between two internal gas channels in each of the three groups of multiple gas channels. For example, the hexagonal structure 2979A is located between two internal gas channels 2872A, two internal gas channels 2872B, and two internal gas channels 2872C.

[0168] In some implementations, the configuration of the three sets of multiple internal gas channels and the resulting hexagonal structure can provide favorable airflow control within the panel, cleaning of internal features, and the use of branched through-holes. For example, the hexagonal structure can provide sufficient space and chambers for locating branched (e.g., three) ports and through-holes. In some such implementations, the gas distribution ports can be arranged along linear axes parallel to or collinear with the central axis of each internal gas channel. In other implementations, the gas distribution ports can be arranged on two or more linear axes (parallel to and offset from the central axis of the respective internal gas channel). Figure 29 In the first group of multiple gas distribution ports 2982A, the ports are arranged along an axis A1 that is parallel, aligned with, or collinear with the central axis of the internal gas channel 2872B. For the internal gas channel 2872A, the gas distribution ports 2982B are arranged along two parallel axes A2 and A3 that are parallel to and offset from the central axis of the channel 2872A. Figure 29 Only a portion of the ports are shown for clarity. In some implementations, the various panels provided herein (including panels 2122, 2422, and 2522) may also have the three sets of multiple internal gas channels described herein.

[0169] As provided above, the nozzle can be formed with a cover plate, any panel provided herein, and in some instances, a nozzle collar. The panels described herein have various features configured to engage with other nozzle elements. For example, in some implementations, the peripheral wall may have a sealing seat configured to receive a seal configured to engage and seal with the nozzle cover plate and / or nozzle collar. Figure 21 As shown, the peripheral wall 2151 has a sealing seat 2185. The sealing seat extends about the central axis 2183 of the panel, extends about the back surface 2192, and radially outwards from the back surface 2192. In some implementations, the sealing seat may have an outer seat diameter SD1 larger than the outermost point OP1 of the back surface 2192. Figure 22 In the figure, the sealing seat 2185 is visible and may have a central axis 2183 facing it. Figure 21 (as shown in the diagram) and the back sealing surface 2141 forming an angle (which is an acute angle) with the central axis 2183. This acute angle can range, for example, from about 15 degrees to about 85 degrees.

[0170] Figure 30 An angular cross-sectional view of a nozzle with a panel connected to a nozzle collar and a cover plate is depicted. Figure 30 The nozzle 3002 can be considered a component because it includes panels (such as any of the panels provided above, such as panels 2122, 2422, and 2522), a nozzle collar 3020, and a cover plate 3018 connected together, similar to those described above. Figure 4 and 5 As shown. However, in some implementations, unlike... Figure 4 and 5 And in Figure 30 As shown, cover plate 3018 is in direct contact with panel 2122 and is connected to both nozzle collar 3020 and cover plate 3018. Seal 2187 is disposed in sealing seat 2185 to contact cover plate 3018 and form a seal at this interface or intersection of panel 2122 and cover plate 3018. Similar to the above, by connecting cover plate 3018, panel 2122, and nozzle collar 3020 together, an air chamber, such as center-feed air chamber 3086, is formed between cover plate 3018 and panel 2122.

[0171] In some implementations, the central feed chamber 3086 is partially defined by a peripheral wall 2151, a back surface 2192, and an inner surface 3089 of a cover plate 3018. The central feed chamber 3086 is fluidly connected to a through-hole 2196 to allow gas, plasma, or free radical material to flow through the panel 2122 and out of the front surface 2184. Further, the central feed chamber 3086 is fluidly isolated from the internal gas passages 2172 and 2174 by forming a seal between the panel 2122 and the cover plate 3018 at a sealing seat 2185, and a gas distribution port (not shown) is fluidly connected to the internal gas passages 2172 and 2174. Furthermore, the seal between panel 2122 and cover plate 3018 at sealing seat 2185 further fluidly isolates the annular manifold 3060 formed between nozzle collar 3020 and panel 2122 from the central feed chamber 3086 and completely protects screw 136, which may have limited material selection due to chemical exposure. These configurations give the panel a fluidly isolated dual-chamber configuration. A first gas flows into the annular manifold 3060 through internal gas channels 2172 and 2174 and a port (not shown). A second gas or radial substance flows into the central feed chamber 3086 and through through-hole 2196, and the two isolated chambers allow both the first and second gases to flow into the nozzle assembly while remaining fluidly isolated from each other. These airflows can occur simultaneously, for example, overlapping or flowing in parallel, and the gases remain fluidly isolated from each other.

