Electronic device including antenna module
By employing flexible printed circuit boards and dummy component designs in antenna modules within electronic devices, the problem of insufficient antenna placement space in miniaturized electronic devices is solved, achieving stable wireless communication and consistent communication performance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SAMSUNG ELECTRONICS CO LTD
- Filing Date
- 2024-10-23
- Publication Date
- 2026-06-23
AI Technical Summary
In miniaturized electronic devices, it is difficult to ensure the arrangement space for multiple antennas and the stability of wireless communication, resulting in reduced wireless communication efficiency and signal distortion. At the same time, the wireless communication performance of different products is inconsistent.
An electronic device including an antenna module is used. This antenna module is made of a flexible printed circuit board and is set in a limited space. Through the design of intersecting flexible printed circuit boards and dummy components, the stability and consistency of wireless communication are ensured.
It achieves a stable wireless communication environment in miniaturized electronic devices and provides essentially consistent wireless communication performance across different products.
Smart Images

Figure CN122270903A_ABST
Abstract
Description
Technical Field
[0001] Embodiments of this disclosure relate to an electronic device, such as an electronic device including an antenna module. Background Technology
[0002] The term "electronic device" can refer to a device that performs specific functions based on installed programs, such as home appliances, electronic schedulers, portable multimedia players, mobile communication terminals, tablet PCs, video / audio equipment, desktop / laptop PCs, or vehicle navigation systems. For example, these electronic devices can output stored information as sound or images. With the increasing integration of electronic devices and the growing prevalence of ultra-high-speed and high-capacity wireless communications, a single electronic device, such as a mobile communication terminal, can be equipped with a wide variety of functions. For example, not only communication functions but also entertainment functions such as games, multimedia functions such as music and video playback, communication and security functions for mobile banking, or functions such as schedule management or e-wallets are integrated into a single electronic device.
[0003] As the use of personal or portable communication devices such as smartphones becomes more widespread, user demand for portability and ease of use is increasing. For example, touchscreen displays can provide a virtual keyboard that replaces mechanical input devices (e.g., button input devices) while also serving as an output device for an output screen (e.g., visual information). Thus, portable communication devices or electronic devices have already been able to offer the same or further improved usability (e.g., larger screens) while being miniaturized. On the other hand, with the commercialization of flexible displays, such as foldable or rollable ones, the portability and ease of use of electronic devices are expected to improve further. Electronic devices incorporating flexible displays can be carried in multiple folded or rollable states with different structures (e.g., housings) and can provide a large screen when unfolded, thereby improving portability and ease of use.
[0004] The information provided above is offered as relevant technology for the purpose of aiding understanding of this disclosure. No statement or determination is made as to whether any of the foregoing content can be used as prior art in relation to this disclosure. Summary of the Invention
[0005] [Technical Solution]
[0006] According to embodiments of this disclosure, an electronic device may include: a housing including a front surface, a rear surface opposite to the front surface, and a sidewall at least partially surrounding a space between the front and rear surfaces; a camera assembly disposed adjacent to the sidewall at one edge of the space; a cover plate disposed on at least a portion of the circumference of the camera assembly and at least partially exposed to the outside via the rear surface; a keyboard assembly disposed between a first portion of the sidewall at least partially adjacent to the camera assembly and the camera assembly; and an antenna module having a portion disposed between a second portion of the sidewall adjacent to the first portion and the camera assembly, the antenna module including a first flexible printed circuit board at least partially disposed between the first portion and the camera assembly. In embodiments, the keyboard assembly may include a switch substrate at least partially disposed between the first portion and the camera assembly, a second flexible printed circuit board extending from the switch substrate and configured to intersect the first flexible printed circuit board on one side of the camera assembly, and a dummy member disposed on the second flexible printed circuit board and at least partially facing the cover plate.
[0007] According to embodiments of this disclosure, an electronic device may include: a housing including a front surface, a rear surface opposite the front surface, and a sidewall at least partially surrounding a space between the front and rear surfaces; a camera assembly disposed at one edge of the space adjacent to the sidewall; a cover plate disposed on at least a portion of the outer periphery of the camera assembly and at least partially exposed to the outside via the rear surface, the cover plate providing a recessed portion surrounded at least partially by a protrusion extending outwardly from the edge of the cover plate; a keyboard assembly disposed between a first portion of the sidewall at least partially adjacent to the camera assembly and the camera assembly; and an antenna module partially disposed between a second portion of the sidewall adjacent to the first portion and the camera assembly, the antenna module including a first flexible printed circuit board at least partially disposed between the first portion and the camera assembly. In embodiments, the keyboard assembly may include a switch substrate at least partially disposed between the first portion and the camera assembly, a second flexible printed circuit board extending from the switch substrate and configured to intersect the first flexible printed circuit board on one side of the camera assembly, and a dummy member disposed on the second flexible printed circuit board and configured to face the cover plate across a region disposed across the recessed portion. Attached Figure Description
[0008] The above or other aspects, constructions and / or advantages of embodiments of the present disclosure will become more apparent from the following detailed description with reference to the accompanying drawings.
[0009] Figure 1 This is a block diagram illustrating an electronic device according to an embodiment of the present disclosure within a network environment.
[0010] Figure 2This is a view showing an electronic device in an unfolded state according to an embodiment of the present disclosure.
[0011] Figure 3 This is a view showing an electronic device in a folded state according to an embodiment of the present disclosure.
[0012] Figure 4 This is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.
[0013] Figure 5 This is a view showing the state in which the housing is assembled in an electronic device according to an embodiment of the present disclosure.
[0014] Figure 6 This is a view showing a hinge plate arranged in an electronic device according to an embodiment of the present disclosure.
[0015] Figure 7 This is a view showing the arrangement of one or more hinge modules and electronic components inside an electronic device according to an embodiment of the present disclosure.
[0016] Figure 8 This is a perspective view showing the contact piece of an electronic device according to an embodiment of the present disclosure.
[0017] Figure 9 This is a perspective view showing the state in which a contact element according to an embodiment of the present disclosure is disposed in an electronic device.
[0018] Figure 10 This is a view showing the camera assembly of an electronic device according to an embodiment of the present disclosure.
[0019] Figure 11 This illustrates an electronic device according to an embodiment of the present disclosure. Figure 10 A perspective view of the third camera in the camera assembly.
[0020] Figure 12 This is a first view showing a circuit board of an electronic device according to an embodiment of the present disclosure.
[0021] Figure 13 This is a second view showing a circuit board of an electronic device according to an embodiment of the present disclosure.
[0022] Figure 14 This illustrates an embodiment according to the present disclosure. Figure 11 camera components and Figure 13 A view showing the state in which the circuit board is set inside the housing of the electronic device.
[0023] Figure 15 This is a perspective view showing an antenna module of an electronic device according to an embodiment of the present disclosure.
[0024] Figure 16 This illustrates an embodiment according to the present disclosure. Figure 15 A perspective view of the process by which the antenna module is installed in the housing of the electronic device.
[0025] Figure 17 This illustrates an embodiment according to the present disclosure. Figure 15 A view showing the state in which the antenna module is housed within the casing of the electronic device.
[0026] Figure 18 It shows along Figure 17 A view of a portion of an electronic device according to an embodiment of the present disclosure, taken by line A-A'.
[0027] Figure 19 This is a first perspective view showing a keyboard assembly of an electronic device according to an embodiment of the present disclosure.
[0028] Figure 20 This is a second perspective view showing a keyboard assembly of an electronic device according to an embodiment of the present disclosure.
[0029] Figure 21 This illustrates an embodiment according to the present disclosure. Figure 19 or Figure 20 A view of the state in which the keyboard assembly is housed within the casing of the electronic device.
[0030] Figure 22 It shows along Figure 21 A cross-sectional view of a portion of an electronic device according to an embodiment of the present disclosure, taken by line B-B'.
[0031] Figure 23 It shows along Figure 21 A cross-sectional view of a portion of an electronic device according to an embodiment of the present disclosure, taken by line C-C'.
[0032] Figure 24 This is a view showing a state in which one or more flexible printed circuit boards according to embodiments of the present disclosure are disposed in an electronic device.
[0033] Figure 25 It shows along Figure 24 A cross-sectional view of a portion of an electronic device according to an embodiment of the present disclosure, taken by line D-D'.
[0034] Figure 26 This is a first view showing a cover plate disposed in an electronic device according to an embodiment of the present disclosure.
[0035] Figure 27 This is a second view showing the state in which a cover plate according to an embodiment of the present disclosure is disposed in an electronic device.
[0036] Figure 28 This is a view showing the state in which a dummy component according to an embodiment of the present disclosure is disposed inside a cover plate in an electronic device.
[0037] Throughout the accompanying drawings, the same reference numerals may be assigned to the same parts, constructions, and / or structures. Detailed Implementation
[0038] Beyond connections via commercial communication networks, communication protocols such as Bluetooth or Wi-Fi can provide an environment for direct wireless communication between different electronic devices. For example, electronic devices can perform wireless communication based on different protocols by including multiple antennas. However, as performance becomes more complex, it can be difficult to secure space for accommodating multiple antennas and / or for wiring to transmit wireless signals to the antennas in miniaturized electronic devices, such as smartphones. Coaxial cables or flexible printed circuit boards can be used as wiring to transmit wireless signals to the antennas, but in miniaturized electronic devices, such as smartphones, these components may be positioned close to other structures, potentially generating electromagnetic coupling or induced currents. Electromagnetic coupling or induced currents generated on transmission lines can reduce the efficiency of wireless communication or distort the transmitted signal. On the other hand, due to the flexibility of coaxial cables or flexible printed circuit boards, the assembled shape may differ between different electronic devices manufactured to the same specifications. For example, in the miniaturization of electronic devices, variations in wireless communication performance can sometimes occur depending on the product.
[0039] The embodiments of this disclosure are intended to at least address the above-mentioned problems and / or disadvantages and provide at least the following advantages, and can provide an electronic device including an antenna module that is disposed in a limited space while achieving a stable wireless communication environment.
[0040] Embodiments of this disclosure may provide an electronic device including an antenna module that provides substantially consistent wireless communication performance between different products having the same specifications.
[0041] The technical problems to be solved by this disclosure are not limited to those described above, and those skilled in the art to which this disclosure pertains can clearly understand other technical problems not mentioned above.
[0042] The following description, taken with reference to the accompanying drawings, provides an understanding of various exemplary embodiments of the present disclosure, including the claims and their equivalents. The exemplary embodiments disclosed in the following description include various specific details to aid understanding, but are considered to be one of various exemplary embodiments. Therefore, those skilled in the art will understand that various changes and modifications can be made to the various embodiments described herein without departing from the scope and spirit of the present disclosure. Additionally, descriptions of well-known functions and constructions may be omitted for clarity and brevity.
[0043] The terms and words used in the following description and claims are not limited to their literal meaning, but are intended to clearly and consistently describe embodiments of this disclosure. Therefore, those skilled in the art will understand that the following description of various embodiments of this disclosure is for illustrative purposes only and is not intended to limit the scope of this disclosure and its equivalents.
[0044] Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” should be understood to include the plural meaning. Thus, for example, the term “component surface” can be understood to include one or more surfaces of a component.
[0045] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. (Refer to...) Figure 1 In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with at least one of electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In some embodiments, at least one of the above components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components described above (e.g., sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (e.g., display module 160).
[0046] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to embodiments, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or may be implemented as part of the main processor 121.
[0047] When the main processor 121 is inactive (e.g., in sleep) state, the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware architecture dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed via electronic device 101 where artificial intelligence is performed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q-network, or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include software structures in addition to hardware structures.
[0048] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.
[0049] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.
[0050] The input module 150 can receive commands or data from outside the electronic device 101 (e.g., a user) that will be used by other components of the electronic device 101 (e.g., processor 120). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).
[0051] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to an embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.
[0052] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display device 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force caused by touch.
[0053] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.
[0054] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.
[0055] Interface 177 may support one or more specific protocols used to enable electronic device 101 to connect directly (e.g., wired) or wirelessly to external electronic devices (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.
[0056] Connection 178 may include a connector, through which electronic device 101 may be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).
[0057] The haptic module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.
[0058] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.
[0059] The power management module 188 manages the power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).
[0060] Battery 189 can power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.
[0061] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and supporting direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components separate from each other (e.g., multiple chips). The wireless communication module 192 can identify and verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.
[0062] Wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.
[0063] Antenna module 197 can transmit or receive signals or power to or from the exterior of electronic device 101 (e.g., external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 197.
[0064] According to an embodiment, antenna module 197 can form a millimeter-wave antenna module. According to an embodiment, the millimeter-wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.
[0065] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via inter-peripheral communication schemes (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).
[0066] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of electronic device 102 or electronic device 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations to be performed on electronic device 101 can be performed on one or more of external electronic devices 102, external electronic devices 104, or server 108. For example, if electronic device 101 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, the one or more external electronic devices may perform the requested at least portion of the function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to embodiments, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 can be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology or IoT-related technologies.
[0067] The electronic device according to the embodiments can be one of various types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.
