Semiconductor current limiting resistor and method of processing the same

Abstract

This invention relates to the field of semiconductor current-limiting resistor technology, specifically disclosing a semiconductor current-limiting resistor, including a support component. The support component includes inner and outer support assemblies and upper and lower support assemblies at the upper and lower ends of the inner and outer support assemblies. A semiconductor resistor assembly and a side support assembly are provided in the middle of the inner and outer support assemblies and between the upper and lower support assemblies. In this invention, the sensitivity of the entire resistor is improved by bonding the semiconductor patch with the fan-shaped semiconductor resistor block. The resistance value of the entire resistor can also be adjusted by rotating the adjustment head to drive the stud and the threaded drive hole, thereby improving the applicability range of the entire resistor. The outer support sleeve provides effective external protection for the semiconductor resistor assembly, and the upper and lower support assemblies provide effective protection at the upper and lower ends of the semiconductor resistor assembly, thereby improving the stability of the entire resistor.

Description

Technical Field

[0001] This invention relates to the field of semiconductor current-limiting resistor technology, specifically to a semiconductor current-limiting resistor and its processing method. Background Technology

[0002] A semiconductor current-limiting resistor is a type of existing road construction guardrail, which generally has a relatively simple structure. For example, patent number CN102610495A discloses a semiconductor resistor manufacturing method, a semiconductor resistor, and an electronic device. The semiconductor resistor manufacturing method according to the present invention includes: providing a semiconductor substrate; forming a well region in the semiconductor substrate; forming a first contact region and a second contact region in the upper region of the well region; distributing a mask polysilicon layer on the surface of the well region, excluding the first and second contact regions; using the mask polysilicon portion as a metallization silicide barrier layer, forming a first metallization silicide and a second metallization silicide on the surfaces of the first and second contact regions, respectively. According to the present invention, the step of distributing the mask polysilicon layer can be integrated into the deposition step of the polysilicon gate of the integrated circuit, thereby eliminating the need for an additional mask. Furthermore, the distributed mask polysilicon layer can replace the function of the metallization barrier layer mask in the prior art to ensure that the surface area between the first and second contact regions is not metallized, which can meet general production and use requirements. However, it still has the following disadvantages in actual use: 1. Existing semiconductor resistors generally only have the sensitivity of semiconductor resistance, but their adjustability is poor and their application range needs to be further improved; 2. Existing semiconductor resistors are generally greatly affected by the environment and have poor stability in high-temperature and high-pressure environments. Their stability needs to be further improved. Summary of the Invention

[0003] The purpose of this invention is to provide a semiconductor current-limiting resistor and its processing method to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor current-limiting resistor, comprising a support component, the support component including inner and outer support components and upper and lower support components disposed at the upper and lower ends of the inner and outer support components, a semiconductor resistor assembly and a side support assembly disposed in the middle of the inner and outer support components and between the upper and lower support components, a conduction adjustment component disposed in the middle of the semiconductor resistor assembly and the side support assembly, an external wiring component being inserted into the bottom of the lower support component, the semiconductor resistor assembly being evenly distributed vertically between the upper and lower support components, and the semiconductor resistor assembly being symmetrically distributed left and right in the middle of the inner and outer support components, the side support components being symmetrically distributed on both sides of the semiconductor resistor assembly, the conduction adjustment component being slidably fitted with the side support component, and the external wiring component being electrically connected to the semiconductor resistor assembly on the left and right sides of the lower support component.

[0005] Preferably, the upper support assembly includes an upper support plate, and a first upper limit seat is fixedly provided in the middle of the lower end face of the upper support plate. A second upper limit seat is fixedly provided in the middle of the lower end face of the first upper limit seat. First mounting holes are symmetrically opened on the left and right sides of the upper end face of the upper support plate toward the lower end of the first upper limit seat. An adjustment groove is opened in the middle of the upper end face of the upper support plate, and a first through hole is opened at the bottom of the adjustment groove toward the lower end of the second upper limit seat.

[0006] Preferably, the lower support assembly includes a lower support plate, and a first lower limit seat is fixedly provided in the middle of the upper surface of the lower support plate. A second lower limit seat is fixedly provided in the middle of the upper surface of the first lower limit seat. A first mounting screw hole is symmetrically provided on the upper surface of the first lower limit seat and on both sides of the second lower limit seat. The first mounting screw hole corresponds to the position of the first mounting hole. A second through hole is provided in the middle of the upper surface of the second lower limit seat. A bearing positioning groove is provided at the lower end of the second through hole. An end cap mounting groove is provided at the lower port of the bearing positioning groove. A sealing groove is provided circumferentially in the middle of the inner wall of the bearing positioning groove. Wiring holes are provided on the left and right sides of the second lower limit seat and at the upper end of the first lower limit seat, leading to the bottom of the lower support plate. The external wiring assembly is inserted into the wiring hole, and a contact limiting groove is provided at the upper port of the wiring hole.

[0007] Preferably, the inner and outer support components include an outer support sleeve fitted around the outer sides of the first upper limit seat and the first lower limit seat. The upper and lower ends of the outer support sleeve abut against the lower end face of the upper support plate and the upper end face of the lower support plate, respectively. The inner side of the outer support sleeve is symmetrically provided with inner guide studs. The upper end of the inner guide stud is fitted with the first mounting hole, and the lower end of the inner guide stud is screwed into the first mounting screw hole.

