Method, device and medium for matching ic sensor and chip

Abstract

The application discloses an IC sensor and chip matching method, device, equipment and medium, which is applied to an electric product, the electric product comprises a connected IC sensor and a solidified chip, and the method comprises the following steps: acquiring the application requirement of the electric product and the fixed parameter of the solidified chip, determining a calibration strategy based on the application requirement and the fixed parameter, and calibrating the IC sensor based on the calibration strategy, so that the solidified chip matches the IC sensor, the IC sensor is calibrated and adapted to the solidified chip, no additional complex circuit needs to be arranged, the IC sensor is directly calibrated according to the fixed parameter of the solidified chip and the application requirement of the electric product, the solidified chip of different electric products can be recycled, and the cost is reduced.

Description

Technical Field

[0001] This application relates to the field of sensor calibration technology, specifically to a matching method, apparatus, device, and medium for IC sensors and chips. Background Technology

[0002] In the existing integrated circuit technology field, for electrical products, in order to ensure the product yield, customized firmware chips are usually mass-produced. The development cost is high, and because the firmware chips are highly customized for this type of electrical product, they are difficult to transfer and use in other products, resulting in poor versatility.

[0003] While using general-purpose chips to adapt to different electrical products saves the development cost of fixed chips, general-purpose chips require additional costs to design corresponding control circuits for different electrical products, and the product yield is relatively low.

[0004] As a widely used measuring device in electrical products, IC sensors need to be processed in conjunction with chips in the above manner to achieve customized production of electrical products. How to reduce the high cost required by the existing technology is an urgent problem to be solved. Summary of the Invention

[0005] In view of the above problems, this application provides a method, apparatus, device and medium for matching IC sensors and chips, so as to at least solve the problems existing in the related art.

[0006] In a first aspect, embodiments of this application provide a matching method for an IC sensor and a chip, applied to an electrical product. The electrical product includes a connected IC sensor and a firmware chip. The matching method for the IC sensor and the chip includes:

[0007] Obtain the application requirements of the electrical product and the fixed parameters of the firmware chip;

[0008] The calibration strategy is determined based on the application requirements and fixed parameters.

[0009] The IC sensor is calibrated based on the calibration strategy to make the firmware chip match the IC sensor.

[0010] In some embodiments, determining the calibration strategy based on the application requirements and fixed parameters includes:

[0011] Determine the target function trigger value of the electrical product based on the application requirements;

[0012] The original functional trigger base point value and / or original functional trigger range value of the solidified chip are determined based on the fixed parameters.

[0013] The calibration strategy is determined based on the target function trigger value, the original function trigger base point value, and / or the original function trigger range value.

[0014] In some embodiments, calibrating the IC sensor based on the calibration strategy includes:

[0015] The IC sensor is calibrated based on the difference between the target function trigger value and the original function trigger base value.

[0016] In some embodiments, calibrating the IC sensor based on the calibration strategy further includes:

[0017] A mapping relationship is established based on the midpoint between the target function trigger value and the original function trigger range value as the center point;

[0018] The IC sensor is calibrated based on the mapping relationship.

[0019] In some embodiments, the matching method between the IC sensor and the chip further includes:

[0020] The signal transmission method of the IC sensor and the firmware chip is determined based on the application requirements.

[0021] When the signal transmission method meets the preset conditions, the IC sensor is matched with the firmware chip.

[0022] In some embodiments, the matching method between the IC sensor and the chip further includes:

[0023] The matching methods between IC sensors and chips also include:

[0024] The category of the IC sensor is determined based on the application requirements.

[0025] In some embodiments, the categories of IC sensors include at least one of IC temperature sensors, IC pressure sensors, IC weight sensors, IC humidity sensors, IC speed sensors, IC sound sensors, and IC position sensors.

[0026] Secondly, embodiments of this application provide an over-temperature protection device, including:

[0027] The acquisition module is used to acquire the application requirements of the electrical product and the fixed parameters of the solidified chip;

[0028] The determination module is used to determine the calibration strategy based on the application requirements and fixed parameters;

[0029] A matching module is used to calibrate the IC sensor based on the calibration strategy so that the firmware chip matches the IC sensor.

[0030] Thirdly, embodiments of this application provide an electronic device, including a memory and a processor, wherein the memory stores program code that can run on the processor, and when the program code is executed by the processor, it implements the IC sensor and chip matching method as described in any embodiment of the first aspect.