[0068] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that nouns in the singular form corresponding to terms may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one or all possible combinations of the items enumerated together with the corresponding phrase among the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish the respective component from another component and do not limit the components in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “combined with another element (e.g., a second element),” “combined to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “connected to another element (e.g., a second element)”, it means that the element can be directly (e.g., wiredly) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.
[0069] When used in connection with embodiments of this disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "part," or "circuit"). A module may be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to embodiments, a module may be implemented in the form of an application-specific integrated circuit (ASIC).
[0070] The various embodiments set forth herein can be implemented as software (e.g., a program) comprising one or more instructions readable by a machine (e.g., an electronic device) stored in a storage medium (e.g., internal or external memory). For example, under the control of a processor, the processor of the machine (e.g., an electronic device) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Machine-readable storage media may be provided in the form of non-transitory storage media. The term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being temporarily stored in the storage medium.
[0071] According to embodiments, methods according to embodiments of this disclosure may be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)) or via an app store (e.g., the Play Store). TM The computer program product may be published online (e.g., downloaded or uploaded), or may be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If published online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be temporarily stored in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a forwarding server).
[0072] According to embodiments, each of the above components (e.g., a module or program) may include a single entity or multiple entities, and some of the multiple entities may be separately disposed in different components. According to various embodiments, one or more of the above components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as a corresponding component of the multiple components performed one or more functions before integration. According to embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more operations may be run in a different order or omitted, or one or more other operations may be added.
[0073] In the following detailed description, reference may be made to the length direction, width direction, and / or thickness direction of the electronic device, wherein the length direction may be defined as the "Y-axis direction," the width direction may be defined as the "X-axis direction," and / or the thickness direction may be defined as the "Z-axis direction." In embodiments, the orientation of components may be referred to together with the orthogonal coordinate system shown in the figures and "negative / positive (- / +)." For example, the front side of the electronic device and / or housing may be defined as the "side oriented in the +Z direction," and the rear side may be defined as the "side oriented in the -Z direction." In embodiments, the side surface of the electronic device and / or housing may include regions oriented in the +X direction, regions oriented in the +Y direction, regions oriented in the -X direction, and / or regions oriented in the -Y direction. In embodiments, the "X-axis direction" may include both the "-X direction" and the "+X direction." Note that for the sake of brevity, these are based on the Cartesian coordinate system shown in the figures, and the description of these directions or components does not limit the embodiments of this disclosure. For example, the Cartesian coordinate system may be defined differently from that disclosed, depending on the design specifications of the electronic device or the user's usage habits.
[0074] In the embodiments described below, multiple housings can be rotatably coupled to each other and can rotate relative to each other between a first position in which the housings are folded to face each other and a second position in which the housings are unfolded to be arranged side by side on one side. In the embodiments described below, the description referring to an orthogonal coordinate system when describing embodiments of the electronic device may generally be provided based on the unfolded state. In the electronic devices of the embodiments described below, at least one folding axis can be understood as substantially parallel to the Y-axis direction. However, embodiments of this disclosure are not limited thereto and can be understood to include electronic devices having structures in which one or more folding axes are parallel to the X-axis direction.
[0075] Figure 2 This is a view showing an electronic device in an unfolded state according to an embodiment of the present disclosure. Figure 3 This is a view showing an electronic device according to an embodiment of the present disclosure in a folded state.
[0076] Reference Figure 2 and Figure 3 Electronic device 101 may include a housing 201, a hinged cover 240 configured to cover a foldable portion of the housing 201, and a display 230 disposed in the space formed by the housing 201. According to an embodiment, one side of the display 230 that exposes the output screen may be defined as the front side of electronic device 101 (e.g., a first front side 210a and a second front side 220a). The side opposite the front side may be defined as the rear side of electronic device 101 (e.g., a first rear side 210b and a second rear side 220b). In an embodiment, one side surrounding the space between the front and rear sides may be defined as a side surface of electronic device 101 (e.g., a first side surface 210c and a second side surface 220c). The side surface of electronic device 101 may be a side surface of at least one of the first housing 210 or the second housing 220. Figure 2 and Figure 3 The electronic device 101 may be referred to as a "foldable electronic device," a "portable electronic device," or a "portable foldable electronic device." According to an embodiment, the housing 201 may be referred to as a "foldable housing." The display 230 may be referred to as a "flexible display."
[0077] According to an embodiment, the housing 201 may include a first housing 210, a second housing 220 rotatable relative to the first housing 210, a first rear surface cover 280, and a second rear surface cover 290. The housing 201 of the electronic device 101 is not limited to... Figure 2 and Figure 3 The shapes and components shown are not necessarily those of other shapes or components, but can be achieved through combinations and / or components of other shapes or parts. For example, in an embodiment, the first housing 210 and the first rear surface cover 280 may be integral, and the second housing 220 and the second rear surface cover 290 may be integral.
[0078] According to an embodiment, the first housing 210 may be connected to a hinge structure (e.g., Figure 4The hinge assembly 202 may include a first front surface 210a oriented in a first direction and a first rear surface 210b oriented in a second direction opposite to the first direction. A second housing 220 may be connected to the hinge assembly 202 and may include a second front surface 220a oriented in a third direction and a second rear surface 220b oriented in a fourth direction opposite to the third direction, and may rotate about the hinge assembly 202 relative to the first housing 210. Therefore, the electronic device 101 can be changed to a folded state or an unfolded state. The folding or unfolding operation of the electronic device 101 can be understood as a rotation of the first housing 210 relative to the hinge structure or a rotation of the second housing 220 relative to the hinge structure. When the electronic device 101 is in the folded state, the first front surface 210a may face the second front surface 220a, and when the electronic device 101 is in the unfolded state, the third direction may be the same as the first direction. In the following description, unless otherwise stated, the orientation will be referred to in the unfolded state of the electronic device 101.
[0079] According to an embodiment, the first housing 210 and the second housing 220 may be disposed on opposite sides of the folding axis A and may have a generally symmetrical shape with respect to the folding axis A. As will be described later, the angle or distance between the first housing 210 and the second housing 220 may vary depending on whether the electronic device 101 is in an unfolded state, a folded state, or an intermediate state. According to an embodiment, the second housing 220 further includes a sensor region 224 in which a sensor (e.g., a front-facing camera) is disposed, but the second housing 220 may have a mutually symmetrical shape in other regions.
[0080] According to embodiments, the folding axis A can be implemented as a plurality (e.g., two) of folding axes arranged in parallel. In this disclosure, the folding axis A is arranged along the length direction (Y-axis direction) of the electronic device 101, but the direction of the folding axis A is not limited thereto. For example (not shown), embodiments in which the electronic device 101 includes folding axes extending in the width direction (e.g., X-axis direction) can be implemented.
[0081] According to an embodiment, the electronic device 101 may include a structure to which a digital pen (not shown) can be attached. For example, the electronic device 101 may include a magnetic body configured to attach the digital pen to a side surface of a first housing 210 or a side surface of a second housing 220. According to an embodiment, the electronic device 101 may include a structure to which a digital pen can be inserted. For example, a hole (not shown) for inserting a digital pen may be provided in the side surface of the first housing 210 or the side surface of the second housing 220 of the electronic device 101.
[0082] According to an embodiment, the first housing 210 and the second housing 220 may be at least partially made of a rigid metallic or non-metallic material having a level selected for supporting the display 230. At least a portion made of a metallic material may provide a ground plane for the electronic device 101 and may be electrically connected to a circuit board (e.g., Figure 4 The grounding wire on the board unit 260 in the middle.
[0083] According to embodiments, sensor region 224 may have a predetermined area adjacent to an edge or corner of the second housing 220. According to embodiments, the arrangement, shape, and size of sensor region 224 are not limited to the examples shown. For example, in another embodiment, sensor region 224 may be located at another corner of the second housing 220, or between an upper and lower corner, or in any area of the first housing 210. In embodiments, components embedded in electronic device 101 to perform various functions may be exposed on the front side of electronic device 101 through sensor region 224 or through one or more openings provided in sensor region 224. In embodiments, components may include various types of sensors. Sensors may include at least one of, for example, a front-facing camera, a receiver, or a proximity sensor.
[0084] According to an embodiment, a first rear surface cover 280 may be disposed on one side of the folding axis A on the rear surface of the electronic device 101, and may have, for example, a substantially rectangular periphery, which may be surrounded by other structures of the first housing 210. Similarly, a second rear surface cover 290 is disposed on the other side of the folding axis A on the rear surface of the electronic device 101, and its edge may be surrounded by other structures of the second housing 220.
[0085] According to an embodiment, the first rear cover 280 and / or the second rear cover 290 may have a shape that is substantially symmetrical about the folding axis A. However, the first rear cover 280 and the second rear cover 290 do not necessarily have mutually symmetrical shapes, and in an embodiment, the electronic device 101 may include a first rear cover 280 and a second rear cover 290 with different asymmetrical shapes.
[0086] According to embodiments, a first rear cover 280, a second rear cover 290, a first housing 210, and a second housing 220 can provide space therein for various components of the electronic device 101 (e.g., printed circuit boards or batteries). According to embodiments, one or more components may be located on or visually exposed to the rear of the electronic device 101. For example, at least a portion of the sub-display 234 may be visually exposed through at least a portion of the first rear cover 280. In another embodiment, one or more components or sensors may be visually exposed through at least a portion of the second rear cover 290. In various embodiments, sensors may include a proximity sensor and / or a camera module 206 (e.g., a rear camera).
[0087] According to an embodiment, a front-facing camera exposed to the front surface of the electronic device 101 through one or more openings provided in the sensor region 224, or a camera module 206 at least partially exposed through the second rear surface cover 290, may include one or more lenses, an image sensor, and / or an image signal processor. In some embodiments, two or more lenses (e.g., infrared camera lenses, wide-angle lenses, and telephoto lenses) and image sensors may be disposed on one side of the electronic device 101.
[0088] According to an embodiment, the hinge cover 240 may be disposed between the first housing 210 and the second housing 220 to cover internal components (e.g., Figure 4 (Hinge assembly 202). According to an embodiment, the hinge cover 240 may be covered by a portion of the first housing 210 and a portion of the second housing 220, or may be exposed to the outside depending on the state of the electronic device 101 (expanded state (flat state) or folded state).
[0089] According to the embodiments, such as Figure 2 As shown, when the electronic device 101 is in the unfolded state, the hinge cover 240 can be covered by the first housing 210 and the second housing 220 without being exposed. As another example, such as... Figure 3 As shown, when the electronic device 101 is in a folded state (e.g., a fully folded state), the hinge cover 240 may be exposed to the outside between the first housing 210 and the second housing 220. As another example, when the first housing 210 and the second housing 220 are in an intermediate state where the first housing and the second housing are folded at an angle, the hinge cover 240 may be partially exposed to the outside between the first housing 210 and the second housing 220. However, in this case, the exposed area may be smaller than the exposed area in the fully folded state. In embodiments, the hinge cover 240 may include a curved surface.
[0090] In an embodiment, the display 230 may be disposed in a space provided (or defined) by the housing 201. For example, the display 230 may be located in a recess provided by the housing 201 and may constitute a large portion of the front side of the electronic device 101. Therefore, the front surface of the electronic device 101 may include the display 230 and portions of the first housing 210 and the second housing 220 adjacent to the display 230. The rear surface of the electronic device 101 may include a first rear surface cover 280, portions of the first housing 210 adjacent to the first rear surface cover 280, a second rear surface cover 290, and portions of the second housing 220 adjacent to the second rear surface cover 290.
[0091] According to an embodiment, the display 230 may include a plurality of display areas spaced apart from each other. For example, the display 230 may include a first display area 231 disposed on a first housing 210, a second display area 232 disposed on a second housing 220, and a folding area 233. According to an embodiment, the first display area 231 and the second display area 232 may rotate about a folding axis A.
[0092] According to an embodiment, display 230 may refer to a display that is at least partially deformable into a flat or curved surface. For example, display 230 may be a foldable or flexible display. According to an embodiment, display 230 may include a folding region 233, and a folding area disposed on one side of the folding region 233 (e.g., Figure 2 The first display area 231 (on the left side of the folded area 233 shown), and the other side of the folded area 233 (e.g., Figure 2 The second display area 232 is located to the right of the folded area 233 shown. However, the area division of the display 230 is exemplary, and the display 230 may be divided into multiple areas (e.g., four or more areas or two areas) depending on its structure or function. For example, in Figure 2 In the illustrated embodiment, the area of display 230 may be divided by a folded region 233 or a folding axis (axis A) extending parallel to the Y-axis. However, in another embodiment, the area of display 230 may be divided based on another folded region (e.g., a folded region parallel to the X-axis) or another folding axis (e.g., a folding axis parallel to the X-axis). According to embodiments, display 230 may be integrated with touch sensing circuitry, a pressure sensor configured to measure touch intensity (pressure), and / or a digital converter (not shown) configured to detect a magnetic field type stylus, or arranged adjacent to touch sensing circuitry, a pressure sensor configured to measure touch intensity (pressure), and / or a digital converter (not shown) configured to detect a magnetic field type stylus.