[0008] Preferably, the semiconductor resistor assembly includes a fan-shaped semiconductor resistor block with a fan-shaped plate structure. The fan-shaped semiconductor resistor block has a third through hole in the middle that mates with the inner guide stud. The upper and lower ends of the fan-shaped semiconductor resistor block and the inner arc surface of the fan-shaped semiconductor resistor block are fixedly connected to contact terminals. The fan-shaped semiconductor resistor blocks are symmetrically distributed in the outer support sleeve and are evenly distributed in the vertical direction along the inner guide stud.

[0009] Preferably, the side support assembly includes fan-shaped positioning support blocks symmetrically distributed front and back inside the outer support sleeve. The fan-shaped positioning support blocks have an arc-shaped panel structure, and the upper and lower end faces of the fan-shaped positioning support blocks abut against the lower end face of the first upper limit seat and the upper end face of the lower support plate, respectively. The inner arc surface of the fan-shaped positioning support blocks fits into the second upper limit seat and the second lower limit seat. A guide groove is formed in the middle of the inner arc surface of the fan-shaped positioning support blocks from top to bottom. The two end faces of the fan-shaped positioning support blocks are respectively attached to the adjacent side faces of the fan-shaped semiconductor resistor blocks.

[0010] Preferably, the conduction adjustment assembly includes an adjustment head disposed in the adjustment groove, and a stud that mates with the first through hole is fixedly connected to the lower end of the adjustment head. The lower end of the stud mates with the second through hole. A support bearing is fitted in the bearing positioning groove. The support bearing mates with the lower end of the stud. The lower end of the support bearing is provided with an end cap that engages with the end cap mounting groove. A sealing ring that fits into the sealing groove is provided on the outer side of the end cap.

[0011] Preferably, a conductive support seat is fitted inside the sector-shaped semiconductor resistor block and between the second upper limit seat and the second lower limit seat. The conductive support seat has guide blocks that slide with the guide groove on two symmetrical front and rear sides. A threaded transmission hole for screwing to the stud is opened in the middle of the conductive support seat. A conductive plate is fixedly embedded in the middle of the conductive support seat and outside the threaded transmission hole on the left and right sides of the conductive support seat.

[0012] Preferably, the external wiring assembly includes a conductive contact piece that mates with the wire hole, and a conductive wire that mates with the contact piece's limiting groove is fixedly connected to the upper end of the conductive contact piece, and the conductive wire is in contact with the contact piece terminal at the lower end of the fan-shaped semiconductor resistor block.

[0013] Preferably, the present invention also relates to a method for processing a semiconductor current-limiting resistor, comprising the following steps: Step 1: Production and preparation of the upper support assembly. The upper support plate, the first upper limit seat and the second upper limit seat are machined by turning, and the first mounting hole, the adjustment groove and the first through hole are machined by drilling. Step 2: Production and preparation of the lower support assembly. The lower support plate, the first lower limit seat and the second lower limit seat are machined by turning. The first mounting screw hole, the second through hole, the wire hole and the contact plate limiting groove are machined by drilling. Then the bearing positioning groove, the end cover mounting groove and the sealing groove are machined by turning. Step 3: Production and preparation of inner and outer support components, including machining the outer support sleeve and inner guide stud by turning; Step 4: Production and preparation of semiconductor resistor assembly. The semiconductor sheet is processed by grinding and cutting. The shape of the fan-shaped semiconductor resistor block is processed by turning and milling. The third through hole is processed by drilling. Then the semiconductor sheet and the upper and lower ends of the fan-shaped semiconductor resistor block are bonded together. The contact terminals are processed by stamping. Then the contact terminals are pasted on the upper and lower ends of the semiconductor. Step 5: Production and preparation of side support components. Bakelite or rigid insulating plastic is machined into a cylinder by turning, and then the fan-shaped positioning support block and guide groove are machined by milling. Step 6: Production and preparation of the conduction adjustment assembly. The adjustment head and stud are machined by turning, the end cap is machined by turning, the conduction support seat, guide block and conduction plate are machined by die casting, the threaded drive hole is machined by turning, the corresponding support bearing is selected according to the stud shaft end size, and the corresponding sealing ring is selected according to the sealing groove size. Step 7: Production and preparation of external wiring components. Cut the wire to a fixed length to complete the processing of the conductive contact piece. Complete the processing of the conductive wire by stamping. Then, weld one end of the conductive contact piece to the middle of the lower end face of the conductive wire. Step 8: Assembly. Insert the inner guide stud and the stud into the first mounting hole and the first through hole respectively. Then, flip the upper support plate so that the first upper limit seat faces upward. Connect the third through hole in the middle of the sector-shaped semiconductor resistor block to the inner guide stud. Arrange the sector-shaped semiconductor resistor blocks symmetrically on the inner guide stud. Then, fit the outer support sleeve on the outside of the sector-shaped semiconductor resistor block, so that one end of the outer support sleeve is fitted with the first upper limit seat and one end of the outer support sleeve abuts against the upper support plate. Then, guide the guide groove in the middle of the sector-shaped positioning support block along the inner guide stud to both sides of the sector-shaped semiconductor resistor block. Guide the guide blocks on both sides of the conductive support seat into the guide groove. Lift the upper support plate and rotate the adjusting head to screw the stud into the threaded drive hole for transmission. Insert the conductive support seat into the middle position of the outer support sleeve, then lay the assembled parts flat. Insert the conductive contact into the wire hole from the bottom of the contact limiting groove at the upper end of the first lower limit seat, so that the conductive wire is completely embedded in the contact limiting groove. Pull the inner guide stud outward a certain length, then insert the first lower limit seat from the other end of the outer support sleeve, so that the lower support plate is in contact with the other end of the outer support sleeve. Rotate the inner guide stud to tighten the lower end of the inner guide stud with the first mounting screw hole. Then, snap the support bearing into the bearing positioning groove, embed the sealing ring into the sealing groove, snap the end cap into the end cap mounting groove, and fasten the outer side of the end cap into the end cap mounting groove with screws to complete the assembly of the entire semiconductor current limiting resistor.

