Metal-silicon combined ingot mold
By combining ingot mold design and applying high-temperature resistant materials, the problem of easy damage to traditional ingot molds has been solved, enabling convenient disassembly and replacement of molds, reducing maintenance costs, and improving production efficiency and silicon ingot quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- ORDOS HUAYU MASCH FOUNDRY CO LTD
- Filing Date
- 2026-05-09
- Publication Date
- 2026-06-26
AI Technical Summary
Traditional one-piece ingot molds are easily damaged in the high-temperature molten silicon environment, resulting in high maintenance difficulty and cost, and the inability to replace parts, which affects the continuity of production.
The design adopts a modular ingot mold, which includes the ingot mold body and detachable side wall modules and corner modules. The modules can be easily disassembled and replaced through connecting platforms, docking grooves and locking bolts. The slope design reduces stress concentration, and high-temperature resistant materials and buffer plates are used to buffer impact.
It enables convenient disassembly and replacement of molds, reduces maintenance and replacement costs, improves production continuity and silicon ingot forming quality, and extends mold life.
Smart Images
Figure CN122274104A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of cooling ingot molds, and in particular to a metal-silicon composite ingot mold. Background Technology
[0002] As a core raw material for the polysilicon, organosilicon, and aluminum alloy industries, metallic silicon has seen its production scale expand year by year. my country's current annual output of metallic silicon exceeds 2 million tons, occupying an important position in the global market. In the metallic silicon smelting process, the molten silicon at 1500–1700℃ obtained in the submerged arc furnace needs to be cooled and shaped into silicon ingots through ingot molds before it can enter subsequent processing stages such as crushing and purification. Therefore, the cooling ingot mold is a key piece of equipment connecting metallic silicon smelting and subsequent processing. Its performance directly determines the purity, yield, production efficiency, and production cost of the silicon ingots, and has a significant impact on the high-quality development of the metallic silicon industry.
[0003] Regarding the aforementioned technologies, the inventors discovered the following drawbacks: Since the temperature of molten silicon reaches 1500–1700℃, far exceeding the melting point of ordinary cast iron and cast steel, and because molten silicon has strong corrosiveness and wettability, and given that silicon production is a continuous operation with numerous daily cycles of ingot mold use, thermal fatigue damage accumulates continuously. In traditional one-piece ingot molds, once localized burn-through or cracks occur, the entire mold is scrapped, resulting in significant repair difficulties and extremely high costs. The high-temperature molten silicon continuously chemically corrodes and erodes the inner wall of the ingot mold, easily causing localized burn-through and melting damage. The one-piece structure cannot be partially replaced, requiring complete scrapping, leading to persistently high procurement and maintenance costs for ingot molds in the silicon industry, severely impacting production continuity. Summary of the Invention
[0004] To address the problems mentioned in the background section, this application provides a metal-silicon composite ingot mold.
[0005] This application provides a metal silicon composite ingot mold, which adopts the following technical solution: it includes an ingot mold body and a composite module. The composite module is disposed above the ingot mold body. The composite module includes a side wall module and a corner module. The side wall module and the corner module are arranged in a ring. The corner module is composed of a side module A, a middle module and a side module B. The middle module is disposed between the side module A and the side module B. The top of the inner wall of the side wall module and the corner module is provided with a slope. A connecting platform is fixedly connected to the top wall of the ingot mold body. A boss is provided on the inner wall of the ingot mold body below the connecting platform.
[0006] Optionally, the sidewall module and the corner module are provided with mating grooves that engage with the connecting platform, and the top of the sidewall module and the corner module are fixed to the connecting platform by locking bolts.
[0007] Optionally, a buffer plate is fixedly connected to the bottom of the inner wall of the corner module, and the inner wall of the side wall module, the buffer plate, and the inner wall of the boss are located on the same horizontal plane.
[0008] Optionally, a spindle-lifting groove is provided at the contact position between the side module A and the middle module, and at the contact position between the middle module and the side module B. A positioning port is provided on the top wall of the connecting platform at the position of the spindle-lifting groove, and the bottom wall of the spindle-lifting groove and the bottom wall of the positioning port are located on the same horizontal plane.