[0031] Fourthly, embodiments of this application provide a computer storage medium storing one or more programs, which can be executed by an electronic device as described in the third aspect to implement the IC sensor and chip matching method as described in any embodiment of the first aspect.

[0032] This application provides a method, apparatus, electronic device, and storage medium for matching IC sensors and chips, applicable to electrical products. The electrical product includes a connected IC sensor and a firmware chip. By acquiring the application requirements of the electrical product and the fixed parameters of the firmware chip, a calibration strategy is determined based on the application requirements and fixed parameters. The IC sensor is calibrated based on the calibration strategy to match the firmware chip with the IC sensor. This ensures that the IC sensor and firmware chip are calibrated and adapted without the need for additional complex circuitry. The IC sensor is calibrated according to the application requirements of the electrical product by directly using the fixed parameters of the firmware chip. Firmware chips from different electrical products can be recycled and reused, reducing costs.

[0033] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this application, nor is it intended to limit the scope of this application. Other features of this application will become readily apparent from the following description. Attached Figure Description

[0034] The present application will be described in more detail below based on embodiments and with reference to the accompanying drawings.

[0035] Figure 1 A schematic flowchart of a matching method between an IC sensor and a chip according to an embodiment of this application is shown.

[0036] Figure 2 A structural block diagram of a matching device for an IC sensor and a chip according to an embodiment of this application is shown;

[0037] Figure 3 A structural block diagram of an electronic device for performing a matching method between an IC sensor and a chip according to an embodiment of this application is shown.

[0038] Figure 4This application illustrates a computer-readable storage medium for storing or carrying a matching method for an IC sensor and a chip according to an embodiment of this application. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the embodiments and accompanying drawings. The illustrative embodiments and descriptions of the present invention are only used to explain the present invention and are not intended to limit the present invention.

[0040] In simulation analysis, the design model is often modified because the analysis results do not meet the design requirements. At this time, the simulation model has already performed simulation analysis on the initial design model, set boundary conditions, and obtained simulation results.

[0041] Research on related technologies revealed that in the existing integrated circuit technology field, if an electrical appliance uses a fixed chip (such as a mask chip) to match an IC sensor, it can reduce mass production costs and achieve a high product yield. However, the fixed chip used is customized for this electrical appliance, resulting in higher development costs and a lack of versatility. Considering that the electrical appliance can use a general-purpose chip to match the IC sensor, a general-purpose chip can be selected to save the development costs required for the fixed chip. However, the production cost of the control circuit of this electrical appliance is higher, and the product yield is lower.

[0042] To address the aforementioned issues, the applicant proposes a method, apparatus, device, and medium for matching IC sensors and chips, as described in this application. By acquiring the application requirements of electrical products and the fixed parameters of the embedded chip, a calibration strategy is determined based on these requirements and parameters. The IC sensor is then calibrated based on this strategy to ensure the embedded chip matches the IC sensor. This approach reduces mass production costs, increases product yield, and eliminates the development costs associated with embedding the chip. The matching method for the IC sensor and chip will be described in detail in subsequent embodiments.

[0043] The following describes the application scenarios of the IC sensor and chip matching method provided in the embodiments of this application:

[0044] Please see Figure 1 , Figure 1 This is a schematic flowchart illustrating a matching method between an IC sensor and a chip provided in an embodiment of this application. In this embodiment, the matching method between the IC sensor and the chip can be applied to, for example... Figure 2 The IC sensor and chip matching device 300 shown is... Figure 3The illustrated electronic device 200 may include one or more devices. Multiple electronic devices 200 can transmit information wirelessly and / or via wired means. Multiple electronic devices 200 can collaboratively complete the matching method between the IC sensor and the chip. For example, the electronic device may include a mobile terminal, computer, tablet, etc., and this application does not limit it. The following describes... Figure 1 The process shown is described in detail, and the matching method between the IC sensor and the chip may include S110 to S130.

[0045] S110: Obtain the application requirements of electrical products and the fixed parameters of the embedded chips.

[0046] In the embodiments of this application, the application requirements of electrical products include the target function trigger values ​​to be achieved by the relevant functions of the electrical products, which may include: temperature value, pressure value, weight value, humidity value, speed value and displacement value, etc., and this application does not limit them.