[0014] Compared with the prior art, the beneficial effects of the present invention are: the present invention has a reasonable structural design and strong functionality, and has the following advantages: 1. In this invention, by bonding semiconductor patches with fan-shaped semiconductor resistor blocks, a combination of semiconductor resistance and conductor resistance is formed, which improves the sensitivity of the entire resistor. At the same time, the rotating adjustment head can drive the stud to be screwed into the threaded drive hole, thereby causing the guide block to move up and down along the guide groove. This allows the two ends of the conductive plate in the middle of the conductive support base to contact the contact terminals on the left and right sides of the middle of the outer support sleeve, so that the fan-shaped semiconductor resistor blocks on the left and right sides of the outer support sleeve are in a series conductive state, completing the resistance value adjustment of the entire resistor and improving the applicability of the entire resistor. 2. In this invention, the outer support sleeve provides effective external protection for the semiconductor resistor assembly, the upper and lower support components provide effective protection at the upper and lower ends of the semiconductor resistor assembly, and the side support components provide effective limiting protection on both sides of the semiconductor resistor assembly, thereby improving the stability of the entire resistor. Attached Figure Description

[0015] Figure 1 This is an isometric view of the overall structure of the present invention; Figure 2 This is a front view of the overall structure of the present invention; Figure 3 for Figure 2 Axonometric view of the cross-sectional structure at point AA; Figure 4 for Figure 3 Enlarged schematic diagram of the local structure at point G; Figure 5 for Figure 3 Enlarged schematic diagram of the local structure at point H; Figure 6 for Figure 2 Axonometric view of the cross-sectional structure at point CC; Figure 7 for Figure 6 Enlarged schematic diagram of the local structure at point I; Figure 8 for Figure 2 Axonometric view of the cross-sectional structure at point DD; Figure 9 for Figure 8 Enlarged schematic diagram of the local structure at point J; Figure 10 for Figure 2 Axonometric view of the cross-sectional structure at the middle EE section; Figure 11 for Figure 2 Axonometric view of the cross-sectional structure at the middle FF section; Figure 12 This is a left view of the overall structure of the present invention; Figure 13 for Figure 12 Axonometric view of the cross-sectional structure at point BB; Figure 14 for Figure 13 Enlarged schematic diagram of the local structure at point L; Figure 15 for Figure 13 Enlarged schematic diagram of the local structure at point M.

[0016] In the diagram: 1. Upper support assembly; 2. Lower support assembly; 3. Inner and outer support assemblies; 4. Semiconductor resistor assembly; 5. Side support assembly; 6. Conductivity adjustment assembly; 7. External wiring assembly; 101. Upper support plate; 102. First upper limit seat; 103. Second upper limit seat; 104. First mounting hole; 105. Adjustment groove; 106. First through hole; 201. Lower support plate; 202. First lower limit seat; 203. Second lower limit seat; 204. First mounting screw hole; 205. Second through hole; 206. Bearing positioning groove; 207. End cover mounting... 208. Sealing groove; 209. Wire hole; 210. Contact plate limiting groove; 301. Outer support sleeve; 302. Inner guide stud; 401. Fan-shaped semiconductor resistor block; 402. Contact plate terminal; 403. Third through hole; 501. Fan-shaped positioning support block; 502. Guide groove; 601. Adjusting head; 602. Stud; 603. Support bearing; 604. Sealing ring; 605. End cap; 606. Conductor support seat; 607. Guide block; 608. Threaded transmission hole; 609. Conductor plate; 701. Conductor contact plate; 702. Conductor wire. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] Please see Figures 1 to 15This invention provides a technical solution: a semiconductor current-limiting resistor, comprising a support component, which includes inner and outer support components 3 and upper support components 1 and lower support components 2 at the upper and lower ends of the inner and outer support components 3. A semiconductor resistor assembly 4 and a side support component 5 are disposed in the middle of the inner and outer support components 3 and between the upper support components 1 and lower support components 2. A conduction adjustment component 6 is disposed between the semiconductor resistor assembly 4 and the side support components 5. An external wiring component 7 is inserted into the bottom of the lower support component 2. The semiconductor resistor assemblies 4 are evenly distributed vertically between the upper support components 1 and the lower support components 2, and are symmetrically distributed left and right in the middle of the inner and outer support components 3. The side support components 5 are symmetrically distributed on both sides of the semiconductor resistor assemblies 4. The conduction adjustment component 6 is slidably engaged with the side support components 5. The external wiring component 7 is located on the lower support component. The left and right sides of component 2 are electrically connected to the semiconductor resistor assembly 4. The upper support assembly 1 and the lower support assembly 2 provide support at the upper and lower ends of the inner and outer support assemblies 3. The upper support assembly 1 and the lower support assembly 2 provide support and protection for the semiconductor resistor assembly 4 and the side support assembly 5 in the middle of the inner and outer support assemblies 3. The inner and outer support assemblies 3 provide external protection for the semiconductor resistor assembly 4 and the side support assembly 5. The semiconductor resistor assembly 4, as a combination of conductor resistors and semiconductor resistors, improves the sensitivity of the entire resistor while maintaining the stability of the resistor. The side support assembly 5 provides a limit function on both sides of the semiconductor resistor assembly 4. The side support assembly 5 provides a guiding function for the conduction adjustment assembly 6. The conduction adjustment assembly 6 provides a resistance value adjustment function for the semiconductor resistor assembly 4.