[0009] Optionally, a graphite block is provided in the ingot-starting groove, the slope of the inner wall of the graphite block is consistent with the slope of the inner wall of the corner module, and the left and right sidewalls of the graphite block are set at an inclined angle.
[0010] Optionally, the ingot mold body is square in shape, with rounded corners at all four corners, and lifting rods are provided on the front and rear end side walls of the ingot mold body.
[0011] Optionally, a joint seam is reserved between the sidewall module and the corner module, and the contact surface is set as a high-temperature resistant sealing structure.
[0012] Optionally, the corner positions of the sidewall module and the corner module are thickened, and the ingot-raising groove position is thickened.
[0013] In summary, this application includes the following beneficial technical effects: This invention employs a combined design for the side wall modules and corner modules, and utilizes the meshing design of the connecting platform and docking groove, along with locking bolts, to make mold assembly and disassembly convenient and efficient. Individual modules can be disassembled and replaced, and only the damaged modules need to be replaced to restore the mold to use, eliminating the need to scrap the entire mold and significantly reducing the cost of the ingot mold.
[0014] This invention, through the design of the ingot lifting groove and positioning port, not only realizes the function of the side-injection gate, but also provides a convenient operating space for ingot removal, reducing the labor intensity of workers. At the same time, the design of the combined module slope reduces the stress concentration of silicon ingots and improves the ease of ingot removal. The lifting rod facilitates the lifting and movement of the mold, adapting to the needs of continuous production of metallic silicon and on-site operation. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the overall structure in an embodiment of this application; Figure 2 This is a schematic diagram of the structure of the buffer plate in the embodiments of this application; Figure 3 This is an exploded view of the structure in the embodiment of this application; Figure 4 This is a schematic diagram of the structure of the ingot-starting groove in an embodiment of this application; Figure 5 This is a schematic diagram of the connection platform in an embodiment of this application; Figure 6This is a schematic diagram of the sidewall module in an embodiment of this application; Figure 7 This is a schematic diagram of the boss structure in an embodiment of this application; Figure 8 This is a schematic diagram of the graphite block structure in an embodiment of this application.
[0016] Reference numerals in the attached drawings: 1. Ingot mold body; 2. Side wall module; 3. Corner module; 301. Side module A; 302. Middle module; 303. Side module B; 4. Connecting platform; 5. Boss; 6. Docking groove; 7. Locking bolt; 8. Buffer plate; 9. Ingot lifting groove; 10. Positioning port; 11. Graphite block; 12. Lifting rod. Detailed Implementation
[0017] The following is in conjunction with the appendix Figure 1-8 This application will be described in further detail.
[0018] This application discloses a metal-silicon composite ingot mold. For example... Figures 1-8 As shown, the mold includes an ingot mold body 1 and a combination module. The combination module is positioned above the ingot mold body 1 and is detachably mounted above the ingot mold body 1. Together, they form a complete mold cavity for pouring, cooling, and molding high-temperature molten silicon. The combination module includes a side wall module 2 and a corner module 3. The side wall module 2 and the corner module 3 are arranged in a ring. The arrangement of the side wall module 2 and the corner module 3 forms the complete side wall of the mold cavity after splicing, ensuring the sealing of the mold cavity and providing a stable environment for silicon ingot molding.
[0019] The corner module 3 consists of side module A301, middle module 302, and side module B303. The middle module 302 is located between side module A301 and side module B303. The three are tightly spliced together, which not only ensures the structural strength of the corner module 3, but also facilitates individual disassembly and replacement when a single module is damaged, without scrapping the entire corner module 3, thus further improving the economy of the mold.
[0020] The inner top of the side wall module 2 and the corner module 3 are provided with a slope. The slope design guides the silicon ingot to shrink naturally during the silicon ingot cooling and forming process, reduces the adhesion between the silicon ingot and the mold wall, reduces the stress concentration inside the silicon ingot, and avoids defects such as cracking and missing corners in the silicon ingot. It effectively reduces the stress concentration of the mold under high temperature conditions, and avoids damage such as cracks and deformation at the four corners of the mold due to long-term exposure to high temperature molten silicon and thermal expansion and contraction. It extends the overall service life of the mold and provides guidance for subsequent ingot removal operations, further improving the convenience of ingot removal.