[0172] Similar to the above, panel 2122 has various features for connection with cover plate 3018 and / or nozzle collar 3020 and for generating various flow characteristics, such as at least partially forming an annular manifold 3060. For example, panel 2122 has a front surface with an outer diameter greater than the outer periphery of the circumferential sidewall. (Return to Reference) Figure 21 Panel 2122 has a front surface 2184 with an outer surface diameter FD1, while peripheral sidewall 2151 has an outer wall boundary 2181 with an outer wall diameter WD1, both extending around the central axis 2183 of the panel, which extends through and perpendicular to the back surface 2192. The outer wall diameter WD1 may be smaller than the outer surface diameter FD1 and closer to the central axis of the panel than the outer surface diameter FD1. In some implementations, such as Figure 21 As shown, the outer wall boundary may be circular. Some of these features are configured to engage with the nozzle collar 3020 and the cover plate 3018, and at least partially form the nozzle 3002 and the annular manifold 3060.

[0173] The connection between the panel, nozzle collar, and cover plate provides thermal control for these features. For example, nozzle 3002 has a first heating element 3052A disposed in cover plate 3018 and a second heating element 3052B disposed in nozzle collar 3020. These heating elements heat panel 2122 through physical contact between nozzle collar 3020 and cover plate 3018 and panel 2122. Panels 2122, 2422, and 2522 provided herein provide uniform thermal control across the entire panel when connected to cover plate and / or nozzle collar and heated.

[0174] As provided above, the nozzle can be formed by connecting a cover plate to any of the panels described herein (e.g., panels 2122, 2422, and 2522), and in some instances, a nozzle collar is also included. Using each panel offers several advantages, which in some cases may depend on the process gas and flow conditions used by the nozzle. For example, using panel 2122 offers several advantages. In some instances, Figure 30 The placement of the sealing seat 2185 and the configuration of the cover plate 3018, nozzle collar 3020, and panel 2122 offer several advantages. The cover plate 3018, nozzle collar 3020, and panel 2122 can be removably coupled to each other using only one set of multiple fasteners 3036 (e.g., bolts, etc.). These fasteners 3036 extend through the cover plate 3018, nozzle collar 3020, and panel 2122, holding these components together. Furthermore, holes on these fasteners 3036 and the corresponding components receiving the fasteners 3036 are provided radially outside the sealing seat 2185 and the seal 2187. The nozzle 3002 is thus configured to isolate the fasteners 3036 from the gas and material in the multiple inflation chambers (e.g., the central feed inflation chamber 3086 and the annular manifold (i.e., the annular inflation chamber) 3060). This fluid isolation of fastener 3036 protects it from undesirable exposure to process chemicals, thus extending its lifespan and maintaining its fastening capability.

[0175] In some implementations, the volume of the central feed inflation chamber 3086 can be advantageously reduced by placing the inner surface 3089 of the cover plate 3018 closer to the back surface 2192 of the panel 2122. For example... Figure 30As shown, the back surface 2192 of panel 2122 is offset from the inner surface 3089 of cover plate 3018 by an offset distance OD1. The offset distance ranges from, for example, about 5 mm to about 25 mm, including about 10 mm, 15 mm, about 17 mm, about 19 mm, about 20 mm, about 21 mm, about 22 mm, or about 23 mm. The configuration of nozzle 3002 including panel 2122 has a reduced gas chamber volume 3086, while still reducing parasitic plasma that may form in the gas chamber volume 3086. As described above, reducing the gas chamber volume can advantageously reduce cleaning time, improve cleaning capability and quality, reduce the amount of process chemicals flowing through it, and improve flow control, including at low flow rates.

[0176] In other examples, panel 2422 may also be connected to a cover plate and a nozzle collar. (Return to Reference) Figure 24 Similar to panel 2122, peripheral sidewall 2451 has an outer surface diameter FD2 and an outer wall boundary 2481 with an outer wall diameter WD2, both extending around the central axis of the panel (not shown), which extends through and is perpendicular to the back surface 2492. The outer wall diameter WD2 may be smaller than the outer surface diameter FD2 and closer to the central axis of the panel than the outer surface diameter FD2. In some implementations, such as... Figure 24 As shown, the outer wall boundary can be circular. These features engage with the nozzle collar 3020 and the cover plate 3018 to form the nozzle 3002. Similar to the above, fasteners can be used to connect the panel 2422 to the nozzle collar and cover plate, and these fasteners can be connected to the panel 2422 at a position 2411 radially outside the outer wall boundary 2481. Therefore, when connected to the panel 2422, these fasteners can be positioned radially outside the central feed air chamber formed with the cover plate, thus fluidly isolating the fasteners from the central feed air chamber. This fluid isolation advantageously reduces and prevents the fasteners from being exposed to process chemicals.

[0177] In other implementations, panel 2522 can be connected to a cover plate and a nozzle collar, similar to nozzle 3002. In these examples, panel 2522 can be connected to cover plate 3018 and nozzle collar 3020, i.e. Figure 30 Panel 2122 in the middle.