[0093] According to an embodiment, the first display area 231 and the second display area 232 may have a shape that is substantially symmetrical about the folded area 233. According to an embodiment (not shown), unlike the first display area 231, the second display area 232 may include a notch cut due to the presence of the sensor area 224, but may have a shape substantially symmetrical to the first display area 231 in areas other than the sensor area. For example, the first display area 231 and the second display area 232 may include portions with mutually symmetrical shapes and portions with mutually asymmetrical shapes.
[0094] The operation of the first housing 210 and the second housing 220, depending on the state of the electronic device 101 (e.g., flat or unfolded and folded) and the various areas of the display 230, will be described below.
[0095] According to an embodiment, when the electronic device 101 is in an unfolded state (flat state) (e.g., Figure 2 When the first housing 210 and the second housing 220 are configured to form a substantially 180-degree angle between them and be oriented in the same direction, the surfaces of the first display area 231 and the second display area 232 of the display 230 may form a 180-degree angle therebetween and may be oriented in the same direction (e.g., the front direction of the electronic device). The folding region 233 may define the same plane as the planes of the first display area 231 and the second display area 232.
[0096] According to an embodiment, when the electronic device 101 is in a folded state (e.g., Figure 3 When the electronic device 101 is in a folded state, at least a portion of the folded region 233 can be formed as a curved surface with a predetermined curvature. The surfaces of the first display area 231 and the second display area 232 of the display 230 can face each other while forming a narrow angle between them (e.g., between 0 and 10 degrees).
[0097] According to an embodiment, when the electronic device 101 is in an intermediate state (not shown), the first housing 210 and the second housing 220 can be configured to form an angle between them. The surfaces of the first display area 231 and the second display area 232 of the display 230 can form an angle greater than that in the folded state and less than that in the unfolded state. At least a portion of the folded area 233 can form a curved surface with a predetermined curvature, and in this case, the curvature can be less than that in the folded state.
[0098] Figure 4 This is an exploded perspective view of an electronic device according to an embodiment of the present disclosure. Figure 5This is a view showing the state in which the housing is assembled in an electronic device according to an embodiment of the present disclosure. Figure 6 This is a view showing the state in which a hinge plate is disposed in an electronic device according to an embodiment of the present disclosure. Figure 7 This is a view showing the arrangement of one or more hinge modules and electronic components inside an electronic device according to an embodiment of the present disclosure.
[0099] Reference Figures 4 to 7 Electronic device 200 (e.g., Figures 1 to 3 The electronic device 101 may include a housing 201, a display 230, a hinge assembly 202, a battery 250, and a board unit 260. For example, the housing 201 may include a first housing 210, a second housing 220, a first rear cover 280, and a second rear cover 290. In embodiments, the housing 201 may be understood to include a hinge cover 240. Figure 4 The construction of the first housing 210, the second housing 220, the hinge cover 240, the first rear surface cover 280, and the second rear surface cover 290 can be wholly or partially consistent with... Figure 2 and / or Figure 3 The first housing 210, the second housing 220, the hinge cover 240, the first rear surface cover 280, and the second rear surface cover 290 have the same structure.
[0100] According to an embodiment, the first housing 210 and the second housing 220 can be assembled to each other to engage opposite sides of the hinge assembly 202. For example, the hinge assembly 202 can be disposed in a hinge region between the first housing 210 and the second housing 220 to rotatably engage the first housing 210 and the second housing 220. Here, the term "hinge region" can refer to the space in which the hinge assembly 202 is disposed, the area at least partially surrounded by the hinge cover 240, and / or the space between the folding area 233 of the display 230 and the hinge cover 240. In the embodiment, the hinge region can be understood as the space substantially corresponding to the folding area 233.
[0101] According to the embodiments, such as Figures 5 to 7 As shown, the hinge assembly 202 may include at least one hinge module 229 and a plurality of hinge plates 227. In the illustrated embodiment, three hinge modules 229 are arranged sequentially along the folding axis A, and the flexible printed circuit board 266 may be configured to span the folding axis A through the area between two hinge modules 229. As described below, by means of the camera assembly 204 (e.g., Figure 2 or Figure 3Arranging or implementing multiple antennas or radiating conductors around the camera module 206 can increase the design freedom of the flexible printed circuit board 266. For example, since a greater number of antennas are implemented in one of the multiple housings 210 and 220 and are positioned in conjunction with communication circuitry (e.g., Figure 1 The communication module 190 is housed in the same housing, thus simplifying the wiring across the folding axis A between the communication circuitry and the transmission line between the antenna and the communication circuitry.
[0102] Although not shown, hinge module 229 may include a hinge portion providing at least one folding axis A and an interlocking portion interlocking the relative movement of housings 210 and 220. For example, one or more housings 210 and 220 may be coupled to hinge module 229 and may be rotatable relative to hinge module 229 or hinge cover 240. The interlocking portion may include, for example, a first gear and a second gear, the first gear being configured to rotate on hinge cover 240 as the first housing 210 rotates, and the second gear being configured to rotate on hinge cover 240 as the second housing 220 rotates. In an embodiment, when the first gear and the second gear mesh, the first housing 210 and the second housing 220 may be configured to rotate relative to each other in opposite directions. For example, when the first housing 210 rotates clockwise on hinge cover 240, hinge assembly 202 (e.g., the interlocking portion of hinge module 229) may cause the second housing 220 to rotate counterclockwise on hinge cover 240. In an embodiment, the rotation of the first housing 210 and the second housing 220 can be interlocked by further providing multiple gears (e.g., one or two pairs) between the first gear and the second gear. The number of gears included in the hinge module 229 (e.g., the interlocking portion) can be appropriately selected according to the design specifications of the electronic device (such as the size or shape of the available arrangement space).
[0103] According to an embodiment, hinge plate 227 can be rotatably coupled to one of housings 210 and 220. Figure 2 In its unfolded state, the hinge plate 227 can be aligned to form a continuous plane and can support a portion of the display 230 (e.g., Figure 2 or Figure 4 (The folded area 233). In Figure 3 In the folded state, the hinge plates 227 can be configured to tilt relative to each other, and a space can be constructed to accommodate the folded region 233, which deforms into a curved shape. In an embodiment, when the hinge plates 227 provide a space configured to accommodate the folded region 233 while tilting relative to each other, the folded region 233 can maintain a curved shape with a curvature within a predetermined range in the folded state. For example, in Figure 3In the folded state, the folded area 233 can be protected from damage caused by excessive folding by having a curvature radius of a predetermined size, and the surfaces of the first display area 231 and the second display area 232 can be arranged to form an angle of substantially 0 degrees.
[0104] According to an embodiment, the first housing 210 may include a first support region 212 (e.g., a first support member) configured to support components of the electronic device 200 (e.g., a first circuit board 262 and / or a first battery 252) and a first sidewall 211 configured to surround at least a portion of the first support region 212. The first sidewall 211 may include a first side surface of the electronic device 200 (e.g., Figure 2 The first side surface 210c). According to an embodiment, the second housing 220 may include a second support region 222 configured to support components of the electronic device 200 (e.g., the second circuit board 264 and / or the second battery 254) and a second sidewall 221 configured to surround at least a portion of the second support region 222. The second sidewall 221 may include a second side surface of the electronic device 200 (e.g., the first side surface 210c). Figure 2 The second side surface 220c in the middle.
[0105] According to embodiments, the first sidewall 211 or the second sidewall 221 can be understood as a frame shape having at least partially surrounding the space between the front and rear surfaces of the electronic device 200 (e.g., the first housing 210 or the second housing 220). In embodiments, support regions 212 and 222 may each extend from a corresponding one of the sidewalls 211 and 221. For example, although support regions 212 and 222 and sidewalls 211 and 221 are described separately for ease of description, embodiments of this disclosure are not limited thereto, and support regions 212 or 222 and sidewalls 211 or 221 may be implemented as a single body. In embodiments, support regions 212 or 222 and sidewalls 211 or 221 may be implemented using a combination of insulating and conductive materials. In this case, housings 210 and 220 may be implemented such that support regions 212 or 222 and sidewalls 211 or 221 are integrally formed by insert molding and / or computer numerical control (CNC) machining processes. As will be described below with reference to embodiments, when a conductive material is included, portions of the support regions 212 and 222 and the sidewalls 211 and 221 can be used as one or more antennas or radiating conductors.
[0106] According to an embodiment, as described above, a portion of at least one of the housings 210 and 220 in the electronic device 200 can be used as an antenna. In an embodiment, the portion serving as the antenna of the electronic device 200 can realize a side surface of at least one of the housings 210 and 220. In an embodiment, the portion of the electronic device 200 that serves as the antenna can be configured to be adjacent to and / or oriented towards a direction intersecting the Z-axis of at least one of the housings 210 and 220. For example, the portion serving as the antenna of the electronic device 200 can be realized by a portion of the housings 210 and 220, or it can be manufactured as a separate component from the housings 210 and 220 and disposed adjacent to the edges of the housings 210 and 220. In an embodiment, the description "the portion of the electronic device 200 that serves as the antenna is realized by a portion of the housings 210 and 220" can be understood to include examples where the portion serving as the antenna is arranged to form a side surface of at least one of the housings 210 and 220.
[0107] According to an embodiment, although not shown, the first housing 210 may include a first waterproof member disposed in the first support region 212, and / or the second housing 220 may include a second waterproof member disposed in the second support region 222. The first waterproof member and / or the second waterproof member may be disposed in the gap between the display 230 and one or more support regions 212 and 222 to prevent moisture or foreign matter from flowing into the interior of the first housing 210 and / or the second housing 220 from the outside.
[0108] According to an embodiment, the display 230 may include a first display area 231, a second display area 232, and / or a folding area 233. Figure 3 The construction of the first display area 231, the second display area 232, and the folding area 233 can be consistent with... Figure 2 The first display area 231, the second display area 232, and the folded area 233 are all or partly identical in structure.
[0109] According to an embodiment, the electronic device 200 may further include a sub-display 234. In an embodiment, the sub-display 234 may display a screen in an orientation different from that of the display areas 231 and 232. For example, the sub-display 234 may output a screen in an orientation opposite to that of the first display area 231. According to an embodiment, the sub-display 234 may be disposed on the first rear surface cover 280.
[0110] According to an embodiment, the electronic device 200 may include a camera assembly 204 that combines multiple cameras (e.g., Figure 2 or Figure 3(Camera module 206). Although not shown, the electronic device 200 may also include a camera configured to image an object through a portion of the display 230 (e.g., a first display area 231 or a second display area 232), or a camera configured to image an object through a portion of a sub-display 234. As described below, camera assembly 204 may include multiple cameras with different viewing angles. For example, camera assembly 204 may include a camera with a viewing angle of about 100 degrees or greater (e.g., Figure 10 The first camera 341), and a camera with a field of view of approximately 65 to approximately 85 degrees (e.g., Figure 10 The second camera 342) and / or a camera with a field of view of about 15 degrees to about 40 degrees (e.g., Figure 10 (a third camera 343). In an embodiment, an additional camera having a field of view different from the range described above (e.g., about 40 degrees to about 60 degrees) may be included in the camera assembly.
[0111] According to an embodiment, the electronic device 200 and / or the second rear surface cover 290 may include a cover plate 299 configured to correspond to the camera assembly 204. The cover plate 299 may, for example, provide an optical path (e.g., a through-hole) corresponding to the camera assembly 204, while simultaneously harmonizing the optical path with the exterior of the electronic device 200. To give the exterior of the electronic device 200 an aesthetic appeal or achieve a harmonious external design, the cover plate 299 may include a metallic material. For example, the cover plate 299 may be made of or finished with a metallic material (e.g., printing, deposition, coating, or electroplating). In an embodiment, the cover plate 299 can be understood as a portion of the second rear surface cover 290. A portion of the cover plate (e.g., an edge) may be disposed inside the second rear surface cover 290, and another portion may be exposed to the outside. As described below, when the cover plate 299 includes a metallic material (e.g., a conductive material), it can be used to connect to transmission wiring (… Figure 24 or Figure 26 The flexible printed circuit boards 373b and 383) include at least a notch in the overlapping area to suppress electromagnetic coupling.
[0112] According to an embodiment, battery 250 may include a first battery 252 disposed in a first housing 210 and a second battery 254 disposed in a second housing 220. According to an embodiment, the first battery 252 may be connected to a first circuit board 262, and the second battery 254 may be connected to a second circuit board 264. According to an embodiment, battery 250 may supply power to at least one component of electronic device 200. According to an embodiment, battery 250 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.
[0113] According to an embodiment, board unit 260 may include a first circuit board 262 disposed within a first housing 210 and a second circuit board 264 disposed within a second housing 220. According to an embodiment, the first circuit board 262 and the second circuit board 264 may be electrically connected via at least one flexible printed circuit board 266. According to an embodiment, at least a portion of the flexible printed circuit board 266 may be configured to span a hinge region or hinge structure (e.g., hinge assembly 202). According to an embodiment, the first circuit board 262 and the second circuit board 264 may be disposed within a space defined by the first housing 210, the second housing 220, the first rear surface cover 280, and the second rear surface cover 290. Components for implementing various functions of the electronic device 200 may be mounted on the first circuit board 262 and the second circuit board 264. As will be described below, one of the first circuit board 262 and the second circuit board 264 may provide an opening region configured to accommodate a camera assembly 204 (e.g., Figure 12 or Figure 13 (Opening region 364a).
