Wafer inspection system and method of inspecting the same

Abstract

A chip testing system and method thereof include a testing apparatus, a controller, a tester, a digital measuring instrument, and an electronic device. A chip under test is placed on the chip test socket of the testing apparatus. The electronic device issues commands to switch the on / off states of the Bluetooth module and / or the WIFI module of the chip under test. The digital measuring instrument is then controlled to measure the voltage value of the substrate. If the substrate voltage value is less than a set value, the electronic device determines that the chip under test is an abnormal chip; conversely, if the substrate voltage value is higher than or equal to the set value, the test application determines that the chip under test is a normal chip.

Description

Technical Field

[0001] This invention relates to a wafer inspection system and method, and more particularly to an inspection system and method for detecting defects in wafer hardware circuit design. Background Technology

[0002] Today, Bluetooth and Wi-Fi technologies are widely used to meet the needs of wireless connectivity. Although each technology has its unique functions and advantages, integrated chips are very important in order to meet the needs of portable devices. Therefore, for designers, it is necessary to determine whether technologies such as Bluetooth and Wi-Fi should be integrated into a single chip.

[0003] The applicant in this case has developed this type of integrated chip. However, when customers use this type of integrated chip, Bluetooth disconnection or restart occurs frequently, or the throughput of Wi-Fi drops to zero instantly. Such problems cause the entire batch of chips to need to be recalled for testing. Summary of the Invention

[0004] The present invention discloses a chip inspection system, comprising: an inspection apparatus having at least one test circuit board, the test circuit board having at least one chip test socket, wherein the test circuit board further has at least one voltage test terminal, a first connection terminal, and a second connection terminal; a chip body to be tested, for placement within the chip test socket, the chip body to be tested being electrically connected to the test circuit board, and the chip body to be tested having at least one Bluetooth function module and one WIFI function module; a controller electrically connected to the first connection terminal for transmitting commands to the chip body to be tested; a tester electrically connected to the second connection terminal for testing the Bluetooth function module and / or the WIFI function module; and a digital tester. A measuring instrument, electrically connected to the voltage test endpoint, is used to measure the bulk voltage value of a substrate; and an electronic device, electrically connected to the controller, the tester, and the digital measuring instrument, has a built-in test application. The test application issues multiple commands to enable or disable the Bluetooth and / or WIFI modules of the chip under test, and measures the bulk voltage value of the substrate using the digital measuring instrument. If the bulk voltage value is less than a set value, the test application determines that the chip under test is an abnormal chip; conversely, if the bulk voltage value is higher than or equal to the set value, the test application determines that the chip under test is a normal chip.

[0005] More specifically, the testing equipment also includes a pressure tool for uniformly pressing down on the chip body under test so that the chip body under test can make close contact with the chip test socket, so that the chip body under test can be electrically connected to the test circuit board.

[0006] More specifically, the test application can first start the Bluetooth function module through the controller, and after the Bluetooth function module loads a Bluetooth firmware, it can then turn off the Bluetooth function module. After that, the test application sends a first measurement voltage command to the digital measuring instrument to obtain at least one substrate voltage value, and determines whether it is less than a set value based on the at least one substrate voltage value or the average of multiple substrate voltage values. If the substrate voltage value is less than the set value, the test application determines that the chip under test is an abnormal chip.

[0007] More specifically, if the substrate voltage value is higher than or equal to the set value, the test application determines that the chip under test is a normal chip. Then, the Bluetooth function module can be turned on, and the tester can be used to test whether the WIFI function module can operate normally. After the test, the WIFI function module and the Bluetooth function module are turned off, and the test application sends a second voltage measurement command to the digital measuring instrument to obtain at least one substrate voltage value. The test application then determines whether the substrate voltage value is lower than the set value based on the at least one substrate voltage value or the average value of multiple substrate voltage values. If the substrate voltage value is lower than the set value, the test application determines that the chip under test is an abnormal chip.

[0008] More specifically, if the substrate voltage value determined by the second measurement voltage command is higher than or equal to the set value, the test application determines that the chip under test is a normal chip.