[0021] A connecting platform 4 is fixedly connected to the top wall of the ingot mold body 1. The connecting platform 4 is arranged in a ring along the edge of the top wall of the ingot mold body 1. It is the core structure for achieving precise docking between the combined module and the ingot mold body 1. A boss 5 is provided on the inner wall of the ingot mold body 1 below the connecting platform 4. The boss 5 is used to support the bottom of the combined module and ensure that the combined module is stable after installation.
[0022] Both the sidewall module 2 and the corner module 3 have mating grooves 6 that engage with the connecting platform 4 on their sidewalls. The tops of the sidewall module 2 and the corner module 3 are fixed to the connecting platform 4 by locking bolts 7. The locking bolts 7 are made of high-temperature resistant and high-strength materials, which can effectively resist thermal expansion and thermal fatigue damage caused by high-temperature molten silicon, ensuring the long-term stability of the fixed structure and preventing the modules from shifting during production. At the same time, the detachable design of the locking bolts 7 makes subsequent module disassembly and replacement operations convenient without complicated tools, further improving the convenience of mold maintenance and reducing the difficulty of operation for workers.
[0023] A buffer plate 8 is fixedly connected to the bottom of the inner wall of the corner module 3. The inner walls of the side wall module 2, the buffer plate 8, and the boss 5 are located on the same horizontal plane. The buffer plate 8 is made of refractory material that is resistant to high temperature, impact, and corrosion. Its core function is to buffer the impact force when the high-temperature molten metal is injected into the mold cavity, so as to avoid damage such as burn-through and melting at the bottom of the mold cavity due to excessive local impact, and extend the service life of the mold. At the same time, the design of the inner walls of the side wall module 2, the buffer plate 8, and the boss 5 being on the same horizontal plane ensures a smooth transition between the three without step gaps, which can ensure the flatness of the inner wall of the mold cavity and avoid defects such as unevenness and burrs on the side of the silicon ingot, reduce the amount of subsequent silicon ingot trimming work, and indirectly improve production efficiency.
[0024] The contact positions between side module A301 and middle module 302, and between middle module 302 and side module B303, are all provided with ingot lifting slots 9. The design of the ingot lifting slots 9 can accommodate the insertion and operation of the forklift front shovel, providing ample space for ingot removal. The top wall of the connecting platform 4 is provided with a positioning port 10 located at the ingot lifting slot 9. The bottom wall of the ingot lifting slot 9 and the bottom wall of the positioning port 10 are on the same horizontal plane. The positioning port 10 can accurately position the forklift front shovel, preventing tool deviation during ingot removal, preventing damage to the silicon ingot or mold, and ensuring a smooth and safe ingot removal operation.
[0025] A graphite block 11 is installed inside the ingot-raising groove 9. The graphite block 11 is made of high-purity graphite material, which has the characteristics of high temperature resistance, corrosion resistance and non-adhesion to silicon liquid. The inner wall slope of the graphite block 11 is consistent with the inner wall slope of the corner module 3, ensuring that the inner wall of the mold cavity remains flat and continuous after the graphite block 11 is embedded, without affecting the silicon ingot forming. The left and right side walls of the graphite block 11 are set at an inclined angle. The shape of the graphite block 11 not only ensures the tight fit between the graphite block 11 and the side module A301, the middle module 302 and the side module B303, but also facilitates quick disassembly after casting. At the same time, it reduces the adhesion between the graphite block 11 and the silicon ingot, further improving the convenience of ingot removal. In addition, the ingot-raising groove 9 can be used as a side-injection gate. The graphite block 11 can seal the ingot-raising groove 9 during casting to prevent the leakage of high-temperature silicon liquid, realizing the two-in-one function of "gate + ingot removal groove".
[0026] The ingot mold body 1 is square in shape, with rounded corners at all four corners. Lifting rods 12 are provided on the front and rear side walls of the ingot mold body 1. The lifting rods 12 are made of high-strength steel and are firmly connected to the ingot mold body 1, making it easy to move, transport and place the entire ingot mold through hoisting equipment.
[0027] A joint is reserved between the side wall module 2 and the corner module 3. The design of the joint not only provides space for thermal expansion when the mold is working at high temperature, but also ensures tight splicing. The contact surface is set with a high temperature resistant sealing structure, which can effectively resist the erosion of high temperature silicone liquid, prevent silicone liquid from leaking from the splice, avoid mold damage and production safety hazards, and extend the service life of the mold.
