Stamping method, device, apparatus, storage medium and program product

Abstract

This disclosure provides a stamping method, apparatus, equipment, storage medium, and program product, relating to the field of stamping forming technology. The method includes: collecting on-site production data of the stamping die during the stamping process; matching clearance compensation strategies for different compensation areas of the working surface of the die's blank holder based on the on-site production data; determining the clearance compensation strategies based on forming simulation prediction, in which the working surface of the die's blank holder is divided into multiple compensation areas with different forming functions; determining differentiated die clearance compensation amounts for each compensation area corresponding to the on-site production data based on the clearance compensation strategies; and controlling the die closing clearance of the stamping die according to the die clearance compensation amounts to complete the stamping process. This method can collect on-site production data and match clearance compensation strategies based on pre-divided compensation areas from forming simulation, achieving differentiated and dynamic die clearance compensation, reducing forming defects, and improving the stability and reliability of the stamping process.

Description

Technical Field

[0001] This disclosure relates to the field of stamping forming technology, and in particular to a stamping method, apparatus, equipment, storage medium, and program product. Background Technology

[0002] With the development of computer technology and vehicle manufacturing technology, the forming quality requirements for complex stamped parts such as automotive body panels are increasing. As the core equipment in the forming process, the design accuracy of stamping dies directly affects the product qualification rate and production efficiency.

[0003] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0004] The purpose of this disclosure is to provide a stamping method, apparatus, equipment, storage medium, and process product.

[0005] According to a first aspect of the present disclosure, a stamping method is provided, comprising: during the stamping process, collecting on-site production data of a stamping die; matching a clearance compensation strategy for different compensation regions of the working surface of the blank holder of the stamping die based on the on-site production data; the clearance compensation strategy being determined based on forming simulation prediction of the stamping die, wherein the forming simulation prediction divides the working surface of the blank holder of the stamping die into multiple compensation regions with different forming functions; determining a different die clearance compensation amount for each compensation region corresponding to the on-site production data based on the clearance compensation strategy; and controlling the die closing clearance of the stamping die to complete the stamping process based on the die clearance compensation amount.

[0006] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects: This disclosure allows for the collection of on-site production data and the matching of clearance compensation strategies based on pre-divided compensation regions derived from forming simulation, enabling differentiated and dynamic mold clearance compensation. It can precisely control the mold closing clearance for different forming functional areas, adapting to the forming requirements of different regions, thereby improving the quality of stamped parts, reducing forming defects, and enhancing the stability and reliability of the stamping process.

[0007] In some embodiments, the on-site production data includes thermal state information of each compensation area under stamping conditions; the clearance compensation strategy includes a thermal deformation mapping relationship between the thermal state information of different compensation areas and the corresponding thermal deformation compensation amount; wherein, determining the differentiated mold clearance compensation amount for each compensation area corresponding to the on-site production data according to the clearance compensation strategy includes: determining the thermal deformation compensation amount of each compensation area using the thermal state information of each compensation area according to the thermal deformation mapping relationship; and determining the mold clearance compensation amount corresponding to each compensation area based on the thermal deformation compensation amount of each compensation area.

[0008] In the above implementation, the thermal deformation compensation amount can be determined based on the thermal state information of each area in the on-site production data, and then the die clearance compensation amount can be obtained. This can effectively compensate for the deformation of the die caused by heat during stamping, ensure accurate die closing clearance, and improve the quality of stamped parts.

[0009] In some embodiments, the thermal state information includes temperature rise information of the compensation area; wherein, determining the thermal deformation compensation amount of each compensation area based on the thermal deformation mapping relationship using the thermal state information of each compensation area includes: determining the thermal expansion coefficient of the mold material and the length of the regional feature line of each compensation area; and determining the thermal deformation compensation amount of each compensation area based on the thermal deformation mapping relationship using the temperature rise information of each compensation area, the thermal expansion coefficient of the mold material, and the length of the regional feature line of each compensation area.

[0010] In the above implementation, the amount of thermal deformation compensation can be accurately determined based on the temperature rise information, thermal expansion coefficient and regional feature line length in the on-site production data, thereby accurately reflecting the thermal deformation of each region, providing a reliable basis for determining the mold clearance compensation amount and improving the compensation accuracy.

[0011] In some embodiments, the on-site production data also includes stress information of each compensation area under stamping conditions; the clearance compensation strategy also includes a pressure deformation mapping relationship between the stress information of different compensation areas and the corresponding pressure deformation compensation amount; the stamping method further includes: determining the pressure deformation compensation amount of each compensation area based on the stress information of each compensation area according to the pressure deformation mapping relationship; and correcting the die clearance compensation amount of each compensation area based on the pressure deformation compensation amount.

[0012] In the above implementation, the pressure deformation compensation amount can be determined based on the stress information of each area in the on-site production data, and the mold clearance compensation amount can be corrected accordingly, so as to make the mold closing clearance control more precise and further improve the quality of stamped parts.

[0013] In some implementations, the gap compensation strategy includes fixed compensation values ​​corresponding to different compensation areas; wherein, determining the differentiated mold gap compensation amount for each compensation area corresponding to the on-site production data according to the gap compensation strategy includes: in response to the on-site production data meeting preset conditions, determining the differentiated mold gap compensation amount for each compensation area according to the fixed compensation values ​​corresponding to different compensation areas.

[0014] In the above implementation, when the on-site production data meets the preset conditions, the fixed compensation value corresponding to each compensation area can be used as the die clearance compensation amount, thereby quickly determining the compensation amount and improving the design and debugging efficiency of stamping dies while meeting a certain level of accuracy.

[0015] In some embodiments, the forming simulation prediction divides the working surface of the blank holder of the stamping die into multiple compensation regions with different forming functions, including: obtaining simulated sheet material flow velocity, simulated contact pressure and simulated temperature distribution information through the forming simulation prediction; and making predictions based on the simulated sheet material flow velocity, the simulated contact pressure, the simulated temperature distribution information and the position of the draw bead of the stamping die to determine the boundaries of each compensation region with different forming functions.

[0016] In the above implementation, various information can be obtained through forming simulation prediction to determine the boundaries of each compensation area, ensuring that the compensation strategy matches the actual forming function of the stamping die, thus laying the foundation for accurate compensation.

[0017] In some embodiments, the multiple compensation regions with different forming functions include: a strongly colored region, a generally colored region, an uncolored region, and a back void region; wherein, the heat load of each compensation region is different, and the mold gap compensation amount of each compensation region is distributed in a gradient according to the heat load of each compensation region.

[0018] In the above embodiments, compensation amounts can be set in a gradient distribution according to different functional areas such as strong coloring area, general coloring area, uncolored area and back void area, so that the heat load and compensation amount are matched, and the mold gap is finely gradient controlled.

[0019] In some embodiments, the compensation area and the drawbead of the stamping die have one of the following positional relationships: the strongly colored area is located inside the drawbead; the generally colored area is located within a first preset distance outside the drawbead; the uncolored area is located between the first preset distance and a second preset distance outside the drawbead; the second preset distance is greater than the first preset distance; and the back void area is located outside the second preset distance of the drawbead.

[0020] In the above implementation, the positional relationship between each region and the drawbead can be clearly defined, providing a clear standard for the reasonable division of the working surface area of ​​the blank holder, which helps to accurately determine the boundaries of each region, thereby achieving differentiated die clearance compensation and improving the stamping process effect.