[0178] In some implementations, the back surface of the nozzle can be configured as a non-planar surface that influences various flow aspects within the nozzle. In some embodiments, the back surface can have a central planar portion and a truncated conical portion extending around the central planar portion. This configuration can result in the panel having a gradually decreasing thickness, smaller in the middle and increasing with radial distance from the center. In some implementations, the panel has through-holes with stepped or variable inner diameters. In some implementations, the back surface can have a conical surface without a planar central portion.

[0179] Figure 31 A cross-sectional view of a portion of the panel is depicted. Here, panel 3122 has a body portion 3191 with a gradually decreasing thickness. The back surface 3192 of panel 3122 is non-planar and has a planar, circular central portion 3113 centered on the central axis 3183 of panel 3122. The back surface 3192 also has a truncated conical surface 3115 extending around the central axis 3183 and offset radially outward from and adjacent to the central portion 3113. The central portion (or planar portion) 3113 is radially inward of the truncated conical surface 3115. The thickness of panel 3122 is variable, and the thickness T1 of panel 3122 is minimum at the central portion 3113. The thickness is also minimum at the portion of the truncated conical surface 3115 closest to the central axis 3183, and the thickness T2 increases with increasing radial distance from the central axis 3183. Although Figure 31 The flat portion near the edge is shown, but in some implementations, the cone can extend all the way to the peripheral sidewall.

[0180] Panel 3122 also has a plurality of through holes 3196 extending from the back surface 3192 to the front surface 3184 in a stepped manner, similar to those described above. The through holes 3196 are straight and extend from the back surface 3192 through the body portion 3191 to the front surface 3184 along an axis perpendicular to the front surface 3184. Each through hole 3196 has a total length L (which may vary), a first portion 3163 with a first diameter Ø1 adjacent to or extending through the back surface 3192, and a second portion 3165 with a second diameter Ø2 adjacent to or extending through the front surface 3184. The first portion 3163 and the second portion 3165 intersect each other at point P1. In some embodiments, the first diameter Ø1 is larger than the second diameter Ø2, such as... Figure 31 As shown. This configuration of a tapered back surface and stepped through-holes offers several advantages, such as reducing the volume of the air chamber for faster purging. For example, gas velocity decreases as it diffuses into the circular air chamber, resulting in slower purging. By tilting the back surface and the resulting air chamber, the edge volume is reduced and the gas velocity increases. The stepped through-holes provide flow uniformity that is essentially controlled by a smaller cross-section, because in some instances most of the pressure drop occurs in the narrow through-hole, thus eliminating the influence of the truncated conical surface configuration and panel thickness on the flow uniformity through the panel. In some other implementations, the first diameter Ø1 is smaller than the second diameter Ø2.

[0181] In some implementations, panel 3122 may have multiple internal gas channels or lateral channels, similar to some other panels described herein. Although Figure 31Such internal gas passages are not depicted, but it should be understood that such passages may be arranged in the body portion 3191 of panel 3122. This may include, for example, two sets of multiple internal gas passages oriented perpendicularly to each other, such as... Figure 21 , 23 As shown in Figure 27, and for example, three sets of multiple internal gas channels oriented at a non-perpendicular angle (e.g., about 60 degrees), such as Figure 28 and 29 As shown.

[0182] Figure 33 A schematic diagram of an implementation of a multi-station processing tool 3300 with an inlet loading chamber 3302 and an outlet loading chamber 3304 (one or both of which may include a remote plasma source) is shown. A robot 3306, operating at atmospheric pressure, is configured to move a wafer from a pod loaded via a pod 3308 to the inlet loading chamber 3302 through an atmospheric port 3310. The wafer is placed on a base 3312 within the inlet loading chamber 3302 by the robot 3306, the atmospheric port 3310 is closed, and the loading chamber is then pumped out. If the inlet loading chamber 3302 includes a remote plasma source, the wafer may be exposed to remote plasma processing before being introduced into the processing chamber 3314. Furthermore, the wafer may also be heated in the inlet loading chamber 3302, for example, to remove moisture and adsorbed gases. Then, a chamber transfer port 3316 to the processing chamber 3314 is opened, and another robot (not shown) places the wafer onto a base at the first station in the reactor (shown in the reactor) for processing. Although depicted in Figure 33 The implementation schemes include loading chambers, but it should be understood that in some implementations, wafers can be sent directly to the processing station.

[0183] The depicted processing room 3314 includes four processing stations, in Figure 33 The embodiments shown are numbered from 1 to 4. Each station has a heating base (shown as 3318 in station 1) and a gas line inlet. It should be understood that in some embodiments, each processing station may have different or multiple purposes. Although the depicted processing chamber 3314 includes four stations, it should be understood that a processing chamber according to the invention may have any suitable number of stations. For example, in some embodiments, a processing chamber may have five or more stations, while in other embodiments, a processing chamber may have three or fewer stations.