[0019] See Figures 3 to 11 As shown, the upper support assembly 1 includes an upper support plate 101, and a first upper limit seat 102 is fixedly provided in the middle of the lower end face of the upper support plate 101. A second upper limit seat 103 is fixedly provided in the middle of the lower end face of the first upper limit seat 102. First mounting holes 104 are symmetrically opened on the left and right sides of the upper end face of the upper support plate 101 towards the lower end of the first upper limit seat 102. An adjustment groove 105 is opened in the middle of the upper end face of the upper support plate 101, and an adjustment groove 105 is opened at the bottom of the adjustment groove 105 towards the lower end of the second upper limit seat 103. A first through hole 106 is provided, wherein the upper support plate 101 serves as an end limiting support for the outer support sleeve 301, the first upper limit seat 102 serves as an internal limiting support relative to the outer support sleeve 301, and the first upper limit seat 102 serves as a limiting support relative to the ends of the sector-shaped semiconductor resistor block 401 and the sector-shaped positioning support block 501, and the second upper limit seat 103 serves as a guiding and limiting support relative to the inner arc surface of the sector-shaped semiconductor resistor block 401 and the sector-shaped positioning support block 501.

[0020] See Figure 3 , Figure 5 , Figure 13 and 15 As shown, the lower support assembly 2 includes a lower support plate 201, and a first lower limit seat 202 is fixedly provided in the middle of the upper end face of the lower support plate 201. A second lower limit seat 203 is fixedly provided in the middle of the upper end face of the first lower limit seat 202. First mounting screw holes 204 are symmetrically provided on the upper end face of the first lower limit seat 202 and on both sides of the second lower limit seat 203. The first mounting screw holes 204 correspond to the positions of the first mounting holes 104. A second through hole 205 is provided in the middle of the upper end face of the second lower limit seat 203. A bearing positioning groove 206 is provided at the lower end of the second through hole 205, and an end cap mounting groove 207 is provided at the lower end of the bearing positioning groove 206. A sealing groove 208 is circumferentially provided in the middle of the inner wall of the bearing positioning groove 206. Wiring holes 209 are provided on the left and right sides of the second lower limit seat 203 and at the upper end of the first lower limit seat 202, leading to the bottom of the lower support plate 201. External wiring assembly 7 The device is fitted with the wire hole 209, and a contact plate limiting groove 210 is provided at the upper end of the wire hole 209. The lower support plate 201 provides a limiting support function relative to the lower end face of the outer support sleeve 301. The first lower limiting seat 202 provides a guiding and limiting function relative to the inner side of the outer support sleeve 301. The first lower limiting seat 202 provides a limiting support function relative to the lower end of the sector-shaped semiconductor resistor block 401 and the sector-shaped positioning support block 501. The second lower limiting seat 203 provides a guiding and limiting function relative to the inner arc surface of the sector-shaped semiconductor resistor block 401 and the sector-shaped positioning support block 501. The wire hole 209 provides a guiding function relative to the conductive contact 701. The contact plate limiting groove 210 provides a limiting function relative to the conductive wire 702. The bearing positioning groove 206 provides a guiding and limiting support function relative to the supporting bearing 603. The end cover mounting groove 207 provides an end face limiting support function relative to the end cover 605.

[0021] See Figures 6 to 11 as well as Figures 13 to 15As shown, the inner and outer support assembly 3 includes an outer support sleeve 301 fitted on the outside of the first upper limit seat 102 and the first lower limit seat 202. The upper and lower ends of the outer support sleeve 301 abut against the lower end face of the upper support plate 101 and the upper end face of the lower support plate 201, respectively. The inner side of the outer support sleeve 301 is symmetrically provided with inner guide studs 302. The upper end of the inner guide stud 302 is fitted with the first mounting hole 104, and the lower end of the inner guide stud 302 is screwed to the first mounting screw hole 204. The outer support sleeve 301 provides an outer support and protection function relative to the fan-shaped semiconductor resistor block 401 and the fan-shaped positioning support block 501. The outer support sleeve 301 provides an intermediate support function relative to the upper support plate 101 and the lower support plate 201. The inner guide stud 302 provides a guiding and limiting function relative to the fan-shaped semiconductor resistor block 401. The inner guide stud 302 provides a tightening and fixing function relative to the upper support plate 101 and the lower support plate 201.