[0047] Application requirements may also include the field in which the electrical product will be used, the types and quantities of various sensors required, etc.

[0048] The fixed parameters of the chip may include the original function trigger base point value and / or the original function trigger range value that are fixed to the chip.

[0049] For example, the original function trigger base point value includes temperature, which can be used to determine the temperature range at which the chip is programmed. The original function trigger range value is a distributed temperature, which can be used to determine the distributed temperature range at which the chip is programmed. Of course, fixed parameters may also include other parameters related to the above application requirements, which are not limited in this application.

[0050] S120: Determine the calibration strategy based on application requirements and fixed parameters.

[0051] In some embodiments, S120 includes S121 to S123.

[0052] S121: Determine the target function trigger value of electrical products based on application requirements.

[0053] In this embodiment of the application, taking temperature as an example, the target function trigger value may include: the trigger temperature of the relevant function of the appliance.

[0054] S122: Determine the original function trigger base point value and / or original function trigger range value of the firmware chip based on fixed parameters.

[0055] In this embodiment of the application, taking temperature as a parameter as an example, on the one hand, the original functional trigger base point value of the cured chip can be characterized as being calibrated by taking the curing trigger temperature as the base point; on the other hand, the original functional trigger range value of the cured chip can be characterized as being calibrated according to different levels of the temperature adjustable range.

[0056] S123: Determine the calibration strategy based on the target function trigger value, the original function trigger base point value, and / or the original function trigger range value.

[0057] In the embodiments of this application, on the one hand, for electrical products with fixed adjustment values, a calibration strategy can be determined by using the target function trigger value and the original function trigger base point value. On the other hand, for electrical products with adjustable range values, a calibration strategy can be determined by using the target function trigger value and the original function trigger range value. Furthermore, for electrical products encompassing both fixed values ​​and range values, a calibration strategy can be determined by using the target function trigger value, the original function trigger base point value, and the original function trigger range value, thereby meeting the application requirements of different electrical products.

[0058] S130: The IC sensor is calibrated based on a calibration strategy to make the firmware chip match the IC sensor.

[0059] In this embodiment, the IC sensor can be calibrated according to the different calibration strategies described above, so that the solidified chip matches the IC sensor to meet the application requirements of electrical products. In some aspects, the data information of the sensor before and after calibration can be displayed through a display device.

[0060] In some implementations, S123 calibrates the IC sensor based on a calibration strategy, including calibrating the IC sensor based on the difference between the target function trigger value and the original function trigger base point value.

[0061] In the embodiments of this application, the zero-point calibration of existing IC temperature sensors corresponds to the actual zero point of the temperature. In this application, the base point of the base point calibration method does not necessarily correspond to the actual zero point of the temperature, but is calibrated according to the trigger temperature solidified in the solidified chip as the base point.

[0062] For example, if the curing trigger temperature in the chip is 50°C, then the base point of the IC temperature sensor is calibrated to the curing trigger temperature in the chip. If the trigger temperature of the relevant function of the appliance is 70°C, then the appliance can trigger the relevant function when the temperature reaches 70°C - 50°C = 20°C. If the curing trigger temperature in the chip is 0°C, then the base point calibration of the IC temperature sensor is still based on the curing trigger temperature, that is, the base point of the IC temperature sensor of the appliance is calibrated to 0°C. If the trigger temperature of the relevant function of the appliance is 65°C, then the appliance can trigger the relevant function when the temperature reaches 65°C - 0°C = 65°C. If the curing trigger temperature in the chip is -20°C, then the base point of the IC temperature sensor is still based on the curing trigger temperature, that is, the base point of the IC temperature sensor of the appliance is calibrated to -20°C. If the trigger temperature of the relevant function of the appliance is 35°C, then the appliance can trigger the relevant function when the temperature reaches 35°C - (-20°C) = 55°C.

[0063] In some implementations, S123 calibrates the IC sensor based on a calibration strategy, and also includes S1231 to S1232.

[0064] S1231: Establish a mapping relationship based on the midpoint between the target function trigger value and the original function trigger range value as the center point.

[0065] In this embodiment, the range calibration of the IC sensor does not employ existing methods, but rather a calibration method centered on the midpoint of the range. A mapping relationship is established between the midpoint of the target function trigger value and the original function trigger range value. This includes establishing different mapping relationships for different parameter ranges.