[0184] Figure 33 An embodiment of a wafer handling system 3390 for transferring wafers within a processing chamber 3314 is also described. In some embodiments, the wafer handling system 3390 can transfer wafers between multiple processing stations and / or between a processing station and a loading chamber. It should be understood that any suitable wafer handling system can be employed. Non-limiting examples include wafer turntables and wafer handling robots. Figure 33An embodiment of a system controller 3350 for controlling the hardware status of process conditions and processing tools 3300 is also described. The system controller 3350 may include one or more memory devices 3356, one or more mass storage devices 3354, and one or more processors 3352. The processor 3352 may include a central processing unit (CPU) or computer, analog and / or digital input / output connections, a stepper motor controller board, etc.

[0185] In some implementations, system controller 3350 controls all activities of processing tool 3300. System controller 3350 executes system control software 3358 stored in mass storage device 3354, loaded into memory device 3356, and executed on processor 3352. System control software 3358 may contain instructions for controlling timing, gas mixing, chamber and / or station pressure, chamber and / or station temperature, purge conditions and timing, wafer temperature, RF power level, RF frequency, substrate, pedestal, chuck and / or die position, and other parameters of the specific process performed by processing tool 3300. System control software 3358 can be configured in any suitable manner. For example, various processing tool component subroutines or control objects can be written to control the operation of processing tool components used to implement various processing tool processes according to the disclosed methods. System control software 3358 can be coded in any suitable computer-readable programming language.

[0186] In some embodiments, system control software 3358 may include input / output control (IOC) sequencing instructions for controlling the various parameters described above. For example, each stage of the PEALD process may include one or more instructions for execution via system controller 3350. Instructions for setting process parameters for a PEALD process stage may be included in the corresponding PEALD formulation stage. In some embodiments, the PEALD formulation stages may be sequentially arranged such that all instructions for a PEALD process stage are executed simultaneously with that process stage.

[0187] In some implementations, additional computer software and / or programs may be used, stored on a mass storage device 3354 and / or a memory device 3356 associated with the system controller 3350. Examples of programs or program fragments used for this purpose include substrate positioning programs, process gas control programs, pressure control programs, heater control programs, and plasma control programs.

[0188] The substrate positioning procedure may include program code for a processing tool component, which loads the substrate onto the base 3318 and controls the spacing between the substrate and other components of the processing tool 3300.

[0189] The process gas control program may include code for controlling gas composition and flow rate, and optionally for stabilizing pressure in one or more processing stations prior to deposition. The process gas control program may include code for controlling gas composition and flow rate within any of the disclosed ranges. The pressure control program may include code for controlling pressure in the processing station by adjusting, for example, throttle valves in the processing station's discharge system, the gas flow rate into the processing station, etc. The pressure control program may include code for maintaining pressure in the processing station within any of the disclosed pressure ranges.

[0190] The heater control program may include code for controlling the current flowing to the heating element used to heat the substrate. Alternatively, the heater control program may control the delivery of a heat-conducting gas (e.g., helium) to the substrate. The heater control program may include instructions to maintain the substrate temperature within any disclosed range.

[0191] The plasma control program may include code for setting the RF power level and frequency applied to process electrodes in one or more processing stations, such as using any RF power level disclosed herein. The plasma control program may also include code for controlling the duration of each plasma exposure.

[0192] In some implementations, a user interface may be associated with the system controller 3350. This user interface may include a display screen, a graphical software display of the device and / or process conditions, and user input devices (e.g., pointing devices, keyboards, touch screens, microphones, etc.).

[0193] In some implementations, the parameters adjusted by the system controller 3350 may be related to process conditions. Non-limiting examples include process gas composition and flow rate, temperature, pressure, plasma conditions (e.g., RF power level, frequency, and exposure time), etc. These parameters may be provided to the user in the form of a recipe (which can be input via a user interface).

[0194] Signals for monitoring the process can be obtained from various processing tool sensors via analog and / or digital input connections to the system controller 3350. Signals for controlling the process can be output via analog and digital output connections to the processing tool 3300. Non-limiting examples of processing tool sensors that can be monitored include mass flow controllers, pressure sensors (e.g., pressure gauges), thermocouples, etc. Appropriately programmed feedback and control algorithms can be used with data from these sensors to maintain process conditions.

[0195] The disclosed implementation scheme can be implemented using any suitable chamber. Exemplary deposition apparatuses include, but are not limited to, devices from the ALTUS®, VECTOR®, and / or SPEED® product families, each available from Lam Research Corporation (Fremont, California), or any other various commercially available processing systems. Two or more stations can perform the same function. Similarly, two or more stations can perform different functions. Each station can be designed / configured to perform a specific function / method as needed.