[0114] According to an embodiment, the electronic device 200 may include speakers 208a and 208b. According to an embodiment, speakers 208a and 208b can convert electrical signals into sound. According to an embodiment, speakers 208a and 208b may be arranged within a space defined by a first housing 210, a second housing 220, a first rear surface cover 280, and a second rear surface cover 290. According to an embodiment, speakers 208a and 208b may include an upper speaker 208a located at the upper part (+Y direction) of the electronic device 200 and a lower speaker 208b located at the lower part (-Y direction) of the electronic device 200. In this disclosure, speakers 208a and 208b are shown as being located within a housing (e.g., Figure 4 The speakers 208a and 208b may be located within at least one of the first housing 210 or the second housing 220, but this is an optional configuration. For example, the speakers 208a and 208b may be located within at least one of the first housing 210 or the second housing 220. Figure 4 The construction of speakers 208a and 208b can be wholly or partially related to... Figure 1 The sound output module 155 in the middle has the same structure.
[0115] According to an embodiment, the electronic device 200 may include a rear member 270 (or a rear housing). According to an embodiment, the rear member 270 may be disposed within a housing 201 (e.g., a second housing 220). According to an embodiment, the rear member 270 may accommodate at least one antenna 275. In an embodiment, the rear member 270 may serve as a structure configured to have the antenna 275 disposed thereon, and may serve as a structure configured to support or protect one of circuit boards 262 and 264. For example, a portion of the rear member 270, indicated by reference numeral "279", may support a portion of circuit board 262 or 264.
[0116] According to an embodiment, the electronic device 200 may include an antenna 275. Antennas 275a and 275b may include, for example, an ultra-wideband (UWB) antenna 275a, a near-field communication (NFC) antenna, a wireless charging antenna, and / or a magnetically secure transmission (MST) antenna 275b. Antenna 275 may, for example, perform short-range communication with external devices or wirelessly transmit and receive power required for charging.
[0117] In embodiments, the antenna structure may be provided by a portion or combination thereof of housing 201. For example, antenna 275 may include communication antenna 275c, which is at least partially exposed to the exterior of electronic device 200 and forms at least a portion of the exterior of electronic device 200. Communication antenna 275c may be used to communicate with external electronic devices (e.g., Wi-Fi). For example, communication antenna 275c may be located at the upper portion 271a or lower portion 271b of rear member 270. Furthermore, electronic device 200 may also include additional antennas disposed adjacent to portions of sidewalls 211 and 221 or adjacent to electronic components such as camera assembly 204, which will be described in detail in the embodiments described below.
[0118] In the following detailed description, a configuration in which a pair of housings (or “housing structures”) are rotatably joined by a hinge structure (or “hinge assembly 202”) can be described as an example. However, it should be noted that the electronic devices according to the various embodiments disclosed herein are not limited to these embodiments. For example, an electronic device according to embodiments of this disclosure may include three or more housings, and the term “pair of housings” described in the following embodiments may refer to “two of three or more housings that are rotatably joined to each other.” In the embodiments, Figure 1 All components of the electronic device 101 may be included in one of the first housing 210 or the second housing 220 described above, and in this case, one of the first housing 210 or the second housing 220 may be understood as an embodiment of the electronic device. For example, it should be noted that the electronic device according to the embodiments of this disclosure is not limited by the number of housings or the combination structure implemented between multiple housings.
[0119] In the embodiments described below, repeated components or components that can be readily understood from the preceding embodiments may be assigned the same reference numerals or omitted, and their detailed descriptions may be omitted. Even when reference numerals are assigned in the drawings but are not mentioned in the detailed description with reference to the drawings, those skilled in the art can readily understand these components from the overall detailed description of this disclosure.
[0120] Figure 8 This is a perspective view showing the contacts of an electronic device according to an embodiment of the present disclosure. Figure 9 This is a perspective view showing the state in which the contacts are disposed in an electronic device according to an embodiment of the present disclosure.
[0121] Further reference Figure 8 and Figure 9 The electronic device 200 may include at least one contact 329. The contact 329 may be, for example, a plate or leaf spring bent into an L-shape, and may be disposed on a sidewall 321 (e.g., Figure 4 The first portion 321a of the second sidewall 321. The first portion 321a of the sidewall 321 may, for example, form a frame-shaped portion and may at least partially include a conductive material. The contact 329 may include a fixing portion 329a disposed on the inner surface of the first portion 321a, and a contact portion 329b bent at a predetermined angle relative to the fixing portion 329a. With the fixing portion 329a disposed on the inner surface of the first portion 321a, the contact portion 329b can be understood as extending from the inner surface of the first portion 321a toward the housing 320 (e.g., Figure 4 The second housing 220 extends inside the first part 321a. The fixing part 329a can be fixed to the inner surface of the first part 321a by welding or brazing and / or by conductive adhesive or conductive tape.
[0122] According to an embodiment, the first portion 321a of the sidewall 321 can be electrically connected to a communication circuit (e.g., via a contact 329) through a contact 329. Figure 1 The communication module 190). For example, electronic device 200, processor (e.g., Figure 1 The processor 120) and / or communication module (e.g., Figure 1 The communication module 190 can perform wireless communication using the first portion 321a. In an embodiment, the first portion 321a can be used as a radiating conductor (e.g., an antenna) configured to perform wireless communication in at least one of a frequency band of about 1.8 GHz, a frequency band of about 2.4 GHz, and / or a frequency band of about 3.5 GHz. In an embodiment, when the first portion 321a is used as a radiating conductor, the contact 329 can be configured as a feed point, and Figure 9The portion indicated by "GP" can be set as a short-circuit point or a ground point. For example, the first portion 321a can be implemented as an inverted F antenna.
[0123] According to an embodiment, the sidewall 321 may include a second portion 321b adjacent to and electrically insulated from the first portion 321a. In an embodiment, when viewed from the outside of the electronic device 200, the second portion 321b (e.g., an outer surface) may be configured to form a continuous curved surface or a continuous plane with the first portion 321a. Although not explicitly stated in Figure 9 The accompanying drawings show, but the portion indicated by "321c" can illustrate an insulating structure (e.g., Figure 14 , Figure 16 and / or Figure 17 The insulating structure 321c. For example, the first portion 321a and the second portion 321b can be mechanically connected or bonded to each other while being electrically insulated from each other by the insulating structure 321c. When a conductive material (e.g., metal) and the insulating structure 321c are included, the housing 320 (e.g., sidewalls 321 and / or support regions 322) can be manufactured by an insert injection molding process. For example, the insulating structure 321c can be formed with pre-manufactured conductive portions placed in a mold, and after forming, additional processes such as computer numerical control machining can be performed as needed to manufacture the housing 321 with the desired design shape.
[0124] Figure 10 This is a view showing the camera assembly of an electronic device according to an embodiment of the present disclosure. Figure 11 This illustrates an electronic device according to an embodiment of the present disclosure. Figure 10 A perspective view of the third camera in the camera assembly.
[0125] Reference Figure 10 and Figure 11 Camera component 304 (e.g., Figure 4 or Figure 7 The camera assembly 304 may include multiple cameras 341, 342, and 343. For example, the camera assembly 304 may include a first camera 341 configured to provide ultra-wide-angle functionality, a second camera 342 configured to provide wide-angle functionality, and / or a third camera 343 configured to provide telephoto functionality. Here, it should be noted that optical performance (e.g., angle of view or focal length) such as “ultra-wide-angle,” “wide-angle,” and / or “telephoto” is not limited to those defined by the specifications of the cameras 341, 342, and 343. For example, in embodiments of this disclosure, the optical performance of the cameras 341, 342, and 343 may be defined based on a relative comparison of the angle of view or focal length of the cameras 341, 342, and 343 included in the camera assembly 304.
[0126] According to an embodiment, cameras 341, 342, and 343 may be positioned along the length of the electronic device 200 or the housing 320 (e.g., Figure 4 The cameras 341, 342, and 343 may be arranged along the width direction of the electronic device 200 (e.g., along the Y-axis direction). In an embodiment, cameras 341, 342, and 343 may be arranged along the width direction of the electronic device 200 (e.g., along the Y-axis direction). Figure 4 The cameras 341, 342, and 343 can be arranged along a closed-loop trajectory (in the X-axis direction). For example, the number and arrangement of cameras 341, 342, and 343 are not limited to embodiments of this disclosure and can be varied according to the specifications of the electronic device 200. In embodiments, cameras 341, 342, and 343 can be electrically connected to a circuit board (e.g., via wiring boards 347a, 347b, and 347c). Figure 4 The second circuit board 264 or Figure 12 Circuit board 364).
[0127] According to an embodiment, the electronic device 200 and / or camera assembly 304 may further include at least one support protrusion 345. In an embodiment, when another electronic component (e.g., Figure 15 When the antenna module 307 is positioned adjacent to the camera assembly 304, the support protrusion 345 can provide a structure for supporting another electronic component, or can provide a structure for supporting another electronic component (e.g., Figure 15 The alignment structure of the wiring of the first flexible printed circuit board 373. In the illustrated embodiment, the support protrusion 345 can be understood as protruding from one side of the third camera 343. However, the embodiments of this disclosure are not limited to this, and additional support protrusions may be provided on the first camera 341 or the second camera 342, and / or the support protrusion 345 of the third camera 343 may be omitted when a support protrusion is provided on the first camera 341 or the second camera 342. For example, the support protrusion 345 may be implemented differently depending on the position or wiring path of the electronic components disposed adjacent to the camera assembly 304.
[0128] Figure 12 This is a first view showing a circuit board of an electronic device according to an embodiment of the present disclosure. Figure 13 This is a second view showing a circuit board of an electronic device according to an embodiment of the present disclosure.
[0129] Reference Figure 12 and Figure 13 Circuit board 364 (e.g., Figure 4The second circuit board 264 may have an opening region 364a at one of its side edges. Although no reference numerals are assigned, at least one surface of the circuit board 364 may have one or more electrical / electronic components disposed thereon, such as integrated circuit chips and / or various connectors. At least one connector may provide a connection structure with electronic components such as camera assembly 304. The opening region 364a may, for example, provide a space configured to receive at least a portion of camera assembly 304. In an embodiment, when the circuit board 364 is aligned to the front surface of housing 320 (e.g., Figure 2 The second front surface 220a) and the rear surface (e.g., Figure 2 The second rear surface 220b) is between the two surfaces along the thickness direction (e.g., Figure 4 When the electronic device 200 overlaps with the camera assembly 304 in the Z-axis direction, the thickness of the electronic device 200 may increase. The opening region 364a provides space or area for mounting the camera assembly 304, thus reducing the increase in the thickness of the electronic device 200 in the arrangement of the camera assembly 304 and the circuit board 364. For example, the circuit board 364 may be disposed between the front and rear surfaces of the housing 320 so as not to overlap with the camera assembly 304 at least partially in the thickness direction.
[0130] According to an embodiment, the circuit board 364 may form a portion of the opening region 364a, or may include an extension 364b surrounding at least a portion of the opening region 364a. Reference will be made below to at least... Figure 14 As described, the extension 364b may, for example, be disposed between the first portion 321a and the camera assembly 304 within the housing 320. In embodiments, the contact 329 (e.g., contact portion 329b) may be configured to at least partially face the extension 364b. For example, the extension may be located in the width direction of the electronic device 200 (e.g., Figure 4 It is disposed between the sidewall (e.g., the first part) and the camera assembly in the X-axis direction, and can be configured in the thickness direction of the electronics 200 (e.g., the thickness direction). Figure 4 The contact 329 faces the contact element on the Z-axis direction. In an embodiment, the contact element 329 can be understood as being disposed between the front surface of the housing 320 and the extension 364b in the thickness direction of the electronic device 200. In an embodiment, the extension 364b can be used as a portion for electrically connecting the contact element 329 and / or the sidewall 321 (e.g., the first portion 321a) to the circuit board 364.
[0131] According to an embodiment, when the first portion 321a and / or contact 329 are electrically connected to the circuit board 364, the electronic device 200 and / or the circuit board 364 may further include a leaf spring-type contact terminal 364c disposed on one surface of the circuit board 364 (e.g., the extension portion 364b). In an embodiment, when the first portion 321a serves as a radiating conductor, the contact terminal 364c can be electrically connected to the circuit board 364 through direct contact with the contact 329 (e.g., the contact portion 329b), such that the first portion 321a and / or contact 329b can be electrically connected to the circuit board 364 through the contact terminal 364c. For example, the first portion 321a, serving as a radiating conductor, can receive a feed signal via the contact 329 and / or the contact terminal 364c. In an embodiment, the contact portion 329b may be manufactured with a curved shape to directly contact the circuit board 364 (e.g., the extension portion 364b). In this case, the contact terminal 364c may be replaced by a flat washer instead of a leaf spring structure.