[0066] S1232: Calibrate IC sensors based on mapping relationships.

[0067] In this embodiment, taking the calibration of an IC temperature sensor as an example, if the temperature range cured in the chip is divided into 21 levels, namely W-10, W-9, W-8, W-7, W-6, W-5, W-4, W-3, W-2, W-1, W, W1, W2, W3, W4, W5, W6, W7, W8, W9, W10, then the range calibration of the IC temperature sensor is based on the midpoint of the cured range cured in the chip as the center point and the range being divided into 21 levels. If the temperature range of the appliance is 10℃ (e.g., 30℃—40℃), then the range calibration is performed by taking the midpoint of the cured range cured in the chip as the center point and the range being divided into 21 levels. If the temperature range of the appliance is 30℃, then the temperature ranges are as follows: 30℃—W-10, 30.5℃—W-9, 31℃—W-8, 31.5℃—W-7, 32℃—W-6, 32.5℃—W-5, 33℃—W-4, 33.5℃—W-3, 34℃—W-2, 34.5℃—W-1, 35℃—W0, 35.5℃—W1, 36℃—W2, 36.5℃—W3, 37℃—W4, 37.5℃—W5, 38℃—W6, 38.5℃—W7, 39℃—W8, 39.5℃—W9, 40℃—W10.

[0068] In order to improve the transmission stability of the solidified chip and IC sensor.

[0069] In some embodiments, the matching method between the IC sensor and the chip further includes steps S101 to S102.

[0070] S101: Determine the signal transmission method for IC sensors and firmware chips based on application requirements.

[0071] In this embodiment, the signal transmission methods of the IC sensor and the embedded chip may include: digital signal transmission, analog signal transmission, etc.

[0072] In some aspects, the signal transmission method of a firmware chip can be digital input and / or analog input. In other aspects, the signal transmission method of an IC sensor can be digital output and / or analog output.

[0073] S102: When the signal transmission method meets the preset conditions, match the IC sensor with the firmware chip.

[0074] In this embodiment, before the IC sensor is matched with the embedded chip, the transmission method is adapted to better suit different electrical products.

[0075] In order to further expand the demand for compatible electrical products.

[0076] In some embodiments, the method for matching IC sensors with chips further includes: determining the category of the IC sensor based on application requirements.

[0077] In this embodiment of the application, after obtaining the application requirements, the corresponding required IC sensor category can be determined according to the application requirements, so as to meet the usage needs of electrical products after the corresponding configuration is constructed.

[0078] The categories of IC sensors include at least one of the following: IC temperature sensor, IC pressure sensor, IC weight sensor, IC humidity sensor, IC speed sensor, IC sound sensor, and IC position sensor.

[0079] The specific implementation method of this application is as follows:

[0080] In one implementation, if the embedded chip uses digital input (such as modulating different duty cycles) and the IC sensor uses digital output (such as modulating different duty cycles), the zero-point calibration and range calibration of the IC sensor do not use the existing methods, but instead use a base point calibration and a range calibration method with the midpoint of the range as the center point.

[0081] For example, the zero-point calibration and range calibration of existing IC temperature sensors correspond to the actual zero point and range of temperature. The base point calibration and the range calibration with the midpoint of the range as the center point do not necessarily correspond to the actual temperature zero point and the actual temperature range calibration. Instead, the base point calibration is based on the trigger temperature solidified in the chip, and the range calibration is the range calibration with the midpoint of the range as the center point.

[0082] Specifically, if the trigger temperature embedded in the chip is 50℃, and the temperature range is divided into 11 levels, then the calibrated base point is 50℃—W0, and the calibrated temperature ranges are 45℃—W-5, 46℃—W-4, 47℃—W-3, 48℃—W-2, 49℃—W-1, 50℃—W0, 51℃—W1, 52℃—W2, 53℃—W3, 54℃—W4, and 55℃—W5; if the trigger temperature control of the appliance is 70℃, then the trigger temperature... The adjustable temperature range is 60℃-80℃. Therefore, the temperature base point of the IC temperature sensor of this appliance is calibrated to the chip curing trigger temperature of 50℃. The adjustable temperature range of the trigger temperature settings for the relevant functions of this appliance is divided into 11 levels, namely 60℃-W-5, 62℃-W-4, 64℃-W-3, 66℃-W-2, 68℃-W-1, 70℃-W0, 72℃-W1, 74℃-W2, 76℃-W3, 78℃-W4, and 80℃-W5.