[0196] Based on this description, implementation schemes may include different combinations of features. The following numbered clauses describe examples of implementation schemes: Implementation Scheme 1: A nozzle includes a collar and a panel removably coupled to the collar using a first set of multiple fasteners, wherein the collar and the panel each have a plurality of first gas collar surfaces and a plurality of first gas panel surfaces, and when the collar is connected to the panel, they collectively define a first set of first gas flow paths within the nozzle, wherein for each position in the first set, when the collar is detached from the panel and viewed individually, there are multiple direct lines of sight from that position to multiple corresponding viewpoints outside the collar, wherein each position in the first set of positions is located on one or more first gas collar surfaces, wherein For each of the second set of positions, when the panel is detached from the collar and viewed individually, there are multiple direct lines of sight from that position to multiple corresponding viewpoints outside the panel, wherein each of the second set of positions is located on one or more first gas panel surfaces, wherein when the panel is assembled to the collar, for each of at least some of the first and second set of positions, there are no direct lines of sight from that position to corresponding viewpoints outside the collar and panel assembled together, and wherein each first gas panel surface of the panel and each first gas collar surface of the collar are coated with a corrosion-resistant layer.

[0197] Implementation scheme 2: According to the nozzle described in implementation scheme 1, the surface of the first gas collar includes one or more first gas inlets of the first group of first gas flow paths.

[0198] Implementation scheme 3: The nozzle according to implementation scheme 2, wherein the surface of the first gas collar includes two first gas inlets on opposite sides of the diameter of the collar.

[0199] Implementation Scheme 4: According to the nozzle described in Implementation Scheme 2 or 3, the surface of the first gas collar includes an inner annular surface, at least a portion of which faces radially inward toward the central axis of the nozzle, and the first gas panel surface of the panel includes an outer annular surface, at least a portion of which faces radially outward from the central axis of the nozzle. The inner annular surface of the collar and the outer annular surface of the panel define an annular manifold of a first set of first gas channels. When the collar is connected to the panel, the annular manifold fluid is inserted between the first gas inlet in the collar and a plurality of transverse channels in the panel.

[0200] Implementation scheme 5: The nozzle according to implementation scheme 4, wherein each position in the first group of positions is located on the inner annular surface of the collar.

[0201] Implementation Scheme 6: According to the nozzle described in Implementation Scheme 5, wherein when the collar is assembled to the panel, for each of at least some of the positions in the first group of positions, there is no direct line of sight from that position to the corresponding viewpoint outside the assembled collar and the panel.

[0202] Implementation scheme 7: The nozzle according to implementation scheme 4, wherein each of the second set of positions is located on the outer annular surface of the panel.

[0203] Implementation scheme 8: According to the nozzle described in implementation scheme 7, wherein when the panel is assembled to the collar, for each of at least some of the positions in the second group of positions, there is no direct line of sight from that position to the corresponding viewpoint outside the assembled collar and panel.

[0204] Implementation scheme 9: The nozzle according to implementation scheme 4, wherein the first gas panel surface includes a plurality of peripheral feed chamber surfaces that define peripheral feed chambers in fluid connection with an annular manifold.

[0205] Implementation scheme 10: The nozzle according to implementation scheme 9, wherein each of the second set of positions is located on the outer feed chamber surface of the panel.

[0206] Implementation scheme 11: The nozzle according to implementation scheme 10, wherein when the panel is assembled to the collar, for each of at least some of the positions in the second set of positions, there is no direct line of sight from that position to the corresponding viewpoint outside the assembled collar and panel.

[0207] Implementation Scheme 12: According to the nozzle of Implementation Scheme 9, wherein the surface of the first gas panel defines a plurality of transverse channels fluidly connected to the annular manifold, the plurality of transverse channels including a first set of channels fluidly connected to the annular manifold and a second set of channels fluidly connected to the annular manifold, the first set of channels intersecting and fluidly connected to each other.

[0208] Implementation scheme 13: The nozzle according to implementation scheme 12, wherein the channels in the first group of channels are arranged parallel to each other, and the channels in the second group of channels are arranged parallel to each other.

[0209] Implementation scheme 14: The nozzle according to implementation scheme 12, wherein the channels in the first group of channels are arranged orthogonally to the channels in the second group of channels.

[0210] Implementation scheme 15: The nozzle according to implementation scheme 12, wherein each transverse channel has a pair of opposite ends that terminate at a pair of portions of the annular outer surface and are respectively fluidly connected to the annular manifold.

[0211] Implementation 16: The nozzle according to implementation 12, wherein the panel further includes a plurality of first gas distribution ports fluidly connected to the transverse channel.

[0212] Implementation scheme 17: The nozzle according to implementation scheme 16, wherein the first gas panel surface includes a plurality of first port surfaces defining a first gas distribution port, and each of the second set of positions is located on the first port surface of the panel.

[0213] Implementation scheme 18: The nozzle according to implementation scheme 17, wherein when the panel is assembled to the collar, for each of at least some of the positions in the second set of positions, there is no direct line of sight from that position to the corresponding viewpoint outside the assembled collar and panel.