[0009] More specifically, the test application determines that the chip under test is a normal chip, and then can test whether the Bluetooth function module can operate normally.

[0010] More specifically, the chip test socket is further covered with a shielding device, which is used to cover the chip under test body, so as to avoid interference with the chip under test bodies of other chip test sockets when the Bluetooth function module and / or the WIFI function module are turned on.

[0011] More specifically, the set value is 1.0V~1.3V.

[0012] A wafer inspection method, comprising the following steps: A chip under test is placed on a chip test socket of a testing machine. The chip under test has at least a Bluetooth module and a Wi-Fi module. The Bluetooth module is activated by an electronic device, and after the Bluetooth module loads Bluetooth firmware, the Bluetooth module is then deactivated. A first voltage measurement command is sent to a digital measuring instrument through a test application of the electronic device to obtain at least one substrate voltage value. The test application determines whether the voltage value of at least one substrate or the average value of multiple substrate voltage values ​​is less than a set value. If the substrate voltage value is less than the set value, the test application determines that the chip under test is an abnormal chip.

[0013] More specifically, if the substrate voltage value is higher than or equal to the set value, the test application determines that the chip under test is a normal chip, and then the next stage of testing can be performed, the steps of which are as follows: First, enable the Bluetooth function module; Next, use a tester to test whether the WIFI module can work properly. After the test, turn off the WIFI module and the Bluetooth module. The test application then issues a second measurement voltage instruction to the digital measuring device to obtain at least one substrate voltage value. The test application determines whether the voltage value of at least one substrate or the average value of multiple substrate voltage values ​​is less than a set value. If the substrate voltage value is less than the set value, the test application determines that the chip under test is an abnormal chip.

[0014] The beneficial effects of this invention are: This invention designs a detection system and its detection method to detect whether the chip will experience Bluetooth disconnection / restart or Wi-Fi throughput dropping to zero instantaneously. By testing and screening through this invention's detection system and its detection method, if there are no problems, the chip can be shipped. Attached Figure Description

[0015] Figure 1 A schematic diagram of the overall architecture of the wafer inspection system and its inspection method of the present invention.

[0016] Figure 2A A schematic diagram showing the placement of the wafer body to be tested in the wafer inspection system and inspection method of the present invention.

[0017] Figure 2B A schematic diagram of the electrical connection of the wafer body under test in the wafer inspection system and inspection method of the present invention.

[0018] Figure 3A A schematic diagram of the front of the test circuit board of the wafer inspection system and inspection method of the present invention.

[0019] Figure 3B A schematic diagram of the back of the test circuit board of the wafer inspection system and inspection method of the present invention.

[0020] Figure 4 A schematic diagram showing the connection between the wafer inspection system and the controller of the present invention and inspection method.

[0021] Figure 5 A schematic diagram of the wiring between the wafer inspection system and the tester of the present invention.

[0022] Figure 6 A schematic diagram of the wiring between the wafer inspection system and the inspection method of the present invention and a digital measuring instrument.

[0023] Figure 7 A schematic diagram of the electronic device architecture of the wafer inspection system and inspection method of the present invention.

[0024] Figure 8 A schematic diagram of the first-stage testing process of the wafer inspection system and its inspection method of the present invention.

[0025] Figure 9A A schematic diagram of the Bluetooth switch circuit for the wafer inspection system and inspection method of the present invention.

[0026] Figure 9B A schematic diagram of the peripheral circuit of the wafer test socket in the wafer inspection system and inspection method of the present invention.

[0027] Figure 10 A schematic diagram of the second-stage testing process of the wafer inspection system and its inspection method of the present invention.

[0028] Figure 11 A schematic diagram illustrating the application of the shielding device in the wafer inspection system and inspection method of this invention.