[0083] As another implementation, if the embedded chip uses digital input (such as modulating different duty cycles) and the IC sensor uses digital output (such as modulating different duty cycles), the zero-point calibration and range calibration of the IC sensor do not use the existing methods, but instead use a base point calibration and a range calibration method with the midpoint of the range as the center point.

[0084] For example, the zero-point calibration and range calibration of existing IC temperature sensors correspond to the actual zero point and range of the temperature. However, the base point calibration and range calibration with the midpoint of the range as the center point do not necessarily correspond to the actual zero point of the temperature. Instead, they are calibrated according to the trigger temperature and range that are solidified in the chip as the reference standard.

[0085] Specifically, if the trigger temperature embedded in the chip is 50℃, and the temperature range is divided into 11 levels, then the calibrated base point is 50℃—W0, and the calibrated temperature ranges are 45℃—(W-5), 46℃—(W-4), 47℃—(W-3), 48℃—(W-2), 49℃—(W-1), 50℃—(W0), 51℃—(W1), 52℃—(W2), 53℃—(W3), 54℃—(W4), and 55℃—(W5), where W1 in parentheses represents the specific temperature range. The temperature displayed on the appliance's screen can be converted to W-5—(45℃), W-4—(46℃), W-3—(47℃), W-2—(48℃), W-1—(49℃), W0—(50℃), W1—(51℃), W2—(52℃), W3—(53℃), W4—(54℃), and W5—(55℃) by adding a display converter to the output line of the temperature display chip. The temperature displayed on the appliance's screen is W-5—(45℃), W-4—(46℃), W-3—(47℃), W-2—(48℃), W-1—(49℃), W0—(50℃), W1—(51℃), W2—(52℃), W3—(53℃), W4—(54℃), and W5—(55℃). The temperature in parentheses (e.g., 51℃) is the temperature displayed on the appliance's screen.

[0086] As another implementation method, if the embedded chip uses analog input (such as varying current or voltage) and the IC sensor uses analog output (such as varying current or voltage), the zero-point calibration of the IC sensor does not use the existing method, but a base point calibration method.

[0087] For example, the zero-point calibration of existing IC temperature sensors corresponds to the actual zero point of the temperature. However, the base point calibration method does not necessarily correspond to the actual zero point of the temperature. Instead, it is calibrated based on the trigger current (e.g., the input current is 323μA) that is embedded in the chip.

[0088] Specifically, if the trigger temperature corresponding to the trigger current of the solidified chip is 50℃, then the temperature calibration of the IC temperature sensor is based on the trigger temperature of the solidified chip, that is, the base temperature calibration of the IC temperature sensor is set to 50℃. If the trigger temperature control of the related function of the appliance is 70℃, then the output current of the IC temperature sensor of the appliance when the temperature reaches 70℃ - 50℃ = 20℃ is calibrated as 323μA. Similarly, if the trigger temperature corresponding to the trigger current of the chip is 0℃, then the base temperature of the IC temperature sensor is still calibrated based on the trigger temperature of the solidified chip, that is, the temperature of the IC temperature sensor is calibrated as 50℃. The base point is calibrated to 0℃. If the trigger temperature control of the relevant function of the appliance is 35℃, then the current output by the IC temperature sensor of the appliance when the temperature reaches 35℃-0℃=35℃ is calibrated to 323μA. If the trigger temperature corresponding to the trigger current of the chip is -20℃, then the temperature calibration of the IC temperature sensor is still calibrated with reference to the curing trigger temperature, that is, the base point of the IC temperature sensor is calibrated to -20℃. If the trigger temperature control of the relevant function of the appliance is 30℃, then the current output by the IC temperature sensor of the appliance when the temperature reaches 30℃-(-20℃)=55℃ is calibrated to 323μA.

[0089] As another implementation method, if the chip uses analog input (such as varying current or voltage) and the IC sensor uses analog output (such as varying current or voltage), the range calibration of the IC sensor does not use the existing method, but a range calibration method with the midpoint of the range as the center point.

[0090] For example, the range calibration of existing IC temperature sensors corresponds to the actual temperature range. However, the range calibration based on the center point of the range does not necessarily correspond to the actual temperature range. Instead, it is based on the range calibration method that uses the center point of the range fixed in the chip.