[0021] In some embodiments, controlling the die closing clearance of the stamping die to complete the stamping based on the die clearance compensation amount includes: determining the die closing clearance of each compensation area based on the sheet metal thickness and the die clearance compensation amount corresponding to each compensation area; generating stamping CNC instructions based on the die closing clearance of each compensation area; and controlling the die closing clearance of the stamping die to complete the stamping based on the stamping CNC instructions.

[0022] In the above implementation, differential compensation amounts can be superimposed based on the sheet thickness to generate CNC instructions to control the mold closing clearance, thereby achieving automated implementation from compensation decision-making to execution, and thus efficiently producing high-quality stamped parts.

[0023] According to a second aspect of the present disclosure, a stamping apparatus is provided, comprising: a data acquisition unit for acquiring on-site production data of a stamping die during the stamping process; a strategy matching unit for matching a clearance compensation strategy for different compensation regions of the working surface of the blank holder of the stamping die based on the on-site production data; the clearance compensation strategy being determined based on forming simulation prediction of the stamping die, wherein the forming simulation prediction divides the working surface of the blank holder of the stamping die into multiple compensation regions with different forming functions; a compensation amount determination unit for determining, based on the clearance compensation strategy, a differential die clearance compensation amount corresponding to each compensation region of the on-site production data; and a control unit for controlling the die closing clearance of the stamping die to complete the stamping process based on the die clearance compensation amount.

[0024] In some embodiments, the on-site production data includes thermal state information of each compensation area under stamping conditions; the clearance compensation strategy includes a thermal deformation mapping relationship between the thermal state information of different compensation areas and the corresponding thermal deformation compensation amount; wherein, the compensation amount determination unit determines the differentiated mold clearance compensation amount of each compensation area corresponding to the on-site production data according to the clearance compensation strategy, including: determining the thermal deformation compensation amount of each compensation area using the thermal state information of each compensation area according to the thermal deformation mapping relationship; and determining the mold clearance compensation amount corresponding to each compensation area according to the thermal deformation compensation amount of each compensation area.

[0025] In some embodiments, the thermal state information includes temperature rise information of the compensation area; wherein, the compensation amount determination unit determines the thermal deformation compensation amount of each compensation area based on the thermal deformation mapping relationship and using the thermal state information of each compensation area, including: determining the thermal expansion coefficient of the mold material and the length of the regional feature line of each compensation area; and determining the thermal deformation compensation amount of each compensation area based on the thermal deformation mapping relationship and using the temperature rise information of each compensation area, the thermal expansion coefficient of the mold material, and the length of the regional feature line of each compensation area.

[0026] In some embodiments, the on-site production data also includes stress information of each compensation area under stamping conditions; the clearance compensation strategy also includes a pressure deformation mapping relationship between the stress information of different compensation areas and the corresponding pressure deformation compensation amount; the compensation amount determination unit is further configured to: determine the pressure deformation compensation amount of each compensation area based on the pressure deformation mapping relationship and the stress information of each compensation area; and correct the mold clearance compensation amount of each compensation area based on the pressure deformation compensation amount.

[0027] In some implementations, the gap compensation strategy includes fixed compensation values ​​corresponding to different compensation areas; wherein, the compensation amount determination unit determines the mold gap compensation amount differentiated for each compensation area corresponding to the on-site production data according to the gap compensation strategy, including: in response to the on-site production data meeting preset conditions, determining the mold gap compensation amount differentiated for each compensation area according to the fixed compensation values ​​corresponding to different compensation areas.

[0028] In some embodiments, the device further includes a region prediction unit for dividing the working surface of the blank holder of the stamping die into multiple compensation regions with different forming functions in the forming simulation prediction, including: obtaining simulated sheet flow velocity, simulated contact pressure and simulated temperature distribution information through the forming simulation prediction; and predicting and determining the boundaries of each compensation region with different forming functions based on the simulated sheet flow velocity, the simulated contact pressure, the simulated temperature distribution information and the position of the draw bead of the stamping die.

[0029] In some embodiments, the multiple compensation regions with different forming functions include: a strongly colored region, a generally colored region, an uncolored region, and a back void region; wherein, the heat load of each compensation region is different, and the mold gap compensation amount of each compensation region is distributed in a gradient according to the heat load of each compensation region.

[0030] In some embodiments, the compensation area and the drawbead of the stamping die have one of the following positional relationships: the strongly colored area is located inside the drawbead; the generally colored area is located within a first preset distance outside the drawbead; the uncolored area is located between the first preset distance and a second preset distance outside the drawbead; the second preset distance is greater than the first preset distance; and the back void area is located outside the second preset distance of the drawbead.

[0031] In some embodiments, the control unit controls the die closing clearance of the stamping die to complete the stamping based on the die clearance compensation amount, including: determining the die closing clearance of each compensation area based on the sheet metal thickness and the die clearance compensation amount corresponding to each compensation area; generating stamping CNC instructions based on the die closing clearance of each compensation area; and controlling the die closing clearance of the stamping die to complete the stamping based on the stamping CNC instructions.

[0032] According to a third aspect of the present disclosure, an electronic device is provided, characterized in that it includes: a processor; a memory for storing processor-executable instructions; wherein the processor is configured to implement the above-described stamping method.

[0033] According to a fourth aspect of the present disclosure, a computer-readable storage medium is provided, which, when instructions in the storage medium are executed by a processor of a mobile terminal, enables the mobile terminal to perform the above-described stamping method.

[0034] According to a fifth aspect of the present disclosure, a computer program product is provided, including a computer program that, when executed by a processor, implements the above-described stamping method.

[0035] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0036] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0037] Figure 1 This is a flowchart illustrating a stamping method according to some embodiments of the present disclosure.

[0038] Figure 2 This is a flowchart illustrating the determination of die clearance compensation amount in a stamping method according to some embodiments of the present disclosure.

[0039] Figure 3 This is a flowchart illustrating the determination of die clearance compensation amount in another stamping method according to some embodiments of the present disclosure.

[0040] Figure 4 This is a flowchart illustrating a stamping method according to some embodiments of the present disclosure, showing the process of controlling the die closing clearance of a stamping die to complete the stamping.

[0041] Figure 5 This is a block diagram illustrating a stamping apparatus according to some embodiments of the present disclosure.

[0042] Figure 6 This is a block diagram illustrating an apparatus for stamping according to some embodiments of the present disclosure. Detailed Implementation

[0043] Exemplary embodiments of this disclosure will be described in detail herein, examples of which are illustrated in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings denote the same or similar elements unless otherwise indicated. Various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will become apparent upon understanding this disclosure. For example, the order of operations described herein is merely illustrative and is not limited to those orders set forth herein, but can be changed as will become apparent upon understanding this disclosure, except for operations that must be performed in a particular order. Furthermore, for clarity and brevity, descriptions of features known in the art may be omitted.

[0044] The flowchart shown in the attached diagram is merely an illustrative example and does not necessarily include all content and steps, nor does it necessarily have to be executed in the described order or in the order of the step numbers. For example, some steps can be broken down, while others can be combined or partially combined, and multiple steps can have their order interchanged or be executed simultaneously. Therefore, the actual execution order may change depending on the actual situation.