[0214] Implementation scheme 19: The nozzle according to implementation scheme 16, wherein the collar and the panel each have a plurality of second gas collar surfaces and a plurality of second gas panel surfaces, and when the collar and the panel are connected, they together define a first set of second gas flow paths within the nozzle.

[0215] Implementation scheme 20: The nozzle according to implementation scheme 19, wherein the first group of second gas flow paths is fluidly isolated from the first group of first gas flow paths inside the nozzle.

[0216] Implementation scheme 21: The nozzle according to implementation scheme 19, wherein the second gas collar surface includes an inner peripheral surface facing the central axis of the nozzle, and the second gas panel surface includes a plurality of second port surfaces defining a plurality of second gas distribution ports.

[0217] Implementation scheme 22: The nozzle according to implementation scheme 21, wherein each of the first set of positions is located on the inner peripheral surface of the collar.

[0218] Implementation scheme 23: The nozzle according to implementation scheme 21, wherein each of the second set of positions is located on the second port surface of the panel.

[0219] Implementation scheme 24: The nozzle according to implementation scheme 23, wherein when the panel is assembled to the collar, for each of at least some of the positions in the second set of positions, there is no direct line of sight from that position to the corresponding viewpoint outside the assembled collar and panel.

[0220] Implementation scheme 25: The nozzle according to implementation scheme 21, wherein the panel has a first surface and a second surface, a first gas distribution port extends from the transverse channel to the second surface, and a second gas distribution port extends from the first surface to the second surface.

[0221] Implementation scheme 26: The nozzle according to implementation scheme 21, wherein each first gas distribution port has a first diameter, and each second gas distribution port has a second diameter greater than the first diameter.

[0222] Implementation scheme 27: The nozzle according to implementation scheme 26, wherein the second diameter of the second gas distribution port is up to 0.5 mm.

[0223] Implementation scheme 28: The nozzle according to implementation scheme 27, wherein the second diameter of the second gas distribution port is up to 1.5 mm.

[0224] Implementation scheme 29: The nozzle according to implementation scheme 28, wherein each transverse channel has a third diameter of up to 7 mm.

[0225] Implementation 30: The nozzle according to implementation 19 further includes a cover plate that is removably coupled to a collar via a second set of multiple fasteners and has multiple second gas cover plate surfaces, wherein at least some of the second gas cover plate surfaces, the second gas collar surfaces, and the second gas panel surfaces together define a central feed inflation chamber.

[0226] Implementation scheme 31: The nozzle according to implementation scheme 30, wherein for each position in the third group of positions, when the cover plate is detached from the collar and viewed individually, there are multiple direct lines of sight from that position to the corresponding viewpoint outside the cover plate, and each position in the third group of positions is located on the surface of one or more second gas cover plates.

[0227] Implementation scheme 32: The nozzle according to implementation scheme 30, wherein the cover plate includes an outer edge region and a central region disposed radially inward from the outer edge region, the cover plate includes one or more first gas inlet openings located in the outer edge region and fluidly connected to one or more first gas inlets located in the collar, and the cover plate further includes a second gas inlet opening located in the central region and fluidly connected to the central feed inflation chamber.

[0228] Implementation scheme 33: The nozzle according to implementation scheme 4, wherein the collar includes a heating element, and the one or more first gas inlets in the collar are nonlinear and pass between the heating element and the inner annular surface of the collar.

[0229] Implementation scheme 34: The nozzle according to implementation scheme 1, wherein the corrosion-resistant layer includes nickel or aluminum oxide.

[0230] Implementation scheme 35: The nozzle according to implementation scheme 1, wherein the corrosion-resistant layer is generated by an electrochemical deposition process.

[0231] Implementation scheme 36: The nozzle according to implementation scheme 1, wherein the first gas flow path of the first group does not include blind holes.

[0232] Implementation scheme 37: The nozzle according to implementation scheme 1, wherein the collar includes a blind hole and a thermocouple located in the blind hole.

[0233] Implementation scheme 38: The nozzle according to implementation scheme 1, wherein the first position in the first group of positions includes all positions located on the surface of the first gas collar.

[0234] Implementation 39: The nozzle according to implementation 1, wherein all positions in the first set of positions on the surface of the first gas collar define at least 80% of the total surface area of ​​the first gas collar surface.