[0028] The corner positions of the side wall module 2 and the corner module 3 are thickened, and the position of the ingot-raising groove 9 is also thickened. By increasing the wall thickness, the structural strength and thermal fatigue resistance of the side wall module 2 and the corner module 3 are improved, the probability of damage is reduced, the service life of the mold is further extended, and the mold maintenance and replacement costs are reduced.
[0029] The implementation principle of a metal silicon combined ingot mold in this application embodiment is as follows: In use, the ingot mold body 1 is first fixed on the refractory base plate, and the mating grooves 6 of the side wall modules 2 and the corner modules 3 are precisely engaged with the connecting platform 4 to ensure that each module is tightly arranged. The side wall modules 2, the corner modules 3 and the connecting platform 4 are fixed by locking bolts 7 to complete the overall assembly. After the assembly is completed, the graphite block 11 is embedded in the ingot raising groove 9. The slope of the inner wall of the graphite block 11 is consistent with the inner wall of the corner module 3 to ensure that the inner wall of the mold cavity is flat and continuous.
[0030] The sloped inner wall of the modular assembly reduces stress concentration in the silicon ingot. After the silicon ingot cools and solidifies, the graphite block 11 in the ingot lifting groove 9 is removed. The ingot lifting groove 9 is used as a material handling space. The forklift front shovel is inserted into the ingot lifting groove 9, and with the help of the positioning port 10, the silicon ingot is pried up smoothly, achieving convenient ingot removal.
[0031] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.
Claims
1. A metal silicon composite ingot mold, comprising an ingot mold body (1) and a composite module, wherein the composite module is disposed above the ingot mold body (1), characterized in that: The combined module includes a side wall module (2) and a corner module (3), which are arranged in a ring. The corner module (3) consists of side module A (301), middle module (302) and side module B (303), with the middle module (302) located between side module A (301) and side module B (303); The top of the inner walls of the side wall module (2) and the corner module (3) are provided with a slope; The top wall of the ingot mold body (1) is fixedly connected to a connecting platform (4), and the inner wall of the ingot mold body (1) is provided with a boss (5) below the connecting platform (4).
2. The metal-silicon composite ingot mold according to claim 1, characterized in that: The sidewall module (2) and corner module (3) are provided with docking grooves (6) that engage with the connecting platform (4). The top of the sidewall module (2) and corner module (3) are fixed to the connecting platform (4) by locking bolts (7).
3. The metal-silicon composite ingot mold according to claim 1, characterized in that: The bottom of the inner wall of the corner module (3) is fixedly connected to a buffer plate (8), and the inner walls of the side wall module (2), the buffer plate (8) and the boss (5) are located on the same horizontal plane.
4. The metal-silicon composite ingot mold according to claim 1, characterized in that: The side module A (301) and the middle module (302) are both provided with a spindle-raising groove (9) at the contact position, and the middle module (302) and the side module B (303) are both provided with a spindle-raising groove (9). The top wall of the connecting platform (4) is provided with a positioning port (10) at the position of the spindle-raising groove (9). The bottom wall of the spindle-raising groove (9) and the bottom wall of the positioning port (10) are located on the same horizontal plane.
5. The metal-silicon composite ingot mold according to claim 4, characterized in that: The ingot-starting groove (9) is provided with a graphite block (11). The slope of the inner wall of the graphite block (11) is consistent with the slope of the inner wall of the corner module (3). The left and right side walls of the graphite block (11) are set at an inclined angle.
6. The metal-silicon composite ingot mold according to claim 1, characterized in that: The ingot mold body (1) is square in shape, and the four corners of the ingot mold body (1) are rounded. The front and rear end side walls of the ingot mold body (1) are equipped with lifting rods (12).
7. The metal-silicon composite ingot mold according to claim 1, characterized in that: A pre-reserved joint is provided between the side wall module (2) and the corner module (3), and the contact surface is set as a high-temperature resistant sealing structure.
8. The metal-silicon composite ingot mold according to claim 1, characterized in that: The corner positions of the side wall module (2) and the corner module (3) are thickened, and the position of the ingot-raising groove (9) is thickened.