[0045] The embodiments described below, which are examples of some of the embodiments of this disclosure, do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0046] The specific implementation methods of the embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.

[0047] Figure 1 This is a flowchart illustrating a stamping method according to some embodiments of the present disclosure, such as... Figure 1As shown, the stamping method can be applied to electronic devices, including but not limited to smartphones, smart tablets, wearable devices, desktop computers, laptops, smart speakers, and other terminal devices. It can also include server-side components such as local servers and cloud servers, which can be deployed in a computer cluster or a combination of multiple computers. The stamping method may include the following steps.

[0048] In step S110, during the stamping process, on-site production data of the stamping die is collected.

[0049] In this embodiment of the disclosure, during the stamping process of the stamping die, relevant parameters of the actual stamping state of the stamping die can be acquired in real time through sensors, data acquisition systems, or monitoring equipment. This step can obtain raw information reflecting the current stamping conditions, providing a basis for subsequent regional compensation.

[0050] In step S120, based on the on-site production data, a clearance compensation strategy is matched for different compensation areas of the blank holder working surface of the stamping die. The clearance compensation strategy is determined based on the forming simulation prediction of the stamping die, in which the forming simulation prediction divides the blank holder working surface of the stamping die into multiple compensation areas with different forming functions.

[0051] In this embodiment, based on the collected on-site production data, a gap adjustment scheme corresponding to different zones on the working surface of the pressure ring can be determined from a pre-determined gap compensation strategy. Different compensation zones have different forming functions, allowing for the matching of appropriate gap compensation schemes for each.

[0052] In this embodiment, the flow and deformation behavior of the material during the stamping process, as well as the heating condition of the stamping die, can be predicted in advance using forming simulation technology. The working surface of the blank holder is divided into multiple compensation regions based on the forming functions of different areas of the stamping die. The forming function can refer to the role played by each region of the die during the stamping process, such as guiding material flow or suppressing wrinkling. In the forming simulation prediction, a gap compensation strategy can be derived through numerical simulation, which may include gap compensation schemes for different compensation regions.

[0053] In an exemplary embodiment, the sheet metal stamping process can be simulated using CAE (Computer-Aided Engineering) to achieve the division of regions.

[0054] In step S130, based on the gap compensation strategy, the mold gap compensation amount for each compensation area corresponding to the on-site production data is determined.

[0055] In this embodiment, the mold clearance adjustment value to be applied to each compensation area can be determined based on the matched clearance compensation strategy and real-time on-site production data. This adjustment value can differ between different areas, allowing for independent determination of the compensation amount for each area.

[0056] In an exemplary embodiment, the compensation amount can be a positive value to increase the gap or a negative value to decrease the gap, in order to adjust the local distance between the punch and the die during mold closing, thereby optimizing material flow and the stress state of the mold.

[0057] In step S140, the die closing clearance of the stamping die is controlled according to the die clearance compensation amount to complete the stamping.

[0058] In this embodiment of the disclosure, during the production process of the stamping die, the determined differential die clearance compensation amounts for each region can be converted into execution commands to precisely control the actual clearance between the punch and die during die closing, enabling the die to complete stamping production under the corrected clearance state. Under command control, it can be ensured that the clearance of different compensation regions is consistent with the compensation target, thereby achieving a differentiated edge pressing effect, improving forming quality, and avoiding defects.

[0059] For example, the mold closing clearance value of each compensation area can be calculated based on the mold clearance compensation amount, and mold processing control instructions can be generated accordingly; then, the mold processing control instructions are executed by driving the mold adjustment mechanism to change the mold closing clearance at the corresponding position, thereby realizing the adjustment of the mold closing clearance and completing the stamping production.

[0060] As can be seen from the above steps, the stamping method provided in this disclosure can collect on-site production data and match a clearance compensation strategy based on pre-divided compensation areas from forming simulation, thereby achieving differentiated and dynamic mold clearance compensation. It can precisely control the mold closing clearance for different forming functional areas, adapting to the forming needs of different areas, thereby improving the quality of stamped parts, reducing forming defects, and enhancing the stability and reliability of the stamping process.

[0061] In some embodiments of this disclosure, the field production data includes thermal state information of each compensation area under stamping conditions; the gap compensation strategy includes the thermal deformation mapping relationship between the thermal state information of different compensation areas and the corresponding thermal deformation compensation amount.

[0062] In this embodiment of the disclosure, the on-site production data may include thermal state information, which can be data related to the heat distribution and temperature change characteristics generated under stamping process conditions in each compensation area. The thermal state information can reflect temperature differences caused by friction and deformation heat between the die and the sheet metal.

[0063] In this embodiment, thermal state data, such as temperature distribution, of each region of the blank holder can be obtained from actual measurements during the stamping process. During stamping, friction between the sheet metal and the die, as well as plastic deformation of the sheet metal, generate heat. Some of this heat is conducted to the die through the contact surface, causing a localized temperature rise in the blank holder. This temperature rise causes thermal expansion of the die, thereby altering the local die-closing clearance and further affecting the sheet metal flow behavior. Therefore, obtaining this thermal state information can be used to calculate subsequent thermal deformation compensation, providing a basis for precise control of the die clearance.

[0064] In an exemplary embodiment, temperature changes during continuous stamping can be collected by integrating a temperature sensor into the blank holder to obtain thermal state information.

[0065] In this embodiment of the disclosure, the gap compensation strategy may include a pre-determined mapping relationship between thermal state information and thermal deformation compensation amount. This mapping relationship may be determined in the forming simulation prediction. This mapping relationship can be defined separately for different compensation regions, allowing different compensation amount calculation methods to be used for each region due to differences in thermal effects.

[0066] Figure 2 This is a flowchart illustrating the determination of die clearance compensation amount in a stamping method according to some embodiments of the present disclosure.

[0067] like Figure 2 As shown, in some embodiments of this disclosure, the process of determining the differential mold gap compensation amount for each compensation area corresponding to the on-site production data based on the gap compensation strategy may include the following steps.

[0068] Step S210: Based on the thermal deformation mapping relationship, determine the thermal deformation compensation amount of each compensation region using the thermal state information of each compensation region.

[0069] In this embodiment of the disclosure, the dimensional changes in each region due to thermal deformation can be calculated based on the temperature changes in the thermal state information. The thermal deformation compensation amount can be regarded as an adjustment amount set to offset the changes in the geometric dimensions of the mold caused by temperature changes.

[0070] The thermal state information of each compensation region can be used as input and substituted into the thermal deformation mapping relationship to calculate the amount of gap change that the compensation region should adjust due to thermal deformation.

[0071] Step S220: Determine the mold clearance compensation amount corresponding to each compensation area based on the thermal deformation compensation amount of each compensation area.

[0072] In this embodiment of the disclosure, the thermal deformation compensation amount can be used as the adjustment value of the die clearance to ensure that the actual clearance during stamping meets the design requirements.

[0073] In an exemplary embodiment, other factors (such as pressure information) may also be considered in conjunction with the thermal deformation compensation amount to ultimately determine the mold clearance compensation amount for each region.