[0132] According to an embodiment, in order to stably maintain the contact state between the contact 329 and the contact terminal 364c, the contact 329 or the contact terminal 364c may have a leaf spring structure. For example, when the circuit board 364 is disposed on the housing 320, the contact 329 and the contact terminal 364c may contact each other and may partially deform or partially shift while storing elastic force. In an embodiment, the extension portion 364b may have a sufficiently small width to be disposed in the narrow gap between the first portion 321a and the camera assembly 304. In this case, the elastic force stored in the contact 329 and the contact terminal 364c may cause the extension portion to deform or be damaged. For example, when the extension portion 364b deforms, it may be difficult to stably maintain the electrical connection between the contact 329 and the contact terminal 364c, and the durability of the extension portion 364b may be reduced.
[0133] According to an embodiment, the electronic device 200 and / or circuit board 364 may further include a support plate 364d to suppress deformation of the extension portion 364b and stably maintain the connection between the contact 329 and the contact terminal 364c. In an embodiment, the support plate 364d may be made of a metal material such as stainless steel and may be disposed on other surfaces of the circuit board 364. In an embodiment, the support plate 364d can be understood as being at least partially disposed on other surfaces of the extension portion 364b. For example, even when a spring force is applied to the extension portion 364b through the contact 329 and the contact terminal 364c, deformation or damage to the extension portion 364b can be suppressed by the support plate 364d supporting the extension portion 364b.
[0134] According to an embodiment, the electronic device 200 and / or circuit board 364 may further include fastening holes 364e penetrating the circuit board 364 and / or support plate 364d in a region adjacent to the extension portion 364b. For example, when the circuit board 364 is secured within the housing 320 (e.g., support region 322), fastening members such as screws can secure the circuit board 364 and support plate 364d to the support region 322 through the fastening holes 364e. The fastening force provided by the fastening members can further suppress deformation of the extension portion 364b and / or support plate 364d due to elasticity.
[0135] Figure 14 This illustrates an embodiment according to the present disclosure. Figure 11 camera components and Figure 13 A view showing the state of the circuit board set inside the housing of the electronic device.
[0136] Further reference Figure 14 Within a space at least partially surrounded by sidewall 321, camera assembly 304 may be disposed adjacent to a portion of sidewall 321. For example, camera assembly 304 may be disposed on a support region 322 of housing 320, adjacent to a first portion 321a and / or a second portion 321b of sidewall 321. Support protrusion 345 of camera assembly 304 may be provided, for example, in a form that protrudes toward sidewall 321 (e.g., first portion 321a). For example, support protrusion 345 can be understood as protruding from a side surface of third camera 343 toward first portion 321. As will be referred to below at least Figures 16 to 18 The aforementioned, from the antenna module (e.g., Figure 15 or Figure 17 The first flexible printed circuit board 373 extending from the antenna module 307 may be partially disposed between the sidewall 321 and the support protrusion 345, and may be bent to surround at least a portion of the support protrusion 345.
[0137] According to an embodiment, the circuit board 364 can be disposed on the support region 322 (or inside the sidewall 321) with the extension portion 364b located in the region between the camera assembly 304 and the first portion 321a. For example, between the camera assembly 304 and the first portion 321a, the contact terminals 364c of the circuit board 364 (e.g., Figure 12 The contact terminal 364c can contact the contact 329, such that the sidewall 321 (e.g., the first portion 321a) can be electrically connected sequentially to the extension portion 364b and / or the circuit board 364 via the contact 329 and the contact terminal 364c.
[0138] According to an embodiment, the second portion 321b of the sidewall 321 can be electrically connected to the circuit board 364 to serve as an antenna (e.g., a radiating conductor). For example, Figure 1The processor 120 and / or communication module 190 can be configured to perform wireless communication using the second portion 321b in a frequency band different from that of the first portion 321a (e.g., approximately 850 MHz and / or approximately 900 MHz). In an embodiment, in addition to the first portion 321a and the second portion 321b, one or more other conductive portions of the sidewall 321 can be electrically connected to the circuit board 364 to perform wireless communication in the respective different frequency bands. In an embodiment, the conductive portions can be mechanically bonded while being connected through an insulating structure (e.g., Figure 14 , Figure 16 and / or Figure 17 The insulating structures 321c) are electrically insulated from each other. Figure 14 In the figure, one or more points indicated by reference numeral EP can illustrate points where one or more conductive portions forming sidewall 321 are electrically connected to circuit board 364 (e.g., feed point or ground point).
[0139] Figure 15 This is a perspective view showing an antenna module of an electronic device according to an embodiment of the present disclosure.
[0140] Reference Figure 15 Antenna module 307 may include antenna substrate 371 and a first flexible printed circuit board 373 extending from antenna substrate 371. In embodiments, the first flexible printed circuit board 373 can be understood as a component distinct from antenna module 307. In embodiments, antenna substrate 371 and the first flexible printed circuit board 373 may be substantially implemented as a single substrate, and in this case, the first flexible printed circuit board 373 may be manufactured to be more flexible or softer than antenna substrate 371. Antenna module 307 may be configured to perform millimeter-wave (mmWave) communication, for example, in frequency bands of tens of gigahertz or higher. For example, multiple radiating patches implemented in the form of printed circuit patterns may be disposed on one surface of antenna substrate 371, and electronic device 200 may perform wireless communication using the direction in which the surface on which the radiating patches are disposed of on antenna module 307 faces. It should be noted that in the illustrated embodiment, a structure is illustrated by providing a protective molding on one surface of antenna substrate 371 to conceal the radiating patches.
[0141] According to an embodiment, the first flexible printed circuit board 373 may be disposed inside the electronic device 200 and / or housing 320 in a bent state at least once. The first flexible printed circuit board 373 can be described as being divided into a first alignment portion 373a between the antenna substrate 371 and the bent portion, and a second alignment portion 373b extending from the first alignment portion 373a. According to an embodiment, Figure 15The first flexible printed circuit board 373 shown is illustrated as being assembled on the housing 320, and in its initial manufacturing state, the first flexible printed circuit board 373 may be substantially parallel to the antenna substrate 371. After bending, the second alignment portion 373b may be configured to be inclined or substantially perpendicular to the antenna substrate 371 and / or to the first alignment portion 373a. In an embodiment, the first flexible printed circuit board 373 may be electrically connected to the circuit board at the end of the second alignment portion 373b (e.g., Figure 4 The second circuit board 264 or Figure 17 Circuit board 364).
[0142] According to an embodiment, the electronic device 200 and / or antenna module 307 may further include a first dummy member 375 disposed at a curved portion of the first flexible printed circuit board 373. The first dummy member 375 may be made of an elastic material, synthetic resin, and / or metal material, and may maintain the shape of the curved portion as designed. For example, when the first flexible printed circuit board 373 is elastic, it may have a tendency to return to its initial manufactured shape when configured in a curved shape, and the first dummy member 375 may suppress the restoring force of the first flexible printed circuit board 373, thereby forcing the first flexible printed circuit board 373 to maintain its curved shape.
[0143] According to an embodiment, the first flexible printed circuit board 373 is connected to surrounding components (e.g., Figure 26 The distance between the sidewall 321, camera assembly 304, and / or cover plate 299 can vary depending on the shape of the first flexible printed circuit board 373. This variation in distance can lead to variations in wireless communication performance between different electronic devices with substantially the same design specifications when the first flexible printed circuit board 373 is configured to transmit wireless communication signals. In an embodiment, the first dummy member 375 can hold the first flexible printed circuit board 373 in its designed shape at curved portions, thereby maintaining a constant distance from surrounding components. For example, by keeping the shape of the first flexible printed circuit board 373 or its distance from surrounding components constant, the first dummy member 375 can suppress variations in wireless communication performance.
[0144] Reference Figures 16 to 18 The construction of the antenna module 307 mounted on the housing 320 is further described.
[0145] Figure 16 This illustrates an embodiment of the present disclosure. Figure 15 A perspective view of the process of installing the antenna module in the housing of the electronic device. Figure 17 This illustrates an embodiment according to the present disclosure. Figure 15 A view showing the state of the antenna module housed within the casing of the electronic device. Figure 18 It shows along Figure 17 A view of a portion of an electronic device according to an embodiment of the present disclosure, taken by line A-A'.
[0146] Further reference Figures 16 to 18 Antenna module 307 (e.g., antenna substrate 371) may be disposed between sidewall 321 (e.g., second portion 321b) and camera assembly 304, such that the surface on which a radiating patch is disposed faces the second portion 321b. In an embodiment, a first flexible printed circuit board 373 may extend from antenna substrate 371 and may be at least partially disposed between the second portion 321b and camera assembly 304 and / or between the first portion 321a and camera assembly 304. In an embodiment, one end of the first flexible printed circuit board 373 (e.g., second alignment portion 373b) may be electrically (or mechanically) connected to circuit board 364 on one side of third camera 343. For example, the first flexible printed circuit board 373 may transmit wireless communication signals from a communication circuit disposed on circuit board 364 (e.g., Figure 1 The communication module 190 sends the signal to the antenna substrate 371. In this embodiment, the wireless communication signal received by the antenna substrate 371 can be provided to the circuit board 364 via the first flexible printed circuit board 373.
[0147] According to an embodiment, in the Y-axis direction, the support protrusion 345 can be provided on the contact member 329 (or Figure 12 The contact terminal 364c) is between the antenna substrate 371, and the curved portion of the first flexible printed circuit board 373 (e.g., the first dummy member 375) can be configured to surround at least a portion of the support protrusion 345. For example, the curved portion of the first flexible printed circuit board 373 can be provided with two regions (or substantially in contact) adjacent to the surface of the support protrusion 345, the two regions being inclined or substantially perpendicular to each other. In embodiments, such as Figure 16 As shown, a portion of the first flexible printed circuit board 373 (e.g., the first alignment portion 373a) can be disposed between the camera assembly 304 and the sidewall 321 (e.g., the first portion 321a and / or the second portion 321b) in a state parallel to the antenna substrate 371. For example, between the bend and the antenna substrate 371, the first alignment portion 373a can be aligned with the antenna substrate 371 in the direction facing the sidewall 321.
[0148] According to an embodiment, from the bent portion (e.g., the first dummy member 375) to the end connected to the circuit board 364, another portion of the first flexible printed circuit board 373 (e.g., the second alignment portion 373b) can be bent relative to the first alignment portion 373a so as to be configured to face an orientation different from that of the first alignment portion 373a. For example, when the first alignment portion 373a is configured to face the sidewall 321, the second alignment portion 373b can be understood as being configured to substantially face the front surface of the electronic device 200 (e.g., ...). Figure 2 The second front surface 220a) or the rear surface (e.g., Figure 2 (Second rear surface 220b). In an embodiment, the second alignment portion 373b may be disposed between the camera assembly 304 and the first portion 321a and / or between the camera assembly 304 and the second portion 321b.
[0149] According to an embodiment, between the sidewall 321 and the camera assembly 304, the first flexible printed circuit board 373 can be configured to span the area where the contacts 329 and / or contact terminals 364c are provided. Electromagnetic interference (EMI) may occur when the contacts 329, contact terminals 364c, and / or the first flexible printed circuit board 373 are arranged adjacent to each other while serving as transmission lines for wireless communication signals. EMI generated between transmission lines may reduce the efficiency of wireless communication or distort the wireless communication signals. As described above, by bending at least once, the first flexible printed circuit board 373 can be positioned in a confined space while maintaining a sufficient distance to suppress EMI. Here, the description of "sufficient distance to suppress EMI while allowing it to be in a confined space" can refer to the distance from the contacts 329 or contact terminals 364c, and can be a distance permitted by the design specifications of the electronic device 200 or housing 320.
[0150] According to an embodiment, the supporting protrusion 345 and / or the curved portion of the first flexible printed circuit board 373 may be disposed in the region between the contact 329 and the antenna substrate 371. For example, the first flexible printed circuit board 373 is provided with a span. Figure 12A portion of the area of the contact 329 or contact terminal 364c may substantially correspond to the second alignment portion 373b. According to an embodiment, the second alignment portion 373b can be understood as being positioned facing the contact 329 (or contact terminal 364c), with the circuit board 364 (e.g., the extension 364b) located between the second alignment portion 373b and the contact 329. In an embodiment, when the first alignment portion 373a is configured to span the area where the contact 329 or contact terminal 364c is disposed, the first flexible printed circuit board 373 may be configured to be substantially close to the contact terminal 364c, thereby causing electromagnetic interference. In embodiments of this disclosure, the arrangement of the contact terminal 364c, the support protrusion 345, and / or the curved portion of the first flexible printed circuit board 373 can suppress electromagnetic interference by sufficiently ensuring that the distance between the contact terminal 364c and the first flexible printed circuit board 373 (and / or the distance between the contact 329 and the first flexible printed circuit board 373) is within the limits allowed by the internal space of the electronic device 200. The distance between contact terminal 364c and the first flexible printed circuit board 373 can be understood as being in Figure 17 In the structure shown, measurements are taken along the Y-axis from contact terminal 364c to the first alignment portion 373a. Figure 18 The structure shown measures the distance from the contact terminal 364c to the second alignment portion 373b along the Z-axis.