[0022] See Figures 6 to 9 as well as Figure 13 and Figure 14 As shown, the semiconductor resistor assembly 4 includes a fan-shaped semiconductor resistor block 401 with a fan-shaped plate structure. A third through hole 403 is provided in the middle of the fan-shaped semiconductor resistor block 401 to mate with the inner guide stud 302. Contact terminals 402 are fixedly connected to the upper and lower ends of the fan-shaped semiconductor resistor block 401 and to its inner arc surface. The fan-shaped semiconductor resistor blocks 401 are symmetrically distributed within the outer support sleeve 301, and are evenly spaced in the vertical direction along the inner guide stud 302. The arrangement is as follows: the sector-shaped semiconductor resistor block 401 serves as the carrier support for the semiconductor resistor sheet. During processing, two semiconductor resistor sheets are respectively bonded to the upper and lower ends of the sector-shaped semiconductor resistor block 401. Then, the contact terminal 402 is bonded to the outer side of the semiconductor resistor sheet near the inner arc surface of the sector-shaped semiconductor resistor block 401. Two adjacent sector-shaped semiconductor resistor blocks 401 are connected through the contact terminal 402. Multiple sector-shaped semiconductor resistor blocks 401 fitted on the inner guide stud 302 form a single-sided series resistor.

[0023] See Figures 3 to 9As shown, the side support assembly 5 includes symmetrically distributed fan-shaped positioning support blocks 501 inside the outer support sleeve 301. The fan-shaped positioning support blocks 501 have an arc-shaped panel structure, and the upper and lower end faces of the fan-shaped positioning support blocks 501 abut against the lower end face of the first upper limit seat 102 and the upper end face of the lower support plate 201, respectively. The inner arc surface of the fan-shaped positioning support blocks 501 is fitted with the second upper limit seat 103 and the second lower limit seat 203. A guide is provided from top to bottom in the middle of the inner arc surface of the fan-shaped positioning support blocks 501. The groove 502 and the two end faces of the fan-shaped positioning support block 501 are respectively attached to the adjacent side faces of the fan-shaped semiconductor resistor block 401. The fan-shaped positioning support block 501 plays a limiting role relative to the two sides of the fan-shaped semiconductor resistor block 401. The fan-shaped positioning support block 501 plays an internal support role relative to the first upper limit seat 102 and the first lower limit seat 202. The guide groove 502 plays a guiding role relative to the guide block 607. The side support assembly 5 can be made of bakelite or other rigid insulating plastics.

[0024] See Figure 3 and Figure 5 As shown, the conduction adjustment assembly 6 includes an adjustment head 601 provided in the adjustment groove 105, and a stud 602 that mates with the first through hole 106 is fixedly connected to the lower end of the adjustment head 601. The lower end of the stud 602 mates with the second through hole 205. A support bearing 603 is fitted inside the bearing positioning groove 206. The support bearing 603 mates with the lower end of the stud 602. The lower end of the support bearing 603 is provided with an end cap 605 that engages with the end cap mounting groove 207. The outer side of the end cap 605 is provided with a sealing ring 604 that mates with the sealing groove 208. The support bearing 603 provides a rotational support function relative to the lower end of the stud 602, the sealing ring 604 provides an outer sealing function relative to the end cap 605, the end cap 605 provides a limiting support function relative to the support bearing 603, and the end cap 605 provides a lower end protection function relative to the bearing positioning groove 206.

[0025] See Figure 3 , Figure 4 , Figure 6 , Figure 7 , Figure 13 and Figure 14As shown, a conductive support 606 is fitted inside the fan-shaped semiconductor resistor block 401 and between the second upper limit seat 103 and the second lower limit seat 203. The conductive support 606 has symmetrically arranged guide blocks 607 that slide against the guide groove 502 on both the front and back sides. A threaded drive hole 608 for screwing into the stud 602 is opened in the middle of the conductive support 606. Conductive plates 609 are fixedly embedded in the middle of the conductive support 606 and outside the threaded drive hole 608 on both the left and right sides of the conductive support 606. The conductive plates 609 are positioned relative to the inner left side of the outer support sleeve 301. The contact terminals 402 on both sides of the right serve as a conductive connection. During operation, according to the required resistance adjustment, rotating the adjusting head 601 drives the stud 602 to screw into the threaded transmission hole 608, causing the guide block 607 to move up and down along the guide groove 502. This causes the conductive plate 609 in the middle of the conductive support 606 to contact the contact terminals 402 on the inner end face of the fan-shaped semiconductor resistor block 401 on both sides. This allows the fan-shaped semiconductor resistor blocks 401 on the left and right sides of the inner side of the outer support sleeve 301 to be connected in series to form a series resistor with a certain resistance value, thus completing the resistance adjustment.

