A nickel-plated copper foil material with high conductivity, its application and a method for preparing the nickel-plated copper foil material by using a warm isostatic pressing device

CN122279591APending Publication Date: 2026-06-26CISRI HIPEX TECHNOLOGY CO LTD +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
CISRI HIPEX TECHNOLOGY CO LTD
Filing Date
2026-03-10
Publication Date
2026-06-26

AI Technical Summary

Technical Problem

In existing technologies, copper foil current collectors are prone to corrosion and poor interfacial bonding under high-rate and fast-charging conditions, leading to increased internal resistance and performance degradation. Traditional coatings have high porosity, coarse grains, and insufficient interlayer bonding, making it difficult to balance high conductivity and interfacial reliability.

Method used

A nickel base layer is formed by chemical plating deposition, followed by pulse electroplating to form a nickel main layer. Then, a dense nickel-plated copper foil material is formed through warm isostatic pressing, which enhances the interlayer bonding and conductivity.

Benefits of technology

It significantly reduces internal resistance, improves rate performance and cycle life, enhances battery reliability and safety, achieves high conductivity and excellent interlayer bonding, and is suitable as a current collector for devices such as lithium-ion batteries.

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Abstract

This application relates to the field of battery technology, providing a highly conductive nickel-plated copper foil material, its application, and a method for preparing the nickel-plated copper foil material using a warm isostatic pressing (WIP) apparatus. The method includes the following steps: S100, pretreating the copper foil to obtain a copper foil substrate; S200, depositing a nickel base layer on at least a portion of the surface of the copper foil substrate via chemical plating to obtain a first intermediate product; S300, forming a nickel main layer on at least a portion of the surface of the first intermediate product via pulse electroplating to obtain a second intermediate product; S400, subjecting the second intermediate product to warm isostatic pressing to obtain the nickel-plated copper foil material. This application utilizes the deposited nickel base layer as a non-porous underlay, followed by pulse electroplating to refine a dense nickel layer, and finally, warm isostatic pressing under high temperature and high pressure to close pores and promote atomic diffusion at the copper-nickel interface to form a gradient bonding layer, eliminating defects and continuous conductive pathways, thereby improving conductivity, mechanical strength, and electrochemical stability.
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