[0029] Explanation of reference numerals in the attached figures: 1: Testing equipment 101-104: Steps 11: Test Circuit Board 1100: Front 1101: Back 110: Power connection terminal 111: Chip Test Socket 112: First connection endpoint 113: Second connection endpoint 114: Second connection endpoint 115: Voltage test endpoint 116: Voltage test endpoint 12: Pressing tool 121: Press-down component 2: Controller 20: Power connection terminal 21: Relay 22: USB port 3: Tester 4: Digital measuring instrument 5: Electronic devices 51: Microprocessor 52: Computer-readable recording media 521: Test Application 6: The chip under test 71: First connection 72: Second wiring 73: Second wiring 74: Third connection 75: Third connection 8: Shielding device 801-804: Steps. Detailed Implementation

[0030] Other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of the preferred embodiments with reference to the accompanying drawings.

[0031] The electrical connection described below in this invention refers to a connection behavior generated by a wired or wireless connection, which enables electronic components to generate one-way and / or two-way transmission of digital signals and / or analog signals.

[0032] As used in this article, the articles “a,” “one,” and “any” refer to the grammar of one or more (i.e., at least one) items. For example, “an element” means one element or more.

[0033] The microprocessor described below in this invention is an MCU (Micro Controller Unit). An MCU includes at least a CPU, a memory (e.g., ROM and RAM), and peripheral devices (e.g., ADC, DAC, GPIO, PWM). The actions, instructions, variables, and other data can be written into the memory through a program, and then the CPU executes these program-written actions sequentially.

[0034] The present invention relates to a wafer inspection system and inspection method, such as... Figure 1 As shown, the wafer inspection system includes an inspection tool 1, a controller 2, a tester 3, a digital measuring instrument 4, and an electronic device 5.

[0035] like Figure 2A and Figure 2B As shown, the testing device 1 has at least one test circuit board 11, the test circuit board 11 has at least one chip test socket 111, and the test circuit board 11 also has at least one voltage test terminal, a first connection terminal and a second connection terminal.

[0036] The chip under test (DUT) body 6 can be placed inside the chip test socket 111. The DUT body 6 is electrically connected to the test circuit board 11, and the DUT body 6 has at least one Bluetooth function module and one WIFI function module.

[0037] The testing device 1 also has a pressure plate 12. The pressing member 121 at the front end of the pressure plate 12 is used to uniformly press down the chip body 6 under test. The pins of the chip body 6 under test can make close contact with the pins on the chip test socket 111 so that the chip body 6 under test can be reliably electrically connected to the test circuit board 11.

[0038] The test circuit board 11 also has a power connection terminal 110 for connecting to the input power supply.

[0039] like Figure 3A and Figure 3B As shown, this is a schematic diagram of the front and back circuits of the test circuit board 11 (where... Figure 3B ,Will Figure 3A The front side 1100 is flipped to the right to reveal the back side 1101. An electronic pressure component is provided on the front side of the test circuit board 11. When pressed down, the circuit board is powered on; when pulled up, the circuit board is completely de-energized. The position of the electronic pressure component is electrically connected to the power connection terminal 110, and the power supply or power cut-off is controlled by the electronic pressure component.

[0040] like Figure 3A and Figure 4 As shown, on the test circuit board 11, the first connection terminal 112 (corresponding to) Figure 3A The connection shown in 112) has a first wire 71, the other end of which is electrically connected to the controller 2.

[0041] Because the testing in this case requires the electronic device 5 to issue commands to turn the functional modules (Bluetooth functional module and / or WIFI functional module) on or off, and because the electronic device 5 is connected to the test circuit board 11 through the controller 2, the control commands can be transmitted to the chip under test 6 to inform the chip under test 6 to turn the functional modules (Bluetooth functional module and / or WIFI functional module) on or off, the following descriptions of the electronic device 5 turning the functional modules (Bluetooth functional module and / or WIFI functional module) on or off are all based on the circuit connection created by the controller 2 so that the control commands can be transmitted to the chip under test 6.

[0042] In addition, the aforementioned control commands are not limited to commands that enable or disable functional modules.

[0043] In the course of this case, if Figure 4 As shown, the controller 2 has a power connection terminal 20, a relay 21, and a USB port 22. The USB port 22 is electrically connected to the electronic device 5 via a USB cable (not shown). The electronic device 5 can send a Bluetooth enable command to the controller 2. The controller 2 can start the Bluetooth function module via the relay 21. After the Bluetooth function module loads a Bluetooth firmware, the chip under test 6 can send a Bluetooth disable command to the controller 2 so that the controller 2 can disable the Bluetooth function module.