[0026] See Figure 13 and Figure 15 As shown, the external wiring assembly 7 includes a conductive contact 701 that mates with the wire hole 209, and a conductive wire 702 that mates with the contact limiting groove 210 is fixedly connected to the upper end of the conductive contact 701. The conductive wire 702 is in contact with the contact terminal 402 at the lower end of the sector-shaped semiconductor resistor block 401. The conductive wire 702 provides a contact and conduction function relative to the contact terminal 402 at the lower end of the sector-shaped semiconductor resistor block 401, so that the conductive contact 701 on the left and right sides of the lower end of the lower support plate 201 forms the input and output connection terminals of the entire resistor. When the entire resistor is in use, the conductive contacts 701 on the left and right sides of the lower end of the lower support plate 201 are electrically connected to the power supply line respectively.

[0027] Furthermore, the present invention also relates to a method for processing a semiconductor current-limiting resistor, comprising the following steps: Step 1: Production and preparation of the upper support assembly. The upper support plate, the first upper limit seat and the second upper limit seat are machined by turning, and the first mounting hole, the adjustment groove and the first through hole are machined by drilling, thus completing the production and preparation of the upper support assembly. Step 2: Production and preparation of the lower support assembly. The lower support plate, the first lower limit seat and the second lower limit seat are machined by turning. The first mounting screw hole, the second through hole, the wire hole and the contact plate limiting groove are machined by drilling. Then the bearing positioning groove, the end cover mounting groove and the sealing groove are machined by turning, thus completing the production and preparation of the entire lower support assembly. Step 3: Production and preparation of inner and outer support components. The outer support sleeve and inner guide stud are machined by turning. Here, the outer support sleeve is made of hard insulating material and the inner guide stud is made of metal. After the inner guide stud is machined, an insulating spray is applied to its surface to form an insulating protective film. This completes the production and preparation of the entire inner and outer support components. Step 4: Production and preparation of semiconductor resistor chip assembly. The semiconductor chip is processed by grinding and cutting. Note that the semiconductor resistor chip is cut into a fan-shaped structure that conforms to the end face of the fan-shaped semiconductor resistor block. The shape of the fan-shaped semiconductor resistor block is processed by turning and milling. The fan-shaped semiconductor resistor block blank is processed by turning and turned into a cylindrical structure. Then, this cylindrical structure is cut into multiple fan-shaped semiconductor resistor block core support block structures by saw blade milling cutter. The third through hole is processed by drilling. Then, the semiconductor chip is bonded to the upper and lower ends of the fan-shaped semiconductor resistor block core support structure to complete the preparation of the fan-shaped semiconductor resistor block. The contact terminals are processed by stamping. Finally, the contact terminals are pasted to the upper and lower ends of the semiconductor chip to complete the production and preparation of the entire semiconductor resistor chip assembly. Step 5: Production and preparation of the side support assembly. Bakelite or rigid insulating plastic is machined into a cylinder by turning. Then, the fan-shaped positioning support block is cut into sections and the guide groove is machined by milling. The machined cylindrical structure is cut into multiple sections along the axial direction using a saw blade milling cutter. Then, the guide groove is milled on the inner arc surface of the cut fan-shaped positioning support block using a keyway milling cutter to complete the production and preparation of the entire side support assembly. Step Six: Production and preparation of the conduction adjustment assembly. The adjustment head and stud are machined by turning, the end cap is machined by turning, the conduction support seat, guide block and conduction plate are machined by die casting, the threaded drive hole is machined by turning, the corresponding support bearing is selected according to the stud shaft end size, and the corresponding sealing ring is selected according to the sealing groove size, thus completing the production and material preparation of the conduction adjustment assembly. Step 7: Production and preparation of external wiring components. Cut the wire to a fixed length to complete the processing of the conductive contact piece. Complete the processing of the conductive wire by stamping. Then, weld one end of the conductive contact piece to the middle of the lower end face of the conductive wire to complete the production and preparation of the external wiring components. Step 8: Assembly. Insert the inner guide stud and the stud into the first mounting hole and the first through hole respectively. Then, flip the upper support plate so that the first upper limit seat faces upward. Connect the third through hole in the middle of the sector-shaped semiconductor resistor block to the inner guide stud. Arrange the sector-shaped semiconductor resistor blocks symmetrically on the inner guide stud. Then, fit the outer support sleeve on the outside of the sector-shaped semiconductor resistor block, so that one end of the outer support sleeve is fitted with the first upper limit seat and one end of the outer support sleeve abuts against the upper support plate. Then, guide the guide groove in the middle of the sector-shaped positioning support block along the inner guide stud to both sides of the sector-shaped semiconductor resistor block. Guide the guide blocks on both sides of the conductive support seat into the guide groove. Lift the upper support plate and rotate the adjusting head to screw the stud into the threaded drive hole for transmission. Insert the conductive support seat into the middle position of the outer support sleeve, then lay the assembled parts flat. Insert the conductive contact into the wire hole from the bottom of the contact limiting groove at the upper end of the first lower limit seat, so that the conductive wire is completely embedded in the contact limiting groove. Pull the inner guide stud outward a certain length, then insert the first lower limit seat from the other end of the outer support sleeve, so that the lower support plate is in contact with the other end of the outer support sleeve. Rotate the inner guide stud to tighten the lower end of the inner guide stud with the first mounting screw hole. Then, snap the support bearing into the bearing positioning groove, embed the sealing ring into the sealing groove, snap the end cap into the end cap mounting groove, and fasten the outer side of the end cap into the end cap mounting groove with screws to complete the assembly of the entire semiconductor current limiting resistor.