[0235] For the purposes of this disclosure, the term "fluid connection" is used for volumes, chambers, orifices, etc., which may be connected to each other directly or through one or more intermediate components or volumes to form a fluid connection, similar to the term "electrical connection" used for components connected together to form an electrical connection. The term "fluid insertion" (if used) may refer to a component, volume, chamber, or orifice that is fluidly connected to at least two other components, volumes, chambers, or orifices such that fluid flowing from one of those other components, volumes, chambers, or orifices to another of those components, volumes, chambers, or orifices will first flow through the "fluidly inserted" component and then reach the other of those components, volumes, chambers, or orifices. For example, if a pump is fluidly inserted between a reservoir and an outlet, fluid flowing from the reservoir to the outlet will first flow through the pump and then reach the outlet. The term "fluid adjoining" (if used) refers to the placement of one fluid element relative to another fluid element such that no possible structure could be fluidly inserted between the two elements that could interrupt fluid flow between them. For example, in a flow path having a first valve, a second valve, and a third valve arranged sequentially along it, the first valve is adjacent to the second valve, the second valve is adjacent to both the first and third valves, and the third valve is adjacent to the second valve.

[0236] Unless otherwise specified, when the term “between” is used in conjunction with a range of numbers as used herein, it should be understood to include both the beginning and end values ​​of that range. For example, “between 1 and 5” should be understood to include the numbers 1, 2, 3, 4, and 5, and not just the numbers 2, 3, and 4.

[0237] The above description is illustrative in nature and is not intended to limit the invention, its application, or use. The broad teachings of this invention can be implemented in various ways. Therefore, while specific examples are included, the true scope of the invention should not be so limited, as other variations will become apparent upon reading the drawings, the specification, and the following claims. For clarity, the same reference numerals will be used in the drawings to denote similar elements. As used herein, the phrase "at least one of A, B, and C" should be understood to refer to logic using the non-exclusive logic "OR" (A, B, or C). It should be understood that one or more steps of the method may be performed in a different order (or simultaneously) without altering the principles of the invention.

Claims

1. A nozzle panel for semiconductor processing, the nozzle panel comprising: The front surface has a first outer diameter; The back surface, which is offset from the front surface; The body portion spans between the front surface and the back surface and at least partially forms the front surface and the back surface; Multiple through holes extend from the front surface through the body portion to the back surface; as well as The peripheral wall, adjacent to the back surface, surrounding the plurality of through holes, and including a plurality of first straight wall segments, wherein: Each first vertical wall segment intersects with the adjacent first vertical wall segment at its corner, and Each side angle alternates between interior and exterior angles.

2. The nozzle panel according to claim 1, wherein: The peripheral wall further includes a plurality of second straight wall segments, and each of the second straight wall segments: Longer than any of the first straight-walled segments Inserted between the two first straight wall sections, and It intersects with each of the first straight wall segments at the inner corners.

3. The nozzle panel of claim 2, wherein each of the second straight wall segments is at least four times the length of any of the first straight wall segments.

4. The nozzle panel according to claim 1, wherein: For each interior angle, the two first straight wall segments form an angle of less than 180 degrees, and For each outer angle, the two first straight wall segments form an angle greater than 180 degrees.

5. The nozzle panel according to claim 1, wherein each first vertical wall segment is oriented substantially at 90 degrees relative to the adjacent first vertical wall segment.

6. The nozzle panel according to claim 1, wherein each first vertical wall segment is oriented at a non-perpendicular angle relative to the adjacent first vertical wall segment.

7. The nozzle panel according to claim 1, wherein the through holes are arranged in a rectangular pattern.

8. The nozzle panel according to claim 1, wherein the through holes are arranged in a triangular pattern.

9. The nozzle panel according to claim 1, further comprising: Multiple internal gas channels extend through the body portion in a plane parallel to the front surface; as well as Multiple ports, which are fluidly connected to the multiple internal gas channels, wherein: Each port passes through the front surface and extends from the front surface to and terminates in the corresponding internal gas channel. The internal gas channels of the first group are parallel to each other and parallel to the first direction, and The second group of internal gas channels are parallel to each other and parallel to a second direction perpendicular to the first direction.

10. The nozzle panel of claim 9, wherein the port is fluidly isolated from the internal gas passage in the body portion.

11. The nozzle panel of claim 1, further comprising a plurality of internal gas channels extending through the body portion in a plane parallel to the front surface, wherein: The internal gas channels in the first group are parallel to each other and parallel to the first direction. The second group of internal gas channels are parallel to each other and parallel to a second direction oriented at approximately 60 degrees to the first direction. The third group of internal gas channels are parallel to each other and parallel to a third direction oriented at approximately 60 degrees to the first direction and approximately 60 degrees to the second direction.

12. The nozzle panel according to claim 1, wherein: The peripheral wall also has a sealing seat that extends around the central axis of the nozzle panel and has an outer seat diameter greater than that of the outermost point of the back surface. The sealing seat has a back sealing surface that faces the central axis and forms an acute angle with the central axis.

13. The nozzle panel of claim 1, wherein each through hole comprises: The first part extends a first length from the back surface inside the body portion and has a first inner diameter, and The second part extends a second length from the front surface to the first part and has a second inner diameter smaller than the first inner diameter.

14. The nozzle panel according to claim 1, wherein each through hole comprises: The first part extends a first length from the back surface to the joint point, and At least two branches are fluidly connected to the first portion, each branch extending from the junction to the front surface and through the front surface.