[0151] exist Figure 18 In the structure shown, the area indicated by "S1" can be used to illustrate the location of a keyboard component that will be described later (e.g., Figure 19 or Figure 20 The space of the keyboard assembly 308, and the area indicated by "S2" can be used to illustrate that keys (e.g., keys that are operated by the user to actuate the keyboard assembly 308) are provided therein. Figure 24 The space for the button component 397. Before setting the key, area S2 can be perceived by the user as a recessed portion from the outside of sidewall 321. In the embodiment, in the face of the switch (e.g., facing the keyboard component 308 described later) Figure 19 In portions of switches 381a and 381b), region S2 may have a through-hole structure extending from the outer surface of sidewall 321 to region S1, and in portions not facing the switch, region S2 may have, for example, Figure 22 or Figure 23 The recessed or groove shape shown. In the embodiment, region S1 or region S2 can be understood as being provided at least in part by the first portion 321a of the sidewall 321.
[0152] According to an embodiment, the rear surface panel 290 can be connected to a third camera 343 (e.g., Figure 10A through-hole structure is provided at the corresponding position of the camera assembly 304 to provide an imaging path or optical path for the third camera 343. In an embodiment, in order to protect the third camera 343 (e.g., Figure 10 The camera assembly 304), electronic device 200, and / or rear surface panel 290 may also include a cover plate 299. In embodiments, the cover plate 299 can be understood as part of the rear surface panel 290.
[0153] According to an embodiment, the cover plate 299 may be disposed on at least a portion around the camera assembly 304, and may be positioned relative to the camera (e.g., ...). Figure 10 One or more optical apertures are provided at positions corresponding to the first camera 341, the second camera 342, and / or the third camera 343. In the illustrated embodiment, a structure in which the window plate 299a is disposed in one or more optical apertures of the cover plate 299 can be illustrated. In the embodiment, at least a portion of the edge of the cover plate 299 may be attached to or fixed to the inner surface of the rear surface plate 290, and at least a portion of the outer surface of the cover plate 299 may be exposed to the outside of the rear surface plate 290. In the embodiment, to harmonize with the appearance of the electronic device 200 and / or the rear surface plate 290, or to enhance the aesthetic appearance of the electronic device 200, the cover plate 299 may be made of a metallic material or may be finished with a metallic material (e.g., by printing, coating, deposition, or electroplating).
[0154] In the following text, reference will be made to Figures 19 to 23 The construction and layout of the keyboard assembly 308 are described in more detail.
[0155] Figure 19 This is a first perspective view showing a keyboard assembly of an electronic device according to an embodiment of the present disclosure. Figure 20 This is a second perspective view showing a keyboard assembly of an electronic device according to an embodiment of the present disclosure.
[0156] First, refer to Figure 19 and Figure 20 The keyboard assembly 308 may include a switch substrate 381 and a second flexible printed circuit board 383. The switch substrate 381 may include one or more switches 381a and 381b, for example, disposed on one surface thereon. In embodiments, switches 381a and 381b may be implemented as mechanical structures such as dome switches or tactile switches, and in embodiments, switches 381a and 381b may be implemented as capacitive sensors or pressure-sensitive sensors. In embodiments, the second flexible printed circuit board 383 may extend from the switch substrate 381 and may be electrically connected at its ends to… Figure 21 Circuit board 364. See below for reference. Figures 21 to 23As described, the second flexible printed circuit board 383 may be configured to intersect (or cross) the first flexible printed circuit board 373 or the extension 364b on one side of the camera assembly 304.
[0157] According to an embodiment, the electronic device 200 and / or keyboard assembly 308 may further include a second dummy member 385 disposed on the second flexible printed circuit board 383, thereby standardizing the arrangement of the second flexible printed circuit board 383 and / or the first flexible printed circuit board 373. For example, even in the presence of manufacturing or assembly tolerances, the second flexible printed circuit board 383 and / or the first flexible printed circuit board 373 may be disposed at a predetermined position and in a predetermined shape relative to the rear surface plate 290 or the cover plate 299.
[0158] According to an embodiment, when the second dummy member 385 is located at a first distance from the switch substrate 381, the second dummy member 385 can be understood as being located at a second distance D2 from the end of the second flexible printed circuit board 383, greater than the first distance D1. As described later, there may be a height difference between the switch substrate 381 and the circuit board 364 on the housing 320. In this case, the second flexible printed circuit board 383 can be configured to be partially tilted or have a curved surface. The second dummy member 385 can be disposed in an area of the second flexible printed circuit board 383 where the tilt change is relatively small or the curvature is relatively small.
[0159] According to an embodiment, the electronic device 200 and / or keyboard assembly 308 may further include a protective plate 387 disposed on one surface of the switch substrate 381 and protective supports 389 disposed on other surfaces of the switch substrate 381. (As per...) Figure 22 or Figure 23 As illustrated, when the keyboard assembly 308 is disposed on the housing 320, a protective plate 387 may be disposed between one surface of the switch substrate 381 and the sidewall 321 (e.g., the first portion 321a) to protect the switch substrate 381, and a protective bracket 389 may prevent other surfaces of the switch substrate 381 from directly contacting the structure of the sidewall 321 or the support region 322. For example, the switch substrate 381 may be disposed or fixed substantially inside the sidewall 321 by means of the protective plate 387 and the protective bracket 389. In embodiments, the protective plate 387 may be made of an elastic material such as rubber or silicone to provide a waterproof / dustproof structure at the S2 region of the through-hole structure or at the inner surface of the sidewall 321.
[0160] Figure 21 This illustrates an embodiment according to the present disclosure. Figure 19 or Figure 20 A view of the state of the keyboard assembly set within the housing of the electronic device. Figure 22 It shows along Figure 21A cross-sectional view of a portion of an electronic device according to an embodiment of the present disclosure, taken by line B-B'. Figure 23 It shows along Figure 21 A cross-sectional view of a portion of an electronic device according to an embodiment of the present disclosure, taken by line C-C'.
[0161] Figure 22 and Figure 23 An example is the rear surface panel 290 (e.g., Figure 4 The second rear surface panel 290) or cover plate 299, but it should be noted that, Figure 21 In this diagram, the rear panel 290 or cover 299 is omitted to illustrate the arrangement of the camera assembly 304, the antenna module 307, and / or the keyboard assembly 308.
[0162] Further reference Figures 21 to 23 The keyboard assembly 308 can be disposed within the interior space of the housing 320 (e.g., Figure 18 In region S1), facing the sidewall 321 (e.g., the first portion 321a). In embodiments, the statement "keyboard assembly 308 is configured to face the sidewall" may refer to a configuration in which the switch substrate 381 or one or more switches 381a and 381b are configured to face the inner surface of the sidewall 321. In embodiments, the switch substrate 381 may be stably mounted on a structure (e.g., sidewall 321 or support region 322) provided by the housing 320 by a protective plate 387 and / or a protective bracket 389. In embodiments, the second flexible printed circuit board 383 may be mounted on the circuit board 364 in a bent state relative to the switch substrate 381. For example, when the switch substrate 381 is configured to face the sidewall 321, the second flexible printed circuit board 383 may be understood as being configured to face the front surface of the electronic device 200 (e.g., Figure 2 The second front surface 220a) or the rear surface (e.g., Figure 2 The second rear surface 220b).
[0163] According to an embodiment, the second flexible printed circuit board 383 may be partially aligned to substantially face the circuit board 364, wherein the first flexible printed circuit board 373 is interposed between the second flexible printed circuit board 383 and the circuit board 364, and the end of the second flexible printed circuit board 383 may be electrically (and / or mechanically) connected to the circuit board 364. For example, the second flexible printed circuit board 383 may be disposed on the circuit board 364 to partially intersect (or partially interlock) with the first flexible printed circuit board 373. In an embodiment, the first flexible printed circuit board 373 can be understood as being connected to the circuit board 364 at one end and being arranged to sequentially span an area where the contact 329 (or contact terminal 364c) is disposed and an area where the second flexible printed circuit board 383 (or the second dummy member 385) is disposed.
[0164] According to an embodiment, when the circuit board 364 is disposed on the housing 320 (e.g., support region 322), the contact terminal 364c and the contact element 329 can make mechanical and / or electrical contact with each other. By storing elasticity when the contact terminal 364c deforms upon contact with the contact element 329, the contact state can be maintained more stably. In an embodiment, the elasticity stored in the contact terminal 364c can press the circuit board 364 (e.g., extension 364b) in the -Z direction. When the elasticity of the contact terminal 364c acts on a structure with a relatively small length or width (e.g., within a few millimeters), the extension 364b may deform or be damaged. In an embodiment, Figure 13 or Figure 14 The support plate 364d can support the extension portion 364b on other surfaces of the extension portion 364b, thereby suppressing the deformation of the extension portion 364b caused by the elasticity of the contact terminal 364c, while maintaining the contact state between the contact terminal 364c and the contact member 329 more stably.
[0165] According to an embodiment, the rear surface panel 290 can be connected to a third camera 343 (e.g., Figure 10 A through-hole structure is provided at the corresponding position of the camera assembly 304, thereby providing a third camera 343 (e.g., Figure 10 The imaging path or optical path of the camera assembly 304. In an embodiment, in order to protect the third camera 343 (e.g., Figure 10 The camera assembly 304), electronic device 200, and / or rear surface panel 290 may also include a cover plate 299. In embodiments, the cover plate 299 can be understood as part of the rear surface panel 290.
[0166] According to an embodiment, the cover plate 299 may be disposed on a third camera (e.g., Figure 10 At least partially around the camera component 304, and may be in relation to the camera (e.g., Figure 10 One or more optical apertures are provided at positions corresponding to the first camera 341, the second camera 342, and / or the third camera 343. In the illustrated embodiment, a structure in which the window plate 299a is disposed in one or more optical apertures of the cover plate 299 can be illustrated. In the embodiment, at least a portion of the edge of the cover plate 299 may be attached to or fixed to the inner surface of the rear surface plate 290, and at least a portion of the outer surface of the cover plate 299 may be exposed to the outside of the rear surface plate 290. In the embodiment, to harmonize with the appearance of the electronic device 200 and / or the rear surface plate 290, or to enhance the aesthetic appearance of the electronic device 200, the cover plate 299 may be made of a metallic material or may be finished with a metallic material (e.g., by printing, coating, deposition, or electroplating).
[0167] According to an embodiment, on the circuit board 364 or inside the rear surface panel 290, the second dummy member 385 may be configured to face or contact at least a portion of the inner surface of the cover plate 299. For example, the second dummy member 385 may maintain a gap I between the second flexible printed circuit board 383 and the cover plate 299 (e.g., Figure 28 The thickness T). In an embodiment, the first flexible printed circuit board 373 may be configured to overlap with the second flexible printed circuit board 383 in the region where the second dummy member 385 is disposed. For example, by providing the second dummy member 385 and the second flexible printed circuit board 383, the first flexible printed circuit board 373 may be disposed in a designed shape on the circuit board 364 (e.g., thickness T). Figures 12 to 14 On the extension portion 364b), and may be located at a predetermined distance from the rear surface plate 290 and / or the cover plate 299.
[0168] According to an embodiment, the camera assembly 304 (e.g., the third camera 343) may also include a flange portion 345a connected to the support protrusion 345 on a peripheral surface provided with the support protrusion 345. In an embodiment, the support protrusion 345 can be understood as a portion of the flange portion 345a, and the flange portion 345a may have a structure including a portion that protrudes further than the rest of the flange portion 345a at a location corresponding to the curved portion of the first flexible printed circuit board 373. The portion of the first flexible printed circuit board 373 extending from the curved portion to the end connected to the circuit board 364 (e.g., the second alignment portion 373b) may be supported by the flange portion 345a, thereby being located at a predetermined distance from the rear surface panel 290 and / or the cover plate 299 while maintaining the designed shape.
[0169] According to an embodiment, when the first flexible printed circuit board 373 is used as a transmission line for analog signals (e.g., wireless communication signals), induced currents may be generated in the surrounding conductive structures. When induced currents are generated, the efficiency of signal transmission may be reduced or the quality of wireless communication may be degraded due to distortion of the transmitted signal. The generation of such induced currents or electromagnetic interference can be suppressed by providing various types of electromagnetic shielding structures. In an embodiment, by providing a second dummy member 385 and a second flexible printed circuit board 383, the first flexible printed circuit board 373 can be located at a predetermined distance from the rear surface plate 290 and / or the cover plate 299, thereby suppressing the generation of induced currents.
[0170] In embodiments, when the first flexible printed circuit board 373 in thin film form is disposed differently from its designed shape, variations in wireless communication performance may occur between different electronic devices manufactured to the same specifications. In embodiments of this disclosure, by using support protrusions 345, flange portions 345a, and / or dummy members 375 and 385 to align the first flexible printed circuit board 373 with its designed shape, degradation or variations in wireless communication performance can be suppressed even when structures comprising metallic or conductive materials (e.g., cover plate 299) are disposed adjacent to it.