[0074] Through the embodiments of this disclosure, the thermal deformation compensation amount can be determined based on the thermal state information of each area in the on-site production data, and then the die clearance compensation amount can be obtained. This can effectively compensate for the deformation of the die caused by heat during stamping, ensure accurate die closing clearance, and improve the quality of stamped parts.

[0075] In some embodiments of this disclosure, the thermal state information includes temperature rise information of the compensation area; wherein, determining the thermal deformation compensation amount of each compensation area based on the thermal deformation mapping relationship using the thermal state information of each compensation area includes: determining the thermal expansion coefficient of the mold material and the length of the regional feature line of each compensation area; and determining the thermal deformation compensation amount of each compensation area based on the thermal deformation mapping relationship using the temperature rise information of each compensation area, the thermal expansion coefficient of the mold material, and the length of the regional feature line of each compensation area.

[0076] In this embodiment of the disclosure, the temperature rise information can be the result of subtracting the initial ambient temperature from the real-time stamping temperature, or the temperature rise information can be obtained by subtracting the initial ambient temperature from the typical operating condition reference temperature (such as 80°C).

[0077] In this embodiment of the disclosure, the coefficient of thermal expansion of the material used in the mold can be determined based on its physical properties, and the length of the feature line of each region divided on the blank holder can be determined separately. The method for determining the length of the feature line can be: within the corresponding partition of the blank holder, along the material flow direction or the extension direction of the blank holder contour, the effective contour length of the mold surface in that region.

[0078] In an exemplary embodiment, the multiple regions may include: a strongly colored region, a generally colored region, an uncolored region, and a void region. The maximum effective length along the extension direction of the blank holder surface within each of the strongly colored region, generally colored region, uncolored region, and void region can be taken as the region feature line length. The region feature line length can be obtained directly by measuring from the 3D digital model of the mold, or it can be automatically extracted and output by CAE software within the corresponding region.

[0079] In this embodiment, the thermal deformation mapping relationship can be a linear thermal expansion formula. The obtained coefficient of thermal expansion and feature line length can be combined with the temperature rise of each region, and the dimensional change in each region due to temperature increase can be calculated using the linear thermal expansion formula; this is the thermal deformation compensation amount. This compensation amount can be used to subsequently adjust the mold clearance to counteract the effects of thermal deformation.

[0080] In an exemplary embodiment, the thermal deformation compensation amount Gthermal can be calculated as follows: Gthermal=α ΔT L K.

[0081] Where α is the coefficient of thermal expansion of the mold material, ΔT is the temperature rise, L is the length of the feature line of the region, and K is an empirical correction coefficient. The value of K can be configured within a preset range, such as within the range of [0.7, 20].

[0082] Thus, the value of the mold clearance compensation amount Gcomp can be: Gcomp = Gthermal.

[0083] In an exemplary embodiment, the value of the empirical correction coefficient K can be determined during the forming simulation prediction stage, and can be determined based on a combination of multiple factors. For example, it can be determined based on the characteristics of the mold material, the type of sheet metal, and the stamping process parameters; where the better the thermal conductivity of the mold material, the smaller the value of K can be; the thicker or stronger the sheet metal, the larger the value of K can be; the higher the blank holder force or stamping speed, the more significant the frictional heat generation, and the larger the value of K can be. After the initial value is determined, K can be fine-tuned using trial production measurement data to ensure compensation accuracy.

[0084] Through the embodiments of this disclosure, the amount of thermal deformation compensation can be accurately determined based on the temperature rise information, coefficient of thermal expansion and length of regional characteristic lines in the on-site production data, thereby accurately reflecting the thermal deformation of each region, providing a reliable basis for determining the amount of mold clearance compensation and improving the compensation accuracy.

[0085] In some embodiments of this disclosure, the on-site production data further includes stress information of each compensation area under stamping conditions; the clearance compensation strategy further includes a pressure deformation mapping relationship between the stress information of different compensation areas and the corresponding pressure deformation compensation amount; the stamping method further includes: determining the pressure deformation compensation amount of each compensation area according to the pressure deformation mapping relationship and the stress information of each compensation area; and correcting the die clearance compensation amount of each compensation area based on the pressure deformation compensation amount.

[0086] In this embodiment of the disclosure, the collected on-site production data may also include stress information of each compensation area during the stamping process. Stress information may include, for example, the mechanical load data corresponding to the compensation area. Obtaining stress information can quantify the elastic deformation behavior of the mold under mechanical load, providing a basis for subsequent pressure deformation compensation.

[0087] In an exemplary embodiment, sensors can be used to measure and collect mechanical state data of each compensation area of ​​the blank holder during the stamping process, such as average blank holder force, compressive stress, contact pressure distribution, and friction.

[0088] In this embodiment of the disclosure, the gap compensation strategy may include a predetermined mapping relationship between stress information and pressure deformation compensation amount. This mapping relationship can be defined separately for different compensation regions, allowing different mechanical deformation compensation calculation methods to be used for each region due to stress differences.

[0089] Based on the obtained stress information, combined with the stiffness characteristics or elasticity model of the mold structure and the mold structure characteristics, the elastic deformation amount generated by the stress in each compensation area, i.e., the pressure deformation compensation amount, can be calculated. This compensation amount can be obtained through finite element analysis or empirical formulas to quantify the influence of mechanical loads on the mold clearance. In an exemplary embodiment, the stress information of each compensation area can be used as input and substituted into the pressure deformation mapping relationship in the clearance compensation strategy to calculate the amount of clearance change that should be adjusted due to the elastic or plastic deformation of the mold caused by mechanical load in that area.

[0090] Once the pressure deformation compensation amount is determined, it can be used as a correction factor to adjust the previously determined die clearance compensation amount. Correction methods can include, for example, superposition or weighted summation, to ensure that the final die clearance compensation amount simultaneously considers the combined effects of thermal deformation and pressure deformation, thus ensuring that the actual clearance during stamping meets design requirements.

[0091] In an exemplary embodiment, the pressure deformation compensation amount Gforce can be calculated as follows: Gforce=β Fm L.

[0092] Where β is the pressure deformation coefficient, Fm is the average blank holder force in the region, and L is the length of the region's characteristic line. The pressure deformation coefficient β can be determined through CAE simulation calibration, or a typical range of values ​​for β can be established based on information accumulated from historical projects, such as mold type (e.g., drawing die for cover parts), material, and structural form.

[0093] In an exemplary embodiment, after correction of the pressure deformation compensation amount, the value of the mold clearance compensation amount Gcomp can be: Gcomp = Gthermal + Gforce.

[0094] Through the embodiments of this disclosure, the pressure deformation compensation amount can be determined based on the stress information of each area in the on-site production data, and the die clearance compensation amount can be corrected accordingly, so as to make the die closing clearance control more precise and further improve the quality of stamped parts.

[0095] Figure 3 This is a flowchart illustrating the determination of die clearance compensation amount in another stamping method according to some embodiments of the present disclosure.

[0096] like Figure 3As shown, the process of determining the mold clearance compensation amount may include the following steps.

[0097] Step S310: Determine the thermal state information of each area in the on-site production data under the stamping condition.

[0098] Step S320: Based on the thermal deformation mapping relationship in the gap compensation strategy, determine the thermal deformation compensation amount of each compensation region using the thermal state information of each compensation region.

[0099] Step S330: Determine the stress information of each area in the on-site production data under the stamping condition.