[0044] Furthermore, the connection steps for Bluetooth testing are as follows: Electronic device 5 sends a command to controller 2, which then connects the Bluetooth test circuit path of the relay.

[0045] Then, the electronic device 5 sends a command to the chip under test 6 via the relay 21 to turn on Bluetooth.

[0046] Electronic device 5 then sends a command to controller 2, which switches relay 21 to connect the Bluetooth circuit. Electronic device 5 then controls the chip under test 6 through the connected circuit.

[0047] Furthermore, after the Bluetooth firmware download is complete, the steps to turn off Bluetooth are as follows: Once the Bluetooth firmware download is complete, the electronic device 5 will first receive a notification from the chip under test 6 that the Bluetooth firmware download is complete. Then, the electronic device 5 issues a command to turn off Bluetooth through the test circuit connected to the relay 21.

[0048] Furthermore, when the digital meter (digital measuring device 4) begins measuring Bulk Voltage, the steps are as follows: Once the Bluetooth firmware download is complete, the electronic device 5 will first receive a notification from the chip under test 6 that the Bluetooth firmware download is complete. Then, the electronic device 5 issues a command to measure the Bulk Voltage through the test circuit connected to the relay 21.

[0049] like Figure 3B and Figure 5 As shown, on the test circuit board 11, the second connection terminals 113 and 114 (corresponding to) Figure 3B As shown in Figures 113 and 114, a second wire 72 and a second wire 73 are connected to each other. The other end of the second wire 72 and the second wire 73 are electrically connected to the tester 3 (not shown in the figure). The tester 3 is used to test the WIFI function module.

[0050] like Figure 3A , Figure 3B and Figure 6 As shown, the voltage test terminal 115 (corresponding to) on the test circuit board 11 Figure 3B As shown in 115), 116 (corresponding to Figure 3A As shown in 116), a third wire 74 and 75 are respectively connected. The other end of the third wire 74 and 75 is electrically connected to the digital measuring device 4, which is used to measure the base voltage value.

[0051] The tester 3 and digital measuring device 4 in this case are digitally connected and controlled, and therefore can be electrically connected to the electronic device 5, and the operation of the tester 3 and digital measuring device 4 can be controlled by the electronic device 5 (wherein the tester 3 and the electronic device 5 are connected via Ethernet, and the digital measuring device 4 and the electronic device 5 are connected via USB cable).

[0052] As shown in the previous image ( Figure 1 As shown in the figure, the electronic device 5 is electrically connected to the controller 2, the tester 3 and the digital measuring device 4. The electronic device 5 is any computing device capable of calculation and execution control, such as a desktop computer, a notebook computer or a server device.

[0053] like Figure 7 As shown, the electronic device 5 includes at least one microprocessor 51 and at least one computer-readable recording medium 52, wherein the computer-readable recording medium 52 contains a test application 521, and the computer-readable recording medium 52 further stores computer-readable instructions, which enable the test application 521 to operate when executed by the microprocessor 51.

[0054] The test application 521 is used to issue multiple commands to turn off the Bluetooth function module and / or the WIFI function module of the chip body 6 under test, and to measure the voltage value of the substrate through the digital measuring instrument 4.

[0055] When the Bluetooth function module is turned off, the test application 521 sends a first voltage measurement command to the digital measuring device 4 to obtain at least one substrate voltage value. The test application determines whether the substrate voltage value is less than a set value (set value is 1.0V~1.3V) based on the at least one substrate voltage value or the average value of multiple substrate voltage values. If the substrate voltage value is less than the set value, the test application determines that the chip body 6 under test is an abnormal chip. Conversely, if the substrate voltage value is higher than or equal to the set value, the test application 521 determines that the chip body 6 under test is a normal chip.