[0091] Specifically, if the temperature range embedded in the chip corresponds to the changing current (e.g., 300μA-310μA-320μA) of W-10-W0-W10, then the range calibration of the IC temperature sensor is based on the center point of the range. That is, the changing current corresponding to the temperature range of 30℃-40℃-50℃ is calibrated as 300μA-310μA-320μA. In this way, the actual temperature will differ from the temperature displayed on the chip-controlled display. The temperature comparisons are as follows: 30℃—W-10, 31℃—W-9, 32℃—W-8, 33℃—W-7, 34℃—W-6, 35℃—W-5, 36℃—W-4, 37℃—W-3, 38℃—W-2, 39℃—W-1, 40℃—W0, 41℃—W1, 42℃—W2, 43℃—W3, 44℃—W4, 45℃—W5, 46℃—W6, 47℃—W7, 48℃—W8, 49℃—W9, 50℃—W10.

[0092] As another implementation method, if the chip uses analog input (such as varying current or voltage) and the IC sensor uses analog output (such as varying current or voltage), the zero-point calibration and range calibration of the IC sensor do not use the existing methods, but rather a reference calibration method.

[0093] For example, the zero-point calibration of existing IC temperature sensors corresponds to the actual temperature, while the zero-point calibration of reference calibration methods does not necessarily correspond to the actual temperature. Instead, it is calibrated according to the trigger current solidified in the chip (for example, the input current is 323μA at this time). The range calibration of IC sensors does not use the existing method, but adopts a range calibration method with the midpoint of the range as the center point.

[0094] For example, the range calibration of existing IC temperature sensors corresponds to the actual temperature range. However, the range calibration based on the center point of the range does not necessarily correspond to the actual temperature range. Instead, it is based on the range calibration method that uses the center point of the range fixed in the chip.

[0095] Specifically, if the trigger temperature embedded in the chip corresponds to a current of 310μA and the range is a varying current (e.g., the temperature range corresponding to a current of 300μA-319μA is W0-W19), then the zero-point calibration and range calibration of the IC temperature sensor are based on the trigger temperature and temperature range embedded in the chip. In other words, the trigger temperature of the IC temperature sensor is calibrated to a current of 310μA. If the temperature range embedded in the chip corresponds to a varying current (e.g., a current of 300μA-310μA-320μA), then the range calibration of the IC temperature sensor is based on the midpoint of the range. The temperature sensor's temperature range of 30℃—40℃—50℃ corresponds to a current calibration of 300μA—310μA—320μA. Thus, the comparison between the actual temperature and the temperature displayed on the chip-controlled monitor is as follows: 30℃—W-10, 31℃—W-9, 32℃—W-8, 33℃—W-7, 34℃—W-6, 35℃—W-5, 36℃—W-4, 37℃—W-3, 38℃—W-2, 39℃—W-1, 40℃—W0, 41℃—W1, 42℃—W2, 43℃—W3, 44℃—W4, 45℃—W5, 46℃—W6, 47℃—W7, 48℃—W8, 49℃—W9, 50℃—W10.

[0096] As another implementation method, if the chip uses digital and analog inputs and the IC sensor also uses digital and analog outputs, the zero-point calibration and range calibration of the IC sensor do not use the existing methods, but a reference calibration method.

[0097] For example, existing IC temperature sensors calibrate their zero-point and range according to the actual temperature zero point and range. However, IC sensors do not use this method for zero-point and range calibration. Instead, they employ a base-point calibration and a range calibration method centered on the midpoint of the range. For instance, while existing IC temperature sensors calibrate their zero-point and range according to the actual temperature zero point and range, the base-point calibration and range calibration method centered on the range center point do not necessarily correspond to the actual temperature zero point. Instead, they are calibrated based on the trigger temperature and the range embedded in the chip.