[0028] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor current-limiting resistor, characterized in that: The system includes a support component, which includes an inner and outer support assembly (3) and an upper support assembly (1) and a lower support assembly (2) located at the upper and lower ends of the inner and outer support assembly (3). A semiconductor resistor assembly (4) and a side support assembly (5) are provided in the middle of the inner and outer support assembly (3) and between the upper support assembly (1) and the lower support assembly (2). A conduction adjustment assembly (6) is provided in the middle of the semiconductor resistor assembly (4) and the side support assembly (5). An external wiring assembly (7) is inserted into the bottom of the lower support assembly (2). The semiconductor resistor assembly (4) is evenly distributed vertically between the upper support assembly (1) and the lower support assembly (2), and the semiconductor resistor assembly (4) is symmetrically distributed in the middle of the inner and outer support assembly (3). The side support assembly (5) is symmetrically distributed on both sides of the semiconductor resistor assembly (4). The conduction adjustment assembly (6) is slidably fitted with the side support assembly (5). The external wiring assembly (7) is electrically connected to the semiconductor resistor assembly (4) on the left and right sides of the lower support assembly (2).

2. A semiconductor current-limiting resistor according to claim 1, characterized in that: The upper support assembly (1) includes an upper support plate (101), and a first upper limit seat (102) is fixedly provided in the middle of the lower end face of the upper support plate (101). A second upper limit seat (103) is fixedly provided in the middle of the lower end face of the first upper limit seat (102). First mounting holes (104) are symmetrically opened on the left and right sides of the upper end face of the upper support plate (101) towards the lower end of the first upper limit seat (102). An adjustment groove (105) is opened in the middle of the upper end face of the upper support plate (101), and a first through hole (106) is opened at the bottom of the adjustment groove (105) towards the lower end of the second upper limit seat (103).

3. A semiconductor current-limiting resistor according to claim 2, characterized in that: The lower support assembly (2) includes a lower support plate (201), and a first lower limit seat (202) is fixedly provided in the middle of the upper surface of the lower support plate (201). A second lower limit seat (203) is fixedly provided in the middle of the upper surface of the first lower limit seat (202). First mounting screw holes (204) are symmetrically provided on the upper surface of the first lower limit seat (202) and on both sides of the second lower limit seat (203). The first mounting screw holes (204) correspond to the positions of the first mounting holes (104). A second through hole (205) is provided in the middle of the upper surface of the second lower limit seat (203). The lower end of the second through hole (205) is provided with a bearing positioning groove (206), and an end cap mounting groove (207) is provided at the lower port of the bearing positioning groove (206). A sealing groove (208) is provided in the middle of the inner wall of the bearing positioning groove (206). A wire hole (209) is provided on the left and right sides of the second lower limit seat (203) and at the bottom of the lower support plate (201) at the upper end of the first lower limit seat (202). The external wiring assembly (7) is inserted into the wire hole (209), and a contact plate limiting groove (210) is provided at the upper port of the wire hole (209).

4. A semiconductor current-limiting resistor according to claim 3, characterized in that: The inner and outer support components (3) include an outer support sleeve (301) fitted on the outside of the first upper limit seat (102) and the first lower limit seat (202). The upper and lower ends of the outer support sleeve (301) abut against the lower end face of the upper support plate (101) and the upper end face of the lower support plate (201), respectively. The inner side of the outer support sleeve (301) is symmetrically provided with inner guide studs (302). The upper end of the inner guide studs (302) is fitted with the first mounting hole (104), and the lower end of the inner guide studs (302) is screwed into the first mounting screw hole (204).

5. A semiconductor current-limiting resistor according to claim 4, characterized in that: The semiconductor resistor assembly (4) includes a fan-shaped semiconductor resistor block (401) with a fan-shaped plate structure. The fan-shaped semiconductor resistor block (401) has a third through hole (403) in the middle that is fitted with the inner guide stud (302). The upper and lower ends of the fan-shaped semiconductor resistor block (401) and the inner arc surface of the fan-shaped semiconductor resistor block (401) are fixedly connected to the contact terminal (402). The fan-shaped semiconductor resistor blocks (401) are symmetrically distributed in the outer support sleeve (301), and the fan-shaped semiconductor resistor blocks (401) are evenly distributed in the vertical direction along the inner guide stud (302).

6. A semiconductor current-limiting resistor according to claim 5, characterized in that: The side support assembly (5) includes a fan-shaped positioning support block (501) symmetrically distributed in the outer support sleeve (301). The fan-shaped positioning support block (501) has an arc panel structure. The upper and lower end faces of the fan-shaped positioning support block (501) abut against the lower end face of the first upper limit seat (102) and the upper end face of the lower support plate (201), respectively. The inner arc surface of the fan-shaped positioning support block (501) is fitted with the second upper limit seat (103) and the second lower limit seat (203). A guide groove (502) is provided in the middle of the inner arc surface of the fan-shaped positioning support block (501) from top to bottom. The two end faces of the fan-shaped positioning support block (501) are respectively attached to the adjacent side faces of the fan-shaped semiconductor resistor block (401).