[0171] Figure 24 This is a view showing the state in which one or more flexible printed circuit boards are disposed in an electronic device according to embodiments of the present disclosure. Figure 25 It shows along Figure 24 A cross-sectional view of a portion of an electronic device according to an embodiment of the present disclosure, taken by line D-D'.
[0172] Reference Figure 24 and Figure 25 , Figure 4 The rear member 270 can stably maintain the arrangement or connection state of various components within the housing 320. For example, in the rear member 270, the support portion and / or one or more other portions indicated by reference numeral 279 can support a portion of the circuit board 364 or support the ends of the first flexible printed circuit board 373 and / or the second flexible printed circuit board 383, thereby stably maintaining the first flexible printed circuit board 373 and / or the second flexible printed circuit board 383 connected to the circuit board 364. In embodiments, although no reference numerals are assigned, the support portion 379 can be configured to directly contact the circuit board 364 or the support plate 364d through a protrusion formed on the surface facing the circuit board 364. Therefore, the circuit board 364 can be stably fixed by the support region 322 and the rear member 270, and deformation or damage to the extension portion 364b can be suppressed.
[0173] According to an embodiment, the button component 397 can be set in... Figure 18 , Figure 22 and / or Figure 23 The button member 397 protrudes from the outer surface of the sidewall 321 (e.g., the first portion 321a) at a predetermined height within region S2. The height at which the button member 397 protrudes from the outer surface of the sidewall 321 can be determined, for example, by the distance of movement of the button member 397 required to actuate one or more switches 381a and 381b of the keyboard assembly 308.
[0174] Figure 26 This is a first view showing the state in which a cover plate is disposed in an electronic device according to an embodiment of the present disclosure. Figure 27This is a second view showing the state in which the cover plate is disposed in an electronic device according to an embodiment of the present disclosure.
[0175] Reference Figure 26 and Figure 27 As mentioned above, when the wiring that transmits analog signals (e.g., Figure 15 and / or Figures 22 to 25 When the first flexible printed circuit board 373 is disposed adjacent to a conductive structure such as the cover plate 299, induced current or electromagnetic interference may occur, thereby reducing wireless communication performance. In embodiments of this disclosure, to suppress electromagnetic interference that may occur between the first flexible printed circuit board 373 and the conductive structure, a second flexible printed circuit board 383 may be disposed between the second alignment portion 373b (e.g., the first flexible printed circuit board 373) and the cover plate 299, and a second dummy member 385 may be disposed between the second flexible printed circuit board 383 and the cover plate 299 and / or between the second alignment portion 373b (e.g., the first flexible printed circuit board 373) and the cover plate 299. For example, by providing a predetermined gap between the first flexible printed circuit board 373 and the cover plate 299, electromagnetic interference that may occur between the second alignment portion 373b (e.g., the first flexible printed circuit board 373) and the cover plate 299 can be suppressed.
[0176] According to an embodiment, by reducing the area of the second alignment portion 373b (e.g., the first flexible printed circuit board 373) and the cover plate 299 facing each other (or the area of overlap between the second alignment portion 373b and the cover plate 299), the generation of electromagnetic interference or induced current between the second alignment portion 373b (e.g., the first flexible printed circuit board 373) and the cover plate 299 can be suppressed. In an embodiment, the cover plate 299 may provide a recessed portion 299b extending inward from one of its edges. The recessed portion 299b may be implemented, for example, by removing a portion of the cover plate 299, and may be disposed at a location overlapping with the second dummy member 385, the first flexible printed circuit board 373 (e.g., the second alignment portion 373b), and / or the second flexible printed circuit board 383. In an embodiment, the second dummy member 385 may be understood to be at least partially disposed between the recessed portion 299b and the first flexible printed circuit board 373 (e.g., the second alignment portion 373b), or between the recessed portion 299b and the second flexible printed circuit board 383. For example, the second dummy member 385 can be understood as being configured to face the cover plate 299 across the area where the notch portion 299b is provided.
[0177] According to an embodiment, the notch portion 299b can be understood as being achieved by providing a protrusion 299c on one edge of the cover plate 299. For example, the protrusion 299c may extend outward from one side of the cover plate 299 to surround at least a portion of the notch portion 299b. In an embodiment, the protrusion 299c may be located in an area that substantially does not overlap with the second dummy member 385, the first flexible printed circuit board 373 (e.g., the second alignment portion 373b), and / or the second flexible printed circuit board 383.
[0178] According to an embodiment, the second dummy member 385 can be manufactured to a predetermined size and can be disposed at a predetermined position on the second flexible printed circuit board 383. In an embodiment, one end of the second flexible printed circuit board 383 can be understood as being connected to the switch substrate 381, and its other end can be directly connected to the circuit board 364. In this case, due to the height difference between the switch substrate 381 and the circuit board 364, a portion of the second flexible printed circuit board 383 can be disposed on the circuit board 364 in an inclined or curved shape. As a portion of the second flexible printed circuit board 383 gets closer to the switch substrate 381 or closer to the connection portion with the circuit board 364, the inclination angle or curvature of the portion of the second flexible printed circuit board 383 can increase. In an embodiment, the second dummy member 385 can be disposed in a portion of the second flexible printed circuit board 383 with a relatively small inclination angle or curvature. In an embodiment, the second dummy member 385 can be understood as being disposed closer to the switch substrate 381 than the end of the second flexible printed circuit board 383.
[0179] According to an embodiment, in the portion adjacent to the switch substrate 381, the second flexible printed circuit board 383 can be bent at a predetermined angle (e.g., approximately 90 degrees) and can be connected to the circuit board 364 at its end, while forming a gentle slope between the circuit board 364 and the cover plate 299. In an embodiment, the area of the second flexible printed circuit board 383 where the second dummy member 385 is provided can be arranged substantially parallel to the circuit board 364 or the cover plate, while the area of the second flexible printed circuit board 383 between the second dummy member 385 and the portion connected to the circuit board 364 can be arranged to be inclined relative to the circuit board 364 or have a curved shape.
[0180] Figure 28 This is a view showing the state in which a dummy component is disposed inside the cover plate 299 in an electronic device according to an embodiment of the present disclosure.
[0181] Reference Figure 28 As mentioned above, when the antenna module (e.g., Figure 15 Antenna module 308) and / or keyboard assembly (e.g., Figure 19 or Figure 20When the keyboard assembly 308 is disposed on the housing 320, the first flexible printed circuit board 373 (e.g., the second alignment portion 373b) and / or the second flexible printed circuit board 383 may be configured to at least partially face the cover plate 299. Even in electronic devices of the same specifications, the first flexible printed circuit board 373 or the second flexible printed circuit board 383, manufactured in the form of a film, may have slight differences in position or shape on the housing 320 depending on the product due to manufacturing or assembly tolerances. In the embodiments, although an electromagnetic shielding structure can be adequately provided, variations in wireless communication performance may occur when the distance between the first flexible printed circuit board 373 transmitting analog signals (e.g., wireless communication signals) and the cover plate 299, which includes conductive material, varies depending on the product.
[0182] In the electronic device 200 according to an embodiment of the present disclosure, the assembly position or shape of the first flexible printed circuit board 373 and / or the second flexible printed circuit board 383 can be standardized by including a second dummy member 385. For example, by disposing the second flexible printed circuit board 383 and / or the second dummy member 385 between the first flexible printed circuit board 373 and the cover plate 299, the gap G between the first flexible printed circuit board 373 and the cover plate 299 can be maintained at a predetermined size. Here, the expression "gap G equal to or greater than a predetermined size" can refer to a gap size sufficient to minimize the generation of induced current in the cover plate 299 when power or an electrical signal is transmitted through the first flexible printed circuit board 373 (or the second flexible printed circuit board 383). In the embodiment, the expression "gap G equal to or greater than a predetermined size" can refer to a gap that minimizes electromagnetic coupling generated between the first flexible printed circuit board 373 and the cover plate 299 or between the second flexible printed circuit board 383 and the cover plate 299 when power or an electrical signal is transmitted through the first flexible printed circuit board 373 (or the second flexible printed circuit board 383). For example, by at least partially disposing the second flexible printed circuit board 383 and / or the second dummy component 385 between the first flexible printed circuit board 373 and the cover plate 299, electromagnetic coupling between the first flexible printed circuit board 373 and the cover plate 299 or induced current in the cover plate 299 can be suppressed.
[0183] Before setting the second dummy member 385, when the sidewall 321 (e.g., Figure 14When the first portion 321a) is used as a radiating conductor, a null section with a radiative efficiency of about -16 dB or less at a frequency of about 2 GHz is generated. According to embodiments of this disclosure, when the second dummy member 385 is provided and the first region 321a is used as a radiating conductor, it has been determined that the radiative efficiency at a frequency of about 2 GHz is improved by about 3 dB, and the null phenomenon is improved. In a structure where the second dummy member 385 is provided and the second region 321b is used as a radiating conductor, it has been determined that the radiative efficiency in the frequency band of about 850 MHz and / or about 900 MHz is improved by about 0.5 dB to 1 dB.
[0184] According to an embodiment, when the keyboard assembly 308 is disposed on the housing 320 and connected to the circuit board 364 without interfering with external structures (e.g., the second dummy member 385 or the cover plate 299), the second flexible printed circuit board 373 can be configured to form a gently sloping or curved trajectory from the switch substrate 381 to the connection portion with the circuit board 364. As mentioned above, depending on manufacturing or assembly tolerances, this sloping or curved shape of the second flexible printed circuit board 373 may result in a distance from the cover plate 299 (e.g., Figure 28 The variation of the gap G shown is illustrated. By being disposed on the second flexible printed circuit board 373 to face (or contact) the cover plate 299, the second dummy member 385 can suppress the variation of the gap G between products. For example, different products with the same specifications can have substantially equivalent quality (or equivalent wireless communication performance).
[0185] According to an embodiment, the portion of the second flexible printed circuit board 383 adjacent to the switch substrate 381 can be configured to form a predetermined angle (e.g., approximately 90 degrees) relative to the switch substrate 381, and the second flexible printed circuit board 383 can be configured into a substantially flat shape by providing (or attaching) a second dummy member 385. The second dummy member 385 can be disposed on the second flexible printed circuit board 373 to face or contact the cover plate 299. For example, the second flexible printed circuit board 373 (or the first flexible printed circuit board 383) can be disposed between the circuit board 364 and the cover plate 299, and can be positioned at a predetermined distance (e.g., gap G) from the cover plate 299. In an embodiment, on the inner side of the cover plate 299, at least the area of the second flexible printed circuit board 373 in which the second dummy member 385 is disposed can maintain a substantially flat shape.
[0186] According to an embodiment, the second dummy member 385 may be a foam strip made of a polymer material such as acrylic acid, and may be manufactured taking into account the shape of the second flexible printed circuit board 383. In an embodiment, by having a predetermined thickness T, the second dummy member 385 can accommodate the gap between the second flexible printed circuit board 383 and the cover plate 299 (e.g., Figure 23 The gap I) is maintained at about 0.1 mm or greater and about 0.5 mm or less. However, since the second dummy member 385 can be made of an elastic material such as foam tape, it should be noted that the values related to the thickness T or gap described above do not limit the embodiments of this disclosure when the second dummy member 385 is disposed on the housing 320. According to an embodiment, the second dummy member 385 can be located at a distance of about 0.06 mm from the cover plate 299, and therefore can be substantially not in contact with the cover plate 299.
[0187] According to an embodiment, the second dummy member 385 can be manufactured to correspond to the shape of the second flexible printed circuit board 383. For example, when viewed in a plan view, when the second dummy member 385 is disposed in a curved portion of the second flexible printed circuit board 383, the second dummy member 385 can have a shape corresponding to the curved portion of the second flexible printed circuit board 383. In an embodiment, in a structure where the second dummy member 385 is attached to the second flexible printed circuit board 383, for example, in a structure provided with adhesive material, the second dummy member 385 can be manufactured to have a size smaller than the width or length of the second flexible printed circuit board 383. For example, the second dummy member 385 can be manufactured to have a size or shape such that the second dummy member 385 is disposed approximately 0.2 mm inward from the edge of the second flexible printed circuit board 383. This can suppress contamination of the internal space of the electronic device 200 by means of adhesive material used for attaching the second dummy member 385.
[0188] As described above, due to the antenna module (e.g., Figures 15 to 17 The antenna module 307 is positioned in a confined space while suppressing changes in the shape of the transmission wiring, thus allowing electronic devices (e.g., Figures 1 to 4 Electronic devices 101 and 200 can be provided with a stable wireless communication environment. For example, in electronic devices of the same specifications, by standardizing the arrangement and shape of the transmission lines leading to the antenna module, variations in wireless communication performance between different products can be suppressed, and consumer reliability can be ensured.
[0189] The effects that can be obtained from this disclosure are not limited to those described above, and other effects not explicitly mentioned can be clearly understood by those skilled in the art from the description of the above embodiments.