[0098] Specifically, if the trigger temperature embedded in the chip is 50℃, and the temperature range is divided into 11 equal increments, then the calibrated base point is 50℃—W0, and the calibrated temperature ranges are 45℃—(W-5), 46℃—(W-4), 47℃—(W-3), 48℃—(W-2), 49℃—(W-1), 50℃—(W0), 51℃—(W1), 52℃—(W2), 53℃—(W3), 54℃—(W4), and 55℃—(W5), where W1 in parentheses represents the specific temperature range. The temperature displayed on the appliance's screen can be converted to W-5—(45℃), W-4—(46℃), W-3—(47℃), W-2—(48℃), W-1—(49℃), W0—(50℃), W1—(51℃), W2—(52℃), W3—(53℃), W4—(54℃), and W5—(55℃) by adding a display converter to the output line of the chip's temperature display. The values ​​in parentheses (e.g., 51℃) represent the temperature displayed on the appliance's screen. Similarly, the above-described methods for calibrating the temperature baseline and the range calibration using the center point of the range as the baseline are applicable to IC sensors such as IC pressure sensors, IC weight sensors, IC humidity sensors, IC speed sensors, IC sound sensors, and IC position sensors.

[0099] In summary, the IC sensor and chip matching method provided in this application can adaptively calibrate, match the signal transmission mode of the IC sensor and the embedded chip, and match the type of IC sensor based on the target function trigger value and the original function trigger base point value and / or the original function trigger range value. While meeting the application requirements of electrical products, it can reduce mass production costs, increase product yield, and save the development costs required for embedded chips.

[0100] Please see Figure 2 , Figure 2 This application provides a structural block diagram of an IC sensor and chip matching device, applicable to electrical products. The electrical product includes a connected IC sensor and a firmware chip. The IC sensor and chip matching device 300 includes: an acquisition module 310, a determination module 320, and a matching module 330, wherein:

[0101] The acquisition module 310 is used to acquire the application requirements of electrical products and the fixed parameters of the embedded chip.

[0102] The determination module 320 is used to determine the calibration strategy based on application requirements and fixed parameters.

[0103] Matching module 330 is used to calibrate the IC sensor based on a calibration strategy so that the firmware chip matches the IC sensor.

[0104] The device embodiments in this application may also include other modules, specifically corresponding to the above-described method components.

[0105] It should be noted that the device embodiments in this application correspond to the aforementioned method embodiments. The specific principles in the device embodiments can be found in the content of the aforementioned method embodiments, and will not be repeated here.

[0106] In the several embodiments provided in this example, the coupling between modules can be electrical, mechanical, or other forms of coupling.

[0107] Furthermore, the functional modules in the various embodiments of the present invention can be integrated into one processing module, or each module can exist physically separately, or two or more modules can be integrated into one module. The integrated modules described above can be implemented in hardware or as software functional modules.

[0108] Please see Figure 3 , Figure 3 This application provides a structural block diagram of an electronic device 200 that can perform the above-described IC sensor and chip matching method. The electronic device 200 may be a smartphone, tablet computer, computer, or portable computer.

[0109] The electronic device 200 also includes a processor 202 and a memory 204. The memory 204 stores programs that can execute the contents of the foregoing embodiments, and the processor 202 can execute the programs stored in the memory 204.

[0110] The processor 202 may include one or more cores for data processing and message matrix units. The processor 202 connects to various parts of the electronic device 200 using various interfaces and lines, and performs various functions and processes data by running or executing instructions, programs, code sets, or instruction sets stored in the memory 204, and by calling data stored in the memory 204. Optionally, the processor 202 may be implemented using at least one hardware form of Digital Signal Processing (DSP), Field-Programmable Gate Array (FPGA), or Programmable Logic Array (PLA). The processor 202 may integrate one or more of the following: Central Processing Unit (CPU), Graphics Processing Unit (GPU), and modem / decoder. The CPU primarily handles the operating system, user interface, and applications; the GPU is responsible for rendering and drawing the displayed content; and the modem is used for wireless communication. It is understood that the modem / decoder may also not be integrated into the processor and may be implemented separately through a communication chip.

[0111] Memory 204 may include random access memory (RAM) or read-only memory (ROM). Memory 204 can be used to store instructions, programs, code, code sets, or instruction sets. Memory 204 may include a program storage area and a data storage area, wherein the program storage area may store instructions for implementing an operating system, instructions for implementing at least one function (e.g., instructions for a user to obtain random numbers), instructions for implementing the various method embodiments described below, etc. The data storage area may also store data (e.g., random numbers) created by the terminal during use.