[0056] The above implementation is mainly used to detect Bluetooth. After that, WIFI must be detected. Therefore, the Bluetooth function module can be turned on by the command, and the WIFI function module can be tested by the tester 3 to see if it can work properly. After the test, the WIFI function module is turned off first, and then the Bluetooth function module is turned off. The test application 521 then sends a second voltage measurement command to the digital measuring instrument 4 to obtain at least one substrate voltage value again.

[0057] Furthermore, the steps for conducting a Wi-Fi test are as follows: Electronic device 5 sends a command to controller 2, which then connects the WIFI test circuit path of the relay.

[0058] Then, the electronic device 5 sends a command to the chip under test 6 via the relay 21 to turn on the WIFI.

[0059] Once WIFI is turned on, electronic device 5 will receive a notification that the WIFI function is enabled, and then send an instruction to tester 3 to perform the test.

[0060] Then, based on at least one substrate voltage value or the average of multiple substrate voltage values, it is determined whether it is less than the set value. If the substrate voltage value is less than the set value, the test application 521 determines that the chip under test is an abnormal chip. Conversely, if the substrate voltage value determined by the second measurement voltage command is higher than or equal to the set value, the test application determines that the chip under test is a normal chip.

[0061] After two tests, if the test application 521 determines that the chip under test 6 is a normal chip, then the Bluetooth module can be tested to see if it can work properly.

[0062] like Figure 8 As shown, the first stage of the wafer inspection method in this case comprises the following steps: A chip under test is placed on a chip test socket of a testing machine. The chip under test has at least a Bluetooth function module and a WIFI function module 801. 802. Activate the Bluetooth function module, and after the Bluetooth function module loads a Bluetooth firmware, then deactivate the Bluetooth function module. A first voltage measurement command is sent to a digital measuring instrument through a test application of the electronic device to obtain at least one substrate voltage value 803. The test application determines whether the voltage value of at least one substrate or the average value of multiple substrate voltage values ​​is less than a set value. If the substrate voltage value is less than the set value, the test application determines that the chip under test is an abnormal chip 804.

[0063] Further explanation of the above steps is as follows (the equipment and parameters mentioned in the examples below are limited to a specific implementation, but are not limited to other implementations and can be adjusted as needed): Step 802, in which the Bluetooth function module is activated, is initiated by the electronic device's test application sending a command to the relay control board, causing... Figure 9A The first connection endpoint (endpoint line (5) and endpoint line (3)) can be connected to enable the Bluetooth function and keep the Bluetooth function module at a high potential (e.g., 1.8V).

[0064] Step 802, in which the Bluetooth function module loads a Bluetooth firmware, is briefly described with an example as follows: Reset Bluetooth functionality; Increase the baud rate to 2 Mbps; Download the Bluetooth driver (.hcd file, provided by the IC manufacturer); Download the configuration file and write it to the memory (the configuration file is an instruction provided by the IC manufacturer); Execute instructions provided by the IC manufacturer; The transmission rate was reduced to 115200 bps.

[0065] Step 802, turning off the Bluetooth function module, is caused by the test application of the electronic device sending an instruction to the relay control board to enable the first connection endpoint (endpoint line (3) and endpoint line (1)) in Figure 3A to communicate, so as to turn off the Bluetooth function. In this state, the Bluetooth is not powered off and the FW firmware is still in the memory.

[0066] Step 803, in which at least one substrate voltage value is obtained, is briefly described with an example as follows: First, set the digital measuring device 4 (in this embodiment, the digital measuring device 4 is a digital electricity meter, such as GW GDM-8341), including setting the electricity meter unit (e.g., DC 5V), setting the electricity meter sampling rate configuration (e.g., Medium), and setting the time for measuring the integrated voltage of the output (e.g., every 0.5s).

[0067] Perform measurement at the contact point (the second connection point for measurement, such as...) Figure 9B As shown, 115 (the connection between L6 and C104) and 116 (TP1_GND) are measured several times and the average value is taken (for example, the average value is taken after 3 measurements). The test application will pass if the average voltage value is greater than or equal to 1V.

[0068] When the average voltage value is less than 1V, the test application determines FAIL and instructs the digital measuring instrument to stop the test.