[0100] Step S340: Based on the pressure deformation mapping relationship in the gap compensation strategy, determine the pressure deformation compensation amount of each compensation area using the force information of each compensation area.

[0101] Step S350: Determine the mold clearance compensation amount corresponding to each compensation area based on the thermal deformation compensation amount and pressure deformation compensation amount of each compensation area.

[0102] Figure 3 Other aspects of the embodiments can be found in the other embodiments described above.

[0103] In some embodiments of this disclosure, the gap compensation strategy includes fixed compensation values ​​corresponding to different compensation areas; wherein, determining the differentiated mold gap compensation amount for each compensation area corresponding to the on-site production data according to the gap compensation strategy includes: in response to the on-site production data meeting preset conditions, determining the differentiated mold gap compensation amount for each compensation area according to the fixed compensation values ​​corresponding to different compensation areas.

[0104] In this embodiment of the disclosure, the gap compensation strategy may include a set of predetermined fixed compensation values ​​that do not change with real-time changes in on-site production data. Based on the forming function requirements of each area of ​​the mold (such as precision control of rib management surfaces, anti-wrinkling control, zero-contact avoidance, thermal expansion compensation, etc.) or historical experience data, an independent fixed mold gap compensation value or compensation range can be pre-set for each compensation area.

[0105] When the collected on-site production data meets the preset conditions, the fixed compensation values ​​preset for each compensation area can be directly used as the differential mold clearance compensation amount to adjust the mold closing clearance to complete the stamping.

[0106] Among them, preset conditions can be used as predefined logical judgment criteria to determine whether to adopt the fixed compensation value mode. Preset conditions can be set based on on-site production data. For example, preset conditions can include at least one of the following: missing on-site production data (such as missing thermal state information, missing stress information, etc.), abnormal on-site sensors, failure to meet steady-state requirements, and exceeding the number of stamping times threshold.

[0107] Through the embodiments of this disclosure, when the on-site production data meets the preset conditions, the fixed compensation value corresponding to each compensation area can be used as the die clearance compensation amount, thereby quickly determining the compensation amount and improving the design and debugging efficiency of stamping dies while meeting a certain level of accuracy.

[0108] In some embodiments of this disclosure, the forming simulation prediction divides the working surface of the blank holder of the stamping die into multiple compensation regions with different forming functions, including: obtaining simulated sheet material flow velocity, simulated contact pressure and simulated temperature distribution information through the forming simulation prediction; and determining the boundaries of each compensation region with different forming functions based on the simulated sheet material flow velocity, the simulated contact pressure, the simulated temperature distribution information and the position of the draw bead of the stamping die.

[0109] In this embodiment of the disclosure, the stamping process can be numerically simulated using CAE simulation to obtain parameters such as the simulated flow velocity of the sheet metal under the action of the blank holder, the simulated contact pressure with the die, and the simulated predicted temperature.

[0110] By comprehensively analyzing various physical parameters obtained through CAE simulation and mold structural features (i.e., drawbead positions), it is possible to predict and delineate the boundaries of regions with different forming functions on the blank holder working surface. For example, by combining the drawbead positions and identifying abrupt changes, extreme regions, or characteristic curves of various physical parameters on the mold, the boundaries of these regions can be determined.

[0111] In an exemplary embodiment, the simulated predicted temperature can be used to determine the differences in heat load in different regions. For example, the strongly colored area inside the drawbead has the characteristics of high contact pressure, fast sheet flow, and high heat load, and the simulated predicted temperature in this area is high. The heat load in areas far from the drawbead (such as the general colored area, the uncolored area, and the back void area) can be decreased sequentially, and the corresponding simulated predicted temperature gradually decreases. Based on this temperature distribution difference, combined with the location of the drawbead, multiple regions can be divided.

[0112] Through the embodiments of this disclosure, various information can be obtained through forming simulation prediction to determine the boundaries of each compensation area, ensuring that the compensation strategy matches the actual forming function of the stamping die, and laying the foundation for accurate compensation.

[0113] In some embodiments of this disclosure, the multiple compensation regions with different forming functions include: a strongly colored region, a generally colored region, an uncolored region, and a back void region; wherein, the heat load of each compensation region is different, and the mold gap compensation amount of each compensation region is distributed in a gradient according to the heat load of each compensation region.

[0114] In this embodiment of the disclosure, the working surface of the pressure ring can be divided into four types of compensation areas with different functions according to the contact state and heat transfer characteristics between the sheet metal and the die during the stamping process: a strong coloring area (high contact pressure) for achieving precise control of the rib management surface, a general coloring area (medium contact pressure) for requiring anti-wrinkling control, an uncolored area (zero contact pressure) for requiring zero contact or open space without allowing avoidance, and a back space area (no direct contact) for avoiding thermal expansion.

[0115] The compensation amount can be varied in a gradient according to the order of heat load in each compensation zone from large to small (e.g., the larger the heat load, the larger the compensation amount) to differentially offset the effect of thermal deformation on the mold closing clearance. The order of heat load in each compensation zone can be: heat load of strongly colored zone > heat load of generally colored zone > heat load of uncolored zone > heat load of back void zone.

[0116] For example, using the sheet thickness t as the clearance reference, the mold closing clearance can be adjusted based on the sheet thickness t using the mold clearance compensation amount.

[0117] In particular, the high-coloring zone requires strict control of the sheet metal flow accuracy. Its high heat load and large contact pressure lead to significant thermal expansion and elastic deformation. A larger die clearance compensation amount (Gcomp1, such as 0.03~0.20mm) can be set so that the actual die closing clearance in this area is t-Gcomp1, thereby achieving tight fit and precise flow control of the inner side of the draw bead during the stamping process.

[0118] The core function of the general coloring area is to control wrinkling. It needs to take into account both fit and material flow. A medium mold gap compensation amount (Gcomp2, such as 0~0.03mm) can be set so that the actual mold closing gap of this area is t-Gcomp2, which ensures a certain fit while avoiding excessive constraint on material flow.

[0119] The core function of the uncolored area is to achieve zero contact or open space without avoidance. It does not require precise fitting and only needs to meet the basic gap requirements. A small mold gap compensation amount (Gcomp3≈0) can be set so that the actual mold closing gap of this area is t-Gcomp3, that is, to keep the mold closing gap at t and prevent non-functional contact from interfering with the forming.

[0120] The back clearance area is mainly used for structural avoidance and thermal expansion buffering. It usually does not involve contact heat transfer, but space needs to be reserved to prevent thermal bulging interference. Its mold clearance compensation amount Gcomp4 can be set to zero or negative (i.e., locally enlarged clearance) and appropriate clearance space should be reserved.

[0121] By employing the differentiated compensation strategy configured according to the thermal load gradient, the target mold closing clearance of each functional area can be effectively maintained under all operating conditions, thereby improving forming accuracy and process robustness.

[0122] Through the embodiments of this disclosure, compensation amounts can be set in a gradient distribution according to different functional areas such as strongly colored areas, generally colored areas, uncolored areas, and back void areas, so that the heat load and compensation amounts are matched, and the mold gap can be precisely gradient controlled.