15. The nozzle panel according to claim 1, wherein the first straight wall section forms a stepped sidewall.

16. The nozzle panel according to claim 1, wherein: Each through hole has an outer diameter, and The shortest distance between the outermost through hole and the peripheral wall is the shortest offset distance measured from the center of each through hole to the peripheral wall, which is less than or equal to the outer diameter.

17. The nozzle panel according to claim 1, wherein: The peripheral wall has an outer wall boundary extending around the central axis of the nozzle panel, and The front surface has an outer surface diameter larger than that of the outer wall boundary.

18. The nozzle panel according to claim 17, wherein the outer wall boundary is circular.

19. The nozzle panel according to claim 1, wherein: The nozzle panel is configured to connect to the cover plate. When connected to the cover plate, an air chamber is formed between the back surface of the nozzle panel and the cover plate, and The air chamber is fluidly connected to the through hole.

20. The nozzle panel of claim 19, further comprising a plurality of internal gas channels extending through the body portion in a plane parallel to the front surface, wherein: The internal gas channels in the first group are parallel to each other and parallel to the first direction. The second group of internal gas channels are parallel to each other and parallel to a second direction different from the first direction, and When connected to the nozzle cover, the inflation chamber is fluidly isolated from the internal gas channel.

21. A nozzle panel for semiconductor processing, the nozzle panel comprising: The front surface has a first outer diameter; The back surface, which is offset from the front surface; The body portion spans between the front surface and the back surface and at least partially forms the front surface and the back surface; as well as Multiple through holes extend from the front surface through the body portion to the back surface; Each of the through holes includes: The first segment extends a first length from the back surface to the joint point, and At least two branches are fluidly connected to the first segment, each branch extending from the junction to the front surface and through the front surface.

22. The nozzle panel according to claim 21, wherein: Each first segment has a first diameter, and Each branch has a second diameter that is equal to or less than the first diameter.

23. The nozzle panel of claim 22, wherein the second diameter is smaller than the first diameter.

24. The nozzle panel of claim 21, wherein each branch has the same length as the other branches.

25. The nozzle panel of claim 21, wherein each through hole comprises three branches.

26. The nozzle panel of claim 21, further comprising a plurality of internal gas channels extending through the body portion in a plane parallel to the front surface, wherein: The internal gas channels of the first group are parallel to each other and parallel to the first direction, and The second set of internal gas channels are parallel to each other and parallel to a second direction that is different from the first direction.

27. The nozzle panel of claim 26, wherein the first direction is perpendicular to the second direction.

28. The nozzle panel of claim 26, further comprising a third set of internal gas channels parallel to each other and parallel to a third direction, wherein: The second direction is oriented at approximately 60 degrees to the first direction, and The third direction orientation is approximately 60 degrees from the first direction and approximately 60 degrees from the second direction.

29. A nozzle panel for semiconductor processing, the nozzle panel comprising: The front surface has a first outer diameter; The back surface, which is offset from the front surface; The body portion spans between the front surface and the back surface and at least partially forms the front surface and the back surface; as well as Multiple through holes extending from the front surface through the body portion to the back surface; wherein: Each through hole includes: The first segment extends from the back surface and has a first inner diameter, and The second segment extends from the front surface to the first segment and has a second inner diameter smaller than the first inner diameter. The front surface is planar, and the back surface is non-planar. The body portion has a variable thickness.

30. The nozzle panel of claim 29, wherein the back surface comprises a truncated conical surface.

31. The nozzle panel of claim 30, wherein the back surface further includes a planar portion radially inward of the truncated conical surface.

32. The nozzle panel according to claim 29, wherein the back surface is a conical surface.

33. The nozzle panel of claim 29, further comprising a plurality of internal gas channels extending through the body portion in a plane parallel to the front surface, wherein: The internal gas channels of the first group are parallel to each other and parallel to the first direction, and The second set of internal gas channels are parallel to each other and parallel to a second direction that is different from the first direction.

34. The nozzle panel of claim 33, wherein the first direction is perpendicular to the second direction.

35. The nozzle panel of claim 33, further comprising a third set of internal gas channels parallel to each other and parallel to a third direction, wherein: The second direction is oriented at approximately 60 degrees to the first direction, and The third direction orientation is approximately 60 degrees from the first direction and approximately 60 degrees from the second direction.

36. A nozzle for semiconductor processing, the nozzle comprising: Panel according to any one of claims 1 to 35; as well as A cover plate that contacts and is connected to the nozzle panel.

37. The nozzle of claim 36, further comprising a nozzle collar that contacts and is connected to the panel and the cover plate.

38. The nozzle of claim 37, further comprising a first heating element in the cover plate and a second heating element in the nozzle collar, wherein the first heating element and the second heating element are configured to heat the panel.