[0069] like Figure 10 As shown, in the second stage of the chip testing method in this case, if the substrate voltage value is higher than or equal to the set value, the test application determines that the chip under test is a normal chip, and then the next stage of testing can be performed. The steps are as follows: First, enable the Bluetooth function of module 101; Then, use the tester to test whether the WIFI module can work properly. After the test, turn off the WIFI module and the Bluetooth module. Subsequently, the test application sends a second voltage measurement command to the digital measuring device to obtain at least one substrate voltage value 103. The test application determines whether the voltage value of at least one substrate or the average value of multiple substrate voltage values ​​is less than the set value. If the substrate voltage value is less than the set value, the test application determines that the chip under test is the abnormal chip 104.

[0070] Further explanation of the above steps is as follows (the equipment and parameters mentioned in the examples below are limited to a specific implementation, but are not limited to other implementations and can be adjusted as needed): Step 102: Test the WIFI module using the tester. A brief example of the steps is as follows: Load the Wi-Fi driver; Load firmware and power settings files; Load the driver patch file; Check if the one-time password test content is correct; Read and write test media access address; WIFI wireless function test; Turn off the Wi-Fi function.

[0071] Step 104: If the measured substrate voltage value is higher than or equal to the set value, the chip under test is determined to be a normal chip. Then, the Bluetooth function module can be tested to see if it can operate normally. A brief example of the steps is as follows: The testing instrument commands the test sample to return data of 11110000, calculates the peak value and mean value of its frequency offset, and records them as Df1max and Df1avg. The testing instrument commands the test sample to return data in the 10101010 group, calculates the peak and mean values ​​of its frequency offset, and denoted as Df2max and Df2avg. Test criteria: At least 99.9% of Df1max must be between 140kHz and 175kHz, and at least 99.9% of Df2max must be < 3115kHz; Df2avg / Df1avg < 30.8.

[0072] In addition, such as Figure 11 As shown, a shielding device 8 is further covered above the chip test socket 111. The shielding device 8 is used to cover the chip body 6 under test, so as to avoid interference with the chip bodies under test of other chip test sockets when the Bluetooth function module and / or the WIFI function module are turned on.

[0073] The aforementioned shielding device 8 was developed because, during the setup of the Wi-Fi 6E wireless network function testing environment, it was discovered that the factory-side test stations, being in an open space, experienced packet loss rates exceeding 10% in the receiver sensitivity measurement. This clearly violated the Wi-Fi IEEE 802.11XX standard specifications. Therefore, to prevent interference between test stations and avoid affecting actual product characteristics and causing misjudgments, and to effectively solve this problem, the shielding device 8 was manufactured and implemented in the factory-side test fixture for production testing.

[0074] By using the shielding device 8, the discrimination results measured by the program have significantly reduced and improved the problem of packet loss rate greater than 10%. The introduction of the shielding device 8 has also greatly improved the production yield and reduced the misjudgment results caused by interference in the test environment.

[0075] Compared with other existing technologies, the chip testing system and method provided by this invention are designed to detect whether the chip will experience Bluetooth disconnection / restart or Wi-Fi throughput dropping to zero instantly. By testing and screening through the testing system and method of this invention, if there are no problems, the chip can be shipped.

[0076] The present invention has been disclosed above through the above embodiments, but it is not intended to limit the present invention. Those skilled in the art, after understanding the foregoing technical features and embodiments of the present invention, should not make any modifications or alterations.

Claims

1. A wafer inspection system, characterized in that, include: A testing device having at least one test circuit board having at least one chip test socket, wherein the test circuit board also has at least one voltage test terminal, a first connection terminal and a second connection terminal; A chip under test body is placed in the chip test socket. The chip under test body is electrically connected to the test circuit board. The chip under test body has at least a Bluetooth function module and a WIFI function module. A controller, electrically connected to the first connection endpoint, is used to transmit instructions to the chip body under test; A tester, electrically connected to the second connection endpoint, is used to test the Bluetooth function module and / or the WIFI function module; A digital measuring instrument, electrically connected to the voltage test terminal, is used to measure the voltage value of a substrate; as well as An electronic device is electrically connected to the controller, the tester and the digital measuring instrument. The electronic device has a built-in test application. The test application is used to issue multiple commands to turn on or off the Bluetooth function module and / or the WIFI function module of the chip under test, and to measure the voltage value of the substrate through the digital measuring instrument. If the substrate voltage is less than a set value, the test application determines that the chip under test is an abnormal chip; conversely, if the substrate voltage is higher than or equal to the set value, the test application determines that the chip under test is a normal chip.