[0123] In some embodiments of this disclosure, the compensation area and the drawbead of the stamping die have one of the following positional relationships: the strongly colored area is located inside the drawbead; the generally colored area is located within a first preset distance outside the drawbead; the uncolored area is located between the first preset distance and a second preset distance outside the drawbead; the second preset distance is greater than the first preset distance; and the back void area is located outside the second preset distance of the drawbead.

[0124] In this embodiment, the strongly colored area can be the region on the working surface of the blank holder that has the closest contact with the sheet metal and the greatest pressure. It can be set in the inner region of the draw bead (i.e., the side closer to the die cavity). The inner side of the draw bead has high material flow resistance and concentrated blank holder force, which easily leads to high temperature and high contact pressure, which meets the characteristics of a strongly colored area.

[0125] The typical coloring zone can be an area with moderate contact pressure and temperature, located outside the draw bead. It can be positioned within a first preset distance from the draw bead. In this area, near the draw bead on the outside, material flow is affected by the draw bead but still maintains some contact, with a moderate heat load.

[0126] The uncolored area can be an area where the sheet metal has slight or no effective contact with the pressure ring. It is located outside the draw bead and can be set in an annular zone between a first preset distance and a second preset distance further away from the draw bead. This area is less affected by the draw bead and has a lower heat load.

[0127] The back clearance zone can be an area where the sheet metal and the blank holder are not in contact at all. It is located outside the draw bead and can be set in an area beyond the second preset distance. This area is far from the draw bead, has no direct contact pressure, and has the lowest heat load.

[0128] The embodiments disclosed herein clearly define the positional relationship between each region and the drawbead, providing a clear standard for the reasonable division of the working surface area of ​​the blank holder, which helps to accurately determine the boundaries of each region, thereby achieving differentiated die clearance compensation and improving the stamping process effect.

[0129] Figure 4 This is a flowchart illustrating a stamping method according to some embodiments of the present disclosure, showing the process of controlling the die closing clearance of a stamping die to complete the stamping.

[0130] like Figure 4 As shown, in some embodiments of this disclosure, the process of controlling the die closing clearance of the stamping die to complete the stamping process according to the die clearance compensation amount may include the following steps.

[0131] Step S410: Based on the sheet thickness, determine the mold closing clearance of each compensation area by combining the mold clearance compensation amount corresponding to each compensation area.

[0132] In this embodiment of the disclosure, the actual gap value required for each area can be calculated based on the initial sheet thickness (e.g., 1.0 mm) and the preset mold gap compensation amount for each area using the formula "mold closing gap = sheet thickness - mold gap compensation amount".

[0133] Step S420: Generate stamping CNC instructions based on the mold closing clearance of each compensation area.

[0134] In this embodiment of the disclosure, the target die-closing clearance value of each compensation zone can be converted into stamping CNC commands that can be recognized and executed by the CNC system of the stamping equipment. The stamping CNC commands may include position, pressure, or displacement parameters that can be used by each stamping actuator in order to precisely control the die-closing clearance of different compensation zones.

[0135] In an exemplary embodiment, the calculated mold closing clearance values ​​for each region can be mapped onto the mold surface to generate a three-dimensional digital model integrating differentiated clearance compensation information. Then, the mold surface digital model containing clearance compensation information can be imported into a relevant system, allowing the system to perform tool path planning, cutting parameter settings, etc., based on the geometric information of the digital model. Ultimately, this generates machining instructions that can be recognized and executed by a CNC machine tool. These instructions can precisely control the machine tool to process the stamping die, ensuring that the actual clearance of each region of the processed stamping die conforms to the stated mold closing clearance during mold closing. This reduces forming defects during the stamping process and improves the stability and reliability of the stamping process.

[0136] Step S430: Control the die closing clearance of the stamping die according to the stamping CNC command to complete the stamping.

[0137] In this embodiment of the present disclosure, the generated stamping CNC command can be sent to the controller of the stamping equipment. The controller drives the die clearance adjustment mechanism so that the die closing clearance of each compensation area reaches the target value required by the stamping CNC command. Then, the complete stamping process is executed under the clearance configuration to complete the stamping of the die.

[0138] Through the embodiments disclosed herein, differential compensation amounts can be superimposed based on sheet metal thickness to generate CNC instructions to control the die closing clearance, thereby achieving automated implementation from compensation decision-making to execution, and thus efficiently producing high-quality stamped parts.

[0139] In an exemplary embodiment, based on the material thickness t, a four-level gradient adjustment method for the blank holder gap can be shown in Table 1.

[0140] Table 1

[0141] Wherein, Gcomp1, Gcomp2, and Gcomp3 are the die clearance compensation amounts calculated based on the thermal deformation compensation amounts (or the thermal deformation compensation amounts and pressure deformation compensation amounts) of each region. The preset values ​​can be in the range of (0, 0.2).

[0142] In an exemplary embodiment, based on the material thickness t, another method for adjusting the gap of the pressure ring in four stages can be shown in Table 2.

[0143] Table 2

[0144] The preset value can be in the range of (0, 0.2). The data shown in Table 2 represents a type of "fixed compensation value corresponding to different compensation areas" that the gap compensation strategy can include.

[0145] In an exemplary embodiment, the stamping method may further include: during trial molding or production, adjusting the height of the pressure adjusting pad of the stamping die to finely adjust the die closing gap within a preset range to compensate for residual deviations between simulation and reality.

[0146] This enhances the flexibility and adaptability of the stamping process, ensuring stability in the stamping process and the quality of the stamped parts.

[0147] It should be noted that the above figures are merely illustrative representations of the processes included in methods according to some embodiments of this disclosure, and are not intended to be limiting. It is readily understood that the processes shown in the above figures do not indicate or limit the temporal order of these processes. Furthermore, it is readily understood that these processes may be executed synchronously or asynchronously, for example, in multiple modules.

[0148] The following are embodiments of the apparatus disclosed herein, which can be used to execute embodiments of the method disclosed herein. For details not disclosed in the apparatus embodiments of this disclosure, please refer to the embodiments of the method disclosed herein.

[0149] Figure 5 This is a block diagram illustrating a stamping apparatus according to some embodiments of the present disclosure. (Refer to...) Figure 5 The device includes: a data acquisition unit 501, a strategy matching unit 502, a compensation amount determination unit 503, a control unit 504, and a region prediction unit 505.

[0150] The data acquisition unit 501 is used to acquire on-site production data of the stamping die during the stamping process; the strategy matching unit 502 is used to match the clearance compensation strategy of different compensation areas of the working surface of the blank holder of the stamping die according to the on-site production data; the clearance compensation strategy is determined based on the forming simulation prediction of the stamping die, in which the forming simulation prediction divides the working surface of the blank holder of the stamping die into multiple compensation areas with different forming functions; the compensation amount determination unit 503 is used to determine the different die clearance compensation amount of each compensation area corresponding to the on-site production data according to the clearance compensation strategy; the control unit 504 is used to control the die closing clearance of the stamping die to complete the stamping according to the die clearance compensation amount.

[0151] In some embodiments of this disclosure, the on-site production data includes thermal state information of each compensation area under stamping conditions; the clearance compensation strategy includes a thermal deformation mapping relationship between the thermal state information of different compensation areas and the corresponding thermal deformation compensation amount; wherein, the compensation amount determination unit 503 determines the differentiated mold clearance compensation amount of each compensation area corresponding to the on-site production data according to the clearance compensation strategy, including: determining the thermal deformation compensation amount of each compensation area using the thermal state information of each compensation area according to the thermal deformation mapping relationship; and determining the mold clearance compensation amount corresponding to each compensation area according to the thermal deformation compensation amount of each compensation area.