[0112] Electronic device 200 may also include a network module and a screen. The network module is used to receive and transmit electromagnetic waves, converting electromagnetic waves into electrical signals, thereby enabling communication with communication networks or other devices, such as audio playback devices. The network module may include various existing circuit elements used to perform these functions, such as antennas, radio frequency transceivers, digital signal processors, encryption / decryption chips, SIM cards, memory, etc. The network module can communicate with various networks such as the Internet, corporate intranets, and wireless networks, or communicate with other devices via wireless networks. The aforementioned wireless networks may include cellular telephone networks, wireless local area networks, or metropolitan area networks. The screen can display interface content and facilitate data interaction.

[0113] Please refer to Figure 4 , Figure 4 This diagram illustrates a structural block diagram of a computer-readable storage medium according to an embodiment of this application. The computer-readable storage medium 400 stores program code 410, which can be called by a processor to execute the methods described in the above method embodiments.

[0114] The computer-readable storage medium 400 may be an electronic memory such as flash memory, EEPROM (Electrically Erasable Programmable Read-Only Memory), EPROM, hard disk, or ROM. Optionally, the computer-readable storage medium includes a non-transitory computer-readable storage medium. The computer-readable storage medium 400 has storage space for program code 410 that performs any of the method steps described above. This program code 410 can be read from or written to one or more computer program products. The program code 410 may, for example, be compressed in a suitable form.

[0115] This application also provides a computer program product or computer program that includes computer instructions stored in a computer-readable storage medium. A processor of a computer device reads the computer instructions from the computer-readable storage medium and executes the computer instructions, causing the computer device to perform the IC sensor and chip matching method described in the various optional implementations above.

[0116] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A method for matching an IC sensor with a chip, characterized in that, Applied to electrical products, the electrical products include connected IC sensors and a firmware chip, and the matching method between the IC sensor and the chip includes: Obtain the application requirements of the electrical product and the fixed parameters of the firmware chip; The calibration strategy is determined based on the application requirements and fixed parameters. The IC sensor is calibrated based on the calibration strategy to make the firmware chip match the IC sensor.

2. The matching method between the IC sensor and the chip according to claim 1, characterized in that, The calibration strategy determined based on the application requirements and fixed parameters includes: Determine the target function trigger value of the electrical product based on the application requirements; The original functional trigger base point value and / or original functional trigger range value of the solidified chip are determined based on the fixed parameters. The calibration strategy is determined based on the target function trigger value, the original function trigger base point value, and / or the original function trigger range value.

3. The matching method between the IC sensor and the chip according to claim 2, characterized in that, The calibration of the IC sensor based on the calibration strategy includes: The IC sensor is calibrated based on the difference between the target function trigger value and the original function trigger base value.

4. The matching method between the IC sensor and the chip according to claim 3, characterized in that, The calibration of the IC sensor based on the calibration strategy further includes: A mapping relationship is established based on the midpoint between the target function trigger value and the original function trigger range value as the center point; The IC sensor is calibrated based on the mapping relationship.

5. The matching method between the IC sensor and the chip according to claim 1, characterized in that, The method further includes: The signal transmission method of the IC sensor and the firmware chip is determined based on the application requirements. When the signal transmission method meets the preset conditions, the IC sensor is matched with the firmware chip.

6. The matching method between the IC sensor and the chip according to claim 1, characterized in that, The method further includes: The category of the IC sensor is determined based on the application requirements.

7. The matching method between the IC sensor and the chip according to claim 6, characterized in that, The categories of IC sensors include at least one of the following: IC temperature sensor, IC pressure sensor, IC weight sensor, IC humidity sensor, IC speed sensor, IC sound sensor, and IC position sensor.

8. A matching device for an IC sensor and a chip, characterized in that, Applied to electrical products, the electrical products including connected IC sensors and firmware chips, the device includes: The acquisition module is used to acquire the application requirements of the electrical product and the fixed parameters of the solidified chip; The determination module is used to determine the calibration strategy based on the application requirements and fixed parameters; A matching module is used to calibrate the IC sensor based on the calibration strategy so that the firmware chip matches the IC sensor.

9. An electronic device, characterized in that, The electronic device includes a memory and a processor. The memory stores program code that can run on the processor. When the program code is executed by the processor, it implements the matching method of IC sensor and chip as described in any one of claims 1-7.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores program code that can be called by one or more processors to execute the matching method of the IC sensor and chip as described in any one of claims 1-7.

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