2. The wafer inspection system as described in claim 1, characterized in that, The testing equipment also has a pressure tool for uniformly pressing down on the chip body under test so that the chip body under test can make close contact with the chip test socket, so that the chip body under test can be electrically connected to the test circuit board.

3. The wafer inspection system as described in claim 1, characterized in that, The test application can first start the Bluetooth function module through the controller, and after the Bluetooth function module loads a Bluetooth firmware, it can then turn off the Bluetooth function module. After that, the test application sends a first measurement voltage command to the digital measuring instrument to obtain at least one substrate voltage value, and determines whether it is less than a set value based on the at least one substrate voltage value or the average of multiple substrate voltage values. If the substrate voltage value is less than the set value, the test application determines that the chip under test is an abnormal chip.

4. The wafer inspection system as described in claim 1, characterized in that, If the substrate voltage value is higher than or equal to the set value, the test application determines that the chip under test is a normal chip. Then, the Bluetooth function module can be turned on, and the tester can be used to test whether the WIFI function module can operate normally. After the test, the WIFI function module and the Bluetooth function module are turned off, and the test application sends a second voltage measurement command to the digital measuring instrument to obtain at least one substrate voltage value. The test application then determines whether the substrate voltage value is lower than the set value based on the at least one substrate voltage value or the average value of multiple substrate voltage values. If the substrate voltage value is lower than the set value, the test application determines that the chip under test is an abnormal chip.

5. The wafer inspection system as described in claim 4, characterized in that, If the substrate voltage value determined by the second measurement voltage command is higher than or equal to the set value, the test application determines that the chip under test is a normal chip.

6. The wafer inspection system as described in claim 5, characterized in that, The testing application determines that the chip under test is a normal chip, and then it can test whether the Bluetooth module can function normally.

7. The wafer inspection system as described in claim 1, characterized in that, The chip test socket is further covered by a shielding device, which is used to cover the chip under test, so as to avoid interference with the chip under test of other chip test sockets when the Bluetooth function module and / or the WIFI function module are turned on.

8. The wafer inspection system as described in claim 1, characterized in that, This setting is 1.0V~1.3V.

9. A wafer inspection method, comprising a wafer inspection system according to any one of claims 1-8, characterized in that, The steps are as follows: A chip under test is placed on a chip test socket of a testing machine. The chip under test has at least a Bluetooth module and a WIFI module. The Bluetooth module is activated by an electronic device, and after the Bluetooth module loads Bluetooth firmware, the Bluetooth module is then deactivated. A first voltage measurement command is sent to a digital measuring instrument through a test application of the electronic device to obtain at least one substrate voltage value. The test application determines whether the voltage value of at least one substrate or the average value of multiple substrate voltage values ​​is less than a set value. If the substrate voltage value is less than the set value, the test application determines that the chip under test is an abnormal chip.

10. The wafer inspection method as described in claim 9, characterized in that, If the voltage value of the substrate is higher than or equal to the set value, the test application determines that the chip under test is a normal chip, and then the next stage of testing can be performed. The steps are as follows: First, enable the Bluetooth function module; Next, use a tester to test whether the WIFI module can work properly. After the test, turn off the WIFI module and the Bluetooth module. The test application then issues a second measurement voltage instruction to the digital measuring device to obtain at least one substrate voltage value. The test application determines whether the voltage value of at least one substrate or the average value of multiple substrate voltage values ​​is less than a set value. If the substrate voltage value is less than the set value, the test application determines that the chip under test is an abnormal chip.

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