[0152] In some embodiments of this disclosure, the thermal state information includes temperature rise information of the compensation area; wherein, the compensation amount determination unit 503 determines the thermal deformation compensation amount of each compensation area based on the thermal deformation mapping relationship and using the thermal state information of each compensation area, including: determining the thermal expansion coefficient of the mold material and the length of the regional feature line of each compensation area; and determining the thermal deformation compensation amount of each compensation area based on the thermal deformation mapping relationship and using the temperature rise information of each compensation area, the thermal expansion coefficient of the mold material, and the length of the regional feature line of each compensation area.

[0153] In some embodiments of this disclosure, the on-site production data further includes stress information of each compensation area under stamping conditions; the clearance compensation strategy further includes a pressure deformation mapping relationship between the stress information of different compensation areas and the corresponding pressure deformation compensation amount; the compensation amount determination unit 503 is further configured to: determine the pressure deformation compensation amount of each compensation area according to the pressure deformation mapping relationship and the stress information of each compensation area; and correct the mold clearance compensation amount of each compensation area based on the pressure deformation compensation amount.

[0154] In some embodiments of this disclosure, the gap compensation strategy includes fixed compensation values ​​corresponding to different compensation areas; wherein, the compensation amount determination unit 503 determines the mold gap compensation amount differentiated for each compensation area corresponding to the on-site production data according to the gap compensation strategy, including: in response to the on-site production data meeting preset conditions, determining the mold gap compensation amount differentiated for each compensation area according to the fixed compensation values ​​corresponding to different compensation areas.

[0155] In some embodiments of this disclosure, the device further includes a region prediction unit 505, used to divide the working surface of the blank holder of the stamping die into multiple compensation regions with different forming functions in the forming simulation prediction, including: obtaining simulated sheet flow velocity, simulated contact pressure and simulated temperature distribution information through the forming simulation prediction; and making predictions based on the simulated sheet flow velocity, the simulated contact pressure, the simulated temperature distribution information and the position of the draw bead of the stamping die to determine the boundaries of each compensation region with different forming functions.

[0156] In some embodiments of this disclosure, the multiple compensation regions with different forming functions include: a strongly colored region, a generally colored region, an uncolored region, and a back void region; wherein, the heat load of each compensation region is different, and the mold gap compensation amount of each compensation region is distributed in a gradient according to the heat load of each compensation region.

[0157] In some embodiments of this disclosure, the compensation area and the drawbead of the stamping die have one of the following positional relationships: the strongly colored area is located inside the drawbead; the generally colored area is located within a first preset distance outside the drawbead; the uncolored area is located between the first preset distance and a second preset distance outside the drawbead; the second preset distance is greater than the first preset distance; and the back void area is located outside the second preset distance of the drawbead.

[0158] In some embodiments of this disclosure, the control unit 504 controls the die closing clearance of the stamping die to complete the stamping based on the die clearance compensation amount, including: determining the die closing clearance of each compensation area based on the sheet metal thickness and the die clearance compensation amount corresponding to each compensation area; generating stamping CNC instructions based on the die closing clearance of each compensation area; and controlling the die closing clearance of the stamping die to complete the stamping based on the stamping CNC instructions.

[0159] Regarding the apparatus in the above embodiments, the specific manner in which each module performs its operation has been described in detail in the embodiments related to the method, and will not be elaborated upon here.

[0160] Figure 6 This is a block diagram illustrating an apparatus 600 for stamping according to some embodiments of the present disclosure. For example, apparatus 600 may be a mobile phone, computer, digital broadcasting terminal, messaging device, game console, tablet device, medical device, fitness equipment, personal digital assistant, etc.

[0161] Reference Figure 6 The device 600 may include one or more of the following components: a processing component 602, a memory 604, a power component 606, a multimedia component 608, an audio component 610, an input / output (I / O) interface 612, a sensor component 614, and a communication component 616.

[0162] Processing component 602 typically controls the overall operation of device 600, such as operations associated with display, telephone calls, data communication, camera operation, and recording. Processing component 602 may include one or more processors 620 to execute instructions to perform all or part of the steps of the methods described above. Furthermore, processing component 602 may include one or more modules to facilitate interaction between processing component 602 and other components. For example, processing component 602 may include a multimedia module to facilitate interaction between multimedia component 608 and processing component 602.

[0163] Memory 604 is configured to store various types of data to support the operation of device 600. Examples of this data include instructions for any application or method operating on device 600, contact data, phonebook data, messages, pictures, videos, etc. Memory 604 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0164] The power supply component 606 provides power to the various components of the device 600. The power supply component 606 may include a power management system, one or more power sources, and other components associated with generating, managing, and distributing power to the device 600.

[0165] Multimedia component 608 includes a screen that provides an output interface between the device 600 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touchscreen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensors may sense not only the boundaries of the touch or swipe action but also the duration and pressure associated with the touch or swipe operation. In some embodiments, multimedia component 608 includes a front-facing camera and / or a rear-facing camera. When the device 600 is in an operating mode, such as a shooting mode or a video mode, the front-facing camera and / or the rear-facing camera may receive external multimedia data. Each front-facing camera and rear-facing camera may be a fixed optical lens system or have focal length and optical zoom capabilities.

[0166] Audio component 610 is configured to output and / or input audio signals. For example, audio component 610 includes a microphone (MIC) configured to receive external audio signals when device 600 is in an operating mode, such as call mode, recording mode, and voice recognition mode. The received audio signals may be further stored in memory 604 or transmitted via communication component 616. In some embodiments, audio component 610 also includes a speaker for outputting audio signals.

[0167] I / O interface 612 provides an interface between processing component 602 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to, home buttons, volume buttons, power buttons, and lock buttons.

[0168] Sensor assembly 614 includes one or more sensors for providing status assessments of various aspects of device 600. For example, sensor assembly 614 may detect the on / off state of device 600, the relative positioning of components such as the display and keypad of device 600, changes in the position of device 600 or a component of device 600, the presence or absence of user contact with device 600, the orientation or acceleration / deceleration of device 600, and temperature changes of device 600. Sensor assembly 614 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. Sensor assembly 614 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, sensor assembly 614 may also include an accelerometer, a gyroscope, a magnetometer, a pressure sensor, or a temperature sensor.

[0169] Communication component 616 is configured to facilitate wired or wireless communication between device 600 and other devices. Device 600 can access wireless networks based on communication standards, such as WiFi, 3G, 4G, 5G, other communication standards, or combinations thereof. In some embodiments of this disclosure, communication component 616 receives broadcast signals or broadcast-related information from an external broadcast management system via a broadcast channel. In some embodiments of this disclosure, communication component 616 further includes a near-field communication (NFC) module to facilitate short-range communication. For example, the NFC module may be implemented based on radio frequency identification (RFID) technology, Infrared Data Association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

[0170] In some embodiments of this disclosure, the apparatus 600 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components to perform the methods described above.