7. A semiconductor current-limiting resistor according to claim 3, characterized in that: The conduction adjustment assembly (6) includes an adjustment head (601) provided in the adjustment groove (105), and a stud (602) that is fitted with the first through hole (106) is fixedly connected to the lower end of the adjustment head (601). The lower end of the stud (602) is fitted with the second through hole (205). A support bearing (603) is fitted in the bearing positioning groove (206). The support bearing (603) is fitted with the lower end of the stud (602). The lower end of the support bearing (603) is provided with an end cover (605) that is engaged with the end cover mounting groove (207). The outer side of the end cover (605) is provided with a sealing ring (604) that is fitted with the sealing groove (208).

8. A semiconductor current-limiting resistor according to claim 7, characterized in that: A conductive support seat (606) is fitted inside the fan-shaped semiconductor resistor block (401) and between the second upper limit seat (103) and the second lower limit seat (203). The conductive support seat (606) is symmetrically provided with guide blocks (607) that slide with the guide groove (502) on both the front and back sides. A threaded transmission hole (608) for screwing with the stud (602) is opened in the middle of the conductive support seat (606). Conductive plates (609) are fixedly embedded in the middle of the conductive support seat (606) and outside the threaded transmission hole (608) on the left and right sides of the conductive support seat (606).

9. A semiconductor current-limiting resistor according to claim 5, characterized in that: The external wiring assembly (7) includes a conductive contact (701) that mates with the wire hole (209), and a conductive wire (702) that mates with the contact limiting groove (210) is fixedly connected to the upper end of the conductive contact (701), and the conductive wire (702) is in contact with the contact terminal (402) at the lower end of the fan-shaped semiconductor resistor block (401).

10. A method for processing a semiconductor current-limiting resistor as described in any one of claims 1-9, characterized in that, The method includes the following steps: Step 1: Production and preparation of the upper support assembly. The upper support plate, the first upper limit seat and the second upper limit seat are machined by turning, and the first mounting hole, the adjustment groove and the first through hole are machined by drilling. Step 2: Production and preparation of the lower support assembly. The lower support plate, the first lower limit seat and the second lower limit seat are machined by turning. The first mounting screw hole, the second through hole, the wire hole and the contact plate limiting groove are machined by drilling. Then the bearing positioning groove, the end cover mounting groove and the sealing groove are machined by turning. Step 3: Production and preparation of inner and outer support components, including machining the outer support sleeve and inner guide stud by turning; Step 4: Production and preparation of semiconductor resistor assembly. The semiconductor sheet is processed by grinding and cutting. The shape of the fan-shaped semiconductor resistor block is processed by turning and milling. The third through hole is processed by drilling. Then the semiconductor sheet and the upper and lower ends of the fan-shaped semiconductor resistor block are bonded together. The contact terminals are processed by stamping. Then the contact terminals are pasted on the upper and lower ends of the semiconductor. Step 5: Production and preparation of side support components. Bakelite or rigid insulating plastic is machined into a cylinder by turning, and then the fan-shaped positioning support block and guide groove are machined by milling. Step 6: Production and preparation of the conduction adjustment assembly. The adjustment head and stud are machined by turning, the end cap is machined by turning, the conduction support seat, guide block and conduction plate are machined by die casting, the threaded drive hole is machined by turning, the corresponding support bearing is selected according to the stud shaft end size, and the corresponding sealing ring is selected according to the sealing groove size. Step 7: Production and preparation of external wiring components. Cut the wire to a fixed length to complete the processing of the conductive contact piece. Complete the processing of the conductive wire by stamping. Then, weld one end of the conductive contact piece to the middle of the lower end face of the conductive wire. Step 8: Assembly. Insert the inner guide stud and the stud into the first mounting hole and the first through hole respectively. Then, flip the upper support plate so that the first upper limit seat faces upward. Connect the third through hole in the middle of the sector-shaped semiconductor resistor block to the inner guide stud. Arrange the sector-shaped semiconductor resistor blocks symmetrically on the inner guide stud. Then, fit the outer support sleeve on the outside of the sector-shaped semiconductor resistor block, so that one end of the outer support sleeve is fitted with the first upper limit seat and one end of the outer support sleeve abuts against the upper support plate. Then, guide the guide groove in the middle of the sector-shaped positioning support block along the inner guide stud to both sides of the sector-shaped semiconductor resistor block. Guide the guide blocks on both sides of the conductive support seat into the guide groove. Lift the upper support plate and rotate the adjusting head to screw the stud into the threaded drive hole for transmission. Insert the conductive support seat into the middle position of the outer support sleeve, then lay the assembled parts flat. Insert the conductive contact into the wire hole from the bottom of the contact limiting groove at the upper end of the first lower limit seat, so that the conductive wire is completely embedded in the contact limiting groove. Pull the inner guide stud outward a certain length, then insert the first lower limit seat from the other end of the outer support sleeve, so that the lower support plate is in contact with the other end of the outer support sleeve. Rotate the inner guide stud to tighten the lower end of the inner guide stud with the first mounting screw hole. Then, snap the support bearing into the bearing positioning groove, embed the sealing ring into the sealing groove, snap the end cap into the end cap mounting groove, and fasten the outer side of the end cap into the end cap mounting groove with screws to complete the assembly of the entire semiconductor current limiting resistor.

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