[0190] According to embodiments of this disclosure, electronic devices (e.g., Figures 1 to 4 The electronic device 101 or 200 may include a housing (e.g., Figures 2 to 4 The second housing 220 or Figure 14 The housing 320 includes a front surface (e.g., Figure 2 The second front surface 220a), and the rear surface opposite the front surface (e.g., Figure 2 The second rear surface 220b), and the sidewalls (e.g., at least partially surrounding the space between the front and rear surfaces) Figure 4 The second sidewall 221 or Figure 14 The sidewall 321); camera assembly (e.g., Figure 4 , Figure 7 , Figure 10 and / or Figure 14 The camera assembly (204 or 304) is disposed near the sidewall at one edge of the space; the cover plate (e.g., Figure 4 , Figure 22 , Figure 23 , Figure 26 and / or Figure 27 The cover plate 299), which is disposed on at least a portion of the outer periphery of the camera assembly and is at least partially exposed to the outside through the rear surface; the keyboard assembly (e.g., Figures 19 to 24 The keyboard assembly 308), which is disposed in the first part of the side wall adjacent to the camera assembly (e.g., Figure 14 The first part 321a) and the camera assembly, and the antenna module (e.g., Figures 15 to 17 Antenna module 307), which has a second part disposed on a sidewall adjacent to the first part (e.g., Figure 14 The portion between the second part 321b) and the camera assembly, the antenna module includes a first flexible printed circuit board (e.g., ) at least partially disposed between the first part and the camera assembly. Figures 15 to 17 The first flexible printed circuit board 373). In an embodiment, the keyboard assembly may include a switch substrate (e.g., at least partially disposed between the first portion and the camera assembly). Figure 19 The switch substrate 381), extending from the switch substrate and configured to intersect the first flexible printed circuit board on one side of the camera assembly, and the second flexible printed circuit board (e.g., Figure 19 The second flexible printed circuit board 383), and a dummy component disposed on the second flexible printed circuit board and at least partially facing the cover plate (e.g., Figure 19 , Figure 20 or Figure 26 The second virtual component 385).
[0191] According to an embodiment, the cover plate may include a protrusion extending from the edge of the cover plate to the outside of the cover plate (e.g., Figure 26The protrusion 299c) provides a recessed portion at least partially surrounded by the protrusion (e.g., Figure 26 (The recessed portion 299b). In an embodiment, the portion of the dummy member may be disposed between the recessed portion and the first flexible printed circuit board, or between the recessed portion and the second flexible printed circuit board.
[0192] According to an embodiment, a portion of the second flexible printed circuit board may be disposed between the first flexible printed circuit board and the cover plate.
[0193] According to embodiments, the above-described electronic device may further include a processor (e.g., Figure 1 The processor 120) or communication module (e.g., Figure 1 The communication module 190 is configured to perform wireless communication using at least one of the first part, the second part, or the antenna module.
[0194] According to an embodiment, the sidewall may include an insulating structure disposed between the first portion and the second portion (e.g., Figure 14 , Figure 16 and / or Figure 17 (Insulation structure 321c).
[0195] According to embodiments, the above-described electronic device may further include a circuit board (e.g., Figure 4 The second circuit board 264 and / or Figures 12 to 14 Circuit board 364), which is disposed in the space between the front and rear surfaces and provides an opening area configured to accommodate a portion of the camera assembly (e.g., Figure 12 and / or Figure 13 (Opening region 364a). In an embodiment, the end of the second flexible printed circuit board may be connected to the circuit board.
[0196] According to an embodiment, the dummy component can be disposed at a first distance from the switch substrate and positioned at a second distance from the end of the second flexible printed circuit board. In an embodiment, the first distance can be less than the second distance.
[0197] According to embodiments, the above-described electronic device may further include an extension portion (e.g., Figures 12 to 14 The extension portion 364b is a portion of the circuit board and defines an opening area, and is at least partially disposed between the first portion and the camera assembly. In an embodiment, a dummy member may be disposed between the extension portion and the cover plate.
[0198] According to one embodiment, the electronic device may further include a contact (e.g., extending from the sidewall at the first portion and configured to at least partially face the extended portion) Figure 8 , Figure 9 and / or Figure 14 (Contact 329). In an embodiment, the first portion can be electrically connected to the circuit board via the contact.
[0199] According to an embodiment, the first flexible printed circuit board can be configured to sequentially span the area where the contact is provided and the area where the second flexible printed circuit board is provided, and the end of the first flexible printed circuit board can be connected to the circuit board.
[0200] According to an embodiment, the extension portion may be at least partially disposed between the contact and the first flexible printed circuit board.
[0201] According to an embodiment, the above-described electronic device may further include contact terminals disposed on one surface of the extension and electrically connected to the contact element (e.g., Figure 12 or Figure 22 (Contact terminal 364c). In an embodiment, the first portion can be configured to receive a feed signal via the contact terminal and the contact element.
[0202] According to embodiments of this disclosure, electronic devices (e.g., Figures 1 to 4 The electronic device 101 or 200 may include a housing (e.g., Figures 2 to 4 The second housing 220 or Figure 14 The housing 320 includes a front surface (e.g., Figure 2 The second front surface 220a), and the rear surface opposite the front surface (e.g., Figure 2 The second rear surface 220b), and the sidewalls (e.g., at least partially surrounding the space between the front and rear surfaces) Figure 4 The second sidewall 221 or Figure 14 The sidewall 321); camera assembly (e.g., Figure 4 , Figure 7 , Figure 10 and / or Figure 14 The camera assembly (204 or 304) is disposed near the sidewall at one edge of the space; the cover plate (e.g., Figure 4 , Figure 22 , Figure 23 , Figure 26 and / or Figure 27 The cover plate 299 is disposed on at least a portion of the outer periphery of the camera assembly and is at least partially exposed to the outside via a rear surface. The cover plate is provided with at least partial protrusions (e.g., Figure 26 The notch portion surrounded by the protrusion 299c (e.g., Figure 26 The notch portion 299b), the protrusion extends outward from the edge of the cover plate; the keyboard assembly (e.g., Figures 19 to 24 The keyboard assembly 308), which is located on the first part of the side wall adjacent to the camera assembly (e.g., Figure 14Between the first part 321a) and the camera assembly; and the antenna module (e.g., Figures 15 to 17 Antenna module 307), which has a second part disposed on the side wall adjacent to the first part (e.g., Figure 14 The portion between the second part 321b) and the camera assembly, the antenna module includes a first flexible printed circuit board (e.g., ) at least partially disposed between the first part and the camera assembly. Figures 15 to 17 The first flexible printed circuit board 373). In an embodiment, the keyboard assembly may include a switch substrate (e.g., at least partially disposed between the first portion and the camera assembly). Figure 19 The switch substrate 381), extending from the switch substrate and configured to intersect the first flexible printed circuit board on one side of the camera assembly, and the second flexible printed circuit board (e.g., Figure 19 The second flexible printed circuit board 383), and a dummy member disposed on the second flexible printed circuit board and configured to face the cover plate across the area provided with the notch (e.g., Figure 19 , Figure 20 or Figure 26 The second virtual component 385).
[0203] According to an embodiment, a portion of the first flexible printed circuit board can be aligned to face at least one of the recessed portion or the cover plate, wherein the dummy member is located between the portion of the first flexible printed circuit board and at least one of the recessed portion or the cover plate.
[0204] According to embodiments, the above-described electronic device may further include a circuit board (e.g., Figure 4 The second circuit board 264 and / or Figures 12 to 14 Circuit board 364), which is disposed in the space between the front and rear surfaces and provides an opening area configured to accommodate a portion of the camera assembly (e.g., Figure 12 and / or Figure 13 (Opening area 364a). In an embodiment, the dummy component may be disposed at a first distance from the switch substrate, and the end of the second flexible printed circuit board may be electrically connected to the circuit board at a second distance from the dummy component. In an embodiment, the first distance may be less than the second distance.
[0205] According to an embodiment, in the above-described electronic device, the circuit board may further include an extension disposed between the camera assembly and the first portion (e.g., Figures 12 to 14 (Extension portion 364b). In an embodiment, at least a portion of the dummy member, at least a portion of the first flexible printed circuit board, or at least a portion of the second flexible printed circuit board may be disposed between the extension portion and the cover plate.
[0206] According to an embodiment, in the area between the cover plate and the circuit board, the end of the second flexible printed circuit board can be electrically connected to the circuit board.
[0207] According to an embodiment, the dummy component can be configured to maintain a gap of not less than 0.1 mm and not more than 0.5 mm between the second flexible printed circuit board and the cover plate.
[0208] Although this disclosure has been described by way of example with reference to embodiments, it should be understood that these embodiments are intended to be exemplary and not to limit the disclosure. Those skilled in the art will appreciate that various changes in form and detail may be made without departing from the overall scope of this disclosure, including the appended claims and their equivalents.
Claims
1. An electronic device (101; 200), comprising: The housing (220; 320) includes a front surface (220a), a rear surface (220b) opposite to the front surface, and a sidewall (221; 321) that at least partially surrounds the space between the front and rear surfaces. The camera assembly (204; 304) is positioned near the sidewall at one edge of the space; A cover plate (299) is disposed on at least a portion of the outer periphery of the camera assembly and is at least partially exposed to the outside through the rear surface; The keyboard assembly (308) is at least partially disposed between the first part (321a) of the side wall adjacent to the camera assembly and the camera assembly; and An antenna module (307) is partially disposed on a sidewall between a second portion (321b) adjacent to the first portion and a camera assembly, wherein the antenna module includes a first flexible printed circuit board (373) at least partially disposed between the first portion and the camera assembly. The keyboard components include: The switch board (381) is at least partially disposed between the first part and the camera assembly. A second flexible printed circuit board (383) extends from the switch substrate and is configured to intersect the first flexible printed circuit board on one side of the camera assembly. A dummy component (385) is disposed on a second flexible printed circuit board and faces at least partially the cover plate.
2. The electronic device according to claim 1, wherein, The cover plate includes a protrusion (299c) extending from the edge of the cover plate to the outside of the cover plate to provide a recessed portion (299b) partially surrounded by the protrusion, and The dummy component is disposed between the recessed portion and the first flexible printed circuit board, or between the recessed portion and the second flexible printed circuit board.
3. The electronic device according to any one of claims 1 to 2, wherein, A portion of the second flexible printed circuit board is disposed between the first flexible printed circuit board and the cover plate.
4. The electronic device according to any one of claims 1 to 3, further comprising: The processor (120) or communication module (190) is configured to perform wireless communication using at least one of the first part, the second part, or the antenna module.
5. The electronic device according to claim 4, wherein, The sidewall includes an insulating structure (321c) disposed between the first part and the second part.
6. The electronic device according to any one of claims 1 to 5, further comprising: Circuit board (264; 364), is disposed in the space between the front and rear surfaces and provides an opening area (364a) configured to accommodate a portion of the camera assembly. The end of the second flexible printed circuit board is connected to the circuit board.
7. The electronic device according to claim 6, wherein, The dummy component is disposed at a first distance (D1) from the switch substrate and at a second distance (D2) from the end of the second flexible printed circuit board. The first distance is less than the second distance.
8. The electronic device according to any one of claims 6 to 7, further comprising: The extension portion (364b) is a portion of the circuit board, the extension portion (364b) defines a portion of the opening area and is at least partially disposed between the first portion and the camera assembly, and The dummy component is placed between the extension and the cover plate.
9. The electronic device according to claim 8, further comprising: The contact element (329) extends from the sidewall of the first portion and is configured to at least partially face the extended portion. The first part is electrically connected to the circuit board via contacts.
10. The electronic device according to claim 9, wherein, The first flexible printed circuit board is configured to sequentially span the area where the contact is disposed and the area where the second flexible printed circuit board is disposed, and The end of the first flexible printed circuit board is connected to the circuit board.
11. The electronic device according to any one of claims 9 to 10, wherein, The extension is at least partially disposed between the contact and the first flexible printed circuit board.
12. The electronic device according to any one of claims 9 to 11, further comprising: A contact terminal (364d) is disposed on one surface of the extension and is electrically connected to the contact element. The first part is configured to receive the feed signal via contact terminals and contacts.
13. The electronic device according to any one of claims 1 to 12, further comprising: Second shell; The hinge structure (202) is configured to rotatably connect the second housing to the housing and provide at least one folding axis (A) that serves as the rotation center of the housing or the second housing; and Flexible printed circuit board (266), with a hinge structure extending from the inside of the housing to the inside of the second housing.
14. The electronic device of claim 13, further comprising: The flexible display (230) includes a first display area (231) disposed in one of the housing and the second housing, a second display area (232) disposed in the other of the housing and the second housing, and a folding area (233) disposed on the hinge structure. The flexible display is configured to output a screen through at least a portion of the front surface of the housing.
15. The electronic device according to claim 1, wherein, The dummy component is configured to maintain a gap of not less than 0.1 mm and not more than 0.5 mm between the second flexible printed circuit board and the cover plate.