[0171] In some embodiments of this disclosure, a non-transitory computer-readable storage medium including instructions is also provided, such as a memory 604 including instructions that can be executed by a processor 620 of device 600 to perform the above-described method. For example, the non-transitory computer-readable storage medium may be a ROM, random access memory (RAM), CD-ROM, magnetic tape, floppy disk, and optical data storage device, etc.

[0172] A computer-readable storage medium, when the instructions in the storage medium are executed by a processor of a mobile terminal, enables the mobile terminal to perform the above-described stamping method.

[0173] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0174] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A stamping method, characterized in that, include: During the stamping process, collect on-site production data of the stamping die; Based on the on-site production data, a gap compensation strategy is matched for different compensation areas of the working surface of the blank holder of the stamping die; The gap compensation strategy is determined based on the forming simulation prediction of the stamping die, in which the working surface of the stamping die's blank holder is divided into multiple compensation regions with different forming functions. Based on the gap compensation strategy, determine the differentiated mold gap compensation amount for each compensation area corresponding to the on-site production data; The stamping process is completed by controlling the die closing clearance based on the die clearance compensation amount.

2. The method according to claim 1, characterized in that, The on-site production data includes thermal state information of each compensation area under stamping conditions; the clearance compensation strategy includes the thermal deformation mapping relationship between the thermal state information of different compensation areas and the corresponding thermal deformation compensation amount; wherein, determining the differentiated mold clearance compensation amount for each compensation area corresponding to the on-site production data according to the clearance compensation strategy includes: Based on the thermal deformation mapping relationship, the thermal deformation compensation amount of each compensation region is determined using the thermal state information of each compensation region. The mold clearance compensation amount corresponding to each compensation area is determined based on the thermal deformation compensation amount of each compensation area.

3. The method of claim 2, wherein, The thermal state information includes temperature rise information of the compensation area; wherein, determining the thermal deformation compensation amount of each compensation area based on the thermal deformation mapping relationship using the thermal state information of each compensation area includes: Determine the coefficient of thermal expansion of the mold material and the length of the feature lines of each compensation zone; Based on the aforementioned thermal deformation mapping relationship, the thermal deformation compensation amount of each compensation area is determined by utilizing the temperature rise information of each compensation area, the thermal expansion coefficient of the mold material, and the length of the regional characteristic line of each compensation area.

4. The method according to claim 2, characterized in that, The on-site production data also includes the stress information of each compensation area under the stamping condition; the clearance compensation strategy also includes the pressure deformation mapping relationship between the stress information of different compensation areas and the corresponding pressure deformation compensation amount. The method further includes: Based on the pressure deformation mapping relationship, the pressure deformation compensation amount of each compensation area is determined using the force information of each compensation area. The mold clearance compensation amount for each compensation area is corrected based on the pressure deformation compensation amount.

5. The method of claim 1, wherein, The gap compensation strategy includes fixed compensation values ​​corresponding to different compensation areas; wherein, determining the differentiated mold gap compensation amount for each compensation area corresponding to the on-site production data according to the gap compensation strategy includes: In response to the on-site production data meeting preset conditions, the differential mold clearance compensation amount for each compensation area is determined based on the fixed compensation value corresponding to different compensation areas.

6. The method of claim 1, wherein, The forming simulation prediction divides the working surface of the stamping die's blank holder into multiple compensation regions with different forming functions, including: The simulation simulation prediction is used to obtain information on the simulated sheet material flow velocity, simulated contact pressure, and simulated temperature distribution. Based on the simulated sheet flow velocity, simulated contact pressure, simulated temperature distribution information, and the position of the draw bead in the stamping die, the boundaries of each compensation region with different forming functions are determined.

7. The method of claim 1, wherein, The multiple compensation zones with different forming functions include: a strong coloring zone, a general coloring zone, an uncolored zone, and a back void zone; wherein, the heat load of each compensation zone is different, and the mold gap compensation amount of each compensation zone is distributed in a gradient according to the heat load of each compensation zone.

8. The method of claim 7, wherein, The compensation area and the drawbead of the stamping die have one of the following positional relationships: The strongly colored area is located inside the draw bead; The general coloring area is located within a first preset distance outside the draw bead; The uncolored area is located between a first preset distance and a second preset distance on the outer side of the drawbead; the second preset distance is greater than the first preset distance. The back opening area is located outside the second preset distance of the outer side of the drawbeam.

9. The method of claim 1, wherein, The step of controlling the die closing clearance of the stamping die to complete the stamping process based on the die clearance compensation amount includes: Based on the sheet thickness, and combined with the mold clearance compensation amount corresponding to each compensation area, the mold closing clearance of each compensation area is determined. Generate stamping CNC commands based on the mold closing clearance of each compensation zone; The stamping process is completed by controlling the die closing clearance of the stamping die according to the stamping CNC instructions.

10. A stamping apparatus characterized by comprising: include: The data acquisition unit is used to collect on-site production data of the stamping die during the stamping process; The strategy matching unit is used to match the gap compensation strategy of different compensation areas of the working surface of the blank holder of the stamping die according to the on-site production data; the gap compensation strategy is determined based on the forming simulation prediction of the stamping die, and the forming simulation prediction divides the working surface of the blank holder of the stamping die into multiple compensation areas with different forming functions. The compensation amount determination unit is used to determine the mold clearance compensation amount that is differentiated for each compensation area corresponding to the on-site production data, based on the clearance compensation strategy. The control unit is used to control the mold closing clearance of the stamping die to complete the stamping process based on the mold clearance compensation amount.

11. The apparatus according to claim 10, characterized in that, The on-site production data includes thermal state information of each compensation area under stamping conditions; the clearance compensation strategy includes the thermal deformation mapping relationship between the thermal state information of different compensation areas and the corresponding thermal deformation compensation amount; wherein, the compensation amount determination unit determines the differentiated mold clearance compensation amount for each compensation area corresponding to the on-site production data according to the clearance compensation strategy, including: Based on the thermal deformation mapping relationship, the thermal deformation compensation amount of each compensation region is determined using the thermal state information of each compensation region. The mold clearance compensation amount corresponding to each compensation area is determined based on the thermal deformation compensation amount of each compensation area.

12. The apparatus according to claim 10, characterized in that, The device further includes a region prediction unit, used to divide the working surface of the blank holder of the stamping die into multiple compensation regions with different forming functions during forming simulation prediction, including: The simulation simulation prediction is used to obtain information on the simulated sheet material flow velocity, simulated contact pressure, and simulated temperature distribution. Based on the simulated sheet flow velocity, simulated contact pressure, simulated temperature distribution information, and the position of the draw bead in the stamping die, the boundaries of each compensation region with different forming functions are determined.

13. The apparatus of claim 10, wherein, The multiple compensation zones with different forming functions include: a strong coloring zone, a general coloring zone, an uncolored zone, and a back void zone; wherein, the heat load of each compensation zone is different, and the mold gap compensation amount of each compensation zone is distributed in a gradient according to the heat load of each compensation zone.

14. An electronic device, comprising: include: processor; Memory used to store processor-executable instructions; The processor is configured to implement the steps of the method according to any one of claims 1-9.

15. A computer-readable storage medium, wherein instructions in the storage medium, when executed by a processor of a mobile terminal, enable the mobile terminal to perform the steps of the method according to any one of claims 1-9.

16. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by a processor, it implements the steps of the method as described in any one of claims 1-9.

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